Double-layer substrate structure, LED lamp bead, display module and lamp bead preparation method

Abstract

The invention relates to the technical field of LEDs, in particular to a double-layer substrate structure, an LED lamp bead, a display module and a lamp bead preparation method. The double-layer substrate structure comprises a bottom plate which is provided with at least one bottom plate positioning hole, and the inner side of the bottom plate is provided with at least one bonding pad; the panel is used for being attached to the inner side face of the bottom plate, the panel is provided with at least one panel positioning hole and at least one cup opening, the panel positioning holes and the cup openings correspond to the bottom plate positioning holes and the bonding pads in number respectively, and when the centers of the panel positioning holes and the centers of the bottom plate positioning holes are aligned in the thickness direction of the double-layer substrate structure, the panel positioning holes and the cup openings are aligned in the thickness direction of the double-layer substrate structure. The center of the cup opening is aligned with the center of the bonding pad in the thickness direction of the double-layer substrate structure. The bottom plate positioning holes and the face plate positioning holes which are in one-to-one correspondence and aligned in center are formed in the face plate and the base plate. Therefore, the offset of the center position of the bottom plate positioning hole and the offset of the center position of the panel positioning hole can be recognized through the image, the offset between the panel and the base plate is checked and adjusted accordingly, and the risk of alignment offset in the double-layer plate bonding process can be greatly reduced.

Description

Technical Field

[0001] The present invention relates to the field of LED technology, and in particular to a double-layer substrate structure, an LED lamp bead, a display module and a lamp bead preparation method. Background Art

[0002] LED display screens have the following advantages: high grayscale, wide viewing angle, rich colors, and customizable screen shape. Therefore, LED display screens are widely used in various fields such as industry, transportation, commercial advertising, information release, sports competitions, etc. The pixel components used in LED display screens are LED lamp beads. As a common component material of LED lamp beads, double-layer board substrates are in great demand in the market.

[0003] In the related art, the double-layer board substrate is composed of a bottom plate and a panel. The double-layer board is bonded by an adhesive. The upper surface pad of the bottom plate corresponds to the position of the panel cup mouth one by one. The panel is generally dark in color to enhance the contrast and improve the display effect. The corresponding position of the bottom plate and the panel is confirmed by the positioning holes on the edge of the plate. However, since the shape of the pad is mostly a special-shaped structure, it is easy to misidentify when the machine recognizes the shape for alignment, resulting in the position of the double-layer board being offset after bonding, and the problem of the panel covering the pad position. Once the positioning deviation is too large, the center position of the double-layer board is easy to shift. And because the pad position is blocked by the panel, it will also cause the wire bonding operation space to be too small, resulting in a large number of process defects in the subsequent packaging process. Summary of the invention

[0004] In the related art, the positioning of the bottom plate and the front plate in the double-layer substrate depends on the recognition of the shape of the pad on the bottom plate by the image recognition device. However, the shape of the pad is mostly a special-shaped structure, and the image recognition device is prone to misrecognition when recognizing the special-shaped structure. Misrecognition during the recognition process will cause the position of the bottom plate and the front plate to shift after bonding, resulting in the phenomenon that the front plate covers the pad position.

[0005] In a first aspect, an embodiment of the present application provides a double-layer substrate structure, which includes: A bottom plate, on which at least one bottom plate positioning hole is provided, and at least one welding pad is provided on the inner side of the bottom plate; A panel is used to be fitted with the inner side surface of the bottom plate, and the panel is provided with at least one panel positioning hole and at least one cup opening, wherein the panel positioning hole and the cup opening correspond to the number of the bottom plate positioning holes and the number of the pads, respectively, and the panel is configured as follows: When the center of the panel positioning hole is aligned with the center of the bottom plate positioning hole in the thickness direction of the double-layer substrate structure, the center of the cup mouth is aligned with the center of the pad in the thickness direction of the double-layer substrate structure.

[0006] In combination with the first aspect, in one implementation, the outer side surface of the base plate is provided with a pin, and the pin is electrically connected to the pad through the base plate positioning hole.

[0007] In combination with the first aspect, in one embodiment, the radial cross-section of the panel positioning hole at least partially overlaps with the radial cross-section of the bottom plate positioning hole in the projection plane in the thickness direction of the double-layer substrate structure, and the projection surface area of ​​the radial cross-section of the panel positioning hole is not equal to the projection surface area of ​​the radial cross-section of the bottom plate positioning hole.

[0008] In combination with the first aspect, in one implementation, the projection area of ​​the radial cross section of the panel positioning hole is greater than the projection area of ​​the radial cross section of the bottom plate positioning hole.

[0009] In combination with the first aspect, in one implementation, the bottom plate positioning hole and the panel positioning hole are both round holes.

[0010] In a second aspect, the present application provides a method for preparing a lamp bead using the above-mentioned double-layer substrate structure, which comprises: Align the center of the bottom plate positioning hole of the bottom plate with the center of the panel positioning hole of the panel one by one; Bonding the aligned bottom plate and the panel to form a loading unit; The chip is packaged on a loading unit, and then the loading unit packaged with the chip is cut to obtain LED lamp beads.

[0011] In combination with the second aspect, in one embodiment, the step of cutting the double-layer substrate structure encapsulating the chip to obtain an LED lamp bead includes: The double-layer substrate structure encapsulated with the chip is cut to form the LED lamp bead, and the LED lamp bead includes an upper surface for emitting light and a lower surface provided with pins, the projection surface of the upper surface and the lower surface in the thickness direction of the LED lamp bead partially overlap, and the projection surface area of ​​the upper surface of the LED lamp bead is larger than the projection surface area of ​​its lower surface.

[0012] In a third aspect, an embodiment of the present application provides an LED lamp bead, which includes: an LED lamp bead prepared using the LED lamp bead preparation method described in the second aspect above.

[0013] In a fourth aspect, the present application provides a display module, comprising: the LED lamp bead as described in the third aspect above.

[0014] In combination with the fourth aspect, in one embodiment, it further includes: a circuit board, on the inner side of which the LED lamp bead is mounted, and the inner side of the circuit board is provided with at least one through hole The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least: The present application provides one-to-one corresponding and center-aligned bottom plate positioning holes and panel positioning holes on both the panel and the substrate. The image can then be used to identify the center position offset of the bottom plate positioning holes and the panel positioning holes, and the offset between the panel and the substrate can be checked and adjusted accordingly, which can greatly reduce the risk of alignment offset when bonding the double-layer boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 A top view of a double-layer substrate structure in an embodiment of the present application; Figure 2 It is a front cross-sectional view of a double-layer substrate structure in an embodiment of the present application; Figure 3 A top view of the bottom plate in the embodiment of the present application; Figure 4 This is a front cross-sectional view of the bottom plate in the embodiment of the present application; Figure 5 A top view of a panel in an embodiment of the present application; Figure 6 A cross-sectional view of a panel in an embodiment of the present application; Figure 7 A top view of the double-layer substrate structure in the packaging state in the embodiment of the present application; Figure 8 This is a front cross-sectional view of the double-layer substrate structure in the packaging state in the embodiment of the present application; Fig. 9 It is a front cross-sectional view of the double-layer substrate structure in the cutting process in the embodiment of the present application; Fig.10 This is a front cross-sectional view of the lamp bead device in the embodiment of the present application; Fig.11 This is a top view of the lamp bead device in the embodiment of the present application; Fig.12 This is a schematic diagram of a circuit board in an embodiment of the present application; Fig.13 This is a schematic diagram of the arrangement of multiple lamp beads in an embodiment of the present application; Fig.14 A cross-sectional view of a display module in an embodiment of the present application; In the figure: 1. Base plate; 11. Base plate positioning hole; 111. Copper layer; 112. Via; 12. Pad; 13. Pin; 2. Panel; 21. Panel positioning hole; 22. Cup mouth; 3. Circuit board; 31. Through hole; 4. Chip; 5. Metal wire; 6. Cutting line; 7. Blade; 8. Copper pin; 9. Lamp bead. DETAILED DESCRIPTION

[0017] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0018] In the related art, the positioning of the bottom plate and the panel in the double-layer substrate depends on the recognition of the shape of the pad on the bottom plate by the image recognition device. However, the shape of the pad is mostly a special-shaped structure, and the image recognition device is prone to misrecognition when recognizing the special-shaped structure. Misrecognition will cause the position of the bottom plate and the panel to shift after bonding, and the panel will cover the pad position. Further, it will cause a large number of process defects in the subsequent packaging process.

[0019] First, as Figure 1 and Figure 2 As shown, in the embodiment of the present application, a double-layer substrate structure of an LED is provided, which includes: a bottom plate 1 and a panel 2; wherein, A bottom plate 1 is provided with at least one bottom plate positioning hole 11, and at least one soldering pad 12 is provided on the inner side of the bottom plate 1; a panel 2 is used to be detachably attached to the inner side of the bottom plate 1, and at least one panel positioning hole 21 and at least one cup opening 22 are provided on the panel 2, and the panel positioning holes 21 and the cup opening 22 correspond to the number of the bottom plate positioning holes 11 and the soldering pad 12, respectively, and the panel 2 is configured as follows: When the center of the panel positioning hole 21 is aligned with the center of the bottom plate positioning hole 11 in the thickness direction of the double-layer substrate structure, the center of the cup mouth 22 is aligned with the center of the solder pad 12 in the thickness direction of the double-layer substrate structure.

[0020] Furthermore, if Figure 2 As shown, the bottom plate 1 and the panel 2 are bonded by bonding materials (usually epoxy resin) to form a double-layer substrate. The center position of the cup mouth 22 corresponds to the center position of the pad 12 of the bottom plate 1, and the panel positioning hole 21 corresponds to the bottom plate positioning hole 11. After the panel 2 is bonded to the bottom plate 1, several cavities are formed at the pad 12 and the cup mouth 22, which are the process spaces for the subsequent packaging processes.

[0021] It is worth noting that in the above embodiment, the bottom plate 1 and the panel 2 are aligned through the bottom plate positioning holes 11 and the panel positioning holes 21. Since the image recognition device only needs to identify and confirm the center position of each pair of bottom plate positioning holes 11 and panel positioning holes 21, the recognition accuracy is improved and the possibility of misrecognition is greatly reduced.

[0022] In some optional embodiments, the main body of the bottom plate 1 can be made of insulating material. Figure 3 The pad 12 on the upper surface of the bottom plate 1 and the pin 13 installed on the outer side of the bottom plate 1 are both made of metal materials. Preferably, the pad 12 and the pin 13 are both made of copper or iron. The bottom plate 1 is made of resin insulating material.

[0023] It is worth noting that copper or iron as manufacturing materials have low cost and high stability. Resin insulation materials have excellent electrical insulation properties and good bonding properties, and can adapt well to subsequent packaging.

[0024] Furthermore, the pins 13 on the outer side of the base plate 1 are electrically connected to the pads 12 through the base plate positioning holes 11. Figure 4 As shown, the surface of the bottom plate positioning hole 11 is plated with a copper layer 111, and the copper layer 111 is electrically connected to the pin 13 and the pad 12. The thickness of the copper layer 111 can be 0.1 mm.

[0025] It can be understood that, by plating the copper layer 111 on the surface of the bottom plate positioning hole 11, the bottom plate positioning hole 11 not only has the positioning function in the bonding process, but also serves as a circuit connecting the two sides of the bottom plate 1 to form a conducting circuit.

[0026] In some optional embodiments, the panel 2 is a single-layer insulating resin structure and is mainly made of resin insulating material, such as Figure 5 The panel 2 is provided with a plurality of cup openings 22, the number of which corresponds to the number of pads 12, and a plurality of panel positioning holes 21 are provided between the cup openings 22. Figure 6 As shown, the cup opening 22 vertically penetrates the upper and lower surfaces of the panel 2 .

[0027] In some specific embodiments, the radial cross-section of the panel positioning hole 21 at least partially overlaps with the projection surface of the radial cross-section of the bottom plate positioning hole 11 in the thickness direction of the double-layer substrate structure, and the projection surface area of ​​the radial cross-section of the panel positioning hole 21 is not equal to the projection surface area of ​​the radial cross-section of the bottom plate positioning hole 11.

[0028] It is worth noting that, in the double-layer substrate using the above preferred embodiment, the radial cross-sectional areas of the panel positioning hole 21 and the bottom plate positioning hole 11 are not equal. After the panel 2 and the bottom plate 1 are bonded, the positioning holes on one side can still be seen from the other side. This facilitates the use of image recognition equipment to locate the center position of the panel positioning hole 21 and the bottom plate positioning hole 11. By using image recognition to identify the position offset of the concentric holes, the risk of alignment offset during bonding of the double-layer boards can be greatly reduced. In specific implementation, it can be set that the center offset is less than a preset threshold (such as 0.05mm) to be qualified.

[0029] Based on the above specific implementation, preferably, the projection area of ​​the radial cross section of the panel positioning hole 21 is larger than the projection area of ​​the radial cross section of the bottom plate positioning hole 11 .

[0030] It is understandable that, with the double-layer substrate of the preferred embodiment described above, after the panel 2 and the bottom plate 1 are bonded, the bottom plate positioning hole 11 can still be seen from the panel positioning hole 21 on the side of the panel 2. The radial cross-section of the bottom plate positioning hole 11 is small, so that the amount of copper layer 111 in the bottom plate positioning hole 11 is small, which saves material input and improves the preparation speed of the bottom plate 1.

[0031] In some specific implementations, the bottom plate positioning hole 11 and the panel positioning hole 21 are both round holes.

[0032] It is understandable that a circular hole is formed on the bottom plate 1 or the panel 2. On the one hand, the process of forming a circular hole is relatively simple and easy to manufacture. On the other hand, it is convenient to plate a copper layer 111 on the circular hole, which is conducive to improving the manufacturing efficiency. However, the bottom plate positioning hole 11 and the panel positioning hole 21 in the present application are not limited to circular hole structures, and square holes or holes of other shapes can be applied to the bottom plate positioning hole 11 and the panel positioning hole 21 in the present application.

[0033] Preferably, the bottom plate positioning hole 11 and the panel positioning hole 21 are both circular holes, and the diameter of the bottom plate positioning hole 11 is smaller than the diameter of the panel positioning hole 21 .

[0034] It is worth noting that, as mentioned above, the diameter of the bottom plate positioning hole 11 is smaller than the diameter of the panel positioning hole 21 , so that the amount of the copper layer 111 in the bottom plate positioning hole 11 is less.

[0035] Furthermore, the sizes of the positioning holes of the bottom plate 1 and the panel 2 need to be determined according to the actual size of the lamp beads and the material cost. In a specific embodiment of the present application, when applied to LED lamp bead products between P1.0-3.0: The radius of the bottom plate positioning hole 11 is generally 0.2-0.4mm. The radius of the bottom plate positioning hole 11 of the product structure in this embodiment is set to 0.3mm. A copper layer 111 with a thickness of 0.1mm is plated on the surface of the bottom plate positioning hole 11, and no additional hole filling treatment is performed. At this time, the bottom plate 1 forms a number of bottom plate positioning holes 11 with an outer diameter of 0.3mm and an inner diameter of 0.2mm. The pad 12 and the pin 13 conduct the upper and lower circuits through the copper layer 111 attached to the bottom plate positioning hole 11 to achieve the circuit connection effect. The radius of the panel positioning hole 21 of the panel 2 needs to be greater than 0.2mm to facilitate image recognition and positioning during the subsequent bonding of the double-layer board.

[0036] In a second aspect, the present application provides a method for preparing a lamp bead using the double-layer substrate structure in the above embodiment, which comprises the following steps: Step S1, aligning the center of the bottom plate positioning hole 11 of the bottom plate 1 with the center of a panel positioning hole 21 of the panel 2 one by one.

[0037] Specifically, an image recognition device can be used to identify the center positions of the bottom plate positioning hole 11 and the panel positioning hole 21, and measure the center position offset of the two. Then, the relative position of the bottom plate 1 and the panel 2 is adjusted according to the center position offset until the center position offset is qualified. In specific implementation, it can be set that the center offset is less than a preset threshold (such as 0.05mm) to be qualified.

[0038] Step S2, bonding the aligned bottom plate 1 and the panel 2 to form a loading unit.

[0039] Specifically, Figure 2 As shown, after the base plate 1 and the panel 2 are bonded together, a plurality of cavities are formed at the pads 12 and the cup mouth 22 , which are process spaces for subsequent packaging processes.

[0040] Step S3: encapsulate the chip 4 on the loading unit.

[0041] Specifically, Figure 8 As shown, the chip 4 is fixed on the pad 12 of the loading unit, the electrode of the chip 4 is connected to the pad 12 by bonding the metal wire 5, and then the transparent packaging glue is dispensed and packaged at the cup mouth 22. Through high-temperature hardening, the liquid glue is transformed into solid glue, which plays a role in protecting the light-emitting chip; the double-layer board plays a role in supporting and protecting the chip; at this time, a structure consisting of the loading unit formed by the double-layer board, the chip 4 and the packaging glue as the main body is formed.

[0042] Step S4, cutting the loading unit encapsulating the chip 4 to obtain the LED lamp beads 9.

[0043] Specifically, the loading unit is cut into multiple pieces such as Fig.11The independent LED lamp beads 9 shown in the figure have a cutting position that is a line connecting the centers of the positioning holes between the lamp beads (i.e. Figure 7 6) Position of middle cutting line.

[0044] In the first embodiment of the present application, a vertical structure blade is used for cutting, and after cutting, independent LED lamp beads 9 with vertical structures are formed.

[0045] In the second embodiment of the present application, the double-layer substrate structure encapsulating the chip 4 is cut to form the LED lamp bead 9, and the LED lamp bead 9 includes an upper surface for emitting light and a lower surface provided with a pin 13, and the projection surface of the upper surface and the lower surface in the thickness direction of the LED lamp bead 9 partially overlaps, and the projection surface area of ​​the upper surface of the LED lamp bead 9 is larger than the projection surface area of ​​the lower surface.

[0046] It should be noted that when larger LED lamp beads 9 are used in smaller dot pitch (such as when 1.5*1.5mm lamp beads are used in P1.56 dot pitch display screens), the distance between the lamp beads in the display module is relatively close, so the pins 13 on the lower surfaces of adjacent lamp beads extending to the copper pins 8 on the side are prone to contact each other and cause short circuit abnormalities.

[0047] Furthermore, in the present application, the lamp beads are cut into a "large upper and small lower" structure, so that the projection surface of the upper surface of the lamp beads as the light-emitting surface in the thickness direction covers the projection surface of the lower surface provided with the pins 13. Thus, without affecting the light-emitting area, the gap between the copper pins 8 of adjacent lamp beads is made larger, thereby minimizing the risk of short circuit.

[0048] In combination with the above second embodiment, a preferred implementation of step S4 of the present application includes: using a V-shaped blade 7 to perform back cutting along the cutting line 6. Fig. 9 As shown, the packaged loading unit pins 13 are fixed in a cutting machine, and the blade 7 cuts the loading unit placed on the reverse side to form a plurality of inverted trapezoidal LED lamp beads 9.

[0049] It can be understood that in the above preferred embodiment, the lamp bead structure is an inverted trapezoidal structure, with the light-emitting position on the upper surface of the lamp bead as the long side and the pin on the lower surface as the short side, which minimizes the risk of short circuit without affecting the light-emitting area. Under the same lamp bead size, the inverted trapezoidal structure can be applied to display screens with smaller dot pitch, reducing the risk of short circuit and having a wider application pitch; after cutting, it becomes a single lamp bead, and each lamp bead uses a group of RGB light-emitting chips as a pixel unit; the structure of the independent lamp bead after cutting is as follows Fig.10 and Fig.11 shown.

[0050] In a third aspect, the present application provides an LED lamp bead, which is prepared using any implementation of the above-mentioned LED lamp bead preparation method.

[0051] Preferably, if Fig.10 As shown, the LED lamp bead 9 has an inverted trapezoidal structure.

[0052] It is worth noting that, as mentioned above, the LED lamp bead 9 has an inverted trapezoidal structure and can be applied to display screens with smaller dot pitches, thereby reducing the risk of the copper pins 8 on the sides of adjacent LED lamp beads 9 contacting each other and causing a short circuit.

[0053] In a fourth aspect, the present application provides a display module, comprising: an LED lamp bead 9 and a circuit board 3 in any of the above embodiments, wherein the LED lamp bead 9 is fixed to the circuit board 3 by soldering.

[0054] In some optional implementations, such as Fig.12 As shown, at least one through hole 31 is provided on the inner side of the circuit board 3 .

[0055] It is worth noting that the through hole 31 facilitates the sound to be transmitted from the outer side of the circuit board 3 to the inner side where the LED lamp beads 9 are arranged, and then the sound is transmitted to the surface of the LED display screen through the channel 112 surrounded by the multiple LED lamp beads 9, thereby improving the consistency between the sound effect of the LED display screen and the main picture, and at the same time, it can also increase the heat dissipation performance of the LED display screen. Fig.13 As shown, the channel 112 is surrounded by various parts of the bottom plate positioning hole 11 of the original double-layer substrate structure.

[0056] Preferably, the radial cross-sectional area of ​​the through hole 31 is 0.5 to 1.5 times the radial cross-sectional area of ​​the bottom plate positioning hole 11 .

[0057] It is understandable that if the through hole 31 is too large, the space for placing the integrated circuit will be reduced, and if the through hole is too small, the sound transmission effect will be poor. Therefore, the size of the through hole 31 should be based on the bottom plate positioning hole 11.

[0058] In some optional implementations, in order to improve the efficiency of sound transmission and heat dissipation, such as Fig.14 As shown, the through hole 31 on the circuit board 3 corresponds to the position of the hole 112. In summary, the present application sets one-to-one corresponding and center-aligned bottom plate positioning holes and panel positioning holes on both the panel and the substrate. Then, the image can be used to identify the center position offset of the bottom plate positioning holes and the panel positioning holes, and the offset between the panel and the substrate can be checked and adjusted accordingly, which can greatly reduce the risk of alignment offset when the double-layer board is bonded. Furthermore, the present application uses a special cutting method to cut the substrate into an inverted trapezoidal structure, so that the lamp beads can be used in display screens with smaller dot pitches, reducing the risk of short circuits. In the present application, through holes are arranged on the circuit board to cooperate with the holes between the lamp beads to improve the consistency of the sound effect of the LED display screen with the main picture, and at the same time, increase the heat dissipation performance of the LED display screen.

[0059] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0060] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0061] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A double-layer substrate structure, characterized in that: include: A bottom plate (1) having at least one bottom plate positioning hole (11) provided thereon, and at least one welding pad (12) provided on the inner side of the bottom plate (1); A panel (2) is used to be arranged in affixed relation with the inner side surface of the bottom plate (1), the panel (2) being provided with at least one panel positioning hole (21) and at least one cup opening (22), the panel positioning hole (21) and the cup opening (22) respectively corresponding in number to the bottom plate positioning hole (11) and the solder pad (12), and the panel (2) is configured as follows: When the center of the panel positioning hole (21) is aligned with the center of the bottom plate positioning hole (11) in the thickness direction of the double-layer substrate structure, the center of the cup mouth (22) is aligned with the center of the solder pad (12) in the thickness direction of the double-layer substrate structure.

2. The double-layer substrate structure according to claim 1, characterized in that: The outer side surface of the base plate (1) is provided with a pin (13), and the pin (13) is electrically connected to the pad (12) through the base plate positioning hole (11).

3. The double-layer substrate structure according to claim 1, wherein: The radial cross section of the panel positioning hole (21) at least partially overlaps with the projection surface of the radial cross section of the bottom plate positioning hole (11) in the thickness direction of the double-layer substrate structure, and the projection surface area of ​​the radial cross section of the panel positioning hole (21) is not equal to the projection surface area of ​​the radial cross section of the bottom plate positioning hole (11).

4. The double-layer substrate structure according to claim 3, characterized in that: The projection area of ​​the radial cross section of the panel positioning hole (21) is greater than the projection area of ​​the radial cross section of the bottom plate positioning hole (11).

5. The double-layer substrate structure according to claim 1, wherein: The bottom plate positioning hole (11) and the panel positioning hole (21) are both round holes.

6. A method for preparing a lamp bead using the double-layer substrate structure as claimed in claim 1, characterized in that: include: Align the center of the bottom plate positioning hole (11) of the bottom plate (1) with the center of the panel positioning hole (21) of the panel (2); Bonding the aligned bottom plate (1) and the panel (2) to form a loading unit; The chip (4) is packaged on a loading unit, and the loading unit packaged with the chip (4) is cut to obtain an LED lamp bead (9).

7. The method for preparing a lamp bead according to claim 6, characterized in that: The step of cutting the double-layer substrate structure encapsulating the chip to obtain an LED lamp bead (9) comprises: The double-layer substrate structure encapsulating the chip is cut to form the LED lamp bead (9), the LED lamp bead (9) comprising an upper surface for emitting light and a lower surface provided with pins (13), the upper surface and the lower surface of the LED lamp bead (9) partially overlapping in the projection surface in the thickness direction of the LED lamp bead (9), and the projection surface area of ​​the upper surface of the LED lamp bead (9) is greater than the projection surface area of ​​the lower surface thereof.

8. An LED lamp bead, characterized in that: include: An LED lamp bead (9) prepared by the LED lamp bead preparation method as claimed in claim 6 or 7.

9. A display module, characterized in that: include: The LED lamp bead (9) as claimed in claim 8.

10. The display module according to claim 9, wherein: Also includes: A circuit board (3) having the LED lamp bead (9) mounted on its inner side surface, and at least one through hole (31) is provided on the inner side surface of the circuit board (3).

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