Capacitance Testing Method, Device, Electronic Equipment and Storage Medium of Wafer

Abstract

The present invention provides a capacitance testing method, device, electronic device and storage medium for a wafer, including: before performing an empty needle capacitance test, reading the test information of the object to be tested; generating a judgment variable based on the common information in the test information; determining whether there is a corresponding empty needle capacitance value based on the judgment variable; if not, performing an empty needle test on the object to be tested according to the test information, and associating the obtained empty needle capacitance value with the judgment variable; if so, automatically obtaining the existing empty needle capacitance value. In this way, by using the test information such as the test object and test parameters as common information and determining whether there is an empty needle capacitance based on the judgment of global variables, the empty needle capacitance can be tested without repetition, the production capacity can be improved, and the production efficiency can be increased; at the same time, the number of needle lifting / needle inserting times can be greatly reduced, the life of the needle card can be improved, and the cost can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and in particular, to a method and device for testing the capacitance of a wafer, an electronic device, and a storage medium. Background Art

[0002] Capacitance is a common item in the field of wafer acceptance testing, and it is affected by the parasitic capacitance of the relevant test circuit during the testing process. Therefore, in order to obtain an accurate capacitance test value, it is necessary to weaken the interference of parasitic capacitance as much as possible.

[0003] In the prior art, subtracting the capacitance of the empty needle is a common and effective method to weaken the interference of parasitic capacitance. The capacitance of the empty needle (C0) is the capacitance value of the corresponding circuit obtained when the probe card does not contact the wafer, which is used to characterize the parasitic capacitance. After obtaining the capacitance of the empty needle, the probe card contacts the wafer, and the capacitance value of the corresponding circuit is C1. The actual capacitance (C = C1 - C0) can effectively weaken the influence of parasitic capacitance.

[0004] However, the test methods of C0 and C1 are the same, and they mainly characterize the parasitic capacitance value of the test system. In the existing test method, for each device in the wafer, the empty needle capacitance (C0) is tested by lifting the needle every time, which will cause waste of test resources and test production capacity. At the same time, a large number of needle lifting / needle inserting operations will shorten the life of the probe card. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to provide a method and device for testing the capacitance of a wafer, an electronic device, and a storage medium, so as to quickly and intelligently test the capacitance, thereby greatly improving the capacitance test efficiency.

[0006] In a first aspect, an embodiment of the present invention provides a method for testing the capacitance of a wafer, the method including: before performing the capacitance test of the empty needle, reading the test information of the object to be tested; generating a judgment variable based on the common information in the test information; the common information characterizes the same test position and test conditions relative to the same reference dimension; determining whether there is a corresponding capacitance value of the empty needle based on the judgment variable; if not, performing an empty needle test on the object to be tested according to the test information, and associating the obtained capacitance value of the empty needle with the judgment variable; if so, automatically obtaining the existing capacitance value of the empty needle.

[0007] In an optional embodiment of the present application, the above test information includes test object information and test parameters. Generating a judgment variable based on the common information in the test information includes: obtaining the test mode selected by the user, and determining the data dimension required for the common information according to the test mode; selecting the required test object information according to the data dimension required for the common information, and jointly forming the judgment variable information with the common information in the test parameters.

[0008] In an alternative embodiment of the present application, the above test modes include testing once for a batch, testing once for a wafer, and testing once for a die. The data dimensions are correspondingly set with batch dimension, wafer dimension, and die dimension. The test object information required is determined according to the data dimension and consists of at least one of batch ID, wafer ID, and die ID.

[0009] In an alternative embodiment of the present application, the determining of the test object information required, which consists of at least one of batch ID, wafer ID, and die ID according to the data dimension, includes: if the mode selected by the user corresponds to the die dimension, it is determined that the test object information includes: batch ID, wafer ID, and die ID; if the mode selected by the user corresponds to the wafer dimension, it is determined that the test object information includes: batch ID and wafer ID; if the mode selected by the user corresponds to the batch dimension, it is determined that the test object information includes: batch ID.

[0010] In an alternative embodiment of the present application, the above test parameters include the position information of the object to be tested in the die and the test conditions of the object to be tested.

[0011] In an alternative embodiment of the present application, the determining whether there is a corresponding empty needle capacitance value based on a judgment variable includes: setting the judgment variable as key, setting the return instruction $ to obtain the variable output quantification, and the return instruction $ to obtain an empty output for the quantification; based on the judgment variable, obtaining the global variable of $$key; when $$key is a null value, the global variable is the target value; when $$key is a quantification, the global variable is the value of the variable $key; determining whether to test the empty needle capacitance based on the value of the global variable; when testing the empty needle capacitance, setting $key as a variable with a value equal to the currently tested empty needle capacitance value.

[0012] In an alternative embodiment of the present application, the above target value is greater than a preset threshold; determining whether to test the empty needle capacitance based on the value of the global variable includes: if the value of the global variable is greater than the threshold, determining to test the empty needle capacitance; if the value of the global variable is less than or equal to the threshold, determining not to test the empty needle capacitance.

[0013] In a second aspect, an embodiment of the present invention further provides a capacitance testing device for a wafer. The device includes: a test information reading module, configured to read the test information of the object to be tested before performing the empty needle capacitance test, and generate a judgment variable based on the common information in the test information; the common information represents the same test position and test conditions with respect to the same reference dimension; a test judgment module, configured to determine whether there is a corresponding empty needle capacitance value based on the judgment variable; if not, perform an empty needle test on the object to be tested according to the test information and associate the tested empty needle capacitance value with the judgment variable; if so, automatically obtain the existing empty needle capacitance value.

[0014] In a third aspect, an embodiment of the present invention further provides an electronic device, including a processor and a memory. The memory stores computer-executable instructions that can be executed by the processor, and the processor executes the computer-executable instructions to implement the above-mentioned capacitance testing method for wafers.

[0015] In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium. The computer-readable storage medium stores computer-executable instructions, and when the computer-executable instructions are called and executed by a processor, the computer-executable instructions cause the processor to implement the above-mentioned capacitance testing method for wafers.

[0016] The embodiments of the present invention bring the following beneficial effects:

[0017] The embodiments of the present invention provide a capacitance testing method, device, electronic device, and storage medium for wafers. Before performing the empty needle capacitance test, the test information of the object to be tested is read; a judgment variable is generated based on the common information in the test information; the common information represents the same test position and test conditions relative to the same reference dimension; it is determined whether there is a corresponding empty needle capacitance value based on the judgment variable; if not, the object to be tested is subjected to an empty needle test according to the test information, and the obtained empty needle capacitance value is associated with the judgment variable; if so, the existing empty needle capacitance value is automatically obtained. In this way, by using the test information such as the test object and test parameters as common information, and determining whether there is an empty needle capacitance based on the judgment of global variables, the empty needle capacitance can be tested without repetition, improving production capacity and production efficiency; at the same time, the number of needle lifting / needle inserting is greatly reduced, the life of the needle card is improved, and the cost is reduced.

[0018] Other features and advantages of the present disclosure will be described in the following specification, or some features and advantages can be inferred from the specification without doubt, or can be known by implementing the above technologies of the present disclosure.

[0019] To make the above objects, features, and advantages of the present disclosure more obvious and understandable, the following specific preferred embodiments are given, and in conjunction with the accompanying drawings, the detailed description is as follows. Description of the Drawings

[0020] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0021] Figure 1 It is a flowchart of a capacitance testing method for wafers provided by an embodiment of the present invention;

[0022] Figure 2 A flowchart of another method for testing the capacitance of a wafer provided by an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of a method for testing the capacitance of a wafer provided by an embodiment of the present invention;

[0024] Figure 4 A schematic structural diagram of a device for testing the capacitance of a wafer provided by an embodiment of the present invention;

[0025] Figure 5 A schematic structural diagram of an electronic device provided by an embodiment of the present invention. Detailed implementation manners

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0027] Currently, in the prior art when testing the capacitance of a wafer, for each test of each test object (device), the needle needs to be lifted to test the capacitance of the empty needle. However, lifting the needle multiple times will cause waste of production capacity and test resources. At the same time, a large number of needle lifting and needle inserting operations will shorten the life of the probe card.

[0028] Based on this, a method, device, electronic device, and storage medium for testing the capacitance of a wafer provided by an embodiment of the present invention specifically provide a method for quickly testing capacitance applied to the field of wafer electrical property testing. It can intelligently allocate data to corresponding test objects without repeatedly testing the capacitance of the empty needle, thereby effectively reducing the influence of parasitic capacitance, quickly and intelligently testing capacitance, greatly improving the capacitance testing efficiency, and at the same time eliminating the need for manual operation.

[0029] To facilitate the understanding of this embodiment, first, a method for testing the capacitance of a wafer disclosed in an embodiment of the present invention will be introduced in detail.

[0030] Embodiment 1:

[0031] An embodiment of the present invention provides a method for testing the capacitance of a wafer. Refer to Figure 1 the flowchart of a method for testing the capacitance of a wafer as shown, and this method for testing the capacitance of a wafer includes the following steps:

[0032] Step S102, before performing the empty needle capacitance test, read the test information of the object to be tested; generate a judgment variable based on the common information in the test information; the common information represents the same test position and test conditions relative to the same reference dimension.

[0033] In this embodiment, before performing the electrical test / empty needle capacitance test, the test information of the object to be tested can be read; the test information may include the test object information and test parameters, integrate the read test information and assign it to the judgment variable (i.e., variable key). Among them, the variable key can be assigned a string related to the test information.

[0034] Step S104, determine whether there is a corresponding empty needle capacitance value based on the judgment variable; if not, perform an empty needle test on the object to be tested according to the test information, and associate the obtained empty needle capacitance value with the judgment variable; if it exists, automatically obtain the existing empty needle capacitance value.

[0035] In this embodiment, the common information can be determined according to the test requirements and / or the implementation conditions of the test software and hardware; for example: for relatively the same test position and test conditions, it can be considered that the values of the empty needle capacitance are the same or common, then the common information can be composed of parameters related to the test position and test conditions. Relatively having the same test position can be relatively having the same test coordinates or test object, for example: the same device under the same module of different wafers / dies in the same lot, or the same module under different wafers / dies in the same lot.

[0036] In this embodiment, the global variable can be determined based on the variable key. Among them, the global variable of $$key can be obtained by using an instruction (a variable that can be used by different test items before the entire software is closed). The above $key can refer to the string related to the test information in the previous step.

[0037] If there is no empty needle capacitance value associated with $key, then $key is still the string related to the test information, and the obtained global variable result can be a preset target value. For example, a numerical value X2 greater than 10 30 can be used as the target value.

[0038] If there is an empty needle capacitance value associated with $key, that is, the empty needle capacitance of the device to be tested at the same position has been measured on other dies before, then $key is associated with the empty needle capacitance value, that is, the string information is associated with the empty needle capacitance value. Specifically, by setting $key to a variable with a value equal to the empty needle capacitance value, the obtained global variable result can be the above empty needle capacitance value, and the above empty needle capacitance value is assigned to the global variable.

[0039] In this embodiment, it is possible to determine whether to test the empty needle capacitance by judging the value of the global variable. If the empty needle capacitance is to be tested, the connection is made without contacting the needle card for testing, and the test value of the empty needle capacitance is assigned to the global variable; if the empty needle capacitance is not to be tested, the test result of the empty needle capacitance is automatically obtained.

[0040] An embodiment of the present invention provides a method for testing the capacitance of a wafer. Before performing the empty needle capacitance test, the test information of the object to be tested is read; a judgment variable is generated based on the common information in the test information; the common information represents the same test position and test conditions relative to the same reference dimension; based on the judgment variable, it is determined whether there is a corresponding empty needle capacitance value; if not, the empty needle test is performed on the object to be tested according to the test information, and the obtained empty needle capacitance value is associated with the judgment variable; if so, the existing empty needle capacitance value is automatically obtained. In this way, by using the test information such as the test object and test parameters as the common information and determining whether there is an empty needle capacitance based on the judgment of the global variable, the empty needle capacitance can be tested without repetition, improving production capacity and production efficiency; at the same time, the number of needle lifting / needle insertion is greatly reduced, the life of the needle card is increased, and the cost is reduced.

[0041] Embodiment Two:

[0042] This embodiment provides another method for testing the capacitance of a wafer, which is implemented on the basis of the above embodiment. Refer to Figure 2 the flowchart of another method for testing the capacitance of a wafer shown in

[0043] Step S202, before performing the empty needle capacitance test, read the test information of the object to be tested, where the test information includes the test object information and test parameters; obtain the test mode selected by the user, and determine the data dimension required for the common information according to the test mode; select the required test object information according to the data dimension required for the common information, and jointly form a judgment variable with the common information in the test parameters.

[0044] In some embodiments, the above test modes include testing once for a batch, testing once for a wafer, and testing once for a die. The data dimensions are correspondingly set with a batch dimension, a wafer dimension, and a die dimension. The required test object information is determined to be composed of at least one of the batch ID, wafer ID, and die ID according to the data dimension.

[0045] Among them, testing once for a die means that the devices to be tested with the same common information in each die only need to be tested once, specifically referring to separately testing the empty needle capacitance for each die on a wafer; for example, each die has multiple modules, and the devices to be tested are located on the modules:

[0046] If the empty-pin capacitance of the devices under test on the same module of a single die is set to be the same, then under the same test conditions, the empty-pin capacitance of multiple devices under test on the entire module only needs to be measured once, and the subsequent devices under test can directly use this empty-pin capacitance;

[0047] If the capacitance empty-pin values of the devices under test in a single die are set to be all different, then the empty-pin capacitance of each device under test on the single die needs to be measured separately.

[0048] Among them, measuring once for one wafer means measuring the empty-pin capacitance of multiple dies under each wafer. For the devices under test with the same common information, it only needs to be measured once, specifically referring to only measuring the empty-pin capacitance once for one wafer; for example, each die has multiple modules, and the devices under test are located on the modules:

[0049] If the empty-pin capacitance of the same device under test on the same module of different dies is set to be the same, then under the same test conditions, it only needs to measure the corresponding empty-pin capacitance on one die, and the subsequent devices under test at the same position on other dies can directly use this empty-pin capacitance.

[0050] Among them, measuring once for one batch means measuring the empty-pin capacitance of multiple wafers in one batch. For the devices under test with the same common information, it only needs to be measured once, specifically referring to only measuring the empty-pin capacitance once for multiple wafers in one batch; for example, each die has multiple modules, and the devices under test are located on the modules:

[0051] If the empty-pin capacitance of the same device under test on the same module of different dies is set to be the same, then under the same test conditions, it only needs to measure the corresponding empty-pin capacitance on one die, and the subsequent devices under test at the same position on other dies can directly use this empty-pin capacitance.

[0052] In some embodiments, if the selected mode by the user corresponds to the die dimension, the determined test object information includes: batch ID, wafer ID, and die ID. According to the difference in die ID, separate measurement of the empty-pin capacitance for different dies can be achieved; if the selected mode by the user corresponds to the wafer dimension, the determined test object information includes: batch ID and wafer ID; if the selected mode by the user corresponds to the batch dimension, the determined test object information includes: batch ID.

[0053] In some embodiments, the above test parameters include the position information of the object under test in the die and the test conditions of the object under test.

[0054] The test object information in this embodiment may include: the name of the batch (lot ID), the name of the wafer (wafer ID), or the name of the die (die ID), and the test parameters include test input information (such as the Pad number of the device under test, voltage value).

[0055] In this embodiment, the user can select a die, a wafer, or a lot as the mode for measuring the empty needle capacitance once.

[0056] See Figure 3 the schematic diagram of a method for testing the capacitance of a wafer shown. The user can select the mode. If the user selects the mode in the die dimension (i.e., Figure 3 mode 0 in it), it means that each die needs to be tested. If the user selects the mode in the wafer dimension (i.e., Figure 3 mode 1 in it), it means that each wafer only needs to be tested once. For example, if there are multiple test objects with the same position, then after completing the empty needle capacitance test of the first test object, the subsequent test objects do not need to be tested again. If the user selects the mode in the lot dimension (i.e., Figure 3 mode 3 in it), it means that a lot (which can include 1 - 25 wafers) only needs to be tested once. For example, after completing the empty needle capacitance test of the test object (device under test) in a certain die of the first wafer, the subsequent test objects with the same position relative to the die do not need to be tested again.

[0057] In this embodiment, the composition of the test object information can be determined based on the selected mode. Specifically, if the user selects the mode in the die dimension, the test object information includes lot ID, wafer ID, and die ID; if the user selects the mode in the wafer dimension, the test object information includes lot ID and wafer ID; if the user selects the mode in the lot dimension, the test object information includes lot ID.

[0058] As Figure 3 shown, in this embodiment, a string related to the test information can be assigned to the variable key. For example, the variable key in this embodiment can be key = [lot ID, wafer ID, die XY, test parameters], where die XY can be the coordinates of the die relative to the wafer.

[0059] Step S204: Determine whether there is a corresponding empty needle capacitance value based on the judgment variable; if not, perform an empty needle test on the object to be tested according to the test information, and associate the obtained empty needle capacitance value with the judgment variable; if it exists, automatically obtain the existing empty needle capacitance value.

[0060] In some embodiments, the judgment variable can be set as key, and the return instruction $ is set to obtain the variable output quantity, and the return instruction $ obtains an empty output quantity; based on the judgment variable, the global variable of $$key is obtained; when $$key is a null value, the global variable is the target value; when $$key is a quantity, the global variable is the value of the variable $key; whether to test the empty needle capacitance is determined based on the value of the global variable; when testing the empty needle capacitance, $key is set to a variable with a value equal to the currently measured empty needle capacitance value.

[0061] As Figure 3 shown, if there is no empty needle capacitance value associated with the variable key, the target value X2 can be assigned to Var1. If there is an empty needle capacitance value C0_tmp associated with the variable key, the obtained global variable result can be C0_tmp, and C0_tmp is assigned to Var1.

[0062] In some embodiments, if the value of the global variable is greater than the threshold, it is determined to test the empty needle capacitance; if the value of the global variable is less than or equal to the threshold, it is determined not to test the empty needle capacitance.

[0063] Among them, the target value is greater than a preset threshold. For example, in this embodiment, a value X2 greater than the preset threshold 1e 30 can be used as the target value. As Figure 3 shown, in this embodiment, a judgment can be made on whether to test the empty needle capacitance. If Var1>1e 30 , a loop can be entered, that is, the empty needle capacitance is tested.

[0064] Among them, after determining to test the empty needle capacitance, the wafer can also be controlled to descend to separate from the probe, and the current empty needle capacitance value is tested; the current empty needle capacitance value is associated with the variable, and the current empty needle capacitance value is placed into the empty needle array as the test result.

[0065] As Figure 3 shown, the wafer is controlled to descend (separate from the probe), the current empty needle capacitance value is tested, and then $key is set to a variable with a value equal to the current empty needle capacitance value C0_tmp. At this time, it is equivalent to changing the aforementioned string into a variable with a value of the empty needle capacitance, and C0_tmp is placed into the empty needle array C0.

[0066] As Figure 3 shown, if Var1≤1e 30 , that is, there is already an available empty needle capacitance, it can be determined not to test the empty needle capacitance.

[0067] Among them, after determining not to test the empty needle capacitance, the value of the global variable can also be placed into the empty needle array as the test result.

[0068] As Figure 3 shown, the obtained global variable result is C0_tmp, and if Var1 is C0_tmp, then directly put the value of Var1 into the empty needle array C0.

[0069] In the setting at the wafer level, a wafer includes multiple dies (bare chips), a die contains multiple modules, and a module includes multiple devices under test. When performing a capacitance test on the second device (device under test) in the same module of a die, due to different input conditions for different parameters, the variable key is different. Therefore, for the first capacitance test of different devices, the entire process will be experienced, and the empty needle capacitance will be tested separately once.

[0070] For the same module and the same device (referring to the same relative position with respect to the die, by setting different mode values (such as Figure 3 0, 1, 2 in it respectively correspond to measuring the empty needle once for a die, a wafer, and a lot)), it is possible to share a key value for the same device in the same die, wafer, and lot. After the first capacitance test of this device, $key will be associated with the empty needle capacitance value C0_tmp. Therefore, the obtained global variable is C0_tmp, that is, Var1 is equal to C0_tmp. At this time, it is determined not to test the empty needle capacitance, and directly put the value of Var1 into the empty needle array C0, without the need to perform the wafer_down test again, thereby realizing that the empty needle capacitance C0 of the same device in different lots / wafers / dies in the same module is only measured once.

[0071] For the devices under test (test objects) at the same relative positions on different dies, the corresponding empty needle capacitances are basically the same. In the prior art, if there are devices under test at the same positions on two dies, the empty needle capacitance tests need to be performed on both.

[0072] The above method provided by the embodiments of the present invention integrates the relevant information of the devices under test to form a global variable, and determines whether there is an available empty needle capacitance for the current device under test according to the information of the current device under test and the global variable. If there is, directly obtain it to avoid repeated testing. On the basis of not repeatedly testing the empty needle capacitance, intelligently allocate data to the corresponding test objects, thereby effectively reducing the influence of parasitic capacitance, quickly and intelligently testing capacitance, greatly improving the capacitance test efficiency, and at the same time not requiring manual operation, thus improving the test efficiency.

[0073] Embodiment 3:

[0074] Corresponding to the above method embodiments, an embodiment of the present invention provides a capacitance testing device for a wafer. Refer to Figure 4 the structural schematic diagram of a capacitance testing device for a wafer shown in

[0075] a test information reading module 41, configured to read the test information of the object to be tested before performing the empty needle capacitance test; generate a judgment variable based on the common information in the test information; the common information represents the same test position and test conditions relative to the same reference dimension;

[0076] a test judgment module 42, configured to determine whether there is a corresponding empty needle capacitance value based on the judgment variable; if not, perform an empty needle test on the object to be tested according to the test information, and associate the obtained empty needle capacitance value with the judgment variable; if so, automatically obtain the existing empty needle capacitance value.

[0077] An embodiment of the present invention provides a capacitance testing device for a wafer, which reads the test information of the object to be tested before performing the empty needle capacitance test; generates a judgment variable based on the common information in the test information; the common information represents the same test position and test conditions relative to the same reference dimension; determines whether there is a corresponding empty needle capacitance value based on the judgment variable; if not, performs an empty needle test on the object to be tested according to the test information, and associates the obtained empty needle capacitance value with the judgment variable; if so, automatically obtains the existing empty needle capacitance value. By using the test information such as the test object and test parameters as the common information, and determining whether there is an empty needle capacitance based on the judgment of global variables, the empty needle capacitance can be tested without repetition, the production capacity can be improved, and the production efficiency can be increased; at the same time, the number of needle lifting / needle inserting times can be greatly reduced, the life of the needle card can be improved, and the cost can be reduced.

[0078] The above test information includes test object information and test parameters. The above test information reading module is configured to obtain the selected test mode of the user, determine the data dimension required for the common information according to the test mode; select the required test object information according to the data dimension required for the common information, and jointly form a judgment variable with the common information in the test parameters.

[0079] The above test modes include testing once for a batch, testing once for a wafer, and testing once for a die. The data dimensions are correspondingly set with a batch dimension, a wafer dimension, and a die dimension. The required test object information is determined to be composed of at least one of the batch ID, wafer ID, and die ID according to the data dimension.

[0080] The above-mentioned test information reading module is used to determine the test object information including batch ID, wafer ID, and die ID if the mode selected by the user corresponds to the die dimension; to determine the test object information including batch ID and wafer ID if the mode selected by the user corresponds to the wafer dimension; and to determine the test object information including batch ID if the mode selected by the user corresponds to the batch dimension.

[0081] The above-mentioned test parameters include the position information of the object to be tested in the die and the test conditions of the object to be tested.

[0082] The above-mentioned test judgment module is used to set the judgment variable as key, set the return instruction $ to obtain the variable output quantification, and the return instruction $ to obtain an empty output for the quantification; based on the judgment variable, obtain the global variable of $$key; when $$key is a null value, the global variable is the target value; when $$key is a quantification, the global variable is the value of the variable $key; determine whether to test the empty needle capacitance based on the value of the global variable; when testing the empty needle capacitance, set $key to a variable with a value equal to the empty needle capacitance value obtained from the current test.

[0083] The above-mentioned target value is greater than a preset threshold; the above-mentioned test judgment module is used to determine to test the empty needle capacitance if the value of the global variable is greater than the threshold; and to determine not to test the empty needle capacitance if the value of the global variable is less than or equal to the threshold.

[0084] Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the above-described capacitance testing device for wafers can refer to the corresponding process in the embodiments of the foregoing capacitance testing method for wafers, and will not be elaborated herein.

[0085] Embodiment 4:

[0086] The embodiment of the present invention also provides an electronic device for running the above-mentioned capacitance testing method for wafers; see Figure 5 The structural schematic diagram of an electronic device shown. The electronic device includes a memory 100 and a processor 101. Among them, the memory 100 is used to store one or more computer instructions, and the one or more computer instructions are executed by the processor 101 to implement the above-mentioned capacitance testing method for wafers.

[0087] Furthermore, Figure 5 The electronic device shown also includes a bus 102 and a communication interface 103, and the processor 101, the communication interface 103, and the memory 100 are connected through the bus 102.

[0088] Among them, the memory 100 may include high-speed random access memory (RAM), and may also include non-volatile memory, such as at least one disk memory. The communication connection between this system network element and at least one other network element is implemented through at least one communication interface 103 (which can be wired or wireless), and the Internet, wide area network, local area network, metropolitan area network, etc. can be used. The bus 102 can be an ISA bus, a PCI bus, an EISA bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 5 only a bidirectional arrow is used in Figure 5 , but it does not mean that there is only one bus or one type of bus.

[0089] The processor 101 may be an integrated circuit chip with signal processing capabilities. In the implementation process, the steps of the above method can be completed by the integrated logic circuit in hardware or instructions in software form in the processor 101. The above-mentioned processor 101 can be a general-purpose processor, including a central processing unit (CPU for short), a network processor (NP for short), etc.; it can also be a digital signal processor (DSP for short), an application specific integrated circuit (ASIC for short), a field programmable gate array (FPGA for short), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. It can implement or execute the various methods, steps and logic block diagrams disclosed in the embodiments of the present invention. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc. The steps of the method disclosed in combination with the embodiments of the present invention can be directly embodied as being executed and completed by a hardware decoding processor, or executed and completed by a combination of hardware and software modules in the decoding processor. The software module can be located in a mature storage medium in the art such as random access memory, flash memory, read-only memory, programmable read-only memory, or electrically erasable programmable memory, register, etc. This storage medium is located in the memory 100, and the processor 101 reads the information in the memory 100 and combines its hardware to complete the steps of the method in the foregoing embodiments.

[0090] An embodiment of the present invention further provides a computer-readable storage medium storing computer-executable instructions, which, when called and executed by a processor, cause the processor to implement the above-mentioned capacitance testing method for a wafer. For specific implementation, reference may be made to the method embodiment, which will not be elaborated herein.

[0091] A computer program product of the capacitance testing method, device, electronic device, and storage medium for a wafer provided by an embodiment of the present invention includes a computer-readable storage medium storing program code, and the instructions included in the program code can be used to execute the method in the foregoing method embodiment. For specific implementation, reference may be made to the method embodiment, which will not be elaborated herein.

[0092] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described system and / or device can refer to the corresponding processes in the foregoing method embodiment, which will not be elaborated herein.

[0093] In addition, in the description of the embodiments of the present invention, unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0094] If a function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art or a part of this technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods in the various embodiments of the present invention. The foregoing storage medium includes: various media such as a USB flash drive, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk, or an optical disc that can store program code.

[0095] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0096] Finally, it should be noted that the above embodiments are only specific embodiments of the present invention, used to illustrate the technical solutions of the present invention, rather than limiting it. The protection scope of the present invention is not limited thereto. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that any person skilled in the technical field of the present invention can still modify the technical solutions described in the foregoing embodiments, or can easily conceive of changes, or make equivalent replacements for some of the technical features; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A method for capacitance testing of a wafer, characterized in that, The method includes: Before performing the empty needle capacitance test, reading the test information of the object to be tested; generating a judgment variable based on the common information in the test information; the common information represents the same test position and test conditions relative to the same reference dimension; Determining whether there is a corresponding empty needle capacitance value based on the judgment variable; if not, performing an empty needle test on the object to be tested according to the test information, and associating the obtained empty needle capacitance value with the judgment variable; if so, automatically obtaining the existing empty needle capacitance value; The test information includes test object information and test parameters. Generating a judgment variable based on the common information in the test information includes: obtaining the test mode selected by the user, determining the data dimension required for the common information according to the test mode; selecting the required test object information according to the data dimension required for the common information, and jointly forming a judgment variable with the common information in the test parameters; wherein, the data dimension is correspondingly set with a batch dimension, a wafer dimension, and a die dimension; Determining whether there is a corresponding empty needle capacitance value based on the judgment variable includes: setting the judgment variable as key, setting the return instruction $ to obtain the variable output quantity, and the return instruction $ to obtain the quantitative output as empty; based on the judgment variable, obtaining the global variable of $$key; when $$key is a null value, the global variable is the target value; when $$key is a quantity, the global variable is the value of the variable $key; determining whether to test the empty needle capacitance based on the value of the global variable; when testing the empty needle capacitance, setting $key as a variable with a value equal to the currently obtained empty needle capacitance value; wherein, $key is a string related to the test information; The target value is greater than a preset threshold. Determining whether to test the empty needle capacitance based on the value of the global variable includes: if the value of the global variable is greater than the threshold, determining to test the empty needle capacitance; if the value of the global variable is less than or equal to the threshold, determining not to test the empty needle capacitance.

2. The method according to claim 1, wherein The test mode includes testing once for each batch, testing once for each wafer, and testing once for each die. Determine the required test object information composed of at least one of the batch ID, wafer ID, and die ID according to the data dimension.

3. The method according to claim 2, characterized in that, Determining the required test object information composed of at least one of the batch ID, wafer ID, and die ID according to the data dimension includes: If the mode selected by the user corresponds to the die dimension, determining that the test object information includes: batch ID, wafer ID, and die ID; If the mode selected by the user corresponds to the wafer dimension, determining that the test object information includes: batch ID and wafer ID; If the mode selected by the user corresponds to the batch dimension, determining that the test object information includes: batch ID.

4. The method according to claim 2, characterized in that, The test parameters include the position information of the object to be tested in the die and the test conditions of the object to be tested.

5. A capacitance testing device for a wafer, characterized in that, The device includes: A test information reading module, which is used to read the test information of the object to be tested before performing the empty needle capacitance test; generate a judgment variable based on the common information in the test information; the common information represents the same test position and test conditions relative to the same reference dimension. A test judgment module, which is used to determine whether there is a corresponding empty needle capacitance value based on the judgment variable; if not, perform an empty needle test on the object to be tested according to the test information, and associate the obtained empty needle capacitance value with the judgment variable; if so, automatically obtain the existing empty needle capacitance value. The test information includes test object information and test parameters. The test information reading module is used to obtain the selected test mode by the user, determine the data dimension required for the common information according to the test mode; select the required test object information according to the data dimension required for the common information, and jointly form a judgment variable with the common information in the test parameters; wherein, the data dimension is correspondingly set with a batch dimension, a wafer dimension, and a die dimension. The test judgment module is used to set the judgment variable as key, set the return instruction $ to obtain the variable output quantification, and the return instruction $ to obtain the quantification output as empty; based on the judgment variable, obtain the global variable of $$key; when $$key is a null value, the global variable is the target value; when $$key is a quantification, the global variable is the value of the variable $key; determine whether to test the empty needle capacitance based on the value of the global variable; when testing the empty needle capacitance, set $key as a variable with a value equal to the currently obtained empty needle capacitance value; where $key is a string related to the test information. The target value is greater than a preset threshold; the test judgment module is used to determine to test the empty needle capacitance if the value of the global variable is greater than the threshold; determine not to test the empty needle capacitance if the value of the global variable is less than or equal to the threshold.

6. An electronic device, characterized in that, It includes a processor and a memory. The memory stores computer executable instructions that can be executed by the processor. The processor executes the computer executable instructions to implement the capacitance test method for the wafer according to any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer executable instructions. When the computer executable instructions are called and executed by the processor, the computer executable instructions cause the processor to implement the capacitance test method for the wafer according to any one of claims 1 to 4.

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