Hot copper aging mold suitable for sheet-shaped semi-conductive shielding material and use method of hot copper aging mold

Abstract

The invention discloses a hot copper aging mold suitable for a sheet-shaped semi-conductive shielding material and a use method, and the hot copper aging mold suitable for the sheet-shaped semi-conductive shielding material comprises a mold main body plate which is provided with a plurality of sample grooves; each sample assembly comprises a first protection layer, a copper sheet, a shielding material sample, a second protection layer, a pressure detection device and a flexible layer; the pressing pieces are suitable for being detachably installed on the mold main body plate through threaded fasteners, the pressing pieces comprise the first pressing pieces and the second pressing pieces, and copper wire core simulation textures are arranged on the surfaces, facing the sample grooves, of the first pressing pieces. According to the hot copper aging mold suitable for the sheet-shaped semi-conductive shielding material, the influence of pressure and wire core texture on the aging process can be researched, and the hot copper aging mold has the advantages of being high in reliability and accuracy, uniform in stress and the like.

Description

Technical Field

[0001] The invention relates to the technical field of hot copper aging test, and in particular to a hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials and a use method thereof. Background Art

[0002] Cross-linked polyethylene cables generate a lot of pollution during the production process and are difficult to recycle. Polypropylene is considered to be the most environmentally friendly insulating material with the greatest potential to replace cross-linked polyethylene. However, when the polypropylene-based semi-conductive shielding layer is in contact with the copper cable core at high temperatures for a long time, copper ions will catalyze the oxidative degradation of polypropylene and destroy the shielding layer. It is necessary to conduct hot copper aging tests on semi-conductive shielding materials to evaluate the material's anti-copper damage effect.

[0003] The hot copper aging test device in the related technology places the copper sheet and the shielding material sample between the pressing sheet and the mold, tightens the pressing sheet and the mold with screws to make the copper sheet and the sample fit tightly, and then places the device at a set experimental temperature to perform hot copper aging.

[0004] The hot copper aging test device in the related art makes it difficult to know the pressure on each sample, and because the screws are tightened to different degrees, it is also difficult to ensure that each sample is subjected to the same pressure, making it difficult to study the impact of pressure on the hot copper aging process. In addition, the same sample is prone to uneven force at different locations, affecting the accuracy of the test results. In addition, the copper wire core is affected by the process, and there will be concave lines on the surface. The hot copper aging test device in the related art cannot simulate the impact of such lines on the hot copper aging process. Summary of the invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a hot copper aging mold suitable for sheet-like semi-conductive shielding materials, which can study the influence of pressure and wire core texture on the aging process, and has the advantages of high reliability, high accuracy, uniform force, etc.

[0006] The present invention also provides a method for using the hot copper aging mold suitable for the sheet-like semi-conductive shielding material.

[0007] To achieve the above-mentioned purpose, according to an embodiment of the first aspect of the present invention, a hot copper aging mold suitable for sheet-like semi-conductive shielding materials is proposed, and the hot copper aging mold suitable for sheet-like semi-conductive shielding materials comprises: a mold main body plate, on which a plurality of sample slots are provided; a plurality of sample assemblies, the plurality of sample assemblies are suitable for respectively fitting into the plurality of sample slots, each of the sample assemblies comprising a first protective layer, a copper sheet, a shielding material sample, a second protective layer, a pressure detection device and a flexible layer stacked in sequence in the thickness direction; a plurality of pressing sheets, the pressing sheets being suitable for being detachably mounted on the mold main body plate by threaded fasteners, each of the pressing sheets being suitable for covering a sample slot and being suitable for clamping the sample assembly in the covered sample slot together with the bottom wall of the covered sample slot, the plurality of pressing sheets comprising one or more first pressing sheets and one or more second pressing sheets, and the surface of the first pressing sheet facing the sample slot is provided with a copper wire core simulation texture.

[0008] The hot copper aging mold suitable for sheet-like semi-conductive shielding materials according to the embodiment of the present invention can study the influence of pressure and wire core texture on the aging process, and has the advantages of strong reliability, high accuracy, uniform force, etc.

[0009] In addition, the hot copper aging mold for sheet-shaped semi-conductive shielding materials according to the above embodiment of the present invention may also have the following additional technical features:

[0010] According to an embodiment of the present invention, the thickness of the sample assembly is greater than the depth of the sample groove.

[0011] According to an embodiment of the present invention, both the first protective layer and the second protective layer are polyimide material layers.

[0012] According to an embodiment of the present invention, the pressure detection device is a thin film pressure sensor.

[0013] According to one embodiment of the present invention, the flexible layer is a foamed silicone layer.

[0014] According to an embodiment of the present invention, each of the pressing plates is provided with a plurality of mounting holes, the threaded fasteners are fitted in the mounting holes, and the plurality of mounting holes are arranged in an array on the pressing plates.

[0015] According to an embodiment of the present invention, the sample assembly is clearance-matched with the sample slot.

[0016] According to one embodiment of the present invention, two opposite surfaces of the mold body plate are provided with sample grooves.

[0017] According to an embodiment of the second aspect of the present invention, a method for using the hot copper aging mold applicable to sheet-shaped semi-conductive shielding materials according to an embodiment of the first aspect of the present invention is provided, comprising the following steps:

[0018] S1, placing the sample assembly in the sample slot;

[0019] S2, mounting the pressing sheet on the mold main body plate by means of threaded fasteners, detecting the pressure on the sample assembly by means of the pressure detection device, and adjusting the pressure on the sample assembly by tightening or loosening the threaded fasteners, so that the pressure on each sample assembly is within a predetermined pressure range;

[0020] S3, placing the hot copper aging mold into a heating box at a predetermined test temperature for heating to perform an aging test;

[0021] S4. After the test, the hot copper aging mold is taken out from the heating box, and after cooling, the threaded fastener is disassembled and the sample assembly is taken out.

[0022] According to the method for using the hot copper aging mold suitable for sheet-like semi-conductive shielding materials in an embodiment of the present invention, by utilizing the hot copper aging mold suitable for sheet-like semi-conductive shielding materials described in the embodiment of the first aspect of the present invention, it is possible to study the influence of pressure and wire core texture on the aging process, and has the advantages of strong reliability, high accuracy, and uniform force.

[0023] According to one embodiment of the present invention, each of the pressing pieces is installed on the mold main body plate by means of a plurality of threaded fasteners arranged in an array. In step S2, the threaded fasteners relatively close to the middle of the pressing piece are installed first, and then the threaded fasteners relatively far from the middle of the pressing piece are installed.

[0024] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0026] Figure 1 1 is a schematic structural diagram of a hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0027] Figure 2 It is a structural schematic diagram of a mold main body plate of a hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0028] Figure 3 It is a schematic structural diagram of a first pressing sheet of a hot copper aging mold applicable to sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0029] Figure 4 1 is a schematic structural diagram of a second pressing sheet of a hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0030] Figure 5 It is a schematic structural diagram of a sample assembly of a hot copper aging mold applicable to sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0031] Figure 6 The present invention is a flowchart of a method for using a hot copper aging mold for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0032] Figure numerals: hot copper aging mold 1 for sheet-like semi-conductive shielding material, mold main body plate 10, sample slot 11, threaded hole 12, sample assembly 20, first protective layer 21, copper sheet 22, shielding material sample 23, second protective layer 24, pressure detection device 25, flexible layer 26, pressing sheet 30, first pressing sheet 31, second pressing sheet 32, copper wire core simulated texture 33, mounting hole 34. DETAILED DESCRIPTION

[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] The following describes a hot copper aging mold 1 applicable to sheet-shaped semiconductive shielding materials according to an embodiment of the present invention with reference to the accompanying drawings.

[0037] like Figure 1-Figure 5 As shown, a hot copper aging mold 1 applicable to sheet-shaped semiconductive shielding materials according to an embodiment of the present invention comprises a mold body plate 10 , a sample assembly 20 and a plurality of pressing sheets 30 .

[0038] The mold body plate 10 is provided with a plurality of sample slots 11. The plurality of sample assemblies 20 are adapted to be respectively fitted in the plurality of sample slots 11, and each sample assembly 20 comprises a first protective layer 21, a copper sheet 22, a shielding material sample 23, a second protective layer 24, a pressure detection device 25 and a flexible layer 26 which are sequentially stacked in the thickness direction. The pressing sheet 30 is adapted to be detachably mounted on the mold body plate 10 by means of threaded fasteners, and each pressing sheet 30 is adapted to cover a sample slot 11 and is adapted to clamp the sample assembly 20 in the covered sample slot 11 together with the bottom wall of the covered sample slot 11, and the plurality of pressing sheets 30 comprises one or more first pressing sheets 31 and one or more second pressing sheets 32, and a copper wire core simulation texture 33 is provided on the surface of the first pressing sheet 31 facing the sample slot 11.

[0039] Specifically, when the test is required, the sample assembly 20 is placed in the sample slot 11, and the pressing sheet 30 is installed on the mold main body plate 10 through the threaded fasteners. The pressure on the sample assembly is detected by the pressure detection device, and the pressure on the sample assembly 20 is adjusted by tightening or loosening the threaded fasteners, so that the pressure on each sample assembly 20 is within the predetermined pressure range, and the hot copper aging mold 1 is placed in a heating box at a predetermined test temperature for heating to perform an aging test. After the test is completed, the hot copper aging mold 1 is taken out of the heating box, and the threaded fasteners are removed after cooling, and the sample assembly 20 is taken out. Observe, detect, and record the aging degree of the shielding material sample 23.

[0040] The predetermined pressure range can be adjusted according to test requirements to study the effect of pressure on the aging process when pressure is used as a test variable.

[0041] It should be understood here that the “bottom wall” of the sample slot 11 refers to the bottom wall in the direction in which it is opened. In other words, the bottom wall of the sample slot 11 is opposite to the open side of the sample slot 11 .

[0042] The flexible layer 26 can be attached to the bottom wall of the sample slot 11. In other words, when the upper surface of the sample slot 11 is open, the first protective layer 21, the copper sheet 22, the shielding material sample 23, the second protective layer 24, the pressure detection device 25 and the flexible layer 26 are stacked in sequence from top to bottom.

[0043] The surface of the second pressing sheet 32 ​​facing the sample slot 11 may be a flat surface.

[0044] The pressure detection device 25 and the flexible layer 26 can be reused in each test process.

[0045] According to the hot copper aging mold 1 suitable for sheet-like semi-conductive shielding materials according to the embodiment of the present invention, by setting the first protective layer 21 and the second protective layer 24, the first protective layer 21 can be used to isolate the copper sheet 22 and the pressing sheet 30, and the second protective layer 24 can be used to isolate the shielding material sample 23 and the pressure detection device 25, thereby protecting the pressing sheet 30 and the pressure detection device 25, improving the reliability of the hot copper aging mold 1 suitable for sheet-like semi-conductive shielding materials, and facilitating repeated tests.

[0046] Furthermore, by providing a pressure detection device 25, the pressure detection device 25 can be used to detect the pressure on each sample assembly 20, which can facilitate the control of the pressure on each sample assembly 20. Compared with the hot copper aging test device in the related art, on the one hand, it can facilitate the pressure on each sample assembly 20 to be close, avoiding the problem of inconsistent force on the samples due to different tightening degrees of the screws, thereby improving the accuracy of the test. On the other hand, it can facilitate the use of pressure as a test variable, thereby facilitating the study of the influence of pressure on the hot copper aging process.

[0047] In addition, by providing the flexible layer 26, the flexible layer 26 can undergo elastic deformation when the sample assembly 20 is clamped, so that the force acts evenly on the shielding material sample 23 and the copper sheet 22, thereby improving the uniformity of the force on the shielding material sample 23 and the copper sheet 22 and further improving the accuracy of the test results.

[0048] Furthermore, by setting up a first pressing plate 31 and a second pressing plate 32, a copper wire core simulation texture 33 is provided on the surface of the first pressing plate 31 facing the sample slot 11. The copper wire core simulation texture 33 can be used to simulate the concave texture on the copper wire core, so that the first pressing plate 31 and the second pressing plate 32 can be used to perform a control test with and without the texture, thereby simulating the influence of the texture on the aging process of the shielding material sample 23, and restoring the actual situation of contact between the internal core of the cable and the shielding material layer.

[0049] Therefore, the hot copper aging mold 1 suitable for sheet-like semi-conductive shielding materials according to the embodiment of the present invention can study the influence of pressure and wire core texture on the aging process, and has the advantages of strong reliability, high accuracy, uniform force, etc.

[0050] The following describes a hot copper aging mold 1 applicable to sheet-shaped semi-conductive shielding materials according to a specific embodiment of the present invention with reference to the accompanying drawings.

[0051] In some specific embodiments of the present invention, Figure 1-Figure 5 As shown, a hot copper aging mold 1 applicable to sheet-shaped semiconductive shielding materials according to an embodiment of the present invention comprises a mold body plate 10 , a sample assembly 20 and a plurality of pressing sheets 30 .

[0052] Advantageously, the thickness of the sample assembly 20 is greater than the depth of the sample groove 11. Specifically, since the flexible layer 26 can be elastically deformed, the pressing sheet 30 can completely squeeze the sample assembly 20 into the sample groove 11 by tightening the threaded fasteners without causing the problem of difficulty in installing the threaded fasteners. In this way, after the pressing sheet 30 is installed by the threaded fasteners, it is convenient for the pressing sheet 30 and the bottom wall of the sample groove 11 to squeeze the sample assembly 20 together, so that the copper sheet 22 and the shielding material sample 23 can withstand a certain pressure, and the uniformity of the force on the copper sheet 22 and the shielding material sample 23 is further improved.

[0053] Optionally, the first protective layer 21 and the second protective layer 24 are both polyimide material layers, so that the first protective layer 21 and the second protective layer 24 have good high temperature resistance, are not easily deformed, and are not easily adhered to the shielding material sample 23.

[0054] Furthermore, the pressure detection device 25 is a thin film pressure sensor, which can facilitate the detection of the pressure on the sample assembly 20 .

[0055] Furthermore, the flexible layer 26 is a foamed silicone layer, which can make the flexible layer 26 have good elastic deformation ability and improve the uniformity of the force of the sample assembly 20.

[0056] Specifically, Figure 1-Figure 4 As shown, each pressing sheet 30 is provided with a plurality of mounting holes 34, and the threaded fasteners are fitted in the mounting holes 34, and the plurality of mounting holes 34 are arranged in an array on the pressing sheet 30. Specifically, the mold body plate 10 is provided with a plurality of threaded holes 12, and the threaded holes 12 correspond to the plurality of mounting holes 34 one by one. Here, preferably, each pressing sheet 30 is provided with six mounting holes 34. This can facilitate the installation of the threaded fasteners and further improve the uniformity of the force on the sample assembly 20.

[0057] More specifically, the sample assembly 20 is clearance-matched with the sample slot 11 , so that the sample assembly 20 can be easily placed in the sample slot 11 .

[0058] Furthermore, if Figure 1 and Figure 2 As shown, two opposite surfaces of the mold body plate 10 are provided with sample slots 11. In this way, more sample slots 11 can be provided on the mold body plate 10, so that multiple groups of sample assemblies 20 can be tested simultaneously.

[0059] Reference below Figure 1-Figure 6 The method for using the hot copper aging mold 1 for sheet-shaped semi-conductive shielding materials according to the above embodiment of the present invention includes the following steps:

[0060] S1, placing the sample assembly 20 in the sample slot 11;

[0061] S2, mounting the pressing sheet 30 on the mold main body plate 10 by means of threaded fasteners, detecting the pressure of the sample assembly 20 by means of the pressure detection device 25, and adjusting the pressure of the sample assembly 20 by tightening or loosening the threaded fasteners, so that the pressure of each sample assembly 20 is within a predetermined pressure range;

[0062] S3, placing the hot copper aging mold 1 into a heating box at a predetermined test temperature for heating to perform an aging test;

[0063] S4. After the test is completed, the hot copper aging mold 1 is taken out from the heating box, and after cooling, the threaded fasteners are disassembled and the sample assembly 20 is taken out.

[0064] According to the method for using the hot copper aging mold 1 suitable for sheet-like semi-conductive shielding materials according to the embodiment of the present invention, by utilizing the hot copper aging mold 1 suitable for sheet-like semi-conductive shielding materials according to the above embodiment of the present invention, it is possible to study the influence of pressure and wire core texture on the aging process, and it has the advantages of strong reliability, high accuracy, uniform force, etc.

[0065] Advantageously, each pressing piece 30 is installed on the mold body plate 10 by means of a plurality of threaded fasteners arranged in an array. In step S2, the threaded fasteners relatively close to the middle of the pressing piece 30 are installed first, and then the threaded fasteners relatively far from the middle of the pressing piece 30 are installed. Specifically, there may be six threaded fasteners, and during installation, the middle two in the length direction of the pressing piece 30 may be installed first, and then the remaining four may be installed. This can avoid the situation where the edges of the pressing piece 30 are over-tightened while the middle is not tightened.

[0066] Other structures and operations of the hot copper aging mold 1 and the use method of the sheet-like semi-conductive shielding material according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0067] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0068] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials, characterized in that: include: A mold main body plate, wherein a plurality of sample slots are provided on the mold main body plate; A plurality of sample assemblies, each of which is adapted to be respectively fitted in the plurality of sample slots, and each of which comprises a first protective layer, a copper sheet, a shielding material sample, a second protective layer, a pressure detection device and a flexible layer stacked in sequence in a thickness direction; A plurality of pressing plates, each of which is suitable for being detachably mounted on the mold main body plate via threaded fasteners, each of which is suitable for covering one of the sample slots and for clamping the sample assembly in the covered sample slot together with the bottom wall of the covered sample slot, the plurality of pressing plates comprising one or more first pressing plates and one or more second pressing plates, the first pressing plates having a copper wire core simulation texture on their surface facing the sample slot.

2. The hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: The thickness of the sample assembly is greater than the depth of the sample groove.

3. The hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: The first protective layer and the second protective layer are both polyimide material layers.

4. The hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: The pressure detection device is a thin film pressure sensor.

5. The hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: The flexible layer is a foamed silicone layer.

6. The hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: Each of the pressing plates is provided with a plurality of mounting holes, the threaded fasteners are fitted in the mounting holes, and the plurality of mounting holes are arranged in an array on the pressing plates.

7. The hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: The sample assembly is clearance-matched with the sample slot.

8. The hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: Sample grooves are provided on two opposite surfaces of the mold body plate.

9. A method for using a hot copper aging mold for sheet-shaped semi-conductive shielding materials according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, placing the sample assembly in the sample slot; S2, mounting the pressing sheet on the mold main body plate by means of threaded fasteners, detecting the pressure on the sample assembly by means of the pressure detection device, and adjusting the pressure on the sample assembly by tightening or loosening the threaded fasteners, so that the pressure on each sample assembly is within a predetermined pressure range; S3, placing the hot copper aging mold into a heating box at a predetermined test temperature for heating to perform an aging test; S4. After the test, the hot copper aging mold is taken out from the heating box, and after cooling, the threaded fastener is disassembled and the sample assembly is taken out.

10. The method for using the hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 9, characterized in that: Each of the pressing pieces is mounted on the mold body plate by means of a plurality of threaded fasteners arranged in an array. In step S2, the threaded fasteners relatively close to the middle of the pressing piece are first installed, and then the threaded fasteners relatively far from the middle of the pressing piece are installed.

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