Display panel, preparation method of display panel and electronic device

Abstract

The embodiment of the application provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display. The display panel comprises an array substrate, an isolation structure, a light emitting unit and a first encapsulation layer. The isolation structure is located on one side of the array substrate, and the isolation structure is surrounded to form an isolation opening. At least part of the light emitting unit is located in the isolation opening. The light emitting unit comprises a light emitting part and a second electrode which are stacked in sequence in a direction away from the array substrate. The light emitting unit comprises a first light emitting unit and a second light emitting unit. The first encapsulation layer comprises a plurality of encapsulation units which are arranged at intervals. The side of the encapsulation unit away from the array substrate comprises a groove. The depth of the groove located on the first light emitting unit is less than the sum of the thickness of the light emitting part and the second electrode of the second light emitting unit. The application can better protect the first light emitting unit, the first light emitting unit is not easy to be damaged, and thus the display effect of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display panels.

[0003] However, there are still some problems with the display panel that need to be addressed. Summary of the Invention

[0004] To overcome the technical problems mentioned in the background, this application provides a display panel, which includes:

[0005] Array substrate;

[0006] An isolation structure located on one side of the array substrate, the isolation structure enclosing an isolation opening;

[0007] A light-emitting unit is located within the isolation opening. The light-emitting unit includes a light-emitting portion and a second electrode stacked sequentially along a direction away from the array substrate. The light-emitting unit includes a first light-emitting unit and a second light-emitting unit.

[0008] A first encapsulation layer located on the side of the light-emitting unit away from the array substrate, the first encapsulation layer comprising a plurality of spaced encapsulation units, the encapsulation units at least covering the light-emitting unit and extending to the side of the isolation structure, the side of the isolation structure being the surface of the isolation structure facing the isolation opening;

[0009] The packaging unit includes a groove on the side away from the array substrate. The depth of the groove in the first light-emitting unit is less than the sum of the thicknesses of the light-emitting portion and the second electrode in the second light-emitting unit, along a direction perpendicular to the array substrate.

[0010] In some possible implementations, the light-emitting unit further includes a third light-emitting unit; along a direction perpendicular to the array substrate, the depth of the groove in the second light-emitting unit is less than the sum of the thicknesses of the light-emitting portion of the third light-emitting unit and the second electrode;

[0011] Preferably, the depth of the groove in the first light-emitting unit is less than the thickness of the light-emitting portion in the second light-emitting unit;

[0012] Preferably, the depth of the groove in the second light-emitting unit is less than the thickness of the light-emitting portion of the third light-emitting unit;

[0013] Preferably, along a direction perpendicular to the array substrate, the depth of the groove located in the first light-emitting unit is less than the depth of the groove located in the third light-emitting unit;

[0014] Preferably, along a direction perpendicular to the array substrate, the depth of the groove in the second light-emitting unit is less than the depth of the groove in the third light-emitting unit;

[0015] Preferably, the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit all emit different colors.

[0016] In some possible implementations, the depth of the groove in the first light-emitting unit along a direction perpendicular to the array substrate ranges from 0.03 μm to 0.07 μm;

[0017] Preferably, the depth of the groove in the second light-emitting unit along the direction perpendicular to the array substrate is in the range of 0.03μm-0.07μm;

[0018] Preferably, the depth of the groove in the third light-emitting unit along the direction perpendicular to the array substrate is in the range of 0.1μm-0.2μm;

[0019] Preferably, the depth of the groove in the second light-emitting unit is equal to the depth of the groove in the first light-emitting unit along a direction perpendicular to the array substrate.

[0020] In some possible implementations, the orthographic projection of the groove on the array substrate lies within the orthographic projection of the isolation opening on the array substrate;

[0021] Preferably, at least a portion of the groove's orthographic projection on the array substrate lies within the orthographic projection of the isolation structure on the array substrate;

[0022] Preferably, the orthographic projection of the groove on the array substrate is annular, the orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the light-emitting unit on the array substrate, and the depth of the same groove surrounding the light-emitting unit is equal at different positions.

[0023] In some possible implementations, adjacent packaging units are spaced apart on the side of the isolation structure away from the array substrate;

[0024] Preferably, there is a gap between the packaging unit located on the side of the isolation structure away from the array substrate and the side of the isolation structure away from the array substrate;

[0025] Preferably, the orthographic projection of the packaging unit on the array substrate covers the orthographic projection of the isolation opening on the array substrate and the orthographic projection of a portion of the isolation structure on the array substrate.

[0026] In some possible implementations, the display panel further includes a second encapsulation layer located on the side of the first encapsulation layer away from the array substrate;

[0027] Preferably, the display panel further includes a third encapsulation layer located on the side of the second encapsulation layer away from the array substrate;

[0028] Preferably, the materials of both the first encapsulation layer and the third encapsulation layer include inorganic materials;

[0029] Preferably, the material of the second encapsulation layer includes an organic material.

[0030] In some possible implementations, the light-emitting unit further includes a first electrode located on the side of the light-emitting portion closer to the array substrate;

[0031] Preferably, the display panel further includes a pixel defining layer located on the side of the film layer containing the first electrode away from the array substrate, and the isolation structure is located on the side of the pixel defining layer away from the array substrate; the pixel defining layer includes pixel openings that expose at least a portion of the first electrode, and the orthographic projection of the isolation structure on the array substrate is located between the orthographic projections of two adjacent pixel openings on the array substrate;

[0032] Preferably, the orthographic projection of the pixel opening on the array substrate is located within the orthographic projection of the isolation opening on the array substrate.

[0033] In some possible implementations, the isolation structure includes a first isolation portion and a second isolation portion stacked sequentially along a direction away from the array substrate, wherein the orthographic projection of the side of the first isolation portion away from the array substrate on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate.

[0034] In some possible implementations, the second electrode of the light-emitting unit is electrically connected to the first isolation portion; and / or, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the array substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion;

[0035] Preferably, the material of the third isolation portion includes molybdenum metal; and / or, the material of the first isolation portion includes aluminum metal; and / or, the material of the second isolation portion includes titanium metal.

[0036] In some possible implementations, this application also provides a method for manufacturing a display panel, the method comprising:

[0037] Provide an array substrate;

[0038] An isolation structure is formed on one side of the array substrate, and the isolation structure encloses an isolation opening;

[0039] At least a portion of the light-emitting units are formed within the isolation opening, and a first encapsulation layer is formed on the side of the light-emitting units away from the array substrate. The light-emitting units include light-emitting portions and second electrodes stacked sequentially in a direction away from the array substrate. The light-emitting units include a first light-emitting unit and a second light-emitting unit. The first encapsulation layer includes a plurality of encapsulation units spaced apart. The encapsulation units at least cover the light-emitting units and extend to the side of the isolation structure. The side of the isolation structure is the surface of the isolation structure facing the isolation opening.

[0040] The packaging unit includes a groove on the side away from the array substrate. The depth of the groove in the first light-emitting unit is less than the sum of the thicknesses of the light-emitting portion and the second electrode in the second light-emitting unit, along a direction perpendicular to the array substrate.

[0041] In some possible implementations, the step of forming an isolation structure on one side of the array substrate includes:

[0042] A first electrode layer is formed on one side of the array substrate, the first electrode layer comprising a plurality of spaced first electrodes;

[0043] A pixel defining material layer is formed on the side of the first electrode layer away from the array substrate;

[0044] An isolation structure material layer is formed on the side of the pixel defining material layer away from the array substrate;

[0045] The isolation structure material layer is patterned to form an isolation structure;

[0046] The pixel defining material layer is patterned to form a pixel defining layer, the pixel defining layer including a pixel opening that exposes at least a portion of the first electrode; the orthographic projection of the pixel opening on the array substrate lies within the orthographic projection of the isolation opening on the array substrate.

[0047] In some possible implementations, the step of forming at least a portion of the light-emitting unit within the isolation opening and forming a first encapsulation layer on the side of the light-emitting unit away from the array substrate includes:

[0048] A light-emitting functional layer of the first light-emitting unit is formed on the side of the isolation structure away from the array substrate;

[0049] A second electrode layer is formed on the side of the light-emitting functional layer of the first light-emitting unit away from the array substrate;

[0050] A first encapsulation layer is formed on the side of the second electrode layer away from the array substrate;

[0051] A first etched protective layer is formed in the isolation opening corresponding to the first light-emitting unit, and the first etched protective layer extends to cover a portion of the isolation structure;

[0052] Remove the first encapsulation layer, the light-emitting functional layer, and the second electrode layer that are not covered by the first etch protection layer, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate, and remove the first etch protection layer, so as to form a light-emitting part, a second electrode, and an encapsulation unit in the isolation opening corresponding to the first light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the first light-emitting unit.

[0053] Preferably, the second electrode extends to be electrically connected to the isolation structure corresponding to the first light-emitting unit;

[0054] Preferably, the depth of the groove in the first light-emitting unit along the direction perpendicular to the array substrate is in the range of 0.03μm-0.07μm;

[0055] Preferably, the orthographic projection of the groove on the array substrate is annular, the orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the first light-emitting unit on the array substrate, and the depth of the same groove surrounding the first light-emitting unit is equal at different positions.

[0056] In some possible implementations, after the steps of removing the first encapsulation layer, the light-emitting functional layer, and the second electrode layer not covered by the first etch protection layer, and removing the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate, and removing the first etch protection layer, the method further includes:

[0057] A light-emitting functional layer of a second light-emitting unit is formed on the side of the isolation structure away from the array substrate, and the light-emitting functional layer of the second light-emitting unit covers the side of the packaging unit corresponding to the first light-emitting unit away from the array substrate.

[0058] A second electrode layer is formed on the side of the light-emitting functional layer of the second light-emitting unit away from the array substrate. At least a portion of the light-emitting functional layer and / or at least a portion of the second electrode layer of the second light-emitting unit fills at least a portion of the groove located in the first light-emitting unit, and the second electrode layer of the second light-emitting unit is continuously disposed at the groove corresponding to the first light-emitting unit.

[0059] A first encapsulation layer is formed on the side of the second electrode layer away from the array substrate;

[0060] A second etched protective layer is formed within the isolation opening corresponding to the second light-emitting unit;

[0061] Remove the first encapsulation layer, the light-emitting functional layer, and the second electrode layer of the second light-emitting unit that are not covered by the second etch protection layer, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate, and remove the second etch protection layer, so as to form a light-emitting part, a second electrode, and an encapsulation unit in the isolation opening corresponding to the second light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the second light-emitting unit;

[0062] Preferably, the second electrode extends to an isolation structure corresponding to the second light-emitting unit and is electrically connected;

[0063] Preferably, the depth of the groove in the second light-emitting unit along the direction perpendicular to the array substrate is in the range of 0.03μm-0.07μm;

[0064] Preferably, the orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the second light-emitting unit on the array substrate, and the depth of the same groove surrounding the second light-emitting unit is equal at different locations;

[0065] Preferably, along a direction perpendicular to the array substrate, the depth of the groove in the second light-emitting unit is equal to the depth of the groove in the first light-emitting unit.

[0066] In some possible implementations, after the steps of removing the first encapsulation layer, the light-emitting functional layer, and the second electrode layer of the second light-emitting unit not covered by the second etch protection layer, and removing the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate, and removing the second etch protection layer, the method further includes:

[0067] A light-emitting functional layer of a third light-emitting unit is formed on the side of the isolation structure away from the array substrate, and the light-emitting functional layer of the second light-emitting unit covers the packaging unit corresponding to the first light-emitting unit and the second light-emitting unit on the side away from the array substrate.

[0068] A second electrode layer is formed on the side of the light-emitting functional layer of the third light-emitting unit away from the array substrate. At least a portion of the light-emitting functional layer and / or at least a portion of the second electrode layer of the third light-emitting unit fill at least a portion of the grooves located in the first light-emitting unit and the second light-emitting unit, and the second electrode layer of the third light-emitting unit is continuously disposed at the grooves corresponding to the first light-emitting unit and the second light-emitting unit.

[0069] A first encapsulation layer is formed on the side of the second electrode layer away from the array substrate;

[0070] A third etched protective layer is formed within the isolation opening corresponding to the third light-emitting unit;

[0071] Remove the first encapsulation layer, the light-emitting functional layer, and the second electrode layer of the third light-emitting unit that are not covered by the third etch protective layer, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate, and remove the third etch protective layer, so as to form a light-emitting part, a second electrode, and an encapsulation unit in the isolation opening corresponding to the third light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the third light-emitting unit;

[0072] Preferably, the second electrode extends to be electrically connected to the isolation structure corresponding to the third light-emitting unit;

[0073] Preferably, along a direction perpendicular to the array substrate, the depth of the groove in the third light-emitting unit is greater than the depth of the groove in the first light-emitting unit and / or the second light-emitting unit;

[0074] Preferably, the depth of the groove in the third light-emitting unit along the direction perpendicular to the array substrate is in the range of 0.1μm-0.2μm;

[0075] Preferably, the orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the third light-emitting unit on the array substrate, and the depth of the same groove surrounding the third light-emitting unit is equal at different locations.

[0076] In some possible implementations, this application also provides an electronic device, which includes the display panel described in this application, or a display panel prepared by the method for preparing the display panel described in this application.

[0077] Compared with the prior art, this application has the following beneficial effects:

[0078] This application provides a display panel, a method for manufacturing the display panel, and an electronic device. By setting the depth of the groove in the first light-emitting unit to be less than the sum of the thickness of the light-emitting part and the second electrode of the second light-emitting unit, the second electrode of the second light-emitting unit can be continuously filmed on the side of the first light-emitting unit away from the array substrate during the manufacturing of the second light-emitting unit. This can provide better protection for the first light-emitting unit, making it less likely to be damaged, thereby improving the display effect of the display panel. Attached Figure Description

[0079] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0080] Figure 1 A cross-sectional schematic diagram of the display panel in the related technology provided in the embodiments of this application;

[0081] Figure 2 One of the cross-sectional schematic diagrams of the display panel provided in the embodiments of this application;

[0082] Figure 3 A cross-sectional schematic diagram of the display panel when the second electrode of the second light-emitting unit is formed, as provided in an embodiment of this application;

[0083] Figure 4 A second cross-sectional schematic diagram of the display panel provided in the embodiments of this application;

[0084] Figure 5 A partial top view of the display panel provided in an embodiment of this application;

[0085] Figure 6 A cross-sectional schematic diagram of the display panel provided in the embodiments of this application, including a second encapsulation layer and a third encapsulation layer;

[0086] Figure 7 A cross-sectional schematic diagram of the isolation structure of the display panel provided in the embodiments of this application, comprising a three-layer isolation structure;

[0087] Figure 8 A schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0088] Figure 9 A cross-sectional schematic diagram showing a first electrode layer formed on one side of an array substrate, provided for an embodiment of this application;

[0089] Figure 10 A cross-sectional schematic diagram showing the formation of a pixel defining material layer on the side of the first electrode layer away from the array substrate, provided for an embodiment of this application;

[0090] Figure 11 A cross-sectional schematic diagram of an isolation structure material layer formed on the side of the pixel defining material layer away from the array substrate, provided in an embodiment of this application;

[0091] Figure 12 A schematic cross-sectional view of the isolation structure material layer after patterning, provided in an embodiment of this application;

[0092] Figure 13 A cross-sectional schematic diagram of the pixel-defining material layer after patterning, provided in an embodiment of this application;

[0093] Figure 14 A cross-sectional schematic diagram of a light-emitting functional layer in which a first light-emitting unit is formed on the side of the isolation structure away from the array substrate, provided for an embodiment of this application;

[0094] Figure 15 A cross-sectional schematic diagram of the second electrode layer formed on the side of the light-emitting functional layer of the first light-emitting unit away from the array substrate, provided for an embodiment of this application;

[0095] Figure 16 One of the cross-sectional schematic diagrams provided in this application shows the formation of a first encapsulation layer on the side of the second electrode layer away from the array substrate;

[0096] Figure 17 A top view schematic diagram of the formation of a first etched protective layer in the isolation opening corresponding to the first light-emitting unit provided in an embodiment of this application;

[0097] Figure 18 This is a cross-sectional schematic diagram of the first encapsulation layer, light-emitting functional layer, and second electrode layer, which are not covered by the first etch protective layer, provided in an embodiment of this application.

[0098] Figure 19 A cross-sectional schematic diagram of a light-emitting functional layer in which a third light-emitting unit is formed on the side of the isolation structure away from the array substrate, provided for an embodiment of this application;

[0099] Figure 20 A cross-sectional schematic diagram showing a second electrode layer formed on the side of the light-emitting functional layer of the third light-emitting unit away from the array substrate, provided for an embodiment of this application;

[0100] Figure 21 A second cross-sectional schematic diagram showing the formation of a first encapsulation layer on the side of the second electrode layer away from the array substrate, provided in an embodiment of this application;

[0101] Figure 22 A cross-sectional schematic diagram of a second etched protective layer formed within the isolation opening corresponding to the third light-emitting unit, provided in an embodiment of this application;

[0102] Figure 23 A cross-sectional schematic diagram of the third light-emitting unit after removing the first encapsulation layer, light-emitting functional layer, and second electrode layer, which are not covered by the second etch protective layer, provided in an embodiment of this application;

[0103] Figure 24 A cross-sectional schematic diagram of a light-emitting functional layer in which a second light-emitting unit is formed on the side of the isolation structure away from the array substrate, as provided in an embodiment of this application;

[0104] Figure 25 A cross-sectional schematic diagram showing the formation of a second electrode layer on the side of the light-emitting functional layer of the second light-emitting unit away from the array substrate, provided in an embodiment of this application;

[0105] Figure 26 A third cross-sectional schematic diagram showing the formation of a first encapsulation layer on the side of the second electrode layer away from the array substrate, provided as an embodiment of this application;

[0106] Figure 27 A cross-sectional schematic diagram of a third etched protective layer formed within the isolation opening corresponding to the second light-emitting unit, provided in an embodiment of this application;

[0107] Figure 28 This is a cross-sectional schematic diagram of the second light-emitting unit after removing the first encapsulation layer, light-emitting functional layer, and second electrode layer, which are not covered by the third etched protective layer, as provided in an embodiment of this application.

[0108] Reference numerals: 1. Array substrate; 2. Pixel defining layer; 21. Pixel opening; 3. Isolation structure; 31. First isolation portion; 32. Second isolation portion; 33. Third isolation portion; 4. First electrode; 5. Light-emitting portion; 6. Second electrode; 7. Light-emitting unit; 71. First light-emitting unit; 72. Second light-emitting unit; 73. Third light-emitting unit; 8. First encapsulation layer; 81. Encapsulation unit; 811. Groove; 9. Isolation opening; 10. Second encapsulation layer; 11. Third encapsulation layer; 12. Pixel defining material layer; 13. Isolation structure material layer; 14. First etch protection layer; 15. Second etch protection layer; 16. Third etch protection layer. Detailed Implementation

[0109] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0110] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0111] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0112] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0113] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0114] Please see Figure 1The display panel in the related technology includes an array substrate 1, an isolation structure 3 located on one side of the array substrate 1, a light-emitting unit 7 located at least partially within an isolation opening 9 formed by the isolation structure 3, and a first encapsulation layer 8 located on the side of the light-emitting unit 7 away from the array substrate 1. The first encapsulation layer 8 includes an encapsulation unit 81, and the side of the encapsulation unit 81 away from the array substrate 1 includes a groove 811.

[0115] The light-emitting unit 7 includes a first light-emitting unit 71 and a second light-emitting unit 72. Following the fabrication sequence of the first and second light-emitting units 71 and 72, during the fabrication of the second light-emitting unit 72, the second electrode of the second light-emitting unit 72 cannot be continuously deposited at the groove 811 of the first light-emitting unit 71. Therefore, the second electrode of the second light-emitting unit 72 cannot completely protect the first light-emitting unit 71. During the patterning of the second light-emitting unit 72, the first light-emitting unit 71 may be damaged, causing it to malfunction and ultimately affecting the display effect of the display panel.

[0116] In view of this, this embodiment provides a solution to improve the display effect of the display panel, and the solution provided in this embodiment will be described in detail below.

[0117] Please see Figure 2 This embodiment provides a display panel, which includes an array substrate 1, an isolation structure 3, a light-emitting unit 7, and a first encapsulation layer 8.

[0118] The array substrate 1 may include a substrate and a plurality of driving units located on one side of the substrate, each driving unit may include one or more semiconductor switching devices. The semiconductor switching devices may be formed by the combination of multiple film layers in the array substrate 1; for example, the semiconductor switching devices may be thin-film transistors formed by the combination of multiple film layers.

[0119] The isolation structure 3 is located on one side of the array substrate 1, and the isolation structure 3 encloses and forms the isolation opening 9.

[0120] The composition and preparation of the isolation structure 3 are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, 202311499823.9, 202310731471.9, and 202311091555.7 for reference.

[0121] At least a portion of the light-emitting units 7 are located within the isolation opening 9. Each light-emitting unit 7 includes a light-emitting portion 5 and a second electrode 6 stacked sequentially in a direction away from the array substrate 1. Each light-emitting unit 7 includes a first light-emitting unit 71 and a second light-emitting unit 72. The first light-emitting unit 71 and the second light-emitting unit 72 emit different colors. For example, the first light-emitting unit 71 may emit blue, and the second light-emitting unit 72 may emit green. The second light-emitting unit 72 is the last light-emitting unit 7 manufactured for this display panel.

[0122] The first encapsulation layer 8 is located on the side of the light-emitting unit 7 away from the array substrate 1. The first encapsulation layer 8 includes a plurality of encapsulation units 81 spaced apart. The encapsulation units 81 at least cover the light-emitting unit 7 and extend to the side of the isolation structure 3. The side of the isolation structure 3 is the surface of the isolation structure 3 facing the isolation opening 9.

[0123] The packaging unit 81 includes a groove 811 on the side away from the array substrate 1. The depth D1 of the groove 811 in the first light-emitting unit 71 is less than the sum of the thickness H1 of the light-emitting part 5 and the second electrode 6 of the second light-emitting unit 72 in a direction perpendicular to the array substrate 1.

[0124] According to the manufacturing sequence of the first light-emitting unit 71 and the second light-emitting unit 72, after the first light-emitting unit 71 and the second light-emitting unit 72 are manufactured, a groove 811 will be formed on the encapsulation unit 81 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72.

[0125] Since the depth D1 of the groove 811 in the first light-emitting unit 71 is less than the sum of the thickness H1 of the light-emitting part 5 and the second electrode 6 in the second light-emitting unit 72, please refer to... Figure 3 During the formation of the second light-emitting unit 72, the second electrode 6 of the second light-emitting unit 72 can be continuously filmed at the groove 811 of the first light-emitting unit 71. Therefore, when the second light-emitting unit 72 is patterned in the future, the second electrode of the second light-emitting unit 72 can provide more complete protection for the first light-emitting unit 71, so that the first light-emitting unit 71 is not easily damaged or made to fail.

[0126] Based on the above design, in this embodiment, by setting the depth D1 of the groove 811 in the first light-emitting unit 71 to be less than the sum of the thickness H1 of the light-emitting part 5 and the second electrode 6 of the second light-emitting unit 72, when the second light-emitting unit 72 is prepared, the second electrode 6 of the second light-emitting unit 72 can be continuously filmed on the side of the first light-emitting unit 71 away from the array substrate 1, thereby providing better protection for the first light-emitting unit 71 and making it less likely to be damaged, thereby improving the display effect of the display panel.

[0127] In some possible implementations, please refer again. Figure 2 The light-emitting unit 7 also includes a first electrode 4 located on the side of the light-emitting part 5 near the array substrate 1. The display panel also includes a pixel defining layer 2 located on the side of the film layer where the first electrode 4 is located away from the array substrate 1. The isolation structure 3 is located on the side of the pixel defining layer 2 away from the array substrate 1. The pixel defining layer 2 includes a pixel opening 21 that exposes at least part of the first electrode 4. The orthographic projection of the isolation structure 3 on the array substrate 1 is located between the orthographic projections of two adjacent pixel openings 21 on the array substrate 1. The orthographic projection of the pixel opening 21 on the array substrate 1 is located within the orthographic projection of the isolation opening 9 on the array substrate 1.

[0128] When forming the light-emitting functional layer, the light-emitting functional layer is separated by the isolation structure 3 to form multiple spaced light-emitting parts 5. When forming the second electrode layer, the second electrode layer is separated by the isolation structure 3 to form multiple spaced second electrodes 6. The isolation structure 3 includes a conductive material, and the second electrodes 6 are electrically connected to the isolation structure 3. A first electrode 4, a light-emitting part 5, and a second electrode 6 form a light-emitting unit 7. Among them, the first electrode 4 is the anode, and the second electrode 6 is the cathode.

[0129] For some possible implementations, please refer to Figure 4 The light-emitting unit 7 also includes a third light-emitting unit 73; along the direction perpendicular to the array substrate 1, the depth D3 of the groove 811 of the second light-emitting unit 72 is less than the sum of the thickness H2 of the light-emitting part 5 of the third light-emitting unit 73 and the second electrode 6.

[0130] The first light-emitting unit 71, the second light-emitting unit 72, and the third light-emitting unit 73 all emit different colors. For example, the first light-emitting unit 71 includes a blue light-emitting unit, the second light-emitting unit 72 includes a green light-emitting unit, and the third light-emitting unit 73 includes a red light-emitting unit.

[0131] Since the depth D2 of the groove 811 in the second light-emitting unit 72 is less than the sum of the thickness H2 of the light-emitting part 5 and the second electrode 6 of the third light-emitting unit 73, the second electrode 6 of the third light-emitting unit 73 can be continuously filmed at the groove 811 of the second light-emitting unit 72 during the formation of the third light-emitting unit 73. Therefore, when the third light-emitting unit 73 is patterned in the future, the second electrode of the third light-emitting unit 73 can provide more complete protection for the second light-emitting unit 72, so that the second light-emitting unit 72 is less likely to be damaged or fail.

[0132] Preferably, the depth of the groove 811 in the first light-emitting unit 71 is less than the thickness of the light-emitting part 5 in the second light-emitting unit 72. In this way, during the formation of the second light-emitting unit 72, the second electrode 6 of the second light-emitting unit 72 can be more easily continuously filmed at the groove 811 in the first light-emitting unit 71, thereby providing more complete protection for the first light-emitting unit 71.

[0133] Preferably, the depth of the groove 811 in the second light-emitting unit 72 is less than the thickness of the light-emitting part 5 in the third light-emitting unit 73. In this way, during the formation of the third light-emitting unit 73, the second electrode 6 of the third light-emitting unit 73 can be more easily continuously filmed at the groove 811 in the second light-emitting unit 72, thereby providing more complete protection for the second light-emitting unit 72.

[0134] Preferably, please see again. Figure 4 Along the direction perpendicular to the arrayed substrate 1, the depth D1 of the groove 811 in the first light-emitting unit 71 is less than the depth D3 of the groove 811 in the third light-emitting unit 73, that is, D1 <D3。

[0135] Preferably, along the direction perpendicular to the array substrate 1, the depth D2 of the groove 811 in the second light-emitting unit 72 is less than the depth D3 of the groove 811 in the third light-emitting unit 73, that is, D2 <D3。

[0136] The depth D1 of the groove 811 in the first light-emitting unit 71 and the depth D2 of the groove 811 in the second light-emitting unit 72 can be equal or unequal.

[0137] According to the manufacturing order of the first light-emitting unit 71, the second light-emitting unit 72 and the third light-emitting unit 73, the depth D1 of the groove 811 in the first light-emitting unit 71 and the depth D2 of the groove 811 in the second light-emitting unit 72 can be made thicker than the thickness of the groove 811 in the third light-emitting unit 73 by setting the thickness of the encapsulation unit 81 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72 to be less than the depth D3 of the groove 811 in the third light-emitting unit 73.

[0138] Since the depth D1 of the groove 811 in the first light-emitting unit 71 and the depth D2 of the groove 811 in the second light-emitting unit 72 are both less than the depth D3 of the groove 811 in the third light-emitting unit 73, during the formation of the second light-emitting unit 72, the second electrode of the second light-emitting unit 72 can be continuously deposited at the groove 811 of the first light-emitting unit 71. Therefore, during the subsequent patterning of the second light-emitting unit 72, the second electrode of the second light-emitting unit 72 can provide more complete protection for the first light-emitting unit 71. Similarly, during the formation of the third light-emitting unit 73, the second electrode of the third light-emitting unit 73 can be continuously deposited at the groove 811 of the second light-emitting unit 72. Therefore, during the subsequent patterning of the third light-emitting unit 73, the second electrode of the third light-emitting unit 73 can provide more complete protection for the second light-emitting unit 72, thus making it less likely for the first and second light-emitting units 71 and 72 to be damaged or to fail.

[0139] Since the third light-emitting unit 73 is the last light-emitting unit 7 fabricated for this display panel, there is no need to consider the potential damage to the third light-emitting unit 73 caused by the fabrication of other light-emitting units 7. Therefore, the thickness of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 can be set to be less than the thickness of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72. Because the thickness of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 is less than the thickness of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72, the patterning of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 can be completed in less time, thereby improving the efficiency of fabricating the display panel.

[0140] In some possible implementations, please refer again. Figure 4 Along the direction perpendicular to the array substrate 1, the depth D1 of the groove 811 in the first light-emitting unit 71 ranges from 0.03μm to 0.07μm. For example, the depth D1 can be 0.03μm, 0.04μm, 0.05μm, 0.06μm, or 0.07μm. By reasonably setting the depth D1, the first light-emitting unit 71 can be made less prone to failure without increasing the number of packaging units 81 corresponding to the first light-emitting unit 71.

[0141] Preferably, please see again. Figure 4 Along the direction perpendicular to the array substrate 1, the depth D2 of the groove 811 in the second light-emitting unit 72 ranges from 0.03μm to 0.07μm. For example, the depth D2 can be 0.03μm, 0.04μm, 0.05μm, 0.06μm, or 0.07μm. By reasonably setting the depth D2, the second light-emitting unit 72 can be made less prone to failure without increasing the number of packaging units 81 corresponding to the second light-emitting unit 72.

[0142] Preferably, please see again. Figure 4 Along the direction perpendicular to the array substrate 1, the depth D3 of the groove 811 in the third light-emitting unit 73 ranges from 0.1μm to 0.2μm. For example, the depth D3 can be 0.1μm, 0.12μm, 0.15μm, 0.18μm, or 0.2μm. Properly setting the depth D3 can improve the patterning efficiency of the first encapsulation layer 8 corresponding to the third light-emitting unit 73.

[0143] Preferably, please see again. Figure 4 Along the direction perpendicular to the array substrate 1, the depth D2 of the groove 811 in the second light-emitting unit 72 is equal to the depth D1 of the groove 811 in the first light-emitting unit 71.

[0144] The equality of depth D2 and depth D1 does not have to be completely absolute. As long as the difference between depth D2 and depth D1 is within the preset error range, depth D2 and depth D1 can be considered equal. For example, depth D2 and depth D1 can be considered equal if the difference is within 15%.

[0145] Since neither the first light-emitting unit 71 nor the second light-emitting unit 72 is the last light-emitting unit 7 manufactured in the display panel, the depth of the groove 811 located in the first light-emitting unit 71 and the second light-emitting unit 72 needs to be set to be less than the depth of the groove 811 located in the third light-emitting unit 73. In this embodiment, the depth D2 of the groove 811 located in the second light-emitting unit 72 is set to be equal to the depth D1 of the groove 811 located in the first light-emitting unit 71. This allows the manufacturing process of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72 to be the same, thereby improving the efficiency of manufacturing the display panel.

[0146] For some possible implementations, please refer to Figure 4 and Figure 5 The orthographic projection of the groove 811 on the array substrate 1 is located within the orthographic projection of the isolation opening 9 on the array substrate 1.

[0147] In this embodiment, the isolation opening 9 can be understood as the largest opening formed by the sidewalls of the isolation structure 3, for example, Figure 5 The outermost dashed line of the same light-emitting unit 7 represents the maximum opening formed by the sidewalls of the isolation structure 3. Since the orthographic projection of the side of the isolation structure 3 closest to the array substrate 1 onto the array substrate 1 lies within the orthographic projection of the side of the isolation structure 3 furthest from the array substrate 1 onto the array substrate 1, at least a portion of the orthographic projection of the groove 811 onto the array substrate 1 also lies within the orthographic projection of the isolation structure 3 onto the array substrate 1. Thus, the groove 811 is located at the position of the first packaging unit 81 near the sidewall of the isolation structure 3.

[0148] Preferably, please see again. Figure 5 The orthographic projection shape of the groove 811 on the array substrate 1 is similar to the orthographic projection shape of the isolation opening 9 on the array substrate 1.

[0149] Preferably, please see again. Figure 4 The orthographic projection of the groove 811 onto the array substrate 1 is annular. The orthographic projection of the groove 811 onto the array substrate 1 surrounds at least a portion of the orthographic projection of the light-emitting unit 7 onto the array substrate 1. The depth of the same groove 811 surrounding the light-emitting unit 7 is equal at different positions; that is, along a direction perpendicular to the array substrate 1, the depth of the same groove 811 located at the same light-emitting unit 7 is equal at different positions. Thus, when forming the second light-emitting unit 72, the second electrode of the second light-emitting unit 72 can provide more complete protection for the first light-emitting unit 71. When forming the third light-emitting unit 73, the second electrode of the third light-emitting unit 73 can provide more complete protection for the first light-emitting unit 71 and the second light-emitting unit 72, thereby improving the display effect of the display panel.

[0150] In some possible implementations, please refer again. Figure 4 Adjacent packaging units 81 are spaced apart on the side of the isolation structure 3 away from the array substrate 1. There is a gap between the packaging unit 81 on the side of the isolation structure 3 away from the array substrate 1 and the side of the isolation structure 3 away from the array substrate 1. The orthographic projection of the packaging unit 81 on the array substrate 1 covers the orthographic projection of the isolation opening 9 on the array substrate 1 and covers part of the orthographic projection of the isolation structure 3 on the array substrate 1.

[0151] During the patterning process of the light-emitting unit 7, the first encapsulation layer 8 is disconnected at the isolation structure 3 to form an encapsulation unit 81. The encapsulation unit 81 can completely and independently encapsulate the corresponding light-emitting unit 7, thereby improving the display characteristics of the display panel.

[0152] For some possible implementations, please refer to Figure 6 The display panel also includes a second encapsulation layer 10 located on the side of the first encapsulation layer 8 away from the array substrate 1, and a third encapsulation layer 11 located on the side of the second encapsulation layer 10 away from the array substrate 1. The materials of the first encapsulation layer 8 and the third encapsulation layer 11 both include inorganic materials, and the material of the second encapsulation layer 10 includes organic materials.

[0153] The second encapsulation layer 10 and the third encapsulation layer 11 can achieve a better encapsulation effect on the light-emitting unit 7, thereby further improving the encapsulation quality of the display panel.

[0154] In some possible implementations, please refer again. Figure 6The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 stacked sequentially along the direction away from the array substrate 1. The orthographic projection of the side of the first isolation portion 31 away from the array substrate 1 on the array substrate 1 is located within the orthographic projection of the second isolation portion 32 on the array substrate 1.

[0155] Since the second isolation portion 32 is located on the side of the first isolation portion 31 away from the array substrate 1, and the lateral width of the second isolation portion 32 is greater than the lateral width of the first isolation portion 31, the second isolation portion 32 will disconnect the light-emitting functional layer and the second electrode layer at the isolation structure 3. In this way, the isolation structure 3 formed by the first isolation portion 31 and the second isolation portion 32 can more easily make each light-emitting unit 7 independently packaged.

[0156] In some possible implementations, please refer again. Figure 6 The second electrode 6 of the light-emitting unit 7 is electrically connected to the first isolation part 31. The first isolation part 31 includes a conductive material, and the second electrode 6 corresponding to the light-emitting unit 7 extends to contact the side wall of the first isolation part 31 so as to realize the electrical connection between the second electrode 6 corresponding to the light-emitting unit 7 and the first isolation part 31.

[0157] Please see Figure 7 The isolation structure 3 also includes a third isolation section 33 located on the side of the first isolation section 31 facing the array substrate 1, and the second electrode 6 of the light-emitting unit 7 is electrically connected to the third isolation section 33.

[0158] The third isolation section 33 includes a conductive material, and the second electrode 6 corresponding to the light-emitting unit 7 extends to contact the side wall of the third isolation section 33 so as to realize the electrical connection between the second electrode 6 corresponding to the light-emitting unit 7 and the third isolation section 33.

[0159] Specifically, the material of the third isolation portion 33 includes molybdenum metal; and / or, the material of the first isolation portion 31 includes aluminum metal; and / or, the material of the second isolation portion 32 includes titanium metal. Thus, when the isolation structure 3 isolates the second electrode layer into the second electrode 6, the second electrode 6 is more easily electrically connected to the first isolation portion 31 and / or the third isolation portion 33.

[0160] In summary, by setting the depth of the groove 811 in the first light-emitting unit 71 to be less than the sum of the thicknesses of the light-emitting portion 5 and the second electrode 6 of the second light-emitting unit 72, the second electrode 6 of the second light-emitting unit 72 can be continuously filmed on the side of the first light-emitting unit 71 away from the array substrate 1 during the fabrication of the second light-emitting unit 72. This provides better protection for the first light-emitting unit 71, making it less likely to be damaged, and thereby improving the display effect of the display panel.

[0161] For some possible implementations, please refer to Figure 8This application also provides a method for manufacturing a display panel, the method comprising:

[0162] S10: Provide an array substrate 1.

[0163] The array substrate 1 may include a substrate and a plurality of driving units located on one side of the substrate, each driving unit may include one or more semiconductor switching devices. The semiconductor switching devices may be formed by the combination of multiple film layers in the array substrate 1; for example, the semiconductor switching devices may be thin-film transistors formed by the combination of multiple film layers.

[0164] S11: An isolation structure 3 is formed on one side of the array substrate 1, and the isolation structure 3 encloses and forms an isolation opening 9.

[0165] Please see Figure 9 A first electrode layer is formed on one side of the array substrate 1. The first electrode layer includes a plurality of first electrodes 4 spaced apart. Each first electrode 4 includes an anode.

[0166] Please see Figure 10 A pixel defining material layer 12 is formed on the side of the first electrode layer away from the array substrate 1.

[0167] Please see Figure 11 An isolation structure material layer 13 is formed on the side of the pixel defining material layer 12 away from the array substrate 1.

[0168] Please see Figure 12 The isolation structure material layer 13 is patterned to form the isolation structure 3.

[0169] Please see Figure 13 The pixel defining material layer 12 is patterned to form a pixel defining layer 2, which includes a pixel opening 21 that exposes at least a portion of the first electrode 4; the orthographic projection of the pixel opening 21 on the array substrate 1 is located within the orthographic projection of the isolation opening 9 on the array substrate 1.

[0170] S12: At least a portion of the light-emitting unit 7 is formed in the isolation opening 9, and a first encapsulation layer 8 is formed on the side of the light-emitting unit 7 away from the array substrate 1. The light-emitting unit 7 includes a light-emitting part 5 and a second electrode 6 stacked sequentially in the direction away from the array substrate 1. The light-emitting unit 7 includes a first light-emitting unit 71 and a second light-emitting unit 72. The first encapsulation layer 8 includes a plurality of encapsulation units 81 arranged at intervals. The encapsulation units 81 at least cover the light-emitting unit 7 and extend to the side of the isolation structure 3. The side of the isolation structure 3 is the surface of the isolation structure 3 facing the isolation opening 9.

[0171] The packaging unit 81 includes a groove 811 on the side away from the array substrate 1. The depth of the groove 811 in the first light-emitting unit 71 is less than the sum of the thickness of the light-emitting part 5 and the second electrode 6 of the second light-emitting unit 72 in a direction perpendicular to the array substrate 1.

[0172] Please see Figure 14 A light-emitting functional layer of the first light-emitting unit 71 is formed on the side of the isolation structure 3 away from the array substrate 1.

[0173] The light-emitting functional layer is broken at the isolation structure 3, so that at least part of the light-emitting functional layer is located in the isolation opening 9 to form the light-emitting part 5. By controlling the evaporation angle, the light-emitting part 5 can be prevented from contacting the isolation structure 3.

[0174] Please see Figure 15 A second electrode layer is formed on the side of the first light-emitting unit 71 away from the array substrate 1.

[0175] The second electrode layer is broken at the isolation structure 3, so that at least part of the second electrode layer is located within the isolation opening 9 to form the second electrode 6. By controlling the evaporation angle, the second electrode 6 can extend from the isolation opening 9 to make electrical contact with the isolation structure 3, so as to connect to adjacent second electrodes 6 or connect the second electrode 6 to other circuits. In this way, the manufacturing difficulty of the display panel can be reduced.

[0176] Please see Figure 16 A first encapsulation layer 8 is formed on the side of the second electrode layer away from the array substrate 1. A groove 811 is formed in the first encapsulation layer 8 within the isolation opening 9 corresponding to the first light-emitting unit 71.

[0177] Please see Figure 17 A first etched protective layer 14 is formed in the isolation opening 9 corresponding to the first light-emitting unit 71, and the first etched protective layer 14 extends to cover the partial isolation structure 3.

[0178] The first etched protective layer 14 can protect the corresponding light-emitting functional layer, the second electrode layer and the first encapsulation layer 8 of the first light-emitting unit 71.

[0179] Please see Figure 18 The first encapsulation layer 8, the light-emitting functional layer, and the second electrode layer not covered by the first etch protection layer 14 are removed, as are the light-emitting functional layer and the second electrode layer located on the side of the isolation structure 3 away from the array substrate 1. The first etch protection layer 14 is also removed to form the light-emitting part 5, the second electrode 6, and the encapsulation unit 81 in the isolation opening 9 corresponding to the first light-emitting unit 71. The encapsulation unit 81 located on the side of the second electrode 6 away from the array substrate 1 forms the groove 811 corresponding to the first light-emitting unit 71. The second electrode 6 extends to the isolation structure 3 corresponding to the first light-emitting unit 71 and is electrically connected.

[0180] Preferably, the depth D1 of the groove 811 in the first light-emitting unit 71 along the direction perpendicular to the array substrate 1 ranges from 0.03μm to 0.07μm. For example, the depth D1 can be 0.03μm, 0.04μm, 0.05μm, 0.06μm, or 0.07μm, etc. By reasonably setting the depth D1, the first light-emitting unit 71 can be made less prone to failure without increasing the number of packaging units 81 corresponding to the first light-emitting unit 71.

[0181] Preferably, the orthographic projection of the groove 811 onto the array substrate 1 is annular, and the orthographic projection of the groove 811 onto the array substrate 1 surrounds at least a portion of the orthographic projection of the first light-emitting unit 71 onto the array substrate 1. The depth of the same groove 811 surrounding the first light-emitting unit 71 is equal at different positions, that is, along the direction perpendicular to the array substrate 1, the depth of the same groove 811 located at the first light-emitting unit 71 is equal at different positions. When forming the second light-emitting unit 72, the second electrode of the second light-emitting unit 72 can provide more complete protection for the first light-emitting unit 71, thereby making it less likely for the first light-emitting unit 71 to fail.

[0182] After removing the first encapsulation layer 8, the light-emitting functional layer, and the second electrode layer that are not covered by the first etched protective layer 14, the first electrode 4, the light-emitting part 5 of the first light-emitting unit 71, and the second electrode 6 form the first light-emitting unit 71. The first light-emitting unit 71 is completely covered by the encapsulation unit 81, thereby reducing the risk of the vapor deposition material entering the vapor deposition equipment after being exposed to the air, causing equipment contamination and film breakage.

[0183] In this way, without the need for a precision mask, the light-emitting part 5, the second electrode 6 and the encapsulation unit 81 can be formed only in the pixel opening 21 corresponding to the first light-emitting unit 71, and the second electrode 6 can be electrically connected to the isolation structure 3, thereby enabling the first light-emitting unit 71 to be formed in the pixel opening 21 corresponding to the first light-emitting unit 71 at a lower cost.

[0184] Please see Figure 19 A light-emitting functional layer of the second light-emitting unit 72 is formed on the side of the isolation structure 3 away from the array substrate 1. The light-emitting functional layer of the second light-emitting unit 72 covers the side of the encapsulation unit 81 corresponding to the first light-emitting unit 71 away from the array substrate 1.

[0185] Based on the formation of the first light-emitting unit 71, a light-emitting functional layer of the second light-emitting unit 72 is formed. The light-emitting functional layer of the second light-emitting unit 72 will cover the encapsulation unit 81 corresponding to the first light-emitting unit 71. At the same time, the light-emitting part 5 of the second light-emitting unit 72 will be formed in the pixel opening 21 corresponding to the second light-emitting unit 72.

[0186] Please see Figure 20A second electrode layer is formed on the side of the light-emitting functional layer of the second light-emitting unit 72 away from the array substrate 1.

[0187] When the second electrode layer is formed, the second electrode layer will be disconnected at the isolation structure 3, and the second electrode 6 of the second light-emitting unit 72 will be formed in the pixel opening 21 corresponding to the second light-emitting unit 72. The second electrode 6 of the second light-emitting unit 72 is connected to the electrode of the corresponding isolation structure 3. At least part of the light-emitting functional layer and / or at least part of the second electrode layer of the second light-emitting unit 72 fills at least part of the groove 811 located in the first light-emitting unit 71, and the second electrode layer of the second light-emitting unit 72 is continuously disposed at the groove 811 corresponding to the first light-emitting unit 71.

[0188] Because the depth D1 of the groove 811 in the first light-emitting unit 71 is significantly reduced, when forming the second electrode layer of the second light-emitting unit 72, the second electrode layer of the second light-emitting unit 72 can be continuously formed at the groove 811 of the first light-emitting unit 71. Therefore, when the second light-emitting unit 72 is patterned subsequently, the second electrode of the second light-emitting unit 72 can provide more complete protection for the first light-emitting unit 71, so that the first light-emitting unit 71 is less likely to be damaged or fail.

[0189] Please see Figure 21 A first encapsulation layer 8 is formed on the side of the second electrode layer away from the array substrate 1. The first encapsulation layer 8 forms a groove 811 in the isolation opening 9 corresponding to the second light-emitting unit 72.

[0190] Please see Figure 22 A second etched protective layer 15 is formed in the isolation opening 9 corresponding to the second light-emitting unit 72, and the second etched protective layer 15 extends to cover the isolation structure 3.

[0191] The second etched protective layer 15 can protect the corresponding light-emitting layer, second electrode layer and first encapsulation layer 8 of the second light-emitting unit 72.

[0192] Please see Figure 23 Remove the first encapsulation layer 8, the light-emitting functional layer and the second electrode layer of the second light-emitting unit 72 that are not covered by the second etch protection layer 15, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure 3 away from the array substrate 1, and remove the second etch protection layer 15, so as to form a light-emitting part 5, a second electrode 6 and an encapsulation unit 81 in the isolation opening 9 corresponding to the second light-emitting unit 72. The encapsulation unit 81 located on the side of the second electrode 6 away from the array substrate 1 forms a groove 811 corresponding to the second light-emitting unit 72. The second electrode 6 extends to the isolation structure 3 corresponding to the second light-emitting unit 72 for electrical connection.

[0193] Preferably, the depth D2 of the groove 811 in the second light-emitting unit 72, along the direction perpendicular to the array substrate 1, ranges from 0.03μm to 0.07μm. For example, the depth D2 can be 0.03μm, 0.04μm, 0.05μm, 0.06μm, or 0.07μm. By reasonably setting the depth D2, the second light-emitting unit 72 can be made less prone to failure without increasing the number of packaging units 81 corresponding to the second light-emitting unit 72.

[0194] Preferably, the orthographic projection of the groove 811 on the array substrate 1 surrounds at least part of the orthographic projection of the second light-emitting unit 72 on the array substrate 1, and the depth of the same groove 811 surrounding the second light-emitting unit 72 is equal at different positions, that is, along the direction perpendicular to the array substrate 1, the depth of the same groove 811 located in the second light-emitting unit 72 is equal at different positions; when forming the third light-emitting unit 73, the second electrode of the third light-emitting unit 73 can provide more complete protection for the second light-emitting unit 72, thereby improving the yield of the second light-emitting unit 72.

[0195] Preferably, along the direction perpendicular to the array substrate 1, the depth D2 of the groove 811 in the second light-emitting unit 72 is equal to the depth D1 of the groove 811 in the first light-emitting unit 71. Here, the equality of depths D2 and D1 does not have to be absolutely equal; as long as the difference between depths D2 and D1 is within a preset error range, they can be considered equal. For example, depths D2 and D1 can be considered equal if the difference is within 15%.

[0196] Since neither the first light-emitting unit 71 nor the second light-emitting unit 72 is the last light-emitting unit 7 manufactured in the display panel, the depth of the groove 811 located in the first light-emitting unit 71 and the second light-emitting unit 72 needs to be set to be less than the depth of the groove 811 located in the third light-emitting unit 73. In this embodiment, the depth D2 of the groove 811 located in the second light-emitting unit 72 is set to be equal to the depth D1 of the groove 811 located in the first light-emitting unit 71. This allows the manufacturing process of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72 to be the same, thereby improving the efficiency of manufacturing the display panel.

[0197] After removing the first encapsulation layer 8, the light-emitting functional layer, and the second electrode layer that are not covered by the second etched protective layer 15, the first electrode 4, the light-emitting part 5 of the second light-emitting unit 72, and the second electrode 6 form the second light-emitting unit 72. The second light-emitting unit 72 is completely covered by the encapsulation unit 81, thereby reducing the risk of the vapor-deposited material entering the vapor-deposited equipment after being exposed to the air, causing equipment contamination and film breakage.

[0198] In this way, the light-emitting part 5, the second electrode 6 and the encapsulation unit 81 can be formed only in the pixel opening 21 corresponding to the second light-emitting unit 72 without the need for a precision mask, and the second electrode 6 can be electrically connected to the isolation structure 3, thereby enabling the second light-emitting unit 72 to be formed in the pixel opening 21 corresponding to the second light-emitting unit 72 at a lower cost.

[0199] Please see Figure 24 A light-emitting functional layer of a third light-emitting unit 73 is formed on the side of the isolation structure 3 away from the array substrate 1. The light-emitting functional layer of the third light-emitting unit 73 covers the side of the encapsulation unit 81 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72 away from the array substrate 1.

[0200] Based on the formation of the first light-emitting unit 71 and the second light-emitting unit 72, a light-emitting functional layer of the third light-emitting unit 73 is formed. The light-emitting functional layer of the third light-emitting unit 73 will cover the encapsulation unit 81 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72. At the same time, the light-emitting part 5 of the third light-emitting unit 73 will be formed in the pixel opening 21 corresponding to the third light-emitting unit 73.

[0201] Please see Figure 25 A second electrode layer is formed on the side of the third light-emitting unit 73 away from the array substrate 1. At least a portion of the light-emitting functional layer and / or at least a portion of the second electrode layer of the third light-emitting unit 73 fills at least a portion of the grooves 811 located in the first light-emitting unit 71 and the second light-emitting unit 72, and the second electrode layer of the third light-emitting unit 73 is continuously disposed in the grooves 811 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72.

[0202] When the second electrode layer is formed, the second electrode layer will be disconnected at the isolation structure 3, and the second electrode 6 of the third light-emitting unit 73 will be formed in the pixel opening 21 corresponding to the third light-emitting unit 73. The second electrode 6 of the third light-emitting unit 73 is connected to the electrode of the corresponding isolation structure 3.

[0203] Because the depth D2 of the groove 811 in the second light-emitting unit 72 and the depth D1 of the groove 811 in the first light-emitting unit 71 are significantly reduced, the second electrode layer of the third light-emitting unit 73 can be continuously formed at the grooves 811 of the first light-emitting unit 71 and the second light-emitting unit 72 when forming the second electrode layer of the third light-emitting unit 73. Therefore, when the third light-emitting unit 73 is patterned subsequently, the second electrode of the third light-emitting unit 73 can provide more complete protection for the first light-emitting unit 71 and the second light-emitting unit 72, so that the first light-emitting unit 71 and the second light-emitting unit 72 are less likely to be damaged or fail.

[0204] Please see Figure 26 A first encapsulation layer 8 is formed on the side of the second electrode layer away from the array substrate 1. The first encapsulation layer 8 forms a groove 811 in the isolation opening 9 corresponding to the third light-emitting unit 73.

[0205] Please see Figure 27 A third etched protective layer 16 is formed in the isolation opening 9 corresponding to the third light-emitting unit 73, and the third etched protective layer 16 extends to cover the partial isolation structure 3.

[0206] The third etched protective layer 16 can protect the corresponding light-emitting layer, second electrode layer and first encapsulation layer 8 of the third light-emitting unit 73.

[0207] Please see Figure 28 The first encapsulation layer 8, the light-emitting functional layer and the second electrode layer of the third light-emitting unit 73 that are not covered by the third etch protection layer 16 are removed, and the light-emitting functional layer and the second electrode layer located on the side of the isolation structure 3 away from the array substrate 1 are removed, and the third etch protection layer 16 is removed, so that the light-emitting part 5, the second electrode 6 and the encapsulation unit 81 are formed in the isolation opening 9 corresponding to the third light-emitting unit 73. The encapsulation unit 81 located on the side of the second electrode 6 away from the array substrate 1 forms the groove 811 corresponding to the third light-emitting unit 73. The second electrode 6 extends to the isolation structure 3 corresponding to the third light-emitting unit 73 and is electrically connected.

[0208] Preferably, along the direction perpendicular to the array substrate 1, the depth D3 of the groove 811 in the third light-emitting unit 73 is greater than the depth of the groove 811 in the first light-emitting unit 71 and the second light-emitting unit 72. Since the third light-emitting unit 73 is the last light-emitting unit 7 fabricated for this display panel, there is no need to consider damage to the third light-emitting unit 73 during the fabrication of other light-emitting units 7. Thus, the thickness of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 can be set to be less than the thickness of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72. Since the thickness of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 is less than the thickness of the first encapsulation layer 8 corresponding to the first light-emitting unit 71 and the second light-emitting unit 72, the patterning of the first encapsulation layer 8 corresponding to the third light-emitting unit 73 can be completed in less time, thereby improving the efficiency of fabricating the display panel.

[0209] Preferably, the depth D3 of the groove 811 in the third light-emitting unit 73 along the direction perpendicular to the array substrate 1 ranges from 0.1μm to 0.2μm. For example, the depth D3 can be 0.1μm, 0.12μm, 0.15μm, 0.18μm, or 0.2μm. Properly setting the depth D3 can improve the patterning efficiency of the first encapsulation layer 8 corresponding to the third light-emitting unit 73.

[0210] Preferably, the orthographic projection of the groove 811 on the array substrate 1 surrounds at least a portion of the orthographic projection of the third light-emitting unit 73 on the array substrate 1, and the depth of the same groove 811 surrounding the third light-emitting unit 73 is equal at different positions, that is, along the direction perpendicular to the array substrate 1, the depth of the same groove 811 located in the third light-emitting unit 73 is equal at different positions. In this way, the uniformity of light emission from the third light-emitting unit 73 is better.

[0211] Thus, the display panel formed by the above method is less likely to damage the front first light-emitting unit 71 and the second light-emitting unit 72, thereby improving the light-emitting effect of the display panel formed by the above method.

[0212] In some possible implementations, this application also provides an electronic device that includes the display panel described in this application, or includes a display panel prepared by the method described in this application. This electronic device may include a device with image processing capabilities, such as a server, personal computer, laptop computer, etc. Because this electronic device includes the display panel described in this application, it has higher display quality.

[0213] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0214] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: Array substrate; An isolation structure located on one side of the array substrate, the isolation structure enclosing an isolation opening; A light-emitting unit is located within the isolation opening. The light-emitting unit includes a light-emitting portion and a second electrode stacked sequentially along a direction away from the array substrate. The light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit. A first encapsulation layer is located on the side of the light-emitting unit away from the array substrate. The first encapsulation layer includes a plurality of encapsulation units spaced apart. The encapsulation units at least cover the light-emitting unit and extend to the side of the isolation structure. The side of the isolation structure is the surface of the isolation structure facing the isolation opening. The packaging unit includes a groove on the side away from the array substrate. Along a direction perpendicular to the array substrate, the depth of the groove in the first light-emitting unit is less than the sum of the thicknesses of the light-emitting portion and the second electrode in the second light-emitting unit. Along a direction perpendicular to the array substrate, the depth of the groove in the second light-emitting unit is equal to the depth of the groove in the first light-emitting unit. The depth of the groove in the second light-emitting unit is less than the depth of the groove in the third light-emitting unit. The depth of the groove in the first light-emitting unit ranges from 0.03 μm to 0.07 μm.

2. The display panel according to claim 1, characterized in that, Along a direction perpendicular to the array substrate, the depth of the groove in the second light-emitting unit is less than the sum of the thickness of the light-emitting portion of the third light-emitting unit and the thickness of the second electrode.

3. The display panel according to claim 1, characterized in that, The depth of the groove in the first light-emitting unit is less than the thickness of the light-emitting part in the second light-emitting unit; The depth of the groove in the second light-emitting unit is less than the thickness of the light-emitting part in the third light-emitting unit.

4. The display panel according to claim 1, characterized in that, Along a direction perpendicular to the array substrate, the depth of the groove located in the first light-emitting unit is less than the depth of the groove located in the third light-emitting unit; The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit all emit different colors.

5. The display panel according to claim 1, characterized in that, Along a direction perpendicular to the array substrate, the depth of the groove in the second light-emitting unit ranges from 0.03 μm to 0.07 μm; Along a direction perpendicular to the array substrate, the depth of the groove in the third light-emitting unit ranges from 0.1 μm to 0.2 μm.

6. The display panel according to any one of claims 1-5, characterized in that, The orthographic projection of the groove on the array substrate is located within the orthographic projection of the isolation opening on the array substrate; At least a portion of the groove's orthogonal projection onto the array substrate lies within the orthogonal projection of the isolation structure onto the array substrate.

7. The display panel according to claim 1, characterized in that, The orthographic projection of the groove on the array substrate is annular, and the orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the light-emitting unit on the array substrate. The depth of the same groove surrounding the light-emitting unit is equal at different locations.

8. The display panel according to any one of claims 1-5, characterized in that, The adjacent packaging units are spaced apart on the side of the isolation structure away from the array substrate; There is a gap between the packaging unit located on the side of the isolation structure away from the array substrate and the side of the isolation structure away from the array substrate; The orthographic projection of the packaging unit on the array substrate covers the orthographic projection of the isolation opening on the array substrate and the orthographic projection of the isolation structure on the array substrate.

9. The display panel according to claim 1, characterized in that, The display panel further includes a second encapsulation layer located on the side of the first encapsulation layer away from the array substrate; The display panel further includes a third encapsulation layer located on the side of the second encapsulation layer away from the array substrate; Both the first encapsulation layer and the third encapsulation layer are made of inorganic materials; The material of the second encapsulation layer includes organic materials.

10. The display panel according to any one of claims 1-5, characterized in that, The light-emitting unit further includes a first electrode located on the side of the light-emitting part closer to the array substrate; The display panel further includes a pixel defining layer located on the side of the film layer where the first electrode is located away from the array substrate, and the isolation structure is located on the side of the pixel defining layer away from the array substrate; the pixel defining layer includes pixel openings that expose at least part of the first electrode, and the orthographic projection of the isolation structure on the array substrate is located between the orthographic projections of two adjacent pixel openings on the array substrate. The orthographic projection of the pixel opening on the array substrate lies within the orthographic projection of the isolation opening on the array substrate.

11. The display panel according to any one of claims 1-5, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion stacked sequentially along a direction away from the array substrate, wherein the orthographic projection of the side of the first isolation portion away from the array substrate on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate.

12. The display panel according to claim 11, characterized in that, The second electrode of the light-emitting unit is electrically connected to the first isolation portion; and / or, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the array substrate, and the second electrode of the light-emitting unit is electrically connected to the third isolation portion; The material of the third isolation part includes molybdenum metal; and / or, the material of the first isolation part includes aluminum metal; and / or, the material of the second isolation part includes titanium metal.

13. A method for manufacturing a display panel, characterized in that, The method includes: Provide an array substrate; An isolation structure is formed on one side of the array substrate, and the isolation structure encloses an isolation opening; At least a portion of the light-emitting units are formed within the isolation opening, and a first encapsulation layer is formed on the side of the light-emitting units away from the array substrate. The light-emitting units include light-emitting portions and second electrodes stacked sequentially in a direction away from the array substrate. The light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit. The first encapsulation layer includes a plurality of encapsulation units spaced apart. The encapsulation units at least cover the light-emitting units and extend to the side of the isolation structure. The side of the isolation structure is the surface of the isolation structure facing the isolation opening. The packaging unit includes a groove on the side away from the array substrate. Along a direction perpendicular to the array substrate, the depth of the groove in the first light-emitting unit is less than the sum of the thicknesses of the light-emitting portion and the second electrode in the second light-emitting unit. Along a direction perpendicular to the array substrate, the depth of the groove in the second light-emitting unit is equal to the depth of the groove in the first light-emitting unit. The depth of the groove in the second light-emitting unit is less than the depth of the groove in the third light-emitting unit. The depth of the groove in the first light-emitting unit ranges from 0.03 μm to 0.07 μm.

14. The method for manufacturing a display panel according to claim 13, characterized in that, The step of forming an isolation structure on one side of the array substrate includes: A first electrode layer is formed on one side of the array substrate, the first electrode layer comprising a plurality of spaced first electrodes; A pixel defining material layer is formed on the side of the first electrode layer away from the array substrate; An isolation structure material layer is formed on the side of the pixel defining material layer away from the array substrate; The isolation structure material layer is patterned to form an isolation structure; The pixel defining material layer is patterned to form a pixel defining layer, the pixel defining layer including a pixel opening that exposes at least a portion of the first electrode; the orthographic projection of the pixel opening on the array substrate lies within the orthographic projection of the isolation opening on the array substrate.

15. The method for manufacturing a display panel according to claim 13, characterized in that, The step of forming at least a portion of the light-emitting units within the isolation opening and forming a first encapsulation layer on the side of the light-emitting units away from the array substrate includes: A light-emitting functional layer of the first light-emitting unit is formed on the side of the isolation structure away from the array substrate; A second electrode layer is formed on the side of the light-emitting functional layer of the first light-emitting unit away from the array substrate; A first encapsulation layer is formed on the side of the second electrode layer away from the array substrate; A first etched protective layer is formed in the isolation opening corresponding to the first light-emitting unit, and the first etched protective layer extends to cover a portion of the isolation structure; Remove the first encapsulation layer, the light-emitting functional layer, and the second electrode layer that are not covered by the first etch protection layer, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate, and remove the first etch protection layer, so as to form a light-emitting part, a second electrode, and an encapsulation unit in the isolation opening corresponding to the first light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the first light-emitting unit.

16. The method for manufacturing a display panel according to claim 15, characterized in that, The second electrode extends to be electrically connected to the isolation structure corresponding to the first light-emitting unit; Along a direction perpendicular to the array substrate, the depth of the groove in the first light-emitting unit ranges from 0.03 μm to 0.07 μm; The orthographic projection of the groove on the array substrate is annular, and the orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the first light-emitting unit on the array substrate. The depth of the same groove surrounding the first light-emitting unit is equal at different positions.

17. The method for manufacturing a display panel according to claim 15, characterized in that, After the steps of removing the first encapsulation layer, the light-emitting functional layer, and the second electrode layer not covered by the first etch protection layer, and removing the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate, and removing the first etch protection layer, the method further includes: A light-emitting functional layer of a second light-emitting unit is formed on the side of the isolation structure away from the array substrate, and the light-emitting functional layer of the second light-emitting unit covers the side of the packaging unit corresponding to the first light-emitting unit away from the array substrate. A second electrode layer is formed on the side of the light-emitting functional layer of the second light-emitting unit away from the array substrate. At least a portion of the light-emitting functional layer and / or at least a portion of the second electrode layer of the second light-emitting unit fills at least a portion of the groove located in the first light-emitting unit, and the second electrode layer of the second light-emitting unit is continuously disposed at the groove corresponding to the first light-emitting unit. A first encapsulation layer is formed on the side of the second electrode layer away from the array substrate; A second etched protective layer is formed within the isolation opening corresponding to the second light-emitting unit; Remove the first encapsulation layer, the light-emitting functional layer, and the second electrode layer of the second light-emitting unit that are not covered by the second etch protective layer, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate, and remove the second etch protective layer, so as to form a light-emitting part, a second electrode, and an encapsulation unit in the isolation opening corresponding to the second light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the second light-emitting unit.

18. The method for manufacturing a display panel according to claim 17, characterized in that, The second electrode extends to be electrically connected to the isolation structure corresponding to the second light-emitting unit; Along a direction perpendicular to the array substrate, the depth of the groove in the second light-emitting unit ranges from 0.03 μm to 0.07 μm; The orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the second light-emitting unit on the array substrate, and the depth of the same groove surrounding the second light-emitting unit is equal at different locations; Along a direction perpendicular to the array substrate, the depth of the groove in the second light-emitting unit is equal to the depth of the groove in the first light-emitting unit.

19. The method for manufacturing a display panel according to claim 17, characterized in that, After the steps of removing the first encapsulation layer, the light-emitting functional layer, and the second electrode layer of the second light-emitting unit not covered by the second etch protective layer, and removing the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate, and removing the second etch protective layer, the method further includes: A light-emitting functional layer of a third light-emitting unit is formed on the side of the isolation structure away from the array substrate, and the light-emitting functional layer of the second light-emitting unit covers the packaging unit corresponding to the first light-emitting unit and the second light-emitting unit on the side away from the array substrate. A second electrode layer is formed on the side of the light-emitting functional layer of the third light-emitting unit away from the array substrate. At least a portion of the light-emitting functional layer and / or at least a portion of the second electrode layer of the third light-emitting unit fill at least a portion of the grooves located in the first light-emitting unit and the second light-emitting unit, and the second electrode layer of the third light-emitting unit is continuously disposed at the grooves corresponding to the first light-emitting unit and the second light-emitting unit. A first encapsulation layer is formed on the side of the second electrode layer away from the array substrate; A third etched protective layer is formed within the isolation opening corresponding to the third light-emitting unit; Remove the first encapsulation layer, the light-emitting functional layer, and the second electrode layer of the third light-emitting unit that are not covered by the third etch protective layer, and remove the light-emitting functional layer and the second electrode layer located on the side of the isolation structure away from the array substrate, and remove the third etch protective layer, so as to form a light-emitting part, a second electrode, and an encapsulation unit in the isolation opening corresponding to the third light-emitting unit, and the encapsulation unit located on the side of the second electrode away from the array substrate forms the groove corresponding to the third light-emitting unit.

20. The method for manufacturing a display panel according to claim 19, characterized in that, The second electrode extends to be electrically connected to the isolation structure corresponding to the third light-emitting unit; Along a direction perpendicular to the array substrate, the depth of the groove located in the third light-emitting unit is greater than the depth of the groove located in the first light-emitting unit and / or the second light-emitting unit; Along a direction perpendicular to the array substrate, the depth of the groove in the third light-emitting unit ranges from 0.1 μm to 0.2 μm; The orthographic projection of the groove on the array substrate surrounds at least a portion of the orthographic projection of the third light-emitting unit on the array substrate, and the depth of the same groove surrounding the third light-emitting unit is equal at different locations.

21. An electronic device, characterized in that, The electronic device includes a display panel as described in any one of claims 1-12, or a display panel prepared by the method for preparing a display panel as described in any one of claims 13-20.

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