Method and apparatus for foundation leveling

Abstract

Various embodiments of the present technology may provide a base and a sensing system coupled to the base and configured to generate a plurality of sensor output signals indicative of air flow through the base and the sensing system. A controller is connected to the sensing system and configured to detect a flow pattern on the susceptor based on the sensor output signal.

Description

Technical Field

[0001] The present disclosure generally relates to methods and apparatus for pedestal leveling. More specifically, the present disclosure relates to pedestal leveling by a remote device. Background Art

[0002] Pedestal heaters used in semiconductor manufacturing may require periodic leveling. Traditionally, leveling is done manually (i.e., by hand), which involves the tedious process of adjusting each leveler one by one and taking measurements after each adjustment. Additionally, the small, crowded spaces in which the levelers are located make them difficult to access. Summary of the invention

[0003] Various embodiments of the present technology can provide a base and a sensing system, the sensing system coupled to the base and configured to generate a plurality of sensor output signals indicative of air flow through the base and the sensing system. A controller is coupled to the sensing system and configured to detect a flow pattern over the base based on the sensor output signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] A more complete understanding of the present technology may be obtained by referring to the detailed description when considered in conjunction with the following illustrative drawings.In the following drawings, like reference numerals refer to like elements and steps throughout the drawings.

[0005] Figure 1 A system according to an embodiment of the present technology is representatively shown;

[0006] Figure 2 A system according to an embodiment of the present technology is representatively shown;

[0007] Figure 3 Representatively illustrating a substrate mounting unit having a leveling assembly according to an embodiment of the present technology;

[0008] Figure 4 Representatively illustrating a leveling assembly according to an embodiment of the present technology;

[0009] Figure 5A representatively illustrates a cross-sectional view of a portion of a leveling assembly according to an embodiment of the present technology;

[0010] Figure 5B representatively illustrates a cross-sectional view of a portion of a leveling assembly according to an embodiment of the present technology;

[0011] Figure 6 representatively illustrates an exploded view of a leveling assembly according to an embodiment of the present technology;

[0012] Figure 7 Representatively illustrates an adjustment mechanism according to an embodiment of the present technology;

[0013] Figure 8 A portion of an adjustment mechanism according to an embodiment of the present technology is representatively shown; and

[0014] Fig. 9 is a flow chart for operating a system according to an embodiment of the present technology.

[0015] Fig.10 A portion of a system according to an embodiment of the present technology is representatively shown;

[0016] Fig.11 Representatively illustrates a sensing system according to an embodiment of the present technology;

[0017] Fig. 12A Representatively depicting a top view of an alternative sensing system according to an embodiment of the present technology;

[0018] Fig. 12B Representatively shows a schematic diagram according to an embodiment of the present technology. Fig. 12A A side view of a sensing system;

[0019] Fig.13A representatively illustrating a top view of an alternative sensing system in accordance with an embodiment of the present technology; and

[0020] Fig. 13B Representatively shows a schematic diagram according to an embodiment of the present technology. Fig.13A Side view of the sensing system. DETAILED DESCRIPTION

[0021] The present technology can be described in terms of functional block components and various processing steps. Such functional blocks can be implemented by any number of components configured to perform a specified function and achieve various results. For example, the present technology can use various gas pipelines, valves, power supplies, pressure controllers, and filters.

[0022] refer to Figure 1 and 2 , the exemplary system 100 may include a reactor 230, which includes an upper body 1600 and a lower body 1300. The upper body 1600 and the lower body 1300 may be connected to each other. In more detail, the upper body 1600 and the lower body 1300 of the reactor may form an internal space 500 and 1000, while being in surface contact and face sealing with each other. The reactor 230 may include a substrate mounting unit 300 (also referred to as a pedestal) and a ring 800 surrounding the substrate mounting unit 300 and arranged between the substrate mounting unit 300 and the upper body 1600 in the internal space 500 and 1000.

[0023] Reactor 230 can be configured to perform processing on an object to be processed, such as a substrate (e.g., a wafer). For example, reactor 230 can be configured to perform heating, deposition, etching, polishing, ion implantation, and / or other processing on an object to be processed. In some embodiments, reactor 230 can be configured to perform a moving function, a vacuum sealing function, a heating function, an exhaust function, and / or other functions of an object to be processed, so that the object is processed in the reactor. In an optional embodiment, reactor 230 can be a reactor in which an atomic layer deposition (ALD) or chemical vapor deposition (CVD) process is performed.

[0024] The upper body 1600 of the reactor may include a first gas inlet 225, a gas supply unit 200, an exhaust unit 600, and a ring 800. The lower body 1300 of the reactor may include a second gas inlet 900. The upper body 1600 and the substrate mounting unit 300 may form a reaction space 500. The lower body 1300 and the substrate mounting unit 300 may form a lower space 1000. The second gas generator 1900 may generate a filling gas, and the filling gas may be transmitted to the lower space 1000 through the second gas inlet 900.

[0025] The ring 800 may surround the substrate mounting unit 300 and may be arranged between the substrate mounting unit 300 and the upper body 1600. The ring 800 may generally have a circular ring shape, but is not limited thereto. For example, when the substrate mounting unit 300 has a quadrilateral shape, the ring 800 may have a quadrilateral annular shape. The ring 800 may be fixed to the upper body 1600. Alternatively, the ring 800 may be movably mounted on the upper body 1600.

[0026] The substrate mounting unit 300 may include a susceptor body 125 for supporting a substrate and a heater (not shown) for heating the substrate supported by the susceptor body 125. The heater may be embedded in the susceptor body 125. The substrate mounting unit 300 may further include a base 130 supporting the susceptor body 125. In order to load / unload the substrate, the substrate mounting unit 300 may be configured to be vertically movable by being connected to the driving unit 1100.

[0027] In various embodiments, the system 100 may further include a leveling assembly 250 coupled to the substrate mounting unit 300. For example, the leveling assembly 250 may be directly coupled to the base 130. The leveling assembly 250 may include a first plate P1 and a second plate P2. The second plate P2 may be on the first plate P1, and the first plate P1 and the second plate P2 may be connected to each other through the support unit SU.

[0028] In various embodiments, the leveling assembly 250 may include a plurality of support units, for example, a first support unit SU_V1 , a second support unit SU_V2 , a third support unit SU_V3 , and a fourth support unit SU_H1 .

[0029] The first plate P1 may be connected to the driving unit 1100. The first plate P1, the second plate P2, and the substrate mounting unit 300 may be moved by the driving of the driving unit 1100. In more detail, the driving force generated by the driving unit 1100 may be transmitted to the first plate P1, and the transmitted driving force may be transmitted from the first plate P1 to the second plate P2 through the supporting unit SU. As a result, by the driving of the driving unit 1100, the substrate mounting unit 300 connected to the second plate P2 may also be moved in the vertical direction (i.e., along the z-axis).

[0030] In various embodiments, the leveling assembly 250 may further include a position control unit PU. The position control unit PU may be configured to change the relative position of the second plate P2 with respect to the first plate P1 to maintain a constant interval of the reaction space 500 or a constant interval of the gap between the substrate mounting unit 300 and the ring 800.

[0031] The position control unit PU may include a plurality of horizontal position control units, such as a first horizontal adjustment mechanism PU_H1 , a second horizontal adjustment mechanism PU_H3 , and a third horizontal adjustment mechanism PU_H3 , configured to move the second plate P2 in a horizontal direction (along a horizontal plane).

[0032] The position control unit PU may further include a plurality of vertical position control units, such as a first vertical adjustment mechanism PU_V1 , a second vertical adjustment mechanism PU_V2 , and a third vertical adjustment mechanism PU_V3 , configured to move the second plate P2 in a vertical direction to tilt the substrate mounting unit 300 .

[0033] The driving unit 1100 may be configured to elevate the substrate mounting unit 300 to load / unload the substrate onto the substrate mounting unit 300. However, the position control unit PU may be configured to tilt the substrate mounting unit 300 to finely adjust the position of the substrate mounting unit 300. In addition, the driving unit 1100 may move the first plate P1 and the second plate P2 at the same time, while the position control unit PU may move only the second plate P2 without moving the first plate P1.

[0034] The driving unit 1100 and the position control unit PU may have moving ranges of different scales. The driving unit 1100 may have a moving range of, for example, several tens of centimeters, while the position control unit PU may have a moving range of several millimeters. In other words, the first moving range of the substrate mounting unit 300 moved by the driving unit 1100 may be greater than the second moving range of the substrate mounting unit 300 moved by the position control unit PU.

[0035] Each support unit SU may be configured to support the second plate P2. In more detail, a static support function and a dynamic support function of the support unit SU may be performed. First, regarding the static support function, the support unit SU may be configured to provide a fixing force for fixing the second plate P2 so that the substrate mounting unit 300 may be maintained at a specific intended position. In other words, the support unit SU may perform the function of supporting the second plate so that the second plate may maintain a static state.

[0036] Regarding the dynamic support function, when the second plate P2 is moved by the position control unit PU, the support unit SU can allow the second plate P2 to move. The support unit SU can provide a supporting force for the second plate P2 while allowing the second plate P2 to move. In other words, the support unit SU can support the second plate P2 relative to the relative movement of the second plate P2 relative to the first plate P1, and the support unit SU can support the second plate P2 in a dynamic state of the second plate P2.

[0037] The support unit SU may be configured to transmit a fixing force of the first plate P1 relative to the second plate P2 connected to the substrate mounting unit 300. In other words, the support unit SU may connect the first plate P1 to the second plate P2 so that the driving force generated by the driving unit 1100 can be transmitted from the first plate P1 to the second plate P2. Bolts or the like may be used for such a connection mechanism, but it should be noted that the transmission of the fixing force by bolts or the like causes the second plate P2 to be over-constrained (i.e., a state in which the second plate P2 is not allowed to move), thereby limiting the relative movement between the first plate P1 and the second plate P2.

[0038] On the other hand, according to the embodiment, the support unit SU can prevent the second plate P2 from being over-constrained by the position control unit PU. As described above, when the driving unit 1100 and the substrate mounting unit 300 are mechanically fixed using bolts or the like, fine adjustment of the substrate mounting unit 300 is impossible due to the over-constrained state. On the other hand, because the support unit SU according to the embodiment is configured to prevent such an over-constrained state, fine adjustment of the substrate mounting unit 300 can be achieved.

[0039] The expandable portion 1200 may be between the lower surface of the lower body 1300 and the second plate P2. The expandable portion 1200 may be disposed between the lower surface of the lower body 1300 and the second plate P2 to isolate the lower space 1000 from the outside.

[0040] The extendable portion 1200 may extend and contract according to the movement of the substrate mounting unit 300 and the second plate P2. For example, the extendable portion 1200 may have a corrugated structure (e.g., a bellows). When the first plate P1, the second plate P2, and the substrate mounting unit 300 are lifted by the driving unit 1100, the extendable portion 1200 may contract. When the first plate P1, the second plate P2, and the substrate mounting unit 300 are lowered by the driving unit 1100, the extendable portion 1200 may expand.

[0041] In an alternative embodiment, the extendable portion 1200 may be configured to have elasticity. For example, the elasticity of the extendable portion 1200 may be adjusted to extend or contract in response to the vertical movement of the substrate mounting unit 300, so that the shielding between the lower surface of the lower body 1300 and the second plate P2 can be maintained. Due to the shielding of the extendable portion 1200, the reaction space 500 and the lower space 1000 can be separated from the chamber space 1800.

[0042] The process gas introduced through the first gas inlet 100 may be supplied to the reaction space 500 and the substrate through the gas supply unit 200. The gas supply unit 200 may be a shower head, and the base of the shower head may include a plurality of gas supply holes formed to spray the process gas (e.g., in a vertical direction). The process gas supplied on the substrate may chemically react with the substrate or chemically react between gases, and then deposit a thin film on the substrate or etch a thin film.

[0043] In the reaction space 500, residual gas or unreacted gas remaining after a chemical reaction with the substrate may be exhausted to the outside through the exhaust space 700 and an exhaust pump (not shown) in the exhaust pipe 600. The exhaust method may be upper exhaust or lower exhaust.

[0044] It may be desirable to keep a constant distance between the lower surface of the gas supply unit 200 and the upper surface of the substrate on the substrate mounting unit 300. In other words, the distance between the substrate mounting unit 300 and the gas supply unit 200 at one end of the substrate mounting unit 300 needs to be equal to the distance between the substrate mounting unit 300 and the gas supply unit 200 at the other end of the substrate mounting unit 300.

[0045] The tilt and / or spacing adjustment performed during the process can be performed when the substrate is unloaded, such as during an idle state. For example, during an idle state in the process, fine calibration of the substrate mounting unit 300 can be automatically performed. For example, by remotely controlling the position control unit PU during an idle state or during substrate processing, fine calibration of the substrate mounting unit 300 can be performed without an operator entering the chamber space 1800.

[0046] In various embodiments, reference Figure 4 and Figure 6 , the second plate P2 may include first protrusions PR1, second protrusions PR2, and third protrusions PR3, which may be symmetrically arranged to have an angular distance of 120 degrees from each other.

[0047] In various embodiments, the leveling assembly 25 may further include a first bracket BR1 connected to the first plate P1. The first bracket BR1 may be configured separately from the first plate P1, or may be integrally formed with the first plate P1. In an exemplary embodiment, a first horizontal adjustment mechanism PU_H1 may be fixed to the first bracket BR1. The first horizontal adjustment mechanism PU_H1 fixed to the first plate P1 via the first bracket BR1 may apply a force to one side surface of the second plate P2, and by this force, the second plate P2 may move in a horizontal direction. In an exemplary embodiment, a first support unit SU_V1 may be fixed to the first plate P1, and may support the second plate P2 in a horizontal direction, while allowing the second plate P2 to move by a force generated by the horizontal position control unit PU_H1.

[0048] In addition, the leveling assembly 250 may further include a second bracket BR2 connected to the first plate P1. The second bracket BR2 may be configured separately from the first plate P1, or may be formed integrally with the first plate P1. In an exemplary embodiment, the second support unit SU_V2 may be fixed to the first plate P1, and may support the second plate P2 in a horizontal direction while allowing the second plate P2 to move by a force generated by the horizontal position control unit PU_H2.

[0049] Similarly, the leveling assembly 250 may further include a third bracket BR3 connected to the first plate P1. The second bracket BR2 may be configured separately from the first plate P1, or may be integrally formed with the first plate P1. In an exemplary embodiment, the third support unit SU_V3 may be fixed to the first plate P1, and may support the second plate P2 in a horizontal direction while allowing the second plate P2 to move. The fourth support unit SU_H1 adjacent to the third protrusion PR3 may contact a side surface of the third cover LD3 on the third protrusion PR3 to form a sixth contact point. Therefore, the fourth support unit SU_H1 between the third bracket BR and the side surface of the third protrusion PR3 may change the position of the third protrusion PR3 of the second plate P2 through the sixth contact point.

[0050] In more detail, the fourth supporting unit SU_H1 may change the position of the third protrusion PR3 by passively moving in response to active movements of the fourth position control unit PU_H1 and the fifth position control unit PU_H2.

[0051] The support unit SU may be on the bottom side surface of the second plate P2. In some embodiments, the position control unit PU and the support unit SU may be arranged symmetrically with respect to the center of the second plate P2. Therefore, each support unit SU may generate a support force (e.g., an elastic force) corresponding to the force generated by the corresponding horizontal position control unit PU and applied toward the side surface of the second plate P2.

[0052] The brackets BR1, BR2, and BR3 and the lower covers LC1, LC2, and LC3 may be installed to be fixed to the first plate P1 at positions where the first, second, and third protrusions PR1, PR2, and PR3 are arranged. The covers LD1, LD2, and LD3 may be installed to be fixed to the second plate P2 at positions where the first, second, and third protrusions PR1, PR2, and PR3 are arranged.

[0053] The covers LD1, LD2 and LD3 may be configured to be arranged on the upper surface of the protrusions, respectively, to provide contact points with the position control unit and / or the support unit. In an alternative embodiment, the covers may be implemented as integrated with the protrusions. In another embodiment, the covers may be implemented as separate configurations and mounted to be fixed to the second flat plate P2 (e.g., as shown in FIG. Figure 6 shown).

[0054] In more detail, the first vertical adjustment mechanism PU_V1 at the first protrusion PR1 can contact the upper surface of the first cover LD1 on the first protrusion PR1 to form a first contact point. Therefore, the first vertical adjustment mechanism PU_V1 between the first bracket BR1 and the upper surface of the first protrusion PR1 can change the position of the first protrusion PR1 of the second plate P2 through the first contact point.

[0055] The second vertical adjustment mechanism PU_V2 on the second protrusion PR2 can contact the upper surface of the second cover LD2 on the second protrusion PR2 to form a second contact point. Therefore, the second position control unit PU_V2 between the second bracket BR2 and the upper surface of the second protrusion PR2 can change the position of the second protrusion PR2 of the second plate P2 through the second contact point.

[0056] The third vertical adjustment mechanism PU_V3 on the third protrusion PR3 can contact the upper surface of the third cover LD3 on the third protrusion PR3 to form a third contact point. Therefore, the third vertical adjustment mechanism PU_V3 between the third bracket BR and the upper surface of the third protrusion PR3 can change the position of the third protrusion PR3 of the second plate P2 through the third contact point.

[0057] In addition, the first horizontal adjustment mechanism PU_H1 adjacent to the first protrusion PR1 can contact the side surface of the first cover LD1 on the first protrusion PR1 to form a fourth contact point. Therefore, the first horizontal adjustment mechanism PU_H1 between the first bracket BR1 and the side surface of the first protrusion PR1 can change the position of the first protrusion PR1 of the second plate P2 through the fourth contact point.

[0058] The second horizontal adjustment mechanism PU_H2 adjacent to the second protrusion PR2 can contact the side surface of the second cover LD2 on the second protrusion PR2 to form a fifth contact point. Therefore, the second horizontal adjustment mechanism PU_H2 between the second bracket BR2 and the side surface of the second protrusion PR2 can change the position of the second protrusion PR2 of the second plate P2 through the fifth contact point.

[0059] The fourth support unit SU_H1 adjacent to the third protrusion PR3 may contact the side surface of the third cover LD3 on the third protrusion PR3 to form a sixth contact point. Therefore, the fourth support unit SU_H1 between the third bracket BR and the side surface of the third protrusion PR3 may change the position of the third protrusion PR3 of the second plate P2 through the sixth contact point.

[0060] In more detail, the fourth supporting unit SU_H1 may change the position of the third protrusion PR3 by passively moving in response to active movements of the first and second horizontal adjustment mechanisms PU_H1 and PU_H2.

[0061] In addition, the first support unit SU_V1 below the first vertical adjustment mechanism PU_V1 can pass through the first plate P1 and the second plate P2 to contact the first cover LD1, thereby forming a seventh contact point. Therefore, the first support unit SU_V1 between the first lower cover LC1 and the first cover LD1 can change the position of the first protrusion PR1 of the second plate P2 through the seventh contact point.

[0062] In the same manner, the second support unit SU_V2 under the second vertical adjustment mechanism PU_V2 can pass through the first plate P1 and the second plate P2 and contact the second cover LD2 to change the position of the second protrusion PR2 of the second plate P2, and the third support unit SU_V3 under the third vertical adjustment mechanism PU_V3 passes through the first plate P1 and the second plate P2 and contacts the third cover LD3 to change the position of the third protrusion PR3 of the second plate P2.

[0063] In various embodiments, two horizontal position control units (i.e., the first horizontal adjustment mechanism PU_H1 and the second horizontal adjustment mechanism PU_H2) and one support unit (i.e., the fourth support unit SU_H1) may be symmetrically arranged relative to the center of the second plate P2. Figure 6 As shown, they can be arranged 120 degrees apart from each other.

[0064] In various embodiments, the first plate P1 is fixed to the base 130 of the pedestal 300 and cannot move, while the second plate P2 is movable in the horizontal direction by a plurality of horizontal adjustment mechanisms, and tilting of the second plate P2 around the moving axis is also possible.

[0065] The tilt adjustment of the base 300 is performed by the movement of the vertical adjustment mechanisms PU_V1, PU_V2, and PU_V3, which are mounted on three brackets BR1, BR2, and BR3 in the vertical direction. In more detail, when the vertical adjustment mechanisms PU_V1, PU_V2, and PU_V3 move in the forward direction (+), the vertical adjustment mechanisms PU_V1, PU_V2, and PU_V3 push the upper surfaces of the support units SU_V1, SU_V2, and SU_V3 in the vertical direction, and the support units SU_V1, SU_V2, SU_V3 and the second plate P2 move in the vertical direction. Any one of the vertical adjustment mechanisms can move individually or simultaneously. In one embodiment, by changing the moving distance of each vertical adjustment mechanism, the tilt in the vertical direction can be more accurately controlled. In order to accurately control the movement in the vertical direction, that is, the tilt, the support units SU_V1, SU_V2, and SU_V3 may include an elastomer 16. For example, the elastic body 16 of the support units SU_V1, SU_V2, SU_V3 may be a spring, and excessive constraint of the vertical adjustment mechanisms PU_V1, PU_V2, PU_V3 may be prevented by using the elastic force of the spring. In one embodiment, the spring may be an elastic body such as a coil spring or a leaf spring, and each elastic force may be 5kgf to 15kgf (a total of 5kgf to 15kgf×3EA=15kgf to 45kgf).

[0066] In various embodiments, and with reference to Figure 5A-5B When the horizontal adjustment mechanisms PU_H2, PU_H2 move in the horizontal direction, the support units SU_V1, SU_V2 and the second plate P2 are pushed in the horizontal direction, and the fourth support unit SU_H1 accurately controls the horizontal movement of the second plate P2, and at the same time controls the excessive movement or excessive constraint of the horizontally moving second plate P2 through the elastic force of the second elastic body 15.

[0067] The first elastic body 16 and the through hole are separated from each other, and the end of the fourth support unit SU-H1 in contact with the third cover LD3 protrudes from the outer wall of the third bracket BR3 to facilitate the horizontal movement of the second plate P3. Figure 5A As shown, the second plate P2 can horizontally move the separation distance between the elastic body 16 and the through hole. Figure 5BIn the embodiment, the separation distance is 1 mm to 9 mm, but is not limited thereto. In addition, since the friction between the through hole and the elastic body 16 can be prevented due to the gap, the vertical movement and tilting of the second plate P2 can become easier. There is a protrusion on the side of the fourth support unit SU_H1 so that the connection with the second elastic body 15 can be maintained.

[0068] On the other hand, when the vertical adjustment mechanisms PU_V1, PU_V2, PU_V3 move in the vertical direction, the support units SU_V1, SU_V2, SU_V3 and the second plate P2 are pushed in the vertical direction, and when the second plate P2 is tilted due to the elastic force of the first elastic body 16, the tilt of the second plate P2 is precisely controlled while controlling excessive movement or excessive constraint. As shown in the figure, the second plate P2 is spaced apart from the first plate P1, making it easier to vertically move or tilt the second plate P2. In an exemplary embodiment, the separation distance is 1 mm to 6 mm, but is not limited thereto.

[0069] In various embodiments, reference Figure 7 and Figure 8 , the adjustment mechanism PU_V1, PU_V2, PU_V3, PU_H1, PU_H2 may include a rotating body 710 and a fixed body 720. For example, the rotating body 710 may include a micrometer, and the horizontal movement or tilt of the second plate P2 may be controlled according to the rotational displacement of the rotating body 710 relative to the fixed body 720 and its corresponding scale position. The fixed body 720 may be fixed to the bracket BR. The rotating body 710 may rotate around the central axis of the fixed body 720. The adjustment mechanism may also include a ball bearing 525 located in the rotating body 710 and arranged at the central axis.

[0070] In various embodiments, returning to reference Figure 1 The system may also include a controller 135 configured to receive and transmit various signals. The controller 135 may include any number of devices and systems suitable for receiving and transmitting multiple signals, performing decisions based on input signals, etc. For example, the controller 135 may include a logic system and a memory.

[0071] In various embodiments, returning to reference Figure 1 , the system 100 may also include an adjustment component. The adjustment component may include a first plurality of flexible rotating shafts 115 (e.g., rotating shafts 115 (a) and 115 (b)) and a second plurality of flexible rotating shafts 125 (e.g., rotating shafts 125 (a) and 125 (b)). Each shaft 115, 125 may include a first end and a second end. Each shaft in the first plurality of flexible rotating shafts 115 may be coupled to a corresponding vertical adjustment mechanism PU_V at a first end. Similarly, each shaft in the second plurality of flexible rotating shafts 125 may be coupled to a corresponding horizontal adjustment mechanism PU_H at a first end.

[0072] In various embodiments, the flexible rotating shafts 115, 125 may be coupled to the corresponding adjustment mechanisms (eg, PU_V, PU_H) via any suitable fasteners (eg, brackets, screws, etc.).

[0073] In various embodiments, the adjustment assembly can also include a first plurality of motors 120 (e.g., motors 120(a) and 120(c)) and a second plurality of motors 130 (e.g., motors 130(a) and 130(c)) configured to rotate corresponding flexible rotating shafts. For example, each motor in the first plurality of motors 120 can be coupled to a second end of a corresponding shaft in the first plurality of flexible rotating shafts 115. Similarly, each motor in the second plurality of motors 130 can be coupled to a second end of a corresponding shaft in the second plurality of flexible rotating shafts 125. The motors 120, 130 can include any suitable motors, such as servo motors, stepper motors, etc.

[0074] In various embodiments, the motor may be configured to receive a control signal from the controller 135. The control signal may provide information to the motor 120 regarding the desired degree of rotation, and the motor 120 may respond to the signal by moving the desired degree of rotation.

[0075] In various embodiments, and with reference to Figure 1 and 7 , the adjustment assembly may further include a plurality of rotary encoders 110 (e.g., rotary encoders 110 (a) and 110 (c)) configured to measure or otherwise detect the degree or amount of rotation of the moving body 710 of the corresponding adjustment mechanism in the first and second plurality of adjustment mechanisms PU_H, PU_V. For example, each adjustment mechanism PU_H, PU_V may be connected to a dedicated rotary encoder. The rotary encoder 110 may be coupled to the adjustment mechanism with any suitable fastener.

[0076] In various embodiments, the rotary encoder may transmit an encoder signal to the controller 135 , wherein the encoder signal indicates the actual amount / degree of rotation of the moving body 710 of the adjustment mechanism.

[0077] In various embodiments, reference Figure 1 and Figure 2, the system 100 may also include a sensing system 105 configured to detect the tilt of the pedestal 125 and / or detect the horizontal placement (i.e., centering) of the pedestal 125 within the reaction chamber. The sensing system 105 may include any suitable sensor to detect the amount or degree of tilt of the pedestal 125, and / or detect the position of the pedestal 125 relative to a stationary element (e.g., a sidewall of the reaction chamber and / or the ring 800) within the reaction chamber. For example, the sensing system 105 may detect or otherwise measure the horizontal gap between the outer edge 140 of the pedestal 125 and the ring 800, and / or detect or otherwise measure the vertical gap between the top of the pedestal 125 and the ring and / or some other stationary element. In some embodiments, the sensing system 105 may include a pyrometer, an optical sensor, a proximity sensor, a laser sensor, a flow sensor, a temperature sensor, etc.

[0078] In various embodiments, the sensing system 105 can be communicatively coupled to the controller 135. For example, the sensing system 105 can transmit an output sensor signal to the controller 135. The output sensor signal can indicate a numerical value and / or any other signal appropriate for the sensor type.

[0079] In an exemplary embodiment, referring to Figure 1 , 10 11, the sensing system 105 may include a plurality of thermocouples 1100. The plurality of thermocouples 1100 may be embedded in the top surface of the base body 125 and configured to measure the temperature at the edge 140 of the base body 125. The thermocouples 1100 may be arranged in a circular pattern near the edge 140 of the base body 125 and spaced equidistantly from each other. For example, the thermocouples 1100 may be spaced apart in 45 degree increments, 30 degree increments, etc. In an exemplary embodiment, the plurality of thermocouples include at least 3 thermocouples. Each thermocouple may generate an output signal indicating the temperature at a specific location on the base body 125.

[0080] In an exemplary embodiment, the controller 135 can receive output signals from multiple thermocouples. The controller 135 can be configured to compare the multiple output signals from the thermocouples and identify the thermocouple with the highest temperature and the lowest temperature. The controller 135 can use the high and low temperature information from the corresponding thermocouples to determine the flow pattern of the gas / air through the base body 125 and the thermocouples. For example, the thermocouple corresponding to the lowest temperature may indicate the highest flow at that particular location because the high flow through the thermocouple will cool the thermocouple. The thermocouple corresponding to the highest temperature may indicate the lowest flow at that particular location. The determined flow pattern may indicate a tilted base (e.g., such as Fig.10As the pedestal is tilted, higher gas flow will be observed where the gap between the pedestal body 125 and the sealing plate or flow control ring is largest. Similarly, lower gas flow will be observed where the gap between the pedestal body 125 and the sealing plate or flow control ring is smallest. The controller 135 can then perform the leveling and centering methods described below based on the sensor data.

[0081] Alternatively or additionally, reference Figure 1 , 12A -B, 13A-B, the sensing system 105 may include a hot wire anemometer 1200. The hot wire anemometer 1200 may include a plurality of independent hot wire anemometers. In this case, the plurality of hot wire anemometers 1200 include at least three hot wire anemometers, which are located at or near the edge 140 of the base body 125 and are electrically insulated from other hot wire anemometers. In addition, the hot wires may be arranged equidistant from each other, for example, at 120 degree intervals, 90 degree intervals, 45 degree intervals, etc.

[0082] Alternatively, the hot wire anemometer may include a single continuous hot wire. The hot wire may be coupled to the top surface of the base body 125 (e.g., as shown in FIG. Figures 12A-12B 140 ) or coupled to the outer edge 140 of the base body 125. In this case, probes or electrical taps (not shown) can be connected to the hot wire to measure the resistance at various points along the hot wire. Thus, the resistance change of a specific portion of the hot wire can be determined between the two electrical taps.

[0083] In various embodiments, the hot wire anemometer 1200 can be attached to the base body 125 with fasteners 1205. The fasteners 1205 can include a non-conductive material to electrically isolate the hot wire anemometers from each other, other electrical components, and / or the base body.

[0084] In various embodiments, the controller 135 can receive output signals from the hot wire anemometer 1200. In some cases, the hot wire anemometer can generate an output signal indicating a change in current, where the change in current is a function of temperature and air flow rate. In other cases, the hot wire anemometer can generate an output signal indicating a change in resistance, where the change in resistance is a function of temperature and air flow rate. In either case, the greater the change in current or resistance, the higher the flow path at that particular location. The controller 135 can be configured to compare multiple output signals from the hot wire anemometer 1200 and identify the locations or areas of the hot wire where the change in resistance or current is the largest and smallest. The controller 135 can use the high and low information from the hot wire anemometer 1200 to determine the flow pattern of gas / air through the base body 125. The determined flow pattern can indicate a tilted base (e.g., such as Fig.10As the pedestal is tilted, higher gas flow (and higher current or resistance change of the hot wire anemometer) will be observed where the gap between the pedestal body 125 and the sealing plate or flow control ring is largest. Similarly, lower gas flow (and lower current or resistance change) will be observed where the gap between the pedestal body 125 and the sealing plate or flow control ring is smallest. The controller 135 can then perform the leveling and centering methods described below based on the sensor data.

[0085] In operation, refer to Figure 1 , 6 , 7 and 9, the system 100 can be configured to perform an automatic closed-loop method for leveling and / or centering the base 125. This can be achieved by automatically operating the leveling assembly 250 and the adjustment assembly. The sensing system 105 can first detect the position of the base 125 (902). In an exemplary embodiment, the sensing system 105 can perform measurements to determine whether the base 125 is tilted and / or off-center. In some embodiments, during the sensor measurement, an inert gas can flow through the showerhead 200. The sensing system 105 can generate an output sensor signal (e.g., signal S5) based on the measurement and transmit the output sensor signal to the controller 135. Based on the sensor measurement, the controller 135 can determine whether the base 125 is horizontal and centered (905). If the base 125 is horizontal and centered, the leveling / centering process stops.

[0086] If the controller 135 determines that the base 125 is not horizontal, the controller 135 determines which adjustment mechanism needs to be adjusted based on the sensor signal to make the base 125 horizontal / centered (910). The controller 135 can then generate an output signal (e.g., signals S2, S4, S6, S7) and transmit the output signal to the motor 120 (a) (915). The motor 120 (a) then responds to the output signal S4 by rotating, and thereby rotates the flexible rotating shaft 115 (a). The flexible rotating shaft 115 (a) can be connected to the rotating body 710 of the first vertical adjustment mechanism PU_V1. Therefore, when the motor 120 rotates, the flexible rotating shaft also rotates, thereby rotating the rotating body 710, which moves the vertical adjustment mechanism up or down in the z direction (920). As described above, this movement adjusts the tilt of the base 125.

[0087] Similarly, the flexible rotating shaft can be coupled to the rotating body 710 of the first horizontal adjustment mechanism PU_H1. In this case, when the motor 120 rotates, the flexible rotating shaft also rotates, thereby rotating the rotating body 710, which moves the horizontal adjustment mechanism along the xy plane. As described above, this movement moves the base 125 along the xy plane.

[0088] In an exemplary embodiment, the controller 135 controls each motor 120 independently based on the output sensor signal. For example, the controller 135 can signal one motor 120 to rotate in one direction while simultaneously signaling a different motor 120 to rotate in another direction. Alternatively, the signaling from the controller 135 to the motors 120 can be sequential.

[0089] As the base moves according to the adjustment mechanisms PU_H, PU_V, the sensor system 105 may continue to sense, detect, or measure the position of the base 125 and continue to transmit output sensor signals to the controller 135. When the controller determines that the base 125 is level and centered, the leveling / centering process is complete.

[0090] In some embodiments, the controller 135 can use the encoder signal (e.g., signal S1, S3) from the rotary encoder 110 to confirm that the desired rotation amount / degree of the motor 120 and the rotating shafts 115, 125 is the same as the actual rotation amount / degree of the moving body 710 of the adjustment mechanism PU_V / PU_H. For example, the controller 135 can receive the encoder signal, and if the actual rotation does not match the desired rotation, the controller 135 can calibrate the next output control signal to account for any detected offset.

[0091] In the foregoing description, the technology has been described with reference to specific exemplary embodiments. The specific embodiments shown and described are illustrations of the technology and its best mode and are not intended to limit the scope of the technology in any way. In fact, for the sake of brevity, the conventional manufacturing, connection, preparation and other functional aspects of the method and system may not be described in detail. In addition, the connecting lines shown in the various figures are intended to represent exemplary functional relationships and / or steps between the various elements. In actual systems, there may be many alternative or additional functional relationships or physical connections.

[0092] The technology has been described with reference to specific exemplary embodiments. However, various modifications and changes may be made without departing from the scope of the technology. The description and drawings are to be regarded as illustrative rather than restrictive, and all such modifications are intended to be included within the scope of the technology. Therefore, the scope of the technology should be determined by the general embodiments described and their legal equivalents, rather than solely by the specific examples described above. For example, the steps described in any method or process embodiment may be performed in any order unless otherwise expressly specified, and are not limited to the explicit order presented in the specific examples. In addition, the components and / or elements described in any device embodiment may be assembled or otherwise operably configured in various arrangements to produce substantially the same results as the technology, and are therefore not limited to the specific configurations described in the specific examples.

[0093] Benefits, other advantages, and solutions to problems have been described above with respect to specific embodiments. However, any benefit, advantage, solution to a problem, or any element that may cause any particular benefit, advantage, or solution to occur or become more significant should not be construed as a critical, required, or essential feature or component.

[0094] The terms "comprises," "comprising," or any variations thereof, are intended to refer to non-exclusive inclusion, such that a process, method, article, composition, or apparatus that includes a list of elements includes not only those elements listed, but may also include other elements not expressly listed or inherent to such process, method, article, composition, or apparatus. Other combinations and / or modifications of the above-described structures, arrangements, applications, proportions, elements, materials, or components used in the practice of the present technology, except those not specifically recited, may be changed or otherwise specially adapted to a particular environment, manufacturing specifications, design parameters, or other operating requirements without departing from the general principles thereof.

[0095] The present technology has been described above with reference to exemplary embodiments. However, changes and modifications may be made to the exemplary embodiments without departing from the scope of the present technology. These and other changes or modifications are intended to be included within the scope of the present technology, as expressed in the following claims.

Claims

1. A device comprising: Base, including: a body comprising a first surface, an opposing second surface, and an outer edge; and a base coupled to the second surface of the body; a sensing system coupled to the base and configured to generate a sensor output signal; and A controller is coupled to the sensing system and configured to detect a flow pattern over the base based on the sensor output signal.

2. The device according to claim 1, wherein The sensing system includes a plurality of thermocouples embedded within a first surface of the body.

3. The device according to claim 1, wherein: The plurality of thermocouples are disposed adjacent an outer edge of the body and are arranged in a circular pattern.

4. The device according to claim 3, wherein: Adjacent thermocouples of the plurality of thermocouples are spaced apart from each other by equal distances.

5. The device according to claim 1, wherein: The sensing system includes a hot wire anemometer.

6. The device according to claim 5, wherein: The hot wire anemometer includes a single continuous wire loop coupled to the body of the base with a fastener.

7. The device according to claim 6, wherein: The fastener is formed of a non-conductive material.

8. The device according to claim 6, wherein: The fastener is coupled to a first surface of a body of the base.

9. The device according to claim 6, wherein: The fastener is coupled to an outer edge of a body of the base.

10. A method for detecting alignment of a susceptor, comprising: sensing air flow through the sensing system and the base with a sensing system coupled to the base; generating a plurality of sensor output signals indicative of air flow; as well as An air flow pattern through the base is determined based on the sensor output signal.

11. The method according to claim 10, wherein: The sensing system includes a plurality of thermocouples embedded within a top surface of the pedestal.

12. The method according to claim 10, wherein: The plurality of thermocouples are disposed adjacent an outer edge of the susceptor and are arranged in a circular pattern, wherein adjacent thermocouples of the plurality of thermocouples are spaced an equal distance from one another.

13. The method according to claim 12, wherein: Each of the plurality of sensor output signals indicates a temperature of a corresponding thermocouple, and determining the air flow pattern includes comparing the plurality of output signals to one another and identifying a maximum temperature and a minimum temperature using the compared output signals.

14. The method according to claim 10, wherein: The sensing system includes a hot wire anemometer coupled to the base with a non-conductive fastener.

15. The method according to claim 14, wherein: Each of the plurality of sensor output signals is indicative of a resistance change, and determining the air flow pattern includes comparing the plurality of output signals to one another and identifying a maximum resistance change and a minimum resistance change using the compared output signals.

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