Preparation method of display panel, display panel and display device

Abstract

The invention relates to a preparation method of a display panel, the display panel and a display device.The preparation method comprises the steps that first patterning processing is conducted on an isolation material layer formed on one side of a substrate, and a first isolation opening is formed in the isolation material layer; performing second patterning processing on the first packaging material layer, the first light-emitting device material layer and the isolation material layer on one side of the substrate to form a first light-emitting device and a first packaging part which are arranged in the first isolation opening, and forming a second isolation opening in the isolation material layer; and forming a second light-emitting device material layer and a second packaging material layer which are stacked on one side, deviating from the substrate, of the first packaging material layer and at the second isolation opening, and performing third patterning processing on the second packaging material layer and the second light-emitting device material layer to form a second light-emitting device and a second packaging part which are arranged at the second isolation opening. By using the preparation method of the display panel provided by the invention, the productivity can be saved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing a display panel, a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display panels are widely used due to their advantages such as lightness, active light emission, fast response speed, wide viewing angle, rich colors, high brightness, low power consumption, and high and low temperature resistance. However, there is a problem of production capacity waste in the process of preparing display panels. Summary of the invention

[0003] Based on this, it is necessary to provide a method for preparing a display panel, a display panel and a display device in order to solve the above technical problems.

[0004] In a first aspect, an embodiment of the present application provides a method for preparing a display panel, the method comprising:

[0005] forming an isolation material layer on one side of the substrate, and performing a first patterning process on the isolation material layer to form a first isolation opening on the isolation material layer;

[0006] Forming a stacked first light-emitting device material layer and a first packaging material layer on one side of the substrate, and performing a second patterning process on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first packaging portion provided in the first isolation opening, and forming a second isolation opening on the isolation material layer;

[0007] A stacked second light-emitting device material layer and a second packaging material layer are formed on the side of the first packaging material layer away from the substrate and at the second isolation opening, and the second packaging material layer and the second light-emitting device material layer are subjected to a third patterning process to form a second light-emitting device and a second packaging part arranged in the second isolation opening.

[0008] In one embodiment, the substrate includes a first area and a second area, the orthographic projection of the first isolation opening on the substrate is located within the range of the first area, and the orthographic projection of the second isolation opening on the substrate is located within the range of the second area; the first packaging material layer, the first light-emitting device material layer and the isolation material layer are subjected to a second patterning process to form a first light-emitting device and a first packaging portion provided in the first isolation opening, and a second isolation opening is formed on the isolation material layer, comprising:

[0009] Removing the first packaging material layer on the side facing away from the substrate and only located in the second area to form a first packaging part;

[0010] Removing the first light-emitting device material layer on the side away from the substrate and only located in the second area to form a first light-emitting device disposed in the first isolation opening;

[0011] Etching the isolation material layer located only in the second region to form a second isolation opening on the isolation material layer;

[0012] Optionally, a dry etching process is used to remove the first packaging material layer located only in the second area and facing away from the substrate, so as to form a first packaging part;

[0013] Optionally, a wet etching process is used to remove the first light-emitting device material layer located only in the second region and away from the substrate, so as to form a first light-emitting device disposed in the first isolation opening;

[0014] Optionally, a dry etching process and a wet etching process are used to etch the isolation material layer located only in the second region to form a second isolation opening on the isolation material layer;

[0015] Optionally, performing a third patterning process on the second encapsulation material layer and the second light-emitting device material layer to form a second light-emitting device and a second encapsulation portion provided in the second isolation opening includes:

[0016] Removing the second packaging material layer and the second light-emitting device material layer on the side away from the substrate except the second area to form a second light-emitting device and a second packaging part provided in the second isolation opening;

[0017] Optionally, the first light-emitting device material layer includes a stacked first light-emitting functional material layer and a first electrode material layer, and the first light-emitting device includes a first light-emitting functional portion formed by the first light-emitting functional material layer and a first electrode formed by the first electrode material layer; the second light-emitting device material layer includes a second light-emitting functional material layer and a second electrode material layer, and the second light-emitting device includes a second light-emitting functional portion formed by the second light-emitting functional material layer and a second electrode formed by the second electrode material layer.

[0018] In one embodiment, a second patterning process is performed on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first packaging portion provided in the first isolation opening, and a second isolation opening is formed on the isolation material layer, comprising:

[0019] Performing a second patterning process on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device, a first encapsulation portion, a first covering portion connected to the first light-emitting device and the first encapsulation portion, and forming a second isolation opening on the isolation material layer;

[0020] The first covering portion includes a first sub-covering portion disposed on a side of the first isolation structure facing away from the substrate between the first isolation opening and the second isolation opening, and a second sub-covering portion disposed on a side wall of the first isolation structure corresponding to the first isolation opening;

[0021] Optionally, the first covering portion includes a redundant device material layer located on the first light-emitting device material layer and a first encapsulation sub-portion connected to the first encapsulation portion;

[0022] Optionally, performing a third patterning process on the second encapsulation material layer and the second light-emitting device material layer to form a second light-emitting device and a second encapsulation portion provided in the second isolation opening includes:

[0023] Performing a third patterning process on the second encapsulation material layer and the second light-emitting device material layer to form a second light-emitting device and a second encapsulation portion, and a second covering portion connected to the second light-emitting device and the second encapsulation portion;

[0024] The second covering portion includes a third sub-covering portion provided on a side of the first isolation structure facing away from the substrate, and a fourth sub-covering portion provided on a side wall of the first isolation structure corresponding to the second isolation opening;

[0025] Optionally, the second covering portion includes a redundant device material layer located on the second light-emitting device material layer and a second encapsulation sub-portion connected to the second encapsulation portion;

[0026] Optionally, along the thickness direction of the substrate, a distance between the first sub-covering portion and the substrate is smaller than a distance between the third sub-covering portion and the substrate;

[0027] Optionally, the third sub-covering portion is located on a side of a portion of the first sub-covering portion facing away from the substrate.

[0028] In one embodiment, the preparation method further comprises:

[0029] Performing a fourth patterning process on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form a third isolation opening on the isolation material layer;

[0030] forming a stacked third light emitting device material layer and a third packaging material layer on one side of the substrate;

[0031] Performing a fifth patterning process on the third encapsulation material layer and the third light-emitting device material layer to form a third light-emitting device and a third encapsulation portion disposed in the third isolation opening;

[0032] Optionally, the third light-emitting device material layer includes a stacked third light-emitting function material layer and a third electrode material layer, and the third light-emitting device includes a third light-emitting function portion and a third electrode.

[0033] In one embodiment, the substrate includes a third region, and the orthographic projection of the third isolation opening on the substrate is located within the range of the third region; performing a fourth patterning process on the first packaging material layer, the first light-emitting device material layer, and the isolation material layer to form the third isolation opening on the isolation material layer, comprising:

[0034] removing the first packaging material layer on the side facing away from the substrate and only located in the third area;

[0035] Removing the first light-emitting device material layer on the side away from the substrate and only located in the third area;

[0036] Etching the isolation material layer located only in the third region to form a third isolation opening on the isolation material layer;

[0037] Optionally, a dry etching process is used to remove the first packaging material layer which is located on a side away from the substrate and only in the third area;

[0038] Optionally, a wet etching process is used to remove the second light-emitting device material layer which is located on a side away from the substrate and only in the third area;

[0039] Optionally, a dry etching process and a wet etching process are used to etch the isolation material layer located only in the third region to form a third isolation opening on the isolation material layer;

[0040] Optionally, a fifth patterning process is performed on the third encapsulation material layer and the third light-emitting device material layer to form a third light-emitting device and a third encapsulation portion provided in the third isolation opening, including:

[0041] The third encapsulation material layer and the third light-emitting device material layer on the side facing away from the substrate except those located outside the third region are removed to form a third light-emitting device and a third encapsulation part.

[0042] In one embodiment, performing a fourth patterning process on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form a third isolation opening on the isolation material layer includes:

[0043] Performing a fourth patterning process on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form a third covering portion and a third isolation opening on the isolation material layer;

[0044] The third covering portion includes a fifth sub-covering portion disposed on a side of the second isolation structure facing away from the substrate between the second isolation opening and the third isolation opening, and a sixth sub-covering portion disposed on a side wall of the second isolation structure corresponding to the second isolation opening;

[0045] Optionally, the third covering portion includes a redundant device material layer located on the first light-emitting device material layer, a redundant device material layer located on the second light-emitting device material layer, and a redundant encapsulation material layer located on the first encapsulation material layer, and a third encapsulation sub-portion connected to the second encapsulation portion;

[0046] Optionally, a fifth patterning process is performed on the third encapsulation material layer and the third light-emitting device material layer to form a third light-emitting device and a third encapsulation portion provided in the third isolation opening, including:

[0047] Performing a fifth patterning process on the third encapsulation material layer and the third light-emitting device material layer to form a third light-emitting device and a third encapsulation portion, and a fourth covering portion connected to the third light-emitting device and the third encapsulation portion;

[0048] The fourth covering portion includes a seventh sub-covering portion disposed on a side of the second isolation structure facing away from the substrate, and an eighth sub-covering portion disposed on a side wall of the second isolation structure corresponding to the third isolation opening;

[0049] The fourth covering portion includes a redundant device material layer located on the third light emitting device material layer, and a fourth encapsulation sub-portion connected to the third encapsulation portion;

[0050] Optionally, along the thickness direction of the substrate, the distance between the fifth sub-covering portion and the substrate is smaller than the distance between the seventh sub-covering portion and the substrate;

[0051] Optionally, the seventh sub-covering portion is located on a side of a portion of the fifth sub-covering portion facing away from the substrate.

[0052] In one embodiment, an isolation material layer is formed on one side of a substrate, and a first patterning process is performed on the isolation material layer to form a first isolation opening on the isolation material layer, including:

[0053] Forming a stacked pixel definition material layer and an isolation structure material layer on one side of the substrate;

[0054] Performing a first patterning process on the isolation structure material layer and the pixel definition material layer to form a first isolation structure opening on the isolation structure material layer and a first pixel opening on the pixel definition material layer; an orthographic projection of the first pixel opening on the substrate is located within an orthographic projection of the first isolation structure opening on the substrate;

[0055] The first isolation structure opening includes a first isolation sub-opening, a second isolation sub-opening and a third isolation sub-opening, the second isolation sub-opening is located between the first isolation sub-opening and the third isolation sub-opening, the orthographic projection of the first isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate, and the orthographic projection of the third isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate;

[0056] Optionally, performing a second patterning process on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first packaging portion provided in the first isolation opening, and forming a second isolation opening on the isolation material layer, comprises:

[0057] The first packaging material layer, the first light-emitting device material layer, the isolation structure material layer and the pixel defining material layer are subjected to a second patterning process to form a first light-emitting device and a first packaging portion provided at the first isolation structure opening and the first pixel opening, and a second isolation structure opening is formed on the isolation structure material layer, and a second pixel opening is formed on the pixel defining material layer; the orthographic projection of the second pixel opening on the substrate is located within the orthographic projection of the second isolation structure opening on the substrate.

[0058] In one embodiment, the preparation method further comprises:

[0059] A plurality of fourth electrodes are formed on one side of the substrate, and the plurality of fourth electrodes are respectively arranged on a side of the first light emitting device close to the substrate and a side of the second light emitting device close to the substrate.

[0060] In a second aspect, an embodiment of the present application provides a display panel, including:

[0061] substrate;

[0062] An isolation layer is provided on one side of the substrate and is provided with a first isolation opening and a second isolation opening, and a first isolation structure between the first isolation opening and the second isolation opening;

[0063] A light emitting device, comprising a first light emitting device disposed at the first isolation opening and a second light emitting device disposed at the second isolation opening;

[0064] The encapsulation layer comprises a first encapsulation portion provided on a side of the first light emitting device away from the substrate and a second encapsulation portion provided on a side of the second light emitting device away from the substrate;

[0065] A covering portion, comprising a first covering portion connected to the first light emitting device and the first packaging portion, and a second covering portion connected to the second light emitting device and the second packaging portion;

[0066] The first covering portion includes a first sub-covering portion provided on a side of the first isolation structure away from the substrate, and a second sub-covering portion provided on a side wall of the first isolation structure corresponding to the first isolation opening; the second covering portion includes a third sub-covering portion provided on a side of the first isolation structure away from the substrate, and a fourth sub-covering portion provided on a side wall of the first isolation structure corresponding to the second isolation opening;

[0067] Along the thickness direction of the substrate, a distance between the first sub-covering portion and the substrate is smaller than a distance between the third sub-covering portion and the substrate.

[0068] In one of the embodiments, the first covering portion includes a redundant device material layer located on the first light emitting device material layer and a first encapsulation sub-portion connected to the first encapsulation portion;

[0069] The second covering portion includes a redundant device material layer located on the second light emitting device material layer and a second encapsulation sub-portion connected to the second encapsulation portion;

[0070] Optionally, the third sub-covering portion is located on a side of a portion of the first sub-covering portion that is away from the substrate;

[0071] Optionally, the first light emitting device includes a first light emitting functional portion and a first electrode, and the second light emitting device includes a second light emitting functional portion and a second electrode.

[0072] In one embodiment, the isolation layer includes an isolation structure layer and a pixel definition layer, the pixel definition layer is disposed on one side of the substrate, and the isolation structure layer is disposed on a side of the pixel definition layer away from the substrate;

[0073] The pixel defining layer is provided with a first pixel opening and a second pixel opening, and the isolation structure layer is provided with a first isolation structure opening and a second isolation structure opening; the orthographic projection of the first pixel opening on the substrate is located within the orthographic projection of the first isolation structure opening on the substrate, and the orthographic projection of the second pixel opening on the substrate is located within the orthographic projection of the second isolation structure opening on the substrate;

[0074] Optionally, the first isolation structure opening includes a first isolation sub-opening, a second isolation sub-opening and a third isolation sub-opening, the second isolation sub-opening is located between the first isolation sub-opening and the third isolation sub-opening, the orthographic projection of the first isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate, and the orthographic projection of the third isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate;

[0075] Optionally, the second isolation structure opening includes a fourth insulator opening, a fifth insulator opening and a sixth insulator opening, the fifth insulator opening is located between the fourth insulator opening and the sixth insulator opening, the orthographic projection of the fourth insulator opening on the substrate is located within the orthographic projection of the fifth insulator opening on the substrate, and the orthographic projection of the sixth insulator opening on the substrate is located within the orthographic projection of the fifth insulator opening on the substrate.

[0076] In one embodiment, the isolation layer is further provided with a third isolation opening, and a second isolation structure is included between the second isolation opening and the third isolation opening;

[0077] The light emitting device further includes a third light emitting device disposed in the third isolation opening;

[0078] Optionally, the encapsulation layer further includes a third encapsulation portion provided on a side of the third light-emitting device away from the substrate;

[0079] Optionally, the pixel defining layer is further provided with a third pixel opening, the isolation structure layer is further provided with a third isolation structure opening, and the orthographic projection of the third pixel opening on the substrate is located within the orthographic projection of the third isolation structure opening on the substrate;

[0080] Optionally, the third isolation structure opening includes a seventh insulator opening, an eighth insulator opening and a ninth insulator opening, the eighth insulator opening is located between the seventh insulator opening and the ninth insulator opening, the orthographic projection of the seventh insulator opening on the substrate is located within the orthographic projection of the eighth insulator opening on the substrate, and the orthographic projection of the ninth insulator opening on the substrate is located within the orthographic projection of the eighth insulator opening on the substrate.

[0081] In one embodiment, the covering portion further includes: a third covering portion, and a fourth covering portion connected to the third light emitting device and the third encapsulation portion;

[0082] The third covering portion includes a fifth sub-covering portion provided on a side of the second isolation structure facing away from the substrate, and a sixth sub-covering portion of a side wall of the second isolation structure corresponding to the second isolation opening;

[0083] The fourth covering portion includes a seventh sub-covering portion provided on a side of the second isolation structure facing away from the substrate, and an eighth sub-covering portion of a side wall of the second isolation structure corresponding to the third isolation opening;

[0084] Optionally, the third covering portion includes a redundant device material layer located on the first light-emitting device material layer, a redundant device material layer located on the second light-emitting device material layer, and a redundant encapsulation material layer located on the first encapsulation material layer, and a third encapsulation sub-portion connected to the second encapsulation portion;

[0085] Optionally, the fourth covering portion includes a redundant device material layer located on the third light-emitting device material layer, and a fourth encapsulation sub-portion connected to the third encapsulation portion;

[0086] Optionally, along the thickness direction of the substrate, the distance between the fifth sub-covering portion and the substrate is smaller than the distance between the seventh sub-covering portion and the substrate;

[0087] Optionally, the seventh sub-covering portion is located on a side of a portion of the fifth sub-covering portion facing away from the substrate.

[0088] In one embodiment, the display panel further comprises:

[0089] A plurality of fourth electrodes are respectively arranged on a side of the first light emitting device close to the substrate and a side of the second light emitting device close to the substrate.

[0090] In a third aspect, an embodiment of the present application further provides a display device, comprising the display panel provided in the second aspect.

[0091] The embodiment of the present application provides a method for preparing a display panel, a display panel and a display device. The preparation method includes: forming an isolation material layer on one side of a substrate, and performing a first patterning process on the isolation material layer to form a first isolation opening on the isolation material layer; forming a stacked first light-emitting device material layer and a first packaging material layer on one side of the substrate, and performing a second patterning process on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first packaging part provided at the first isolation opening, and forming a second isolation opening on the isolation material layer; forming a stacked second light-emitting device material layer and a second packaging material layer on the side of the first packaging material layer away from the substrate and at the second isolation opening, and performing a third patterning process on the second packaging material layer and the second light-emitting device material layer to form a second light-emitting device and a second packaging part provided at the second isolation opening. In the present application, after forming the first light-emitting device material layer and the first packaging material layer on one side of the substrate, the first packaging material layer, the first light-emitting device material layer and the isolation material layer are directly subjected to a second patterning process to form a first light-emitting device and a first packaging part provided at the first isolation opening, and a second isolation opening is formed on the isolation material layer, so that the process of removing the first light-emitting device material layer and the first packaging material layer outside the area where the first isolation opening is located can be reduced, the mask plate can be reduced, and the production capacity can be saved. In addition, in the process of preparing the second light-emitting device, the first packaging material layer and the first light-emitting device material layer can protect the isolation material layer, reduce the risk of invasion of the drug solution in the subsequent preparation process, and thus improve the display effect of the prepared display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0092] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For different technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0093] Figure 1 A schematic flow chart of steps of a method for preparing a display panel provided in an embodiment;

[0094] Figure 2 A schematic flow chart of steps of a method for preparing a display panel provided in another embodiment;

[0095] Figure 3 A schematic flow chart of steps of a method for preparing a display panel provided in another embodiment;

[0096] Figure 4 A schematic flow chart of steps of a method for preparing a display panel provided in another embodiment;

[0097] Figure 5 A schematic flow chart of steps of a method for preparing a display panel provided in another embodiment;

[0098] Figure 6 A schematic flow chart of steps of a method for preparing a display panel provided in another embodiment;

[0099] Figure 7-Figure 14 for Figure 6 A schematic diagram of a cross-sectional structure of a display panel during a method for manufacturing the display panel shown;

[0100] Fig.15 is a schematic diagram of a cross-sectional structure of a display panel provided in an embodiment;

[0101] Fig.16 is a schematic cross-sectional structure diagram of a display panel provided in another embodiment;

[0102] Fig.17 is a schematic cross-sectional structure diagram of a display panel provided in another embodiment;

[0103] Fig.18 The diagram is a planar distribution diagram of a display panel provided in an embodiment.

[0104] 1. Pixel defining material layer; 2. Isolation structure material layer; 3. First light emitting device material layer; 4. First packaging material layer; 5. Second light emitting device material layer; 6. Second packaging material layer; 7. Third light emitting device material layer; 8. Third packaging material layer; 10. Display panel; 11. Substrate; 12. Isolation layer; 121. First isolation opening; 122. Second isolation opening; 123. First isolation structure; 124. Isolation structure layer; 1241. First isolation structure opening; 1241a. First isolation structure opening; 1242. Second isolation structure opening; 1243. First isolation structure opening; 1244. First isolation structure opening; 1245. First isolation structure opening; 1246. First isolation structure opening; 1247. First isolation structure opening; 1248. First isolation structure opening; 1249. First isolation structure opening; 1250. First isolation structure opening; 1251. First isolation structure opening; 1252. First isolation structure opening; 1253. First isolation structure opening; 1254. First isolation structure opening; 1255. First isolation structure opening; 1256. First isolation structure opening; 1257. First isolation structure opening; 1258. First isolation structure opening; 1259. First isolation structure opening; 1260. First isolation structure opening; 1261. First isolation structure opening; 1262. First isolation structure opening; 1263. First isolation structure opening; 1264. First isolation structure opening; 1265. First isolation structure opening; 1266. First isolation structure opening; 1267. First isolation structure opening; 1268. First isolation structure opening; 1269. First isolation structure opening; 1270. First isolation structure opening; 1271. First isolation structure opening; 1272. First isolation structure opening; 1273. First isolation structure 1241b, second insulator opening; 1241c, third insulator opening; 1242, second insulator structure opening; 1242a, fourth insulator opening; 1242b, fifth insulator opening; 1242c, sixth insulator opening; 1243, third insulator structure opening; 1243a, seventh insulator opening; 1243b, eighth insulator opening; 1243c, seventh insulator opening; 125, pixel defining layer; 1251, first pixel opening; 1252, second insulator structure opening; 1253, third insulator structure opening; 1254, fourth insulator opening; 1255, fifth insulator opening; 1256, sixth insulator opening; 1257, seventh insulator opening; 1258, eighth insulator opening; 1259, eighth insulator opening; 1260, seventh insulator opening; 1261, first pixel opening; 1262, fourth insulator opening; 1263, fifth insulator opening; 1264, sixth insulator opening; 1265, seventh insulator opening; 1266, eighth insulator opening; 1267, seventh insulator opening; 1268, eighth insulator opening; 1269, eighth insulator opening; 1270, eighth insulator opening; 1271, eighth insulator opening; 1272, eighth insulator opening; 1273, eighth insulator opening; 1274, eighth insulator opening; 1275, eighth insulator opening; 1276, eighth insulator opening; 1277, eighth insulator opening; 1278, eighth insulator opening; 1279, eighth insulator opening; 1280, eighth insulator opening; 1281, eighth insulator opening; 1 52, second pixel opening; 1253, third pixel opening; 126, third isolation opening; 127, second isolation structure; 13, light emitting device; 131, first light emitting device; 1311, first light emitting functional unit; 1312, first electrode; 132, second light emitting device; 1321, second light emitting functional unit; 1322, second electrode; 133, third light emitting device; 1331, third light emitting functional unit; 1332, third electrode; 14, encapsulation layer; 141, first encapsulation unit; 142. Second packaging part; 143. Third packaging part; 15. Covering layer; 151. First covering part; 1511. First sub-covering part; 1512. Second sub-covering part; 152. Second covering part; 1521. Third sub-covering part; 1522. Fourth sub-covering part; 153. Third covering part; 1531. Fifth sub-covering part; 1532. Sixth sub-covering part; 154. Fourth covering part; 1541. Seventh sub-covering part; 1542. Eighth sub-covering part; 16. Fourth electrode. DETAILED DESCRIPTION

[0105] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0106] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, they do not represent any order, quantity or importance, but are only used to distinguish different components. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present application, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element. "Include" or "comprising" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0107] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0108] In addition, in the specification, the phrase "planar distribution schematic diagram" refers to a drawing when the target part is observed from above, and the phrase "cross-sectional schematic diagram" or "cross-sectional structure schematic diagram" refers to a drawing when a section obtained by vertically cutting the target part is observed from the side.

[0109] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0110] Organic Light Emitting Diode (OLED) display panels are widely used due to their many advantages, such as light weight, active light emission, fast response speed, wide viewing angle, rich colors and high brightness, low power consumption, and resistance to high and low temperatures.

[0111] In the conventional technology, when preparing the light-emitting devices of each color in the display panel, a separate opening scheme is adopted to reduce the loss of the light-emitting devices prepared in the front to the light-emitting devices prepared in the back, which is conducive to improving the dark spots. However, after the first light-emitting device is evaporated, the relevant process of the second light-emitting device needs to be carried out, and after the second light-emitting device is evaporated, the relevant process of the third light-emitting device needs to be carried out. In this way, more mask plates are required, which will cause waste of production capacity, and the subsequent processes will increase the risk of dark spots.

[0112] In view of this, the embodiments of the present application provide a method for preparing a display panel, a display panel, and a display device. The preparation method includes: forming an isolation material layer on one side of a substrate, and performing a first patterning process on the isolation material layer to form a first isolation opening on the isolation material layer; forming a stacked first light-emitting device material layer and a first packaging material layer on one side of the substrate, and performing a second patterning process on the first packaging material layer, the first light-emitting device material layer, and the isolation material layer to form a first light-emitting device and a first packaging portion provided at the first isolation opening, and forming a second isolation opening on the isolation material layer; forming a stacked second light-emitting device material layer and a second packaging material layer on the side of the first packaging material layer away from the substrate, and at the second isolation opening, and performing a third patterning process on the second packaging material layer and the second light-emitting device material layer to form a second light-emitting device and a second packaging portion provided at the second isolation opening.

[0113] In the present application, after forming the first light-emitting device material layer and the first packaging material layer on one side of the substrate, the first packaging material layer, the first light-emitting device material layer and the isolation material layer are directly subjected to a second patterning process to form a first light-emitting device and a first packaging part provided at the first isolation opening, and a second isolation opening is formed on the isolation material layer, so that the process of removing the first light-emitting device material layer and the first packaging material layer outside the area where the first isolation opening is located can be reduced, the mask plate can be reduced, and the production capacity can be saved. In addition, in the process of preparing the second light-emitting device, the first packaging material layer and the first light-emitting device material layer can protect the isolation material layer, reduce the risk of invasion of the drug solution in the subsequent preparation process, and thus improve the display effect of the prepared display panel.

[0114] The composition, preparation and other contents of the isolation structure mentioned below are described in CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and PCT / CN2024 / 099073. Further description is provided in N117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0115] See also Figure 1 The present invention provides a method for manufacturing a display panel. The method comprises the following specific steps:

[0116] Step 100: forming an isolation material layer on one side of a substrate, and performing a first patterning process on the isolation material layer to form a first isolation opening on the isolation material layer.

[0117] A substrate is provided, which may be a substrate of an inorganic material, or a substrate of an organic material, or a composite substrate formed by stacking a substrate of an inorganic material and a substrate of an organic material. The isolation material layer may include multiple layers of isolation material, and the material of the isolation material layer may be an organic insulating material or a metal. This embodiment does not limit the number of layers and material of the substrate and the isolation material layer, as long as the function can be achieved.

[0118] An isolation material layer is formed by vapor deposition on the entire surface of one side of the substrate, a first mask is formed on the side of the isolation material layer facing away from the substrate, and a first patterning process is performed on the isolation material layer based on the first mask to form a first isolation opening on the isolation material layer.

[0119] Step 101: Form a stacked first light-emitting device material layer and a first packaging material layer on one side of the substrate, and perform a second patterning process on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first packaging portion provided in a first isolation opening, and form a second isolation opening on the isolation material layer.

[0120] The first light emitting device material layer may include multiple layers of light emitting materials. This embodiment does not limit the specific structure of the first light emitting device material layer as long as it can emit light of the first color of the display panel.

[0121] After forming the first isolation opening on the isolation material layer, the first light emitting device material layer is first formed on one side of the substrate, and then the first packaging material layer is formed on the side of the first light emitting device material layer away from the substrate. It can be understood that the first light emitting device material layer and the first packaging material layer that are interconnected are formed on the side of the isolation material layer away from the substrate and in the first isolation opening.

[0122] After forming the first light-emitting device material layer and the first packaging material layer on one side of the substrate, the first packaging material layer, the first light-emitting device material layer and the isolation material layer are subjected to a second patterning process to form a first light-emitting device provided at the first isolation opening and a first packaging portion of the first light-emitting device on the side away from the substrate, and an isolation layer may be formed, on which a second isolation opening is provided. In other words, a second mask is formed on the side of the first packaging material layer away from the substrate, and based on the second mask, the first packaging material layer, the first light-emitting device material layer and the isolation material layer are subjected to a second patterning process to form the first light-emitting device, the first packaging portion and the second isolation opening.

[0123] It can be understood that the formed isolation layer includes a first isolation opening and a second isolation opening, a first isolation structure is provided between the first isolation opening and the second isolation opening, and a stacked first light emitting device and a first packaging part are provided in the first isolation opening.

[0124] Step 102: forming a stacked second light-emitting device material layer and a second packaging material layer on a side of the first packaging material layer away from the substrate and at the second isolation opening, and performing a third patterning process on the second packaging material layer and the second light-emitting device material layer to form a second light-emitting device and a second packaging portion provided at the second isolation opening;

[0125] The second light emitting device material layer may include multiple layers of light emitting materials. This embodiment does not limit the specific structure of the second light emitting device material layer as long as it can emit light of the second color of the display panel.

[0126] After forming the second isolation opening on the isolation material layer, the second light-emitting device material layer is directly evaporated on the entire surface of one side of the substrate, and then the second packaging material layer is formed on the side of the second light-emitting device material layer facing away from the substrate. It can be understood that after forming the second isolation opening on the isolation material layer, one side of the substrate includes the first packaging part, the first packaging material layer and the second isolation opening, then the second light-emitting device material layer and the second packaging material layer are formed on the side of the first packaging part facing away from the substrate, the side of the first packaging material layer facing away from the substrate, and the second isolation opening.

[0127] After forming a second light-emitting device material layer and a second packaging material layer on one side of the substrate, a third mask plate is formed on the side of the second packaging material layer away from the substrate, and the second packaging material layer and the second light-emitting device material layer are subjected to a third patterning process based on the third mask plate to form a second light-emitting device and a second packaging part.

[0128] It is understandable that the second isolation opening is provided with a stacked second light emitting device and a second encapsulation part. The structure and material of the second encapsulation material layer may be the same as or different from the structure and material of the first encapsulation material layer.

[0129] The method for preparing a display panel provided in an embodiment of the present application is that after forming a first light-emitting device material layer and a first packaging material layer on one side of a substrate, the first packaging material layer, the first light-emitting device material layer and the isolation material layer are directly subjected to a second patterning process to form a first light-emitting device and a first packaging portion disposed at a first isolation opening, and a second isolation opening is formed on the isolation material layer, so that the process of removing the first light-emitting device material layer and the first packaging material layer outside the area where the first isolation opening is located can be reduced, the mask plate can be reduced, and production capacity can be saved. Moreover, in the process of preparing the second light-emitting device, the first packaging material layer and the first light-emitting device material layer can protect the isolation material layer, reduce the risk of intrusion of the drug solution in the subsequent preparation process, and thus improve the display effect of the prepared display panel.

[0130] In one embodiment, the substrate includes a first region and a second region, an orthographic projection of the first isolation opening on the substrate is located within the first region, and an orthographic projection of the second isolation opening on the substrate is located within the second region.

[0131] like Figure 2 As shown, a second patterning process is performed on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first packaging portion provided in the first isolation opening, and an implementation method of forming a second isolation opening on the isolation material layer, the steps of the implementation method include:

[0132] Step 200 : removing the first packaging material layer on the side away from the substrate and only located in the second area to form a first packaging part.

[0133] The second area refers to an area on the substrate where a second isolation opening is required. The first packaging material layer located in the second area and formed on the side of the first light-emitting device material layer away from the substrate is removed to form a first packaging part.

[0134] In an optional embodiment, a dry etching process is used to remove the first packaging material layer located in the second area on the side away from the substrate to form the first packaging portion.

[0135] Step 201 : removing the first light-emitting device material layer on the side away from the substrate and only located in the second region to form a first light-emitting device disposed in the first isolation opening.

[0136] After the first packaging material layer located in the second area is removed, the first light-emitting device material layer located in the second area will be exposed. The first light-emitting device material layer located in the second area formed on the side of the isolation material layer away from the substrate is removed, that is, the exposed first light-emitting device material layer located in the second area is removed, and a first light-emitting device is formed at the first isolation opening.

[0137] In an optional embodiment, a wet etching process is used to remove the first light-emitting device material layer located only in the second region and away from the substrate, so as to form a first light-emitting device disposed in the first isolation opening.

[0138] Step 202 : Etching the isolation material layer located in the second region to form a second isolation opening on the isolation material layer.

[0139] After removing the first light emitting device material layer located in the second region, the isolation material layer located in the second region is etched to form an isolation layer, wherein the isolation layer includes a second isolation opening.

[0140] In an optional embodiment, the isolation material layer located in the second region is etched using a dry etching process and a wet etching process to form a second isolation opening on the isolation material layer;

[0141] In an optional embodiment, the first light-emitting device material layer includes a stacked first light-emitting functional material layer and a first electrode material layer, the first light-emitting device includes a first light-emitting functional portion formed by the first light-emitting device material layer and a first electrode formed by the first electrode material layer, and the first light-emitting functional portion includes one or more of a stacked hole injection layer, a hole transport layer, a hole blocking layer, an electron transport layer, and an electron injection layer. The first electrode is a cathode.

[0142] In the above embodiment, after forming the first light-emitting device material layer and the first packaging material layer on one side of the substrate, the second isolation opening is directly formed in the second area, so that there is no need to use a mask plate to remove the first packaging material layer and the first light-emitting device material layer in other areas except the first area, which can reduce the number of masks and save production capacity. In addition, the first packaging material layer and the first light-emitting device material layer can protect the isolation material layer, reduce the risk of intrusion of the drug solution in the subsequent preparation process, and thus improve the display effect of the prepared display panel.

[0143] In one embodiment, a third patterning process is performed on the second packaging material layer and the second light-emitting device material layer to form a second light-emitting device and a second packaging portion provided in the second isolation opening, and the implementation method includes:

[0144] The second packaging material layer and the second light emitting device material layer on the side away from the substrate except those located in the second region are removed to form a second light emitting device and a second packaging part provided in the second isolation opening.

[0145] After forming a second light-emitting device material layer and a second packaging material layer on one side of the substrate, first remove the second packaging material layer on the side away from the substrate and located in other areas except the second area, that is, only retain the second packaging material layer located in the second area, and then remove the second light-emitting device material layer on the side away from the substrate and located in other areas except the second area, that is, only retain the second light-emitting device material layer located in the second area, so as to form a second light-emitting device arranged at the second isolation opening and a second packaging portion of the second light-emitting device on the side away from the substrate, thereby exposing the first light-emitting device arranged at the first isolation opening.

[0146] In an optional embodiment, the second light-emitting device material layer includes a stacked second light-emitting functional material layer and a second electrode material layer, the second light-emitting device includes a second light-emitting functional portion formed by the second light-emitting functional material layer and a second electrode formed by the second electrode material layer, and the second light-emitting functional portion includes one or more of a stacked hole injection layer, a hole transport layer, a hole blocking layer, an electron transport layer, and an electron injection layer. The second electrode is a cathode.

[0147] In an optional embodiment, a dry etching process is used to remove the second packaging material layer on the side facing away from the substrate and in other areas except the second area.

[0148] In an optional embodiment, a wet etching process is used to remove the second light emitting device material layer in the area other than the second area and away from the substrate. Specifically, a wet etching process is used to remove the second light emitting functional material layer and the second electrode material layer in the area other than the second area.

[0149] In one embodiment, a first packaging material layer, a first light-emitting device material layer, and an isolation material layer are subjected to a second patterning process to form a first light-emitting device and a first packaging portion provided in a first isolation opening, and an implementation method of forming a second isolation opening on the isolation material layer includes:

[0150] The first packaging material layer, the first light-emitting device material layer and the isolation material layer are subjected to a second patterning process to form a first light-emitting device, a first packaging portion and a first covering portion connected to the first light-emitting device arranged in the first isolation opening, and a second isolation opening is formed on the isolation material layer.

[0151] It can be understood that after the first packaging material layer, the first light-emitting device material layer and the isolation material layer are subjected to the second patterning treatment, not only the first light-emitting device, the first packaging part and the second isolation opening can be formed, but also a first covering part connected to the first light-emitting device and the first packaging part can be formed.

[0152] The first covering portion includes a first sub-covering portion disposed on a side of the first isolation structure facing away from the substrate between the first isolation opening and the second isolation opening, and a second sub-covering portion disposed on a side wall of the first isolation structure corresponding to the first isolation opening.

[0153] That is, the first covering portion extends along the side wall of the first isolation structure close to the first isolation opening to a side of the first isolation structure facing away from the substrate.

[0154] In one embodiment, the first covering portion includes a redundant device material layer located on the first light emitting device material layer and a first encapsulation sub-portion connected to the first encapsulation portion.

[0155] During the second patterning process of the first packaging material layer, the first light-emitting device material layer and the isolation material layer, part of the first light-emitting device material layer (that is, a redundant first light-emitting device material layer is included on the side of the first isolation structure away from the substrate) and the first packaging sub-portion will remain on the side of the first isolation structure away from the substrate, forming a first covering portion.

[0156] In the above embodiment, when the first packaging material layer, the first light-emitting device material layer and the isolation material layer are subjected to the second patterning process, not only the first light-emitting device, the first packaging part and the second isolation opening can be formed, but also the first covering part connected to the first light-emitting device and the first packaging part can be formed. The formed first covering part can protect the first isolation structure and the first light-emitting device, reduce the risk of intrusion of the drug solution in the subsequent preparation process, and thus improve the display effect of the prepared display panel.

[0157] In one embodiment, a third patterning process is performed on the second packaging material layer and the second light-emitting device material layer to form a second light-emitting device and a second packaging portion provided in the second isolation opening, and the implementation method includes:

[0158] The second packaging material layer and the second light emitting device material layer are subjected to a third patterning process to form a second light emitting device and a second packaging portion provided in the second isolation opening, and a second covering portion connected to the second light emitting device and the second packaging portion.

[0159] It is understandable that after the second packaging material layer and the second light-emitting device material layer are subjected to the third patterning process, not only the second light-emitting device and the second packaging part can be formed, but also the second covering part connected to the second light-emitting device and the second packaging part can be formed.

[0160] The second covering portion includes a third sub-covering portion disposed on a side of the first isolation structure away from the substrate, and a fourth sub-covering portion disposed on a side wall of the first isolation structure corresponding to the second isolation opening.

[0161] That is, the second covering portion extends along the side wall of the first isolation structure close to the second isolation opening to a side of the first isolation structure facing away from the substrate.

[0162] In an optional embodiment, the second covering portion includes a redundant device material layer located on the second light-emitting device material layer and a second encapsulation sub-portion connected to the second encapsulation portion.

[0163] During the third patterning process of the second packaging material layer and the second light-emitting device material layer, the second light-emitting device material layer (that is, a redundant second light-emitting device material layer is included on the side of the first isolation structure away from the substrate) and the second packaging sub-portion will remain on the side of the first isolation structure away from the substrate, forming a second covering portion.

[0164] In one embodiment, along the thickness direction of the substrate, a distance between the first sub-covering portion and the substrate is smaller than a distance between the third sub-covering portion and the substrate.

[0165] The first sub-covering portion includes a first side surface close to the substrate and a second side surface away from the substrate, and similarly, the third sub-covering portion includes a third side surface close to the substrate and a fourth side surface away from the substrate. Along the thickness direction of the substrate, the distance between the first side surface and the substrate is smaller than the distance between the third side surface and the substrate, and the distance between the second side surface and the substrate is smaller than the distance between the fourth side surface and the substrate.

[0166] In one embodiment, the third sub-covering portion is located on a side of a portion of the first sub-covering portion facing away from the substrate.

[0167] That is to say, there is a region where the orthographic projection of the third sub-covering portion on the substrate and the orthographic projection of the first sub-covering portion on the substrate partially overlap with each other.

[0168] In the above embodiment, after the second packaging material layer and the second light-emitting device material layer are subjected to the third patterning process, not only the second light-emitting device and the second packaging part can be formed, but also the second covering part connected to the second light-emitting device and the second packaging part can be formed. The formed second covering part can protect the first isolation structure and the second light-emitting device, reduce the risk of intrusion of the drug solution in the subsequent preparation process, and thus improve the display effect of the prepared display panel.

[0169] In one embodiment, the display panel may include three light emitting devices, and after forming the first light emitting device and the second light emitting device, the third light emitting device may be formed. Figure 3 As shown, the preparation method also includes:

[0170] Step 300: Perform a fourth patterning process on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a third isolation opening on the isolation material layer.

[0171] A fourth mask is disposed on the first packaging material layer, and a fourth patterning process is performed on the first packaging material layer, the first light emitting device material layer and the isolation material layer based on the fourth mask, so that a third isolation opening can be formed on the isolation material layer.

[0172] It can be understood that the formed isolation layer includes a first isolation opening, a second isolation opening and a third isolation opening, a first isolation structure is provided between the first isolation opening and the second isolation opening, and a second isolation structure is provided between the second isolation opening and the third isolation opening.

[0173] Step 301: Form a stacked third light-emitting device material layer and a third packaging material layer on one side of a substrate.

[0174] The third light emitting device material layer may include multiple layers of light emitting materials. This embodiment does not limit the specific structure of the first light emitting device material layer, as long as it can emit light of the third color of the display panel.

[0175] After forming the third isolation opening on the isolation material layer, the third light-emitting device material layer is first vapor-deposited on the entire surface of one side of the substrate, and then the third packaging material layer is vapor-deposited on the entire surface of the third light-emitting device material layer away from the substrate. It can be understood that the same connected third light-emitting device material layer and third packaging material layer are formed on the side of the first packaging part away from the substrate, the side of the first covering part away from the substrate, the side of the second covering part away from the substrate, the side of the second packaging part away from the substrate and the third isolation opening. The structure and material of the third packaging material layer can be the same as or different from the structure and material of the first packaging material layer.

[0176] Step 302: Perform a fifth patterning process on the third packaging material layer and the third light-emitting device material layer to form a third light-emitting device and a third packaging portion disposed in the third isolation opening.

[0177] After forming a third light-emitting device material layer and a third packaging material layer on one side of the substrate, a fifth mask plate is set on the side of the third packaging material layer away from the substrate. Based on the fifth mask plate, the third packaging material layer and the third light-emitting device material layer are subjected to a fifth patterning process to form a third light-emitting device and a third packaging part arranged in the third isolation opening.

[0178] In an optional embodiment, the third light-emitting device material layer includes a stacked third light-emitting functional material layer and a third electrode material layer, the third light-emitting device includes a third light-emitting functional portion and a third electrode, and the third light-emitting functional portion includes one or more of a stacked hole injection layer, a hole transport layer, a hole blocking layer, an electron transport layer, and an electron injection layer. The third electrode is a cathode.

[0179] In the above embodiment, the first packaging material layer, the first light-emitting device material layer and the isolation material layer are subjected to a fourth patterning treatment to form a third isolation opening on the isolation material layer; a third light-emitting device material layer and a third packaging material layer are formed on one side of the substrate, and the third packaging material layer and the third light-emitting device material layer are subjected to a fifth patterning treatment to form a third light-emitting device and a third packaging portion arranged in the third isolation opening. The display panel prepared in this way can emit three different colors of light, thereby improving the display performance of the prepared display panel.

[0180] In one embodiment, the substrate includes a third region, and an orthographic projection of the third isolation opening on the substrate is located within the range of the third region.

[0181] like Figure 4 As shown, a fourth patterning process is performed on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a third isolation opening on the isolation material layer. The steps of the implementation method include:

[0182] Step 400 : removing the first packaging material layer on the side facing away from the substrate and only located in the third area.

[0183] The third region refers to a region on the substrate where a third isolation opening is required, and the first packaging material layer located in the third region is removed from the first packaging material layer formed on the side of the first light-emitting device material layer away from the substrate.

[0184] In an optional embodiment, a dry etching process is used to remove the first packaging material layer on the side away from the substrate and only located in the third area.

[0185] Step 401: remove the first light-emitting device material layer on the side away from the substrate and only located in the third area.

[0186] After removing the first packaging material layer located in the third area, the first light-emitting device material layer located in the third area will be exposed. The first light-emitting device material layer located in the third area formed on the side of the isolation material layer away from the substrate is removed, that is, the exposed first light-emitting device material layer located in the third area is removed.

[0187] In an optional embodiment, a wet etching process is used to remove the first light-emitting device material layer located only in the third region. Specifically, a wet etching process is used to remove the first light-emitting functional material layer and the first electrode material layer located in the third region.

[0188] Step 402 : Etching the isolation material layer located only in the third region to form a third isolation opening on the isolation material layer.

[0189] After removing the first light emitting device material layer located in the third region, the isolation material layer located in the third region is etched to form a third isolation opening on the isolation material layer.

[0190] In an optional embodiment, a dry etching process and a wet etching process are used to remove the isolation material layer located only in the third region.

[0191] In one embodiment, a third packaging material layer and a third light-emitting device material layer are subjected to a fifth patterning process to form a third light-emitting device and a third packaging portion disposed in a third isolation opening, comprising:

[0192] The third encapsulation material layer and the third light-emitting device material layer on the side facing away from the substrate except those located outside the third region are removed to form a third light-emitting device and a third encapsulation part.

[0193] After forming a third light-emitting device material layer and a third packaging material layer on one side of the substrate, the third packaging material layer and the third light-emitting device material layer formed in other areas except the third area on one side of the substrate are removed (that is, only the third packaging material layer and the third light-emitting device material layer located in the third area are retained), so as to form a third light-emitting device arranged in the third isolation opening, and a third packaging part arranged on the side of the third light-emitting device away from the substrate.

[0194] In one embodiment, a fourth patterning process is performed on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form a third isolation opening on the isolation material layer, and the implementation method includes:

[0195] The first encapsulation material layer, the first light emitting device material layer and the isolation material layer are subjected to a fourth patterning process to form a third covering portion and a third isolation opening on the isolation material layer.

[0196] It is understandable that after the fourth patterning process is performed on the first packaging material layer, the first light-emitting device material layer and the isolation material layer, not only a third isolation opening can be formed, but also a third covering portion can be formed, and the third covering portion can be connected to the second light-emitting device and the second packaging portion.

[0197] The third covering portion includes a fifth sub-covering portion disposed on a side of the second isolation structure facing away from the substrate between the second isolation opening and the third isolation opening, and a sixth sub-covering portion disposed on a side wall of the second isolation structure corresponding to the second isolation opening.

[0198] That is, the third covering portion extends along the side wall of the second isolation structure close to the second isolation opening to a side of the second isolation structure facing away from the substrate.

[0199] In one embodiment, the third covering portion includes a redundant device material layer located at the first light emitting device material layer, a redundant device material layer located at the second light emitting device material layer and a redundant encapsulation material layer located at the first encapsulation material layer, and a third encapsulation sub-portion connected to the second encapsulation portion.

[0200] During the fourth patterning process of the first packaging material layer, the first light-emitting device material layer and the isolation material layer, the first light-emitting device material layer, the first packaging material layer, the second light-emitting device material layer (that is, the second isolation structure on the side away from the substrate includes a redundant first light-emitting device material layer, a redundant second light-emitting device material layer and a redundant first packaging material layer) and a third packaging sub-section connected to the second packaging section will remain on the side of the second isolation structure away from the substrate.

[0201] In the above embodiment, after the first packaging material layer, the first light-emitting device material layer and the isolation material layer are subjected to the fourth patterning process, not only the third isolation opening can be formed, but also the third covering portion can be formed. The formed third covering portion can be formed on the second isolation structure and the second light-emitting device, thereby reducing the risk of intrusion of the drug solution in the subsequent preparation process, thereby improving the display effect of the prepared display panel.

[0202] In one embodiment, a third packaging material layer and a third light-emitting device material layer are subjected to a fifth patterning process to form a third light-emitting device and a third packaging portion disposed in a third isolation opening. The implementation method includes:

[0203] The third encapsulation material layer and the third light emitting device material layer are subjected to a fifth patterning process to form a third light emitting device and a third encapsulation part, and a fourth covering part connected to the third light emitting device and the third encapsulation part.

[0204] It is understandable that after the third encapsulation material and the third light-emitting device material layer are subjected to the fifth patterning process, not only the third light-emitting device and the third encapsulation part can be formed, but also a fourth covering part connected to the third light-emitting device and the third encapsulation part can be formed.

[0205] The fourth covering portion includes a seventh sub-covering portion disposed on a side of the second isolation structure facing away from the substrate, and an eighth sub-covering portion disposed on a side wall of the second isolation structure corresponding to the third isolation opening.

[0206] That is, the fourth covering portion extends along the side wall of the second isolation structure close to the third isolation opening to a side of the second isolation structure facing away from the substrate.

[0207] In an optional embodiment, the fourth covering portion includes a redundant device material layer located in the third light-emitting device material layer, and a fourth encapsulation sub-portion connected to the third encapsulation portion.

[0208] During the fifth patterning process of the third packaging material layer and the third light-emitting device material layer, a third light-emitting device material layer will remain on the side of the second isolation structure facing away from the substrate (that is, a redundant third light-emitting device material layer is included on the side of the second isolation structure facing away from the substrate), and a fourth packaging sub-part connected to the third packaging part, thereby forming a fourth covering part.

[0209] In one embodiment, along the thickness direction of the substrate, a distance between the fifth sub-covering portion and the substrate is smaller than a distance between the seventh sub-covering portion and the substrate.

[0210] The fifth sub-covering portion includes a fifth side surface close to the substrate and a sixth side surface away from the substrate. Similarly, the seventh sub-covering portion includes a seventh side surface close to the substrate and an eighth side surface away from the substrate. Along the thickness direction of the substrate, the distance between the fifth side surface and the substrate is smaller than the distance between the seventh side surface and the substrate, and the distance between the sixth side surface and the substrate is smaller than the distance between the eighth side surface and the substrate.

[0211] In one embodiment, the seventh sub-covering portion is located on a side of a portion of the fifth sub-covering portion facing away from the substrate.

[0212] That is to say, there is an overlapping area between the orthographic projection of the seventh sub-covering portion on the substrate and the orthographic projection of the fifth sub-covering portion on the substrate.

[0213] In one embodiment, the isolation material layer may include a pixel defining material layer and an isolation structure material layer. In this case, Figure 5 As shown, an implementation method involves forming an isolation material layer on one side of a substrate and performing a first patterning process on the isolation material layer to form a first isolation opening on the isolation material layer, the implementation method comprising:

[0214] Step 500: forming a stacked pixel definition material layer and an isolation structure material layer on one side of a substrate.

[0215] First, a pixel definition material layer is vapor-deposited on the entire surface of one side of the substrate, and then an isolation structure material layer is vapor-deposited on the entire surface of the pixel definition material layer away from the substrate, so as to form an isolation material layer disposed on one side of the substrate.

[0216] Step 501, performing a first patterning process on the isolation structure material layer and the pixel definition material layer to form a first isolation structure opening on the isolation structure material layer and a first pixel opening on the pixel definition material layer; the orthographic projection of the first pixel opening on the substrate is located within the orthographic projection of the first isolation structure opening on the substrate.

[0217] A first mask is formed on the side of the isolation structure material layer facing away from the substrate, and a first patterning process is performed on the isolation material layer and the pixel definition material layer based on the first mask to form a first isolation structure opening on the isolation structure material layer and a first pixel opening on the pixel definition material layer. The first isolation opening includes a first pixel opening and a first isolation structure opening.

[0218] In an optional embodiment, photoresist can be coated on the side of the isolation structure material layer facing away from the substrate, and the isolation structure material layer is first subjected to a first sub-patterning process using a first sub-mask plate to form a first isolation structure opening on the isolation structure material layer; and then a second sub-mask plate is used to perform a second sub-patterning process on the pixel defining material layer to form a first pixel opening on the pixel defining material layer, thereby forming a first isolation opening.

[0219] In one embodiment, the first isolation structure opening formed on the isolation structure material layer may include a first isolation sub-opening, a second isolation sub-opening and a third isolation sub-opening, and the second isolation sub-opening is located between the first isolation sub-opening and the third isolation sub-opening. That is to say, along the thickness direction of the display panel, the first isolation sub-opening, the second isolation sub-opening and the third isolation sub-opening are sequentially formed on the isolation structure material layer. The orthographic projection of the first isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate, and the orthographic projection of the third isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate.

[0220] It can be understood that, along the direction perpendicular to the thickness direction of the display panel, the distance between the side walls of the isolation structure material layer on both sides of the second insulator opening is greater than the distance between the side walls of the isolation structure material layer on both sides of the first insulator opening, and the distance between the side walls of the isolation structure material layer on both sides of the second insulator opening is greater than the distance between the side walls of the isolation structure material layer on both sides of the third insulator opening.

[0221] In an optional embodiment, the orthographic projection of the first insulator opening on the substrate may coincide with the orthographic projection of the third insulator opening on the substrate; the orthographic projection of the third insulator opening on the substrate may also be located within the orthographic projection of the first insulator opening on the substrate.

[0222] In an optional embodiment, the first isolation structural material layer includes three stacked structural material layers, a first isolation sub-opening is formed on the first structural material layer, a second isolation sub-opening is formed on the second structural material layer, and a third isolation sub-opening is formed on the third structural material layer.

[0223] In one embodiment, when a pixel defining material layer and an isolation structure material layer are formed on one side of a substrate, a second patterning process is performed on a first packaging material layer, a first light-emitting device material layer, and an isolation material layer to form a first light-emitting device and a first packaging portion provided in a first isolation opening, and an implementation method of forming a second isolation opening on the isolation material layer, the implementation method comprising:

[0224] The first packaging material layer, the first light-emitting device material layer, the isolation structure material layer and the pixel defining material layer are subjected to a second patterning process to form a first light-emitting device and a first packaging portion provided at the first isolation structure opening and the first pixel opening, and a second isolation structure opening is formed on the isolation structure material layer, and a second pixel opening is formed on the pixel defining material layer; the orthographic projection of the second pixel opening on the substrate is located within the orthographic projection of the second isolation structure opening on the substrate.

[0225] After forming a first light-emitting device material layer and a first packaging material layer on one side of the substrate, a second mask plate is set on the side of the first packaging material layer away from the substrate, and the first packaging material layer, the first light-emitting device material layer, the isolation structure material layer and the pixel definition material layer are subjected to a second patterning process based on the second mask plate, so as to form a first light-emitting device and a first packaging part arranged at the first isolation structure opening and the first pixel opening, form a second isolation structure opening on the isolation structure material layer, and form a second pixel opening on the pixel definition material layer.

[0226] The description of the second pixel opening and the second isolation structure opening may refer to the specific description of the first pixel opening and the first isolation structure opening in the above example, and will not be repeated here.

[0227] It can be understood that the prepared display panel includes a pixel defining layer and an isolation structure layer, the pixel defining layer is provided with a first pixel opening and a second pixel opening, and the isolation structure layer is provided with a first isolation structure opening and a second isolation structure opening.

[0228] In an optional embodiment, an implementation method involving performing a second patterning process on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first packaging portion provided in the first isolation opening, and forming a second isolation opening on the isolation material layer may include:

[0229] Removing the first packaging material layer on the side facing away from the substrate and only located in the second area to form a first packaging part;

[0230] Removing the first light-emitting device material layer on the side away from the substrate and only located in the second area to form a first light-emitting device disposed in the first isolation opening;

[0231] Etching the isolation structure material layer located only in the second region to form a second isolation structure opening on the isolation structure material layer;

[0232] The pixel definition material layer located only in the second area is etched to form a second pixel opening on the pixel definition material layer.

[0233] Optionally, a dry etching process is used to remove the first packaging material layer located only in the second area.

[0234] Optionally, a wet etching process is used to remove the first light-emitting device material layer located only in the second area;

[0235] Optionally, a dry etching process and a wet etching process are used to etch the isolation structure material layer located only in the second region.

[0236] In an optional embodiment, after etching the isolation structure material layer located only in the second area, the applied photoresist is stripped off. Photoresist is applied on the side away from the substrate, and the pixel definition material layer located in the second area is etched based on the corresponding mask plate to form a second pixel opening on the pixel definition material layer.

[0237] In the above embodiment, the isolation material layer formed on one side of the substrate includes a pixel defining material layer and an isolation structure material layer that are sequentially evaporated, and the first isolation opening formed includes a first pixel opening and a first isolation structure opening, and the second isolation opening includes a second pixel opening and a second isolation structure opening. The setting of such an isolation layer can provide a display effect of the display panel.

[0238] In an optional embodiment, when the isolation material layer formed on one side of the substrate includes a pixel defining material layer and an isolation structure material layer, the formed third isolation opening may include a third pixel opening and a third isolation structure opening. The description of the third pixel opening and the third isolation structure opening can refer to the specific description of the first pixel opening and the first isolation structure opening, which will not be repeated here.

[0239] In one embodiment, the preparation method further comprises:

[0240] A plurality of fourth electrodes are formed on one side of the substrate, and the plurality of fourth electrodes are respectively arranged on a side of the first light emitting device close to the substrate and a side of the second light emitting device close to the substrate.

[0241] Before forming the isolation material layer on one side of the substrate, a plurality of fourth electrodes are formed on one side of the substrate. Specifically, a fourth electrode material layer can be evaporated on the entire surface of one side of the substrate, and the fourth electrode material layer can be subjected to corresponding patterning to form a plurality of fourth electrodes. The plurality of fourth electrodes are respectively arranged on the side of the first light-emitting device close to the substrate and the side of the second light-emitting device close to the substrate. In other words, a fourth electrode is arranged on the first area of ​​the substrate, and a fourth electrode is arranged on the second area of ​​the substrate. The fourth electrode is an anode.

[0242] In an optional embodiment, when the prepared display panel includes a third light emitting device, the fourth electrode is also disposed on a side of the third light emitting device close to the substrate. That is, the fourth electrode is disposed in the third region of the substrate.

[0243] It should be noted that in the method for preparing the display panel provided in the embodiment of the present application, each film layer can be prepared by sputtering, chemical vapor deposition (CVD), vacuum deposition, pulsed laser deposition (PLD), atomic layer deposition (ALD), etc. The CVD method includes plasma enhanced chemical vapor deposition (PECVD), laser chemical vapor deposition (LCVD), low pressure chemical vapor deposition (LPCVD), etc.

[0244] In one embodiment, reference Figure 6 Flowchart of Figure 7-Figure 14 The present application provides a method for preparing a display panel, and the steps of the preparation method include:

[0245] Step 600: forming a pixel defining material layer 1 and an isolation structure material layer 2 on one side of the substrate 11, removing the isolation structure material layer 2 and the pixel defining material layer 1 located in the first area A, so as to form a first isolation structure opening 1241 on the isolation structure material layer 2, and forming a first pixel opening 1251 on the pixel defining material layer 1; Figure 7 shown.

[0246] The display panel includes a first area A, a second area B and a third area C. The corresponding position of the first area A is used to set the first light-emitting device 131, the corresponding position of the second area B is used to set the second light-emitting device 132, and the corresponding position of the third area C is used to set the third light-emitting device 133.

[0247] Step 601: forming a first light emitting device material layer 3 and a first packaging material layer 4 on one side of the substrate 11; Figure 8 shown.

[0248] Step 602, removing the first packaging material layer 4, the first light-emitting device material layer 3, the isolation structure material layer 2 and the pixel definition material layer 1 located only in the second area B, so as to form a second isolation structure opening 1242 on the isolation structure material layer 2, form a second pixel opening 1252 on the pixel definition material layer 1, form a first light-emitting device 131 and a first packaging portion 141 provided at the first isolation structure opening 1241 and the first pixel opening 1251, and form a first covering portion 151 connected to the first light-emitting device 131 and the first packaging portion 141; Fig. 9 shown.

[0249] A first isolation structure 123 is disposed between the first isolation structure opening 1241 and the second isolation structure opening 1242 .

[0250] Step 603: forming a second light emitting device material layer 5 and a second packaging material layer 6 on one side of the substrate 11; Fig.10 shown.

[0251] Step 604: remove the second packaging material layer 6 and the second light-emitting device material layer 5 except those located in the second region B, to form a second light-emitting device 132 and a second packaging portion 142, and a second covering portion 152 connected to the second light-emitting device 132 and the second packaging portion 142; Fig.11 shown.

[0252] Step 605: remove the first encapsulation material layer 4, the first light-emitting device material layer 3, the isolation structure material layer 2 and the pixel definition material layer 1 located only in the third region C, so as to form a third isolation structure opening 1243 on the isolation structure material layer 2, and form a second pixel opening 1253 and a third covering portion 153 on the pixel definition material layer 1; Fig.12 shown.

[0253] A second isolation structure 127 is disposed between the second isolation structure opening 1242 and the third isolation structure opening 1243 .

[0254] Step 606: forming a third light emitting device material layer 7 and a third packaging material layer 8 on one side of the substrate 11; Fig.13 shown.

[0255] Step 607: remove the third encapsulation material layer 8 and the third light emitting device material layer 7 except those located in the third region C, and form a third light emitting device 133 and a third encapsulation portion 143, and a fourth covering portion 154 connected to the third light emitting device 133 and the third encapsulation portion 143. Fig.14 shown.

[0256] It should be understood that, although the various steps in the flowchart in the figure are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps is not strictly limited in order, and these steps can be executed in other orders. Moreover, at least a part of the steps in the figure may include a plurality of sub-steps or a plurality of stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these sub-steps or stages is not necessarily carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps.

[0257] In one embodiment, Fig.15 As shown, the present application provides a display panel 10, and the display panel 10 includes:

[0258] substrate 11;

[0259] The isolation layer 12 is disposed on one side of the substrate 11 and is provided with a first isolation opening 121 and a second isolation opening 122 , and a first isolation structure 123 between the first isolation opening 121 and the second isolation opening 122 ;

[0260] The light emitting device 13 includes a first light emitting device 131 disposed in the first isolation opening 121 and a second light emitting device 132 disposed in the second isolation opening 122;

[0261] The encapsulation layer 14 includes a first encapsulation portion 141 disposed on a side of the first light emitting device 131 away from the substrate 11, and a second encapsulation portion 142 disposed on a side of the second light emitting device 132 away from the substrate 11;

[0262] The covering layer 15 includes a first covering portion 151 connected to the first light emitting device 131 and the first packaging portion 141, and a second covering portion 152 connected to the second light emitting device 132 and the second packaging portion 142. The first covering portion 151 includes a first sub-covering portion 1511 provided on the side of the first isolation structure 123 away from the substrate 11, and a second sub-covering portion 1512 provided on the side wall of the first isolation structure 123 corresponding to the first isolation opening 121; the second covering portion 152 includes a third sub-covering portion 1521 provided on the side of the first isolation structure 123 away from the substrate 11, and a fourth sub-covering portion 1522 provided on the side wall of the first isolation structure 123 corresponding to the second isolation opening 122.

[0263] Along the thickness direction of the substrate 11 , the distance between the first sub-covering portion 1511 and the substrate 11 is smaller than the distance between the third sub-covering portion 1521 and the substrate 11 .

[0264] It can be understood that the display panel 10 includes a substrate 11, an isolation layer 12, a light emitting device 13, an encapsulation layer 14 and a cover layer 15. The isolation layer 12 is provided with a first isolation opening 121 and a second isolation opening 122, and a first isolation structure 123 between the first isolation opening 121 and the second isolation opening 122. A first light emitting device 131 is provided at the first isolation opening 121, and a second light emitting device 132 is provided at the second isolation opening 122. The first light emitting device 131 and the second light emitting device 132 can emit light of different colors.

[0265] A first sub-covering portion 1511 and a third sub-covering portion 1521 are disposed on a side of the first isolation structure 123 facing away from the substrate. A second sub-covering portion 1512 and a fourth sub-covering portion 1522 are disposed on the sidewalls of the first isolation structure 123. For the description of the first sub-covering portion 1511, the second sub-covering portion 1512, the third sub-covering portion 1521 and the fourth sub-covering portion 1522, reference may be made to the specific description in the above embodiment, which will not be repeated here.

[0266] The display panel 10 provided in the embodiment of the present application includes a substrate 11, an isolation layer 12, a light-emitting device 13, an encapsulation layer 14 and a covering layer 15. The isolation layer 12 is arranged on one side of the substrate 11, and is provided with a first isolation opening 121 and a second isolation opening 122, and a first isolation structure 123 between the first isolation opening 121 and the second isolation opening 122; the light-emitting device 13 includes a first light-emitting device 131 arranged at the first isolation opening 121 and a second light-emitting device 132 arranged at the second isolation opening 122; the encapsulation layer 14 includes a first encapsulation portion 141 arranged at a side of the first light-emitting device 131 away from the substrate 11 and a second encapsulation portion 142 arranged at a side of the second light-emitting device 132 away from the substrate 11; the covering layer 15 includes a first covering portion 151 connected to the first light-emitting device 131 and the first encapsulation portion 141, and a second covering portion 152 connected to the second light-emitting device 132 and the second encapsulation portion 142. In the process of preparing the display panel 10 provided in this embodiment, after the first light-emitting device 131 is formed, the first light-emitting device material layer in other regions except the first region on the substrate 11 is not removed, and the second light-emitting device material layer is directly prepared, so that the covering layer 15 can be formed. In this way, in the process of preparing the display panel 10, the use of mask plates can be reduced, the production capacity can be saved, and the display panel 10 has higher practicality.

[0267] In one embodiment, Figure 12-Figure 15 As shown, the first covering portion 151 includes a redundant device material layer located in the first light emitting device material layer and a first encapsulation sub-portion connected to the first encapsulation portion 141 .

[0268] The second covering portion 152 includes a redundant device material layer located at the second light emitting device material layer and a second encapsulation sub-portion connected to the second encapsulation portion 142 .

[0269] Optionally, the third sub-covering portion 1521 is located on a side of the portion of the first sub-covering portion 1511 facing away from the substrate 11 .

[0270] For the description of the first covering portion 151 , the second covering portion 152 , the third sub-covering portion 1521 and the first sub-covering portion 1511 , reference may be made to the specific description in the above embodiments, which will not be repeated herein.

[0271] In one embodiment, Fig.16 As shown, the first light emitting device 131 includes a first light emitting function portion 1311 and a first electrode 1312 , and the second light emitting device 132 includes a second light emitting function portion 1321 and a second electrode 1322 .

[0272] For the description of the first light emitting functional portion 1311 and the first electrode 1312 , and the second light emitting functional portion 1321 and the second electrode 1322 , reference may be made to the specific description in the above embodiments, and will not be repeated herein.

[0273] In the above embodiment, the provision of the cover layer 15 can protect the first light emitting device 131 , the second light emitting device 132 and the first isolation structure 123 , thereby improving the service life and display effect of the display panel 10 .

[0274] In one embodiment, Figure 7-Figure 16 As shown, the isolation layer 12 includes an isolation structure layer 124 and a pixel defining layer 125 . The pixel defining layer 125 is disposed on one side of the substrate 11 , and the isolation structure layer 124 is disposed on a side of the pixel defining layer 125 away from the substrate 11 .

[0275] The pixel defining layer 125 is provided with a first pixel opening 1251 and a second pixel opening 1252, and the isolation structure layer 124 is provided with a first isolation structure opening 1241 and a second isolation structure opening 1242. That is, in the case where the isolation layer 12 includes the isolation structure layer 124 and the pixel defining layer 125, the first isolation opening 121 provided in the isolation layer 12 includes the first isolation structure opening 1241 and the first pixel opening 1251, and the second isolation opening 122 includes the second isolation structure opening 1242 and the second pixel opening 1252.

[0276] The orthographic projection of the first pixel opening 1251 on the substrate 11 is located within the orthographic projection of the first isolation structure opening 1241 on the substrate 11 , and the orthographic projection of the second pixel opening 1252 on the substrate 11 is located within the orthographic projection of the second isolation structure opening 1242 on the substrate 11 .

[0277] For the description of the first pixel opening 1251 , the second pixel opening 1252 , the first isolation structure opening 1241 , and the second isolation structure opening 1242 , reference may be made to the specific description in the above embodiments, which will not be repeated herein.

[0278] In an optional embodiment, if Figure 7-Figure 17 As shown, for the first isolation structure opening 1241 in the isolation structure layer 124, the first isolation structure opening 1241 includes a first isolation sub-opening 1241a, a second isolation sub-opening 1241b and a third isolation sub-opening 1241c. The orthographic projection of the first isolation sub-opening 1241a on the substrate 11 is located within the orthographic projection of the second isolation sub-opening 1241b on the substrate 11, and the orthographic projection of the third isolation sub-opening 1241c on the substrate 11 is located within the orthographic projection of the second isolation sub-opening 1241b on the substrate 11.

[0279] It can be understood that, along the thickness direction of the display panel 10, the first isolation structure opening 1241 includes a first isolation sub-opening 1241a, a second isolation sub-opening 1241b and a third isolation sub-opening 1241c which are stacked in sequence, that is, the second isolation sub-opening 1241b is located between the first isolation sub-opening 1241a and the third isolation sub-opening 1241c. The distance between the side walls on both sides of the isolation structure layer 124 corresponding to the second isolation sub-opening 1241b is greater than the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the first isolation sub-opening 1241a, and the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the third isolation sub-opening 1241c is greater than the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the first isolation sub-opening 1241a.

[0280] In an optional embodiment, the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the first isolation sub-opening 1241a can be equal to the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the third isolation sub-opening 1241c, or can be greater than the distance between the side walls on both sides of the isolation structure layer 124 corresponding to the third isolation sub-opening 1241c.

[0281] In an optional embodiment, the second isolation structure opening 1242 includes a fourth insulator opening 1242a, a fifth insulator opening 1242b and a sixth insulator opening 1242c stacked in sequence, that is, the fifth insulator opening 1242b is located between the fourth insulator opening 1242a and the sixth insulator opening 1242c.

[0282] For the specific description of the fourth insulator opening 1242a, the fifth insulator opening 1242b and the sixth insulator opening 1242c, reference may be made to the description of the first insulator opening 1241a, the second insulator opening 1241b and the third insulator opening 1241c in the above embodiment, which will not be repeated here.

[0283] In the above embodiment, the isolation layer 12 includes an isolation structure layer 124 and a pixel defining layer 125, a first isolation structure opening 1241 and a second isolation structure opening 1242 are provided on the isolation structure layer 124, and a first pixel opening 1251 and a second pixel opening 1252 are provided on the pixel defining layer 125. In other words, the first isolation opening 121 includes a first pixel opening 1251 and a first isolation structure opening 1241, and the second isolation opening 122 includes a second pixel opening 1252 and a second isolation structure opening 1242, so that the first light-emitting device 131 and the second light-emitting device 132 can be more highly isolated, thereby improving the display effect of the display panel 10.

[0284] In one embodiment, Figure 7-Figure 16As shown, the isolation layer 12 is further provided with a third isolation opening 126 , and a second isolation structure 127 is provided between the second isolation opening 122 and the third isolation opening 126 .

[0285] When the isolation layer 12 is provided with the third isolation opening 126 , the light emitting device 13 further includes a third light emitting device 133 provided in the third isolation opening 126 .

[0286] In one embodiment, when the isolation layer 12 is provided with the third isolation opening 126 , the encapsulation layer 14 further includes a third encapsulation portion 143 provided on a side of the third light emitting device 133 facing away from the substrate 11 .

[0287] The third light emitting device 133 emits a different color from the first light emitting device 131 and the second light emitting device 132. The description of the third light emitting device 133 and the third encapsulation part 143 can refer to the specific description of the second light emitting device 132 and the second encapsulation part 142 in the above embodiment, which will not be repeated here.

[0288] In one embodiment, Figure 7-Figure 17 As shown, in the case where the isolation layer 12 is provided with the third isolation opening 126, the isolation structure layer 124 included in the isolation layer 12 is also provided with a third isolation structure opening 1243, and the pixel defining layer 125 included in the isolation layer 12 is also provided with a third pixel opening 1253. The orthographic projection of the third pixel opening 1253 on the substrate 11 is located within the orthographic projection of the third isolation structure opening 1243 on the substrate 11.

[0289] In an optional embodiment, if Figure 7-Figure 17 As shown, for the third isolation structure opening 1243 in the isolation structure layer 124, the third isolation structure opening 1243 includes a seventh isolation sub-opening 1243a, an eighth isolation sub-opening 1243b and a ninth isolation sub-opening 1243c, the orthographic projection of the seventh isolation sub-opening 1243a on the substrate 11 is located within the orthographic projection of the eighth isolation sub-opening 1243b on the substrate 11, and the orthographic projection of the ninth isolation sub-opening 1243c on the substrate 11 is located within the orthographic projection of the eighth isolation sub-opening 1243b on the substrate 11.

[0290] For the detailed description of the third isolation structure opening 1243 , reference may be made to the description of the first isolation structure opening 1241 or the second isolation structure opening 1242 in the above embodiments, which will not be repeated herein.

[0291] In the above embodiment, the display panel 10 further includes a third light emitting device 133 disposed in the third isolation opening 126 . Such a display panel 10 can display multiple colors, thereby improving the practicality and display effect of the display panel 10 .

[0292] In one embodiment, Fig.16As shown, the third light emitting device 133 includes a third light emitting function portion 1331 and a third electrode 1332 .

[0293] For the description of the third light emitting functional portion 1331 and the third electrode 1332 , reference may be made to the specific description of the first light emitting functional portion 1311 and the first electrode 1312 , or the second light emitting functional portion 1321 and the second electrode 1322 in the above embodiments, which will not be repeated here.

[0294] In one embodiment, Fig.14 As shown, the cover layer 15 further includes: a third cover portion 153 connected to the second light emitting device 132 and the second encapsulation portion 142 , and a fourth cover portion 154 connected to the third light emitting device 133 .

[0295] The third covering portion 153 includes a fifth sub-covering portion 1531 disposed on a side of the second isolation structure 127 facing away from the substrate 11 , and a sixth sub-covering portion 1532 on a sidewall of the second isolation structure 127 corresponding to the second isolation opening 122 .

[0296] The fourth covering portion 154 includes a seventh sub-covering portion 1541 disposed on a side of the second isolation structure 127 facing away from the substrate 11 , and an eighth sub-covering portion 1542 on a sidewall of the second isolation structure 127 corresponding to the third isolation opening 126 .

[0297] Optionally, the third covering portion 153 includes a redundant device material layer located at the first light emitting device material layer, a redundant device material layer located at the second light emitting device material layer and a redundant encapsulation material layer located at the first encapsulation material layer, and a third encapsulation sub-portion connected to the second encapsulation portion 142 .

[0298] Optionally, the fourth covering portion 154 includes a redundant device material layer located on the third light-emitting device material layer, and a fourth encapsulation sub-portion connected 143 to the third encapsulation portion.

[0299] Optionally, along the thickness direction of the substrate 11 , the distance between the fifth sub-covering portion 1531 and the substrate 11 is smaller than the distance between the seventh sub-covering portion 1541 and the substrate 11 .

[0300] Optionally, the seventh sub-covering portion 1541 is located on a side of the portion of the fifth sub-covering portion 1531 facing away from the substrate 11 .

[0301] For the description of the third covering portion 153 and the fourth covering portion 154 , reference may be made to the specific description in the above embodiment, which will not be repeated here.

[0302] In one embodiment, Fig.16 As shown, the display panel 10 further includes:

[0303] The plurality of fourth electrodes 16 are respectively disposed on a side of the first light emitting device 131 close to the substrate 11 and a side of the second light emitting device 132 close to the substrate 11 .

[0304] When the display panel 10 includes the third light emitting device 133 , the fourth electrode 16 is also disposed on a side of the third light emitting device 133 close to the substrate 11 .

[0305] In one embodiment, a plan view (i.e., a top view) of the display panel 10 is as follows: Fig.18 As shown. Fig.18 It can be seen from the figure that the isolation openings in the display panel 10 are distributed in a grid shape, and the isolation structure is arranged around the isolation openings.

[0306] An embodiment of the present application provides a display device, including the display panel 10 provided in the above embodiment. Alternatively, the display device may also include the display panel 10 prepared by the method for preparing a display panel provided in the above embodiment.

[0307] The display device includes the display panel 10 provided in the above embodiment, or a display panel prepared by the method for preparing the display panel provided in the above embodiment, and has all the beneficial effects of the display panel 10, or all the beneficial effects of the method for preparing the display panel, which will not be repeated here.

[0308] The display device can be a laptop computer, a mobile phone, a wireless device, a personal digital assistant (PDA), a handheld or portable computer, a GPS receiver / navigator, a camera, an MP4 video player, a camcorder, a game console, a watch, a clock, a calculator, a television monitor, a flat-panel display, a computer monitor, a car display (e.g., an odometer display, etc.), a navigator, a cockpit controller and / or display, a display of a camera view (e.g., a display of a rearview camera in a vehicle), an electronic photo, an electronic billboard or sign, a projector, etc.

[0309] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.

[0310] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0311] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for preparing a display panel, characterized in that: The preparation method comprises: forming an isolation material layer on one side of the substrate, and performing a first patterning process on the isolation material layer to form a first isolation opening on the isolation material layer; Forming a stacked first light-emitting device material layer and a first packaging material layer on one side of the substrate, and performing a second patterning process on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first packaging portion provided in the first isolation opening, and forming a second isolation opening on the isolation material layer; A stacked second light-emitting device material layer and a second packaging material layer are formed on the side of the first packaging material layer away from the substrate and at the second isolation opening, and the second packaging material layer and the second light-emitting device material layer are subjected to a third patterning process to form a second light-emitting device and a second packaging part arranged at the second isolation opening.

2. The preparation method according to claim 1, characterized in that: The substrate includes a first area and a second area, the orthographic projection of the first isolation opening on the substrate is located within the range of the first area, and the orthographic projection of the second isolation opening on the substrate is located within the range of the second area; the second patterning process is performed on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first packaging portion provided at the first isolation opening, and a second isolation opening is formed on the isolation material layer, comprising: Removing the first packaging material layer on one side away from the substrate and only located in the second area to form the first packaging part; Removing the first light-emitting device material layer on one side away from the substrate and only located in the second area to form the first light-emitting device disposed in the first isolation opening; Etching the isolation material layer located only in the second region to form the second isolation opening on the isolation material layer; Optionally, a dry etching process is used to remove the first packaging material layer located only in the second area and away from the substrate, so as to form the first packaging part; Optionally, a wet etching process is used to remove the first light-emitting device material layer located only in the second area and away from the substrate, so as to form the first light-emitting device disposed in the first isolation opening; Optionally, a dry etching process and a wet etching process are used to etch the isolation material layer located only in the second region to form the second isolation opening on the isolation material layer; Optionally, performing a third patterning process on the second packaging material layer and the second light-emitting device material layer to form a second light-emitting device and a second packaging portion provided in the second isolation opening includes: Removing the second packaging material layer and the second light-emitting device material layer on the side away from the substrate except the second area, so as to form the second light-emitting device and the second packaging part provided in the second isolation opening; Optionally, the first light-emitting device material layer includes a stacked first light-emitting functional material layer and a first electrode material layer, and the first light-emitting device includes a first light-emitting functional portion formed by the first light-emitting functional material layer and a first electrode formed by the first electrode material layer; the second light-emitting device material layer includes a second light-emitting functional material layer and a second electrode material layer, and the second light-emitting device includes a second light-emitting functional portion formed by the second light-emitting functional material layer and a second electrode formed by the second electrode material layer.

3. The preparation method according to claim 1, characterized in that: The second patterning process is performed on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first packaging portion provided in the first isolation opening, and a second isolation opening is formed on the isolation material layer, comprising: Performing a second patterning process on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form the first light-emitting device, the first encapsulation portion, a first covering portion connected to the first light-emitting device and the first encapsulation portion, and forming a second isolation opening on the isolation material layer; The first covering portion includes a first sub-covering portion disposed on a side of the first isolation structure facing away from the substrate between the first isolation opening and the second isolation opening, and a second sub-covering portion disposed on a side wall of the first isolation structure corresponding to the first isolation opening; Optionally, the first covering portion includes a redundant device material layer located on the first light-emitting device material layer and a first encapsulation sub-portion connected to the first encapsulation portion; Optionally, performing a third patterning process on the second packaging material layer and the second light-emitting device material layer to form a second light-emitting device and a second packaging portion provided in the second isolation opening includes: Performing a third patterning process on the second encapsulation material layer and the second light-emitting device material layer to form the second light-emitting device and the second encapsulation portion, and a second covering portion connected to the second light-emitting device and the second encapsulation portion; The second covering portion includes a third sub-covering portion disposed on a side of the first isolation structure away from the substrate, and a fourth sub-covering portion disposed on a side wall of the first isolation structure corresponding to the second isolation opening; Optionally, the second covering portion includes a redundant device material layer located on the second light-emitting device material layer and a second encapsulation sub-portion connected to the second encapsulation portion; Optionally, along a thickness direction of the substrate, a distance between the first sub-covering portion and the substrate is smaller than a distance between the third sub-covering portion and the substrate; Optionally, the third sub-covering portion is located on a side of a portion of the first sub-covering portion facing away from the substrate.

4. The preparation method according to any one of claims 1 to 3, characterized in that The preparation method further comprises: Performing a fourth patterning process on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form a third isolation opening on the isolation material layer; forming a stacked third light emitting device material layer and a third packaging material layer on one side of the substrate; Performing a fifth patterning process on the third encapsulation material layer and the third light-emitting device material layer to form a third light-emitting device and a third encapsulation portion disposed in the third isolation opening; Optionally, the third light-emitting device material layer includes a stacked third light-emitting functional material layer and a third electrode material layer, and the third light-emitting device includes a third light-emitting functional portion and a third electrode.

5. The preparation method according to claim 4, characterized in that: The substrate includes a third region, and the orthographic projection of the third isolation opening on the substrate is located within the range of the third region; performing a fourth patterning process on the first packaging material layer, the first light-emitting device material layer, and the isolation material layer to form the third isolation opening on the isolation material layer, comprises: removing the first packaging material layer which is located on a side away from the substrate and only in the third area; removing the first light-emitting device material layer which is located on one side away from the substrate and only in the third area; Etching the isolation material layer located only in the third region to form the third isolation opening on the isolation material layer; Optionally, a dry etching process is used to remove the first packaging material layer which is located on a side away from the substrate and only in the third area; Optionally, a wet etching process is used to remove the second light-emitting device material layer which is located on a side away from the substrate and only in the third area; Optionally, a dry etching process and a wet etching process are used to etch the isolation material layer located only in the third region to form the third isolation opening on the isolation material layer; Optionally, performing a fifth patterning process on the third encapsulation material layer and the third light-emitting device material layer to form a third light-emitting device and a third encapsulation portion provided in the third isolation opening includes: The third packaging material layer and the third light-emitting device material layer are removed from one side away from the substrate and except those located outside the third region, and only the third packaging material layer and the third light-emitting device material layer in the third region are retained to form the third light-emitting device and the third packaging part.

6. The preparation method according to claim 4, characterized in that: The performing a fourth patterning process on the first encapsulation material layer, the first light emitting device material layer and the isolation material layer to form a third isolation opening on the isolation material layer includes: Performing a fourth patterning process on the first encapsulation material layer, the first light-emitting device material layer and the isolation material layer to form a third covering portion and form the third isolation opening on the isolation material layer; The third covering portion includes a fifth sub-covering portion disposed on a side of the second isolation structure facing away from the substrate between the second isolation opening and the third isolation opening, and a sixth sub-covering portion disposed on a side wall of the second isolation structure corresponding to the second isolation opening; Optionally, the third covering portion includes a redundant device material layer located on the first light-emitting device material layer, a redundant device material layer located on the second light-emitting device material layer, and a redundant encapsulation material layer located on the first encapsulation material layer, and a third encapsulation sub-portion connected to the second encapsulation portion; Optionally, performing a fifth patterning process on the third encapsulation material layer and the third light-emitting device material layer to form a third light-emitting device and a third encapsulation portion provided in the third isolation opening includes: Performing a fifth patterning process on the third encapsulation material layer and the third light-emitting device material layer to form the third light-emitting device and the third encapsulation portion, and a fourth covering portion connected to the third light-emitting device and the third encapsulation portion; The fourth covering portion includes a seventh sub-covering portion provided on a side of the second isolation structure facing away from the substrate, and an eighth sub-covering portion provided on a side wall of the second isolation structure corresponding to the third isolation opening; The fourth covering portion includes a redundant device material layer located on the third light emitting device material layer, and a fourth encapsulation sub-portion connected to the third encapsulation portion; Optionally, along the thickness direction of the substrate, a distance between the fifth sub-covering portion and the substrate is smaller than a distance between the seventh sub-covering portion and the substrate; Optionally, the seventh sub-covering portion is located on a side of a portion of the fifth sub-covering portion that is away from the substrate.

7. The preparation method according to any one of claims 1 to 3, characterized in that: The step of forming an isolation material layer on one side of the substrate and performing a first patterning process on the isolation material layer to form a first isolation opening on the isolation material layer comprises: forming a stacked pixel definition material layer and an isolation structure material layer on one side of the substrate; Performing a first patterning process on the isolation structure material layer and the pixel definition material layer to form a first isolation structure opening on the isolation structure material layer and a first pixel opening on the pixel definition material layer; an orthographic projection of the first pixel opening on the substrate is located within an orthographic projection of the first isolation structure opening on the substrate; The first isolation structure opening includes a first isolation sub-opening, a second isolation sub-opening and a third isolation sub-opening, the second isolation sub-opening is located between the first isolation sub-opening and the third isolation sub-opening, the orthographic projection of the first isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate, and the orthographic projection of the third isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate; Optionally, performing a second patterning process on the first packaging material layer, the first light-emitting device material layer and the isolation material layer to form a first light-emitting device and a first packaging portion provided in the first isolation opening, and forming a second isolation opening on the isolation material layer includes: The first packaging material layer, the first light-emitting device material layer, the isolation structure material layer and the pixel defining material layer are subjected to a second patterning process to form the first light-emitting device and the first packaging portion provided at the first isolation structure opening and the first pixel opening, and a second isolation structure opening is formed on the isolation structure material layer, and a second pixel opening is formed on the pixel defining material layer; the orthographic projection of the second pixel opening on the substrate is located within the orthographic projection of the second isolation structure opening on the substrate.

8. The preparation method according to any one of claims 1 to 3, characterized in that: The preparation method further comprises: A plurality of fourth electrodes are formed on one side of the substrate, and the plurality of fourth electrodes are respectively arranged on a side of the first light emitting device close to the substrate and a side of the second light emitting device close to the substrate.

9. A display panel, characterized in that: include: substrate; An isolation layer, disposed on one side of the substrate, having a first isolation opening and a second isolation opening, and a first isolation structure between the first isolation opening and the second isolation opening; A light emitting device, comprising a first light emitting device disposed at the first isolation opening and a second light emitting device disposed at the second isolation opening; an encapsulation layer, comprising a first encapsulation portion provided on a side of the first light emitting device away from the substrate and a second encapsulation portion provided on a side of the second light emitting device away from the substrate; a covering portion, comprising a first covering portion connected to the first light emitting device and the first encapsulation portion, and a second covering portion connected to the second light emitting device and the second encapsulation portion; The first covering portion includes a first sub-covering portion provided on a side of the first isolation structure away from the substrate, and a second sub-covering portion provided on a side wall of the first isolation structure corresponding to the first isolation opening; the second covering portion includes a third sub-covering portion provided on a side of the first isolation structure away from the substrate, and a fourth sub-covering portion provided on a side wall of the first isolation structure corresponding to the second isolation opening; Along a thickness direction of the substrate, a distance between the first sub-covering portion and the substrate is smaller than a distance between the third sub-covering portion and the substrate.

10. The display panel according to claim 9, characterized in that: The first covering portion includes a redundant device material layer located on the first light emitting device material layer and a first encapsulation sub-portion connected to the first encapsulation portion; The second covering portion includes a redundant device material layer located on the second light emitting device material layer and a second encapsulation sub-portion connected to the second encapsulation portion; Optionally, the third sub-covering portion is located on a side of a portion of the first sub-covering portion that is away from the substrate; Optionally, the first light emitting device includes a first light emitting functional portion and a first electrode, and the second light emitting device includes a second light emitting functional portion and a second electrode.

11. The display panel according to claim 10, characterized in that: The isolation layer includes an isolation structure layer and a pixel definition layer, wherein the pixel definition layer is disposed on one side of the substrate, and the isolation structure layer is disposed on a side of the pixel definition layer away from the substrate; The pixel defining layer is provided with a first pixel opening and a second pixel opening, and the isolation structure layer is provided with a first isolation structure opening and a second isolation structure opening; The orthographic projection of the first pixel opening on the substrate is located within the orthographic projection of the first isolation structure opening on the substrate, and the orthographic projection of the second pixel opening on the substrate is located within the orthographic projection of the second isolation structure opening on the substrate; Optionally, the first isolation structure opening includes a first isolation sub-opening, a second isolation sub-opening and a third isolation sub-opening, the second isolation sub-opening is located between the first isolation sub-opening and the third isolation sub-opening, the orthographic projection of the first isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate, and the orthographic projection of the third isolation sub-opening on the substrate is located within the orthographic projection of the second isolation sub-opening on the substrate; Optionally, the second isolation structure opening includes a fourth isolation sub-opening, a fifth isolation sub-opening and a sixth isolation sub-opening, the fifth isolation sub-opening is located between the fourth isolation sub-opening and the sixth isolation sub-opening, the orthographic projection of the fourth isolation sub-opening on the substrate is located within the orthographic projection of the fifth isolation sub-opening on the substrate, and the orthographic projection of the sixth isolation sub-opening on the substrate is located within the orthographic projection of the fifth isolation sub-opening on the substrate.

12. The display panel according to claim 11, characterized in that: The isolation layer is further provided with a third isolation opening, and a second isolation structure is provided between the second isolation opening and the third isolation opening; The light emitting device further comprises a third light emitting device disposed in the third isolation opening; Optionally, the encapsulation layer further includes a third encapsulation portion provided on a side of the third light-emitting device away from the substrate; Optionally, the pixel defining layer is further provided with a third pixel opening, the isolation structure layer is further provided with a third isolation structure opening, and the orthographic projection of the third pixel opening on the substrate is located within the orthographic projection of the third isolation structure opening on the substrate; Optionally, the third isolation structure opening includes a seventh isolation sub-opening, an eighth isolation sub-opening and a ninth isolation sub-opening, the eighth isolation sub-opening is located between the seventh isolation sub-opening and the ninth isolation sub-opening, the orthographic projection of the seventh isolation sub-opening on the substrate is located within the orthographic projection of the eighth isolation sub-opening on the substrate, and the orthographic projection of the ninth isolation sub-opening on the substrate is located within the orthographic projection of the eighth isolation sub-opening on the substrate.

13. The display panel according to claim 12, characterized in that: The covering part further includes: a third covering part, and a fourth covering part connected to the third light emitting device and the third encapsulation part; The third covering portion includes a fifth sub-covering portion provided on a side of the second isolation structure away from the substrate, and a sixth sub-covering portion on a side wall of the second isolation structure corresponding to the second isolation opening; The fourth covering portion includes a seventh sub-covering portion provided on a side of the second isolation structure away from the substrate, and an eighth sub-covering portion of a side wall of the second isolation structure corresponding to the third isolation opening; Optionally, the third covering portion includes a redundant device material layer located on the first light-emitting device material layer, a redundant device material layer located on the second light-emitting device material layer and a redundant encapsulation material layer located on the first encapsulation material layer, and a third encapsulation sub-portion connected to the second encapsulation portion; Optionally, the fourth covering portion includes a redundant device material layer located on the third light-emitting device material layer, and a fourth encapsulation sub-portion connected to the third encapsulation portion; Optionally, along the thickness direction of the substrate, a distance between the fifth sub-covering portion and the substrate is smaller than a distance between the seventh sub-covering portion and the substrate; Optionally, the seventh sub-covering portion is located on a side of a portion of the fifth sub-covering portion that is away from the substrate.

14. The display panel according to any one of claims 9 to 13, characterized in that: The display panel further includes: A plurality of fourth electrodes are respectively arranged on a side of the first light emitting device close to the substrate and a side of the second light emitting device close to the substrate.

15. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 9 to 14.

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