Punch-formed high-heat-flux three-dimensional vapor chamber and manufacturing method

Abstract

The invention relates to a punch-formed high-heat-flux three-dimensional vapor chamber and a manufacturing method, and belongs to the technical field of vapor chambers, the three-dimensional vapor chamber comprises a cover plate and a bottom plate, the cover plate is integrally formed through die stamping, dense three-dimensional fins are formed on the top surface of the cover plate through stamping, the three-dimensional fins are arranged at intervals, gaps between the adjacent fins form air flow channels, and the air flow channels are communicated with the bottom plate. The three-dimensional fin is of a hollow structure, the inner surface of the three-dimensional fin is provided with a liquid absorption core structure, the bottom plate is machined to form a groove through a machining or etching technology, and a supporting column, a backflow column and a liquid absorption core are arranged in the groove of the bottom plate. The three-dimensional vapor chamber manufactured through the manufacturing method can conduct integrated heat dissipation, has the advantages of being larger in heat dissipation area, better in heat dissipation effect, more uniform and capable of running against gravity, and meanwhile has the advantages of being high in production efficiency, high in yield and low in manufacturing cost.

Description

Technical Field

[0001] The invention relates to a stamping-formed three-dimensional vapor chamber with high heat flux density, belonging to the technical field of vapor chambers. Background Art

[0002] With the rapid development of technologies such as 5G communications, radars, and drones, the heat dissipation demand of electronic equipment, especially high-power RF chips, is growing, which puts higher requirements on heat dissipation technology. Three-dimensional vapor chamber (3DVC) technology has attracted attention for its excellent heat dissipation performance and integrated heat dissipation solutions. Compared with traditional heat pipes and two-dimensional vapor chambers, the main advantage of three-dimensional vapor chambers is that they can directly perform integrated heat dissipation without the need for additional interface materials to connect with three-dimensional fins for heat dissipation, thereby effectively reducing thermal resistance. This design not only simplifies the heat dissipation structure, but also improves the heat dissipation efficiency. Especially in air-cooled heat dissipation systems, three-dimensional vapor chambers can further improve the heat dissipation efficiency.

[0003] At present, the manufacturing of three-dimensional heat spreaders mainly relies on welding technology to join the three-dimensional cavity and the heat spreader. However, this method has the problems of low production efficiency and poor stability, and the cost is relatively high in large-scale batch production. In addition, the common three-dimensional heat spreaders have liquid retention problems in the three-dimensional structure, and it is difficult to maintain the phase change cycle in high-power or reverse gravity application scenarios, resulting in heat dissipation failure. With the continuous growth in the application demand of three-dimensional heat spreaders, the market urgently needs a three-dimensional heat spreader manufacturing method with higher production efficiency, lower cost and wider application range.

[0004] This patent aims to design a high heat flux density three-dimensional heat sink and its manufacturing method to solve the challenges in the existing technology and provide a more efficient and economical heat dissipation solution. Summary of the invention

[0005] The main purpose of the present invention is to provide a stamping-formed three-dimensional heat diffusion plate with high heat flux density.

[0006] The purpose of the present invention can be achieved by adopting the following technical solutions:

[0007] A stamped high heat flux density three-dimensional heat spreader, comprising a cover plate and a base plate, characterized in that the cover plate is integrally formed by mold stamping, the top surface of the cover plate is stamped to form densely distributed three-dimensional fins, the three-dimensional fins are arranged at intervals, and the gaps between adjacent fins form air channels, the three-dimensional fins are hollow structures and the inner surface is provided with a liquid wick structure, the base plate is formed into a groove by stamping, machining or etching, and the base plate groove is provided with a support column, a reflux column and a liquid wick.

[0008] Preferably, the three-dimensional fins include, but are not limited to, V-shaped, square, arc-shaped, long rectangular or tapered fin shapes;

[0009] The cross section of the three-dimensional fin after stamping changes in angle from the top to the bottom, or the top and the bottom are perpendicular to each other. The spacing arrangement of the three-dimensional fins includes but is not limited to staggered arrangement, parallel arrangement, and honeycomb arrangement.

[0010] Preferably, the support columns on the base plate are formed by machining or etching, and the support columns are arranged at intervals on the base plate at positions staggered from the projection of the three-dimensional fins of the cover plate, and the height of the support columns does not exceed the top of the groove.

[0011] Preferably, the reflux column is arranged at the center position of the three-dimensional fin projection on the bottom plate, and the height of the reflux column is the same as the height of the cavity in the three-dimensional fin.

[0012] Preferably, the reflux column is connected to the inner top surface of the three-dimensional fin after the heat spreader cover plate and the bottom plate are joined. The reflux column is formed by machining, etching, welding or sintering processes. The reflux column structure includes but is not limited to a solid structure, a hollow structure, a porous liquid-absorbing core structure and a suspended woven belt structure.

[0013] Preferably, the wick includes but is not limited to various wick structures such as sintered powder, silk screen, braided belt, micro groove, etc., and the wick is arranged in the bottom plate groove and on the surface of the reflux column by sintering, electrodeposition, laser processing and other methods.

[0014] Preferably, the thickness of the wick does not exceed the depth of the groove.

[0015] A stamping-formed high heat flux density three-dimensional heat sink comprises the following steps:

[0016] S1. Forming a cover plate having a three-dimensional fin structure through a stamping process;

[0017] S2. Processing the bottom plate by machining or etching to form a groove and a support column in the groove;

[0018] S3, machining a reflux column in the groove by machining, etching, welding or sintering;

[0019] S4, arranging the liquid wick on the cover plate, the inner surface of the three-dimensional fin, the bottom plate groove and the surface of the reflux column by sintering, electrodeposition, laser processing, etc.;

[0020] S5. The edges of the cover plate and the bottom plate are welded and a liquid filling port is left, and a liquid filling pipe is welded at the liquid filling port;

[0021] S6. Inject the liquid working medium into the cavity through the filling tube, and form a heat spreader after low-temperature freezing, vacuuming, and sealing.

[0022] Preferably, in step S6, the liquid working medium is a liquid that does not react with the cover plate, the bottom plate, the reflux column and the liquid wick.

[0023] Beneficial technical effects of the present invention:

[0024] The present invention provides a stamping-formed high heat flux density three-dimensional heat sink.

[0025] 1) The cooling surface of the heat spreader cover is equipped with a fin heat dissipation structure, which can increase the heat dissipation area and improve the heat dissipation efficiency.

[0026] 2) The heat spreader cover and the three-dimensional fin heat dissipation structure are integrated and formed. The integrated heat dissipation reduces the thermal resistance of the heat spreader and reduces the cost.

[0027] 3) The bottom plate is provided with a reflux column to further improve the strength of the heat spreader while also accelerating the condensation reflux of the liquid working medium, thereby improving the heat dissipation efficiency.

[0028] 4) Both the cover plate and the bottom plate are equipped with a liquid absorption core structure to ensure the stable operation of liquid condensation reflux, and can operate stably under high power and reverse gravity conditions.

[0029] 5) The manufacturing method is simple, the processing cost is low, and the yield rate is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a stereoscopic diagram of a preferred embodiment of a stamping-formed high heat flux density three-dimensional heat diffusion plate and a manufacturing method according to the present invention;

[0031] Figure 2 It is a decomposition structure diagram of a preferred embodiment of a stamping-formed high heat flux density three-dimensional heat diffusion plate and a manufacturing method according to the present invention;

[0032] Figure 3 A three-dimensional diagram of a cover plate and a bottom plate according to a preferred embodiment of a stamping-formed high heat flux density three-dimensional heat diffusion plate and a manufacturing method of the present invention;

[0033] Figure 4 A three-dimensional side view of a cover plate and a bottom plate of a preferred embodiment of a stamping-formed high heat flux density three-dimensional heat diffusion plate and a manufacturing method according to the present invention;

[0034] Figure 5 A cross-sectional view of a preferred embodiment of a stamping-formed high heat flux density three-dimensional vapor chamber and a manufacturing method according to the present invention;

[0035] Figure 6 A partial cross-sectional view of Example 1 of a preferred embodiment of a stamping-formed high heat flux density three-dimensional vapor chamber and a manufacturing method according to the present invention;

[0036] Figure 7A partial cross-sectional view of Example 2 of a preferred embodiment of a stamping-formed high heat flux density three-dimensional vapor chamber and a manufacturing method according to the present invention;

[0037] Figure 8 The present invention provides a manufacturing method flow chart of a stamping-formed high heat flux density three-dimensional heat diffusion plate and a preferred embodiment of the manufacturing method thereof.

[0038] In the figure: 1. cover plate; 2. bottom plate; 3. liquid absorption core; 4. liquid filling port; 5. liquid working medium; 11. three-dimensional fins; 21. reflux column; 22. support column. DETAILED DESCRIPTION

[0039] In order to make the technical solution of the present invention more clear and specific to those skilled in the art, the present invention is further described in detail below in conjunction with embodiments and drawings, but the implementation manner of the present invention is not limited thereto.

[0040] like Figure 1 - Figure 8 As shown, the present embodiment provides a stamped high heat flux density three-dimensional heat spreader, comprising a cover plate 1 and a base plate 2, wherein the cover plate 1 is integrally formed by mold stamping, and the top surface of the cover plate 1 is stamped to form densely distributed three-dimensional fins 11, the three-dimensional fins 11 are arranged at intervals, and the gaps between adjacent fins form air channels, the three-dimensional fins 11 are hollow structures and the inner surface is provided with a liquid wick structure, the base plate 2 is formed into a groove by stamping, machining or etching, and the groove of the base plate 2 is provided with a support column, a reflux column 21 and a liquid wick 3.

[0041] The three-dimensional fins 11 include, but are not limited to, V-shaped, square, arc-shaped, long rectangular or tapered fin shapes;

[0042] The cross section of the three-dimensional fin 11 after stamping changes in angle from the top to the bottom or the top and the bottom are perpendicular to each other. The spacing arrangement of the three-dimensional fin 11 includes but is not limited to staggered arrangement, parallel arrangement, and honeycomb arrangement.

[0043] The support columns 22 on the bottom plate 2 are formed by machining or etching. The support columns 22 are arranged at intervals on the bottom plate 2 at positions staggered from the three-dimensional fin projection of the cover plate 1. The height of the support columns 22 does not exceed the top of the groove.

[0044] The reflux column 21 is disposed at the projection center of the three-dimensional fin 11 on the bottom plate 2 , and the height of the reflux column 21 is the same as the height of the cavity inside the three-dimensional fin 11 .

[0045] The reflux column 21 is connected to the inner top surface of the three-dimensional fin 11 after the heat spreader cover plate 1 and the bottom plate are joined. The reflux column 21 is formed by machining, etching, welding or sintering processes. The structure of the reflux column 21 includes but is not limited to a solid structure, a hollow structure, a porous liquid-absorbing core 3 structure and a suspended woven belt structure.

[0046] The absorbent core 3 includes but is not limited to various absorbent core 3 structures such as sintered powder, silk screen, braided belt, micro groove, etc. The absorbent core 3 is arranged in the bottom plate groove and the surface of the reflux column by sintering, electrodeposition, laser processing and other methods.

[0047] The thickness of the liquid absorbent core 3 does not exceed the depth of the groove.

[0048] In the step S6 , the liquid working medium is a liquid that does not react with the cover plate 1 , the bottom plate 2 , the reflux column 21 and the liquid wick 3 .

[0049] like Figure 1 - Figure 8 As shown, the working process of a stamping high heat flux density three-dimensional heat sink provided in this embodiment is as follows:

[0050] S1, forming a cover plate 1 having a three-dimensional fin 11 structure in one piece by a stamping process;

[0051] S2, forming a groove and a support column 22 in the groove by machining or etching the bottom plate 2;

[0052] S3, machining a reflux column 21 in the groove by machining, etching, welding or sintering;

[0053] S4, arranging the liquid wick 3 on the inner surface of the three-dimensional fin 11 of the cover plate 1, the groove of the bottom plate 2 and the surface of the reflux column 21 by sintering, electrodeposition, laser processing or the like;

[0054] S5, the edges of the cover plate 1 and the bottom plate 2 are welded and a liquid filling port 4 is left, and a liquid filling pipe is welded at the liquid filling port 4;

[0055] S6, injecting the liquid working medium 5 into the cavity through the liquid filling tube, and forming a heat spreader through low temperature freezing, vacuuming and sealing.

[0056] Embodiment 1

[0057] like Figure 3 As shown, the cross-sectional shape of the three-dimensional fins 11 is square and they are arranged in parallel and spaced apart on the top surface of the cover plate 1. Figure 4As shown, in order to prevent the cover plate 1 and the bottom plate 2 from collapsing when they are superimposed, support columns 22 are provided on the bottom plate 2 by etching. The support columns 22 are evenly spaced and arranged on the bottom plate 2 at positions staggered from the projection of the three-dimensional fins 11 of the cover plate 1. The height of the support columns 22 is flush with the top of the groove. The reflux column 21 is a solid metal column, which is welded to the center of the projection of the three-dimensional fin 1 on the bottom plate 2 and has the same height as the cavity inside the three-dimensional fin 11.

[0058] like Figure 5 As shown, the liquid wick 3 is a copper wire mesh liquid wick, sintered in the groove of the bottom plate 2 and on the surface of the reflux column 21, and the liquid working medium 5 uses high-purity water.

[0059] Embodiment 2

[0060] like Figure 7 As shown, the difference between this embodiment and embodiment 1 is that the reflux column 21 is a suspended braided belt structure. By sintering the copper braided belt and suspending it in the groove of the base plate 2, the reflux effect of the reflux column 21 is further enhanced, the flow of the liquid working medium is accelerated, and at the same time the temperature uniformity of the heat spreader is improved, thereby improving the heat dissipation effect of the heat spreader.

[0061] The above description is only a further embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and concepts of the present invention within the scope disclosed by the present invention, which belong to the protection scope of the present invention.

Claims

1. A stamped high heat flux density three-dimensional heat sink, comprising a cover plate (1) and a bottom plate (2), characterized in that: The cover plate (1) is integrally formed by die stamping, and the top surface of the cover plate (1) is stamped to form densely distributed three-dimensional fins (11), the three-dimensional fins (11) are arranged at intervals, and the gaps between adjacent fins form air flow channels, the three-dimensional fins (11) are hollow structures and the inner surfaces are provided with a liquid wick structure, and the bottom plate (2) is processed by stamping, machining or etching to form a groove, and the bottom plate (2) is provided with a support column, a reflux column (21) and a liquid wick (3) in the groove.

2. The stamping-formed high heat flux density three-dimensional heat sink according to claim 1, characterized in that: The three-dimensional fins (11) include but are not limited to V-shaped, square, arc-shaped, long rectangular or tapered fin shapes; The cross section of the three-dimensional fin (11) after stamping changes in angle from the top to the bottom, or the top and the bottom are perpendicular to each other. The spacing arrangement of the three-dimensional fin (11) includes but is not limited to staggered arrangement, parallel arrangement, and honeycomb arrangement.

3. The stamping-formed high heat flux density three-dimensional heat sink according to claim 2, characterized in that: The support columns (22) on the bottom plate (2) are formed by machining or etching, the support columns (22) are arranged at intervals on the bottom plate (2) at positions staggered from the projection of the three-dimensional fins of the cover plate (1), and the height of the support columns (22) does not exceed the top of the groove.

4. The stamping-formed high heat flux density three-dimensional heat sink according to claim 3, characterized in that: The reflux column (21) is arranged at the projection center position of the three-dimensional fin (11) on the bottom plate (2), and the height of the reflux column (21) is the same as the height of the cavity inside the three-dimensional fin (11).

5. The stamping-formed high heat flux density three-dimensional heat sink according to claim 4, characterized in that: The reflux column (21) is connected to the inner top surface of the three-dimensional fin (11) after the heat spreader cover (1) and the bottom plate are joined, and the reflux column (21) is formed by machining, etching, welding or sintering process; The structure of the reflux column (21) includes but is not limited to a solid structure, a hollow structure, a porous liquid wick (3) structure and a suspended braided belt structure.

6. The stamping-formed high heat flux density three-dimensional heat sink according to claim 5, characterized in that: The wick (3) includes but is not limited to various wick (3) structures such as sintered powder, silk screen, braided belt, and micro grooves. The wick (3) is arranged in the groove of the bottom plate and on the surface of the reflux column (21) by sintering, electrodeposition, and laser processing.

7. The stamping-formed high heat flux density three-dimensional heat sink according to claim 6, characterized in that: The thickness of the liquid wick (3) does not exceed the depth of the groove.

8. The stamping-formed high heat flux density three-dimensional heat sink according to claim 7, characterized in that: The following steps are involved: Step S1, forming a cover plate (1) having a three-dimensional fin (11) structure through a stamping process; Step S2, machining the bottom plate (2) by machining or etching to form a groove and a support column (22) in the groove; Step S3, machining a reflux column (21) in the groove by machining, etching, welding or sintering; Step S4, arranging the liquid wick on the cover plate (1), the inner surface of the three-dimensional fin (11), the groove of the bottom plate (2) and the surface of the reflux column by sintering, electrodeposition or laser processing; Step S5, welding the edges of the cover plate (1) and the bottom plate (2) and leaving a liquid filling port, and welding a liquid filling tube at the liquid filling port; Step S6: inject the liquid working medium into the cavity through the liquid filling tube, and form a heat spreader through low-temperature freezing, vacuuming, and sealing.

9. The method for manufacturing a high heat flux density vapor chamber by stamping according to claim 8, characterized in that: In the step S6, the liquid working medium is a liquid that does not react with the cover plate (1), the bottom plate (2), the reflux column (21) and the liquid wick (3).

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