Power self-adaptive control method and system for laser metal engraving

Abstract

The invention discloses a power self-adaptive control method and system for laser metal engraving, and relates to the related field of laser processing, and the method comprises the steps: obtaining a photoetching demand and photoetching target characteristics, carrying out demand dissection, and determining a photoetching geometric map which is marked with a frequency modulation node, and the photoetching demand is 2D etching or 3D etching; an integrated grating structure of the photoetching machine is obtained, aiming at the photoetching geometric map, a photoetching regulator is introduced to carry out a two-order regulation decision based on a frequency modulation node, a photoetching strategy is determined, and the two-order regulation comprises first-order beam combination regulation and second-order shaping regulation; the photoetching strategy responds to a photoetching machine, assists a photoetching coordinate system, and carries out self-adaptive positioning and frequency modulation management on a laser engraving process of a photoetching target. The technical problems that existing power control for laser metal engraving is insufficient in precision and low in efficiency are solved, and the technical effect of improving the power control precision and efficiency is achieved.

Description

Technical Field

[0001] The present application relates to the field of laser processing, and in particular to a power adaptive control method and system for laser metal engraving. Background Art

[0002] Power control in laser metal engraving is crucial to achieve accurate and efficient etching effects. At present, the main method to solve the problem of laser metal engraving power control is to control it through preset fixed parameters or simple manual adjustment. However, this method cannot be dynamically adjusted according to lithography requirements and target characteristics in real time, resulting in unsatisfactory engraving effects under complex lithography geometric maps, insufficient precision, low efficiency and other problems.

[0003] In the current related technologies, power control for laser metal engraving has technical problems of insufficient precision and low efficiency. Summary of the invention

[0004] The present application provides a power adaptive control method and system for laser metal engraving, which obtains and analyzes lithography requirements and target characteristics, determines lithography geometric maps and frequency modulation nodes, combines the integrated grating structure of the lithography machine, makes two-order (first-order beam combining, second-order shaping) adjustment decisions through a lithography controller, formulates a lithography strategy, applies the lithography strategy to the lithography machine, realizes adaptive positioning and frequency modulation management of lithography targets, and achieves the technical effect of improving power control accuracy and efficiency.

[0005] The present application provides a power adaptive control method for laser metal engraving, comprising: obtaining lithography requirements and lithography target characteristics, performing demand analysis, and determining a lithography geometric map, wherein the lithography geometric map is marked with a frequency modulation node, and the lithography requirement is 2D etching or 3D etching; obtaining an integrated grating structure of a lithography machine, introducing a lithography controller for the lithography geometric map to perform a two-order adjustment decision based on the frequency modulation node, and determining a lithography strategy, wherein the two-order adjustment includes a first-order beam combining adjustment and a second-order shaping adjustment; the lithography strategy responds to the lithography machine, assists the lithography coordinate system, and performs adaptive positioning and frequency modulation management on the laser engraving process of the lithography target.

[0006] In a possible implementation, the requirements are analyzed, the lithography geometry map is determined, and the following processing is performed: the lithography requirements are identified and converted into sequence requirements based on the lithography trajectory in the entire lithography cycle, wherein the sequence requirements are identified with the lithography space angle and the lithography energy efficiency; the lithography mode of the lithography machine is read, and the frequency modulation node of the sequence requirements is determined based on the lithography target characteristics as constraints, and the lithography geometry map is generated, wherein the lithography target characteristics at least include the metal material characteristics.

[0007] In a possible implementation, the following processing is performed: the lithography mode is a single-track lithography mode or a multi-track collaborative mode; the lithography track is identified, and if the lithography mode is a multi-track collaborative mode, the lithography track is divided into lithography tracks to determine the mode track division result; based on the mode track division result, the sequence demand is identified to locate the demand trend change and identify the frequency modulation node.

[0008] In a possible implementation, demand trend location is performed, the frequency modulation node is identified, and the following processing is performed: a first demand variable threshold and a second demand variable threshold are set, wherein the first demand variable threshold is greater than the second demand variable threshold; by performing trajectory trend identification, if it is greater than the first demand variable threshold, it is identified as a Class I frequency modulation node; if it is greater than the second demand variable threshold and less than or equal to the first demand variable threshold, it is identified as a Class II frequency modulation node; wherein the Class I frequency modulation node performs first-order beam combining adjustment and second-order shaping adjustment, and the Class II frequency modulation node performs second-order shaping adjustment.

[0009] In a possible implementation, a lithography controller is constructed to perform the following processing: identify the integrated grating structure and determine the spectral characteristics of each grating unit; use the spectral characteristics as an index to perform lithography big data retrieval and retrieve a lithography record set; based on the spectral characteristics, mine the laser beam combining conditions of the combined grating array through the lithography record set, and integrate the lithography record set as sample data to drive the training of the lithography controller, wherein the combined grating array is a combination of at least two grating units, and the lithography controller includes a laser beam combining block and a laser shaping block.

[0010] In a possible implementation, a two-order adjustment decision based on the frequency modulation node is performed to determine the lithography strategy, and the following processing is performed: the lithography geometric map is imported into the lithography controller; the frequency modulation node is identified, and if it is the first type of frequency modulation node, a beam combining grating decision based on the laser beam combining block and a parameter adjustment based on the laser shaping block are performed to determine the first frequency modulation strategy; if it is the second type of frequency modulation node, a parameter adjustment based on the laser shaping block is performed to determine the second frequency modulation strategy; the first frequency modulation strategy and the second frequency modulation strategy are used to establish a frequency modulation node mapping with the lithography geometric map as the lithography strategy.

[0011] In a possible implementation, the lithography strategy responds to the lithography machine and performs the following processing: based on the lithography strategy, the CNC center of the lithography machine is configured; the spatial placement position of the lithography target is scanned and determined, and converted to the lithography coordinate system, and lithography positioning and frequency modulation control based on the lithography strategy is performed, wherein the lithography coordinate system is the control coordinate system of the lithography machine.

[0012] In a possible implementation, the following processing is performed: the integrated grating structure is a redundant structure; if there is a faulty grating unit, a backup unit based on the redundant structure is triggered to perform laser beam combining control.

[0013] In a possible implementation, after the adaptive positioning and frequency modulation management of the laser engraving process of the lithography target, the following processing is also performed: synchronously perform lithography monitoring and tracking to determine the real-time lithography energy efficiency; based on position mapping, calibrate the real-time lithography energy efficiency and the atlas lithography requirements to locate the resumption node, wherein the resumption node is marked with an energy efficiency difference; assist the lithography controller to determine the resumption frequency modulation strategy based on the resumption node, and transmit it to the CNC center of the lithography machine.

[0014] The present application also provides a power adaptive control system for laser metal engraving, including: a lithography geometry map determination module, used to obtain lithography requirements and lithography target characteristics, perform demand analysis, and determine a lithography geometry map, wherein the lithography geometry map is marked with a frequency modulation node, and the lithography requirement is 2D etching or 3D etching; a lithography strategy determination module, used to obtain an integrated grating structure of a lithography machine, introduce a lithography controller for the lithography geometry map to perform a two-order regulation decision based on the frequency modulation node, and determine the lithography strategy, wherein the two-order regulation includes a first-order beam combining regulation and a second-order shaping regulation; an adaptive control module, used for the lithography strategy to respond to the lithography machine, assist the lithography coordinate system, and perform adaptive positioning and frequency modulation management on the laser engraving process of the lithography target.

[0015] The power adaptive control method and system for laser metal engraving proposed in this application first obtains the lithography requirements and lithography target characteristics, performs demand analysis, and determines the lithography geometric map, wherein the lithography geometric map is marked with frequency modulation nodes, and the lithography requirements are 2D etching or 3D etching. Then, the integrated grating structure of the lithography machine is obtained, and for the lithography geometric map, a lithography controller is introduced to make a two-order adjustment decision based on the frequency modulation node to determine the lithography strategy, wherein the two-order adjustment includes first-order beam combining adjustment and second-order shaping adjustment. Finally, the lithography strategy responds to the lithography machine, assists the lithography coordinate system, and performs adaptive positioning and frequency modulation management on the laser engraving process of the lithography target. The technical effect of improving the power control accuracy and efficiency is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the accompanying drawings of the embodiment of the present invention will be briefly introduced below. A flow chart is used in the present application to illustrate the operations performed by the system according to the embodiment of the present application. It should be understood that the preceding or following operations are not necessarily performed accurately in order. On the contrary, various steps can be processed in reverse order or simultaneously as needed. At the same time, other operations can also be added to these processes, or one or more operations can be removed from these processes.

[0017] Figure 1 A schematic flow chart of a power adaptive control method for laser metal engraving provided in an embodiment of the present application.

[0018] Figure 2 A schematic diagram of the structure of a power adaptive control system for laser metal engraving provided in an embodiment of the present application.

[0019] Explanation of the reference numerals: lithography geometry map determination module 10 , lithography strategy determination module 20 , adaptive control module 30 . DETAILED DESCRIPTION

[0020] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below.

[0021] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings. The described embodiments should not be regarded as limiting the present application. All other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of this application.

[0022] In the following description, reference is made to "some embodiments", which describe a subset of all possible embodiments, but it is understood that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict, and the terms "first\second" involved are merely to distinguish similar objects and do not represent a specific ordering of objects. The terms "including" and "having" and any variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or modules that are not clearly listed or inherent to these processes, methods, products, or devices. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of this application. The terms used herein are for the purpose of describing the embodiments of the present application only.

[0023] The present application embodiment provides a power adaptive control method for laser metal engraving, such as Figure 1 As shown, the method includes: Step S100, obtaining lithography requirements and lithography target characteristics, performing requirement analysis, and determining a lithography geometric map, wherein the lithography geometric map is marked with a frequency modulation node, and the lithography requirement is 2D etching or 3D etching.

[0024] Specifically, the specific requirements of lithography are clarified through communication with customers, design document analysis or experimental testing. For example, for a complex 3D etched pattern, it is necessary to determine the contours, depths and angles of its various parts. The characteristics of the lithography target material (such as metal) are analyzed, including its optical properties, thermal properties, mechanical properties, etc., to select appropriate laser parameters and lithography strategies. The lithography requirements are broken down into multiple subtasks, such as pattern segmentation, layer division, and frequency modulation node identification. The lithography pattern is converted into a processable digital format using computer-aided design (CAD) software or specialized lithography design software. According to the dissected requirements, a lithography geometric map is generated. The lithography geometric map is a graphical representation method that contains the geometric shape, size, position and frequency modulation node identification of the lithography pattern. The frequency modulation node refers to the key position where the laser power needs to be adjusted during the lithography process, which is located at the edge, corner or detail of the pattern.

[0025] In a possible implementation, the requirements are analyzed to determine the lithography geometry map, and step S100 further includes step S110, identifying the lithography requirements and converting them into sequence requirements based on the lithography trajectory under the full lithography cycle, wherein the sequence requirements are identified by the lithography space angle and the lithography energy efficiency. Specifically, according to the lithography requirements, a path planning algorithm (such as A* algorithm, Dijkstra algorithm, etc.) is used to plan the lithography trajectory. These algorithms can generate the optimal path from the starting point to the end point according to the geometric shape and size of the lithography pattern, including the movement path, speed and dwell time of the laser beam at different positions. The lithography trajectory includes straight lines, curves or complex geometric shapes, depending on the design of the lithography pattern. The lithography trajectory is decomposed into a series of discrete points or sections, each of which corresponds to a specific lithography parameter, such as the laser incident angle (especially in three-dimensional processing), lithography depth, width, etc. These parameters are arranged in the order of the lithography trajectory to form a sequence requirement. Each element in the sequence requirement is marked with the corresponding lithography spatial angle (i.e., laser incident angle) and lithography energy efficiency (i.e., the efficiency of laser energy utilization in the lithography process, reflecting the ability of laser energy to be converted into lithography effect). The lithography energy efficiency of each sequence requirement is evaluated based on the lithography requirements and material properties. For example, for high-reflectivity materials, higher laser power is required to achieve the same engraving depth, so its energy efficiency is lower.

[0026] Step S120, read the lithography mode of the lithography machine, take the lithography target characteristics as constraints, determine the frequency modulation node of the sequence requirements, and generate the lithography geometric map, wherein the lithography target characteristics at least include metal material characteristics. Specifically, check the configuration or setting of the lithography machine to determine the lithography mode it supports, such as single-track lithography mode, etc. According to the lithography mode of the lithography machine, determine the control method and parameter setting range of the laser beam. Take the lithography target characteristics as constraints, that is, consider the characteristics of the lithography target material, such as the reflectivity, thermal conductivity, melting point, etc. of the metal material. These characteristics will affect the interaction between the laser beam and the lithography target, thereby affecting the lithography effect. Therefore, when determining the frequency modulation node, it is necessary to fully consider the requirements and restrictions of the lithography target characteristics on the laser parameters. For example, for metal materials with high reflectivity, it is necessary to increase the laser power to overcome the reflection loss; for materials with low thermal conductivity, it is necessary to reduce the laser power to avoid excessive thermal damage. When determining the frequency modulation node, the material characteristics are used as constraints. For example, if the melting point of the material is low, the laser power needs to be reduced in the area close to the melting point. Analyze each element in the sequence requirements to determine at which positions or conditions the laser parameters (such as power, frequency, focus position, etc.) need to be adjusted. These positions or conditions are the frequency modulation nodes, such as the edges, corners or details of the lithography pattern, or the positions where the parameters need to be changed during the movement of the laser beam. According to the position of the frequency modulation node and the parameter adjustment requirements, generate a lithography geometry map, which contains the geometry, size, position of the lithography pattern, and the identification and parameter setting information of the frequency modulation node. This implementation method provides an important basis for the formulation of lithography strategies by refining the lithography requirements and considering the characteristics of the lithography target.

[0027] In a possible implementation, step S120 further includes step S121, and the lithography mode is a single-track lithography mode or a multi-track collaborative mode. Specifically, the lithography mode is divided into a single-track lithography mode and a multi-track collaborative mode. The single-track mode means that the lithography machine uses a single laser beam or a single track for engraving; the multi-track collaborative mode means that the lithography machine can use multiple laser beams or tracks for collaborative engraving at the same time to improve engraving efficiency or process more complex patterns.

[0028] Step S122, identify the lithography track, if the lithography mode is a multi-track collaborative mode, perform lithography track division on the lithography track, and determine the mode track division result. Specifically, when the lithography mode is a multi-track collaborative mode, determine the multi-track collaborative capability of the lithography machine, including the number of laser beams supported, the power range of each laser beam, the collaborative mode, etc. Use a trajectory decomposition algorithm to decompose the lithography track into multiple sub-tracks. Each sub-track is responsible for a different laser beam or track. The algorithm needs to consider the interference between laser beams, engraving efficiency, and the complexity of the lithography pattern, optimize the allocation of sub-tracks, ensure that the workload of each laser beam is balanced, and avoid mutual interference, and finally determine the mode track division result, that is, the specific sub-track that each laser beam or track is responsible for. An example of the mode track division result is shown in Table 1.

[0029] Table 1: Example of pattern splitting results: ; Step S123, for the pattern track division result, by identifying the sequence demand, the demand trend change positioning is performed, and the frequency modulation node is identified. Specifically, the sequence demand identifies the laser incident angle, lithography depth, width, etc. at each position based on the lithography track in the full lithography cycle. The pattern track division result is analyzed to determine at which positions or conditions the lithography requirements (such as laser incident angle, lithography depth, etc.) will change. These change points are identified on the lithography geometry map as frequency modulation nodes, which are key positions for subsequent laser parameter adjustment (such as power, frequency, focus position, etc.). This implementation method ensures that subsequent lithography strategies and parameter adjustments can adapt to the configuration and capabilities of the lithography machine by identifying the lithography mode (single track or multi-track collaboration). In the multi-track collaboration mode, the distribution of laser beams or tracks is optimized by lithography track division, which improves the engraving efficiency and the ability to process complex patterns. Through demand trend positioning, the key positions or conditions (frequency modulation nodes) where laser parameters need to be adjusted in the lithography process are accurately identified, providing a clear basis for subsequent laser parameter adjustment and lithography strategy formulation.

[0030] In a possible implementation, the demand trend is located, the frequency modulation node is identified, and step S123 further includes step S1231, setting a first demand variable threshold and a second demand variable threshold, wherein the first demand variable threshold is greater than the second demand variable threshold. Specifically, according to the lithography requirements, the lithography target characteristics (such as metal material characteristics) and the performance parameters of the lithography machine, two demand variable thresholds are pre-set: the first demand variable threshold and the second demand variable threshold. The first demand variable threshold is set to a higher value to identify the frequency modulation node that needs to perform more complex adjustments (i.e., first-order beam combining adjustment and second-order shaping adjustment). The second demand variable threshold is set to a lower value to identify the frequency modulation node that only needs to perform simpler adjustments (i.e., second-order shaping adjustment). Among them, the demand variable refers to the parameters that may change during the lithography process, such as the laser incident angle, lithography depth, width, etc., and the changes in these parameters will affect the lithography quality and efficiency.

[0031] Step S1232, by performing trajectory trend change identification, if it is greater than the first demand variable threshold, it is identified as a first-class frequency modulation node; if it is greater than the second demand variable threshold and less than or equal to the first demand variable threshold, it is identified as a second-class frequency modulation node, wherein the first-class frequency modulation node performs first-order beam combining adjustment and second-order shaping adjustment, and the second-class frequency modulation node performs second-order shaping adjustment. Specifically, analyze the lithography trajectory to identify the change point or trend change area of ​​the lithography demand on the trajectory. For example, the edge, corner or depth change of the pattern. Use the difference method or differential method to calculate the demand variable values ​​of these change points or areas, such as the change amount of the laser incident angle, the change amount of the lithography depth, etc. The demand variable value is compared with the set threshold. If the demand variable value is greater than the first demand variable threshold, the change point or area is identified as a first-class frequency modulation node, indicating that the first-order beam combining adjustment and the second-order shaping adjustment need to be performed. If the demand variable value is greater than the second demand variable threshold and less than or equal to the first demand variable threshold, the change point or area is identified as a second-class frequency modulation node, indicating that only the second-order shaping adjustment needs to be performed. This implementation method divides the frequency modulation nodes into Class I and Class II by setting different thresholds of demand variables, thus achieving fine-tuning of different degrees of change in the lithography process. Class I frequency modulation nodes perform more complex adjustments to cope with larger demand changes; Class II frequency modulation nodes perform simpler adjustments to cope with smaller demand changes. Through fine-tuning, lithography requirements can be met more accurately, and lithography quality and accuracy can be improved. Especially when dealing with complex patterns or three-dimensional etching, this fine-tuning can significantly reduce errors and defects. Choosing the appropriate adjustment method according to the size of the demand change can avoid unnecessary complex adjustments, thereby improving lithography efficiency. For smaller demand changes, only simple adjustments are required; for larger demand changes, more complex adjustments are required to ensure lithography quality.

[0032] Step S200, obtaining the integrated grating structure of the lithography machine, introducing a lithography controller to perform two-order regulation decision based on the frequency modulation node for the lithography geometric map, and determining the lithography strategy, wherein the two-order regulation includes first-order beam combining regulation and second-order shaping regulation.

[0033] Specifically, use tools such as optical microscopes, electron microscopes or spectrum analyzers to measure the grating array structure of the lithography machine and record parameters such as the number, arrangement, and focal length of the gratings. Among them, the integrated grating structure refers to the combined structure of multiple grating units used to control the laser beam in the lithography machine. Analyze the spectral characteristics of the grating unit, such as transmittance, reflectivity, diffraction efficiency, etc. These characteristics determine the grating's ability to control the laser beam. Analyze the focusing effect of the grating on the laser beam based on the focal length and arrangement of the grating. For example, a grating with a smaller focal length can achieve tighter focus. Analyze the shaping effect of the grating on the laser beam, such as changing the shape and intensity distribution of the beam. For example, a rectangularly arranged grating can shape a circular beam into a rectangular beam. Analyze the beam splitting capability of the grating, that is, a grating can split a laser beam into multiple sub-beams for multi-track collaborative engraving. An example of an integrated grating structure is shown in Table 2. Select or design a suitable lithography controller that can adaptively adjust the power of the laser engraving process according to the requirements of the lithography geometry map and frequency modulation node. Integrate the lithography controller with the lithography machine to ensure that the controller can respond to the operating status of the lithography machine and lithography requirements in real time. According to the frequency modulation node position in the lithography geometry map, determine the lithography strategy, that is, the specific parameters of the first-order beam combining adjustment and the second-order shaping adjustment, including the setting and adjustment methods of parameters such as laser power, frequency, focus position, and shaping method. Among them, the first-order beam combining adjustment is mainly used to adjust the focus position and power distribution of the laser beam to ensure that the laser beam can accurately irradiate the lithography target. The second-order shaping adjustment is used to perform fine shaping of the laser beam to meet the detail requirements of the lithography pattern.

[0034] Table 2: Examples of integrated grating structures: ; In one possible implementation, a lithography controller is constructed, and step S200 further includes step S210, identifying the integrated grating structure and determining the spectral characteristics of each grating unit. Specifically, use tools such as an optical microscope, an electron microscope or a spectrum analyzer to physically observe or spectrally analyze the integrated grating structure of the lithography machine. Identify each grating unit in the integrated grating structure, including their position, shape, size and other geometric features. Through spectral analysis, measure the transmittance, reflectivity or diffraction efficiency of each grating unit for light of different wavelengths. Record and analyze these data to obtain a spectral characteristic curve or data table of each grating unit. Among them, the grating unit refers to a single grating in the integrated grating structure, which has a specific geometric shape and spectral characteristics.

[0035] Step S220, using the spectral characteristics as an index, perform a lithography big data search and retrieve a lithography record set. Specifically, the spectral characteristics of each grating unit are used as a search keyword or index to access a large database containing a large amount of lithography data and records. Search the large database for lithography records that match specific spectral characteristics. The retrieval results include parameter settings, effect evaluations, etc. when lithography was previously performed using grating units with similar spectral characteristics. Extract and organize relevant lithography records from the retrieval results to form a lithography record set. The lithography record set contains successful or failed lithography cases, as well as their detailed parameters and effect descriptions.

[0036] Step S230, according to the spectral characteristics, the laser beam combining conditions of the combined grating array are mined through the lithography record set, and the lithography record set is integrated as sample data to drive the training of the lithography controller, wherein the combined grating array is a combination of at least two grating units, and the lithography controller includes a laser beam combining block and a laser shaping block. Specifically, the successful cases in the lithography record set are analyzed to find the best conditions for achieving laser beam combining. These conditions include the wavelength, power, incident angle of the laser, and the arrangement and spacing of the grating units. According to the analysis results, the parameter settings of the grating array are optimized to achieve the best laser beam combining effect. The data in the lithography record set are organized into a format suitable for machine learning or deep learning. The sample data includes input features (such as spectral characteristics, laser parameters, etc.) and output labels (such as beam combining effect, engraving quality, etc.). The lithography controller is trained using the integrated sample data. The lithography controller includes a laser beam combining block and a laser shaping block, and learns through training how to adjust the laser parameters according to the input features to achieve the best beam combining and shaping effects. Among them, the combined grating array is a combination of at least two grating units, which is used to achieve a specific laser beam combination or shaping effect. This implementation method can mine the best parameter settings and effect evaluation when using grating units with similar spectral characteristics for lithography through lithography big data retrieval and retrieval of lithography record sets. This information can be used to optimize the current lithography process and improve engraving quality and efficiency.

[0037] In a possible implementation, a two-order regulation decision based on a frequency modulation node is performed to determine a lithography strategy, and step S200 further includes step S240, importing the lithography geometry map into the lithography controller. Specifically, the generated lithography geometry map data is imported into the lithography controller using a data interface or a file transfer method.

[0038] Step S250, identify the frequency modulation node, if it is the first type of frequency modulation node, execute the beam combining grating decision based on the laser beam combining block and the parameter adjustment based on the laser shaping block to determine the first frequency modulation strategy, if it is the second type of frequency modulation node, execute the parameter adjustment based on the laser shaping block to determine the second frequency modulation strategy. Specifically, the lithography controller scans the lithography geometry map and identifies all the marked frequency modulation nodes. According to the type of frequency modulation node (first type or second type), decide which frequency modulation strategy to adopt. For the first type of frequency modulation node, the lithography controller first executes the beam combining grating decision based on the laser beam combining block, selects the grating combination suitable for the current lithography requirements, so as to optimize the laser beam combining effect. Then, execute the parameter adjustment based on the laser shaping block, and adjust the parameters of the laser (such as power, frequency, phase, etc.) to meet the specific requirements in the lithography geometry map. The first frequency modulation strategy is the result of combining the beam combining grating decision and the laser shaping block parameter adjustment.

[0039] For the second type of frequency modulation node, the lithography controller mainly performs parameter adjustment based on the laser shaping block, and also adjusts the laser parameters, but does not need to change the grating combination, because the demand change of the second type of frequency modulation node is relatively small. The second frequency modulation strategy is based on the result of the laser shaping block parameter adjustment.

[0040] Step S260, using the first frequency modulation strategy and the second frequency modulation strategy to establish a frequency modulation node mapping with the lithography geometric map as the lithography strategy. Specifically, the first frequency modulation strategy and the second frequency modulation strategy are mapped with a type of frequency modulation node and a type of frequency modulation node in the lithography geometric map, respectively. Ensure that each frequency modulation node corresponds to a specific frequency modulation strategy so that it can be accurately executed during the lithography process. Combine the frequency modulation node mapping with the lithography geometric map to form a complete lithography strategy. The lithography strategy contains all the required adjustment information and parameter settings during the lithography process, and is used to guide the operation of the lithography machine. This implementation method forms a complete lithography strategy by establishing a frequency modulation node mapping, combining the frequency modulation strategy with the lithography geometric map, which helps to guide the operation of the lithography machine and ensure that the lithography process can proceed smoothly according to the predetermined plan, thereby improving the quality and efficiency of laser metal engraving.

[0041] In a possible implementation, step S200 further includes step S270, the integrated grating structure is a redundant structure, and if there is a faulty grating unit, a backup unit based on the redundant structure is triggered to perform laser beam combining control.

[0042] Specifically, when designing an integrated grating structure, additional grating units are reserved as backup to form a redundant structure. These backup units do not participate in the work under normal circumstances, but can quickly take over when the main unit fails. The faulty grating unit in the integrated grating structure is identified through real-time monitoring or fault detection system. The fault is manifested as the grating unit cannot work properly, the output light intensity is unstable, the spectral characteristics deviate from expectations, etc. Once the faulty grating unit is detected, the redundancy mechanism is immediately triggered. The control system automatically switches to the backup grating unit to ensure that it can quickly take over the work of the faulty unit. Use the backup grating unit to participate in the laser beam combining process to ensure the stability and accuracy of the laser beam combining. Adjust the parameters (such as angle, position, etc.) of the backup grating unit to match the working state of the original grating unit. For example, adjust the angle of the backup grating to maintain the same focusing effect as the original grating. Verify whether the adjusted backup grating unit can work properly and ensure that the beam combining effect is not affected. The adjustment example is shown in Table 3. This implementation introduces a redundant structure to ensure that when a grating unit fails, it can quickly switch to a backup unit to avoid system interruption or performance degradation. This helps to improve the continuity and stability of the laser metal engraving process and reduce downtime and production losses caused by failures.

[0043] Table 3: Example of parameter adjustment for alternate grating units: ; Step S300, the lithography strategy responds to the lithography machine and assists the lithography coordinate system to perform adaptive positioning and frequency modulation management on the laser engraving process of the lithography target.

[0044] Specifically, the formulated lithography strategy is input into the lithography machine to ensure that the lithography machine can perform laser engraving operations according to the strategy. A lithography coordinate system is established, which is consistent with the coordinate system of the lithography pattern and the lithography machine. According to the information of the lithography strategy and the lithography coordinate system, the focusing position and power distribution of the laser beam are adjusted in real time. When encountering a frequency modulation node, the laser power or frequency is automatically adjusted to meet the detailed requirements of the lithography pattern. During the lithography process, the operating status of the lithography machine and the laser engraving effect are monitored in real time to adjust the lithography strategy in time. The embodiment of the present application adopts the method of obtaining and analyzing lithography requirements and target characteristics, determining lithography geometric maps and frequency modulation nodes, combining the integrated grating structure of the lithography machine, and performing two-order (first-order beam combining, second-order shaping) adjustment decisions through the lithography controller, formulating lithography strategies, applying lithography strategies to lithography machines, and realizing adaptive positioning and frequency modulation management of lithography targets. Technical means such as, achieve the technical effect of improving power control accuracy and efficiency.

[0045] In one possible implementation, the lithography strategy is responsive to the lithography machine, and step S300 further includes step S310, in which the lithography machine is numerically controlled and configured based on the lithography strategy. Specifically, the determined lithography strategy is read, and the strategy contains all the adjustment information and parameter settings required in the lithography process. The parameters and settings in the lithography strategy are input into the numerical control center (CNC, Computer Numerical Control, the core control system of the lithography machine, responsible for controlling the laser engraving process according to the input instructions and parameters) of the lithography machine. The configuration includes laser power, frequency, phase, grating selection, engraving path, engraving speed, etc.

[0046] Step S320, scan and determine the spatial placement position of the lithography target, convert it to the lithography coordinate system, and perform lithography positioning and frequency modulation control based on the lithography strategy, wherein the lithography coordinate system is the control coordinate system of the lithography machine. Specifically, use the sensor or scanning device on the lithography machine to perform spatial scanning on the lithography target (metal material or component to be laser engraved) to determine the exact position of the lithography target in the physical space, including its shape, size and relative position. Convert the lithography target position information obtained by scanning to the control coordinate system (i.e., lithography coordinate system) of the lithography machine. The lithography coordinate system is the reference coordinate system used for positioning and control of the lithography machine, and all engraving operations are performed based on this coordinate system. According to the positioning and frequency modulation information in the lithography strategy, control the lithography machine to accurately position the lithography target. During the engraving process, according to the setting and strategy of the frequency modulation node, adjust the parameters of the laser (such as power, frequency, etc.) in real time to meet the specific requirements in the lithography geometric map. This implementation method is configured through the CNC center, and the parameters and settings in the lithography strategy are input into the lithography machine to ensure that it can operate in the predetermined manner. The spatial placement of the lithography target is determined by scanning and converted into the lithography coordinate system to achieve precise positioning. These operations ensure that the lithography process can proceed smoothly according to the predetermined strategy, achieve the expected engraving effect, and meet various lithography needs.

[0047] In one possible implementation, after adaptive positioning and frequency modulation management of the laser engraving process of the lithography target, the method further includes: synchronously performing lithography monitoring and tracking to determine the real-time lithography energy efficiency; based on position mapping, calibrating the real-time lithography energy efficiency and the atlas lithography requirements to locate the resumption node, wherein the resumption node is marked with an energy efficiency difference; assisting the lithography controller to determine the resumption frequency modulation strategy based on the resumption node, and transmitting it to the CNC center of the lithography machine.

[0048] Specifically, during the laser engraving process, sensors or monitoring equipment are used to collect engraving data of the lithography target in real time, including laser power, engraving speed, engraving depth, etc. According to the collected engraving data, the real-time lithography energy efficiency is calculated, that is, the utilization efficiency of laser energy in the lithography process, which reflects the ability of laser energy to be converted into lithography effect. Energy efficiency can be defined by the ratio of actual engraving depth to laser energy, or by the ratio of actual engraving depth to expected engraving depth. For example, if the actual engraving depth is 0.4mm and the expected engraving depth is 0.5mm, then the real-time lithography energy efficiency = 0.4 / 0.5 = 0.8; or if the laser power is 100W, the real-time lithography energy efficiency = 0.4 / 100 = 0.004mm / W. Compare the real-time lithography energy efficiency with the requirements in the predetermined lithography geometry map. Through position mapping, the real-time lithography energy efficiency is corresponded to the specific position in the map to find out the position where there is a difference or does not meet expectations. During the proofreading process, the position that needs to be resumed or adjusted, that is, the resumption node, is identified. For each resumption node, the energy efficiency difference is calculated and identified, that is, the difference between the actual energy efficiency and the expected energy efficiency. According to the energy efficiency difference of the resumption node, the lithography controller is used to adjust the strategy. According to the size and nature of the energy efficiency difference, the lithography controller formulates corresponding resumption frequency modulation strategies, such as adjusting laser power, engraving speed or engraving depth. The determined resumption frequency modulation strategy is transmitted to the CNC center of the lithography machine through the communication interface or data cable. According to the received strategy instructions, the CNC center adjusts and controls the lithography machine accordingly to achieve the expected engraving effect of the resumption node. This implementation method can timely discover and locate the resumption nodes with large energy efficiency differences by real-time monitoring and tracking of the lithography process. By formulating and implementing the resumption frequency modulation strategy, the engraving effect can be improved, and the engraving quality and efficiency can be improved.

[0049] In the above, refer to Figure 1 The power adaptive control method for laser metal engraving according to an embodiment of the present invention is described in detail. Figure 2 A power adaptive control system for laser metal engraving according to an embodiment of the present invention is described.

[0050] The power adaptive control system for laser metal engraving according to the embodiment of the present invention is used to solve the technical problems of insufficient power control accuracy and low efficiency in the prior art, and achieve the technical effect of improving power control accuracy and efficiency. The power adaptive control system for laser metal engraving includes: a lithography geometry map determination module 10, a lithography strategy determination module 20, and an adaptive control module 30.

[0051] The lithography geometry determination module 10 is used to obtain the lithography requirements and lithography target characteristics, perform demand analysis, and determine the lithography geometry map, wherein the lithography geometry map is marked with frequency modulation nodes, and the lithography requirements are 2D etching or 3D etching; the lithography strategy determination module 20 is used to obtain the integrated grating structure of the lithography machine, introduce a lithography controller to perform two-order adjustment decisions based on the frequency modulation nodes for the lithography geometry map, and determine the lithography strategy, wherein the two-order adjustment includes first-order beam combining adjustment and second-order shaping adjustment; the adaptive control module 30 is used for the lithography strategy to respond to the lithography machine, assist the lithography coordinate system, and perform adaptive positioning and frequency modulation management on the laser engraving process of the lithography target.

[0052] The specific configuration of the lithography geometry map determination module 10 will be described in detail below. As described above, the requirements are analyzed to determine the lithography geometry map. The lithography geometry map determination module 10 may further include: a sequence requirement conversion unit for identifying the lithography requirements and converting them into sequence requirements based on the lithography trajectory in the entire lithography cycle, wherein the sequence requirements are identified with the lithography space angle and the lithography energy efficiency; a frequency modulation node determination unit for reading the lithography mode of the lithography machine, and determining the frequency modulation nodes of the sequence requirements with the lithography target characteristics as constraints to generate the lithography geometry map, wherein the lithography target characteristics at least include metal material characteristics.

[0053] Among them, the frequency modulation node determination unit may further include: a lithography mode acquisition subunit for acquiring the lithography mode, wherein the lithography mode is a single-track lithography mode or a multi-track collaborative mode; a lithography track division subunit for identifying the lithography track, and if the lithography mode is a multi-track collaborative mode, performing lithography track division on the lithography track to determine the pattern track division result; a demand trend change positioning subunit for locating the demand trend according to the pattern track division result by identifying the sequence demand, and identifying the frequency modulation node.

[0054] Among them, demand trend change positioning is performed to identify the frequency modulation node. The demand trend change positioning subunit may further include: a demand variable threshold setting component is used to set a first demand variable threshold and a second demand variable threshold, wherein the first demand variable threshold is greater than the second demand variable threshold; a frequency modulation node identification component is used to identify trajectory trend changes. If it is greater than the first demand variable threshold, it is identified as a Class I frequency modulation node; if it is greater than the second demand variable threshold and less than or equal to the first demand variable threshold, it is identified as a Class II frequency modulation node, wherein the Class I frequency modulation node performs first-order beam combining regulation and second-order shaping regulation, and the Class II frequency modulation node performs second-order shaping regulation.

[0055] The specific configuration of the lithography strategy determination module 20 will be described in detail below. As described above, the lithography controller is constructed, and the lithography strategy determination module 20 may further include: a spectral characteristic determination unit for identifying the integrated grating structure and determining the spectral characteristics of each grating unit; a lithography big data retrieval unit for performing lithography big data retrieval with the spectral characteristics as an index and retrieving the lithography record set; a lithography controller training unit for mining the laser beam combining conditions of the combined grating array through the lithography record set according to the spectral characteristics, and integrating the lithography record set as sample data to drive the training of the lithography controller, wherein the combined grating array is a combination of at least two grating units, and the lithography controller includes a laser beam combining block and a laser shaping block.

[0056] Among them, a two-order adjustment decision based on the frequency modulation node is performed to determine the lithography strategy. The lithography strategy determination module 20 may further include: a lithography geometric map importing unit is used to import the lithography geometric map into the lithography controller; a frequency modulation strategy determination unit is used to identify the frequency modulation node, if it is the first type of frequency modulation node, execute the beam combining grating decision based on the laser beam combining block and the parameter adjustment based on the laser shaping block to determine the first frequency modulation strategy, if it is the second type of frequency modulation node, execute the parameter adjustment based on the laser shaping block to determine the second frequency modulation strategy; the frequency modulation node mapping establishment unit is used to establish a frequency modulation node mapping with the first frequency modulation strategy and the second frequency modulation strategy and the lithography geometric map as the lithography strategy.

[0057] The specific configuration of the adaptive control module 30 will be described in detail below. As described above, the lithography strategy responds to the lithography machine, and the adaptive control module 30 may further include: a numerical control center configuration unit for performing numerical control center configuration on the lithography machine based on the lithography strategy; a lithography positioning and frequency modulation control unit for scanning and determining the spatial placement position of the lithography target, converting it to the lithography coordinate system, and performing lithography positioning and frequency modulation control based on the lithography strategy, wherein the lithography coordinate system is the control coordinate system of the lithography machine.

[0058] Among them, the lithography strategy determination module 20 may further include: an integrated grating structure acquisition unit for acquiring an integrated grating structure, wherein the integrated grating structure is a redundant structure; a backup unit triggering unit for triggering a backup unit based on the redundant structure to perform laser beam combining control if there is a faulty grating unit.

[0059] Among them, after the adaptive positioning and frequency modulation management of the laser engraving process of the lithography target, the system can further include: a real-time lithography energy efficiency determination module is used to synchronously perform lithography monitoring and tracking to determine the real-time lithography energy efficiency; a resumption of work node positioning module is used to calibrate the real-time lithography energy efficiency and the atlas lithography requirements according to position mapping, and locate the resumption of work node, wherein the resumption of work node is marked with an energy efficiency difference; a resumption of work frequency modulation strategy determination module is used to assist the lithography controller, determine the resumption of work frequency modulation strategy based on the resumption of work node, and transmit it to the CNC center of the lithography machine.

[0060] The power adaptive control system for laser metal engraving provided by the embodiment of the present invention can execute the power adaptive control method for laser metal engraving provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0061] Although the present application makes various references to certain modules in the system according to the embodiments of the present application, any number of different modules may be used and run on the user terminal and / or server, and the various units and modules included are only divided according to functional logic, but are not limited to the above division, as long as the corresponding functions can be achieved; in addition, the specific names of the functional units are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of the present invention.

[0062] The above specific implementation manner does not constitute a limitation to the protection scope of the present application. It should be understood by those skilled in the art that various modifications, combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application. In some cases, the actions or steps recorded in the present application can be performed in an order different from that in the embodiment and can still achieve the desired results. In addition, the process depicted in the accompanying drawings does not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

Claims

1. A power adaptive control method for laser metal engraving, characterized in that: The method comprises: Obtaining lithography requirements and lithography target characteristics, performing requirement analysis, and determining a lithography geometric map, wherein the lithography geometric map is marked with a frequency modulation node, and the lithography requirement is 2D etching or 3D etching; The integrated grating structure of the lithography machine is obtained, and according to the lithography geometric map, a lithography controller is introduced to make a two-order adjustment decision based on the frequency modulation node to determine the lithography strategy, wherein the two-order adjustment includes a first-order beam combining adjustment and a second-order shaping adjustment; The lithography strategy responds to the lithography machine and assists the lithography coordinate system to perform adaptive positioning and frequency modulation management on the laser engraving process of the lithography target.

2. The power adaptive control method for laser metal engraving according to claim 1, characterized in that: Perform requirements analysis and determine lithography geometry, including: Identify the lithography requirements and convert them into sequence requirements based on lithography tracks in the full lithography cycle, wherein the sequence requirements are identified by lithography space angle and lithography energy efficiency; The lithography mode of the lithography machine is read, and the frequency modulation node of the sequence requirement is determined based on the lithography target characteristics as constraints to generate the lithography geometric map, wherein the lithography target characteristics at least include metal material characteristics.

3. The power adaptive control method for laser metal engraving according to claim 2, characterized in that: The lithography mode is a single-track lithography mode or a multi-track collaborative mode; Identify the lithography track, and if the lithography mode is a multi-track collaborative mode, perform lithography track division on the lithography track, and determine a mode track division result; Based on the pattern track division result, the sequence demand is identified, the demand trend change is located, and the frequency modulation node is marked.

4. The power adaptive control method for laser metal engraving according to claim 3, characterized in that: Locating demand trend changes and identifying the frequency modulation nodes include: Setting a first demand variable threshold and a second demand variable threshold, wherein the first demand variable threshold is greater than the second demand variable threshold; By performing trajectory trend change identification, if it is greater than the first demand variable threshold, it is marked as a type of frequency modulation node; If it is greater than the second demand variable threshold and less than or equal to the first demand variable threshold, it is identified as a second-class frequency modulation node; The first type of frequency modulation node performs first-order beam combining regulation and second-order shaping regulation, and the second type of frequency modulation node performs second-order shaping regulation.

5. The power adaptive control method for laser metal engraving according to claim 4, characterized in that: Build a lithography controller, including: Identifying the integrated grating structure and determining the spectral characteristics of each grating unit; Using the spectral characteristics as an index, performing lithography big data retrieval to retrieve a lithography record set; According to the spectral characteristics, the laser beam combining conditions of the combined grating array are mined through the lithography record set, and the lithography record set is integrated as sample data to drive the training of the lithography controller, wherein the combined grating array is a combination of at least two grating units, and the lithography controller includes a laser beam combining block and a laser shaping block.

6. The power adaptive control method for laser metal engraving according to claim 5, characterized in that: Make two-stage modulation decisions based on the frequency modulation node to determine the lithography strategy, including: importing the lithography geometry map into the lithography controller; Identify the frequency modulation node, and if it is the first type of frequency modulation node, execute the beam combining grating decision based on the laser beam combining block and the parameter adjustment based on the laser shaping block to determine the first frequency modulation strategy; If it is the second type of frequency modulation node, perform parameter adjustment based on the laser shaping block to determine a second frequency modulation strategy; The first frequency modulation strategy and the second frequency modulation strategy are used to establish a frequency modulation node mapping with the lithography geometric map as the lithography strategy.

7. The power adaptive control method for laser metal engraving according to claim 1, characterized in that: The lithography strategy is responsive to a lithography machine and includes: Based on the lithography strategy, perform numerical control center configuration on the lithography machine; The spatial placement position of the lithography target is determined by scanning, converted to the lithography coordinate system, and lithography positioning and frequency modulation control based on the lithography strategy is performed, wherein the lithography coordinate system is a control coordinate system of the lithography machine.

8. The power adaptive control method for laser metal engraving according to claim 1, characterized in that: The integrated grating structure is a redundant structure; If there is a faulty grating unit, a backup unit based on the redundant structure is triggered to perform laser beam combining control.

9. The power adaptive control method for laser metal engraving according to claim 1, characterized in that: After adaptive positioning and frequency modulation management of the laser engraving process of the lithography target, including: Simultaneous lithography monitoring and tracking to determine real-time lithography energy efficiency; According to the position mapping, the real-time lithography energy efficiency and the atlas lithography requirement are checked to locate the work resumption node, wherein the work resumption node is marked with an energy efficiency difference; Assist the lithography controller to determine the resumption frequency modulation strategy based on the resumption node and transmit it to the CNC center of the lithography machine.

10. A power adaptive control system for laser metal engraving, characterized in that: The system is used to implement the power adaptive control method for laser metal engraving according to any one of claims 1 to 9, and the system comprises: A lithography geometry map determination module is used to obtain lithography requirements and lithography target characteristics, perform requirement analysis, and determine a lithography geometry map, wherein the lithography geometry map is marked with a frequency modulation node, and the lithography requirement is 2D etching or 3D etching; A lithography strategy determination module is used to obtain the integrated grating structure of the lithography machine, introduce a lithography controller to make a two-order adjustment decision based on the frequency modulation node according to the lithography geometric map, and determine the lithography strategy, wherein the two-order adjustment includes a first-order beam combining adjustment and a second-order shaping adjustment; The adaptive control module is used for the lithography strategy to respond to the lithography machine, assist the lithography coordinate system, and perform adaptive positioning and frequency modulation management on the laser engraving process of the lithography target.

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