Centering disk, sounding monomer and electronic equipment

Abstract

The invention discloses a centering disk, a sound production single body and electronic equipment, and relates to the technical field of electroacoustic equipment parts, the centering disk comprises a body and a bonding pad arranged on the body, the bonding pad is used for being electrically connected with a lead, and the bonding pad comprises a base material and a covering film which are sequentially arranged in the thickness direction of the bonding pad; the base material comprises a welding layer, a conduction layer, an insulating layer and a reinforcing layer which are sequentially arranged in the thickness direction, the reinforcing layer is connected with the covering film, through holes are formed in the base material and sequentially penetrate through the welding layer, the conduction layer, the insulating layer and the reinforcing layer in the thickness direction, and a connecting layer for connecting the conduction layer and the reinforcing layer is prepared on the hole wall of each through hole. The reinforcing layer and the connecting layer are matched to connect and limit the conducting layer, and the binding force of the connecting layer to the conducting layer prevents the conducting layer from tilting and layering, so that the conducting layer and the covering film are not easy to layer during welding, and the welding yield and the welding effect of the bonding pad of the centering disk are improved.

Description

Technical Field

[0001] The invention relates to the technical field of electroacoustic equipment parts, and in particular to a centering support, a sound-generating unit and an electronic device. Background Art

[0002] Micro spot welding is a precision welding technology that is widely used in the manufacture of electronic products, especially for high-precision connection of tiny components. Taking the sound unit as an example, micro spot welding technology becomes one of the key processes when connecting the lead wire and the pad on the centering support. Micro spot welding uses pulse current or laser heating to quickly heat the welding part to the melting point and complete the welding in a short time. In the sound unit, the connection between the lead wire and the pad is crucial, and the stability of the solder joint directly affects the performance and long-term reliability of the sound unit.

[0003] However, during the spot welding process of the prior art micro-spot welding, the instantaneous temperature generated by the welding head can reach 400+℃, which has completely exceeded the combined bearing temperature of the covering film and the conductive layer of the pad. The probability of delamination of the conductive layer and the covering film after spot welding continues to increase, resulting in frequent delamination of the conductive layer and the covering film after welding. Summary of the invention

[0004] The main purpose of the present invention is to provide a centering support plate, a sound-emitting unit and an electronic device, aiming to solve the problem in the prior art that the pad of the centering support plate is easily delaminated from the substrate during micro-spot welding.

[0005] To achieve the above-mentioned purpose, the present invention proposes a centering support plate, comprising a main body and a soldering pad arranged on the main body, the soldering pad is used to be electrically connected to the lead, the soldering pad comprises a substrate and a covering film arranged in sequence along its thickness direction, the substrate comprises a welding layer, a conductive layer, an insulating layer and a reinforcing layer arranged in sequence along the thickness direction, the reinforcing layer is connected to the covering film, a through hole is opened on the substrate, the through hole passes through the welding layer, the conductive layer, the insulating layer and the reinforcing layer in sequence along the thickness direction, and the hole wall of each through hole is prepared with a connecting layer connecting the conductive layer and the reinforcing layer.

[0006] In one embodiment, the conductive layer includes a first electroplated copper layer and a first rolled copper layer sequentially arranged along the thickness direction, and the reinforcement layer includes a second rolled copper layer and a second electroplated copper layer sequentially arranged along the thickness direction, wherein the first rolled copper layer and the second rolled copper layer are respectively located on both sides of the insulating layer along the thickness direction.

[0007] In one embodiment, the connecting layer is a copper-plated layer electroplated on the hole wall of the through hole, and the copper-plated layer sequentially connects the first electroplated copper layer, the first rolled copper layer, the second rolled copper layer and the second electroplated copper layer along the thickness direction.

[0008] In one embodiment, the substrate is arranged in a polygonal shape, one side of the substrate is a connecting side for connecting to an external structure, and the other sides of the substrate are non-connecting sides;

[0009] The through holes are arranged at at least two of the non-connecting edges; or,

[0010] The through holes are arranged at at least two corners of the substrate.

[0011] In one embodiment, there are a plurality of through holes, and the plurality of through holes are distributed at intervals along the edge of the substrate.

[0012] In one embodiment, the plurality of through holes are all annular non-closed through holes, and the through holes are opened at the edge of the substrate, so that a plurality of gaps are formed at the edge of the substrate.

[0013] In one embodiment, the edges of the substrate on which the through holes are formed are open-type; and / or, in one embodiment, the plurality of notches are all U-shaped notches.

[0014] In one embodiment, the plurality of through holes are all annular closed through holes, and the plurality of through holes are arranged close to the edge of the substrate.

[0015] In one embodiment, the connection layer completely covers the hole wall of the through hole, and the wall thickness of the connection layer is uniform;

[0016] And / or, the number of the through holes is at least two, the through holes are round holes, and the diameter of each of the through holes is 0.1 mm to 0.3 mm;

[0017] And / or, the covering film includes a base layer and an adhesive layer, the base layer is connected to the reinforcement layer via the adhesive layer, the welding layer is a tin layer, and the base layer and the insulating layer are both polyimide layers.

[0018] In one embodiment, the main body includes a first connecting portion, a second connecting portion, and an elastic portion located between the first connecting portion and the second connecting portion, the elastic portion is formed by the first connecting portion extending in a curve along different directions to the second connecting portion, and the soldering pad is provided at one end of the first connecting portion away from the elastic portion.

[0019] In one embodiment, a position of the elastic portion close to the first connecting portion is bent toward the second connecting portion to form an installation space, and the soldering pad is located in the installation space.

[0020] The present invention also provides a sound-emitting unit, which includes a vibration system, a magnetic circuit system and a shell, the vibration system includes a voice coil and the above-mentioned centering support plate, the first connecting part is connected to the voice coil at one end away from the elastic part, the second connecting part is connected to the shell at one end away from the elastic part, and the pad connects the voice coil to the external circuit through the lead.

[0021] The present invention further provides an electronic device, comprising a housing and the above-mentioned sound-emitting unit, wherein the sound-emitting unit is arranged in the housing.

[0022] The technical solution of the present invention is to respectively arrange a conducting layer and a reinforcing layer on the substrate of the pad of the centering support piece, and to open a through hole on the substrate, and to arrange a connecting layer at the hole wall of the through hole, so that the connecting layer connects the conducting layer and the reinforcing layer, and the binding force of the connecting layer offsets the force of the conducting layer being deformed during welding, so that the conducting layer will not be delaminated between the insulating layer and the covering film due to high temperature during welding, and the conducting layer will not be lifted, thereby improving the welding yield of the pad and achieving better welding effect. The present invention connects and limits the conducting layer through the cooperation of the reinforcing layer and the connecting layer, and prevents the conducting layer from being lifted and delaminated through the binding force of the connecting layer on the conducting layer, so that the conducting layer and the covering film are not easily delaminated during welding, thereby improving the welding yield and welding effect of the pad of the centering support piece. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0024] Figure 1 A schematic structural diagram of a welding pad of a centering support plate is provided for one embodiment of the present invention;

[0025] Figure 2 A schematic cross-sectional structure diagram of a solder pad of a centering support plate is provided for one embodiment of the present invention;

[0026] Figure 3 A schematic structural diagram of a centering support provided in the first embodiment of the present invention;

[0027] Figure 4 A schematic structural diagram of a centering support provided in a second embodiment of the present invention;

[0028] Figure 5 A schematic structural diagram of a centering support provided in a third embodiment of the present invention;

[0029] Figure 6 A schematic structural diagram of a centering support provided in a fourth embodiment of the present invention;

[0030] Figure 7 A schematic structural diagram of a centering support provided in a fifth embodiment of the present invention;

[0031] Figure 8 A schematic structural diagram of a centering support provided in a sixth embodiment of the present invention.

[0032] Description of Figure Numbers:

[0033] 100, soldering pad; 1, substrate; 11, welding layer; 12, conductive layer; 121, first electroplated copper layer; 122, first rolled copper layer; 13, insulating layer; 14, reinforcing layer; 141, second rolled copper layer; 142, second electroplated copper layer; 15, through hole; 151, notch; 16, connecting edge; 17, non-connecting edge; 18, corner; 19, connecting layer; 2, covering film; 21, base layer; 22, adhesive layer; 3, covering layer; 400, centering support plate; 401, main body; 410, first connecting part; 420, second connecting part; 430, elastic part; 431, first end; 432, second end; 433, installation space; 440, conductive part.

[0034] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0037] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0038] Please combine Figures 1 to 4 A centering support plate 400 is proposed for this embodiment, including a main body 401 and a pad 100 arranged on the main body 401, the pad 100 is used to be electrically connected to the lead, the pad 100 includes a substrate 1 and a cover film 2 arranged in sequence along its thickness direction, the substrate 1 includes a welding layer 11, a conductive layer 12, an insulating layer 13 and a reinforcing layer 14 arranged in sequence along the thickness direction, the reinforcing layer 14 is connected to the cover film 2, a through hole 15 is opened on the substrate 1, the through hole 15 sequentially penetrates the welding layer 11, the conductive layer 12, the insulating layer 13 and the reinforcing layer 14 along the thickness direction, and the hole wall of each through hole 15 is prepared with a connecting layer 19 connecting the conductive layer 12 and the reinforcing layer 14.

[0039] The technical solution of the present invention is to respectively arrange a conducting layer 12 and a reinforcing layer 14 on the substrate 1 of the pad 100 of the centering support 400, and to open a through hole 15 on the substrate 1, and to arrange a connecting layer 19 at the hole wall of the through hole 15, so that the connecting layer 19 connects the conducting layer 12 and the reinforcing layer 14, and the binding force of the connecting layer 19 offsets the force of the conducting layer 12 being delaminated and deformed during welding, so that the conducting layer 12 will not be delaminated between the insulating layer 13 and the covering film 2 due to high temperature during welding, and the conducting layer 12 will not be lifted, thereby improving the welding yield of the pad 100 and achieving better welding effect. The present invention connects and limits the conducting layer 12 through the cooperation of the reinforcing layer 14 and the connecting layer 19, and prevents the conducting layer 12 from being lifted and delaminated through the binding force of the connecting layer 19 on the conducting layer 12, so that the conducting layer 12 and the covering film 2 are not easily delaminated during welding, thereby improving the welding yield and welding effect of the pad 100.

[0040] In one embodiment, the conductive layer 12 includes a first electroplated copper layer 121 and a first rolled copper layer 122 sequentially arranged along the thickness direction, and the reinforcing layer 14 includes a second rolled copper layer 141 and a second electroplated copper layer 142 sequentially arranged along the thickness direction, wherein the first rolled copper layer 122 and the second rolled copper layer 141 are respectively located on both sides of the insulating layer 13 along the thickness direction.

[0041] The conductive layer 12 is formed by stacking a first electroplated copper layer 121 and a first rolled copper layer 122. The first rolled copper layer 122 is connected to the insulating layer 13 as a base layer, and then the first electroplated copper layer 121 is formed by electroplating on the surface of the first rolled copper layer 122 to optimize the conductive performance and welding performance. Rolled copper is suitable as a base layer due to its smooth surface and excellent ductility, and can be better combined with the insulating layer 13, which can improve the connection effect with the insulating layer 13. Therefore, by the same token, when the reinforcing layer 14 passes through the second rolled copper layer 141 and the second electroplated copper layer 142, the second rolled copper layer 141 is also a layer connected to the insulating layer 13.

[0042] Specifically, the connection layer 19 is a copper-plated layer electroplated on the hole wall of the through hole 15, and the copper-plated layer sequentially connects the first electroplated copper layer 121, the first rolled copper layer 122, the second rolled copper layer 141 and the second electroplated copper layer 142 along the thickness direction. The conductive layer 12 and the reinforcement layer 14 are both copper layers, so the connection layer 19 is prepared by copper electroplating, and the same materials have the same physical properties, which makes it easier to form a strong metal bond, thereby improving the connection stability between the connection layer 19 and the conductive layer 12 and the reinforcement layer 14. The copper-plated layer sequentially connects the first electroplated copper layer 121, the first rolled copper layer 122, the second rolled copper layer 141 and the second electroplated copper layer 142, so that each layer is connected to the copper-plated layer, increasing the connection area between the copper-plated layer and the conductive layer 12 and the reinforcement layer 14, thereby improving the connection stability.

[0043] The substrate 1 is arranged in a polygonal shape, one side of the substrate 1 is a connecting side 16 for connecting with an external structure, and the other sides of the substrate 1 are non-connecting sides 17;

[0044] Please combine Figure 3 , Figure 4 , Figure 6 and Figure 7 In one embodiment, at least two non-connecting edges 17 are provided with through holes 15;

[0045] The through hole 15 is arranged at the non-connecting edge 17, and at least two non-connecting edges 17 are provided with the through hole 15, so that the connecting layer 19 can provide binding force to the conductive layer 12 from different directions of the substrate 1, so that the force on the conductive layer 12 is more uniform, and the stability of the conductive layer 12 is further improved, and the conductive layer 12 is prevented from warping due to uneven force on one side during the welding process, thereby improving the welding yield and welding effect of the pad 100.

[0046] See also Figure 8 In another embodiment, at least two corners 18 of the substrate 1 are provided with through holes 15 .

[0047] It can be understood that the substrate 1 is a polygon with multiple corners 18, and the through holes 15 are arranged at at least two different corners 18, so that the connecting layer 19 can provide binding force to the conductive layer 12 from different directions of the substrate 1, so that the conductive layer 12 is subjected to more uniform force, further improving the stability of the conductive layer 12, avoiding the conductive layer 12 from warping due to uneven force on one side during the welding process, and improving the welding yield and welding effect of the pad 100.

[0048] See also Figure 5 In yet another embodiment, a through hole 15 is provided at each corner of the substrate 1, and each corner of the substrate is connected to the conductive layer 12 and the reinforcing layer 14 through a connecting layer 19 on the hole wall of the through hole 15, so that each corner of the conductive layer 12 can be subjected to a restraining force, thereby maximizing the stability of the conductive layer 12, avoiding the conductive layer 12 from warping due to uneven force on one side during the welding process, and improving the welding yield and welding effect of the pad 100.

[0049] In one embodiment, there are a plurality of through holes 15 , and the plurality of through holes 15 are distributed at intervals along the edge of the substrate 1 .

[0050] The through holes 15 are distributed at intervals along the edge of the substrate, and the edge of the conductive layer 12 can be restrained by the connecting layer 19 on the hole wall of the through hole 15 to prevent the edge of the conductive layer 12 from warping. On the one hand, the position in the middle of the pad 100 can be reserved without affecting the welding of the lead and having little impact on the original function of the pad 100 itself. On the other hand, the through holes 15 located at the edge are easier to prepare, thereby improving the processing efficiency.

[0051] Please combine Figures 3 to 6 In one embodiment, the plurality of through holes 15 are all annular non-closed through holes 15 , and the through holes 15 are opened at the edge of the substrate 1 so that a plurality of notches 151 are formed at the edge of the substrate 1 .

[0052] The through hole 15 is opened at the edge of the substrate 1 and is an annular non-closed through hole 15, so that when the connecting layer 19 is prepared by electroplating, the electroplating equipment can be placed on the side of the substrate 1 and extended into the notch 151, and the substrate 1 is prepared on the hole wall of the through hole 15, making the electroplating process more convenient and the preparation of the connecting layer 19 more convenient.

[0053] Specifically, Figure 3 1 is a drawing of the first embodiment of the present application, wherein there are three annular non-closed through holes 15 on the pad, and the three annular non-closed through holes 15 are respectively arranged at three non-connected edges 17; Figure 4 This is a drawing of the second embodiment of the present application, wherein there are two annular non-closed through holes 15 on the pad, and the two annular non-closed through holes 15 are respectively arranged at two non-connected edges 17 thereof; Figure 5 1 is a drawing of the third embodiment of the present application, wherein there are four annular non-closed through holes 15 on the pad, and the four annular non-closed through holes 15 are respectively arranged at the four corners of the pad 100; Figure 6 This is an illustration of the fourth embodiment of the present application, in which there are four annular non-closed through holes 15 on the pad, and the four annular non-closed through holes 15 are respectively arranged at three non-connected edges 17, and two through holes 15 are arranged at one of the non-connected edges 17.

[0054] Furthermore, the substrate 1 is provided with the through hole 15 in an open-type configuration outside its edge.

[0055] It should be noted that the outside of the substrate 1 may be provided with structures such as a covering film 2. When there is a blocking structure outside the edge of the substrate 1, due to the blocking of the covering film 2 and other structures, it is impossible to directly open the annular non-closed through hole 15 on the edge of the substrate 1. Therefore, the edge outside the through hole 15 is opened in an open manner.

[0056] In one embodiment, the plurality of through holes 15 are all arc-shaped through holes 15 , and the plurality of notches 151 are all U-shaped notches 151 .

[0057] When the through hole 15 is an arc-shaped through hole 15 and the notch 151 is a U-shaped notch 151, the hole wall of the through hole 15 is flat and smooth everywhere. When the connecting layer 19 is electroplated on the hole wall, the connecting layer 19 is smoother and more continuous, and stress concentration will not occur at the corner 18, so that the stability of the connecting layer 19 is better and the service life of the connecting layer 19 is extended.

[0058] Please combine Figure 7 and Figure 8 In one embodiment, the plurality of through holes 15 are all annular closed through holes 15 , and the plurality of through holes 15 are arranged close to the edge of the substrate 1 .

[0059] It can be understood that when the outer side of the substrate 1 is blocked, it is inconvenient to drill a hole at the edge of the substrate 1, and the through hole 15 can only be set inside the substrate 1. Therefore, the through hole 15 is an annular closed through hole 15, and multiple through holes 15 are close to the edge of the substrate 1, and the middle part is reserved for welding the pad 100 and the lead, so as to avoid the through hole 15 occupying too much space of the pad 100 and affecting the welding effect of the pad 100.

[0060] Specifically, Figure 7 This is a drawing of the fifth embodiment of the present application, wherein the pad 100 has three annular closed through holes 15, and the three annular closed through holes 15 are respectively arranged corresponding to the three non-connected edges 17; Figure 8 This is a drawing of the sixth embodiment of the present application, in which the pad 100 has two annular closed through holes 15, the two annular closed through holes 15 are respectively arranged corresponding to two of the non-connected edges 17, and the two through holes 15 are arranged diagonally.

[0061] In one embodiment, the edge of the substrate 1 is covered with a covering layer 3 along its extension direction, so that the edge of the substrate 1 is arranged in a closed manner.

[0062] When the substrate 1 is covered with a covering layer 3 so that the outer edge of the substrate 1 is closed, only an annular closed through hole 15 opened inside the substrate 1 can be used to avoid interference from the covering layer 3 when opening the through hole 15, which may affect the opening effect of the through hole 15.

[0063] Furthermore, the connection layer 19 completely covers the hole wall of the through hole 15, and the wall thickness of the connection layer 19 is uniform. The connection layer 19 completely covers the hole wall of the through hole 15, and the connection area between the connection layer 19 and the conductive layer 12 and the reinforcement layer 14 is increased to the maximum extent, thereby maximizing the connection stability of the connection layer 19 to the conductive layer 12 and improving the welding effect of the pad 100.

[0064] In one embodiment, the number of the through holes 15 is at least two, the through holes 15 are round holes, and the diameter of each through hole 15 is 0.1 mm to 0.3 mm.

[0065] It should be noted that the size of the pad 100 is usually small, so the diameter of the through hole 15 is 0.1mm~0.3mm, and only when the number is at least two, at least two connecting layers 19 can be set from different directions to meet the connection effect of the connecting layer 19 to the conductive layer 12, avoid the conductive layer 12 from warping to the greatest extent, and improve the stability of the conductive layer 12 and the welding effect of the pad 100.

[0066] In one embodiment, the covering film 2 includes a base layer 21 and an adhesive layer 22. The base layer 21 is connected to the reinforcing layer 14 through the adhesive layer 22. The welding layer 11 is a tin layer. The base layer 21 and the insulating layer 13 are both polyimide layers. The base layer 21 is connected to the reinforcing layer 14 through the adhesive layer 22. It can be understood that the base layer 21 is a polyimide layer and the reinforcing layer 14 is a metal layer. The direct connection between the two is not stable. Therefore, the base layer 21 and the reinforcing layer 14 are bonded by the adhesive layer 22 to avoid separation or warping between the two, further improving the stability of the pad 100. The base layer 21 and the insulating layer 13 are polyimide layers. Polyimide has excellent heat resistance and mechanical stability, is suitable as a base or connecting layer 19, can be unaffected at high temperatures, and has better stability. The welding layer 11 is a tin layer. Tin, as a commonly used solder, has excellent solderability and wettability, improves welding quality, is easy to obtain, and has low cost.

[0067] In one embodiment, the main body 401 includes a first connecting portion 410, a second connecting portion 420, and an elastic portion 430 located between the first connecting portion 410 and the second connecting portion 420. The elastic portion 430 is formed by the first connecting portion 410 extending in a curve along different directions to the second connecting portion 420. A solder pad 100 is provided at one end of the first connecting portion 410 away from the elastic portion 430.

[0068] The first connecting portion 410 and the second connecting portion 420 of the centering support 400 are connected by an elastic portion 430. The elastic portion 430 enables the movement of the voice coil to be accurately controlled within a reasonable range to avoid excessive vibration or deviation, thereby ensuring that the voice coil vibrates uniformly along the axial direction under the action of the driving signal. The elastic portion 430 plays a role similar to a spring, providing appropriate restoring force to help the voice coil quickly return to its initial position after vibration, thereby ensuring efficient movement of the sound unit and avoiding the voice coil from deviating from the center.

[0069] In one embodiment, the elastic portion 430 is bent toward the second connection portion 420 at a position close to the first connection portion 410 to form an installation space 433 , and the solder pad 100 is located in the installation space 433 .

[0070] The elastic portion 430 of the centering support piece 400 is bent to form an installation space 433, and the soldering pad 100 is arranged in the installation space 433, so that the soldering pad 100 does not need to occupy additional space, thereby reducing the overall volume of the centering support piece 400 and optimizing the spatial layout of the centering support piece 400.

[0071] It should be noted that a conductive member 440 is also provided on the main body 401, which is connected and conducted to the pad 100, and extends along the first connecting portion 410, the elastic portion 430 and the second connecting portion 420 in sequence until it is electrically connected to the voice coil outside the second connecting portion 420, thereby supplying power to the voice coil.

[0072] The present invention also provides a sound-generating unit, which includes a vibration system, a magnetic circuit system and a shell. The vibration system includes a voice coil and the above-mentioned centering support 400. The end of the first connection part 410 away from the elastic part 430 is connected to the voice coil, and the end of the second connection part 420 away from the elastic part 430 is connected to the shell. The pad 100 conducts the voice coil with the external circuit through a lead. The first connection part 410 of the centering support 400 is connected to the voice coil, and the second connection part 420 is connected to the shell, so that the centering support 400 can fix the voice coil in the middle of the sound-generating unit, ensuring that the voice coil can vibrate uniformly along the axial direction when driven.

[0073] The specific structure of the centering support plate 400 refers to the above-mentioned embodiments. Since the sound-emitting unit adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0074] The present invention also proposes an electronic device, which includes a housing and the above-mentioned sound-emitting unit, and the sound-emitting unit is arranged in the housing. The specific structure of the sound-emitting unit refers to the above-mentioned embodiment. Since the electronic device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here. Among them, the electronic device can be a terminal device, a vehicle-mounted device, and various intelligent mobile terminals, such as a mobile phone, a computer, etc.

[0075] The above are only optional embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A centering support, characterized in that: It includes a main body and a soldering pad arranged on the main body, the soldering pad is used to be electrically connected to the lead, the soldering pad includes a substrate and a covering film arranged in sequence along its thickness direction, the substrate includes a welding layer, a conductive layer, an insulating layer and a reinforcing layer arranged in sequence along the thickness direction, the reinforcing layer is connected to the covering film, a through hole is opened on the substrate, the through hole passes through the welding layer, the conductive layer, the insulating layer and the reinforcing layer in sequence along the thickness direction, and the hole wall of each through hole is prepared with a connecting layer connecting the conductive layer and the reinforcing layer.

2. The centering support according to claim 1, characterized in that: The conductive layer includes a first electroplated copper layer and a first rolled copper layer sequentially arranged along the thickness direction, and the reinforcement layer includes a second rolled copper layer and a second electroplated copper layer sequentially arranged along the thickness direction, wherein the first rolled copper layer and the second rolled copper layer are respectively located on both sides of the insulating layer along the thickness direction.

3. The centering support sheet according to claim 2, characterized in that: The connecting layer is a copper-plated layer electroplated on the hole wall of the through hole, and the copper-plated layer sequentially connects the first electroplated copper layer, the first rolled copper layer, the second rolled copper layer and the second electroplated copper layer along the thickness direction.

4. The centering support according to claim 1, characterized in that: The substrate is arranged in a polygonal shape, one side of the substrate is a connecting side for connecting with an external structure, and the other sides of the substrate are non-connecting sides; The through holes are arranged at at least two of the non-connecting edges; or, The through holes are arranged at at least two corners of the substrate.

5. The centering support according to claim 1, characterized in that: There are a plurality of through holes, and the plurality of through holes are distributed at intervals along the edge of the substrate.

6. The centering support according to claim 5, characterized in that: The plurality of through holes are all annular non-closed through holes, and the through holes are opened at the edge of the substrate so that a plurality of gaps are formed at the edge of the substrate.

7. The centering arm according to claim 6, characterized in that: The edge of the substrate where the through hole is opened is open; And / or, the plurality of notches are all U-shaped notches.

8. The centering support according to claim 5, characterized in that: The plurality of through holes are all annular closed through holes, and the plurality of through holes are arranged close to the edge of the substrate.

9. The centering spider according to any one of claims 1 to 8, characterized in that The connecting layer completely covers the hole wall of the through hole, and the wall thickness of the connecting layer is uniform; And / or, the number of the through holes is at least two, the through holes are round holes, and the diameter of each of the through holes is 0.1 mm to 0.3 mm; And / or, the covering film includes a base layer and an adhesive layer, the base layer is connected to the reinforcement layer via the adhesive layer, the welding layer is a tin layer, and the base layer and the insulating layer are both polyimide layers.

10. The centering spider according to any one of claims 1 to 8, characterized in that The body includes a first connection part, a second connection part and an elastic part located between the first connection part and the second connection part. The elastic part is formed by the first connection part extending in a curve along different directions to the second connection part. The pad is provided at one end of the first connection part away from the elastic part.

11. The centering arm according to claim 10, characterized in that: The elastic portion is bent toward the second connecting portion at a position close to the first connecting portion to form an installation space, and the soldering pad is located in the installation space.

12. A sound-emitting unit, characterized in that: The sound-emitting unit includes a vibration system, a magnetic circuit system and a shell, the vibration system includes a voice coil and a centering support plate as described in any one of claims 10 or 11, the end of the first connecting part away from the elastic part is connected to the voice coil, the end of the second connecting part away from the elastic part is connected to the shell, and the pad connects the voice coil to an external circuit through the lead.

13. An electronic device, characterized in that: The electronic device comprises a housing and a sound-emitting unit as claimed in claim 12, wherein the sound-emitting unit is arranged in the housing.

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