Self-adjusting chip packaging method and device

Abstract

The invention relates to the technical field of chip packaging, in particular to a packaging method and device for a self-adjusting chip, and the method comprises the steps: providing a packaging device, obtaining an initial coordinate value of the chip on a jig platform, obtaining a surface feature of the chip, and combining the initial coordinate value with the surface feature to obtain first positioning data; the spraying assembly is controlled to conduct spraying treatment on the chip, and a spraying path is adjusted; controlling the rotating platform to rotate by a preset angle, and acquiring second positioning data after the chip is rotated; controlling the thermocuring assembly to carry out thermocuring treatment around the chip based on the second positioning data to form a packaging protection layer; and carrying out performance test and adjustment on the packaging protection layer until the packaging protection layer reaches a preset packaging effect. According to the invention, the problems of insufficient precision and poor packaging in the existing packaging method are effectively solved, and the stability and reliability of the packaging process are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a packaging method and device for a self-regulating chip. Background Art

[0002] With the continuous advancement of semiconductor technology, the functions of integrated circuit chips are becoming increasingly powerful, and the degree of integration is constantly improving. In this context, chip packaging technology has also developed rapidly. Packaging plays a role in protecting chips from external environmental influences and provides functions such as electrical connection and heat dissipation. A self-regulating chip is an intelligent chip that can automatically adjust its performance or behavior according to changes in the external environment or internal working conditions. How to achieve efficient packaging of such chips has become an important topic in the field of packaging technology. Self-regulating chips have a high degree of integration, complex structure, and sensitive surface features, so the requirements for accuracy and reliability during their packaging process are relatively stringent.

[0003] The existing chip packaging method is a fixed packaging path and parameter setting, but due to factors such as chip surface irregularities, position errors, and temperature fluctuations, the existing packaging process is often difficult to achieve precise consistency, which can easily lead to poor packaging or unstable performance. For example, there may be tiny defects or unevenness on the chip surface, which will cause deviations during the spraying or thermal curing process, thereby affecting the quality of the packaging protective layer. In addition, as the size of self-adjusting chips decreases and packaging requirements increase, the existing manual adjustment and control methods cannot effectively solve these problems.

[0004] Therefore, how to dynamically adjust packaging parameters during the chip packaging process, especially the spraying path and thermal curing angle, has become a difficult problem that needs to be solved urgently in the technical field. Summary of the invention

[0005] The main purpose of the present invention is to provide a packaging method for a self-regulating chip, aiming to overcome the technical problem that the prior art cannot adjust the packaging parameters according to the surface characteristics of the chip.

[0006] In order to achieve the above-mentioned invention problem, the present invention proposes a packaging method of a self-regulating chip, the method comprising: A packaging device is provided, the packaging device comprising a rotating platform, a spraying component and a heat curing component, the rotating platform comprises a plurality of fixture platforms, the spraying component and the heat curing component are arranged above the fixture platforms at intervals; Acquire the initial coordinate value of the chip on the fixture platform, and acquire the surface features of the chip, and combine the initial coordinate value and the surface features to obtain first positioning data; Controlling the spraying assembly to spray the chip, acquiring a position offset of the chip during the spraying process based on the first positioning data, and adjusting a spraying path based on the position offset; Controlling the rotating platform to rotate a preset angle, and obtaining new coordinate values ​​and new surface features of the chip after rotation, to obtain second positioning data; Based on the second positioning data, control the thermal curing component to perform thermal curing around the chip to form a packaging protection layer; The performance test is performed on the encapsulation protection layer. If the encapsulation protection layer does not achieve the preset encapsulation effect, the thermal curing angle of the thermal curing component is adjusted until the encapsulation protection layer achieves the preset encapsulation effect.

[0007] Furthermore, the step of obtaining the initial coordinate value of the chip on the fixture platform, obtaining the surface features of the chip, and combining the initial coordinate value and the surface features to obtain the first positioning data includes: Positioning the chip to obtain the initial coordinate value of the chip on the fixture platform, wherein the initial coordinate value includes the coordinate value of the chip in the three axes of X, Y, and Z; According to the initial coordinate value of the chip, the relative position between the chip and each fixture platform on the fixture platform is calculated to generate a relative position matrix; Scanning the chip surface to obtain surface feature data of the chip surface, wherein the surface feature data includes but is not limited to the undulation height and surface roughness of the chip surface; The undulation height and the surface roughness are combined to generate an influence coefficient matrix; The relative position matrix and the influence coefficient matrix are processed comprehensively to obtain first positioning data, wherein the first positioning data includes the optimized coordinate values ​​of the chip.

[0008] Furthermore, the step of controlling the spraying assembly to spray the chip, acquiring the position offset of the chip during the spraying process based on the first positioning data, and adjusting the spraying path based on the position offset includes: Initializing a spraying path of a spraying component according to the first positioning data, and performing spraying processing on the chip according to the spraying path; During the spraying process, the actual position of the chip is detected, and the difference between the actual position of the chip and the initial coordinate value is obtained to obtain the position offset; Perform weighted calculation on the position offset in the X, Y, and Z axis directions to obtain the corrected spray path; The spraying assembly is controlled according to the corrected spraying path to spray the chip until the spraying is completed.

[0009] Furthermore, the step of controlling the rotating platform to rotate a preset angle, and obtaining new coordinate values ​​and new surface features of the chip after rotation, to obtain second positioning data includes: Setting the angle of the rotating platform, controlling the rotating platform to rotate according to the preset angle, and obtaining the rotation angle and rotation angle change information of the chip after rotation; Based on the rotation angle change information, a relative position change amount of the chip after rotation is acquired to obtain a coordinate offset amount of the chip after rotation; According to the coordinate offset of the chip after rotation, the new coordinate value of the chip after rotation is calculated, and the new coordinate value is calibrated to obtain the new coordinate value; Obtain the surface feature change information of the chip after the spraying treatment, including the new undulation height and new surface roughness of the chip surface, and generate a new influence coefficient matrix; The new coordinate values ​​and the new influence coefficient matrix are processed comprehensively to obtain second positioning data, wherein the second positioning data includes the optimized coordinate values ​​of the chip after rotation and characteristic change information of the chip surface.

[0010] Furthermore, the step of controlling the thermal curing component to perform thermal curing around the chip based on the second positioning data to form a packaging protection layer includes: Analyzing the second positioning data to obtain a curing temperature range required for the chip during thermal curing; According to the curing temperature range, determining the rotation angle of the heat curing component required in the heat curing process to obtain a target heat curing rotation angle; According to the target thermal curing rotation angle, controlling the rotation angle of the thermal curing component, so that the thermal curing component performs thermal curing around the chip and maintains the temperature within a preset time to form an initial protective layer; After the thermal curing process is completed, the temperature of the chip surface is gradually reduced to form the protective layer.

[0011] Furthermore, the step of determining the rotation angle of the heat curing component required in the heat curing process according to the curing temperature range to obtain the target heat curing rotation angle includes: Subdividing the curing temperature range to obtain a plurality of temperature intervals; For each of the temperature intervals, based on historical experimental data, obtaining the optimal thermal curing angle of the chip in each temperature interval; generating a thermal curing angle curve according to the optimal thermal curing angle; The peak angle in the thermal curing angle curve is selected as the target thermal curing rotation angle.

[0012] Furthermore, the step of performing a performance test on the encapsulation protection layer and adjusting the thermal curing angle of the thermal curing component until the encapsulation protection layer achieves the preset encapsulation effect if the encapsulation protection layer does not achieve the preset encapsulation effect comprises: Performing surface inspection on the encapsulation protection layer, scanning the thickness and flatness of the encapsulation protection layer using a surface scanning device to obtain surface data of the encapsulation protection layer; Calculating a defect index of the packaging protective layer based on the thickness and flatness data, and comparing it with a preset packaging standard to obtain a defect evaluation result; If the defect assessment result is that a defect exists, calculating an angle adjustment value according to a difference between the defect index and the packaging standard; Controlling the heat curing component to move according to the angle adjustment value, performing secondary heat curing treatment, and obtaining a new encapsulation protection layer; The testing process and the heat curing process are repeated until the encapsulation protection layer achieves a preset encapsulation effect.

[0013] The present invention also provides a packaging device for a self-regulating chip, comprising: substrate; A rotating platform, the rotating platform is connected to the substrate via a rotating shaft, and a plurality of fixture platforms are arranged on the rotating platform; A spraying assembly, wherein the spraying assembly is connected to the substrate via a first bracket, and a spraying port of the spraying assembly is arranged opposite to the fixture platform, and is used to spray packaging material onto the chip on the fixture platform; A heat curing component is connected to the substrate through a second bracket, a heating port of the heat curing component is arranged opposite to the fixture platform, and the heat curing component rotates around the second bracket to achieve all-round heat curing treatment of the chip.

[0014] Furthermore, the second bracket includes a slide bar, a driving member and a rotating shaft, the slide bar is vertically connected to the base plate, and one end of the slide bar away from the base plate is connected to the driving member so that the driving member slides up and down along the slide bar; The rotating shaft is connected to the driving member parallel to the substrate, and one end of the rotating shaft away from the driving member is connected to the thermal curing component. The driving member drives the rotating shaft to rotate, thereby causing the thermal curing component to rotate around the rotating shaft, thereby adjusting the position of the thermal curing component to achieve thermal curing treatment of different parts of the chip.

[0015] Furthermore, the spraying assembly includes a spray head, a spray pump and a spray controller, the spray head is connected to the spray pump, and is used to spray the packaging material from the spray head; the spray pump is used to provide the pressure required for spraying, and evenly spray the packaging material from the spray head onto the chip on the fixture platform; the spray controller is used to control the spraying speed and spraying amount of the spray head.

[0016] Beneficial effects: The present application proposes a packaging method for a self-adjusting chip, which adopts a packaging device combining a rotating platform, a spraying component and a thermal curing component, and can dynamically adjust the packaging parameters in real time during the packaging process. By obtaining the initial coordinate value and surface features of the chip and combining the positioning data, the spraying path can be accurately controlled to ensure that the position offset in the spraying process is corrected in time, thereby avoiding the packaging deviation caused by surface irregularity or position error. Further, by controlling the preset angle of the rotating platform, combined with the obtained new coordinate value and new surface features, the thermal curing angle in the thermal curing process can be further accurately adjusted to ensure the uniformity and accuracy of the thermal curing treatment, thereby forming a uniform packaging protective layer, improving the adaptive ability in the packaging process, avoiding the problems of micro defects on the chip surface, position deviation and temperature fluctuation that cannot be dealt with by the fixed path and parameter setting in the traditional packaging method, and effectively improving the stability and consistency of the packaging effect. If the packaging protective layer does not achieve the preset effect, the system can automatically adjust the thermal curing angle until the packaging requirements are met, thereby improving the packaging quality of the self-adjusting chip and improving production efficiency.

[0017] In summary, the present application can effectively solve the problems of insufficient precision and poor packaging in existing packaging methods, especially for self-regulating chips with complex structures and sensitive surface features, and can significantly improve the stability and reliability of the packaging process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the steps of a packaging method for a self-regulating chip in one embodiment of the present invention; Figure 2 It is a schematic block diagram of the overall structure of a packaging device for a self-regulating chip according to an embodiment of the present invention; Figure 3 It is a schematic block diagram of a top view structure of a self-regulating chip packaging device according to an embodiment of the present invention; Figure 4 The present invention is a schematic block diagram of the structure of a spraying component of a self-regulating chip packaging device according to an embodiment of the present invention.

[0019] Among them, the figure markings are: 1, substrate; 2, rotating platform; 21, rotating axis; 3, fixture platform; 4, spraying assembly; 41, spraying head; 42, spraying pump; 43, spraying controller; 5, thermal curing assembly; 6, first bracket; 7, second bracket; 71, sliding rod; 72, driving member; 73, rotating shaft; 8, measuring assembly; 9, scanning assembly.

[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0022] It will be understood by those skilled in the art that, unless expressly stated, the singular forms "one", "above", and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present invention refers to the presence of features, integers, steps, operations, elements, modules, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, modules, components, and / or groups thereof. It should be understood that when an element is said to be "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be an intermediate element. In addition, the "connection" or "coupling" used herein may include wireless connection or wireless coupling. The term "and / or" used herein includes all or any module and all combinations of one or more associated listed items.

[0023] Those skilled in the art will understand that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those skilled in the art in the field to which the present invention belongs. It should also be understood that terms such as those defined in common dictionaries should be understood to have meanings consistent with the meanings in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as here.

[0024] Reference Figure 1 , an embodiment of the present invention provides a packaging method of a self-regulating chip, the method comprising: S1: providing a packaging device, the packaging device comprising a rotating platform 2, a spraying assembly 4 and a thermal curing assembly 5, the rotating platform 2 comprising a plurality of fixture platforms 3, the spraying assembly 4 and the thermal curing assembly 5 being arranged above the fixture platforms 3 at intervals; In step S1, a packaging device is provided, which includes a rotating platform 2, on which a plurality of fixture platforms 3 are arranged. The fixture platforms 3 are used to fix the chip and ensure that it can rotate stably during the packaging process. During the packaging process, the chip needs to rotate so that the spraying component 4 and the thermal curing component 5 can evenly treat the various surfaces of the chip. The function of the spraying component 4 is to spray the surface of the chip. It is located above the rotating platform 2 and is spaced apart from the thermal curing component 5. The spraying component 4 forms a preliminary protective layer on the surface of the chip by spraying a suitable material. The thermal curing component 5 is used to perform thermal curing treatment on the chip after the chip is sprayed to ensure the formation of a stable packaging protective layer. The thermal curing component 5 is located above the rotating platform 2, and provides uniform heating for the chip through its rotation and heat treatment functions to ensure that the hardening process of the packaging layer proceeds smoothly.

[0025] S2: Obtaining the initial coordinate value of the chip on the fixture platform 3, and obtaining the surface features of the chip, and combining the initial coordinate value and the surface features to obtain first positioning data; In step S2, during the packaging process, the initial positioning of the chip can be obtained based on an optical sensor, a distance sensor or other high-precision measuring component 8, which is integrated on the rotating platform 2 and can capture the position of the chip in real time. There may be tiny bumps, depressions, stains or other defects on the surface of the chip, which will affect the uniformity of the spraying and the effect of thermal curing. Through high-precision sensors (such as surface scanners, laser scanners, etc.), the tiny features of the chip surface can be obtained in real time, and even the irregular shapes of the surface can be modeled. These surface feature information can help the subsequent spraying components 4 and thermal curing components 5 to make necessary adjustments to adapt to chips with different surface conditions. The initial coordinate value provides the spatial position of the chip, and the surface feature provides detailed information on the surface state of the chip. After the initial coordinate value and the surface feature are combined to form the first positioning data, the packaging equipment can perform precise operations on the chip based on this data in the subsequent steps.

[0026] S3: Control the spraying component 4 to spray the chip, obtain the position offset of the chip during the spraying process based on the first positioning data, and adjust the spraying path based on the position offset; In step S3, when the spraying component 4 performs the spraying task, it forms a spraying path according to the initial position and surface features of the chip. This path is determined according to the first positioning data, and the first positioning data includes the initial coordinate value of the chip and the surface feature information. The spraying component 4 controls the starting position of the spraying, and performs preliminary spraying by adjusting parameters such as the angle of the nozzle and the spraying distance. In the actual packaging process, due to slight errors or surface irregularities, the chip may be slightly displaced during the spraying process. At this time, a position feedback mechanism is used to monitor the movement trajectory of the chip in real time through a sensor or camera system, and compare it with the preset path. If it is found that the actual position of the chip deviates from the preset spraying path, the spraying component 4 will adjust according to the position offset and re-plan the spraying path to ensure the uniformity of the spraying and improve the stability and consistency of the packaging process. S4: Control the rotating platform 2 to rotate by a preset angle, and obtain new coordinate values ​​and new surface features of the chip after rotation to obtain second positioning data; In step S4, the rotating platform 2 allows the chip to rotate at a specific angle in three-dimensional space. A plurality of fixture platforms 3 are provided on the rotating platform 2. The chip is fixed on these fixture platforms 3, and the position of the chip is adjusted by the rotation of the rotating platform 2. In step S4, the rotating platform 2 rotates according to a preset angle, which can be 45 degrees, 90 degrees or other specific angles. The purpose is to rotate the chip to the bottom of the thermal curing component 5. The rotated chip will form new coordinate data and surface features. The new coordinate value is obtained by real-time monitoring of the rotation position and coordinate changes of the chip. Combined with the first positioning data before rotation, the second positioning data is generated. This new positioning data is obtained based on the rotation angle of the chip and the change of its surface features. Similar to step S3, the new surface features of the chip after spraying are obtained. These features may include the coating thickness, uniformity and possible defects after spraying.

[0027] S5: controlling the thermal curing component 5 to perform thermal curing around the chip based on the second positioning data to form a packaging protection layer; In step S5, the heat curing component 5 is controlled to perform heat curing around the chip by obtaining the second positioning data. The heat curing component 5 is composed of a plurality of heating elements, which generate sufficient heat during the heat curing process to help the packaging material to cure. According to the second positioning data, the heat curing component 5 will accurately adjust its heating area and heating intensity according to the specific position and surface characteristics of the chip. In order to ensure uniform heat curing, the heat curing component 5 can be rotated or adjusted around different parts of the chip to ensure that each angle can be fully heated to ensure that each angle can be fully heated. The adjustment of the heat curing angle is a dynamic process, and the angle and path of heat curing are optimized according to the real-time position and surface characteristics of the chip. For example, if the chip surface in a certain area is more complex or irregular, the heat curing component 5 may need to be fine-tuned according to the second positioning data so that the heating element can perform heat curing at a specific angle for the area, thereby achieving a uniform coverage effect. After the heat curing process is completed, a solid and uniform packaging protective layer will be formed on the surface of the chip, and the packaging layer can effectively protect the chip from the influence of the external environment, such as temperature, humidity and physical impact.

[0028] S6: Performing a performance test on the packaging protective layer. If the packaging protective layer does not achieve a preset packaging effect, adjusting the thermal curing angle of the thermal curing component 5 until the packaging protective layer achieves a preset packaging effect.

[0029] In step S6, the performance test of the formed encapsulation protection layer is performed to evaluate the quality of the encapsulation protection layer, including its thickness uniformity, degree of curing, hardness, heat resistance, moisture resistance, and protection against external physical impact. The performance test of the encapsulation protection layer can be carried out in a variety of ways, for example, by checking the surface quality of the encapsulation layer through a scanning electron microscope (SEM), or by using other precision instruments to measure the physical properties of the encapsulation layer such as hardness and strength. These test results will directly affect whether the subsequent thermal curing process needs to be adjusted to ensure that the quality of the chip package meets the design and application requirements. For example, assuming that the performance test finds that the thickness of the encapsulation protection layer in some areas is uneven, resulting in the encapsulation layer in some parts being too thin and may not provide sufficient protection. At this time, the thermal curing component 5 needs to be adjusted. Specifically, the angle adjustment of the thermal curing component 5 can affect the distribution of the heat source during the thermal curing process. If the thermal curing component 5 is not heated sufficiently in some areas, it may cause the encapsulation layer to be incompletely cured, thereby affecting its final performance. Based on the feedback from the performance test, the thermal curing angle of the thermal curing component 5 is adjusted to ensure that all areas can be uniformly heated and the quality of the encapsulation layer is further improved. It is worth noting that the adjustment process in S6 is an iterative optimization process. After the first adjustment, a new performance test may be required to verify whether the adjusted encapsulation layer meets the preset requirements. If it still does not meet the requirements, it may be necessary to continue to adjust the thermal curing angle until the quality of the encapsulation protective layer fully meets the requirements.

[0030] In one embodiment, the step of obtaining the initial coordinate value of the chip on the fixture platform 3, obtaining the surface features of the chip, and combining the initial coordinate value and the surface features to obtain the first positioning data includes: Positioning the chip to obtain the initial coordinate value of the chip on the fixture platform 3, wherein the initial coordinate value includes the coordinate value of the chip in the three axes of X, Y, and Z; According to the initial coordinate value of the chip, the relative position between the chip and each fixture platform 3 on the fixture platform 3 is calculated to generate a relative position matrix; Scanning the chip surface to obtain surface feature data of the chip surface, wherein the surface feature data includes but is not limited to the undulation height and surface roughness of the chip surface; The undulation height and the surface roughness are combined to generate an influence coefficient matrix; The relative position matrix and the influence coefficient matrix are processed comprehensively to obtain first positioning data, wherein the first positioning data includes the optimized coordinate values ​​of the chip.

[0031] In the above embodiment, the initial coordinate values ​​of the chip on the fixture platform 3 are obtained, that is, the coordinates of the chip in the X, Y, and Z axis directions on the fixture platform 3. These coordinate values ​​represent the position of the chip in three-dimensional space. In actual operation, the accurate position of the chip on the fixture can be obtained based on the measurement component 8 integrated on the rotating platform 2 and converted into precise numerical coordinates. The relative position between the chip and the fixture platform 3 is calculated based on the initial coordinate values ​​of the chip, and a relative position matrix is ​​generated to clarify the spatial relationship between the chip and the fixture. This matrix contains the deviation of the chip relative to multiple coordinate points on the fixture platform 3. Specifically, assuming that there are multiple fixed fixture points or reference points on the fixture platform 3, the relative position of the chip and these points can be calculated to form a matrix containing the deviation between each reference point and the chip. After obtaining the initial coordinates and relative position matrix of the chip, the surface of the chip is scanned to obtain the surface feature data of the chip. The chip surface feature data mainly includes the undulation height and surface roughness of the chip surface. The acquisition of surface feature data can be achieved by high-precision surface scanning technology, such as by means of scanning components 9 integrated in the spraying component 4, etc., which can comprehensively scan the chip surface and obtain detailed information on its surface microstructure. The surface roughness reflects the smoothness of the microstructure of the chip surface, and the surface roughness is obtained to calculate the influence coefficient matrix. The influence coefficient matrix integrates characteristic data such as undulation height and surface roughness to obtain a comprehensive influence coefficient, which reflects the influence of the chip surface features on the packaging process. For example, when the surface undulation is large or the surface roughness is high, the influence coefficient will be high, and the relative position matrix and the influence coefficient matrix are comprehensively processed to obtain the first positioning data. In this step, an optimized coordinate value is calculated in combination with the relative position between the chip and the fixture and the influence of the surface features. This optimized coordinate value is the best placement position of the chip on the fixture platform 3, so that the chip can be in the most stable and accurate position during the packaging process. By comprehensively processing the relative position matrix and the influence coefficient matrix, positioning is performed through the initial coordinates, and the influence of surface features on positioning is also considered, so as to achieve more accurate packaging positioning. The optimized coordinate value is the first positioning data to ensure the optimization of packaging quality and chip performance.

[0032] In another embodiment, the calculation formula of the above steps is: ; Among them, FPD is the first positioning data; RPM is the relative position matrix, which indicates the spatial deviation of the chip relative to multiple reference points on the fixture platform. It is calculated through the initial coordinate values ​​(X, Y, Z) and reflects the spatial relationship between the chip and the fixture. Assuming that the fixture platform has n reference points, RPM is an n×3 matrix, and each row corresponds to the deviation between a reference point and the chip; ICM is the influence coefficient matrix, which integrates the undulation height and roughness of the chip surface to quantify the influence of surface features on package positioning. The larger the ICM value, the greater the interference of surface features on positioning; λ is the attenuation factor, which is used to control the influence of ICM on the overall positioning. Through the exponential function Introducing nonlinear effects, so that the influence of surface characteristics decays smoothly with the increase of λ, which is a positive real number (such as 0.1~1.0); is an exponential decay term used to smooth the influence of ICM. When ICM is large, this term approaches 0, reducing excessive interference from surface features. When ICM is small, this term approaches 1, retaining the original influence. is the surface feature weight factor, which is used to adjust the contribution of surface fluctuation height to positioning data. The larger σ is, the more significant the impact of fluctuation height is. The range is 0.5~2.0; The height gradient is the spatial gradient of the chip surface height (H), which indicates the severity of the surface height change and is calculated from the scanning data; is the roughness parameter of the chip surface, which is the arithmetic mean roughness and reflects the smoothness of the surface microstructure; is the roughness distribution density, which describes the uniformity of the roughness distribution on the chip surface and is a local density function; is the surface roughness integral term. The roughness Ra and distribution density δ of the chip surface are integrated to calculate the overall impact of the surface roughness. The integration range S is the chip surface area.

[0033] In one embodiment, the step of controlling the spraying assembly 4 to spray the chip, acquiring the position offset of the chip during the spraying process based on the first positioning data, and adjusting the spraying path based on the position offset includes: Initializing a spraying path of the spraying component 4 according to the first positioning data, and performing spraying processing on the chip according to the spraying path; During the spraying process, the actual position of the chip is detected, and the difference between the actual position of the chip and the initial coordinate value is obtained to obtain the position offset; Perform weighted calculation on the position offset in the X, Y, and Z axis directions to obtain the corrected spray path; The spraying assembly 4 is controlled to spray the chip according to the corrected spraying path until the spraying is completed.

[0034] In the above embodiment, the spraying path is initialized according to the first positioning data. The spraying path refers to the track that the spraying equipment needs to walk on the chip surface. This path will be sprayed on the chip surface, covering all the areas of the chip that need to be sprayed. The spraying component 4 starts to spray the chip according to the preset spraying path. In this process, the actual position of the chip is monitored, and the difference between the actual position and the initial coordinates is obtained. This difference is the position offset. In fact, during the spraying process, due to the influence of slight deformation, temperature change, mechanical error or other external factors on the chip surface, the chip may be slightly offset. After obtaining the position offset, the position offset in the three axes of X, Y, and Z is weighted to obtain a corrected spraying path. The specific method of weighted calculation is based on the influence of the offset in different directions on the final spraying effect. For example, in some cases, the offset of the X axis may have a more significant effect on the spraying quality than the Z axis. At this time, more weight is given to the X axis offset. By weighting the position offset in each direction, a new spraying path can be calculated, so that the spraying equipment can accurately operate according to the corrected path until the spraying process is completed. In this way, the spraying equipment can respond to changes in chip position in real time and make necessary path adjustments to ensure that each spraying position can accurately cover the target area of ​​the chip. This self-adjusting control method not only improves spraying accuracy, but also reduces spraying defects caused by position errors, thereby improving the quality and reliability of packaging.

[0035] In one embodiment, the step of controlling the rotating platform 2 to rotate a preset angle, and obtaining new coordinate values ​​and new surface features of the chip after rotation, to obtain the second positioning data includes: Setting the angle of the rotating platform 2, controlling the rotating platform 2 to rotate according to the preset angle, and obtaining the rotation angle and rotation angle change information of the chip after rotation; Based on the rotation angle change information, a relative position change amount of the chip after rotation is acquired to obtain a coordinate offset amount of the chip after rotation; According to the coordinate offset of the chip after rotation, the new coordinate value of the chip after rotation is calculated, and the new coordinate value is calibrated to obtain the new coordinate value; Obtain the surface feature change information of the chip after the spraying treatment, including the new undulation height and new surface roughness of the chip surface, and generate a new influence coefficient matrix; The new coordinate values ​​and the new influence coefficient matrix are processed comprehensively to obtain second positioning data, wherein the second positioning data includes the optimized coordinate values ​​of the chip after rotation and characteristic change information of the chip surface.

[0036] In the above embodiment, the platform is controlled to rotate at a preset angle by setting the angle of the rotating platform 2, and the position and angle of the chip are adjusted. Specifically, the rotating platform 2 starts the platform to rotate according to the preset angle. During the rotation process, the angle change of the platform will affect the position of the chip, especially the center coordinates and surface features of the chip may change due to the rotation. By measuring the change in the rotation angle, the relative position change of the chip after rotation can be obtained, and these changes are the coordinate offsets of the chip after rotation. This offset reflects the difference between the original coordinates and the actual coordinates after the chip is rotated, which is an important basis for correcting the chip positioning in the subsequent steps. Based on this offset, the new coordinate value of the chip after rotation is calculated. The new coordinate value is a description of the precise position of the chip after rotation. The calculated new coordinate value may have a certain error. The new coordinate value is calibrated to correct possible errors and ensure the accuracy of the positioning data. After the spraying process, the surface features of the chip will change, and the spraying process will change some microstructures of the surface. By measuring the surface features, new surface undulation height and roughness data can be obtained, and these data will form a new influence coefficient matrix. The influence coefficient matrix is ​​a mathematical model used to describe how changes in chip surface features affect the entire packaging process. The newly calculated coordinate values ​​are processed together with the new influence coefficient matrix to obtain the second positioning data. The second positioning data is a comprehensive description of the final position and surface features of the chip after rotation. It includes the optimized coordinate values ​​of the chip after rotation and the feature change information on the chip surface. The optimized coordinate values ​​enable subsequent packaging operations to be performed more accurately, while the change information on surface features helps subsequent equipment such as spray equipment and placement machines to make appropriate adjustments to ensure the stability of packaging quality.

[0037] In one embodiment, the step of controlling the thermal curing component 5 to perform thermal curing around the chip based on the second positioning data to form a packaging protection layer includes: Analyzing the second positioning data to obtain a curing temperature range required for the chip during thermal curing; According to the curing temperature range, determining the rotation angle of the heat curing component 5 required in the heat curing process, and obtaining a target heat curing rotation angle; According to the target thermal curing rotation angle, the rotation angle of the thermal curing component 5 is controlled, so that the thermal curing component 5 performs thermal curing around the chip and maintains the temperature within a preset time to form an initial protective layer; After the thermal curing process is completed, the temperature of the chip surface is gradually reduced to form the protective layer.

[0038] In the above embodiment, the second positioning data is analyzed to obtain the curing temperature range required by the chip during the thermal curing process, and the thermal curing temperature range required by the chip can be determined. For example, the chip surface has a high roughness, and a part of the area is exposed to direct heat source, while the other part is far away. According to the surface feature data, the temperature range required by different areas of the chip surface can be inferred by analyzing the roughness and the thermal conductivity of different materials. The thermal curing process is optimized by the rotation angle of the thermal curing component 5 to ensure that the packaging protective layer covers the entire chip evenly and flatly. During the chip packaging process, the thermal curing component 5 rotates around the chip to achieve a uniform thermal curing effect and ensure the stability of the protective layer. By calculating the required rotation angle, the problem of uneven thermal curing caused by improper angle can be avoided, thereby ensuring the high quality of chip packaging. The determination of the target thermal curing rotation angle can be carried out based on the surface characteristics of the chip and the predetermined packaging process requirements. According to the angle, the rotation of the thermal curing component 5 is controlled to perform uniform heat treatment around the chip within the specified angle. By controlling the rotation angle of the component, it can cover the entire chip during the thermal curing process and maintain a constant temperature within the preset time. As the thermal curing process proceeds, a preliminary packaging protective layer is gradually formed, and measures are taken to gradually reduce the surface temperature of the chip. Nonlinear cooling is performed according to the characteristics of the specific material to avoid damage to the chip and protective layer due to thermal stress caused by excessive cooling.

[0039] In one embodiment, the step of determining the rotation angle of the heat curing component 5 required in the heat curing process according to the curing temperature range to obtain the target heat curing rotation angle includes: Subdividing the curing temperature range to obtain a plurality of temperature intervals; For each of the temperature intervals, based on historical experimental data, obtaining the optimal thermal curing angle of the chip in each temperature interval; generating a thermal curing angle curve according to the optimal thermal curing angle; The peak angle in the thermal curing angle curve is selected as the target thermal curing rotation angle.

[0040] In the above embodiment, the curing temperature range is subdivided to form multiple temperature intervals, and the influence of the temperature on the chip in different intervals is controlled, because different temperature levels will have different degrees of influence on the curing effect of the chip. For example, some areas may require higher temperatures to accelerate the curing process, while other areas may require lower temperatures to avoid chip damage caused by overheating. By subdividing the temperature range, the curing effect of each temperature interval can be controlled more accurately, thereby ensuring the uniformity and effect of the entire curing process. According to the characteristics of each temperature interval, the optimal thermal curing angle of the chip in each temperature interval is obtained based on historical experimental data. By summarizing past experiments, the optimal rotation angle of the chip in different temperature intervals can be obtained. Such an angle can ensure uniform heat distribution of the chip and optimize the curing effect of the chip surface. For example, in some temperature intervals, the chip may need to be rotated at a certain angle to ensure uniformity of heat transfer due to uneven surface, so as to avoid uneven curing caused by local overheating or overcooling. In other temperature intervals, good heat transfer effect may be achieved by adjusting the rotation angle slightly. By obtaining the best thermal curing angle data, a thermal curing angle curve is generated. It can be formed by connecting the best angles corresponding to multiple temperature intervals, with the purpose of showing the changing trend of angles at different temperatures. By selecting the peak angle in the thermal curing angle curve as the target thermal curing rotation angle, the peak angle here is usually the angle with the best effect in the thermal curing process, that is, within a certain temperature range, it can maximize the heat transfer efficiency and ensure that all parts of the chip are heated evenly. In practical applications, the peak angle can be the result of experimental data, representing the rotation angle with the best thermal curing effect under certain experimental conditions. For example, if historical data shows that the chip has the best curing effect when the temperature range is between 150°C and 180°C and the rotation angle is 45 degrees, then this angle will be selected as the target thermal curing rotation angle. Through this process, the rotation angles corresponding to different temperature intervals are optimized during the entire thermal curing process, ensuring that the curing effect of each interval can reach the expected goal.

[0041] In one embodiment, the step of performing a performance test on the encapsulation protection layer and adjusting the thermal curing angle of the thermal curing component 5 until the encapsulation protection layer achieves the preset encapsulation effect if the encapsulation protection layer does not achieve the preset encapsulation effect comprises: Performing surface inspection on the encapsulation protection layer, scanning the thickness and flatness of the encapsulation protection layer using a surface scanning device to obtain surface data of the encapsulation protection layer; Calculating a defect index of the packaging protective layer based on the thickness and flatness data, and comparing it with a preset packaging standard to obtain a defect evaluation result; If the defect assessment result is that a defect exists, calculating an angle adjustment value according to a difference between the defect index and the packaging standard; Controlling the heat curing component 5 to move according to the angle adjustment value, performing secondary heat curing treatment, and obtaining a new encapsulation protection layer; The testing process and the heat curing process are repeated until the encapsulation protection layer achieves a preset encapsulation effect.

[0042] In the above embodiment, a surface scanning device is used to scan the thickness and flatness of the encapsulation protective layer to obtain the surface data of the encapsulation protective layer, and the defect index of the encapsulation protective layer is calculated based on the thickness and flatness data obtained by these scans. The defect index is a comprehensive indicator for measuring the surface quality of the encapsulation protective layer, reflecting the surface unevenness, thickness variation, and possible defects such as bubbles and cracks. When calculating the defect index, the surface data is compared with the preset encapsulation standard. The encapsulation standard can be set according to different application requirements. The defect evaluation result is obtained by comparing the actual scanning data with the preset standard to obtain the degree of defect of the encapsulation protective layer. If the defect index is greater than the preset standard, it means that there is a defect in the encapsulation protective layer, and the angle adjustment value is calculated according to the difference between the defect index and the encapsulation standard. The angle adjustment value is determined by analyzing the nature and severity of the defect. For example, if the uniformity of the surface thickness is poor, it may be caused by uneven temperature distribution or improper rotation angle during the thermal curing process. At this time, by calculating the difference in the defect index, the thermal curing angle that needs to be adjusted can be determined. For example, if it is found that the thickness of one side of the chip is thinner, it may be necessary to increase the thermal curing angle of that side to ensure that the heat can be evenly distributed on the entire encapsulation protective layer to achieve the required flatness and thickness. After calculating the angle adjustment value, the thermal curing component 5 is controlled to move according to the angle adjustment value, thereby realizing secondary thermal curing treatment. At this time, the angle of the thermal curing component 5 will be precisely adjusted according to the calculated adjustment value to optimize the thermal curing effect and ensure that the encapsulation protective layer is more evenly thermally treated. The secondary thermal curing treatment is usually further refined on the basis of the original curing conditions to ensure that the encapsulation layer of the chip can achieve a more ideal effect. The secondary thermal curing process may involve subtle adjustments to the original angle, and even a more precise control system can be used to monitor and adjust the angle in real time to ensure that each round of thermal treatment can meet high-standard packaging requirements. After completing the second thermal curing treatment, the quality of the encapsulation protective layer still needs to be tested again, and the surface inspection and defect evaluation process is usually repeated to ensure that the adjusted encapsulation protective layer achieves the preset effect. If the encapsulation layer after the secondary thermal curing treatment still fails to meet the standard, the difference between the defect index and the preset standard will be calculated again, and the thermal curing angle will be readjusted according to the difference, and a new thermal curing treatment will be performed. This process can be repeated until the final encapsulation protective layer meets the preset quality standards.

[0043] Reference Figures 2 to 4 In one embodiment, a packaging device for a self-adjusting chip includes: a substrate 1; a rotating platform 2, the rotating platform 2 is connected to the substrate 1 through a rotating shaft 21, and a plurality of fixture platforms 3 are arranged on the rotating platform 2; a spraying component 4, the spraying component 4 is connected to the substrate 1 through a first bracket 6, and a spraying port of the spraying component 4 is arranged opposite to the fixture platform 3, and is used to spray packaging material onto the chip on the fixture platform 3; a thermal curing component 5, the thermal curing component 5 is connected to the substrate 1 through a second bracket 7, the heating port of the thermal curing component 5 is arranged opposite to the fixture platform 3, and the thermal curing component 5 rotates around the second bracket 7 to achieve all-round thermal curing treatment of the chip.

[0044] In this embodiment, the substrate 1 is the basic platform of the entire device, providing support and stability, and can also be effectively connected with other components. The substrate 1 is connected to the rotating platform 2 through a rotating shaft 21, so that the rotating platform 2 can rotate relative to the substrate 1. The existence of the rotating platform 2 can make multiple fixture platforms 3 evenly distributed and participate in the chip packaging process. The fixture platform 3 is used to place the chip, and with the rotation of the rotating platform 2, it can realize the processing of the chip in multiple directions, thereby ensuring that each chip can receive uniform spraying materials and thermal curing treatment. The connection between the rotating platform 2 and the substrate 1 is realized by the rotating shaft 21, allowing the rotating platform 2 to rotate accurately on the substrate 1, so that each chip can be aligned with the spraying component 4 and the thermal curing component 5 at an appropriate angle, thereby improving the processing efficiency. The spraying component 4 is connected to the substrate 1 through the first bracket 6, and also keeps the spraying port and the fixture platform 3 aligned, so that the spraying process can efficiently and evenly spray the packaging material onto the chip. The relative arrangement of the spray port of the spray assembly 4 and the fixture platform 3 ensures that the spray material can be evenly covered on the chip during the rotation of the rotating platform 2, avoiding packaging defects caused by uneven material coating. The thermal curing assembly 5 is connected to the substrate 1 through the second bracket 7, and the heating port is arranged relative to the fixture platform 3. At this time, the thermal curing assembly 5 realizes all-round thermal curing treatment of the chip by rotating around the second bracket 7. The rotational movement of the thermal curing assembly 5 can ensure that the packaging material is evenly heated and cured on the chip surface, avoiding hot spots or cold spots during the heating process, thereby improving the thermal curing effect and the overall quality of the package.

[0045] In one embodiment, the second bracket 7 includes a slide bar 71, a driving member 72 and a rotating shaft 73, the slide bar 71 is vertically connected to the substrate 1, and the end of the slide bar 71 away from the substrate 1 is connected to the driving member 72, so that the driving member 72 slides up and down along the slide bar 71; the rotating shaft 73 is parallel to the substrate 1 and connected to the driving member 72, and the end of the rotating shaft 73 away from the driving member 72 is connected to the thermal curing component 5, and the driving member 72 drives the rotating shaft 73 to rotate, so that the thermal curing component 5 rotates around the rotating shaft 73, thereby adjusting the position of the thermal curing component 5 to achieve thermal curing treatment of different parts of the chip.

[0046] In the above embodiment, the vertical connection between the slide bar 71 and the substrate 1 provides the stability of the entire support structure. When the device is started, the slide bar 71 provides a fixed sliding track. The driving member 72 is connected to the end of the slide bar 71 away from the substrate 1, and can slide up and down under the guidance of the slide bar 71, so that the driving member 72 can accurately control the position of the thermal curing component 5 according to the requirements, thereby adjusting the relative position of the thermal curing component 5 and the chip. When the device is working, the up and down sliding of the driving member 72 enables the thermal curing component 5 to move within the required height range. At the same time, the rotating shaft 73 is parallel to the substrate 1 and connected to the driving member 72, ensuring the stability of the thermal curing component 5 during the rotation process and avoiding shaking or offset caused by rotation. The driving member 72 realizes the rotation of the thermal curing component 5 around the rotating shaft 73 by driving the rotation of the rotating shaft 73. This rotation design not only enables the thermal curing component 5 to flexibly adjust its position to meet the packaging requirements of different chips, but also ensures that the heat can be evenly distributed during the thermal curing process, avoiding packaging quality problems caused by uneven heat distribution. Through the precise control of the driving member 72, the thermal curing component 5 can rotate at an appropriate speed and angle, thereby achieving thermal curing treatment of different parts of the chip, ensuring the accuracy and efficiency of the entire packaging process.

[0047] In one embodiment, the spray assembly 4 includes a spray head 41, a spray pump 42 and a spray controller 43. The spray head 41 is connected to the spray pump 42 to spray the packaging material from the spray head 41; the spray pump 42 is used to provide the pressure required for spraying, and evenly spray the packaging material from the spray head 41 onto the chip on the fixture platform 3; the spray controller 43 is used to control the spraying speed and spraying amount of the spray head 41.

[0048] In the above embodiment, the packaging material is loaded into the spray pump 42. When the device receives the spraying instruction, the spray pump 42 starts working and pushes the packaging material to the spray head 41 by generating a certain pressure. The spray head 41 has a fine nozzle design, which can ensure that the packaging material is sprayed in a uniform and fine mist. This not only improves the utilization rate of the packaging material, but also ensures that the packaging material can be evenly covered on the chip surface to avoid bubbles or accumulation. The spray controller 43 accurately adjusts the spray speed and spray amount of the spray head 41 according to the preset parameters or real-time feedback information. By adjusting the spray speed, the deposition rate of the packaging material on the chip can be controlled, thereby achieving precise control of the thickness of the packaging layer; and by adjusting the spray amount, it can be ensured that the amount of packaging material sprayed each time is moderate, so that neither material is wasted nor the packaging effect is poor due to insufficient material. This fine spray control provides a strong guarantee for the packaging quality of the chip.

[0049] In another embodiment, two circular movable plates are arranged between the spray head 41 and the spray pump 42, and a plurality of circular through holes are arranged on the circular movable plates. A plurality of cylinders are staggeredly installed between the two circular movable plates, and the two ends of the cylinders are fixedly connected to the two circular movable plates. When the spray pump 42 is working, the pressure generated pushes the packaging material to flow through the cylinder between the two circular movable plates. Due to the staggered installation of the cylinders, the packaging material is disturbed to a certain extent during the flow, which further promotes the uniform dispersion of the packaging material and enhances the uniformity of the packaging material.

[0050] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A packaging method for a self-regulating chip, characterized in that: The method comprises: A packaging device is provided, the packaging device comprising a rotating platform, a spraying component and a heat curing component, the rotating platform comprises a plurality of fixture platforms, the spraying component and the heat curing component are arranged above the fixture platforms at intervals; Acquire the initial coordinate value of the chip on the fixture platform, and acquire the surface features of the chip, and combine the initial coordinate value and the surface features to obtain first positioning data; Controlling the spraying assembly to spray the chip, acquiring a position offset of the chip during the spraying process based on the first positioning data, and adjusting a spraying path based on the position offset; Controlling the rotating platform to rotate a preset angle, and obtaining new coordinate values ​​and new surface features of the chip after rotation, to obtain second positioning data; Based on the second positioning data, control the thermal curing component to perform thermal curing around the chip to form a packaging protection layer; The performance test is performed on the encapsulation protection layer. If the encapsulation protection layer does not achieve the preset encapsulation effect, the thermal curing angle of the thermal curing component is adjusted until the encapsulation protection layer achieves the preset encapsulation effect.

2. The packaging method of the self-regulating chip according to claim 1, characterized in that: The step of obtaining the initial coordinate value of the chip on the fixture platform, obtaining the surface features of the chip, and combining the initial coordinate value and the surface features to obtain the first positioning data includes: Positioning the chip to obtain the initial coordinate value of the chip on the fixture platform, wherein the initial coordinate value includes the coordinate value of the chip in the three axes of X, Y, and Z; According to the initial coordinate value of the chip, the relative position between the chip and each fixture platform on the fixture platform is calculated to generate a relative position matrix; Scanning the chip surface to obtain surface feature data of the chip surface, wherein the surface feature data includes but is not limited to the undulation height and surface roughness of the chip surface; The undulation height and the surface roughness are combined to generate an influence coefficient matrix; The relative position matrix and the influence coefficient matrix are processed comprehensively to obtain first positioning data, wherein the first positioning data includes the optimized coordinate values ​​of the chip.

3. The packaging method of the self-regulating chip according to claim 1, characterized in that: The step of controlling the spraying assembly to spray the chip, acquiring the position offset of the chip during the spraying process based on the first positioning data, and adjusting the spraying path based on the position offset includes: Initializing a spraying path of a spraying component according to the first positioning data, and performing spraying processing on the chip according to the spraying path; During the spraying process, the actual position of the chip is detected, and the difference between the actual position of the chip and the initial coordinate value is obtained to obtain the position offset; Perform weighted calculation on the position offset in the X, Y, and Z axis directions to obtain the corrected spray path; The spraying assembly is controlled according to the corrected spraying path to spray the chip until the spraying is completed.

4. The packaging method of the self-regulating chip according to claim 1, characterized in that: The step of controlling the rotating platform to rotate by a preset angle, and obtaining new coordinate values ​​and new surface features of the chip after rotation, to obtain second positioning data includes: Setting the angle of the rotating platform, controlling the rotating platform to rotate according to the preset angle, and obtaining the rotation angle and rotation angle change information of the chip after rotation; Based on the rotation angle change information, a relative position change amount of the chip after rotation is acquired to obtain a coordinate offset amount of the chip after rotation; According to the coordinate offset of the chip after rotation, the new coordinate value of the chip after rotation is calculated, and the new coordinate value is calibrated to obtain the new coordinate value; Obtain the surface feature change information of the chip after the spraying treatment, including the new undulation height and new surface roughness of the chip surface, and generate a new influence coefficient matrix; The new coordinate values ​​and the new influence coefficient matrix are processed comprehensively to obtain second positioning data, wherein the second positioning data includes the optimized coordinate values ​​of the chip after rotation and characteristic change information of the chip surface.

5. The packaging method of the self-regulating chip according to claim 1, characterized in that: The step of controlling the thermal curing component to perform thermal curing around the chip based on the second positioning data to form a packaging protection layer includes: Analyzing the second positioning data to obtain a curing temperature range required for the chip during thermal curing; According to the curing temperature range, determining the rotation angle of the heat curing component required in the heat curing process to obtain a target heat curing rotation angle; According to the target thermal curing rotation angle, controlling the rotation angle of the thermal curing component, so that the thermal curing component performs thermal curing around the chip and maintains the temperature within a preset time to form an initial protective layer; After the thermal curing process is completed, the temperature of the chip surface is gradually reduced to form the protective layer.

6. The packaging method of the self-regulating chip according to claim 5, characterized in that: The step of determining the rotation angle of the heat curing component required in the heat curing process according to the curing temperature range to obtain the target heat curing rotation angle comprises: Subdividing the curing temperature range to obtain a plurality of temperature intervals; For each of the temperature intervals, based on historical experimental data, obtaining the optimal thermal curing angle of the chip in each temperature interval; generating a thermal curing angle curve according to the optimal thermal curing angle; The peak angle in the thermal curing angle curve is selected as the target thermal curing rotation angle.

7. The packaging method of the self-regulating chip according to claim 1, characterized in that: The step of performing a performance test on the encapsulation protection layer and adjusting the thermal curing angle of the thermal curing component until the encapsulation protection layer achieves the preset encapsulation effect if the encapsulation protection layer does not achieve the preset encapsulation effect comprises: Performing surface inspection on the encapsulation protection layer, scanning the thickness and flatness of the encapsulation protection layer using a surface scanning device to obtain surface data of the encapsulation protection layer; Calculating a defect index of the packaging protective layer based on the thickness and flatness data, and comparing it with a preset packaging standard to obtain a defect evaluation result; If the defect assessment result is that a defect exists, calculating an angle adjustment value according to a difference between the defect index and the packaging standard; Controlling the heat curing component to move according to the angle adjustment value, performing secondary heat curing treatment, and obtaining a new encapsulation protection layer; The testing process and the heat curing process are repeated until the encapsulation protection layer achieves a preset encapsulation effect.

8. A packaging device for a self-regulating chip, applied to the method according to any one of claims 1 to 7, characterized in that: include: substrate(1); A rotating platform (2), the rotating platform (2) being connected to the substrate (1) via a rotating shaft (21), and a plurality of fixture platforms (3) being arranged on the rotating platform (2); A spraying component (4), the spraying component (4) being connected to the substrate (1) via a first bracket (6), and a spraying port of the spraying component (4) being arranged opposite to the fixture platform (3) and being used for spraying packaging material onto the chip on the fixture platform (3); A heat curing component (5), the heat curing component (5) being connected to the substrate (1) via a second bracket (7), a heating port of the heat curing component (5) being arranged opposite to the fixture platform (3), and the heat curing component (5) rotating around the second bracket (7) to achieve all-round heat curing treatment of the chip.

9. The packaging device of the self-regulating chip according to claim 8, characterized in that: The second bracket (7) comprises a sliding rod (71), a driving member (72) and a rotating shaft (73); the sliding rod (71) is vertically connected to the base plate (1); an end of the sliding rod (71) away from the base plate (1) is connected to the driving member (72) so that the driving member (72) slides up and down along the sliding rod (71); The rotating shaft (73) is connected to the driving member (72) parallel to the substrate (1); one end of the rotating shaft (73) away from the driving member (72) is connected to the thermal curing component (5); the driving member (72) drives the rotating shaft (73) to rotate, thereby causing the thermal curing component (5) to rotate around the rotating shaft (73), thereby adjusting the position of the thermal curing component (5) and achieving thermal curing treatment of different parts of the chip.

10. The packaging device of the self-regulating chip according to claim 8, characterized in that: The spraying assembly (4) comprises a spraying head (41), a spraying pump (42) and a spraying controller (43); the spraying head (41) is connected to the spraying pump (42) and is used to spray the packaging material from the spraying head (41); the spraying pump (42) is used to provide the pressure required for spraying, so as to evenly spray the packaging material from the spraying head (41) onto the chip on the fixture platform (3); and the spraying controller (43) is used to control the spraying speed and spraying amount of the spraying head (41).

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