Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display. In the display panel, a protection layer is arranged on a pixel defining layer in a part of an isolation opening, the pixel defining layer below the protection layer can be protected from being damaged by etching through the protection layer, then the situation that the display effect of the display panel is affected due to poor manufacturing process caused by damage of the pixel defining layer is avoided, the manufacturing process yield of the display panel can be improved through the design, and the display effect of the display panel is improved. And the display effect of the display panel is ensured.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for preparing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) is considered to be the next generation display technology after liquid crystal display technology. It is widely used in various consumer electronic products such as smart phones, TVs, laptops, desktop computers, car displays, wearable devices, etc. due to its excellent color and picture quality, and has become the mainstream technology in display panels.

[0003] However, the process performance of current OLED display products needs to be further improved. Summary of the invention

[0004] In order to overcome the technical problems mentioned in the above technical background, the present application provides a display panel, a method for preparing a display panel, and an electronic device.

[0005] In a first aspect of the present application, a display panel is provided, the display panel comprising:

[0006] substrate;

[0007] A pixel defining layer, located on one side of the substrate, wherein the pixel defining layer defines a pixel opening on the substrate;

[0008] An isolation structure, located at a side of the pixel defining layer away from the substrate, the isolation structure encloses an isolation opening, and the isolation opening is connected to the pixel opening;

[0009] The protection layer is located on at least a portion of the pixel defining layer in the isolation opening, and the orthographic projection of the protection layer on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

[0010] In a possible implementation of the present application, in a direction away from the substrate, the isolation structure includes a first isolation portion and a second isolation portion stacked in sequence, and the second isolation portion includes a protruding portion extending relative to the first isolation portion toward a direction corresponding to the isolation opening;

[0011] The orthographic projection of the protective layer on the substrate at least partially overlaps with the orthographic projection of the protruding portion on the substrate;

[0012] Preferably, a distance between an orthographic projection contour line of a side of the protective layer facing the corresponding pixel opening on the substrate and an orthographic projection contour line of the protruding portion facing the corresponding isolation opening is greater than or equal to 0;

[0013] Preferably, a minimum distance between an orthographic projection of the protection layer on the substrate and an orthographic projection of the first isolation portion on the substrate is greater than or equal to 0.

[0014] In a possible implementation of the present application, in a direction perpendicular to the plane where the substrate is located, the thickness of the protective layer is not greater than 200 angstroms;

[0015] Preferably, the material of the protective layer is a dry etching resistant material;

[0016] Preferably, the material of the protective layer includes an inorganic material resistant to dry etching or an organic material resistant to dry etching;

[0017] Preferably, a material of the protection layer is the same as or different from a material of the pixel defining layer.

[0018] In a possible implementation of the present application, the display panel further includes a light emitting device;

[0019] At least part of the light emitting device is located in the isolation opening;

[0020] In a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer and a second electrode which are stacked in sequence, the first electrode is located on a side of the pixel defining layer close to the substrate, the pixel opening exposes at least a portion of the first electrode, and the second electrode overlaps the isolation structure;

[0021] Preferably, the second electrode at least covers at least a portion of the protection layer, and the second electrode overlaps a side of the isolation structure facing the corresponding isolation opening.

[0022] In a possible implementation of the present application, the isolation opening includes a first isolation opening and a second isolation opening, the light-emitting device includes a first light-emitting device and a second light-emitting device of different light-emitting colors, at least part of the first light-emitting device is located in the first isolation opening, and at least part of the second light-emitting device is located in the second isolation opening;

[0023] The protection layer is at least disposed on the pixel defining layer of the second isolation opening;

[0024] Preferably, the protection layer comprises a first protection layer, and the first protection layer is disposed on the pixel defining layer in the second isolation opening.

[0025] In a possible implementation manner of the present application, the isolation opening further includes a third isolation opening, the light-emitting device further includes a third light-emitting device having a light-emitting color different from that of the first light-emitting device and the second light-emitting device, and at least part of the third light-emitting device is located in the third isolation opening;

[0026] The protective layer includes a second protective layer, and the second protective layer is disposed on the pixel defining layer in the third isolation opening;

[0027] Preferably, the first protective layer and the second protective layer are made of the same material, and the first protective layer and the second protective layer are arranged in the same layer.

[0028] In a possible implementation of the present application, in a direction perpendicular to the plane where the substrate is located, the thickness of the first protective layer is equal to or unequal to the thickness of the second protective layer.

[0029] In a possible implementation of the present application, the isolation structure further includes a third isolation portion, and in a direction away from the substrate, the third isolation portion, the first isolation portion, and the second isolation portion are stacked in sequence, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the third isolation portion on the substrate;

[0030] The protective layer is disposed on the pixel defining layer close to the third isolation portion, and a minimum distance between an orthographic projection of the protective layer on the substrate and an orthographic projection of the third isolation portion on the substrate is greater than or equal to 0;

[0031] Preferably, the material of the first isolation portion includes aluminum, silver or copper, the material of the second isolation portion includes molybdenum or titanium, and the material of the third isolation portion includes titanium or molybdenum.

[0032] In a second aspect of the present application, a method for preparing a display panel is further provided, the method comprising:

[0033] providing a substrate;

[0034] A pixel defining layer, a protective layer and an isolation structure are manufactured on the substrate, so that the pixel defining layer defines a pixel opening on the substrate, the isolation structure is located on a side of the pixel defining layer away from the substrate, the isolation structure encloses and forms an isolation opening, the isolation opening is connected to the pixel opening, the protective layer is located on at least a portion of the pixel defining layer in the isolation opening, and the orthographic projection of the protective layer on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

[0035] In a possible implementation of the present application, the step of manufacturing a pixel defining layer, a protective layer and an isolation structure on the substrate includes:

[0036] forming a pixel defining material layer on the substrate;

[0037] Making a protective material layer on a side of the pixel defining material layer away from the substrate, and patterning the protective material layer to form the protective layer;

[0038] Forming an isolation structure material layer on a side of the pixel defining material layer and the protective layer away from the substrate, and patterning the isolation structure material layer to form an isolation structure and an isolation opening;

[0039] The pixel defining material layer exposed at the isolation opening is patterned to form a pixel defining layer including the pixel opening.

[0040] In a possible implementation of the present application, the step of forming a protective material layer on a side of the pixel defining material layer away from the substrate, and patterning the protective material layer to form the protective layer includes:

[0041] Making a protective material layer on a side of the pixel defining material layer away from the substrate;

[0042] Performing different degrees of thinning treatment on different regions of the protective material layer away from the substrate to obtain the protective layer;

[0043] Preferably, the step of performing different degrees of thinning on different regions of the protective material layer away from the substrate to obtain the protective layer comprises:

[0044] Coating a photoresist layer on the side of the protective material layer away from the substrate;

[0045] Exposing and developing the photoresist layer through a half-tone mask to form an etching window on the photoresist layer, wherein the half-tone mask includes a full light-transmitting opening and a semi-light-transmitting opening;

[0046] The protective material layer is thinned through the etching window to obtain the protective layer, wherein the semi-transparent opening corresponds to the protective layer.

[0047] In a possible implementation of the present application, the semi-transparent opening includes a first semi-transparent opening and a second semi-transparent opening with different transmittances, and the protective layer includes a first protective layer and a second protective layer with different thicknesses in a direction perpendicular to the plane where the substrate is located, wherein the step of thinning the protective material layer through the etching window to obtain the protective layer includes:

[0048] Thinning the protective material layer through the etching window to obtain the first protective layer and the second protective layer, wherein the first semi-transparent opening corresponds to the first protective layer, and the second semi-transparent opening corresponds to the second protective layer;

[0049] Preferably, the step of forming an isolation structure material layer on a side of the pixel defining material layer and the protective layer away from the substrate, and patterning the isolation structure material layer to form an isolation structure and an isolation opening comprises:

[0050] An isolation structure material layer is formed on the side of the pixel defining material layer and the protective layer away from the substrate, and the isolation structure material layer is patterned to form an isolation structure and an isolation opening, so that the first protective layer and the second protective layer are respectively located in different isolation openings.

[0051] In a possible implementation of the present application, the step of manufacturing a pixel defining layer, a protective layer and an isolation structure on the substrate includes:

[0052] forming a pixel defining material layer on the substrate;

[0053] Making an isolation structure material layer on a side of the pixel defining material layer away from the substrate, and patterning the isolation structure material layer to form an isolation structure and an isolation opening;

[0054] Forming a protective layer in the isolation opening at a position close to the isolation structure;

[0055] The pixel defining material layer exposed at the isolation opening is patterned to form a pixel defining layer including the pixel opening.

[0056] In a possible implementation of the present application, the step of manufacturing a pixel defining layer, a protective layer and an isolation structure on the substrate includes:

[0057] forming a pixel defining material layer on the substrate;

[0058] Performing different degrees of thinning on different regions of the pixel defining material layer away from the substrate to obtain a protective layer that is raised relative to the peripheral region;

[0059] Making an isolation structure material layer on a side of the pixel defining material layer away from the substrate after the thinning process, and patterning the isolation structure material layer to form an isolation structure and an isolation opening;

[0060] The pixel defining material layer exposed at the isolation opening is patterned to form a pixel defining layer including the pixel opening.

[0061] In a possible implementation of the present application, the step of performing different degrees of thinning on different regions of the pixel defining material layer away from the substrate to obtain a protective layer that is raised relative to the peripheral region includes:

[0062] Coating a photoresist layer on a side of the pixel defining material layer away from the substrate;

[0063] Exposing and developing the photoresist layer through a half-tone mask to form an etching window on the photoresist layer, wherein the half-tone mask includes a full light-transmitting opening and a semi-light-transmitting opening;

[0064] The pixel defining material layer is thinned through the etching window to obtain a protective layer protruding relative to the peripheral area, wherein the semi-transparent opening corresponds to the protective layer, and the fully transparent opening corresponds to the peripheral area of ​​the protective layer.

[0065] In a possible implementation of the present application, the semi-transparent opening includes a first semi-transparent opening and a second semi-transparent opening with different transmittances, the protective layer includes a first protective layer and a second protective layer with different thicknesses in a direction perpendicular to the plane where the substrate is located, and the step of thinning the pixel defining material layer through the etching window to obtain a protective layer that is raised relative to the peripheral area includes:

[0066] The pixel defining material layer is thinned through the etching window to obtain a first protective layer and a second protective layer that are raised relative to the peripheral area, wherein the first semi-transparent opening corresponds to the first protective layer, and the second semi-transparent opening corresponds to the second protective layer;

[0067] Preferably, the step of manufacturing an isolation structure material layer on a side of the pixel defining material layer away from the substrate after the thinning process, and patterning the isolation structure material layer to form the isolation structure and the isolation opening comprises:

[0068] An isolation structure material layer is manufactured on the side of the thinned pixel defining material layer away from the substrate, and the isolation structure material layer is patterned to form an isolation structure and an isolation opening, so that the first protection layer and the second protection layer are respectively located in different isolation openings.

[0069] In a third aspect of the present application, an electronic device is provided, comprising a display panel according to any possible implementation of the first aspect, or a display panel prepared according to any possible implementation of the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0071] Figure 1 A schematic diagram illustrating the positional relationship between the isolation structure and the isolation opening provided in this embodiment;

[0072] Figure 2 Example Figure 1 One of the cross-sectional diagrams at the AA position;

[0073] Figure 3 Example Figure 1 The second cross-sectional diagram at the AA position;

[0074] Figure 4 Example Figure 1 The third cross-sectional diagram at the AA position;

[0075] Figure 5 Example Figure 1 The fourth cross-sectional diagram at the AA position;

[0076] Figure 6 A schematic cross-sectional view including two isolated openings is illustrated;

[0077] Figure 7 A schematic cross-sectional view including three isolated openings is illustrated;

[0078] Figure 8 Example Figure 1 The fifth cross-sectional diagram at the AA position;

[0079] Fig. 9 A schematic diagram illustrating a process of a method for preparing a display panel provided in this embodiment;

[0080] Fig.10 Example Fig. 9 The corresponding process flow chart;

[0081] Fig.11a and Fig.11b A possible process diagram corresponding to step S12 is illustrated;

[0082] Fig.12 Another possible process flow chart corresponding to step S12 is illustrated;

[0083] Fig.13 A schematic diagram of a process for implementing step S12 is illustrated;

[0084] Fig.14 Example Fig.13 The corresponding process flow chart;

[0085] Fig.15 Example Fig.13 Schematic diagram of the process of step S122.

[0086] Icons: 1-display panel; 11-substrate; 12-pixel defining layer; 1201-pixel opening; 13-isolation structure; 1301-isolation opening; 131-first isolation portion; 132-second isolation portion; 133-third isolation portion; 1321-extending portion; 14-protective layer; 141-first protective layer; 142-second protective layer; 15-light-emitting device; 151-first electrode; 152-light-emitting material layer; 153-second electrode; 161-first encapsulation layer; 1611-encapsulation unit; 162-second encapsulation layer; 163-third encapsulation layer; 20-pixel defining material layer; 30-protective material layer; 40-isolation structure material layer; 50-photoresist layer; 60-half-tone mask; 610-fully light-transmitting opening; 620-semi-light-transmitting opening. DETAILED DESCRIPTION

[0087] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0088] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0089] Improving the density of light-emitting devices in a display panel (i.e., pixel density) is an important way to improve the display effect. However, the display panels currently made using the fine metal evaporation mask (FMM) technology are unable to further increase the density of light-emitting devices due to technical limitations. After long-term research, the inventors found that in order to solve the technical problem that the density of light-emitting devices cannot be further increased, an isolation structure is set in some display panels. When the light-emitting material layer and the electrode are evaporated in the entire layer, the light-emitting material layer and the electrode can be disconnected at the position of the isolation structure. Through multiple evaporation and multiple etching processes, light-emitting devices of different colors can be formed in different isolation openings. The above process is also called light-emitting device patterning.

[0090] Patent CN118251982A, Patent 202410864269.8, Patent PCT / CN2024 / 098407, Patent PCT / CN2024 / 102783, Patent PCT / CN2024 / 098217, PCT / CN2024 / 099419, Patent PCT / CN2024 / 099072, Patent CN117979755A, Patent CN117998900A, Patent CN 117062489A, patent CN117580403A, patent CN116583155A, patent CN116669477A, ​​patent CN117396039A, patent CN116669480A, patent CN116600606A and patent CN117500332A record related technical solutions of isolation structure (or partition structure or isolation column) and encapsulation layer, and their contents are incorporated into this application by reference for reference.

[0091] In the above-mentioned display panel, during the process of patterning the light-emitting device, the pixel defining layer in the isolation opening may be damaged, resulting in the inability of the evaporated electrode to be continuously distributed or short-circuited with the electrode under the pixel defining layer, thereby causing process defects and causing the manufactured light-emitting device to be unable to emit light normally, affecting the display effect of the display panel.

[0092] In order to solve the above problems, the inventor innovatively designed the following technical solution, and the specific implementation scheme of the present application will be described in detail below in conjunction with the accompanying drawings. It should be noted that the defects existing in the above solutions in the prior art are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above technical problems and the solutions proposed in this embodiment below for the above problems should all be the contributions made by the inventor to the present application in the process of invention and creation, and should not be understood as the technical content known to those skilled in the art.

[0093] Please refer to Figure 1 and Figure 2 , Figure 1 The schematic diagram of the positional relationship between the isolation structure and the isolation opening is illustrated. Figure 2 Example Figure 1Schematic cross-sectional view at position AA in FIG. In the present embodiment, the display panel 1 includes a substrate 11, a pixel defining layer 12, an isolation structure 13 and a protective layer 14. The pixel defining layer 12 is located on one side of the substrate 11 and defines a pixel opening 1201 on the substrate 11. The isolation structure 13 is located on the side of the pixel defining layer 12 away from the substrate 11. The isolation structure 13 encloses and forms an isolation opening 1301. The isolation opening 1301 is connected to the pixel opening 1201. Exemplarily, the orthographic projection of the pixel opening 1201 on the substrate 11 is located within the orthographic projection of the isolation opening 1301 on the substrate 11, that is, there is a pixel defining layer 12 for defining the pixel opening 1201 in the isolation opening 1301, and the orthographic projection of the pixel defining layer 12 on the substrate 11 at least partially overlaps with the orthographic projection of the isolation opening 1301 on the substrate 11.

[0094] At the position of the pixel defining layer 12 near the isolation structure 13, the obstruction of the isolation structure 13 will cause the thickness of the evaporated film layer at this position to be thinner. In the process of patterning the light-emitting device, the evaporated film layer in the isolation opening 1301 of the light-emitting device made later (the evaporated film layer of the light-emitting device made first) needs to be removed first, and then the film layer of the corresponding light-emitting device is evaporated in the isolation opening 1301. In the process of removing the evaporated film layer, the evaporated film layer in the isolation opening 1301 near the isolation structure 13 is thin and is easily over-etched, thereby damaging the pixel defining layer 12 below, making it impossible for the subsequent evaporated electrodes to be continuously distributed or short-circuited with the electrodes below the pixel defining layer 12, resulting in the light-emitting device 13 being unable to display, affecting the display effect of the display panel 1. To this end, in the present embodiment, the protective layer 14 is located on the pixel defining layer 12 in at least part of the isolation opening 1301, and the orthographic projection of the protective layer 14 on the substrate 11 at least partially overlaps with the orthographic projection of the isolation structure 13 on the substrate 11, that is, the protective layer 14 is arranged at a position where the pixel defining layer 12 in the isolation opening 1301 is close to the isolation structure 13 (the area where the film thickness of the evaporated film layer is thinner).

[0095] In the above structure, a protective layer 14 is provided on the pixel defining layer 12 at a position where the thickness of the evaporated film layer is thinner in the isolation opening 1301, and the pixel defining layer thereunder is protected from being damaged by etching by the protective layer 14, thereby avoiding poor process caused by damage to the pixel defining layer 14 and affecting the display effect of the display panel. The above design can improve the process yield of the display panel 1 and ensure the display effect of the display panel 1.

[0096] In this embodiment, in order to make the entire surface of the evaporated film layer be isolated by the isolation structure 13, the cross section of the isolation structure 13 can be an undercut structure. For example, Figure 3As shown, in the direction away from the substrate 11 (Z direction in the figure), the isolation structure 13 includes a first isolation part 131 and a second isolation part 132 which are stacked in sequence, the orthographic projection of the first isolation part 131 on the substrate 11 is located within the orthographic projection of the second isolation part 132 on the substrate 11, and the second isolation part 132 includes an extension part 1321 extending toward the corresponding isolation opening 1301 relative to the first isolation part 131, and the cross section of the isolation structure 13 can be T-shaped on the cross section perpendicular to the plane where the substrate 11 is located and passing through the center of the isolation opening 1301. It is precisely because of the existence of the extension part 1321 that when the film layer is evaporated on the entire surface, due to the obstruction of the extension part 1321, the film thickness below the extension part 1321 (the area of ​​the pixel defining layer 12 close to the first isolation part 131) will be relatively thin, and in the subsequent patterning process of the light-emitting device, the pixel defining layer 12 at this position is easily etched and damaged. To this end, in this embodiment, the protective layer 14 may be disposed at least on the pixel defining layer 12 below the protruding portion 1321. Specifically, the orthographic projection of the protective layer 14 on the substrate 11 at least partially overlaps with the orthographic projection of the protruding portion 1321 on the substrate 11. Figure 3 As shown, the distance between the orthographic projection contour line of the side of the protective layer 14 toward the corresponding pixel opening 1201 on the substrate 11 and the orthographic projection contour line of the extension portion 1321 toward the corresponding isolation opening 1301 (i.e., the distance d1 in the figure) is greater than or equal to 0, that is, the orthographic projection of the side of the protective layer 14 toward the corresponding pixel opening 1201 on the substrate 11 is located outside the orthographic projection of the extension portion 1321 on the substrate 11.

[0097] In this embodiment, if Figure 3 As shown, the minimum distance d2 between the orthographic projection of the protective layer 14 on the substrate 11 and the orthographic projection of the first isolation portion 131 on the substrate 11 is greater than or equal to 0, that is, the orthographic projection of the protective layer 14 on the substrate 11 is located outside the orthographic projection of the first isolation portion 131 on the substrate 11. Such a design can avoid affecting the effective overlapping area between the vapor-deposited electrode and the first isolation portion 131 when the protective layer 14 overlaps with part of the first isolation portion 131, and can ensure that the overlapping effect of the vapor-deposited electrode and the first isolation portion 131 will not be affected by the reduction of the effective overlapping area.

[0098] In a possible implementation of this embodiment, please refer to Figure 4, the isolation structure 13 also includes a third isolation portion 133. In the direction away from the substrate 11, the third isolation portion 133, the first isolation portion 131 and the second isolation portion 132 are stacked in sequence. Among them, the orthographic projection of the first isolation portion 131 on the substrate 11 can be located within the orthographic projection of the third isolation portion 133 on the substrate 11. In the partial isolation opening 1301, the protective layer 14 is arranged on the pixel defining layer 12 near the third isolation portion 133, and the orthographic projection of the protective layer 14 on the substrate 11 does not overlap with the orthographic projection of the third isolation portion 133 on the substrate 11, that is, the minimum distance d3 between the orthographic projection of the protective layer 14 on the substrate 11 and the orthographic projection of the third isolation portion 133 on the substrate 11 is greater than or equal to 0. With such a design, it can be avoided that the protective layer 14 overlaps with at least part of the third isolation portion 133 to affect the effective overlapping area between the evaporation electrode and the third isolation portion 133, and it can be ensured that the overlapping effect between the evaporation electrode and the third isolation portion 133 will not be affected due to the reduction of the effective overlapping area.

[0099] In order to ensure that the evaporated electrodes can be continuously distributed and overlapped with the isolation structure 13, the thickness of the protective layer 14 should not be too high. In this embodiment, please refer to Figure 4 , in a direction perpendicular to the plane of the substrate 11 (Z direction in the figure), the thickness d of the protective layer 14 is not greater than 200 angstroms. Exemplarily, the thickness d of the protective layer 14 includes 10 angstroms, 20 angstroms, 45 angstroms, 67 angstroms, 84 angstroms, 105 angstroms, 134 angstroms, 154 angstroms, 175 angstroms, 186 angstroms or 200 angstroms, etc.

[0100] The inventors further discovered that the etching gas used in the dry etching process during the patterning of the light-emitting device is what etches and damages the pixel defining layer 13. For this reason, in this embodiment, the material of the protective layer 14 may include a dry etching resistant material. Specifically, the material of the protective layer 14 includes an inorganic material resistant to dry etching or an organic material resistant to dry etching. In some implementations of this embodiment, the protective layer 14 may be made of an insulating material. In other implementations of this embodiment, the protective layer 14 may also be made of a conductive material. For example, the protective layer 14 is made of ITO (indium tin oxide).

[0101] In this embodiment, the pixel defining layer 12 can be an organic pixel defining layer or an inorganic pixel defining layer. Preferably, the pixel defining layer 12 is an inorganic pixel defining layer. When the pixel defining layer 12 is an inorganic pixel defining layer, the pixel defining layer 12 can be a single-layer structure of silicon oxide (SiOx) or silicon nitride (SiNx), or a stacked structure formed alternately of silicon oxide and silicon nitride. The material of the protective layer 14 can be the same as that of the pixel defining layer 12, or it can be different. When the material of the protective layer 14 is the same as that of the pixel defining layer 12, the protective layer 14 and the pixel defining layer 12 can be made of the same film layer.

[0102] For further information, please refer to Figure 5 In this embodiment, the display panel 1 further includes a light emitting device 15, and at least part of the light emitting device 15 is located in the isolation opening 1301. The light emitting device 15 includes a first electrode 151, a light emitting material layer 152 and a second electrode 153. In the direction away from the substrate 11, the first electrode 151, the light emitting material layer 152 and the second electrode 153 are stacked in sequence. At least part of the first electrode 151 is exposed from the position of the pixel opening 1201, the first electrode 151 is connected to the pixel circuit in the substrate 11, and the second electrode 153 covers at least part of the protective layer 14. The second electrode 153 overlaps with the isolation structure 13 through the protective layer 14 toward the side corresponding to the isolation opening 1301. Exemplarily, the second electrode 153 can overlap with the first isolation portion 131. Exemplarily, the first electrode 151 can be the anode of the light emitting device 15, and the second electrode 153 can be the cathode of the light emitting device 15.

[0103] In this embodiment, the isolation structure 13 can enclose a plurality of isolation openings 1301. The setting of the isolation structure 13 can form film layers of light-emitting devices of different colors in different isolation openings 1301 without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel. The isolation structure 13 can isolate the light-emitting material layer 152 and the second electrode 153 in the light-emitting device 15, so that different light-emitting devices 15 are independent of each other, so as to improve the crosstalk between adjacent light-emitting devices 15 and enhance the display effect. Adjacent light-emitting devices 15 can be independently packaged to improve the packaging yield. At the same time, due to the existence of the isolation structure 13, the light-emitting material layer 152 and the second electrode 153 in the light-emitting device 15 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the fine metal mask to save the manufacturing cost of the display panel.

[0104] Please refer to Figure 6In this embodiment, the isolation opening 1301 includes a first isolation opening 1301a and a second isolation opening 1301b, and the light-emitting device 15 includes a first light-emitting device 15a and a second light-emitting device 15b of different light-emitting colors. At least part of the first light-emitting device 15a is located in the first isolation opening 1301a, and at least part of the second light-emitting device 15b is located in the second isolation opening 1301b. In this case, the first light-emitting device 15a and the second light-emitting device 15b are manufactured in a sequential order. After the film layer of the first light-emitting device 15a is evaporated on the entire surface, it is necessary to remove the evaporated film layer in the second isolation opening 1301b first so as to facilitate the subsequent evaporation of the film layer of the second light-emitting device 15b in the second isolation opening 1301b. In this process, the film layer of the first light-emitting device 15a evaporated in the first isolation opening 1301b will be retained, while the second isolation opening 1301b will undergo a process of removing the evaporated film layer, and the pixel definition layer 12 in the second isolation opening 1301b may be damaged by etching. To this end, the protection layer 14 may not be required to be disposed in the first isolation opening 1301 a , that is, the protection layer 14 is at least disposed on the pixel defining layer 12 in the second isolation opening 1301 b .

[0105] Exemplarily, the protection layer 14 includes a first protection layer 141 , and the first protection layer 141 is disposed on the pixel defining layer 12 in the second isolation opening 1301 b .

[0106] For further information, please refer to Figure 7 , the isolation opening 1301 further includes a third isolation opening 1301c, the light emitting device 15 further includes a third light emitting device 15c, the light emitting color of the third light emitting device 15c is different from the light emitting color of the first light emitting device 15a and the second light emitting device 15b, and at least part of the third light emitting device 15c is located in the third isolation opening 1301c. In this case, the first light emitting device 15a, the second light emitting device 15b and the third light emitting device 15c are manufactured in sequence. Based on the same manufacturing process as described above, it can be known that before manufacturing the film layer of the second light emitting device 15b in the second isolation opening 1301b, the film layer of the first light emitting device 15a manufactured in the second isolation opening 1301b needs to be removed, that is, the film layer needs to be etched and removed once; similarly, before manufacturing the film layer of the third light emitting device 15c in the third isolation opening 1301c, the film layer of the first light emitting device 15a manufactured in the third isolation opening 1301c needs to be etched and removed twice. In this embodiment, the protection layer 14 further includes a second protection layer 142 . The second protection layer 142 is disposed on the pixel defining layer 12 in the third isolation opening 1301 c .

[0107] In this embodiment, the first protective layer 141 and the second protective layer 142 are made of the same material and are disposed in the same layer, that is, the first protective layer 141 and the second protective layer 142 can be simultaneously manufactured in the same process.

[0108] In the direction perpendicular to the plane where the substrate 11 is located, the thickness of the first protective layer 141 and the thickness of the second protective layer 142 may be equal or unequal. In the process of manufacturing the light-emitting device 15, the second isolation opening 1301b will undergo a process of etching to remove the evaporated film layer, and the third isolation opening 1301c will undergo two processes of etching to remove the evaporated film layer. If the thickness of the protective layer set in the second isolation opening 1301b and the third isolation opening 1301c is the same before manufacturing the light-emitting device 15, then after the light-emitting device 15 is manufactured, the thickness of the first protective layer 141 will be greater than the thickness of the second protective layer 142; if the thickness of the first protective layer 141 set in the second isolation opening 1301b is less than the thickness of the second protective layer 142 set in the third isolation opening 1301c before manufacturing the light-emitting device 15, then after the light-emitting device 15 is manufactured, the thickness of the first protective layer 141 may be less than, equal to, or greater than the thickness of the second protective layer 142.

[0109] Please refer to Figure 8 The display panel 1 further includes a first encapsulation layer 161, which includes a plurality of encapsulation units 1611, and different encapsulation units 1611 are used to encapsulate light-emitting devices 15 in different isolation openings 1301. Exemplarily, two adjacent encapsulation units 1611 for encapsulating light-emitting devices 15 of different colors are disconnected on the side of the isolation structure 13 away from the substrate 11, and there is a gap between the encapsulation units 1611 located on the side of the isolation structure 13 away from the substrate 11 and the isolation structure 13; two adjacent encapsulation units 1611 for encapsulating light-emitting devices of the same color are connected to each other on the side of the isolation structure 13 away from the substrate 11.

[0110] Further, please refer again to Figure 8 The display panel 1 further includes a second encapsulation layer 162, which is located on a side of the encapsulation unit 1611 away from the substrate 11, and the second encapsulation layer 162 at least covers the encapsulation unit 1611. The second encapsulation layer 162 also fills the gap between the encapsulation unit 1611 and the isolation structure 13, and the second encapsulation layer 162 has a flat surface on a side away from the substrate 11.

[0111] Further, please refer again to Figure 8 The display panel 1 further includes a third encapsulation layer 163 , and the third encapsulation layer 163 is located on a side of the second encapsulation layer 162 away from the substrate 11 .

[0112] Optionally, the first encapsulation layer 161 and the third encapsulation layer 163 are inorganic encapsulation layers, and the second encapsulation layer 162 is an organic encapsulation layer. For example, the first encapsulation layer 161 and the third encapsulation layer 163 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 162 can be formed by inkjet printing (IJP).

[0113] It is understandable that the display panel 1 may also include a touch function layer, an optical adhesive layer, a polarizer, a cover plate and other film layers stacked in sequence on the side of the third packaging layer 163 away from the substrate 11. The above film layers are conventional film layers of the display panel and will not be described in detail here.

[0114] Based on the same inventive concept, this embodiment also provides a method for preparing a display panel, please refer to Fig. 9 and Fig.10 ,in Fig. 9 The schematic diagram of the process of the method for preparing the display panel provided in this embodiment is illustrated. Fig.10 Example Fig. 9 The corresponding process diagram is combined with the following Fig. 9 and Fig.10 The method for manufacturing the display panel provided in this embodiment is described in detail.

[0115] Step S11, providing a substrate 11.

[0116] In this embodiment, the substrate 11 is a multi-layer structure, and the substrate 11 includes at least a plurality of conductive layers and insulating layers between adjacent conductive layers. A pixel circuit for providing a driving signal for the light-emitting device is formed in the substrate 11.

[0117] In step S12 , a pixel definition layer 12 , a protection layer 14 and an isolation structure 13 are formed on the substrate 11 .

[0118] After completing the manufacturing process of this step, the pixel defining layer 12 can define a pixel opening 1201 on the substrate 11, the isolation structure 13 is located on the side of the pixel defining layer 12 away from the substrate 11, the isolation structure 13 encloses and forms an isolation opening 1301, the isolation opening 1301 is connected to the pixel opening 1201, the protective layer 14 is located on at least part of the pixel defining layer 12 in the isolation opening 1301, and the orthographic projection of the protective layer 14 on the substrate 11 at least partially overlaps with the orthographic projection of the isolation structure 13 on the substrate 11.

[0119] The above scheme can form a protective layer 14 on the pixel defining layer 12 at the position where the film thickness of the evaporated film layer is thinner in the isolation opening 1301. The protective layer 14 protects the pixel defining layer below it from being damaged by etching, thereby avoiding poor process caused by damage to the pixel defining layer 14, thereby affecting the display effect of the display panel. The above design can improve the process yield of the display panel 1 and ensure the display effect of the display panel 1.

[0120] In a possible implementation of this embodiment, please refer to Fig.11a and Fig.11b , step S12 can be implemented in the following way.

[0121] First, a pixel definition material layer 20 is formed on the substrate 11 .

[0122] Next, a protective material layer 30 is formed on a side of the pixel defining material layer 20 away from the substrate 11 , and the protective material layer 30 is patterned to form a protective layer 14 .

[0123] In this embodiment, different regions of the protective material layer 30 away from the substrate 11 are thinned to different degrees to obtain the protective layer 14 .

[0124] Specifically, first, a photoresist layer 50 is coated on the side of the protective material layer 30 away from the substrate 11; then, the photoresist layer 50 is exposed and then developed through a half-tone mask 60 to form an etching window on the photoresist layer 50, wherein the half-tone mask 60 includes a fully light-transmitting opening 610 and a semi-light-transmitting opening 620, and the transmittance of the fully light-transmitting opening 610 is greater than the transmittance of the semi-light-transmitting opening 620; finally, the protective material layer 14 is thinned through the etching window to obtain a protective layer 14, wherein the semi-light-transmitting opening 620 corresponds to the protective layer 14.

[0125] Since different isolation openings 1301 undergo different numbers of etching, the thickness of the protective layer 14 disposed on the pixel defining layer 12 in different isolation openings 1301 may be different. Specifically, the semi-transparent opening 620 includes a first semi-transparent opening and a second semi-transparent opening with different transmittances, and the protective layer 14 includes a first protective layer and a second protective layer with different thicknesses in a direction perpendicular to the plane of the substrate 11. Exemplarily, the transmittance of the first semi-transparent opening is less than the transmittance of the second semi-transparent opening, for example, the transmittance of the first semi-transparent opening is 20%-30%, and the transmittance of the second semi-transparent opening is 60%-70%.

[0126] In this embodiment, the protective material layer 30 can be thinned by etching windows to obtain a first protective layer and a second protective layer, wherein the first semi-transparent opening 610 corresponds to the first protective layer, and the second semi-transparent opening 620 corresponds to the second protective layer.

[0127] Then, an isolation structure material layer 40 is formed on the side of the pixel defining material layer 20 and the protection layer 14 away from the substrate 11 , and the isolation structure material layer 40 is patterned to form an isolation structure 13 and an isolation opening 1301 .

[0128] Through the above steps, the first protection layer and the second protection layer are respectively located in different isolation openings 1301 .

[0129] Finally, the pixel defining material layer 20 exposed at the isolation opening 1301 is patterned to form a pixel defining layer 12 including the pixel opening 1201 .

[0130] In this embodiment, since different isolation openings 1301 undergo different etching times, the thickness of the protection layer 14 disposed on the pixel defining layer 12 in different isolation openings 1301 may be different.

[0131] In another possible implementation of this embodiment, please refer to Fig.12 , step S12 can also be implemented in the following way.

[0132] First, a pixel definition material layer 20 is formed on the substrate 11 .

[0133] Next, an isolation structure material layer 40 is formed on a side of the pixel defining material layer 20 away from the substrate 11 , and the isolation structure material layer 40 is patterned to form an isolation structure 13 and an isolation opening 1301 .

[0134] Then, a protection layer 14 is formed in the isolation opening 1301 at a position close to the isolation structure 13 .

[0135] In this step, the area outside the protective layer 14 can be blocked, and the protective layer 14 can be obtained only at the position where the protective layer 14 is needed; or a protective material layer can be formed in the isolation opening 1301, and the portion close to the isolation structure 12 can be retained through patterning to obtain the protective layer 14.

[0136] Finally, the pixel defining material layer 20 exposed at the isolation opening 1301 is patterned to form a pixel defining layer 12 including the pixel opening 1201 .

[0137] In another possible implementation of this embodiment, please refer to Fig.13 and Fig.14 , step S12 can also be implemented in the following way.

[0138] Step S121 , forming a pixel definition material layer 20 on the substrate 11 .

[0139] In step S122 , different regions of the pixel defining material layer 20 away from the substrate 11 are thinned to different degrees to obtain a protective layer 14 that is raised relative to the peripheral region.

[0140] In step S123 , an isolation structure material layer 40 is formed on the side of the pixel definition material layer 20 away from the substrate 11 after the thinning process, and the isolation structure material layer 40 is patterned to form an isolation structure 13 and an isolation opening 1301 .

[0141] In step S124 , the pixel defining material layer 20 exposed at the isolation opening 1301 is patterned to form a pixel defining layer 12 including the pixel opening 1201 .

[0142] For further information, please refer to Fig.15 , step S122 can be implemented in the following way.

[0143] First, a photoresist layer 50 is coated on a side of the pixel definition material layer 20 away from the substrate 11 .

[0144] Next, the photoresist layer 50 is exposed through a half-tone mask 60 and then developed to form an etching window on the photoresist layer 50 , wherein the half-tone mask 60 includes a full light-transmitting opening 610 and a semi-light-transmitting opening 620 .

[0145] Then, the pixel defining material layer 20 is thinned by etching windows to obtain a protective layer 14 that is raised relative to the peripheral area, wherein the semi-transparent opening 620 corresponds to the protective layer 14 and the fully transparent opening 610 corresponds to the peripheral area of ​​the protective layer 14 .

[0146] In this embodiment, since different isolation openings undergo different numbers of etchings, the thickness of the protective layer disposed on the pixel defining layer in different isolation openings may be different. Specifically, the semi-transparent opening 620 includes a first semi-transparent opening and a second semi-transparent opening with different transmittances, and the protective layer 14 includes a first protective layer and a second protective layer with different thicknesses in a direction perpendicular to the plane of the substrate 11. Exemplarily, the transmittance of the first semi-transparent opening is less than the transmittance of the second semi-transparent opening, for example, the transmittance of the first semi-transparent opening is 20%-30%, and the transmittance of the second semi-transparent opening is 60%-70%.

[0147] Specifically, the pixel defining material layer 20 is thinned by etching a window to obtain a first protective layer and a second protective layer that are raised relative to the peripheral area, wherein the first semi-transparent opening corresponds to the first protective layer, and the second semi-transparent opening corresponds to the second protective layer. Exemplarily, the transmittance of the first semi-transparent opening is greater than the transmittance of the second semi-transparent opening, and the thickness of the first protective layer is less than the thickness of the second protective layer.

[0148] Optionally, in step S123, an isolation structure material layer 40 is produced on the side of the pixel definition material layer 20 away from the substrate 11 after the thinning process, and the isolation structure material layer 40 is patterned to form an isolation structure 13 including an isolation opening 1301, so that the first protective layer 141 and the second protective layer 142 are respectively located in different isolation openings 1301.

[0149] Based on the same inventive concept, an embodiment of the present application also provides an electronic device, which includes the display panel provided in the present application, or includes a display panel prepared by the display panel preparation method provided in the present embodiment. The electronic device may include a smart phone, a tablet computer, a vehicle-mounted display device, a smart wearable device, a television, a laptop computer, and other devices with a display function.

[0150] The embodiments of the present application provide a display panel, a method for preparing a display panel, and an electronic device. In the display panel, a protective layer is arranged on the pixel defining layer in a partial isolation opening, and the pixel defining layer thereunder can be protected from being damaged by etching by the protective layer, thereby avoiding poor process caused by damage to the pixel defining layer, thereby affecting the display effect of the display panel. The above design can improve the process yield of the display panel and ensure the display effect of the display panel.

[0151] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; A pixel defining layer, located on one side of the substrate, wherein the pixel defining layer defines a pixel opening on the substrate; An isolation structure, located at a side of the pixel defining layer away from the substrate, the isolation structure encloses an isolation opening, and the isolation opening is connected to the pixel opening; The protection layer is located on at least a portion of the pixel defining layer in the isolation opening, and the orthographic projection of the protection layer on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

2. The display panel according to claim 1, wherein: In a direction away from the substrate, the isolation structure includes a first isolation portion and a second isolation portion which are sequentially stacked, and the second isolation portion includes a protruding portion extending relative to the first isolation portion toward a direction corresponding to the isolation opening; The orthographic projection of the protective layer on the substrate at least partially overlaps with the orthographic projection of the protruding portion on the substrate; Preferably, a distance between an orthographic projection contour line of a side of the protective layer facing the corresponding pixel opening on the substrate and an orthographic projection contour line of the protruding portion facing the corresponding isolation opening is greater than or equal to 0; Preferably, a minimum distance between an orthographic projection of the protection layer on the substrate and an orthographic projection of the first isolation portion on the substrate is greater than or equal to 0.

3. The display panel according to claim 1, wherein: In a direction perpendicular to the plane where the substrate is located, the thickness of the protective layer is not greater than 200 angstroms; Preferably, the material of the protective layer is a dry etching resistant material; Preferably, the material of the protective layer includes an inorganic material resistant to dry etching or an organic material resistant to dry etching; Preferably, a material of the protection layer is the same as or different from a material of the pixel defining layer.

4. The display panel according to any one of claims 1 to 3, characterized in that: The display panel further includes a light emitting device; At least part of the light emitting device is located in the isolation opening; In a direction away from the substrate, the light-emitting device includes a first electrode, a light-emitting material layer and a second electrode which are stacked in sequence, the first electrode is located on a side of the pixel defining layer close to the substrate, the pixel opening exposes at least a portion of the first electrode, and the second electrode overlaps the isolation structure; Preferably, the second electrode covers at least a portion of the protection layer, and the second electrode overlaps a side of the isolation structure facing the corresponding isolation opening.

5. The display panel according to claim 4, wherein: The isolation opening includes a first isolation opening and a second isolation opening, the light emitting device includes a first light emitting device and a second light emitting device of different light emitting colors, at least part of the first light emitting device is located in the first isolation opening, and at least part of the second light emitting device is located in the second isolation opening; The protection layer is at least disposed on the pixel defining layer in the second isolation opening; Preferably, the protection layer comprises a first protection layer, and the first protection layer is disposed on the pixel defining layer in the second isolation opening.

6. The display panel according to claim 5, wherein: The isolation opening further includes a third isolation opening, the light emitting device further includes a third light emitting device having a light emission color different from that of the first light emitting device and the second light emitting device, and at least part of the third light emitting device is located in the third isolation opening; The protective layer includes a second protective layer, and the second protective layer is disposed on the pixel defining layer in the third isolation opening; Preferably, the first protective layer and the second protective layer are made of the same material, and the first protective layer and the second protective layer are arranged on the same layer.

7. The display panel according to claim 6, wherein: In a direction perpendicular to the plane where the substrate is located, the thickness of the first protective layer is equal to or unequal to the thickness of the second protective layer.

8. The display panel according to claim 2, wherein: The isolation structure further includes a third isolation portion, wherein in a direction away from the substrate, the third isolation portion, the first isolation portion and the second isolation portion are sequentially stacked, and an orthographic projection of the first isolation portion on the substrate is located within an orthographic projection of the third isolation portion on the substrate; The protective layer is disposed on the pixel defining layer close to the third isolation portion, and a minimum distance between an orthographic projection of the protective layer on the substrate and an orthographic projection of the third isolation portion on the substrate is greater than or equal to 0; Preferably, the material of the first isolation portion includes aluminum, silver or copper, the material of the second isolation portion includes molybdenum or titanium, and the material of the third isolation portion includes titanium or molybdenum.

9. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; A pixel defining layer, a protective layer and an isolation structure are manufactured on the substrate, so that the pixel defining layer defines a pixel opening on the substrate, the isolation structure is located on a side of the pixel defining layer away from the substrate, the isolation structure encloses and forms an isolation opening, the isolation opening is connected to the pixel opening, the protective layer is located on at least a portion of the pixel defining layer in the isolation opening, and the orthographic projection of the protective layer on the substrate at least partially overlaps with the orthographic projection of the isolation structure on the substrate.

10. The method for manufacturing a display panel according to claim 9, wherein: The step of manufacturing a pixel defining layer, a protective layer and an isolation structure on the substrate includes: forming a pixel defining material layer on the substrate; Making a protective material layer on a side of the pixel defining material layer away from the substrate, and patterning the protective material layer to form the protective layer; Forming an isolation structure material layer on a side of the pixel defining material layer and the protective layer away from the substrate, and patterning the isolation structure material layer to form an isolation structure and an isolation opening; The pixel defining material layer exposed at the isolation opening is patterned to form a pixel defining layer including the pixel opening.

11. The method for preparing a display panel according to claim 10, wherein: The step of forming a protective material layer on a side of the pixel defining material layer away from the substrate and patterning the protective material layer to form the protective layer comprises: Making a protective material layer on a side of the pixel defining material layer away from the substrate; Performing different degrees of thinning treatment on different regions of the protective material layer away from the substrate to obtain the protective layer; Preferably, the step of performing different degrees of thinning on different regions of the protective material layer away from the substrate to obtain the protective layer comprises: Coating a photoresist layer on the side of the protective material layer away from the substrate; Exposing and developing the photoresist layer through a half-tone mask to form an etching window on the photoresist layer, wherein the half-tone mask includes a full light-transmitting opening and a semi-light-transmitting opening; The protective material layer is thinned through the etching window to obtain the protective layer, wherein the semi-transparent opening corresponds to the protective layer.

12. The method for preparing a display panel according to claim 11, wherein: The semi-transparent opening includes a first semi-transparent opening and a second semi-transparent opening with different transmittances, and the protective layer includes a first protective layer and a second protective layer with different thicknesses in a direction perpendicular to the plane where the substrate is located, wherein the step of thinning the protective material layer through the etching window to obtain the protective layer includes: Thinning the protective material layer through the etching window to obtain the first protective layer and the second protective layer, wherein the first semi-transparent opening corresponds to the first protective layer, and the second semi-transparent opening corresponds to the second protective layer; Preferably, the step of forming an isolation structure material layer on a side of the pixel defining material layer and the protective layer away from the substrate, and patterning the isolation structure material layer to form an isolation structure and an isolation opening comprises: An isolation structure material layer is formed on the side of the pixel defining material layer and the protective layer away from the substrate, and the isolation structure material layer is patterned to form an isolation structure and an isolation opening, so that the first protective layer and the second protective layer are respectively located in different isolation openings.

13. The method for preparing a display panel according to claim 9, wherein: The step of manufacturing a pixel defining layer, a protective layer and an isolation structure on the substrate includes: forming a pixel defining material layer on the substrate; Making an isolation structure material layer on a side of the pixel defining material layer away from the substrate, and patterning the isolation structure material layer to form an isolation structure and an isolation opening; Forming a protective layer in the isolation opening at a position close to the isolation structure; The pixel defining material layer exposed at the isolation opening is patterned to form a pixel defining layer including the pixel opening.

14. The method for preparing a display panel according to claim 9, wherein: The step of manufacturing a pixel defining layer, a protective layer and an isolation structure on the substrate includes: forming a pixel defining material layer on the substrate; Performing different degrees of thinning on different regions of the pixel defining material layer away from the substrate to obtain a protective layer that is raised relative to the peripheral region; Making an isolation structure material layer on a side of the pixel defining material layer away from the substrate after the thinning process, and patterning the isolation structure material layer to form an isolation structure and an isolation opening; The pixel defining material layer exposed at the isolation opening is patterned to form a pixel defining layer including the pixel opening.

15. The method for preparing a display panel according to claim 14, wherein: The step of performing different degrees of thinning on different areas of the pixel defining material layer away from the substrate to obtain a protective layer that is raised relative to the peripheral area includes: Coating a photoresist layer on a side of the pixel defining material layer away from the substrate; Exposing and developing the photoresist layer through a half-tone mask to form an etching window on the photoresist layer, wherein the half-tone mask includes a full light-transmitting opening and a semi-light-transmitting opening; The pixel defining material layer is thinned through the etching window to obtain a protective layer protruding relative to the peripheral area, wherein the semi-transparent opening corresponds to the protective layer, and the fully transparent opening corresponds to the peripheral area of ​​the protective layer.

16. The method for manufacturing a display panel according to claim 15, wherein: The semi-transparent opening includes a first semi-transparent opening and a second semi-transparent opening with different transmittances, the protective layer includes a first protective layer and a second protective layer with different thicknesses in a direction perpendicular to the plane where the substrate is located, and the step of thinning the pixel defining material layer through the etching window to obtain a protective layer that is raised relative to the peripheral area includes: The pixel defining material layer is thinned through the etching window to obtain a first protective layer and a second protective layer that are raised relative to the peripheral area, wherein the first semi-transparent opening corresponds to the first protective layer, and the second semi-transparent opening corresponds to the second protective layer; Preferably, the step of manufacturing an isolation structure material layer on a side of the pixel defining material layer away from the substrate after the thinning process, and patterning the isolation structure material layer to form the isolation structure and the isolation opening comprises: An isolation structure material layer is manufactured on the side of the thinned pixel defining material layer away from the substrate, and the isolation structure material layer is patterned to form an isolation structure and an isolation opening, so that the first protection layer and the second protection layer are respectively located in different isolation openings.

17. An electronic device, characterized in that: The electronic device comprises the display panel described in any one of claims 1 to 8, or a display panel prepared by the method for preparing a display panel described in any one of claims 9 to 16.

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