Two-component organic silicon heat-conducting pouring sealant with excellent flexibility and preparation method of two-component organic silicon heat-conducting pouring sealant
By using two-component silicone thermal potting glue and in-situ modification method in thermally conductive materials, the problem of imbalance in thermal conductivity, processing performance and mechanical properties in thermally conductive materials is solved, and efficient thermal management and flexibility are achieved, which is suitable for heat dissipation applications of microelectronic devices.
Patent Information
- Application Number
- CN202510040867.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-10
- Publication Date
- 2025-05-02
AI Technical Summary
The thermal conductivity, processing performance and mechanical properties in existing thermally conductive material systems are unbalanced, making it difficult to effectively manage heat and prevent thermal breakdown in microelectronic devices.
Two-component silicone thermal potting adhesives are used, including alumina fillers, polysiloxane matrix, crosslinking agents, chain extenders, catalysts, inhibitors and interface modifiers, and the alumina fillers are modified through in-situ modification method to improve thermal conductivity and flexibility.
It achieves a balance between thermal conductivity and flexibility, improves the heat dissipation effect and response speed of electronic devices, and is suitable for large capacitors and flexible electronic devices.
Abstract
Description
Technical Field
[0001] The invention relates to a two-component organic silicon heat-conducting potting adhesive and a preparation method thereof, belonging to the technical field of heat-conducting material preparation. Background Art
[0002] In the era of highly integrated microelectronic devices, effective heat management has become a critical issue in the design process. The key to solving thermal failure problems lies in ensuring that the large amount of heat generated by the heat source is dissipated in time, and preventing problems such as thermal breakdown inside the device where transistors are densely packed. In microelectronic devices, thermally conductive materials play a pivotal role. In a complex main device structure, different components may use different materials, resulting in a large number of interfaces. Secondly, during the packaging process, additional components such as heat dissipation elements are packaged together with the main device. Thermally conductive interfaces appear at the connection between the main device and these auxiliary components. The existence of interfaces is extremely unfavorable for heat transfer, involving complex interactions and scattering processes.
[0003] From a material perspective, thermally conductive composite materials play a vital role in electronic devices. These materials are specially designed to fill microgaps and solve surface irregularities that occur when electronic devices interface with heat dissipation components. The main goal is to reduce the thermal resistance that hinders interfacial heat transfer. In recent years, significant progress has been made in the material design and synthesis of high-performance thermally conductive composite materials. However, balancing various aspects such as thermal conductivity, processing performance and mechanical properties in the material system remains a major challenge. Therefore, the present invention proposes a two-component silicone thermally conductive potting compound with excellent flexibility and a preparation method thereof. Summary of the invention
[0004] The present invention aims to solve the problem of imbalance in thermal conductivity, processing performance and mechanical properties in the existing thermal conductive material system, and further proposes a two-component organic silicon thermal conductive potting adhesive with excellent flexibility and a preparation method thereof.
[0005] The technical solution adopted by the present invention to solve the above problems is: the present invention provides a two-component silicone thermal conductive potting adhesive with excellent flexibility, including alumina filler, a polysiloxane matrix, a crosslinking agent, a chain extender, a catalyst, an inhibitor and an interface modifier.
[0006] Furthermore, the mass proportions of the components are: 70-90 parts of alumina filler, 10-30 parts of polysiloxane matrix, 5-10 parts of crosslinking agent, 5-10 parts of chain extender, 0.01-5 parts of catalyst, 0.5-5 parts of inhibitor, and 0.1-5 parts of interface modifier.
[0007] Furthermore, the polysiloxane matrix is composed of one or more of single-end vinyl and polyvinyl silicone oils with a viscosity of 100-500 mPa·s and a vinyl content of 0.5-5%.
[0008] Further, the crosslinking agent is composed of one or more of the side hydrogen-containing silicone oils having a viscosity of 20-200 mPa·s and a hydrogen content of 0.05-5%;
[0009] The chain extender is composed of one or more of single-end hydrogen-containing or double-end hydrogen-containing silicone oils with a viscosity of 20-200 mPa·s and a hydrogen content of 0.05-5%.
[0010] Furthermore, the inhibitor is composed of one or more of 2-phenyl-3-butyn-2-ol, ethynyl cyclohexanol, 3-methyl-1-pentyn-3-ol, and 3,5-dimethyl-1-hexyn-3-ol.
[0011] Furthermore, the alumina filler is composed of one or more of alumina with a particle size of 30 μm, alumina with a particle size of 20 μm, alumina with a particle size of 10 μm, alumina with a particle size of 5 μm, alumina with a particle size of 2 μm, and alumina with a particle size of 1 μm.
[0012] Furthermore, the interface modifier is composed of one or more of dodecyltrimethoxysilane, γ-glycidyloxypropyltrimethoxysilane, aminopropyltriethoxysilane, butyltriethoxysilane, and methyltrimethoxysilane.
[0013] Furthermore, the catalyst is composed of one or more of 1000ppm, 3000ppm, and 5000ppm platinum catalysts.
[0014] The method for preparing a two-component silicone thermally conductive potting adhesive with excellent flexibility according to the present invention comprises the following steps:
[0015] Step 1, pre-treat the filler and the matrix by vacuum dehydration, weigh corresponding parts of aluminum powder and vinyl silicone oil, add them into a planetary mixer and pre-stir for 10 minutes, add an interface modifier, stir at 120°C and vacuum conditions for 0.5-2 hours, cool the reaction mixture to room temperature, and obtain the target thermal conductive potting glue base;
[0016] Step 2, uniformly mix the corresponding amount of base glue, hydrogen-containing silicone oil, inhibitor, and vinyl silicone oil to prepare a two-component potting glue A;
[0017] Step 3, prepare a two-component potting glue B glue by mixing corresponding parts of base glue, catalyst and hydrogen-containing silicone oil;
[0018] Step 4: Weigh the same mass of glue A and glue B, stir them evenly, remove bubbles in a vacuum oven, and fully cure them in an oven at 80° C. for 2 hours to obtain the organic silicon thermal conductive composite material.
[0019] The beneficial effects of the present invention are:
[0020] 1. The present invention adopts an in-situ modification method to modify the alumina filler using different modifiers, which reduces the cost while improving the thermal conductivity and flexibility of the elastomer composite material. It proposes new ideas and solutions for the heat dissipation of electronic equipment and the heat dissipation of 5G base station construction; the composite material obtained by the present invention can quickly dissipate heat to a larger area, with better heat dissipation effect and faster response;
[0021] 2. The process flow of the present invention is simple and convenient, and has low requirements on process conditions, and is suitable for applications in large capacitors and flexible electronic devices. Example
[0022] Example 1
[0023] The filler and the matrix were pre-treated by vacuum dehydration, 85 parts of alumina filler and 15 parts of vinyl silicone oil were weighed and added to a planetary mixer for pre-stirring for 10 minutes, 0.3 parts of butyl triethoxysilane were added, and stirring was carried out at 120°C under vacuum conditions for 1.5 hours, and the reaction mixture was cooled to room temperature to obtain the target thermal conductive potting glue base glue; 100 parts of the base glue were mixed with 7 parts of hydrogen-containing silicone oil, 0.01 parts of inhibitor, and 3 parts of vinyl silicone oil to prepare a two-component potting glue A glue; 100 parts of the base glue were mixed with 0.21 parts of platinum catalyst and 10 parts of vinyl silicone oil to prepare a two-component potting glue B glue;
[0024] The same mass of glue A and glue B were weighed, stirred evenly, vacuum-defoamed, and fully cured in an oven at 80° C. for 2 h to obtain the organic silicon thermal conductive composite material.
[0025] Example 2
[0026] The filler and the matrix were pre-treated by vacuum dehydration, 85 parts of alumina filler and 15 parts of vinyl silicone oil were weighed and added to a planetary mixer for pre-stirring for 10 minutes, 0.3 parts of γ-glycidyloxypropyltrimethoxysilane were added, and stirring was carried out at 120°C and vacuum conditions for 1.5 hours, and the reaction mixture was cooled to room temperature to obtain the target thermal conductive potting glue base glue; 100 parts of the base glue were mixed with 7 parts of hydrogenated silicone oil, 0.01 parts of inhibitor, and 3 parts of vinyl silicone oil to prepare a two-component potting glue A glue; 100 parts of the base glue were mixed with 0.21 parts of platinum catalyst and 10 parts of vinyl silicone oil to prepare a two-component potting glue B glue;
[0027] The same mass of glue A and glue B were weighed, stirred evenly, vacuum-defoamed, and fully cured in an oven at 80° C. for 2 h to obtain the organic silicon thermal conductive composite material.
[0028] Example 3
[0029] The filler and the matrix were pre-treated by vacuum dehydration, 85 parts of alumina filler and 15 parts of vinyl silicone oil were weighed and added to a planetary mixer for pre-stirring for 10 minutes, 0.3 parts of methyltrimethoxysilane were added, and stirring was carried out at 120°C under vacuum conditions for 1.5 hours, and the reaction mixture was cooled to room temperature to obtain the target thermal conductive potting glue base glue; 100 parts of the base glue were mixed with 7 parts of hydrogenated silicone oil, 0.01 parts of inhibitor, and 3 parts of vinyl silicone oil to prepare a two-component potting glue A glue; 100 parts of the base glue were mixed with 0.21 parts of platinum catalyst and 10 parts of vinyl silicone oil to prepare a two-component potting glue B glue;
[0030] The same mass of glue A and glue B were weighed, stirred evenly, vacuum-defoamed, and fully cured in an oven at 80° C. for 2 h to obtain the organic silicon thermal conductive composite material.
[0031] Example 4
[0032] The filler and the matrix were pre-treated by vacuum dehydration, 85 parts of alumina filler and 15 parts of vinyl silicone oil were weighed and added to a planetary mixer for pre-stirring for 10 minutes, 0.3 parts of aminopropyl triethoxysilane were added, and stirring was carried out at 120°C under vacuum conditions for 1.5 hours, and the reaction mixture was cooled to room temperature to obtain the target thermal conductive potting glue base glue; 100 parts of the base glue were mixed with 7 parts of hydrogen-containing silicone oil, 0.01 parts of inhibitor, and 3 parts of vinyl silicone oil to prepare a two-component potting glue A glue; 100 parts of the base glue were mixed with 0.21 parts of platinum catalyst and 10 parts of vinyl silicone oil to prepare a two-component potting glue B glue;
[0033] The same mass of glue A and glue B were weighed, stirred evenly, vacuum-defoamed, and fully cured in an oven at 80° C. for 2 h to obtain the organic silicon thermal conductive composite material.
[0034] Example 5
[0035] The filler and the matrix were pre-treated by vacuum dehydration, 85 parts of alumina filler and 15 parts of vinyl silicone oil were weighed and added to a planetary mixer for pre-stirring for 10 minutes, 0.3 parts of dodecyltrimethoxysilane were added, and stirring was carried out at 120°C and vacuum conditions for 1.5 hours, and the reaction mixture was cooled to room temperature to obtain the target thermal conductive potting glue base glue; 100 parts of the base glue were mixed with 7 parts of hydrogenated silicone oil, 0.01 parts of inhibitor, and 3 parts of vinyl silicone oil to prepare a two-component potting glue A glue; 100 parts of the base glue were mixed with 0.21 parts of platinum catalyst and 10 parts of vinyl silicone oil to prepare a two-component potting glue B glue;
[0036] The same mass of glue A and glue B were weighed, stirred evenly, vacuum-defoamed, and fully cured in an oven at 80° C. for 2 h to obtain the organic silicon thermal conductive composite material.
[0037] The performance tests of the thermally conductive composite materials obtained in Examples 1 to 6 are shown in the following table:
[0038] Thermal conductivity (W / m·K) Tensile strength(MPa) Elongation(%) Example 1 1.59 0.78 87.21 Example 2 1.48 0.99 75.45 Example 3 1.47 1.01 68.51 Example 4 1.44 0.81 69.76 Example 5 1.58 0.65 83.73
[0039] The two-component silicone thermally conductive potting compound with excellent flexibility prepared in Examples 1-5 ensures the thermal conductivity and processing performance of the potting compound. In view of its mechanical properties, this advanced thermally conductive composite material shows great application potential in flexible electronics, electronic packaging and heat dissipation of large capacitors.
[0040] The above is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent replacement and improvement made to the above embodiments without departing from the content of the technical solution of the present invention, based on the technical essence of the present invention, within the spirit and principles of the present invention, still fall within the protection scope of the technical solution of the present invention.
Claims
1. A two-component silicone thermally conductive potting adhesive with excellent flexibility, characterized in that: The invention comprises an alumina filler, a polysiloxane matrix, a cross-linking agent, a chain extender, a catalyst, an inhibitor and an interface modifier.
2. A two-component silicone thermally conductive potting adhesive with excellent flexibility according to claim 1, characterized in that: The mass proportions of the components are: 70-90 parts of alumina filler, 10-30 parts of polysiloxane matrix, 5-10 parts of crosslinking agent, 5-10 parts of chain extender, 0.01-5 parts of catalyst, 0.5-5 parts of inhibitor, and 0.1-5 parts of interface modifier.
3. The two-component silicone thermally conductive potting adhesive with excellent flexibility according to claim 1, characterized in that: The polysiloxane matrix is composed of one or more of single-end vinyl and polyvinyl silicone oils with a viscosity of 100-500 mPa·s and a vinyl content of 0.5-5%.
4. The two-component silicone thermally conductive potting adhesive with excellent flexibility according to claim 1, characterized in that: The crosslinking agent is composed of one or more of the side hydrogen-containing silicone oils with a viscosity of 20-200 mPa·s and a hydrogen content of 0.05-5%; The chain extender is composed of one or more of single-end hydrogen-containing or double-end hydrogen-containing silicone oils with a viscosity of 20-200 mPa·s and a hydrogen content of 0.05-5%.
5. The two-component silicone thermally conductive potting adhesive with excellent flexibility according to claim 1, characterized in that: The inhibitor is composed of one or more of 2-phenyl-3-butyn-2-ol, ethynyl cyclohexanol, 3-methyl-1-pentyn-3-ol and 3,5-dimethyl-1-hexyn-3-ol.
6. The two-component silicone thermally conductive potting adhesive with excellent flexibility according to claim 1, characterized in that: The alumina filler is composed of one or more of alumina with a particle size of 30 μm, alumina with a particle size of 20 μm, alumina with a particle size of 10 μm, alumina with a particle size of 5 μm, alumina with a particle size of 2 μm, and alumina with a particle size of 1 μm.
7. The two-component silicone thermally conductive potting adhesive with excellent flexibility according to claim 1, characterized in that: The interface modifier is composed of one or more of dodecyl trimethoxy silane, gamma-glycidyloxypropyl trimethoxy silane, aminopropyl triethoxy silane, butyl triethoxy silane and methyl trimethoxy silane.
8. The two-component silicone thermally conductive potting adhesive with excellent flexibility according to claim 1, characterized in that: The catalyst is composed of one or more of 1000ppm, 3000ppm and 5000ppm platinum catalysts.
9. A method for preparing a two-component silicone thermally conductive potting adhesive with excellent flexibility, characterized in that: The specific steps include: Step 1, pre-treat the filler and the matrix by vacuum dehydration, weigh corresponding parts of aluminum powder and vinyl silicone oil, add them into a planetary mixer and pre-stir for 10 minutes, add an interface modifier, stir at 120°C and vacuum conditions for 0.5-2 hours, cool the reaction mixture to room temperature, and obtain the target thermal conductive potting glue base; Step 2, uniformly mix the corresponding amount of base glue, hydrogen-containing silicone oil, inhibitor, and vinyl silicone oil to prepare a two-component potting glue A; Step 3, prepare a two-component potting glue B glue by mixing corresponding parts of base glue, catalyst and hydrogen-containing silicone oil; Step 4: Weigh the same mass of glue A and glue B, stir them evenly, remove bubbles in a vacuum oven, and fully cure them in an oven at 80° C. for 2 hours to obtain the organic silicon thermal conductive composite material.