Display panel, manufacturing method of display panel and electronic equipment

Abstract

The invention provides a display panel, a manufacturing method of the display panel and electronic equipment. The display panel comprises a substrate; the isolation structure layer is located on one side of the substrate and comprises isolation parts and wiring parts, the isolation parts define isolation openings, at least part of the isolation parts are arranged at intervals, the wiring parts are located between the adjacent isolation parts, and first gaps are formed between the wiring parts and the isolation parts; wherein at the position facing the first gap, the orthographic projection of the side, away from the substrate, of the isolation structure layer on the substrate does not exceed the orthographic projection of the side, close to the substrate, of the isolation structure layer on the substrate. In this way, the risk that the electrode material layer remains between the isolation part and the wiring part in the subsequent manufacturing process of the light-emitting device can be reduced, and therefore short circuit of the isolation part and the wiring part is avoided.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the invention

[0004] In order to overcome the above-mentioned deficiencies in the prior art, the object of the present application is to provide a display panel, the display panel comprising:

[0005] substrate;

[0006] An isolation structure layer located on one side of the substrate, the isolation structure layer includes an isolation portion and a wiring portion, the isolation portion encloses an isolation opening, at least part of the isolation portions are arranged at intervals, the wiring portion is located between adjacent isolation portions, and a first gap is provided between the wiring portion and the isolation portion;

[0007] Wherein, toward the first gap, the orthographic projection of a side of the isolation structure layer away from the substrate on the substrate does not exceed the orthographic projection of a side of the isolation structure layer close to the substrate on the substrate.

[0008] In some possible implementations, the wiring portion is electrically connected to a touch detection circuit;

[0009] Preferably, the isolation portion is electrically connected to a common voltage providing circuit;

[0010] Preferably, the isolation portion is insulated from the routing portion.

[0011] In some possible implementations, a width of the first gap ranges from 3 microns to 6 microns.

[0012] In some possible implementations, the display panel further includes a pixel defining layer located between the isolation portion and the substrate, the pixel defining layer includes a pixel opening, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate, and the first gap exposes the pixel defining layer.

[0013] In some possible implementations, toward the first gap, the orthographic projection of the side of the routing portion away from the substrate on the substrate does not exceed the orthographic projection of the side of the routing portion close to the substrate on the substrate, and the orthographic projection of the side of the isolation portion away from the substrate on the substrate does not exceed the orthographic projection of the side of the isolation portion close to the substrate on the substrate.

[0014] In some possible implementations, toward the isolation opening, an orthographic projection of a side of the isolation structure layer close to the substrate on the substrate is within an orthographic projection of a side of the isolation structure layer away from the substrate on the substrate.

[0015] In some possible implementations, the routing portion includes a first routing segment extending along a first direction and a second routing segment extending along a second direction; the first routing segment is disconnected at an intersection with the second routing segment, and the disconnected portion of the first routing segment is connected by a first bridge line, and the first bridge line and the isolation structure layer are not arranged at the same layer;

[0016] Preferably, at least some of the adjacent isolation portions are connected to each other via a second bridge line, and the second bridge line and the routing portion are not arranged on the same layer.

[0017] In some possible implementations, the display panel further includes a light emitting device, at least a portion of which is located in the isolation opening;

[0018] Preferably, the display panel further comprises a packaging unit, wherein the packaging unit is located on a side of the light-emitting device away from the substrate, at least a portion of the packaging unit is located within the isolation opening, and at least a portion of the packaging unit extends along the isolation portion toward a side wall of the isolation opening to a side of the isolation portion away from the substrate.

[0019] In some possible implementations, the light-emitting device includes a first electrode, a light-emitting material layer, and a second electrode stacked in a direction away from the substrate, and the second electrode is electrically connected to the isolation portion.

[0020] In some possible implementations, the display panel further includes a first encapsulation layer and a second encapsulation layer located on a side of the encapsulation unit and the isolation portion away from the substrate;

[0021] Preferably, the materials of the encapsulation unit and the second encapsulation layer include inorganic materials; the material of the first encapsulation layer includes organic materials;

[0022] Preferably, the first encapsulation layer extends into the first gap and contacts the pixel defining layer.

[0023] In some possible implementations, the isolation portion includes a supporting portion and a shielding portion located on a side of the supporting portion away from the substrate, and an orthographic projection of one end of the supporting portion facing the isolation opening on the substrate is located within an orthographic projection of one end of the shielding portion facing the isolation opening on the substrate;

[0024] Preferably, the etching resistance of the supporting portion is weaker than that of the shielding portion;

[0025] Preferably, the material of the supporting portion includes aluminum, and / or the material of the shielding portion includes titanium.

[0026] In some possible implementations, the isolation portion further includes a receiving portion located between the support portion and the substrate;

[0027] Preferably, the orthographic projection of one end of the receiving portion facing the isolation opening on the substrate is located within the orthographic projection of one end of the shielding portion facing the isolation opening on the substrate;

[0028] Preferably, the material of the receiving portion includes molybdenum.

[0029] Another object of the present application is to provide a display panel, the display panel comprising:

[0030] substrate;

[0031] An isolation structure layer located on one side of the substrate, the isolation structure layer includes an isolation portion and a routing portion, the isolation portion encloses an isolation opening, at least a portion of the isolation portions are arranged at intervals, and the routing portion is located between adjacent isolation portions;

[0032] The isolation structure layer includes a supporting portion and a shielding portion stacked in a direction away from the substrate;

[0033] The minimum undercut length of the routing portion is less than or equal to the minimum undercut length of the isolation portion;

[0034] The minimum undercut length of the routing portion is the minimum distance between the orthographic projection of the side of the shielding portion close to the supporting portion on the substrate and the orthographic projection of the side of the supporting portion close to the shielding portion on the substrate in the routing portion;

[0035] The minimum undercut length of the isolation portion is the minimum distance between a side of the shielding portion close to the orthographic projection of the support portion on the substrate and a side of the support portion close to the shielding portion on the substrate in the isolation portion.

[0036] In some possible implementations, the minimum undercut length of the routing portion is 0;

[0037] Preferably, an orthographic projection of the shielding portion of the routing portion on the substrate is located within an orthographic projection of the supporting portion of the routing portion on the substrate.

[0038] In some possible implementations, a first undercut length of the isolation portion close to the first gap is smaller than a second undercut length of the isolation portion close to one side of the isolation opening;

[0039] The first undercut length is the minimum distance between the orthographic projection of the side of the shielding portion close to the supporting portion on the substrate and the orthographic projection of the side of the supporting portion close to the shielding portion on the substrate at one end of the isolation portion close to the first gap;

[0040] The second undercut length is the minimum distance between the orthographic projection of the side of the shielding portion close to the supporting portion on the substrate and the orthographic projection of the side of the supporting portion close to the shielding portion on the substrate at one end of the isolation portion close to the isolation opening;

[0041] Preferably, the first undercut length is zero.

[0042] Another object of the present application is to provide a method for manufacturing a display panel, the method comprising:

[0043] providing a substrate;

[0044] Disposing an isolation structure layer on one side of the substrate;

[0045] Etching the isolation structure layer to form a plurality of isolation openings;

[0046] Wherein, before or after the step of etching the isolation structure layer to form a plurality of isolation openings, the method further comprises:

[0047] The isolation structure layer is etched to form an isolation portion and a routing portion; a plurality of the isolation portions are arranged at intervals, the routing portion is located between adjacent isolation portions, and a first gap is provided between the routing portion and the isolation portion; toward the first gap, an orthographic projection of a side of the isolation structure layer away from the substrate on the substrate is located within an orthographic projection of a side of the isolation structure layer close to the substrate on the substrate.

[0048] In some possible implementations, the isolation structure layer includes a first sublayer and a second sublayer, and the first sublayer is located on a side of the second sublayer away from the substrate; and the step of etching the isolation structure layer to form a plurality of isolation openings includes:

[0049] forming a first sub-opening on the first sub-layer in a first etching operation;

[0050] In a second etching operation, a second sub-opening is formed on the second sub-layer, and the first sub-opening and the second sub-opening are connected to form the isolation opening;

[0051] The step of etching the isolation structure layer to form a wiring portion includes:

[0052] The first sub-layer and the second sub-layer are etched in one etching operation to form the first gap between the isolation portion and the routing portion.

[0053] Another object of the present application is to provide a method for manufacturing a display panel, the method comprising:

[0054] providing a substrate;

[0055] Disposing an isolation structure layer on one side of the substrate;

[0056] Etching the isolation structure layer to form a plurality of isolation openings;

[0057] forming a light-emitting layer and a second electrode of the light-emitting device in the isolation opening;

[0058] The isolation structure layer is etched to form an isolation portion and a routing portion, wherein the orthographic projection of the isolation portion on the substrate surrounds the orthographic projection of the isolation opening on the substrate, the isolation portions are arranged at intervals, the routing portion is located between adjacent isolation portions, and a first gap is provided between the routing portion and the isolation portion.

[0059] Another object of the present application is to provide an electronic device, which includes the display panel provided in the present application, or the electronic device includes a display panel manufactured by the manufacturing method of the display panel provided in the present application.

[0060] Compared with the prior art, this application has the following beneficial effects:

[0061] The display panel, the manufacturing method of the display panel and the electronic device provided by the present application have no undercut structures on both sides of the first gap between the isolation part and the wiring part. In this way, the risk of the electrode material layer remaining between the isolation part and the wiring part during the subsequent light-emitting device manufacturing process can be reduced, thereby avoiding short circuit between the isolation part and the wiring part. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0063] Figure 1 A schematic diagram of a display panel in the related art;

[0064] Figure 2 One of the cross-sectional schematic diagrams of the display panel provided in this embodiment;

[0065] Figure 3 One of the schematic diagrams of the isolation structure layer provided in this embodiment;

[0066] Figure 4 A second schematic diagram of the isolation structure layer provided in this embodiment;

[0067] Figure 5 A third schematic diagram of the isolation structure layer provided in this embodiment;

[0068] Figure 6 A second cross-sectional schematic diagram of a display panel provided in this embodiment;

[0069] Figure 7 The third cross-sectional schematic diagram of the display panel provided in this embodiment;

[0070] Figure 8 A fourth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0071] Fig. 9 One of the schematic diagrams of the isolation structure provided in this embodiment;

[0072] Fig.10 A second schematic diagram of the isolation structure provided in this embodiment;

[0073] Fig.11 A fifth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0074] Fig.12 A sixth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0075] Fig.13 One of the schematic flow charts of the method for manufacturing a display panel provided in this embodiment;

[0076] Fig.14 The second schematic flow chart of the method for manufacturing a display panel provided in this embodiment.

[0077] Icon: 110-substrate; 111-substrate; 112-array functional layer; 120-first electrode; 130-pixel defining layer; 140-isolation structure layer; 1401-isolation part; 1402-routing part; 150-light-emitting layer; 160-second electrode; 170-packaging unit; 180-first packaging layer; 190-second packaging layer; 601-first routing segment; 602-second routing segment; 801-light-emitting device; 710-first bridge wire; 720-second bridge wire; 910-isolation opening; 920-first gap; 141-support part; 142-shielding part; 143-receiving part; 1500-light-emitting material layer; 1600-electrode material layer. DETAILED DESCRIPTION

[0078] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0079] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0080] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0081] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0082] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0083] In some display panels, an isolation structure is provided to disconnect the light-emitting material layers in different pixel openings during the evaporation process of the organic light-emitting material layer. Among them, patent applications CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A record the relevant technical solutions of the isolation part (or isolation structure, partition structure, or isolation column), and the contents thereof are incorporated into this application by reference for reference. On this basis, a routing part and an isolation part can be set in the isolation structure layer, the routing part is used to form a signal routing, and the isolation part is used to enclose and form an isolation opening, and there is a gap between the isolation part and the routing part.

[0084] See also Figure 1 The inventors have found that in this type of display panel, the isolation opening 910' and the wiring portion 1402' are usually formed simultaneously in the same etching step, and the isolation portion 1401' needs to have an undercut structure toward the isolation opening 910' to effectively disconnect the organic material during the subsequent organic material evaporation process. Therefore, the first gap 920' between the wiring portion 1402' and the isolation portion 1401' also has an undercut structure on both sides. After the organic material and the electrode material are evaporated, the organic material and the electrode material evaporated in the first gap 920' need to be etched away. However, due to the undercut structure on both sides of the first gap 920', the electrode material here may not be effectively removed, which in turn causes the isolation portion 1401' and the wiring portion 1402' to short-circuit, affecting the display function or other functions of the display panel.

[0085] In view of this, the present embodiment provides a solution that can reduce the risk of short circuit between the isolation portion and the signal wiring. The solution provided by the present embodiment is described in detail below.

[0086] See also Figure 2 , Figure 2 The present embodiment provides a display panel, which may include a substrate 110 and an isolation structure layer 140 .

[0087] The substrate 110 may include a substrate 111 and an array function layer 112 located on one side of the substrate 111 .

[0088] The material of the substrate 111 may include a rigid material, such as glass, or a flexible material, such as polyimide (Pi).

[0089] The array function layer 112 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer, etc. The multiple film layer structures of the array function layer 112 may form multiple thin film transistors (TFTs) at different positions, and the thin film transistors may cooperate with each other to form multiple pixel driving units or driving circuits.

[0090] The isolation structure layer 140 is located on one side of the substrate 110 . For example, the isolation structure layer 140 may be located on a side of the array functional layer 112 away from the substrate 111 .

[0091] The isolation structure layer 140 includes an isolation portion 1401 and a routing portion 1402. The isolation portion 1401 encloses an isolation opening 910. At least part of the isolation portions 1401 are arranged at intervals. The routing portion 1402 is located between adjacent isolation portions 1401. There is a first gap 920 between the routing portion 1402 and the isolation portion 1401. That is, in this embodiment, the isolation portion 1401 and the routing portion 1402 are arranged in the same layer, and there is a first gap 920 between the isolation portion 1401 and the routing portion 1402.

[0092] In this embodiment, toward the first gap 920 , the orthographic projection of the side of the isolation structure layer 140 away from the substrate 110 on the substrate 110 does not exceed the orthographic projection of the side of the isolation structure layer 140 close to the substrate 110 on the substrate 110 .

[0093] For example, in the direction toward the first gap 920, the orthographic projection of the side of the isolation portion 1401 away from the substrate 110 on the substrate 110 does not exceed the orthographic projection of the side of the isolation portion 1401 close to the substrate 110 on the substrate 110, and the orthographic projection of the side of the routing portion 1402 away from the substrate 110 on the substrate 110 does not exceed the orthographic projection of the side of the routing portion 1402 close to the substrate 110 on the substrate 110. That is, in the direction toward the first gap 920, neither the isolation portion 1401 nor the routing portion 1402 has an undercut structure. Optionally, in this embodiment, the isolation portion 1401 and the routing portion 1402 are insulated.

[0094] Based on the above design, since there is no bottom cut structure blocking the two sides of the first gap 920, the light-emitting material layer and the electrode material layer can be more effectively removed during etching after the light-emitting material layer and the electrode material layer are evaporated, thereby reducing the risk of the electrode material layer remaining between the isolation portion 1401 and the wiring portion 1402, thereby avoiding short circuit between the isolation portion 1401 and the wiring portion 1402.

[0095] In some possible implementations, toward the isolation opening 910 , an orthographic projection of a side of the isolation portion 1401 close to the substrate 110 on the substrate 110 is within an orthographic projection of a side of the isolation structure layer 140 away from the substrate 110 on the substrate 110 .

[0096] That is, the isolation portion 1401 has an undercut structure on the side facing the isolation opening 910 , and the isolation structure layer 140 may not have an undercut structure on the side facing the first gap 920 .

[0097] In some possible implementations, the display panel further includes a pixel defining layer 130 located between the isolation structure layer 140 and the substrate 110. The pixel defining layer 130 includes a pixel opening, and the orthographic projection of the pixel opening on the substrate 110 is located within the orthographic projection of the isolation opening 910 on the substrate 110, that is, the pixel opening is connected to the isolation opening 910. The first gap 920 exposes the pixel defining layer 130.

[0098] In some possible implementations, the wiring portion 1402 is electrically connected to the touch detection circuit, that is, the wiring portion 1402 can be used to form a touch detection electrode.

[0099] In this case, optionally, see Figure 3 and Figure 4 In order to increase the sensing area of ​​the touch detection electrode, the wiring portions 1402 in different extending directions can be interconnected to form a mesh structure of detection electrodes, and the isolation portion 1401 can be located in the mesh of the mesh structure formed by the wiring portions 1402 .

[0100] Alternatively, see an example. Figure 3 , an isolation portion 1401 can enclose and form an isolation opening 910. In another example, see Figure 4 One isolation portion 1401 may also enclose a plurality of isolation openings 910 , for example, one isolation portion 1401 may also enclose three isolation openings 910 corresponding to three color sub-pixels in one pixel.

[0101] Optionally, the isolation structure is electrically connected to a common voltage providing circuit.

[0102] For example, the display panel further includes a light emitting device 801, at least a portion of which is located in the isolation opening 910. The light emitting device 801 includes a first electrode 120, a light emitting layer 150, and a second electrode 160 stacked in a direction away from the substrate 110, and the second electrode 160 is electrically connected to the isolation portion 1401. That is, the second electrode 160 can be connected to the common voltage supply circuit through the isolation portion 1401.

[0103] Furthermore, the first electrode 120 can be connected to the pixel driving circuit in the array substrate 110, and the second electrode 160 can be connected to the common voltage providing circuit through the isolation portion 1401. When there is a potential difference between the first electrode 120 and the second electrode 160, the light-emitting layer 150 located between the first electrode 120 and the second electrode 160 is driven to emit light.

[0104] In some possible implementations, the display panel also includes a packaging unit 170, which is located on a side of the light-emitting device 801 away from the substrate 110, at least a portion of the packaging unit 170 is located in the isolation opening 910, and at least a portion of the packaging unit 170 extends along the isolation portion 1401 toward the side wall of the isolation opening 910 to the side of the isolation portion 1401 away from the substrate 110.

[0105] In some possible implementations, the wiring portion 1402 constituting the touch detection electrode needs to form detection electrodes extending in different directions. In this case, see Figure 5 and Figure 6 , Figure 6 for Figure 5 In the cross-sectional view at position AA, the routing portion 1402 includes a first routing segment 601 extending along a first direction and a second routing segment 602 extending along a second direction. The first routing segment 601 is disconnected at the intersection with the second routing segment 602, and the disconnected portion of the first routing segment 601 is connected by a first bridge line 710, and the first bridge line 710 and the isolation structure layer 140 are not arranged at the same layer.

[0106] That is, at a position where the first routing segment 601 may cross the second routing segment 602, the first routing segment 601 is disconnected and connected via a first bridge line 710 that is not arranged at the same layer as the second routing segment 602. In this way, the first routing segment 601 and the second routing segment 602 can be prevented from being short-circuited.

[0107] Optionally, see Figure 7 , Figure 7 for Figure 5 In the cross-sectional view at position BB shown in FIG. 1 , at least some of the adjacent isolation portions 1401 are connected to each other via the second bridge wire 720, and the second bridge wire 720 is not arranged at the same layer as the routing portion 1402. In this way, the adjacent isolation portions 1401 can be electrically connected to each other via the second bridge wire 720, and the second bridge wire 720 will not be short-circuited with the routing portion 1402.

[0108] Optionally, in this embodiment, the first bridge line 710 and / or the second bridge line 720 may be disposed in the same layer as the first electrode 120 , and the first bridge line 710 and / or the second bridge line 720 may also be disposed in the same layer as at least part of the routing lines in the array functional layer 110 .

[0109] For some possible implementations, see again Figure 2 , the width W1 of the first gap 920 ranges from 3 microns to 6 microns.

[0110] For some possible implementations, see Figure 8 The display panel further includes a first encapsulation layer 180 and a second encapsulation layer 190 located on a side of the encapsulation unit 170 and the isolation portion 1401 away from the substrate 110 .

[0111] Optionally, the materials of the encapsulation unit 170 and the second encapsulation layer 190 include inorganic materials, and the material of the first encapsulation layer 180 includes organic materials.

[0112] In the case where the display panel has the pixel defining layer 130 , at least a portion of the first encapsulation layer 180 fills into the first gap 920 and contacts the pixel defining layer 130 .

[0113] For some possible implementations, see Fig. 9 The isolation portion 1401 includes a supporting portion 141 and a shielding portion 142 located on the side of the supporting portion 141 away from the substrate 110, and the orthographic projection of one end of the supporting portion 141 facing the isolation opening 910 on the substrate 110 is located within the orthographic projection of one end of the shielding portion 142 facing the isolation opening 910 on the substrate 110.

[0114] Optionally, the etching resistance of the support portion 141 is weaker than the etching resistance of the shielding portion 142 .

[0115] Optionally, the material of the support portion 141 includes aluminum, and / or the material of the shielding portion 142 includes titanium.

[0116] For some possible implementations, see Fig.10 The isolation portion 1401 further includes a receiving portion 143 located between the support portion 141 and the substrate 110 .

[0117] Optionally, the orthographic projection of one end of the receiving portion 143 facing the isolation opening 910 on the substrate 110 is located within the orthographic projection of one end of the shielding portion 142 facing the isolation opening 910 on the substrate 110 .

[0118] Optionally, the material of the receiving portion 143 includes molybdenum.

[0119] This embodiment further provides a display panel. The display panel may include a substrate 110 and an isolation structure layer 140 .

[0120] The substrate 110 may include a substrate 111 and an array function layer 112 located on one side of the substrate 111 .

[0121] The material of the substrate 111 may include a rigid material, such as glass, or a flexible material, such as polyimide (Pi).

[0122] The array function layer 112 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer, etc. The multiple film layer structures of the array function layer 112 may form multiple thin film transistors (TFTs) at different positions, and the thin film transistors may cooperate with each other to form multiple pixel driving units or driving circuits.

[0123] The isolation structure layer 140 is located on one side of the substrate 110 . For example, the isolation structure layer 140 may be located on a side of the array functional layer 112 away from the substrate 111 .

[0124] The isolation structure layer 140 includes an isolation portion 1401 and a routing portion 1402. The isolation portion 1401 encloses an isolation opening 910. At least part of the isolation portions 1401 are arranged at intervals. The routing portion 1402 is located between adjacent isolation portions 1401. There is a first gap 920 between the routing portion 1402 and the isolation portion 1401. That is, in this embodiment, the isolation portion 1401 and the routing portion 1402 are arranged on the same layer.

[0125] The isolation structure layer 140 includes a support portion 141 and a shielding portion 142 stacked in a direction away from the substrate 111. The contact surfaces of the support portion 141 and the shielding portion 142 have different projection areas on the substrate 110, and at least a portion of the projection area of ​​the shielding portion 142 on the substrate is larger than the projection area of ​​the support portion 141 on the substrate. On a plane parallel to the substrate, the dimension of the shielding portion 142 along a certain direction exceeds the dimension of the support portion 141 along the same direction, and the exceeding portion is defined as the undercut length. The undercut length of the routing portion and the undercut length of the isolation portion are at least partially different.

[0126] See also Fig.11 , the minimum undercut length W2 of the routing portion 1402 is less than or equal to the minimum undercut length W3 of the isolation portion 1401 .

[0127] Among them, the minimum undercut length W2 of the routing portion 1402 is the minimum distance between the orthographic projection of the side of the blocking portion 142 close to the supporting portion 141 on the substrate 111 and the orthographic projection of the side of the supporting portion 141 close to the blocking portion 142 on the substrate 111 in the routing portion 1402.

[0128] The minimum undercut length W3 of the isolation portion 1401 is less than or equal to the minimum undercut length of the isolation portion 1401. The minimum undercut length of the isolation portion 1401 is the minimum distance between the orthographic projection of the side of the shielding portion 142 close to the supporting portion 141 on the substrate 111 and the orthographic projection of the side of the supporting portion 141 close to the shielding portion 142 on the substrate 111 in the isolation portion 1401.

[0129] That is, in this embodiment, by reducing the undercut length of the routing portion 1402 , the risk of the light emitting material layer and the electrode material layer remaining near the routing portion 1402 can be reduced, thereby reducing the short circuit between the routing portion 1402 and the isolation portion 1401 .

[0130] In some possible implementations, the minimum undercut length W2 of the routing portion 1402 may be 0, that is, the routing portion 1402 may not have an undercut structure.

[0131] Optionally, the orthographic projection of the shielding portion 142 of the routing portion 1402 on the substrate is located within the orthographic projection of the supporting portion 141 of the routing portion 1402 on the substrate 111 .

[0132] For some possible implementations, see Fig.12 , the first undercut length W31 of the isolation portion 1401 near the first gap 920 is smaller than the second undercut length W32 of the isolation portion 1401 near the isolation opening 910.

[0133] The first undercut length W31 is the minimum distance between the orthographic projection of the side of the blocking portion 142 close to the supporting portion 141 on the substrate 111 and the orthographic projection of the side of the supporting portion 141 close to the blocking portion 142 on the substrate 111 at one end of the isolation portion 1401 close to the first gap 920 .

[0134] The second undercut length W32 is the minimum distance between the orthographic projection of the side of the blocking portion 142 close to the supporting portion 141 on the substrate 111 and the orthographic projection of the side of the supporting portion 141 close to the blocking portion 142 on the substrate 111 at one end of the isolation portion 1401 close to the isolation opening 910.

[0135] Optionally, the first undercut length W31 may be 0. That is, the side of the isolation portion 1401 close to the first gap 920 may not have an undercut structure.

[0136] See also Fig.13 This embodiment also provides a method for manufacturing a display panel, which may include the following steps.

[0137] Step S110 , providing a substrate 110 .

[0138] Step S120 , disposing an isolation structure layer 140 on one side of the substrate 110 .

[0139] In step S130 , the isolation structure layer 140 is etched to form a plurality of isolation openings 910 .

[0140] Wherein, before step S130 or after step S130, step S140 may be further included.

[0141] Step S140 , etching the isolation structure layer 140 to form a wiring portion 1402 .

[0142] Among them, a plurality of isolation parts 1401 are arranged at intervals, the wiring part 1402 is located between adjacent isolation parts 1401, and a first gap 920 is provided between the wiring part 1402 and the isolation part 1401. Towards the first gap 920, the orthographic projection of the side of the isolation structure layer 140 away from the substrate 110 on the substrate 110 is located within the orthographic projection of the side of the isolation structure layer 140 close to the substrate 110 on the substrate 110.

[0143] That is, in this embodiment, the isolation opening 910 and the wiring portion 1402 can be etched separately in different etching steps. In this way, when etching the isolation opening 910, the isolation structure layer 140 can form an undercut structure, and when etching the wiring portion 1402, no undercut structure can be formed on both sides of the first gap 920. In this way, when etching is performed after the light-emitting material layer 1500 and the electrode material layer 1600 are evaporated, the light-emitting material layer 1500 and the electrode material layer 1600 in the first gap 920 can be better removed to avoid short circuit between the isolation portion 1401 and the wiring portion 1402.

[0144] In some possible implementations, the isolation structure layer 140 includes a first sublayer and a second sublayer, and the first sublayer is located on a side of the second sublayer away from the substrate 110. Under the same etching conditions, the etching resistance of the first sublayer may be higher than that of the second sublayer.

[0145] In step S130, a first sub-opening may be formed on the first sub-layer in a first etching operation. For example, the first opening may be etched on the first sub-layer by dry etching. Optionally, at least a portion of the second sub-layer corresponding to the position of the first opening may also be etched away during this process.

[0146] Then, in the second etching operation, a second sub-opening is formed on the second sub-layer, and the first sub-opening and the second sub-opening are connected to form an isolation opening 910. For example, the second sub-layer is etched by wet etching to form the second opening. In this process, the second sub-layer can be further side-etched by wet etching, so that the second sub-layer is retracted compared to the first sub-layer to form an undercut structure.

[0147] In step S140, the first sub-layer and the second sub-layer can be etched in one etching operation to form a first gap 920 between the isolation portion 1401 and the routing portion 1402. In this way, the first sub-layer and the second sub-layer are etched in one etching operation to form the first gap 920, so that no undercut structure is formed on both sides of the first gap 920.

[0148] In some possible implementations, after step S130 and step S140, the light-emitting layer 150 and the second electrode 160 of the light-emitting device 801 may be formed in the isolation opening 910. In this case, since there is no undercut structure on both sides of the first gap 920, when etching is performed after the light-emitting material layer 1500 and the electrode material layer 1600 are evaporated, the light-emitting material layer 1500 and the electrode material layer 1600 in the first gap 920 can be better removed to avoid short circuit between the isolation portion 1401 and the routing portion 1402.

[0149] In some other possible implementations, step S130 may be performed first to form at least a portion of the isolation opening 910, and then the light-emitting layer 150 and the second electrode 160 of the partial light-emitting device 801 located in the isolation opening 910 are formed, and then step S140 is performed to form the routing portion 1402, and then another at least partial isolation opening 910 is formed, and then the light-emitting layer 150 and the second electrode 160 of another at least partial light-emitting device 801 are formed.

[0150] See also Fig.14 This embodiment also provides a method for manufacturing a display panel, which may include the following steps.

[0151] Step S210 , providing a substrate 110 .

[0152] In step S220 , an isolation structure layer 140 is disposed on one side of the substrate 110 .

[0153] In step S230 , the isolation structure layer 140 is etched to form a plurality of isolation openings 910 .

[0154] Step S240 , forming the light emitting layer 150 and the second electrode 160 of the light emitting device 801 in the isolation opening 910 .

[0155] Step S250 , etching the isolation structure layer 140 to form an isolation portion 1401 and a routing portion 1402 .

[0156] The orthographic projection of the isolation portion 1401 on the substrate 110 surrounds the orthographic projection of the isolation opening 910 on the substrate 110 , the isolation portions 1401 are arranged at intervals, the routing portions 1402 are located between adjacent isolation portions 1401 , and a first gap 920 is provided between the routing portions 1402 and the isolation portions 1401 .

[0157] That is, in this embodiment, the first gap 920 can be formed by etching after the light-emitting layer 150 and the second electrode 160 of each light-emitting device 801 are manufactured. In this way, the evaporation of the light-emitting material layer 1500 and the electrode material layer 1600 will not be performed later, so the residue of the light-emitting material layer 1500 and the electrode material layer 1600 will not be formed in the first gap 920, thereby avoiding the short circuit between the isolation part 1401 and the wiring part 1402.

[0158] The present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel manufactured by the method for manufacturing a display panel provided in the present application. The electronic device may include a mobile phone, a tablet computer, a smart wearable device, a television, a laptop computer, a monitor, and other devices with a display function.

[0159] To sum up, the display panel, the manufacturing method of the display panel and the electronic device provided by the present application have no undercut structures on both sides of the first gap between the isolation part and the wiring part. In this way, the risk of the electrode material layer remaining between the isolation part and the wiring part during the subsequent light-emitting device manufacturing process can be reduced, thereby avoiding short circuit between the isolation part and the wiring part.

[0160] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0161] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; An isolation structure layer located on one side of the substrate, the isolation structure layer includes an isolation portion and a wiring portion, the isolation portion encloses an isolation opening, at least part of the isolation portions are arranged at intervals, the wiring portion is located between adjacent isolation portions, and a first gap is provided between the wiring portion and the isolation portion; Wherein, toward the first gap, the orthographic projection of a side of the isolation structure layer away from the substrate on the substrate does not exceed the orthographic projection of a side of the isolation structure layer close to the substrate on the substrate.

2. The display panel according to claim 1, characterized in that: The wiring portion is electrically connected to the touch detection circuit; Preferably, the isolation portion is electrically connected to a common voltage providing circuit; Preferably, the isolation portion is insulated from the routing portion.

3. The display panel according to claim 1, characterized in that: The width of the first gap ranges from 3 micrometers to 6 micrometers.

4. The display panel according to claim 1, characterized in that: The display panel further includes a pixel defining layer located between the isolation structure layer and the substrate, the pixel defining layer includes a pixel opening, the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate, and the first gap exposes the pixel defining layer.

5. The display panel according to claim 1, characterized in that: At a position facing the isolation opening, an orthographic projection of a side of the isolation portion close to the substrate on the substrate is within an orthographic projection of a side of the isolation structure layer away from the substrate on the substrate.

6. The display panel according to claim 1, characterized in that: Towards the first gap, the orthographic projection of the side of the routing portion away from the substrate on the substrate does not exceed the orthographic projection of the side of the routing portion close to the substrate on the substrate, and the orthographic projection of the side of the isolation portion away from the substrate on the substrate does not exceed the orthographic projection of the side of the isolation portion close to the substrate on the substrate.

7. The display panel according to claim 1, characterized in that: The routing portion includes a first routing segment extending along a first direction and a second routing segment extending along a second direction; the first routing segment is disconnected at an intersection with the second routing segment, and the disconnected portion of the first routing segment is connected by a first bridge line, and the first bridge line and the isolation structure layer are not arranged on the same layer.

8. The display panel according to claim 7, characterized in that: At least some of the adjacent isolation parts are connected to each other through a second bridge line, and the second bridge line and the routing part are not arranged on the same layer.

9. The display panel according to claim 4, characterized in that: The display panel further comprises a light emitting device, at least a portion of which is located within the isolation opening; Preferably, the display panel further comprises a packaging unit, wherein the packaging unit is located on a side of the light-emitting device away from the substrate, at least a portion of the packaging unit is located within the isolation opening, and at least a portion of the packaging unit extends along the isolation portion toward a side wall of the isolation opening to a side of the isolation portion away from the substrate.

10. The display panel according to claim 9, characterized in that: The light emitting device includes a first electrode, a light emitting material layer, and a second electrode stacked in a direction away from the substrate, wherein the second electrode is electrically connected to the isolation portion.

11. The display panel according to claim 10, characterized in that: The display panel further comprises a first encapsulation layer and a second encapsulation layer located on a side of the encapsulation unit and the isolation portion away from the substrate; Preferably, the materials of the encapsulation unit and the second encapsulation layer include inorganic materials; the material of the first encapsulation layer includes organic materials; Preferably, the first encapsulation layer extends into the first gap and contacts the pixel defining layer.

12. The display panel according to claim 1, characterized in that: The isolation portion comprises a supporting portion and a shielding portion located at a side of the supporting portion away from the substrate, wherein an orthographic projection of one end of the supporting portion facing the isolation opening on the substrate is located within an orthographic projection of one end of the shielding portion facing the isolation opening on the substrate; Preferably, the etching resistance of the supporting portion is weaker than that of the shielding portion; Preferably, the material of the supporting portion includes aluminum, and / or the material of the shielding portion includes titanium.

13. The display panel according to claim 12, characterized in that: The isolation portion further includes a receiving portion located between the support portion and the substrate; Preferably, the orthographic projection of one end of the receiving portion facing the isolation opening on the substrate is located within the orthographic projection of one end of the shielding portion facing the isolation opening on the substrate; Preferably, the material of the receiving portion includes molybdenum.

14. A display panel, characterized in that: The display panel comprises: substrate; An isolation structure layer located on one side of the substrate, the isolation structure layer includes an isolation portion and a routing portion, the isolation portion encloses an isolation opening, at least a portion of the isolation portions are arranged at intervals, and the routing portion is located between adjacent isolation portions; The isolation structure layer includes a supporting portion and a shielding portion stacked in a direction away from the substrate; The minimum undercut length of the routing portion is less than or equal to the minimum undercut length of the isolation portion; The minimum undercut length of the routing portion is the minimum distance between the orthographic projection of the side of the shielding portion close to the supporting portion on the substrate and the orthographic projection of the side of the supporting portion close to the shielding portion on the substrate in the routing portion; The minimum undercut length of the isolation portion is the minimum distance between a side of the shielding portion close to the orthographic projection of the support portion on the substrate and a side of the support portion close to the shielding portion on the substrate in the isolation portion.

15. The display panel according to claim 14, characterized in that: The minimum undercut length of the routing portion is 0; Preferably, an orthographic projection of the shielding portion of the routing portion on the substrate is located within an orthographic projection of the supporting portion of the routing portion on the substrate.

16. The display panel according to claim 14, characterized in that: A first undercut length of the isolation portion close to the first gap is smaller than a second undercut length of the isolation portion close to the isolation opening; The first undercut length is the minimum distance between the orthographic projection of the side of the shielding portion close to the supporting portion on the substrate and the orthographic projection of the side of the supporting portion close to the shielding portion on the substrate at one end of the isolation portion close to the first gap; The second undercut length is the minimum distance between the orthographic projection of the side of the shielding portion close to the supporting portion on the substrate and the orthographic projection of the side of the supporting portion close to the shielding portion on the substrate at one end of the isolation portion close to the isolation opening; Preferably, the first undercut length is zero.

17. A method for manufacturing a display panel, characterized in that: The method comprises: providing a substrate; Disposing an isolation structure layer on one side of the substrate; Etching the isolation structure layer to form a plurality of isolation openings; Wherein, before or after the step of etching the isolation structure layer to form a plurality of isolation openings, the method further comprises: The isolation structure layer is etched to form an isolation portion and a routing portion; a plurality of the isolation portions are arranged at intervals, the routing portion is located between adjacent isolation portions, and a first gap is provided between the routing portion and the isolation portion; toward the first gap, an orthographic projection of a side of the isolation structure layer away from the substrate on the substrate is located within an orthographic projection of a side of the isolation structure layer close to the substrate on the substrate.

18. The method according to claim 17, characterized in that The isolation structure layer includes a first sublayer and a second sublayer, and the first sublayer is located on a side of the second sublayer away from the substrate; the step of etching the isolation structure layer to form a plurality of isolation openings includes: forming a first sub-opening on the first sub-layer in a first etching operation; In a second etching operation, a second sub-opening is formed on the second sub-layer, and the first sub-opening and the second sub-opening are connected to form the isolation opening; The step of etching the isolation structure layer to form a wiring portion includes: The first sub-layer and the second sub-layer are etched in one etching operation to form the first gap between the isolation portion and the routing portion.

19. A method for manufacturing a display panel, characterized in that: The method comprises: providing a substrate; Disposing an isolation structure layer on one side of the substrate; Etching the isolation structure layer to form a plurality of isolation openings; forming a light-emitting layer and a second electrode of the light-emitting device in the isolation opening; The isolation structure layer is etched to form an isolation portion and a routing portion, wherein the orthographic projection of the isolation portion on the substrate surrounds the orthographic projection of the isolation opening on the substrate, the isolation portions are arranged at intervals, the routing portion is located between adjacent isolation portions, and a first gap is provided between the routing portion and the isolation portion.

20. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 11, or the electronic device comprises a display panel manufactured by the method for manufacturing a display panel according to any one of claims 12 to 14.

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