Processing method and device for large-breadth thick glass

Abstract

The invention provides a processing method for large-breadth thick glass, which comprises the following steps: carrying out modification processing on the large-breadth thick glass on the surface of the large-breadth thick glass along a preset processing path by utilizing Bessel laser, dividing the large-breadth thick glass into a plurality of slicing areas by using a side contour cutting line consisting of a micropore array formed on the surface of the large-breadth thick glass; positioning through a CCD (Charge Coupled Device) camera, and carrying out chamfering processing on the modified large-breadth thick glass along a side edge contour cutting line by utilizing a profiling laser beam so as to form a chamfering cutting line which is consistent with the shape of the chamfer of the glass sheet to be obtained on the side edge of each slicing area; positioning through a CCD (Charge Coupled Device) camera, and carrying out splitting along a side contour cutting line by utilizing liquid nitrogen to obtain a plurality of glass sheets; and placing the plurality of glass sheets into an etching solution for chamfering, and etching off waste materials of edge chamfers after sheet cracking along the chamfering cutting lines. Therefore, the cutting and chamfering integration of the large-breadth thick glass is realized.

Description

Technical Field

[0001] The invention relates to the technical field of glass processing, and in particular to a processing method and device for large-format thick glass. Background Art

[0002] Large-format cover glass (also often called large-size cover glass) refers to glass materials with larger sizes used to cover or protect devices and screens. Usually, this type of glass plays the role of screen protection, visual effects and touch experience in electronic products (such as mobile phones, TVs, tablets, touch screens, etc.). Due to its large size, the quality of the materials required in the manufacturing process is high, and special attention is also required for processing accuracy and surface treatment technology.

[0003] In the 3C cover glass manufacturing and processing industry, the opening of large-format cover glass and the chamfering after opening are important links. In the prior art, after the large-format cover glass is cut into small pieces, it is split and then processed through a chamfering process before entering other subsequent processes. According to the processing method, the existing large-format glass splitting and chamfering processing technology is divided into three types: (1) full mechanical processing: the incoming large-format glass is cut into a preliminary shape by a cutter wheel, and then mechanically split into small pieces of glass, and then transferred to the CNC process, and the R-angle shape, side chamfer shape and drilling shape are ground by a grinding wheel; (2) mechanical and laser processing: the incoming large-format glass is cut by laser (Bessel light or filament cutting), and then split into small pieces of glass by CO2 laser, and then transferred to the CNC process, and the R-angle shape and side chamfer shape and drilling holes are ground by a grinding wheel; (3) full laser processing: the incoming large-format glass is cut by laser, and then split into small pieces of glass by CO2 laser, and then chamfering is performed through laser beam shaping technology.

[0004] The above method has the following defects: the existing full mechanical processing method has poor cutting quality, serious edge collapse, and many process steps. For non-straight line cutting (curves, arcs, wavy lines, etc.) such as R angle, C angle, U angle of the cutter wheel cutting shape, its flexibility and cutting quality are poor; the existing mechanical and laser processing methods require a large amount of ink to protect the glass surface from scratches during the CNC chamfering and grinding process, and a large amount of chemical liquid is required to remove the ink. At the same time, CNC processing will also consume a large amount of grinding fluid and grinding wheels, and the processing cost is high, which is not conducive to environmental protection; the existing full laser processing method separates the opening, cracking and chamfering of large-format glass into steps (that is, the cutting and chamfering modified layers are formed by laser in steps), with many processes and frequent glass circulation, resulting in scratches, bumps and other defects. The process integration is not high, and three laser equipment are required, which is costly.

[0005] In summary, the existing technology cuts the large-format cover glass into a blank shape, then splits it, processes it through a chamfering process, and finally enters the post-process. The processing steps are cumbersome, resulting in frequent circulation of glass, which may cause scratches, bumps, breakage and other defects. In addition, a lot of waste and consumables are generated from the blank to the final product, the cost is high, and the process integration is not high.

[0006] Based on this, a new solution is needed. Summary of the invention

[0007] The purpose of the present invention is to provide a processing method for large-format thick glass to achieve efficient and accurate glass cutting and chamfering, in view of the problems of complex operation, low precision, low efficiency and edge defects in the prior art.

[0008] An embodiment of the present invention provides a processing method for large-format thick glass, which is used to process a plurality of glass sheets with chamfers on the large-format thick glass, comprising the following steps:

[0009] Step S1, using a Bessel laser to perform modification processing on the surface of the large-format thick glass along a preset processing path, so as to form a side contour cutting line composed of a microhole array on the surface of the large-format thick glass, wherein the side contour cutting line divides the large-format thick glass into a plurality of opening areas;

[0010] Step S2, positioning by a CCD camera, and chamfering the modified large-format thick glass along the side contour cutting line using a profiling laser beam, so as to form a chamfer cutting line consistent with the shape of the chamfer of the desired glass sheet on the side of each opening area;

[0011] Step S3, positioning by a CCD camera, and using liquid nitrogen to split along the side contour cutting line to obtain multiple glass sheets;

[0012] Step S4, placing the plurality of glass sheets into an etching solution for chamfering, and etching away the waste of the edge chamfers after the glass sheets are broken along the chamfering cutting line.

[0013] In the processing method for large-format thick glass provided by the present invention, in the step S1, the laser power of the Bessel laser is 25-75W, the cutting speed is 50-1000mm / s, the dot spacing is 1-10um, and the frequency is 10-150kHz.

[0014] In the processing method for large-format thick glass provided by the present invention, in the step S2, the laser power of the profiling laser beam is 10-30W, the cutting speed is 50-1000mm / s, the dot spacing is 1-10um, and the frequency is 10-150kHz.

[0015] In the processing method for large-format thick glass provided by the present invention, in the step S1, the spacing between the multiple opening areas is 1-5 mm.

[0016] According to another aspect of the present invention, there is also provided a processing device for large-format thick glass, which is used in the method as described above, and the device comprises:

[0017] A dual-optical path system is used to generate two laser beams, the first beam is a Bessel laser beam used to split the large-format thick glass into multiple slice areas, and the second beam is a profiling laser beam used to chamfer the modified large-format thick glass along the side contour cutting line;

[0018] The rotating moving platform is used to place the glass to be processed, and the glass is placed under the first light beam and the second light beam for processing.

[0019] The implementation of the embodiments of the present invention has the following beneficial effects: in the processing method for large-format thick glass provided by the present invention, the large-format thick glass is directly divided into a plurality of opening areas through the Bessel laser modification of step S1 and the contour laser modification of step S2, and a chamfering cutting line is formed on each opening area, thereby realizing the integration of cutting and chamfering of the large-format thick glass and reducing the number of glass circulation times; subsequently, small pieces of glass with a preset chamfered shape are formed through the liquid nitrogen splitting of step S3 and the chemical etching of step S4; the entire processing process generates no mechanical force, effectively reduces edge collapse and burr defects, and has high processing precision, high integration, low cost, and high processing flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 Shown is a flow chart of a processing method for large-format thick glass provided by the present invention;

[0022] Figure 2 Shown is a processing schematic diagram and a corresponding physical diagram of a processing method for large-format thick glass provided by the present invention;

[0023] Figure 3 Shown is a schematic diagram of a preset path for a processing method for large-format thick glass provided by the present invention;

[0024] Figure 4 Shown is a schematic structural diagram of a processing device for large-format thick glass provided by the present invention. DETAILED DESCRIPTION

[0025] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Typical embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0027] In order to better understand the above-mentioned technical scheme, the above-mentioned technical scheme will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the embodiments of the present invention and the specific features in the embodiments are detailed descriptions of the technical scheme of the present application, rather than limitations on the technical scheme of the present application. In the absence of conflict, the embodiments of the present invention and the technical features in the embodiments can be combined with each other.

[0028] Figure 1 FIG. 2 is a flow chart of a method for processing large-format thick glass provided by the present invention. Figure 1 As shown, the processing method for large-format thick glass provided by the embodiment of the present invention comprises the following steps:

[0029] Step S1, using a Bessel laser to perform modification processing on the surface of the large-format thick glass along a preset processing path, so as to form a side contour cutting line composed of a microhole array on the surface of the large-format thick glass, wherein the side contour cutting line divides the large-format thick glass into a plurality of opening areas;

[0030] Specifically, in the prior art, laser cutting modification is performed by projecting a large number of focal points onto the glass cover plate. The energy of these focal points is configured to act on the glass cover plate to achieve the modification effect, that is, these focal points are closely distributed to form a curved surface consistent with the side contour and chamfer shape of the glass sheet. Normally, the laser power is limited. For example, if there are 80 or 1000 focal points, the energy of each point will be evenly distributed. Therefore, for such thicker glass, more focal points will be required for modification, resulting in very small energy of each focal point, making it difficult to generate enough heat for cutting, and it is impossible to complete the modification of the side contour and chamfer in one step. In the present application, the large-format thick glass is first modified along a preset processing path on the surface of the large-format thick glass by a Bessel laser to form a side contour cutting line (such as a microhole array) composed of a microhole array on the surface of the large-format thick glass. Figure 2 The dashed line A1 is shown.

[0031] Bessel laser technology is a laser technology that uses a special beam shape. Unlike conventional Gaussian beams, Bessel beams have unique self-healing and non-diffraction properties. Bessel beams can maintain a good focusing effect over a long distance, avoiding the diffusion of energy during the transmission of conventional laser beams. Bessel beams not only provide high-intensity laser energy at the focal point, but also maintain strong energy in other areas of the beam, which is particularly important for the processing of thick glass. At the same time, Bessel lasers form tiny areas of high energy density on the surface of the glass, and through high temperature, certain areas of the glass undergo physical and chemical changes (such as surface hardening or microcrack formation). This modification helps to reduce energy consumption in subsequent cutting, avoid the accumulation of thermal stress, and reduce the generation of cracks. By precisely controlling the position of the laser focus, a microhole array can be formed on the glass surface along a predetermined path. The role of these microhole arrays is to provide a pre-mark of the cutting line, that is, the glass will easily split along the path defined by the laser in these microhole areas. These microhole arrays can not only effectively control the cutting direction of the glass, but also make the glass crack more smoothly during subsequent cutting through certain physical effects (such as stress concentration), reducing irregularities in the cutting process.

[0032] Specifically, in this embodiment, Bessel laser technology is used to generate a laser beam on a large-format thick glass surface along a preset path (such as Figure 3The glass can be effectively divided into multiple opening areas by forming multiple side contour cutting lines (as shown in the figure). Each opening area corresponds to a single piece of glass to be formed. First, a preset path is designed on the glass surface according to the size and shape of the glass piece to be cut. Then, the Bessel laser beam is irradiated along these preset paths on the glass surface. Thus, multiple side contour cutting lines are formed on the glass surface according to the preset path by the Bessel laser. These cutting lines can be gradually formed by continuous laser scanning, and each cutting line will form a tiny crack or modified area on the glass surface. By precisely controlling the energy and scanning speed of the laser, these contour cutting lines not only play a guiding role, but also provide stress concentration points in the subsequent cutting process, so that the glass can be broken smoothly along these predetermined cutting lines. Through the multiple side contour cutting lines formed on the glass surface, the entire large-format thick glass is divided into multiple opening areas. Each opening area corresponds to an independent glass piece to be formed. Since these cutting lines form pre-made microcracks or weakened areas on the glass surface, the glass can be easily broken according to these areas in the subsequent processing process, avoiding the fragmentation caused by uneven thermal stress or operational errors in the traditional cutting method.

[0033] This embodiment uses Bessel laser technology to form multiple side contour cutting lines on the surface of large-format thick glass. Through precise laser scanning path design, it ensures that the glass can be smoothly divided into multiple opening areas in the subsequent cutting process.

[0034] Step S2, positioning by a CCD camera, and chamfering the modified large-format thick glass along the side contour cutting line using a profiling laser beam, so as to form a chamfer cutting line consistent with the shape of the chamfer of the desired glass sheet on the side of each opening area;

[0035] Specifically, in one embodiment of the present invention, after the large-format thick glass surface is opened by Bessel laser, in order to chamfer each small piece of glass, it is necessary to use the second optical path of the profiling laser beam to process along the original path. Therefore, the large-format glass needs to be moved to the second optical path through the moving platform for operation. During the movement, the glass may produce errors relative to the original position due to the movement. Therefore, in order to improve the positioning accuracy, in this embodiment, the CCD camera is combined for positioning, and the position of the side contour cutting line is captured by the CCD camera. Then, the profiling laser beam is controlled to perform chamfering in each opening area according to the position of the captured side contour line, forming a chamfered cutting line (such as Figure 2 dotted lines A2 and A3 shown).

[0036] In this embodiment, in order to compensate for the displacement error that may occur in the glass on the mobile platform, a CCD camera is used for real-time positioning. The CCD camera can capture the position of the side contour cutting line on the glass surface with high precision, thereby monitoring the position change of the glass in real time. After the CCD camera captures the position of the side contour cutting line on the glass surface, the data is transmitted to the control system. Then, the profiling laser beam of the second optical path is used to perform chamfering along the captured side contour cutting line. The profiling laser beam has tracking properties and can be accurately processed along the preset path of the glass to form a chamfered cutting line consistent with the desired chamfered shape. By combining the positioning feedback of the CCD camera and the precise processing of the profiling laser, the chamfered shape of each opening area is guaranteed to be consistent with the predetermined design. High-precision positioning and chamfering processing reduce processing errors, avoid waste of glass materials, and improve overall production efficiency.

[0037] Furthermore, in one embodiment of the present invention, in order to avoid ablation during the chamfering process, the spacing between multiple open areas is designed to be 1-5mm to ensure that the problem of ablation of adjacent areas will not occur during the second optical path modification process. When the profiling laser beam is performing chamfering, its size and focal length must be precisely controlled to ensure that the beam only acts on the target chamfering area and does not exceed the predetermined chamfering range. If the beam size is designed to be too large, or the focus adjustment is not accurate, it is possible to ablate the adjacent open area. Therefore, when designing the profiling beam, it must be strictly adjusted according to the size and chamfering requirements of the glass sheet to avoid beam overflow. The spacing between the open areas of multiple glass sheets is set to 1-5mm to avoid beam crossing or overflow between adjacent areas. The setting of this spacing can effectively ensure that when each glass sheet is chamfered, the impact of the beam on the adjacent sheet area is minimized. In this way, no matter how the size and focus of the laser beam are adjusted, it will not cause ablation to the adjacent area, thereby ensuring the edge processing quality of each piece of glass.

[0038] This embodiment uses CCD camera for positioning and combines with profiling laser beam to chamfer large-format thick glass, effectively improving the accuracy and consistency of chamfering. This method can compensate for the error caused by glass movement and ensure that the chamfer cutting line of each glass piece is accurate and meets the requirements of high-quality glass processing.

[0039] Step S3, positioning by a CCD camera, using liquid nitrogen to cut along the side contour and perform splitting to obtain multiple glass sheets.

[0040] Specifically, in the present embodiment, after Bessel laser modification and contour laser modification, a clear cutting line is formed on each opening area of ​​the glass sheet. Through CCD camera positioning, the system can accurately identify and locate the position of the side contour cutting line. In the process of splitting large-format thick glass, due to the large size of the glass, the traditional chemical etching splitting method is not applicable. The temperature of liquid nitrogen is extremely low (about -196°C). During the splitting process, liquid nitrogen can quickly reduce the surface temperature of the glass to a very low level. When the glass is cooled by liquid nitrogen, internal stress will be generated on the surface due to the sudden drop in temperature, causing the glass to crack along the preset cutting line under certain conditions. This technology can efficiently split large-format thick glass into multiple small pieces, avoid the stress concentration problem in traditional mechanical cutting methods, and reduce the risk of glass breakage.

[0041] In this embodiment, there is no direct mechanical contact during the liquid nitrogen splitting process, which reduces glass breakage and surface defects caused by physical friction, and is particularly suitable for thicker glass. Through the high-precision positioning of the CCD camera, the liquid nitrogen splitting can be performed along the side cutting line, ensuring that the split edge of each piece of glass is flat and regular, thereby greatly improving the quality and use value of the finished product.

[0042] Compared with the traditional mechanical cutting or chemical etching splitting method, this method has the following advantages: CCD camera ensures the accuracy of the cutting path and avoids the problem of irregular splitting caused by position deviation; liquid nitrogen splitting technology can quickly complete the splitting of large-format glass, improve production efficiency, and reduce the waste of glass materials; the non-mechanical contact splitting method reduces damage to the glass surface and ensures the quality of each piece of glass. Therefore, combining CCD positioning and liquid nitrogen splitting technology can achieve high-quality cutting and splitting of large-format glass on the basis of high precision and high efficiency.

[0043] Step S4, placing the plurality of glass sheets into an etching solution for chamfering, and etching away the waste of the edge chamfers after the glass sheets are broken along the chamfering cutting line.

[0044] Specifically, in step S4, multiple glass sheets are placed in an etching solution for chamfering to remove the waste of chamfering the glass edges after the glass pieces are broken and to optimize the strength and surface quality of the glass sheets. In this embodiment, a high-temperature strong alkali solution is used as an etching solution. This solution can effectively remove burrs and residual chamfering waste on the glass edges, release stress in the glass through chemical reactions, and flatten the glass surface. Specifically: there will be certain burrs or irregular chamfers on the edge of the glass after cracking. These edge wastes not only affect subsequent processing, but may also affect the appearance and quality of the glass. High-temperature strong alkaline solutions can quickly dissolve these wastes to make the edges smooth; during the laser cutting process, due to temperature changes and rapid cooling, the glass will produce local internal stresses. These uneven stresses may affect the strength and stability of the glass. Chemical etching can redistribute the internal stress by dissolving part of the material on the edges and chamfers, help balance the overall stress of the glass, and reduce the risk of breakage in subsequent use; laser cutting will produce tiny cracks at high temperatures. These cracks may be hidden on the surface or edge of the glass, affecting its mechanical properties. Chemical etching can remove the microcracks caused by laser processing and further improve the mechanical strength of the glass.

[0045] In this embodiment, chemical etching can form a very uniform chamfer on the edge of the glass sheet, remove the waste after the crack, and make the appearance of the glass flatter and smoother. By releasing internal stress and eliminating microcracks, the overall strength of the glass sheet is significantly improved. Etched glass usually has better mechanical properties and crack resistance. By removing burrs and waste and releasing uneven internal stress, it can effectively prevent breakage or deformation during subsequent processing or use.

[0046] Thus, through the Bessel laser modification of step S1 and the contour laser modification of step S2, the large-format thick glass is directly divided into multiple opening areas, and at the same time, a chamfering cutting line is formed on each opening area, realizing the integration of cutting and chamfering of the large-format thick glass, and reducing the number of glass circulation times. Subsequently, a small piece of glass with a preset chamfered shape is formed through the liquid nitrogen splitting of step S3 and the chemical etching of step S4. The entire processing process does not generate mechanical force, effectively reducing edge collapse and burr defects, and has high processing accuracy, high integration, low cost, and high processing flexibility.

[0047] The embodiment of the present invention also provides a processing device for large-format thick glass, which is used in the above processing method. Figure 4The device includes a picosecond laser 1, a beam splitter prism 2, a second beam expander 3, a first beam expander 4, a Bessel cutting head 5, a plurality of reflectors 6, a 1 / 2 wave plate 7, a 1 / 4 wave plate 8, a DOE (Diffractive optical element) lens 9, a focusing lens 10, a processed glass 11, and an X / Y moving platform 12. The infrared picosecond laser has a wavelength of 1060-1064nm, a maximum output power of 120W, and an adjustable pulse width of 190fs-200ps. The beam splitter prism 2 is used to divide the optical path of the laser 1 into two, the first optical path is a Bessel cutting optical path, which is composed of a first beam expander 4 and a Bessel cutting head 5; the second optical path is a contoured beam cutting optical path, which is composed of a second beam expander 3, a 1 / 2 wave plate 7, a 1 / 4 wave plate 8, a DOE lens 9, a focusing lens 10, and a plurality of reflectors 6.

[0048] Specifically, in the present embodiment, in the first optical path, the first beam expander 4 performs beam expansion processing on the light beam of the picosecond laser to match the beam size requirement of the Bessel cutting head 5, and the light beam is focused by the Bessel cutting head to process the glass 11. The Bessel cutting head 5 is composed of a plurality of lenses, and the Bessel laser cutting head includes a conical lens, a first focusing lens, a second focusing lens, a third focusing lens and a fourth focusing lens arranged in sequence, wherein the conical lens is used to generate a Bessel laser beam, the first focusing lens and the second focusing lens form a first 4f system for changing the focal depth length and the spot diameter of the Bessel laser beam, and the third focusing lens and the fourth focusing lens form a second 4f system for changing the working distance of the Bessel laser beam. The laser power of the Bessel laser is 25-75W, the cutting speed is 50-1000mm / s, the dot spacing is 1-10um, and the frequency is 10-150kHz.

[0049] Specifically, in the second optical path, the second beam expander 3 expands the beam of the picosecond laser, changes the polarization state of the beam through the 1 / 2 wave plate 7 and the 1 / 4 wave plate 8, and then passes through the DOE lens 9 to generate a profiling beam, and the profiling beam is focused to the required size by the focusing objective lens 10 (focusing magnification 20x, 50x, selected according to the glass thickness) and then chamfers the glass 11. The laser power of the profiling laser beam is 10-30W, the cutting speed is 50-1000mm / s, the dot spacing is 1-10um, and the frequency is 10-150kHz.

[0050] Specifically, in this embodiment, the positioning function of the CCD camera is used to cooperate with the liquid nitrogen splitting and the second laser to perform chamfering operations. The horizontal translation and rotation can be achieved through the X / Y moving platform 12 to move the glass 11 to achieve cutting, splitting, chamfering and other actions.

[0051] The processing method for large-format thick glass provided by the present invention has the following advantages:

[0052] 1. In the traditional process, glass may need to be transported and processed many times (such as opening and chamfering), but in this process, the opening and chamfering are completed at one time, which greatly reduces the circulation of glass. Fewer circulation times reduce the problems of bumps and scratches on the glass during transportation, thereby improving the overall yield rate.

[0053] 2. Compared with the traditional CNC chamfering method, this process has a significant advantage in chamfering time. The CNC chamfering time is about 7 minutes, while the new process chamfering time is only 3 minutes, which improves the efficiency by about 57%. This efficiency improvement comes from the fast cutting capability of laser modification technology and the optimization of integrated process, which reduces the time waste in each processing link. The automation and precision of the laser system enable each step to be completed in a very short time, improving production efficiency.

[0054] 3. This process not only improves efficiency, but also has significant advantages in cost, which are mainly reflected in the following aspects:

[0055] Fewer glass transfers: This reduces the handling and operation of glass between different workstations, reduces labor costs, and reduces equipment maintenance and loss related to handling.

[0056] Fewer operators: Due to the high degree of process integration and automation, the number of operators and the difficulty of operation are greatly reduced, further reducing labor costs.

[0057] Reduce consumables costs: Traditional CNC chamfering requires the use of consumables such as grinding wheels and grinding fluids, while laser technology produces almost no such consumables, thus significantly reducing production costs. In addition, using fewer devices (such as several laser systems) improves space utilization and reduces floor space.

[0058] 4. This process not only ensures production efficiency, but also greatly improves the yield rate of glass, especially in the process of chamfering and opening:

[0059] - No mechanical force: The mechanical force-free characteristics of laser cutting and chemical etching avoid the problems of edge collapse, burrs, defects, etc. that may occur in traditional processing, and reduce the mechanical stress and deformation in glass processing.

[0060] -High-precision positioning: Through the high-precision control of the CCD positioning system, the accuracy of the chamfering line and the opening line is ensured, thereby improving the appearance and dimensional accuracy of the glass products.

[0061] -Reduce scratches and bumps: Due to the reduction in the number of circulation times and the avoidance of mechanical contact throughout the process, the surface of the glass is not easily contaminated by scratches, bumps, fingerprints, etc., and the quality of the final product is significantly improved.

[0062] 5. Through the integrated design of several devices, the entire production line occupies a small area, which not only saves factory space, but also reduces the coordination and transfer between equipment, further improving the utilization efficiency of factory space.

[0063] The present invention integrates Bessel laser modification, contour laser modification, liquid nitrogen splitting and chemical etching technology, successfully realizes the integration of glass cutting and chamfering, improves processing efficiency, reduces production costs, and improves product yield. By reducing the number of glass circulations, reducing mechanical forces, and optimizing the production process, the advantages of this process are not only reflected in high efficiency and low cost, but also ensure high quality and high precision, which is very suitable for the processing needs of large-format thick glass.

[0064] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0065] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, various features of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting the intention that the claimed invention requires more features than those explicitly recited in each claim. More specifically, as reflected in the claims below, inventive aspects lie in less than all the features of the individual embodiments disclosed above. Therefore, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, with each claim itself serving as a separate embodiment of the present invention.

[0066] In addition, those skilled in the art will appreciate that, although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present invention and form different embodiments. For example, in the claims below, any one of the claimed embodiments may be used in any combination.

[0067] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present invention may be implemented by means of hardware comprising a number of different elements and by means of a suitably programmed computer. In a unit claim enumerating a number of devices, several of these devices may be embodied by the same hardware item. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

Claims

1. A method for processing large-format thick glass, used for processing a plurality of glass sheets with chamfers on the large-format thick glass, characterized in that: The following steps are involved: Step S1, using a Bessel laser to perform modification processing on the surface of the large-format thick glass along a preset processing path, so as to form a side contour cutting line composed of a microhole array on the surface of the large-format thick glass, wherein the side contour cutting line divides the large-format thick glass into a plurality of opening areas; Step S2, positioning by a CCD camera, and chamfering the modified large-format thick glass along the side contour cutting line using a profiling laser beam, so as to form a chamfer cutting line consistent with the shape of the chamfer of the desired glass sheet on the side of each opening area; Step S3, positioning by a CCD camera, and using liquid nitrogen to split along the side contour cutting line to obtain multiple glass sheets; Step S4, placing the plurality of glass sheets into an etching solution for chamfering, and etching away the waste of the edge chamfers after the glass sheets are broken along the chamfering cutting line.

2. The processing method for large-format thick glass according to claim 1, characterized in that: In the step S1, the laser power of the Bessel laser is 25-75 W, the cutting speed is 50-1000 mm / s, the dot spacing is 1-10 um, and the frequency is 10-150 kHz.

3. The processing method for large-format thick glass according to any one of claim 1, characterized in that: In the step S2, the laser power of the profiling laser beam is 10-30 W, the cutting speed is 50-1000 mm / s, the dot spacing is 1-10 um, and the frequency is 10-150 kHz.

4. The processing method for large-format thick glass according to claim 1, characterized in that: In the step S1, the spacing between the multiple opening areas is 1-5 mm.

5. A processing device for large-format thick glass, used in the method according to any one of claims 1 to 4, characterized in that: The device comprises: A dual-optical path system is used to generate two laser beams, the first beam is a Bessel laser beam used to split the large-format thick glass into multiple slice areas, and the second beam is a profiling laser beam used to chamfer the modified large-format thick glass along the side contour cutting line; The rotating moving platform is used to place the glass to be processed, and the glass is placed under the first light beam and the second light beam for processing.

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