Display panel and preparation method thereof

Abstract

The invention discloses a display panel and a preparation method thereof, the display panel comprises a substrate, a first wiring layer, a second wiring layer, a side edge wiring, a first packaging layer and a second packaging layer, the substrate comprises a first surface and a second surface which are arranged oppositely, and a first side surface connecting the first surface and the second surface; the first wiring layer is located on one side of the first surface of the substrate; the second wiring layer is located on one side of the second surface of the substrate; the side wiring is arranged on the first side surface, the first end of the side wiring extends to the first surface and is electrically connected with the first wiring layer, and the second end of the side wiring extends to the second surface and is electrically connected with the second wiring layer; the first packaging layer is at least arranged on the surface, deviating from the substrate, of the side line; the second packaging layer is at least arranged on the side face, perpendicular to the first side face, of the side line, and the first packaging layer and the second packaging layer are made of different materials. Through the combined use of the first packaging layer and the second packaging layer, a good packaging effect on side wiring is realized.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same. Background Art

[0002] In the display panel, a first routing layer and a second routing layer are prepared on both sides of a substrate respectively, and side routing is used to electrically connect the first routing layer and the second routing layer. In order to ensure the service life of the side routing, the side routing needs to be packaged.

[0003] The inventor of the present application has discovered that, currently, when packaging the side wiring, there is a problem of poor packaging effect. Summary of the invention

[0004] The present application mainly provides a display panel and a method for preparing the same, which can improve the yield of the display panel.

[0005] In order to solve the above technical problems, the technical solution adopted in the present application is: to provide a display panel, which includes a substrate, a first routing layer, a second routing layer, a side routing, a first packaging layer and a second packaging layer, wherein the substrate includes a first surface and a second surface arranged opposite to each other, and a first side surface connecting the first surface and the second surface; the first routing layer is located on the first surface side of the substrate; the second routing layer is located on the second surface side of the substrate; the side routing is arranged on the first side, and the first end of the side routing extends to the first surface and is electrically connected to the first routing layer, and the second end extends to the second surface and is electrically connected to the second routing layer; the first packaging layer is at least arranged on the surface of the side routing away from the substrate; the second packaging layer is at least arranged on the side of the side routing perpendicular to the first side, wherein the materials of the first packaging layer and the second packaging layer are different.

[0006] The viscosity of the second encapsulation layer is greater than that of the first encapsulation layer.

[0007] Preferably, the material of the first encapsulation layer includes at least one of acrylic, epoxy, and polyimide inks.

[0008] Preferably, the material of the second encapsulation layer includes at least one of acrylic, epoxy, and polyimide inks.

[0009] The first packaging layer further extends to the end surfaces of the first end and the second end of the side wiring.

[0010] The display panel further includes a third packaging layer, which is arranged on the surface of the first wiring layer away from the substrate and extends to the end surface of the first end of the side wiring.

[0011] Preferably, the second packaging layer further extends to an end surface of the second end of the side trace.

[0012] Preferably, the material of the third encapsulation layer includes at least one of acrylic, epoxy, and polyimide inks.

[0013] There are multiple side routing lines, and the multiple side routing lines are arranged at intervals along the direction in which the first side surface extends; and the second packaging layer further extends to the substrate between two adjacent side routing lines.

[0014] To solve the above technical problems, another technical solution adopted in the present application is: providing a method for preparing a display panel, the method comprising: forming a first routing layer on a first surface of a substrate, and forming a second routing layer on a second surface of the substrate, the first surface and the second surface are arranged opposite to each other, and the substrate further comprises a first side surface connecting the first surface and the second surface; forming a side routing layer on the first side surface, wherein the side routing layer extends to the first surface and is electrically connected to the first routing layer, and extends to the second surface and is electrically connected to the second routing layer; forming a first encapsulation layer at least on a surface of the side routing layer away from the substrate; patterning the first encapsulation layer and the side routing layer to obtain side routing and a first encapsulation layer arranged on the side routing; forming a second encapsulation layer at least on a side surface of the side routing perpendicular to the first side surface; wherein the material of the first encapsulation layer is different from the material of the second encapsulation layer.

[0015] Before forming the side wiring layer on the first side, the method further includes: forming a first protective film on a surface of the first wiring layer away from the substrate; and forming a second protective film on a surface of the second wiring layer away from the substrate.

[0016] Wherein, after at least the step of forming the first packaging layer on the surface of the side wiring layer away from the substrate, the method further includes: tearing off the first protective film and the second protective film.

[0017] Among them, the step of forming a first packaging layer at least on the surface of the side routing layer away from the substrate includes: simultaneously forming the first packaging layer on the surface of the side routing layer away from the substrate and on the end surface of the side routing layer electrically connected to the first routing layer and the second routing layer.

[0018] After the steps of patterning the first packaging layer and the side wiring layer, the method further includes: forming a third protective film on at least part of the surface of the first wiring layer away from the substrate; and forming a fourth protective film on at least part of the surface of the second wiring layer away from the substrate.

[0019] Wherein, after the step of forming the second packaging layer at least on the side surface where the side wiring is perpendicular to the first side surface, the method further includes: tearing off the third protective film and the fourth protective film.

[0020] The step of forming a second packaging layer at least on the side surface of the side routing perpendicular to the first side surface includes: simultaneously forming a second packaging layer on the side surface of the side routing perpendicular to the first side surface and on the end surface where the side routing is electrically connected to the second routing layer.

[0021] Among them, after the step of forming a second packaging layer on at least the side of the side routing perpendicular to the first side, it also includes: forming a third packaging layer on the side of the first routing layer away from the substrate, and the third packaging layer extends to the end surface where the side routing is electrically connected to the first routing layer.

[0022] The beneficial effect of the present application is that in the present application, by using the first encapsulation layer and the second encapsulation layer in combination, a better encapsulation effect for the side wiring is achieved, and at the same time the yield of the display panel can be guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0024] Figure 1 This is a schematic structural diagram of an embodiment of a display panel in the present application;

[0025] Figure 2 It is a structural schematic diagram of another embodiment of the display panel in the present application;

[0026] Figure 3 A side view of an embodiment of a display panel in the present application;

[0027] Figure 4 This is a schematic structural diagram of another embodiment of the display panel in the present application;

[0028] Figure 5 This is a flow chart of an implementation method of a display panel preparation method in this application;

[0029] Figure 6 for Figure 5 A cross-sectional view and a top view of an embodiment of steps S10 to S30;

[0030] Figure 7 for Figure 6 The subsequent preparation process diagram;

[0031] Figure 8 for Figure 5 A cross-sectional view and a top view of another embodiment of steps S10 to S30;

[0032] Fig. 9 for Figure 8 The subsequent preparation process diagram;

[0033] 1 first routing layer; 2 second routing layer; 3 substrate; 31 first surface; 32 second surface; 33 first side; 4 side routing; 43 side routing layer; 41 first end; 42 second end; 5 first packaging layer; 6 second packaging layer; 7 third packaging layer; 8 first protective film; 9 second protective film; 10 third protective film; 11 fourth protective film. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0036] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0037] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0038] In the description of the embodiments of the present application, the term "plurality" refers to more than two (including two), and similarly, "multiple groups" refers to more than two groups (including two).

[0039] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0040] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0041] See also Figure 1 , Figure 2 and Figure 3 The present application provides a display panel, which includes a substrate 3, a first wiring layer 1, a second wiring layer 2, a side wiring 4, a first packaging layer 5 and a second packaging layer 6, wherein the substrate 3 includes a first surface 31 and a second surface 32 arranged opposite to each other, and a first side surface 33 connecting the first surface 31 and the second surface 32; the first wiring layer 1 is located on one side of the first surface 31 of the substrate 3; the second wiring layer 2 is located on one side of the second surface 32 of the substrate 3; the side wiring 4 is arranged on the first side surface 33, and the first end 41 of the side wiring 4 extends to the first surface 31 and is electrically connected to the first wiring layer 1, and the second end 42 extends to the second surface 32 and is electrically connected to the second wiring layer 2; the first packaging layer 5 is at least arranged on the surface of the side wiring 4 away from the substrate 3; the second packaging layer 6 is at least arranged on the side of the side wiring 4 perpendicular to the first side surface 33, wherein the materials of the first packaging layer 5 and the second packaging layer 6 are different.

[0042] Specifically, the substrate 3 may be a rigid substrate, such as a glass substrate, or a flexible substrate, for example, the material of the substrate 3 includes polyimide PI. The first wiring layer 1 and the second wiring layer 2 are used to transmit electrical signals, and the side wiring 4 electrically connects the first wiring layer 1 and the second wiring layer 2 to achieve signal conduction between the first wiring layer 1 and the second wiring layer 2.

[0043] Furthermore, in order to ensure the service life and signal transmission stability of the side routing 4, the present application utilizes a combination of a first encapsulation layer 5 and a second encapsulation layer 6 of different materials to protect the side routing 4. The first encapsulation layer 5 is at least arranged on the surface of the side routing 4 away from the substrate 3, that is, the first encapsulation layer 5 is at least formed on the surface of the side routing 4 not connected to the substrate 3, and the second encapsulation layer 6 is at least arranged on the side of the side routing 4 perpendicular to the first side surface 33, wherein the side of the side routing 4 perpendicular to the first side surface 33 is, when the number of the side routing 4 is multiple, the side routing 4 faces / faces away from the adjacent side routing 4.

[0044] The present application utilizes a combination of a first packaging layer 5 and a second packaging layer 6 made of different materials to protect the side routing 4, which can avoid the defect of poor packaging effect of a single material, thereby causing failure of the entire packaging layer. Through the scheme of the present application, even if a certain packaging layer fails, the other packaging layer can still achieve a certain packaging effect, thereby ensuring the service life of the side routing 4. On the other hand, during preparation, the first packaging layer 5 and the second packaging layer 6 can be prepared in a step-by-step manner, thereby avoiding overflow of the packaging material. For details, please refer to the following introduction.

[0045] In one embodiment, the viscosity of the second encapsulation layer 6 is greater than that of the first encapsulation layer 5, that is, the bonding force between the second encapsulation layer 6 and the side wiring 4 is greater than that between the first encapsulation layer 5 and the side wiring 4, which can prevent the second encapsulation layer 6 from flowing out during preparation and contaminating other areas. Specifically, considering that the area of ​​the side surface of the side wiring 4 perpendicular to the first side surface 33 is generally smaller than the area of ​​the surface of the side wiring 4 away from the substrate 3, the viscosity of the second encapsulation layer 6 is set to be greater than that of the first encapsulation layer 5, which can ensure that the bonding force between the second encapsulation layer 6 and the side wiring 4 is greater than that between the first encapsulation layer 5 and the side wiring 4, thereby ensuring the encapsulation effect.

[0046] In one embodiment, the material of the first encapsulation layer 5 includes at least one of acrylic, epoxy, and polyimide inks. Specifically, these materials are easy to obtain, facilitate subsequent preparation, and can reduce preparation costs.

[0047] In one embodiment, the material of the second encapsulation layer 6 includes at least one of acrylic, epoxy, and polyimide inks. Specifically, these materials are easy to obtain, facilitate subsequent preparation, and can reduce preparation costs.

[0048] Please continue reading Figure 1, the first encapsulation layer 5 further extends to the end surfaces of the first end 41 and the second end 42 of the side wiring 4. Specifically, the design of setting the first encapsulation layer 5 to cover the end surfaces of the first end 41 and the second end 42 of the side wiring 4 ensures the encapsulation effect of the first encapsulation layer 5 on the end surfaces of the first end 41 and the second end 42 of the side wiring 4. Of course, in other embodiments, such as Figure 2 As shown, the first packaging layer 5 may not extend to the end surfaces of the first end 41 and the second end 42 of the side trace 4 .

[0049] See also Figure 4 The display panel further includes a third encapsulation layer 7, which is arranged on the surface of the first wiring layer 1 away from the substrate 3 and extends to the end surface of the first end 41 of the side wiring 4. Specifically, at this time, the third encapsulation layer 7 encapsulates and protects the first wiring layer 1 on the one hand, and encapsulates and protects the end surface of the first end 41 of the side wiring 4 on the other hand.

[0050] Continue reading Figure 4 In one embodiment, the second encapsulation layer 6 further extends to the end surface of the second end 42 of the side wiring 4. Specifically, the second encapsulation layer 6 is provided to encapsulate and protect the end surface of the second end 42 of the side wiring 4.

[0051] In one embodiment, the material of the third encapsulation layer 7 includes at least one of acrylic, epoxy, and polyimide inks. These materials are easy to obtain, facilitate subsequent preparation, and can reduce preparation costs.

[0052] Please combine Figure 1 and Figure 3 There are multiple side routings 4, and the multiple side routings 4 are spaced apart along the direction in which the first side surface 33 extends. At this time, the second encapsulation layer 6 further extends to the substrate 3 between two adjacent side routings 4, so that the second encapsulation layer 6 effectively fills the area between the two adjacent side routings 4, and the side surfaces of the side routings 4 in the arrangement direction are effectively encapsulated and protected.

[0053] See also Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 , the following describes a method for preparing a display panel, the method comprising:

[0054] S10: forming a first wiring layer 1 on the first surface 31 of the substrate 3 and forming a second wiring layer 2 on the second surface 32 of the substrate 3 , wherein the first surface 31 and the second surface 32 are arranged opposite to each other, and the substrate 3 further includes a first side surface 33 connecting the first surface 31 and the second surface 32 .

[0055] The first wiring layer 1 and the second wiring layer 2 may be prepared by any method in the prior art, and this application does not impose any specific limitation on the specific process.

[0056] S20 : ​​forming a side routing layer 43 on the first side surface 33 , wherein the side routing layer 43 extends to the first surface 31 and is electrically connected to the first routing layer 1 , and extends to the second surface 32 and is electrically connected to the second routing layer 2 .

[0057] Specifically, a side wiring layer 43 electrically connecting the first wiring layer 1 and the second wiring layer 2 is formed on the first side surface 33 .

[0058] S30 : forming a first packaging layer 5 at least on the surface of the side wiring layer 43 facing away from the substrate 3 .

[0059] Specifically, the first packaging layer 5 is formed at least on the surface of the side wiring layer 43 that is not connected to the substrate 3 .

[0060] S40 : patterning the first packaging layer 5 and the side wiring layer 43 to obtain the side wiring 4 and the first packaging layer 5 disposed on the side wiring 4 .

[0061] Specifically, in order to reduce the transmission resistance, the first packaging layer 5 and the side wiring layer 43 are patterned to obtain the side wiring 4 and the first packaging layer 5 disposed on the side wiring 4 .

[0062] The number of the side wirings 4 may be one or more, which is not limited here.

[0063] S50: forming a second encapsulation layer 6 at least on the side surface of the side trace 4 which is perpendicular to the first side surface 33. The material of the first encapsulation layer 5 is different from the material of the second encapsulation layer 6.

[0064] The preparation process in the prior art is: after forming the side wiring layer 43, the side wiring layer 43 is patterned to obtain the side wiring 4, and then the side wiring 4 is packaged to obtain the packaging layer. However, this process has the following defects: after obtaining the side wiring 4, the side area of ​​the substrate 3 is uneven, and since the packaging material has fluidity, in the subsequent packaging process, when the packaging material is insufficient, the packaging material flows to the pits, and at this time, the protruding side wiring 4 is not packaged and protected, so the packaging effect is poor.

[0065] However, it can be seen from the above-mentioned preparation method of the present application that the present application forms the first encapsulation layer 5 before patterning the side routing layer 43, and there will be no uneven structure at this time, which can ensure the encapsulation effect of the first encapsulation layer 5, and then pattern the side routing 4, and then separately encapsulate the side of the side routing 4 perpendicular to the first side 33 to form the second encapsulation layer 6, and encapsulate the side routing 4 in many aspects. In addition, the material of the first encapsulation layer 5 is different from that of the second encapsulation layer 6, which can avoid the defect that the encapsulation effect of a single material is poor, thereby causing the failure of the entire encapsulation layer.

[0066] See also Figure 6 and Figure 8 Before forming the side wiring layer 43 in step S20, the method further includes:

[0067] S11 : forming a first protective film 8 on a surface of the first wiring layer 1 facing away from the substrate 3 .

[0068] S12 : forming a second protective film 9 on a portion of the surface of the second wiring layer 2 facing away from the substrate 3 .

[0069] Specifically, the first protective film 8 and the second protective film 9 can prevent the packaging material from overflowing onto the first wiring layer 1 and the second wiring layer 2 during the subsequent packaging process. After forming the first packaging layer 5 and before patterning the side wiring layer 43 and the first packaging layer 5, the first protective film 8 and the second protective film 9 are torn off.

[0070] In an application scenario, such as Figure 8 As shown, when the side routing layer 43 is formed, there is a gap between the side routing layer 43 and the first protective film 8, and between the side routing layer 43 and the second protective film 9. Then, when the first packaging layer 5 is formed, the first packaging layer 5 is formed on the surface of the side routing layer 43 away from the substrate 3 and the end surface of the side routing layer 43 electrically connected to the first routing layer 1 and the second routing layer 2. That is to say, the first packaging layer 5 is not only formed on the surface of the side routing layer 43 away from the substrate 3, but also formed on the end surface of the side routing layer 43 electrically connected to the first routing layer 1 and the second routing layer 2. Therefore, after the side routing 4 is subsequently obtained, the first packaging layer 5 is not only arranged on the surface of the side routing 4 away from the substrate 3, but also further extends to the end surfaces of the first end 41 and the second end 42 of the side routing 4.

[0071] In other application scenarios, such as Figure 6 as well as Figure 7As shown, when the side routing layer 43 is formed, there may be no gap between the side routing layer 43 and the first protective film 8, and between the side routing layer 43 and the second protective film 9. At this time, the specific process of forming the second encapsulation layer 6 may include: simultaneously forming the second encapsulation layer 6 on the side surface perpendicular to the first side surface 33 of the side routing 4 and on the end surface where the side routing 4 is electrically connected to the second routing layer 2, and after obtaining the second encapsulation layer 6, further including: forming a third encapsulation layer 7 on the side of the first routing layer 1 away from the substrate 3, and the third encapsulation layer 7 extends to the end surface where the side routing 4 is electrically connected to the first routing layer 1.

[0072] Specifically, Figure 8 and Fig. 9 The application scenario is different. Figure 6 and Figure 7 In the application scenario, the second encapsulation layer 6 is used to encapsulate the end surface of the second end 42 of the side wiring 4, and the third encapsulation layer 7 is used to encapsulate and protect the end surface of the first end 41 of the side wiring 4 while encapsulating and protecting the first wiring layer 1.

[0073] It should be noted that even if the first protective film 8 and the second protective film 9 are not used in the preparation process, the second encapsulation layer 6 can be used to encapsulate the end face of the second end 42 of the side routing 4, and the third encapsulation layer 7 can be used to encapsulate and protect the end face of the first end 41 of the side routing 4 while encapsulating and protecting the first routing layer 1.

[0074] Continue reading Fig. 9 In one embodiment, after step S40, the method further includes:

[0075] S41: forming a third protective film 10 on at least a portion of the surface of the first wiring layer 1 facing away from the substrate 3;

[0076] S42: forming a fourth protective film 11 on at least a portion of the surface of the second wiring layer 2 facing away from the substrate 3;

[0077] After the second encapsulation layer 6 is formed, the third protection film 10 and the fourth protection film 11 are torn off.

[0078] Specifically, the provision of the third protection film 10 and the fourth protection film 11 can prevent the packaging material from overflowing onto the first wiring layer 1 and the second wiring layer 2 during the process of forming the second packaging layer 6 .

[0079] Of course, in other embodiments, the third protective film 10 and the fourth protective film 11 may not be used.

[0080] The present application also provides a display device, which includes the display panel described in any one of the above embodiments. The display device in the embodiments of the present invention can be any product or component with display function and display function, such as electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame or navigator.

[0081] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: The substrate comprises a first surface and a second surface disposed opposite to each other, and a first side surface connecting the first surface and the second surface; A first wiring layer, located on one side of the first surface of the substrate; A second wiring layer is located on one side of the second surface of the substrate; A side routing line is arranged on the first side surface, and a first end of the side routing line extends to the first surface and is electrically connected to the first routing layer, and a second end of the side routing line extends to the second surface and is electrically connected to the second routing layer; A first packaging layer is at least arranged on a surface of the side wiring facing away from the substrate; The second packaging layer is at least arranged on a side surface of the side trace that is perpendicular to the first side surface, wherein the first packaging layer and the second packaging layer are made of different materials.

2. The display panel according to claim 1, characterized in that: The viscosity of the second encapsulation layer is greater than that of the first encapsulation layer; Preferably, the material of the first encapsulation layer includes at least one of acrylic, epoxy, and polyimide inks; Preferably, the material of the second encapsulation layer includes at least one of acrylic, epoxy, and polyimide inks.

3. The display panel according to claim 1, characterized in that: The first packaging layer further extends to end surfaces of the first end and the second end of the side routing.

4. The display panel according to claim 1, characterized in that: The display panel further comprises: A third packaging layer is provided on a surface of the first wiring layer facing away from the substrate and extends to an end surface of the first end of the side wiring; Preferably, the second packaging layer further extends to the end surface of the second end of the side wiring; Preferably, the material of the third encapsulation layer includes at least one of acrylic, epoxy, and polyimide inks.

5. The display panel according to claim 1, characterized in that: There are multiple side routing lines, and the multiple side routing lines are arranged at intervals along the direction in which the first side surface extends; Wherein, the second packaging layer further extends to the substrate between two adjacent side routing lines.

6. A method for preparing a display panel, characterized in that: The method comprises: Forming a first wiring layer on a first surface of a substrate, and forming a second wiring layer on a second surface of the substrate, wherein the first surface and the second surface are arranged opposite to each other, and the substrate further comprises a first side surface connecting the first surface and the second surface; forming a side routing layer on the first side, wherein the side routing layer extends to the first surface and is electrically connected to the first routing layer, and extends to the second surface and is electrically connected to the second routing layer; forming a first packaging layer at least on a surface of the side wiring layer facing away from the substrate; Patterning the first packaging layer and the side routing layer to obtain side routing and the first packaging layer disposed on the side routing; forming a second packaging layer at least on a side surface of the side wiring that is perpendicular to the first side surface; The material of the first encapsulation layer is different from the material of the second encapsulation layer.

7. The preparation method according to claim 6, characterized in that: Before the step of forming a side wiring layer on the first side, the method further includes: forming a first protective film on a portion of the surface of the first wiring layer away from the substrate; forming a second protective film on a portion of the surface of the second wiring layer away from the substrate; After the step of forming a first packaging layer at least on a surface of the side wiring layer away from the substrate, the method further includes: The first protective film and the second protective film are removed.

8. The preparation method according to claim 7, characterized in that: The step of forming a first packaging layer at least on a surface of the side wiring layer facing away from the substrate comprises: At the same time, the first packaging layer is formed on the surface of the side routing layer away from the substrate and on the end surface of the side routing layer electrically connected to the first routing layer and the second routing layer.

9. The preparation method according to claim 6, characterized in that: After the step of patterning the first packaging layer and the side wiring layer, the method further includes: forming a third protective film on at least a portion of the surface of the first wiring layer facing away from the substrate; forming a fourth protective film on at least a portion of the surface of the second wiring layer away from the substrate; After the step of forming a second encapsulation layer at least on a side surface of the side wiring that is perpendicular to the first side surface, the method further includes: The third protective film and the fourth protective film are removed.

10. The preparation method according to claim 6, characterized in that: The step of forming a second encapsulation layer at least on a side surface of the side wiring that is perpendicular to the first side surface comprises: At the same time, forming the second packaging layer on the side surface of the side wiring that is perpendicular to the first side surface and on the end surface where the side wiring is electrically connected to the second wiring layer; After the step of forming a second encapsulation layer at least on a side surface of the side wiring that is perpendicular to the first side surface, the method further includes: A third packaging layer is formed on a side of the first wiring layer away from the substrate, and the third packaging layer extends to an end surface where the side wiring is electrically connected to the first wiring layer.

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