Three-dimensional thermal analysis sensor

Abstract

The invention relates to a three-dimensional thermal analysis sensor, and belongs to the technical field of thermal analysis. The three-dimensional thermal analysis sensor comprises a bottom substrate, a bottom thermoelectric layer, a middle substrate, a first thermoelectric layer and a top substrate which are sequentially stacked, the bottom thermoelectric layer comprises two bottom thermopiles, the first thermoelectric layer comprises two through holes and two first thermopiles, and each first thermopile is distributed around one through hole of the first thermoelectric layer; the top substrate comprises two through holes; the two through holes of the first thermoelectric layer correspond to the two through holes of the top substrate in position; the two bottom thermopiles of the bottom thermoelectric layer correspond to the two through holes of the first thermoelectric layer in position; wherein during measurement, the crucible to be measured and the empty crucible are both placed on the middle substrate and are both located in the through holes of the first thermoelectric layer and the top substrate. The three-dimensional thermal analysis sensor provides a measurement mode of three-dimensional thermal distribution, so that the detection precision and the thermal measurement efficiency of the thermal analysis sensor can be improved.

Description

Technical Field

[0001] The invention relates to the technical field of thermal analysis, in particular to a three-dimensional thermal analysis sensor. Background Art

[0002] At present, differential scanning calorimeters are widely used in polymer, medicine, metal, ceramic and other fields. They can accurately measure the melting point, phase change temperature, thermal effect (enthalpy change) and thermal stability of materials, providing key data support for material research and process optimization.

[0003] Thermocouple structure is the core component of differential scanning calorimeter, which is used to detect the temperature difference between the sample and the reference and convert it into a heat flow signal. Research on existing differential scanning calorimeters found that the internal thermocouple structure is usually arranged as thermocouples of different materials in the same insulation layer to achieve the detection of internal and external temperature differences, which has the disadvantages of low accuracy and low detection sensitivity. Summary of the invention

[0004] In order to solve the above-mentioned problems in the prior art, the present invention provides a three-dimensional thermal analysis sensor.

[0005] In a first aspect, an embodiment of the present application provides a three-dimensional thermal analysis sensor, comprising a bottom substrate, a bottom thermoelectric layer, a middle substrate, a first thermoelectric layer and a top substrate stacked in sequence; the bottom thermoelectric layer comprises two bottom thermoelectric piles, the first thermoelectric layer comprises two through holes and two first thermoelectric piles, and each first thermoelectric pile is respectively distributed around a through hole of the first thermoelectric layer; the top substrate comprises two through holes; the two through holes of the first thermoelectric layer correspond to the positions of the two through holes of the top substrate; and the two bottom thermoelectric piles of the bottom thermoelectric layer also correspond to the positions of the two through holes of the first thermoelectric layer; wherein, during measurement, the crucible to be tested and the empty crucible are both placed on the middle substrate, and are both located in the through holes of the first thermoelectric layer and the top substrate.

[0006] Optionally, the bottom thermoelectric layer includes a first substrate and a second substrate stacked in sequence; the first substrate includes N thermocouple monomers of a first material; the N thermocouple monomers of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the first material includes a first end and a second end; N is a positive integer; the second substrate includes N thermocouple monomers of a second material; the N thermocouple monomers of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the second material includes a first end and a second end; wherein the first end of each thermocouple monomer of the first material is connected to the first end of a thermocouple monomer of the second material through a metal column, and the second end of each thermocouple monomer of the first material is connected to the second end of another thermocouple monomer of the second material through a metal column, so that the thermocouple monomer of the first material on the first substrate and the thermocouple monomer of the second material on the second substrate are connected in series in sequence; N pairs of thermocouples form the bottom thermoelectric pile.

[0007] Optionally, the bottom thermoelectric layer includes: a bottom thermoelectric substrate; N thermocouple monomers of a first material, which are arranged throughout the bottom thermoelectric substrate; the first ends of the N thermocouple monomers of the first material are located on the first surface of the bottom thermoelectric substrate, and the second ends of the N thermocouple monomers of the first material are located on the second surface of the bottom thermoelectric substrate; N is a positive integer; N thermocouple monomers of a second material, which are arranged throughout the bottom thermoelectric substrate; the first ends of the N thermocouple monomers of the second material are located on the first surface of the bottom thermoelectric substrate, and the second ends of the N thermocouple monomers of the second material are located on the second surface of the bottom thermoelectric substrate; wherein the first end of each thermocouple monomer of the first material is connected to the first end of an adjacent thermocouple monomer of the second material, and the second end of each thermocouple monomer of the first material is connected to the second end of another adjacent thermocouple monomer of the second material, so that the N thermocouple monomers of the first material and the N thermocouple monomers of the second material in the bottom thermoelectric substrate are connected in series in sequence; and N pairs of thermocouples form the bottom thermoelectric pile.

[0008] Optionally, the thickness of the bottom thermoelectric substrate is M millimeters; M is a positive number; and the range of M is 0.3-1.2.

[0009] Optionally, the first thermoelectric layer includes a third substrate and a fourth substrate; the third substrate includes N thermocouple monomers of the first material; the N thermocouple monomers of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the first material includes a first end and a second end; N is a positive integer; the fourth substrate includes N thermocouple monomers of the second material; the N thermocouple monomers of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the second material includes a first end and a second end; wherein the first end of each thermocouple monomer of the first material is connected to the first end of a thermocouple monomer of the second material through a metal column, and the second end of each thermocouple monomer of the first material is connected to the second end of another thermocouple monomer of the second material through a metal column, so that the thermocouple monomer of the first material on the third substrate and the thermocouple monomer of the second material on the fourth substrate are connected in series in sequence; N pairs of thermocouples form the first thermoelectric pile.

[0010] Optionally, the first thermoelectric layer further includes Q sub-substrates; Q is a positive integer greater than 1; the Q sub-substrates are arranged between the third substrate and the fourth substrate, and each metal column passes through the Q sub-substrates.

[0011] Optionally, the three-dimensional thermal analysis sensor also includes a second thermoelectric layer; the second thermoelectric layer is arranged between the first thermoelectric layer and the top substrate; the second thermoelectric layer includes two through holes and two second thermoelectric piles, and each second thermoelectric pile is distributed around a through hole of the second thermoelectric layer; the two through holes of the second thermoelectric layer correspond to the positions of the two through holes of the first thermoelectric layer.

[0012] Optionally, the second thermoelectric layer includes a fifth substrate and a sixth substrate stacked in sequence; the fifth substrate includes N thermocouple monomers of the first material; the N thermocouple monomers of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the first material includes a first end and a second end; N is a positive integer; the sixth substrate includes N thermocouple monomers of the second material; the N thermocouple monomers of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the second material includes a first end and a second end; wherein the first end of each thermocouple monomer of the first material is connected to the first end of a thermocouple monomer of the second material through a metal column, and the second end of each thermocouple monomer of the first material is connected to the second end of another thermocouple monomer of the second material through a metal column, so that the thermocouple monomer of the first material on the fifth substrate and the thermocouple monomer of the second material on the sixth substrate are connected in series in sequence; N pairs of thermocouples form the second thermoelectric pile.

[0013] Optionally, the three-dimensional thermal analysis sensor further includes a temperature measurement layer; the temperature measurement layer is stacked and arranged between the bottom substrate and the bottom thermoelectric layer.

[0014] Optionally, the temperature measuring layer includes two temperature measuring metal areas, and the metal of the temperature measuring metal areas is platinum.

[0015] The beneficial effects of the present invention include: the embodiment of the present application provides a three-dimensional thermal analysis sensor, which is configured as a two-layer thermopile structure, wherein when the crucible is placed on the middle substrate, the first thermopile of the first thermoelectric layer is distributed around the crucible, and the bottom thermopile of the bottom thermoelectric layer is distributed at the bottom of the crucible, so that the thermopiles of the side wall and the bottom can synchronously measure the temperature distribution of the crucible. For example, the bottom thermopile can realize the temperature distribution measurement of different areas, and the first thermopile can realize the temperature distribution measurement of different depths, so as to realize the three-dimensional perception of the heat source gradient (including the temperature difference in the vertical direction and the temperature difference in the horizontal direction), that is, the three-dimensional thermal analysis sensor provides a three-dimensional heat distribution measurement method, so as to improve the detection accuracy and thermal measurement efficiency of the thermal analysis sensor. At the same time, through a measurement area in the form of a groove, heat diffusion loss can be reduced, so that the side wall thermopile can more easily capture the heat flow conducted along the groove wall, and improve the comprehensive performance of the three-dimensional thermal analysis sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the structure of a first three-dimensional thermal analysis sensor provided by an embodiment of the present invention; Figure 2 A schematic structural diagram of a second three-dimensional thermal analysis sensor provided by an embodiment of the present invention; Figure 3 A schematic diagram of the structure of a first bottom thermoelectric layer provided by an embodiment of the present invention; Figure 4 A schematic diagram of the structure of a first bottom thermopile provided by an embodiment of the present invention; Figure 5 A schematic diagram of the structure of a second bottom thermoelectric layer provided by an embodiment of the present invention; Figure 6 A schematic diagram of the structure of a second bottom thermopile provided by an embodiment of the present invention; Figure 7 A schematic structural diagram of a first thermoelectric layer provided in an embodiment of the present invention; Figure 8 A schematic structural diagram of a first thermopile provided by an embodiment of the present invention; Fig. 9 A schematic diagram of the structure of another first thermoelectric layer provided in an embodiment of the present invention; Fig.10 A schematic structural diagram of a third three-dimensional thermal analysis sensor provided by an embodiment of the present invention; Fig.11A schematic diagram of the structure of a second thermoelectric layer provided in an embodiment of the present invention; Fig.12 A schematic structural diagram of a fourth three-dimensional thermal analysis sensor provided by an embodiment of the present invention; Fig.13 A schematic diagram of the structure of a temperature measurement layer provided in an embodiment of the present invention; Fig.14 A schematic plan view of a bottom substrate provided by an embodiment of the present invention; Fig.15 A schematic plan view of a temperature measuring layer provided by an embodiment of the present invention; Fig.16 A schematic plan view of a second substrate provided by an embodiment of the present invention; Fig.17 A schematic plan view of a first substrate provided by an embodiment of the present invention; Fig.18 A schematic plan view of a middle substrate provided by an embodiment of the present invention; Fig.19 A schematic plan view of a fourth substrate provided by an embodiment of the present invention; Fig. 20 A schematic plan view of a third substrate provided by an embodiment of the present invention; Fig.21 A schematic plan view of a sixth substrate provided by an embodiment of the present invention; Fig. 22 A schematic plan view of a fifth substrate provided by an embodiment of the present invention; Fig.23 A schematic plan view of a top substrate provided by an embodiment of the present invention.

[0017] Reference numerals: 100-three-dimensional thermal analysis sensor; 10-bottom substrate; 20-bottom thermoelectric layer; 21-bottom thermoelectric pile; 22-first substrate; 23-second substrate; 24-bottom thermoelectric substrate; 30-middle substrate; 40-first thermoelectric layer; 41-first thermoelectric pile; 42-third substrate; 43-fourth substrate; 44-substrate; 50-top substrate; 60-second thermoelectric layer; 61-second thermoelectric pile; 62-fifth substrate; 63-sixth substrate; 70-temperature measurement layer; 71-temperature measurement metal area; 200-thermocouple monomer of the first material; 300-thermocouple monomer of the second material; 400-metal column. DETAILED DESCRIPTION

[0018] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0019] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0020] Research on existing differential scanning calorimeters found that the internal thermocouple structure is usually arranged in a same insulating layer using thermocouples of different materials to detect the temperature difference between the inside and outside, which has the disadvantages of low accuracy and low detection sensitivity.

[0021] In view of the above problems, the present application proposes the following embodiments to solve the above technical problems.

[0022] See also Figure 1~Figure 2 The embodiment of the present application provides a three-dimensional thermal analysis sensor 100, comprising: a bottom substrate 10, a bottom thermoelectric layer 20, a middle substrate 30, a first thermoelectric layer 40 and a top substrate 50 stacked in sequence.

[0023] The bottom thermoelectric layer 20 includes two bottom thermoelectric piles 21. The first thermoelectric layer 40 includes two through holes and two first thermoelectric piles 41, and each first thermoelectric pile 41 is respectively distributed around a through hole of the first thermoelectric layer 40; the top substrate 50 includes two through holes; the two through holes of the first thermoelectric layer 40 correspond to the positions of the two through holes of the top substrate 50; and the two bottom thermoelectric piles 21 of the bottom thermoelectric layer 20 also correspond to the positions of the two through holes of the first thermoelectric layer 40.

[0024] It can be understood that the three-dimensional thermal analysis sensor 100 presents two grooves in layout (corresponding to the two through holes connecting the first thermoelectric layer 40 and the top substrate 50), and the two grooves respectively correspond to the sample measurement area and the reference area of ​​the three-dimensional thermal analysis sensor 100. The sample measurement area has a first thermopile 41 on the side corresponding to it and a bottom thermopile 21 at the bottom. Correspondingly, the reference area also has a first thermopile 41 on the side corresponding to it and a bottom thermopile 21 at the bottom.

[0025] In the embodiment of the present application, the bottom thermopile 21 and the first thermopile 41 are both composed of multiple pairs of thermocouples. During measurement, the crucible to be tested and the empty crucible are both placed on the middle substrate 30, and are both located in the through holes of the first thermoelectric layer 40 and the top substrate 50. Thus, one of the large through holes (including a through hole at the same position of the first thermoelectric layer 40 and the top substrate 50) corresponds to the sample measurement area, and the other large through hole (including another through hole at the same position of the first thermoelectric layer 40 and the top substrate 50) corresponds to the reference area, and the two large through holes are symmetrically distributed.

[0026] During the actual measurement operation, the sample is placed in the crucible to be tested, and then the crucible to be tested is placed in the sample measurement area, and the empty crucible is placed in the reference area before the measurement can begin.

[0027] Considering that the existing thermal analysis sensor can only detect the temperature difference between the inside and outside at the bottom, it has the disadvantages of low accuracy and low detection sensitivity. Therefore, the embodiment of the present application provides a three-dimensional thermal analysis sensor 100, which is configured as a two-layer thermopile structure, wherein when the crucible is placed on the middle substrate 30, the first thermopile 41 of the first thermoelectric layer 40 is distributed around the crucible, and the bottom thermopile 21 of the bottom thermoelectric layer 20 is distributed at the bottom of the crucible, so that the thermopiles on the side wall and the bottom can synchronously measure the temperature distribution of the crucible. For example, the bottom thermopile 21 can measure the temperature distribution of different areas, and the first thermopile 41 can measure the temperature distribution of different depths, so as to achieve three-dimensional perception of the heat source gradient (including the temperature difference in the vertical direction and the temperature difference in the horizontal direction), that is, the three-dimensional thermal analysis sensor 100 provides a three-dimensional heat distribution measurement method, which can improve the detection accuracy and thermal measurement efficiency of the thermal analysis sensor. At the same time, a groove-shaped measuring area can reduce heat diffusion and loss, making it easier for the side wall thermopile to capture the heat flow conducted along the groove wall, thereby improving the comprehensive performance of the three-dimensional thermal analysis sensor 100.

[0028] Next, the structure of the bottom thermoelectric layer 20 will be described.

[0029] In the first implementation, see Figure 3 and Figure 4 The bottom thermoelectric layer 20 includes a first substrate 22 and a second substrate 23 stacked in sequence.

[0030] The first substrate 22 includes N thermocouple monomers 200 of the first material. The N thermocouple monomers 200 of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer 200 of the first material includes a first end and a second end; N is a positive integer. N can be set according to the required standard, size, and structure of the three-dimensional thermal analysis sensor 100, such as N can be 17, 30, etc., which is not limited here.

[0031] The second substrate 23 includes N thermocouple monomers 300 made of the second material. The N thermocouple monomers 300 made of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer 300 made of the second material includes a first end and a second end.

[0032] Among them, the first end of each thermocouple monomer 200 of the first material is connected to the first end of a thermocouple monomer 300 of the second material through a metal column 400, and the second end of each thermocouple monomer 200 of the first material is connected to the second end of another thermocouple monomer 300 of the second material through a metal column 400, so that the thermocouple monomer 200 of the first material on the first substrate 22 and the thermocouple monomer 300 of the second material on the second substrate 23 are connected in series in sequence; N pairs of thermocouples form a bottom thermopile 21.

[0033] It should be noted that the structure of the thermocouple monomer 200 of the first material is the same as that of the thermocouple monomer 300 of the second material. For example, the thermocouple monomer 200 of the first material is a long strip structure as a whole, having a first end and a second end, that is, the first end and the second end are two ends of the long strip structure. Since the thermocouple monomers 200 of the first material are arranged in a ring shape and are spaced apart, the first ends of the N thermocouple monomers 200 of the first material form an inner circle, and the second ends of the N thermocouple monomers 200 of the first material form an outer circle.

[0034] Then, the first end of each thermocouple monomer 200 of the first material is connected to the first end of a thermocouple monomer 300 of the second material through the metal column 400, and the second end of each thermocouple monomer 200 of the first material is connected to the second end of another thermocouple monomer 300 of the second material through the metal column 400, so that the thermocouple monomer 200 of the first material on the first substrate 22 and the thermocouple monomer 300 of the second material on the second substrate 23 are connected in series in sequence. The first ends of the N thermocouple monomers 200 of the first material and the first ends of the N thermocouple monomers 300 of the second material form an inner circle thermoelectric junction. The second ends of the N thermocouple monomers 200 of the first material and the second ends of the N thermocouple monomers 300 of the second material form an outer circle thermoelectric junction. The adjacent thermocouple monomers 200 of the first material and the thermocouple monomers 300 of the second material form a pair of thermocouples (in a V shape); the N pairs of thermocouples form the bottom thermopile 21.

[0035] It can be understood that the bottom thermopile 21 is realized by 2N thermocouples which are staggered up and down and connected in series in sequence, and the whole is also arranged in a ring shape.

[0036] Since the bottom thermopile 21 adopts an inner and outer circle distribution structure, the inner circle thermoelectric junction can be more concentrated and denser, so that the detected heat flow signal intensity is enhanced, thereby effectively measuring the temperature difference in the inner and outer directions. At the same time, the bottom thermopile 21 also adopts an upper and lower staggered distribution, and the thermocouple monomers of the same material are only located on the same insulating plate, and the thermocouples of different materials are connected up and down through the metal column 400. Through the upper and lower staggered distribution of the bottom thermopile 21, the bottom thermopile 21 can effectively measure the temperature difference in the vertical direction. For example, for any one of the thermocouple monomers 200 of the first material, the thermocouple structure can measure the temperature difference between the first end of the thermocouple monomer 200 of the first material and the second end of the thermocouple monomer 300 of the second material connected to the second end of the thermocouple monomer 200 of the first material. In this way, the vertical heat flow is sensed, the measurement area is further improved, and the thermoelectric signal is more obvious and the response is more sensitive. In other words, the bottom thermopile 21 itself can also sense the temperature vertically and perform effective measurements.

[0037] In the second implementation, see Figure 5~Figure 6 Optionally, the bottom thermoelectric layer 20 may include a bottom thermoelectric substrate 24 .

[0038] N thermocouple monomers 200 of the first material are disposed through the bottom thermoelectric substrate 24. The first ends of the N thermocouple monomers 200 of the first material are located on the first surface of the bottom thermoelectric substrate 24, and the second ends of the N thermocouple monomers 200 of the first material are located on the second surface of the bottom thermoelectric substrate 24; N is a positive integer.

[0039] N thermocouple monomers 300 of the second material are arranged throughout the bottom thermoelectric substrate 24 ; the first ends of the N thermocouple monomers 300 of the second material are located on the first surface of the bottom thermoelectric substrate 24 , and the second ends of the N thermocouple monomers 300 of the second material are located on the second surface of the bottom thermoelectric substrate 24 .

[0040] The first end of each thermocouple monomer 200 of the first material is connected to the first end of an adjacent thermocouple monomer 300 of the second material, and the second end of each thermocouple monomer 200 of the first material is connected to the second end of another adjacent thermocouple monomer 300 of the second material, so that the N thermocouple monomers 200 of the first material and the N thermocouple monomers 300 of the second material in the bottom thermoelectric substrate are connected in series in sequence.

[0041] It should be noted that the adjacent thermocouple monomers 200 of the first material and the adjacent thermocouple monomers 300 of the second material form a pair of thermocouples, so that the three-dimensional thermal analysis sensor 100 includes N pairs of thermocouples, and the N pairs of thermocouples form the bottom thermopile 21 .

[0042] When the three-dimensional thermal analysis sensor 100 is used for specific measurements, the first surface of the bottom thermoelectric substrate 24 is used as the side close to the crucible. The first ends of the two thermocouple monomers connected in the first surface of the bottom thermoelectric substrate 24 form an upper surface thermoelectric junction; that is, the first surface of the bottom thermoelectric substrate 24 includes N upper surface thermoelectric junctions. The second ends of the two thermocouple monomers connected in the second surface of the bottom thermoelectric substrate 24 form a lower surface thermoelectric junction. That is, the second surface of the bottom thermoelectric substrate 24 includes N lower surface thermoelectric junctions. It can be understood that the two thermoelectric junctions of the N pairs of thermocouples are respectively distributed on the upper and lower surfaces of the bottom thermoelectric substrate 24, and then when there is a temperature difference between the two surfaces, there will be a thermoelectric potential, thereby achieving measurement.

[0043] That is, the bottom thermopile 21 provides a method of sensing and detecting the upper and lower temperature differences, and realizes measurement by detecting the overall temperature difference of the two surfaces, that is, through the upper and lower temperature difference detection, it can be more in line with the heat transfer direction of the sample reaction in the crucible, and improve the measurement accuracy. At the same time, through the arrangement of the upper and lower thermoelectric junctions, compared with the traditional arrangement of thermocouples on the same plane, the density of the thermoelectric junctions can be greatly increased, so that the upper surface can more completely capture the heat released by the sample reaction in the crucible, thereby improving the thermoelectric conversion coefficient of the heat flow measurement. In addition, the embodiment of the present application provides a through-type thermocouple structure, which can reduce the thermal measurement time constant. The bottom thermopile 21 can capture transient temperature changes more quickly, detect smaller temperature difference changes per unit time, and improve thermal resolution and detection sensitivity.

[0044] Optionally, the thickness of the bottom thermoelectric substrate 24 is M millimeters; M is a positive number; and the range of M is 0.3-1.2.

[0045] It should be noted that setting the thickness of the bottom thermoelectric substrate 24 to 0.3 mm to 1.2 mm can significantly increase the temperature difference between the upper surface (close to the heat source) and the lower surface (far away from the heat source) of the bottom thermoelectric substrate 24, thereby improving the sensitivity of the differential measurement, that is, a significant temperature difference can be achieved between the upper and lower surfaces, thereby enhancing the signal output.

[0046] See also Figure 7~Figure 8Optionally, the first thermoelectric layer 40 includes a third substrate 42 and a fourth substrate 43. The third substrate 42 includes N thermocouple monomers 200 of the first material; the N thermocouple monomers 200 of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer 200 of the first material includes a first end and a second end; N is a positive integer; the fourth substrate 43 includes N thermocouple monomers 300 of the second material; the N thermocouple monomers 300 of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer 300 of the second material includes a first end and a second end; wherein the first end of each thermocouple monomer 200 of the first material is connected to the first end of a thermocouple monomer 300 of the second material through a metal column 400, and the second end of each thermocouple monomer 200 of the first material is connected to the second end of another thermocouple monomer 300 of the second material through a metal column 400, so that the thermocouple monomers 200 of the first material on the third substrate 42 and the thermocouple monomers 300 of the second material on the fourth substrate 43 are connected in series in sequence; N pairs of thermocouples form a first thermoelectric pile 41.

[0047] It should be noted that the first thermopile 41 composed of the third substrate 42 and the fourth substrate 43 is similar in structure to the bottom thermopile 21 composed of the first substrate 22 and the second substrate 23, except that the overall size and distribution of the two are different. The bottom thermopile 21 composed of the first substrate 22 and the second substrate 23 has a larger overall structure and is used for crucible bottom measurement. The first thermopile 41 composed of the third substrate 42 and the fourth substrate 43 is smaller overall, distributed around the through hole, and used for crucible side wall measurement. Therefore, the first thermopile 41 composed of the third substrate 42 and the fourth substrate 43 and the bottom thermopile 21 composed of the first substrate 22 and the second substrate 23 can refer to each other for the same structural parts, which will not be repeated this time.

[0048] See also Fig. 9 Optionally, the first thermoelectric layer 40 further includes Q sub-substrates 44 .

[0049] Q is a positive integer greater than 1, such as Fig. 9 , the value of Q is 2. Q sub-substrates 44 are disposed between the third substrate 42 and the fourth substrate 43 , and each metal column passes through the Q sub-substrates 44 .

[0050] Since the distance between the third substrate 42 and the fourth substrate 43 is deepened, the depth of thermal measurement can be increased. In this way, the temperature difference measurement in the vertical direction can be further improved, and a larger temperature difference change can be sensed.

[0051] See also Fig.10 Optionally, the three-dimensional thermal analysis sensor 100 further includes a second thermoelectric layer 60 .

[0052] The second thermoelectric layer 60 is disposed between the first thermoelectric layer 40 and the top substrate 50 .

[0053] The second thermoelectric layer 60 includes two through holes and two second thermoelectric piles 61 , and each second thermoelectric pile 61 is respectively distributed around a through hole of the second thermoelectric layer 60 ; the two through holes of the second thermoelectric layer 60 correspond to the positions of the two through holes of the first thermoelectric layer 40 .

[0054] It should be noted that the structure of the second thermoelectric layer 60 may refer to the structure description of the first thermoelectric layer 40 , which will not be described in detail here.

[0055] In the embodiment of the present application, an additional second thermoelectric layer 60 is added in the depth direction, so that effective thermal measurement can be performed at different depth positions in the direction of the crucible side wall, further improving the accuracy of three-dimensional thermal measurement.

[0056] See also Fig.11 Optionally, the second thermoelectric layer 60 includes a fifth substrate 62 and a sixth substrate 63 stacked in sequence.

[0057] The fifth substrate 62 includes N thermocouple monomers of the first material; the N thermocouple monomers of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the first material includes a first end and a second end; N is a positive integer; the sixth substrate includes N thermocouple monomers of the second material; the N thermocouple monomers of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the second material includes a first end and a second end; wherein the first end of each thermocouple monomer of the first material is connected to the first end of a thermocouple monomer of the second material through a metal column, and the second end of each thermocouple monomer of the first material is connected to the second end of another thermocouple monomer of the second material through a metal column, so that the thermocouple monomer of the first material on the fifth substrate and the thermocouple monomer of the second material on the sixth substrate are connected in series in sequence; N pairs of thermocouples form a second thermoelectric pile 61.

[0058] It should be noted that the second thermopile 61 composed of the fifth substrate 62 and the sixth substrate 63 has the same structure as the first thermopile 41 composed of the third substrate 42 and the fourth substrate 43. Therefore, the same parts can be referred to each other and will not be described in detail.

[0059] See also Fig.12 Optionally, the three-dimensional thermal analysis sensor 100 further includes a temperature measurement layer 70. The temperature measurement layer 70 is stacked and arranged between the bottom substrate 10 and the bottom thermoelectric layer 20. The temperature measurement layer 70 is used for temperature measurement.

[0060] See also Fig.13Optionally, the temperature measuring layer 70 includes two temperature measuring metal regions 71, and the metal of the temperature measuring metal regions is platinum. Of course, in other embodiments, other metals may also be used, which is not limited here.

[0061] It should be noted that the thermocouple monomer 200 of the first material and the thermocouple monomer 300 of the second material in the embodiment of the present application are two thermocouple monomers with different materials. In one embodiment, the first material is gold platinum palladium, and the second material is gold. Adjacent thermocouple monomers 200 of the first material and thermocouple monomers 300 of the second material can be connected by gold.

[0062] Except, in the embodiment of the present application, the bottom substrate 10, the first substrate 22, the second substrate 23, the middle substrate 30, the third substrate 42, the fourth substrate 43, the sub-substrate 44, the second thermoelectric layer 60, the fifth substrate 62, the sixth substrate 63 and the temperature measuring layer 70 can all be single-layer insulating substrates. The insulating substrate can be a ceramic plate, and can be specifically a co-fired temperature-resistant ceramic sheet. Of course, this is not limited here, and other temperature-resistant insulating materials can also be used. In addition, the bottom substrate 10, the first substrate 22, the second substrate 23, the middle substrate 30, the third substrate 42, the fourth substrate 43, the sub-substrate 44, the second thermoelectric layer 60, the fifth substrate 62, the sixth substrate 63 and the temperature measuring layer 70 can all be circular in shape.

[0063] See also Figures 14 to 23 , as an example of a complete three-dimensional thermal analysis sensor 100, which includes 10 layers of insulating substrates.

[0064] The three-dimensional sensor is realized by using a multi-layer insulating substrate stacking technology. From the bottom to the top, the insulating layer is the first insulating bottom layer (corresponding to the bottom substrate 10), the second layer is the platinum layer (corresponding to the temperature measurement layer 70), the third and fourth layers are the calorimetric sensor layers (the third layer corresponds to the second substrate 23, and the fourth layer corresponds to the first substrate 22), the fifth layer is the insulating interlayer (corresponding to the middle substrate 30), the sixth to ninth layers are the calorimetric sensor layers (the sixth layer corresponds to the fourth substrate 43, the seventh layer corresponds to the third substrate 42, the eighth layer corresponds to the sixth substrate 63, and the ninth layer corresponds to the fifth substrate 62), and the tenth layer is the top insulating layer (corresponding to the top substrate 50).

[0065] The insulating substrate has a circular shape, and two areas are symmetrically distributed on the circular surface, namely, a sample area and a reference area.

[0066] The second layer is platinum coated on an insulating substrate, symmetrically distributed in the sample area and the reference area.

[0067] The third layer is a metal paste of gold, platinum and palladium coated on the insulating substrate, symmetrically distributed in the sample area and the reference area. The metal rings are distributed on the surface of the insulating substrate.

[0068] The fourth layer is a gold metal paste coated on the insulating substrate, symmetrically distributed in the sample area and the reference area. The metal rings are distributed on the surface of the insulating substrate. A hole is opened at the end point of the metal inner circle of the insulating substrate, and the gold metal paste is poured, which is connected with the corresponding third layer of metal gold, platinum and palladium to form an inner circle point thermoelectric junction. A hole is opened at the end point of the metal outer circle of the insulating substrate, and the gold metal paste is poured, which is connected with the corresponding third layer of metal gold, platinum and palladium to form an outer circle point thermoelectric junction.

[0069] The fifth layer is an insulating substrate that protects the surface metal of the fourth layer.

[0070] The sixth layer is a gold metal paste coated on an insulating substrate, symmetrically distributed in the sample area and the reference area.

[0071] The seventh layer is a metal paste of gold, platinum and palladium on the insulating substrate, symmetrically distributed in the sample area and the reference area. The metal rings are distributed on the surface of the insulating substrate. A hole is opened at the end point of the inner circle of the insulating substrate metal, and the metal paste gold is poured, which is connected with the corresponding sixth layer of metal gold to form an inner circle point thermoelectric junction. A hole is opened at the end point of the outer circle of the insulating substrate metal, and the metal paste gold is poured, which is connected with the corresponding sixth layer of metal gold to form an outer circle point thermoelectric junction.

[0072] The eighth layer is a metal paste of gold, platinum and palladium coated on an insulating substrate, which is symmetrically distributed in the sample area and the reference area.

[0073] The 9th layer is a gold metal paste coated on an insulating substrate, symmetrically distributed in the sample area and the reference area. The metal rings are distributed on the surface of the insulating substrate. A hole is opened at the end point of the inner circle of the insulating substrate metal, and the gold metal paste is poured, which is connected to the corresponding 8th layer of metal gold, platinum and palladium to form an inner circle point thermoelectric junction. A hole is opened at the end point of the outer circle of the insulating substrate metal, and the gold metal paste is poured, which is connected to the corresponding 9th layer of metal gold, platinum and palladium to form an outer circle point thermoelectric junction.

[0074] The 10th layer is an insulating substrate that protects the surface metal of the 9th layer.

[0075] The 3rd layer and the 4th layer are connected by hole-injected metal to form a bottom thermopile, the 6th layer and the 7th layer are connected by hole-injected metal to form a middle thermopile, and the 8th layer and the 9th layer are connected by hole-injected metal to form an upper thermopile.

[0076] The bottom thermopile and the middle thermopile are connected in series by pouring gold paste through the opening of the insulating substrate. The middle thermopile and the top thermopile are connected in series by pouring gold paste through the opening of the insulating substrate.

[0077] The heat of the bottom of the sample crucible is measured by the bottom thermopile, and the heat of the side wall of the sample crucible is measured by the middle thermopile and the top thermopile, forming a three-dimensional heat measurement. The three-dimensional thermocouple sensor method improves the efficiency of heat measurement.

[0078] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A three-dimensional thermal analysis sensor, characterized in that: It includes a bottom substrate, a bottom thermoelectric layer, a middle substrate, a first thermoelectric layer and a top substrate which are stacked in sequence; The bottom thermoelectric layer includes two bottom thermopiles, the first thermoelectric layer includes two through holes and two first thermopiles, and each first thermopiles is respectively distributed around a through hole of the first thermoelectric layer; the top substrate includes two through holes; the two through holes of the first thermoelectric layer correspond to the positions of the two through holes of the top substrate; and the two bottom thermopiles of the bottom thermoelectric layer also correspond to the positions of the two through holes of the first thermoelectric layer; Wherein, during measurement, the crucible to be tested and the empty crucible are both placed on the middle substrate, and are both located in the through holes of the first thermoelectric layer and the top substrate.

2. The three-dimensional thermal analysis sensor according to claim 1, characterized in that: The bottom thermoelectric layer includes a first substrate and a second substrate stacked in sequence; The first substrate includes N thermocouple monomers of a first material; the N thermocouple monomers of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the first material includes a first end and a second end; N is a positive integer; The second substrate includes N thermocouple monomers made of a second material; the N thermocouple monomers made of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer made of the second material includes a first end and a second end; Among them, the first end of each thermocouple monomer of the first material is connected to the first end of a thermocouple monomer of the second material through a metal column, and the second end of each thermocouple monomer of the first material is connected to the second end of another thermocouple monomer of the second material through a metal column, so that the thermocouple monomer of the first material on the first substrate and the thermocouple monomer of the second material on the second substrate are connected in series in sequence; N pairs of thermocouples form the bottom thermopile.

3. The three-dimensional thermal analysis sensor according to claim 1, characterized in that: The bottom thermoelectric layer includes: a bottom thermoelectric substrate; N thermocouple monomers of the first material are arranged throughout the bottom thermoelectric substrate; the first ends of the N thermocouple monomers of the first material are located on the first surface of the bottom thermoelectric substrate, and the second ends of the N thermocouple monomers of the first material are located on the second surface of the bottom thermoelectric substrate; N is a positive integer; N thermocouple monomers of the second material are arranged throughout the bottom thermoelectric substrate; the first ends of the N thermocouple monomers of the second material are located on the first surface of the bottom thermoelectric substrate, and the second ends of the N thermocouple monomers of the second material are located on the second surface of the bottom thermoelectric substrate; The first end of each thermocouple monomer of the first material is connected to the first end of an adjacent thermocouple monomer of the second material, and the second end of each thermocouple monomer of the first material is connected to the second end of another adjacent thermocouple monomer of the second material, so that N thermocouple monomers of the first material and N thermocouple monomers of the second material in the bottom thermoelectric substrate are connected in series in sequence; N pairs of thermocouples form the bottom thermoelectric pile.

4. The three-dimensional thermal analysis sensor according to claim 3, characterized in that: The thickness of the bottom thermoelectric substrate is M millimeters; M is a positive number; The range of M is 0.3~1.

2.

5. The three-dimensional thermal analysis sensor according to claim 1, characterized in that: The first thermoelectric layer includes a third substrate and a fourth substrate; The third substrate includes N thermocouple monomers of the first material; the N thermocouple monomers of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the first material includes a first end and a second end; N is a positive integer; The fourth substrate includes N thermocouple monomers made of the second material; the N thermocouple monomers made of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer made of the second material includes a first end and a second end; Among them, the first end of each thermocouple monomer of the first material is connected to the first end of a thermocouple monomer of the second material through a metal column, and the second end of each thermocouple monomer of the first material is connected to the second end of another thermocouple monomer of the second material through a metal column, so that the thermocouple monomer of the first material on the third substrate and the thermocouple monomer of the second material on the fourth substrate are connected in series in sequence; N pairs of thermocouples form the first thermopile.

6. The three-dimensional thermal analysis sensor according to claim 5, characterized in that: The first thermoelectric layer further includes Q sub-substrates; Q is a positive integer greater than 1; The Q sub-substrates are disposed between the third substrate and the fourth substrate, and each metal pillar passes through the Q sub-substrates.

7. The three-dimensional thermal analysis sensor according to claim 1, characterized in that: The three-dimensional thermal analysis sensor also includes a second thermoelectric layer; The second thermoelectric layer is arranged between the first thermoelectric layer and the top substrate; the second thermoelectric layer includes two through holes and two second thermoelectric piles, and each second thermoelectric pile is distributed around a through hole of the second thermoelectric layer; the two through holes of the second thermoelectric layer correspond to the positions of the two through holes of the first thermoelectric layer.

8. The three-dimensional thermal analysis sensor according to claim 7, characterized in that: The second thermoelectric layer includes a fifth substrate and a sixth substrate stacked in sequence; The fifth substrate includes N thermocouple monomers of the first material; the N thermocouple monomers of the first material are arranged in a ring shape and are spaced apart; each thermocouple monomer of the first material includes a first end and a second end; N is a positive integer; The sixth substrate includes N thermocouple monomers made of the second material; the N thermocouple monomers made of the second material are arranged in a ring shape and are spaced apart; each thermocouple monomer made of the second material includes a first end and a second end; Among them, the first end of each thermocouple monomer of the first material is connected to the first end of a thermocouple monomer of the second material through a metal column, and the second end of each thermocouple monomer of the first material is connected to the second end of another thermocouple monomer of the second material through a metal column, so that the thermocouple monomer of the first material on the fifth substrate and the thermocouple monomer of the second material on the sixth substrate are connected in series in sequence; N pairs of thermocouples form the second thermopile.

9. The three-dimensional thermal analysis sensor according to claim 1, characterized in that: The three-dimensional thermal analysis sensor also includes a temperature measurement layer; The temperature measurement layer stack is arranged between the bottom substrate and the bottom thermoelectric layer.

10. The three-dimensional thermal analysis sensor according to claim 9, characterized in that: The temperature measuring layer includes two temperature measuring metal areas, and the metal of the temperature measuring metal areas is platinum.

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