Thermal copper aging mold suitable for sheet semiconductive shielding material and method of use

Abstract

The application discloses a hot copper aging mold suitable for sheet semiconductive shielding materials and a use method thereof. The hot copper aging mold suitable for sheet semiconductive shielding materials comprises a mold main plate, a plurality of sample grooves are arranged on the mold main plate; a plurality of sample assemblies, each sample assembly comprises a first protective layer, a copper sheet, a shielding material sample, a second protective layer, a pressure detection device and a flexible layer; a plurality of pressing pieces, the pressing pieces are suitable for being detachably installed on the mold main plate through threaded fasteners, the plurality of pressing pieces comprise a first pressing piece and a second pressing piece, and a copper wire core simulation texture is arranged on the surface of the first pressing piece facing the sample groove. The hot copper aging mold suitable for sheet semiconductive shielding materials according to the embodiment of the application can study the influence of pressure and wire core texture on the aging process, and has the advantages of high reliability, high accuracy, uniform stress and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of hot copper aging tests, and in particular to a hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials and a use method thereof. Background Art

[0002] Cross-linked polyethylene (XLPE) cables generate significant pollution during production and are difficult to recycle. Polypropylene (PP) is considered the most environmentally friendly insulation material with the greatest potential to replace XLPE. However, when a PP-based semi-conductive shielding layer is exposed to prolonged high temperatures and in contact with the copper cable core, copper ions can catalyze the oxidative degradation of the PP, damaging the shielding layer. Therefore, hot copper aging tests are required to assess the material's resistance to copper damage.

[0003] The hot copper aging test device in the related technology places the copper sheet and the shielding material sample between the pressing sheet and the mold, tightens the pressing sheet and the mold with screws to make the copper sheet and the sample fit tightly, and then places the device at a set experimental temperature for hot copper aging.

[0004] The hot copper aging test apparatus used in related art makes it difficult to determine the pressure applied to each specimen. Furthermore, due to varying screw tightening, it's difficult to ensure uniform pressure across each specimen, making it difficult to study the impact of pressure on the hot copper aging process. Furthermore, uneven force is easily applied to different parts of the same specimen, affecting the accuracy of the test results. Furthermore, the copper wire core, due to manufacturing processes, has surface markings. Hot copper aging test apparatus used in related art cannot simulate the impact of these markings on the hot copper aging process. Summary of the Invention

[0005] The present invention aims to address at least one of the technical problems existing in the prior art. To this end, the present invention proposes a hot copper aging mold suitable for sheet-like semi-conductive shielding materials. This mold, suitable for sheet-like semi-conductive shielding materials, is capable of studying the effects of pressure and wire core texture on the aging process and exhibits advantages such as high reliability, high accuracy, and uniform force distribution.

[0006] The present invention also provides a method for using the hot copper aging mold suitable for the sheet-shaped semi-conductive shielding material.

[0007] To achieve the above-mentioned purpose, according to an embodiment of the first aspect of the present invention, a hot copper aging mold suitable for sheet-like semi-conductive shielding materials is proposed, and the hot copper aging mold suitable for sheet-like semi-conductive shielding materials includes: a mold main body plate, a plurality of sample slots are provided on the mold main body plate; a plurality of sample assemblies, the plurality of sample assemblies are suitable for respectively fitting into the plurality of sample slots, each of the sample assemblies includes a first protective layer, a copper sheet, a shielding material sample, a second protective layer, a pressure detection device and a flexible layer stacked in sequence in the thickness direction; a plurality of pressing sheets, the pressing sheets are suitable for being detachably mounted on the mold main body plate by threaded fasteners, each of the pressing sheets is suitable for covering one of the sample slots and is suitable for clamping the sample assembly in the covered sample slot together with the bottom wall of the covered sample slot, the plurality of pressing sheets include one or more first pressing sheets and one or more second pressing sheets, and the surface of the first pressing sheet facing the sample slot is provided with a copper wire core simulation texture.

[0008] The hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to the embodiment of the present invention can study the influence of pressure and wire core texture on the aging process, and has the advantages of strong reliability, high accuracy, and uniform force.

[0009] In addition, the hot copper aging mold for sheet-shaped semi-conductive shielding materials according to the above embodiment of the present invention may also have the following additional technical features:

[0010] According to one embodiment of the present invention, the thickness of the sample assembly is greater than the depth of the sample groove.

[0011] According to an embodiment of the present invention, both the first protective layer and the second protective layer are polyimide material layers.

[0012] According to one embodiment of the present invention, the pressure detection device is a thin film pressure sensor.

[0013] According to one embodiment of the present invention, the flexible layer is a foamed silicone layer.

[0014] According to one embodiment of the present invention, each pressing plate is provided with a plurality of mounting holes, the threaded fasteners are fitted in the mounting holes, and the plurality of mounting holes are arranged in an array on the pressing plate.

[0015] According to one embodiment of the present invention, the sample assembly is loosely matched with the sample slot.

[0016] According to one embodiment of the present invention, two opposite surfaces of the mold body plate are provided with sample grooves.

[0017] According to an embodiment of the second aspect of the present invention, a method for using the hot copper aging mold for sheet-shaped semiconductive shielding materials according to the embodiment of the first aspect of the present invention is provided, comprising the following steps:

[0018] S1. placing the sample assembly in the sample tank;

[0019] S2. Mounting the pressing sheet on the mold main plate using threaded fasteners, detecting the pressure applied to the sample assembly using the pressure detection device, and adjusting the pressure applied to the sample assembly by tightening or loosening the threaded fasteners so that the pressure applied to each sample assembly is within a predetermined pressure range;

[0020] S3, placing the hot copper aging mold into a heating box at a predetermined test temperature for heating to perform an aging test;

[0021] S4. After the test is completed, the hot copper aging mold is removed from the heating box, and after cooling, the threaded fasteners are disassembled and the sample assembly is taken out.

[0022] According to the method for using the hot copper aging mold suitable for sheet-like semi-conductive shielding materials according to the embodiment of the present invention, by utilizing the hot copper aging mold suitable for sheet-like semi-conductive shielding materials described in the embodiment of the first aspect of the present invention, it is possible to study the influence of pressure and wire core texture on the aging process, and it has the advantages of strong reliability, high accuracy, and uniform force.

[0023] According to one embodiment of the present invention, each of the pressing pieces is mounted on the mold main plate by a plurality of threaded fasteners arranged in an array. In step S2, the threaded fasteners relatively close to the middle of the pressing piece are installed first, and then the threaded fasteners relatively far from the middle of the pressing piece are installed.

[0024] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0026] Figure 1 3 is a schematic structural diagram of a hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0027] Figure 2 3 is a schematic structural diagram of a mold main plate of a hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0028] Figure 3 3 is a schematic structural diagram of a first pressing sheet of a hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0029] Figure 4 3 is a schematic structural diagram of a second pressing sheet of a hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0030] Figure 5 3 is a schematic structural diagram of a sample assembly of a hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0031] Figure 6 The present invention is a flowchart of a method for using a hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention.

[0032] Figure numerals: hot copper aging mold 1 for sheet-shaped semi-conductive shielding material, mold main body plate 10, sample slot 11, threaded hole 12, sample assembly 20, first protective layer 21, copper sheet 22, shielding material sample 23, second protective layer 24, pressure detection device 25, flexible layer 26, pressing sheet 30, first pressing sheet 31, second pressing sheet 32, copper wire core simulated texture 33, mounting hole 34. DETAILED DESCRIPTION

[0033] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, features defined as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0035] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0036] The following describes a hot copper aging mold 1 applicable to sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention with reference to the accompanying drawings.

[0037] like Figure 1-Figure 5 As shown, a hot copper aging mold 1 suitable for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention includes a mold body plate 10 , a sample assembly 20 and a plurality of pressing sheets 30 .

[0038] The mold body plate 10 is provided with multiple sample slots 11. Multiple sample assemblies 20 are adapted to fit within each of the sample slots 11. Each sample assembly 20 comprises a first protective layer 21, a copper sheet 22, a shielding material sample 23, a second protective layer 24, a pressure detection device 25, and a flexible layer 26, stacked sequentially in the thickness direction. Pressing plates 30 are adapted to be removably mounted on the mold body plate 10 via threaded fasteners. Each pressing plate 30 is adapted to cover a sample slot 11 and, together with the bottom wall of the covered sample slot 11, to clamp the sample assembly 20 within the covered sample slot 11. The multiple pressing plates 30 include one or more first pressing plates 31 and one or more second pressing plates 32. The surface of the first pressing plate 31 facing the sample slot 11 is provided with a copper wire core simulated texture 33.

[0039] Specifically, when testing is required, the sample assembly 20 is placed in the sample slot 11, and the pressing piece 30 is mounted on the mold main plate 10 via threaded fasteners. The pressure applied to the sample assembly is detected by the pressure detection device. The pressure applied to the sample assembly 20 is adjusted by tightening or loosening the threaded fasteners, so that the pressure applied to each sample assembly 20 is within a predetermined pressure range. The hot copper aging mold 1 is placed in a heating box at a predetermined test temperature and heated to perform the aging test. After the test is completed, the hot copper aging mold 1 is removed from the heating box, and after cooling, the threaded fasteners are removed, and the sample assembly 20 is removed. The degree of aging of the shielding material sample 23 is observed, detected, and recorded.

[0040] The predetermined pressure range can be adjusted according to test requirements to study the effect of pressure on the aging process when used as a test variable.

[0041] It should be understood that the “bottom wall” of the sample slot 11 refers to the bottom wall in the direction of its opening. In other words, the bottom wall of the sample slot 11 is opposite to the open side of the sample slot 11 .

[0042] The flexible layer 26 can be in contact with the bottom wall of the sample slot 11. In other words, when the upper surface of the sample slot 11 is open, the first protective layer 21, the copper sheet 22, the shielding material sample 23, the second protective layer 24, the pressure detection device 25 and the flexible layer 26 are stacked in sequence from top to bottom.

[0043] The surface of the second pressing piece 32 facing the sample slot 11 may be a flat surface.

[0044] The pressure detection device 25 and the flexible layer 26 can be reused in each test process.

[0045] According to the embodiment of the present invention, the hot copper aging mold 1 suitable for sheet-like semi-conductive shielding materials can be configured with a first protective layer 21 and a second protective layer 24. The first protective layer 21 can be used to isolate the copper sheet 22 and the pressing sheet 30, and the second protective layer 24 can be used to isolate the shielding material sample 23 and the pressure detection device 25, thereby protecting the pressing sheet 30 and the pressure detection device 25, improving the reliability of the hot copper aging mold 1 suitable for sheet-like semi-conductive shielding materials, and facilitating repeated testing.

[0046] Furthermore, by providing a pressure detection device 25, the pressure detection device 25 can be used to detect the pressure on each sample assembly 20, which can facilitate the control of the pressure on each sample assembly 20. Compared with the hot copper aging test device in the related art, on the one hand, it can facilitate the pressure on each sample assembly 20 to be close, avoiding the problem of inconsistent force on the sample due to different tightening degrees of the screws, thereby improving the accuracy of the test. On the other hand, it can facilitate the use of pressure as a test variable, thereby facilitating the study of the influence of pressure on the hot copper aging process.

[0047] In addition, by providing the flexible layer 26, the flexible layer 26 can be elastically deformed when the sample assembly 20 is clamped, so that the force acts evenly on the shielding material sample 23 and the copper sheet 22, thereby improving the uniformity of the force on the shielding material sample 23 and the copper sheet 22, and further improving the accuracy of the test results.

[0048] Furthermore, by setting a first pressing plate 31 and a second pressing plate 32, a copper wire core simulation texture 33 is provided on the surface of the first pressing plate 31 facing the sample slot 11. The copper wire core simulation texture 33 can be used to simulate the concave texture on the copper wire core, so that the first pressing plate 31 and the second pressing plate 32 can be used to perform a control test with and without texture, thereby simulating the influence of the texture on the aging process of the shielding material sample 23, and restoring the actual situation of contact between the internal wire core of the cable and the shielding material layer.

[0049] Therefore, the hot copper aging mold 1 suitable for sheet-shaped semi-conductive shielding materials according to the embodiment of the present invention can study the influence of pressure and wire core texture on the aging process, and has the advantages of strong reliability, high accuracy, and uniform force.

[0050] The following describes a hot copper aging mold 1 applicable to sheet-shaped semi-conductive shielding materials according to a specific embodiment of the present invention with reference to the accompanying drawings.

[0051] In some specific embodiments of the present invention, Figure 1-Figure 5 As shown, a hot copper aging mold 1 suitable for sheet-shaped semi-conductive shielding materials according to an embodiment of the present invention includes a mold body plate 10 , a sample assembly 20 and a plurality of pressing sheets 30 .

[0052] Advantageously, the thickness of the sample assembly 20 is greater than the depth of the sample slot 11. Specifically, because the flexible layer 26 is capable of elastic deformation, the pressing piece 30 can be completely pressed into the sample slot 11 by tightening the threaded fasteners, without the difficulty of installing the threaded fasteners. This allows the pressing piece 30 and the bottom wall of the sample slot 11 to jointly compress the sample assembly 20 after the threaded fasteners are installed. This allows the copper sheet 22 and the shielding material sample 23 to withstand a certain amount of pressure, further improving the uniformity of the force applied to the copper sheet 22 and the shielding material sample 23.

[0053] Optionally, the first protective layer 21 and the second protective layer 24 are both made of polyimide material, which can make the first protective layer 21 and the second protective layer 24 have good high temperature resistance, and are not easy to deform or adhere to the shielding material sample 23.

[0054] Furthermore, the pressure detection device 25 is a thin film pressure sensor, which can facilitate the detection of the pressure on the sample assembly 20.

[0055] Furthermore, the flexible layer 26 is a foamed silicone layer, which can make the flexible layer 26 have good elastic deformation ability and improve the uniformity of the force applied to the sample assembly 20.

[0056] Specifically, if Figures 1-4 As shown, each pressing plate 30 is provided with a plurality of mounting holes 34, into which the threaded fasteners engage. The plurality of mounting holes 34 are arranged in an array on the pressing plate 30. Specifically, the mold body plate 10 is provided with a plurality of threaded holes 12, which correspond one-to-one with the plurality of mounting holes 34. Preferably, each pressing plate 30 is provided with six mounting holes 34. This facilitates the installation of the threaded fasteners and further improves the uniformity of the force applied to the specimen assembly 20.

[0057] More specifically, the sample assembly 20 is clearance-fitted with the sample slot 11 , so that the sample assembly 20 can be easily placed in the sample slot 11 .

[0058] Further, if Figure 1 and Figure 2 As shown, two opposite surfaces of the mold body plate 10 are provided with sample slots 11. In this way, more sample slots 11 can be provided on the mold body plate 10, so that multiple groups of sample assemblies 20 can be tested simultaneously.

[0059] Reference below Figures 1-6 The method for using the hot copper aging mold 1 for sheet-shaped semi-conductive shielding materials according to the above embodiment of the present invention includes the following steps:

[0060] S1, placing the sample assembly 20 in the sample tank 11;

[0061] S2. Mount the pressing sheet 30 on the mold main plate 10 using threaded fasteners, detect the pressure applied to the sample assembly 20 using the pressure detection device 25, and adjust the pressure applied to the sample assembly 20 by tightening or loosening the threaded fasteners so that the pressure applied to each sample assembly 20 is within a predetermined pressure range;

[0062] S3, placing the hot copper aging mold 1 into a heating box at a predetermined test temperature for heating to perform an aging test;

[0063] S4. After the test is completed, the hot copper aging mold 1 is taken out from the heating box, and after cooling, the threaded fasteners are disassembled and the sample assembly 20 is taken out.

[0064] According to the method for using the hot copper aging mold 1 suitable for sheet-like semi-conductive shielding materials according to the embodiment of the present invention, by utilizing the hot copper aging mold 1 suitable for sheet-like semi-conductive shielding materials according to the above-mentioned embodiment of the present invention, it is possible to study the influence of pressure and wire core texture on the aging process, and it has the advantages of strong reliability, high accuracy, and uniform force.

[0065] Advantageously, each pressing plate 30 is mounted on the mold body plate 10 using a plurality of threaded fasteners arranged in an array. In step S2, the threaded fasteners located relatively close to the center of the pressing plate 30 are installed first, followed by the threaded fasteners located relatively far from the center of the pressing plate 30. Specifically, there may be six threaded fasteners, and during installation, the two in the middle of the length of the pressing plate 30 are installed first, followed by the remaining four. This prevents the edges of the pressing plate 30 from being overly compressed while the center is not.

[0066] Other structures and operations of the hot copper aging mold 1 and the use method for sheet-shaped semi-conductive shielding materials according to the embodiment of the present invention are well known to those skilled in the art and will not be described in detail here.

[0067] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0068] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials, characterized in that: include: A mold main body plate, wherein a plurality of sample slots are provided on the mold main body plate; a plurality of sample assemblies, each of which is adapted to fit in the plurality of sample slots, each of which comprises a first protective layer, a copper sheet, a shielding material sample, a second protective layer, a pressure detection device, and a flexible layer stacked in sequence in a thickness direction; Multiple pressing plates, each of which is suitable for being detachably mounted on the mold main plate via threaded fasteners, each of which is suitable for covering one sample slot and for clamping the sample assembly in the covered sample slot together with the bottom wall of the covered sample slot, the multiple pressing plates including one or more first pressing plates and one or more second pressing plates, the surface of the first pressing plate facing the sample slot being provided with a copper wire core simulated texture.

2. The hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: The thickness of the sample assembly is greater than the depth of the sample groove.

3. The hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: The first protective layer and the second protective layer are both polyimide material layers.

4. The hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: The pressure detection device is a thin film pressure sensor.

5. The hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: The flexible layer is a foamed silicone layer.

6. The hot copper aging mold suitable for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: Each pressing plate is provided with a plurality of mounting holes, and the threaded fasteners are fitted into the mounting holes. The plurality of mounting holes are arranged in an array on the pressing plate.

7. The hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: The sample assembly is loosely matched with the sample slot.

8. The hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 1, characterized in that: Sample grooves are provided on two opposite surfaces of the mold body plate.

9. A method for using a hot copper aging mold for sheet-shaped semi-conductive shielding materials according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1. placing the sample assembly in the sample tank; S2. Mounting the pressing sheet on the mold main plate using threaded fasteners, detecting the pressure applied to the sample assembly using the pressure detection device, and adjusting the pressure applied to the sample assembly by tightening or loosening the threaded fasteners so that the pressure applied to each sample assembly is within a predetermined pressure range; S3, placing the hot copper aging mold into a heating box at a predetermined test temperature for heating to perform an aging test; S4. After the test is completed, the hot copper aging mold is removed from the heating box, and after cooling, the threaded fasteners are disassembled and the sample assembly is taken out.

10. The method for using the hot copper aging mold for sheet-shaped semi-conductive shielding materials according to claim 9, characterized in that: Each pressing piece is mounted on the mold body plate by a plurality of threaded fasteners arranged in an array. In step S2, the threaded fasteners relatively close to the middle of the pressing piece are first installed, and then the threaded fasteners relatively far from the middle of the pressing piece are installed.

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