A material handling platform for a lithography machine

Abstract

The present invention discloses a material taking platform for a lithography machine, which relates to the technical field of lithography machines and includes a material moving seat and a lead screw slide table capable of controlling the material moving seat to move along a straight path. Above the material moving seat, a mask carrier plate and a silicon wafer carrier plate are arranged in parallel distribution. When the material moving seat slides to the material taking position, the mask carrier plate and the silicon wafer carrier plate can rotate in opposite directions to both sides of the material moving seat. On both sides of the material moving seat, a material taking seat one and a material taking seat two capable of ascending and descending movements are respectively arranged. As the material taking seat one and the material taking seat two ascend, the mask and the silicon wafer can be respectively ejected above the mask carrier plate and the silicon wafer carrier plate. When the mask carrier plate and the silicon wafer carrier plate in the present invention are at the material taking station, they can rotate in opposite directions to both sides of the material moving seat, so that the mask and the silicon wafer are fully exposed, and at the same time, the material taking and loading operations are performed on the mask carrier plate and the silicon wafer carrier plate, reducing the obstacles in the material taking and loading operation processes and improving the efficiency of the material changing operation.

Description

Technical Field

[0001] The present invention relates to the technical field of lithography machines, and particularly to a material taking platform for a lithography machine. Background Art

[0002] A lithography machine, also known as a mask aligning and exposing machine, an exposure system, a lithography system, etc., is a key device for manufacturing microelectromechanical, optoelectronic, and diode large-scale integrated circuits. Lithography machines can be divided into step projection lithography machines and scanning projection lithography machines. The main performance indicators include: the size range of supported substrates, resolution, alignment accuracy, exposure method, light source wavelength, light intensity uniformity, production efficiency, etc. In the actual operation of a lithography machine, the lithography machine needs to dynamically adjust the position of the wafer through a precise focusing and alignment system to ensure that it is within the focusing range of the optical system. For example, in a step-scanning lithography machine, the movement of the mask plate and the wafer needs to be synchronously controlled during dynamic scanning, and the distance between the two needs to be kept stable to avoid imaging errors.

[0003] In the existing lithography machines, during the processing process, the stage carrying the mask plate and the stage carrying the silicon wafer are mostly arranged in parallel. During the material changing operation, if it is necessary to perform the material changing operation on the mask plate and the silicon wafer simultaneously, it is necessary to manually move out the stage carrying the mask plate, and then separately perform the manual material taking and feeding operations on the silicon wafer stage and the mask plate stage in sequence. After the material changing operation is completed, the mask plate stage is then operated to reset so that the mask plate on the mask station is aligned with the silicon wafer on the silicon wafer station. During this process, the working efficiency of successively performing the material taking and changing operations on the two stations is relatively low, the time consumed by manual operation is relatively long, and it is easier to cause damage to the material due to errors during the manual material taking and feeding process. Therefore, the present invention provides a material taking platform for a lithography machine to meet the requirements. Summary of the Invention

[0004] In view of the above problems, the present invention provides a material taking platform for a lithography machine.

[0005] To achieve the above object, the present invention provides the following technical solution: A material taking platform for a lithography machine includes a material moving base and a lead screw slide table capable of controlling the material moving base to move along a straight path. Above the material moving base, there are a mask plate carrier and a silicon wafer carrier arranged in parallel. When the material moving base slides to the material taking position, the mask plate carrier and the silicon wafer carrier can rotate in opposite directions to both sides of the material moving base.

[0006] On both sides of the material moving base, there are respectively a material taking seat one and a material taking seat two capable of ascending and descending movements. As the material taking seat one and the material taking seat two ascend, the mask plate and the silicon wafer can be respectively ejected above the mask plate carrier and the silicon wafer carrier.

[0007] One end of the lead screw slide is provided with an intercepting seat, and on one side of the intercepting seat close to the material transfer seat, there are two limiting support seats symmetrically distributed along a straight path. When the mask plate carrier and the silicon wafer carrier slide with the material transfer seat to the processing position, both the mask plate carrier and the silicon wafer carrier slide into the inner side of the limiting support seats.

[0008] Furthermore, a first connecting seat and a second connecting seat are respectively fixed at the bottoms of the mask plate carrier and the silicon wafer carrier. The first connecting seat is fixedly installed with a co-rotating wheel, and the co-rotating wheel is connected by a synchronous scale belt to a driving wheel parallel to it.

[0009] The second connecting seat is fixedly installed with a reverse gear, and the reverse gear is meshed and connected with a driving gear parallel to it. The driving wheel and the driving gear are distributed from top to bottom and are connected by the same driving shaft. A motor capable of controlling its rotation is provided at the bottom end of the driving shaft. When the driving wheel and the driving gear rotate in the same direction, the co-rotating wheel and the reverse gear rotate in opposite directions.

[0010] Furthermore, a support frame is fixed on the material transfer seat, and the driving wheel and the driving gear are installed inside the support frame through the driving shaft. The co-rotating wheel and the reverse gear are respectively installed inside the support frame from top to bottom through rotating shafts.

[0011] Furthermore, a first guiding arm and a second guiding arm are respectively provided at the bottoms of the first material taking seat and the second material taking seat. Tooth teeth arranged vertically are provided on one side of the first guiding arm and the second guiding arm. The tooth teeth on both sides of the material transfer seat are meshed and connected with synchronous gears.

[0012] Furthermore, the two synchronous gears on both sides of the material transfer seat are connected by the same linkage shaft. The linkage shaft is rotationally installed on the material transfer seat through a bearing seat, and the linkage shaft passes under the silicon wafer carrier. A motor capable of controlling the rotation of the linkage shaft and the synchronous gears is fixedly installed on one side of the material transfer seat.

[0013] Furthermore, limiting seats are provided on both sides of the material transfer seat, and the first guiding arm and the second guiding arm are both slidably installed with the limiting seats.

[0014] Furthermore, a partition plate distributed along a straight path is fixed at the central position inside the limiting support seat. Pressing plates are provided above and below the partition plate. The pressing plates distributed from top to bottom are connected by a plurality of connecting rods penetrating the partition plate. Two pressure springs distributed from top to bottom are provided outside each connecting rod. One end of the pressure spring is fixed to the partition plate, and the other end is fixed to the pressing plate.

[0015] Pressing rollers distributed along a straight path are fixed on the plate surfaces of the pressing plates far from the partition plate. When the mask plate carrier and the silicon wafer carrier both slide into the inner side of the limiting support seats, the two groups of pressing rollers are respectively abutted against the mask plate carrier and the silicon wafer carrier.

[0016] Furthermore, two groups of limiting rollers are arranged on the inner side walls of the limiting brackets in a distribution from top to bottom. When the mask plate carrier and the silicon wafer carrier both slide into the inside of the limiting brackets, the two groups of limiting rollers respectively abut against the edges of the mask plate carrier and the silicon wafer carrier.

[0017] Furthermore, two guiding frames symmetrically distributed along a straight path are arranged on one side of the intercepting seat facing the material moving seat. Two groups of guiding rollers are arranged inside the guiding frames in a distribution from top to bottom. A receiving cavity for accommodating the guiding frames and the guiding rollers is formed on the material moving seat. When the material moving seat slides to the processing position, the receiving cavity is slidably butted against the guiding frames and the guiding rollers.

[0018] In summary, the technical effects and advantages of the present invention are as follows:

[0019] 1. When the mask plate carrier and the silicon wafer carrier in the present invention are at the material taking station, they can be rotated in opposite directions to both sides of the material moving seat, so that the mask plate and the silicon wafer are fully exposed. At the same time, the operations of taking and loading the mask plate carrier and the silicon wafer carrier are implemented, reducing the obstacles in the processes of taking and loading materials and improving the efficiency of the material changing operation.

[0020] 2. Through the arrangement of the first material taking seat and the second material taking seat at the material taking station in the present invention, the mask plate and the silicon wafer can be quickly separated from the mask plate carrier and the silicon wafer carrier, reducing the frictional damage to the carrier table generated during the process of manually taking the mask plate and the silicon wafer. While protecting the mask plate and the silicon wafer, the portability in the material taking operation process is improved, which is beneficial to implementing the operations of manually taking and placing materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0022] Figure 1 It is a three-dimensional structure schematic diagram of the present invention.

[0023] Figure 2 It is a second-angle structure schematic diagram of the present invention.

[0024] Figure 3 It is a structure schematic diagram of the mask plate carrier and the silicon wafer carrier of the present invention in the material taking state.

[0025] Figure 4 It is a second-angle structure schematic diagram of the mask plate carrier and the silicon wafer carrier of the present invention in the material taking state.

[0026] Figure 5It is a schematic diagram of the structure of the material taking seat of the present invention.

[0027] Figure 6 This is a schematic diagram of the state when the material taking seat of the present invention moves to the processing position.

[0028] Figure 7 It is a schematic diagram of the positions of the limiting bracket and the guide frame of the present invention.

[0029] Figure 8 For the present invention Figure 7 Enlarged structural diagram at A in the middle.

[0030] Figure 9 It is a schematic diagram of the local state when the mask carrier and the silicon wafer carrier of the present invention slide into the interior of the limiting bracket.

[0031] Figure 10 For the present invention Figure 9 Enlarged structural diagram at B in the middle.

[0032] In the figure: 1. Screw slide; 2. Material transfer seat; 3. Mask carrier; 31. Connecting seat 1; 32. Material pick-up seat 1; 33. Guide arm 1; 4. Wafer carrier; 41. Connecting seat 2; 42. Material pick-up seat 2; 43. Guide arm 2; 5. Same direction wheel; 6. Reverse gear; 7. Driving wheel; 8. Synchronous scale belt; 9. Driving gear; 10. Support frame; 11. Synchronous gear; 12. Linkage shaft; 13. Limit seat; 14. Intercepting seat; 15. Guide frame; 16. Guide roller; 17. Limit bracket; 18. Partition plate; 19. Pressure plate; 20. Connecting rod; 21. Pressure spring; 22. Pressure roller; 23. Limit roller. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Example 1: Reference Figure 1 , Figure 2 The material retrieving platform of a photolithography machine shown in the figure comprises a material transfer seat 2 and a screw slide 1 which can control the material transfer seat 2 to move along a straight path. A mask carrier 3 and a silicon wafer carrier 4 are arranged above the material transfer seat 2 in parallel. In the present invention, the movement starting end of the material transfer seat 2 located on the screw slide 1 is directly opposite to the material retrieving station, and the movement end is directly opposite to the processing station of the photolithography machine. When the mask carrier 3 and the silicon wafer carrier 4 are synchronously moved to the processing station, the photolithography processing operation can be performed on the mask carrier 3 and the silicon wafer carrier 4. See Figure 3 ,Figure 4 As shown, after processing is completed, the mask carrier plate 3 and the wafer carrier plate 4 move to the material taking station along with the material transfer seat 2. At this time, the mask carrier plate 3 and the wafer carrier plate 4 can rotate in opposite directions to both sides of the material transfer seat 2.

[0035] When the mask carrier plate 3 and the wafer carrier plate 4 rotate in opposite directions to both sides of the material transfer seat 2, the masks and wafers inside the mask carrier plate 3 and the wafer carrier plate 4 can be fully exposed. Furthermore, the material taking and loading operations can be simultaneously performed on the mask carrier plate 3 and the wafer carrier plate 4, reducing the obstacles during the material taking and loading operations, improving the efficiency of the material changing operation, and enabling the lithography machine to quickly perform lithography processing operations on the replaced mask and wafer.

[0036] As Figure 3 、 Figure 4 shown, on both sides of the material transfer seat 2, there are respectively a material taking seat one 32 and a material taking seat two 42 that can move up and down. After the mask carrier plate 3 and the wafer carrier plate 4 rotate in opposite directions to both sides of the material transfer seat 2, the mask carrier plate 3 and the wafer carrier plate 4 respectively correspond to the material taking seat one 32 and the material taking seat two 42. As the material taking seat one 32 and the material taking seat two 42 rise, the mask and the wafer can be respectively pushed out above the mask carrier plate 3 and the wafer carrier plate 4.

[0037] After the mask and the wafer are pushed out above the mask carrier plate 3 and the wafer carrier plate 4, it is convenient to directly remove the mask and the wafer, which is beneficial for manual material taking and placing operations. Before performing the material taking and placing operations, the mask and the wafer can be quickly separated from the mask carrier plate 3 and the wafer carrier plate 4, reducing the frictional damage to the stage caused by the two during the process of manually taking the mask and the wafer. While protecting the mask and the wafer, it also improves the portability during the material taking operation.

[0038] As Figure 6 shown, in order to maintain the accuracy of the position distribution of the mask carrier plate 3 and the wafer carrier plate 4 when they move to the lithography machine processing station. At one end of the lead screw slide 1, there is an intercepting seat 14. On the side of the intercepting seat 14 close to the material transfer seat 2, there are two limit support seats 17 symmetrically distributed along a straight path. When the mask carrier plate 3 and the wafer carrier plate 4 and the material transfer seat 2 slide to the processing position, the mask carrier plate 3 and the wafer carrier plate 4 both accurately slide into the inside of the limit support seats 17.

[0039] Specifically, as Figure 5 、 Figure 6 shown, at the bottom ends of the mask carrier plate 3 and the wafer carrier plate 4, there are respectively a connecting seat one 31 and a connecting seat two 41 fixed. The connecting seat one 31 is fixedly installed with a same-direction rotating wheel 5. The same-direction rotating wheel 5 is connected through a synchronous scale belt 8 to a driving rotating wheel 7 distributed parallel to it.

[0040] In order to enable the co-rotating wheel 5 and the driving wheel 7 to carry the connecting seat one 31 and the connecting seat two 41 to rotate in opposite directions, in the present invention, a reverse gear 6 is fixedly installed on the connecting seat two 41, and the reverse gear 6 is meshed and connected with a driving gear 9 distributed in parallel therewith. The driving wheel 7 and the driving gear 9 are distributed from top to bottom and are connected by the same driving shaft, and a motor for controlling its rotation is provided at the bottom end of the driving shaft.

[0041] See Figure 3 , Figure 4 As shown, when the motor drives the driving shaft to rotate, the driving wheel 7 and the driving gear 9 can be made to rotate in the same direction, so as to achieve the purpose of driving the co-rotating wheel 5 and the reverse gear 6 to rotate in opposite directions until the connecting seat one 31 and the connecting seat two 41 respectively carry the mask carrier 3 and the wafer carrier 4 to rotate in opposite directions.

[0042] Furthermore, in order to maintain the stability of the connecting seat one 31 and the connecting seat two 41 when carrying the mask carrier 3 and the wafer carrier 4 during rotation, a support frame 10 is fixed on the material transfer seat 2, and the driving wheel 7 and the driving gear 9 are installed inside the support frame 10 through the driving shaft, and the co-rotating wheel 5 and the reverse gear 6 are respectively installed inside the support frame 10 from top to bottom through the rotating shafts.

[0043] Embodiment 2: On the basis of Embodiment 1, as Figure 5 shown, guide arms one 33 and guide arms two 43 are respectively provided at the bottom ends of the material taking seat one 32 and the material taking seat two 42, and teeth are provided vertically on one side of the guide arms one 33 and the guide arms two 43, and synchronous gears 11 are meshed and connected with the teeth located on both sides of the material transfer seat 2. When the synchronous gears 11 rotate, under the meshing action between themselves and the teeth, the guide arms one 33 and the guide arms two 43 can respectively carry the material taking seat one 32 and the material taking seat two 42 to rise, so as to achieve the purpose of ejecting the mask and the wafer above the mask carrier 3 and the wafer carrier 4.

[0044] It should be noted that in the present invention, since the heights of the mask carrier 3 and the wafer carrier 4 are different, therefore, the heights of the material taking seat one 32 and the material taking seat two 42 are also different, and the lengths of the guide arms one 33, the guide arms two 43 and the teeth provided on their sides are also adaptively adjusted according to the heights of the material taking seat one 32 and the material taking seat two 42.

[0045] As Figure 5As shown in the figure, two synchronous gears 11 located on both sides of the material transfer seat 2 are connected by the same linkage shaft 12. The linkage shaft 12 is rotationally installed on the material transfer seat 2 through a bearing seat, and the linkage shaft 12 passes under the wafer carrier 4. A motor capable of controlling the rotation of the linkage shaft 12 and the synchronous gears 11 is fixedly installed on one side of the material transfer seat 2. When the motor operates, under the connection of the linkage shaft 12, the two synchronous gears 11 located on both sides of the material transfer seat 2 can rotate synchronously, so as to achieve the purpose of synchronously raising the guiding arm one 33 and the guiding arm two 43, enabling the material taking seat one 32 and the material taking seat two 42 to eject the mask plate and the wafer, and further improving the transfer efficiency of the mask plate and the wafer.

[0046] As Figure 5 shown, in order to maintain the stability of the guiding arm one 33 and the guiding arm two 43 during the moving process, limiting seats 13 that have a limiting effect on the guiding arm one 33 and the guiding arm two 43 are provided on both sides of the material transfer seat 2, and the guiding arm one 33 and the guiding arm two 43 are both slidably installed with the limiting seats 13.

[0047] Embodiment 3: On the basis of Embodiment 1 and Embodiment 2, as Figure 6 , Figure 7 and Figure 8 shown, when the mask plate carrier 3 and the wafer carrier 4 move synchronously to the processing station, there is an easy-to-occur slight shaking phenomenon during the moving process. In order to make the mask plate carrier 3 and the wafer carrier 4 remain stationary when moving to the processing station, in the present invention, a partition plate 18 distributed along a straight path is fixed at the inner center position of the limiting support seat 17. Pressure plates 19 are provided both above and below the partition plate 18. The pressure plates 19 distributed from top to bottom are connected by a plurality of connecting rods 20 passing through the partition plate 18. Two pressure springs 21 distributed from top to bottom are provided outside each connecting rod 20. One end of each pressure spring 21 is fixed to the partition plate 18, and the other end is fixed to the pressure plate 19.

[0048] Furthermore, as Figure 9 , Figure 10 shown, pressure rollers 22 distributed along a straight path are fixed on the plate surfaces of the pressure plates 19 away from the partition plate 18. When both the mask plate carrier 3 and the wafer carrier 4 slide into the inner side of the limiting support seat 17, both the mask plate carrier 3 and the wafer carrier 4 are in sliding contact with the pressure rollers 22. When the mask plate carrier 3 and the wafer carrier 4 stop sliding, the two groups of pressure rollers 22 respectively abut against the mask plate carrier 3 and the wafer carrier 4.

[0049] The combined setting of the pressure roller 22, the pressing plate 19, and the pressure spring 21 can effectively buffer the shaking force of the mask carrier plate 3 and the wafer carrier plate 4 during the process of the mask carrier plate 3 and the wafer carrier plate 4 sliding into the inner side of the limit bracket 17, ensuring that when the mask carrier plate 3 and the wafer carrier plate 4 stop sliding, the two can maintain a stable state, so as to achieve the purpose of quickly stabilizing the mask carrier plate 3 and the wafer carrier plate 4. During this process, the influence of the shaking force on the photolithography process can be reduced, ensuring the accuracy of the position distribution of the mask carrier plate 3 and the wafer carrier plate 4 at the processing station and the accuracy of the photolithography process.

[0050] It is worth mentioning that in the present invention, the combined setting of the pressure roller 22, the pressing plate 19, and the pressure spring 21 has a plane correction effect on the mask carrier plate 3 and the wafer carrier plate 4, ensuring that when the mask carrier plate 3 and the wafer carrier plate 4 stop sliding, the two can maintain a horizontal state. This can avoid the influence of the inclination of the plate bodies of the mask carrier plate 3 and the wafer carrier plate 4 during long-term use on the photolithography process, and further ensure the accuracy of the photolithography process.

[0051] As Figure 8 shown, two groups of limit rollers 23 distributed from top to bottom are provided on the inner side wall of the limit bracket 17. When the mask carrier plate 3 and the wafer carrier plate 4 both slide into the inner side of the limit bracket 17, the two groups of limit rollers 23 respectively abut against the edges of the mask carrier plate 3 and the wafer carrier plate 4. The setting of the limit rollers 23 can further improve the smoothness of the sliding process of the mask carrier plate 3 and the wafer carrier plate 4.

[0052] As Figure 6 、 Figure 9 shown, two guiding frames 15 symmetrically distributed along a straight path are provided on one side of the intercepting seat 14 facing the material transfer seat 2. Two groups of guiding rollers 16 distributed from top to bottom are provided inside the guiding frames 15, and a receiving cavity for accommodating the guiding frames 15 and the guiding rollers 16 is formed on the material transfer seat 2. When the material transfer seat 2 slides to the processing position, the receiving cavity is slidably docked with the guiding frames 15 and the guiding rollers 16, so that the material transfer seat 2, the mask carrier plate 3, and the wafer carrier plate 4 can be accurately positioned. The setting of the guiding rollers 16 can improve the smoothness of the sliding docking between the receiving cavity and the guiding frames 15.

[0053] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A material retrieving platform for a photolithography machine, comprising a material transfer seat (2) and a lead screw slide (1) capable of controlling the material transfer seat (2) to move along a straight path, characterized in that: A mask carrier (3) and a silicon wafer carrier (4) are arranged in parallel above the material transfer seat (2); when the material transfer seat (2) slides to a material taking position, the mask carrier (3) and the silicon wafer carrier (4) can rotate in opposite directions to two sides of the material transfer seat (2); The two sides of the material transfer seat (2) are respectively provided with a material pick-up seat 1 (32) and a material pick-up seat 2 (42) which can be raised and lowered. As the material pick-up seat 1 (32) and the material pick-up seat 2 (42) rise, the mask and the silicon wafer can be respectively ejected to the top of the mask carrier (3) and the silicon wafer carrier (4); An interception seat (14) is provided at one end of the lead screw slide (1), and two limit brackets (17) are symmetrically distributed along a straight path on one side of the interception seat (14) close to the material transfer seat (2); when the mask carrier (3) and the silicon wafer carrier (4) slide to a processing position with the material transfer seat (2), the mask carrier (3) and the silicon wafer carrier (4) both slide into the inner side of the limit brackets (17).

2. The lithography machine material retrieving platform according to claim 1, characterized in that: A first connection seat (31) and a second connection seat (41) are fixed to the bottom ends of the mask carrier (3) and the silicon wafer carrier (4), respectively; a same-direction rotating wheel (5) is fixedly mounted on the first connection seat (31); and the same-direction rotating wheel (5) is connected to a driving rotating wheel (7) which is distributed parallel thereto via a synchronous ruler (8); The second connecting seat (41) is fixedly mounted with a reverse gear (6), and the reverse gear (6) is meshedly connected with a driving gear (9) arranged in parallel therewith. The driving wheel (7) and the driving gear (9) are arranged from top to bottom and are connected via a common driving shaft. A motor for controlling the rotation of the driving shaft is arranged at the bottom end. When the driving wheel (7) and the driving gear (9) rotate in the same direction, the same-direction wheel (5) and the reverse gear (6) rotate in opposite directions.

3. The photolithography machine material retrieving platform according to claim 2, characterized in that: A support frame (10) is fixed on the material transfer seat (2); the driving wheel (7) and the driving gear (9) are mounted on the inner side of the support frame (10) via a driving shaft; and the same-direction wheel (5) and the reverse gear (6) are mounted on the inner side of the support frame (10) from top to bottom via rotating shafts.

4. The lithography machine material retrieving platform according to claim 1, characterized in that: A guide arm 1 (33) and a guide arm 2 (43) are respectively provided at the bottom ends of the material picking seat 1 (32) and the material picking seat 2 (42); one side of the guide arm 1 (33) and the guide arm 2 (43) are provided with vertically arranged teeth; the teeth located on both sides of the material moving seat (2) are meshedly connected with a synchronous gear (11).

5. The material retrieving platform of the photolithography machine according to claim 4, characterized in that: The two synchronous gears (11) located on both sides of the material transfer seat (2) are connected via a common linkage shaft (12); the linkage shaft (12) is rotatably mounted on the material transfer seat (2) via a bearing seat, and the linkage shaft (12) passes through the bottom of the silicon wafer carrier (4); and a motor capable of controlling the rotation of the linkage shaft (12) and the synchronous gear (11) is fixedly mounted on one side of the material transfer seat (2).

6. The material retrieving platform of the photolithography machine according to claim 5, characterized in that: Limiting seats (13) are provided on both sides of the material transfer seat (2), and the first guide arm (33) and the second guide arm (43) are slidably mounted on the limiting seats (13).

7. The material retrieving platform of the photolithography machine according to claim 1, characterized in that: A partition plate (18) distributed along a straight path is fixed at the center position of the inner side of the limiting bracket (17), and pressure plates (19) are provided above and below the partition plate (18). The pressure plates (19) distributed from top to bottom are connected via a plurality of connecting rods (20) penetrating the partition plate (18), and two pressure springs (21) are provided outside the connecting rods (20) distributed from top to bottom, and one end of the pressure spring (21) is fixed to the partition plate (18), and the other end is fixed to the pressure plate (19); The plate surface of the pressure plate (19) away from the partition plate (18) is fixed with pressure rollers (22) distributed along a straight path, and when the mask carrier (3) and the silicon wafer carrier (4) both slide into the inner side of the limiting bracket (17), the two groups of pressure rollers (22) respectively abut against the mask carrier (3) and the silicon wafer carrier (4).

8. The material retrieving platform of the photolithography machine according to claim 7, characterized in that: Two groups of limit rollers (23) are arranged on the inner side wall of the limit bracket (17) and are distributed from top to bottom. When the mask carrier (3) and the silicon wafer carrier (4) slide into the inner side of the limit bracket (17), the two groups of limit rollers (23) respectively abut against the edges of the mask carrier (3) and the silicon wafer carrier (4).

9. The material retrieving platform of the photolithography machine according to claim 1, characterized in that: The intercepting seat (14) is provided with two guide frames (15) symmetrically distributed along a straight path on one side facing the material transfer seat (2); two groups of guide rollers (16) are provided inside the guide frames (15) distributed from top to bottom; a storage cavity for accommodating the guide frames (15) and the guide rollers (16) is provided on the material transfer seat (2); when the material transfer seat (2) slides to the processing position, the storage cavity slides and docks with the guide frames (15) and the guide rollers (16).

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