Transfer device for wafer film pasting

Abstract

A transfer device for wafer film pasting relates to the field of semiconductor processing, and comprises a workbench, the center of which is provided with a vertically moving top plate used for jacking up a storage plate; the bearing mechanism comprises two limiting plates arranged on the two sides of the workbench respectively, two connecting plates are arranged between the limiting plates, long-strip-shaped holes are formed in the side faces of the limiting plates and the side faces of the connecting plates, supporting plates moving in the length direction of the long-strip-shaped holes are arranged in the long-strip-shaped holes in a penetrating mode and used for supporting the storage plates, and a plurality of supporting plates which are arranged at intervals in the circumferential direction and used for supporting the storage plates are arranged between the limiting plates. The supporting strips move in opposite directions and are used for bearing a wafer; and the transfer mechanism comprises a bearing plate which is arranged above the workbench, moves in the length direction and the vertical direction of the workbench and is used for bearing the wafer, the bearing plate rotates around the axis of the bearing plate, two limiting strips which are symmetrically arranged and move in the vertical direction are arranged on the top surface of the bearing plate, and the transfer mechanism is used for limiting the circumferential side of the wafer and transferring the wafer to the supporting strips. According to the device, the wafer can be prevented from falling off in the transfer process, smooth production is ensured, and the wafer is prevented from being damaged.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a transfer device for wafer film pasting. Background Art

[0002] During the processing of semiconductor chips, a protective film is usually applied to the surface of the wafer in multiple steps. When applying the film to the surface of the wafer, a suction cup is usually used to transfer the wafer to the tooling, and then a film applying mechanism is used to cover the protective film on the surface of the wafer. After that, the suction cup is used again to transfer the wafer covered with the protective film from the tooling and move it to the storage plate, and finally the storage plate is transferred to the cassette. In actual operation, since the wafer is placed in a cassette, it is necessary to first take the wafer out of the cassette and then use a suction cup to transfer the wafer to the tooling. However, due to vibration during equipment operation, the suction cup may shake, causing the wafer to fall from under the suction cup, which is not conducive to smooth production. In addition, since the protective film covering the surface of the wafer usually extends beyond the surface of the wafer, and the protective film is made of a flexible material, after the suction cup absorbs the wafer with the film, the protective film will bend under its own gravity, and during the transfer process, the part of the protective film that extends beyond the wafer will further bend, causing the wafer to fall under the action of air resistance. In addition, when the coated wafer is placed on the storage plate and transferred to the tooling, the protective film may be folded under the wafer, causing damage to the wafer. Summary of the invention

[0003] In view of the deficiencies of the above-mentioned related prior arts, the present application provides a transfer device for wafer film pasting, which can prevent the wafer from falling during the transfer process, ensure the smooth progress of production, and avoid damage to the wafer, and has strong practicality.

[0004] In order to achieve the above object, the present invention adopts the following technologies: A transfer device for wafer film lamination comprises a workbench, a bearing mechanism and a transfer mechanism.

[0005] The workbench is provided with a top plate that is movable in the vertical direction, which is used to lift up a storage plate for placing wafers; the bearing mechanism includes two limit plates that are respectively installed on both sides of one end of the workbench, two connecting plates are provided between the limit plates, and long holes are provided on the sides of the limit plates and the connecting plates, and a supporting plate that is movable along its depth direction is passed through the long holes to support the storage plate for placing the wafers. When in use, the storage plate passes through the long holes on the limit plates, and a plurality of support bars that are arranged at intervals in the circumferential direction and are synchronously movable in the radial direction are provided on the circumferential side of the top plate to carry the wafers; the transfer mechanism includes a bearing plate that is arranged above the workbench and is movable along its length direction and vertical direction to carry the wafers, the bearing plate is rotatable around its own axis, and the top surface is provided with two limit bars that are symmetrically arranged and adjustable in spacing and movable in the vertical direction to limit the circumferential side of the wafer. When in use, the bearing plate is located between the support bars and transfers the wafer to the support bars.

[0006] Furthermore, the support plate is in an inverted L-shape, and the horizontal section is located on the inner side of the limit plate / connecting plate, and the bottom of the horizontal section is arc-shaped, and the vertical section is located on the outer side of the limit plate / connecting plate and is sleeved on the guide rod, which is installed on the limit plate / connecting plate. A first retaining ring is provided at the end of the guide rod, and a first spring is sleeved on the guide rod. The two ends of the first spring respectively abut against the vertical section and the first retaining ring of the support plate, and are always in a compressed state.

[0007] Furthermore, a plurality of limiting holes are provided along the circumferential direction on the top surface of the workbench, which are respectively extended radially along the top plate and penetrated up and down. The length direction of the limiting hole is parallel to the moving direction of the support bar. A moving ring is slidably fitted in the limiting hole, and a support rod is passed through the moving ring. The support bar is installed on the support rod, and a mounting block is sleeved on the support rod. The inner side of the mounting block is rotatably connected to one end of the connecting rod, and the other end of the connecting rod is rotatably connected to the lifting plate. The lifting plate is sleeved on the first screw and locked with a nut. The first screw 212 is installed at the bottom of the workbench 100, and the lower end of the support rod is slidably fitted in the lifting frame. The lifting frame is connected to the moving end of the third vertical lifting mechanism, and the third vertical lifting mechanism is installed at the bottom of the workbench.

[0008] Furthermore, a rectangular ring is provided above the limit plate, the rectangular ring is connected to the movable end of the first vertical lifting mechanism, the first vertical lifting mechanism is installed on the connecting plate, and a plurality of limit rods are provided at the bottom of the rectangular ring. When the rectangular ring is at the lowest point of its travel, the bottom of the limit rod is lower than the horizontal section of the support plate. When in use, the limit rod passes through the storage plate.

[0009] Furthermore, a push rod is provided on the inner side of the connecting plate. The push rod is U-shaped, and both sides are located in the long holes of the connecting plate. The bottom end is located in the long holes of one of the limit plates, and the inner side of the push rod is flush with the inner walls of the limit plate and the connecting plate. One end of the push rod is connected to the moving end of the first horizontal linear mechanism, and the first horizontal linear mechanism is installed on the connecting plate.

[0010] Furthermore, a first through slot and a second through slot are respectively provided at both ends of the bearing plate for passing a limit strip, and a side wall of the first through slot is provided with a slide slot extending toward the center of the bearing plate. The lower end of the limit strip can be detachably mounted on the slider, and the slider is mounted on the slide rod, and the slide rod below the second through slot is provided with a thread and a nut for locking the slider, and both ends of the slide rod are mounted on the vertical rod, the vertical rod is installed at the bottom of the bearing plate, and a second retaining ring is provided at the lower end, and a second spring is mounted on the vertical rod, and both ends of the second spring respectively abut against the slide rod and the second retaining ring, and are always in a compressed state.

[0011] Furthermore, one end of the slider below the first through slot is slidably engaged in the connecting block in the vertical direction, one end of the connecting block is connected to the moving end of the second horizontal linear mechanism, and the second horizontal linear mechanism is installed at the bottom of the bearing plate.

[0012] Furthermore, the transfer mechanism also includes a support seat arranged above one end of the workbench, the support seat is set through the center and a clamping ring is rotatably installed, and two symmetrically arranged clamping grooves are provided on the inner side of the clamping ring. When used, the two ends of the carrier plate are matched in the clamping grooves, and a pressure block is provided in one of the clamping grooves. A notch is provided on the outer side of the first through groove, and the pressure block is matched in the notch and abuts against the top surface of the limit strip.

[0013] Furthermore, the bottom of the carrying plate is rotatably installed in the support ring, the support ring is connected to the movable end of the second vertical lifting mechanism, the second vertical lifting mechanism is installed on the support frame, the support frame is movably arranged along the length direction of the workbench, and the bottom surface of the carrying plate is provided with a first positioning rod, a center rod and a support plate. The axis of the center rod is located on the rotation axis of the clamping ring and is passed through the support frame. When the carrying plate is located at the lowest point of its vertical travel, the first positioning rod is passed through the support frame. The bottom of the clamping ring is provided with a second positioning rod. When the carrying plate is located at the highest point of its vertical travel, the second positioning rod is passed through the support plate.

[0014] Furthermore, baffles are provided on both sides of the top surface of the support seat, and brackets are provided on the baffles. The brackets are sleeved on the second screw rod, and both ends of the second screw rod are installed on the convex plates, and the convex plates are installed on the support seat. Both ends of the second screw rod are sleeved with a third spring and a nut, and the nut is used to abut against the inner side of the bracket. The two ends of the third spring abut against the convex plate and the bracket respectively, and are always in a compressed state.

[0015] The beneficial effects of the present invention are as follows: the wafers are transferred by pushing, and the wafers are placed on the support bars by using a carrier plate, which can prevent the wafers from falling during the transfer process and ensure smooth production; when the wafers are filmed, the wafers are directly received by the storage plate, and after the filming is completed, the storage plate can be directly transferred, thereby avoiding the secondary transfer of the wafers, thereby improving production efficiency and avoiding damage to the wafers after the filming. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0017] Figure 1 It is a three-dimensional schematic diagram of the overall structure of an embodiment of the present application.

[0018] Figure 2 It is a three-dimensional schematic diagram of the carrying mechanism of an embodiment of the present application.

[0019] Figure 3 It is a three-dimensional schematic diagram of the cross-sectional structure of the supporting mechanism of an embodiment of the present application.

[0020] Figure 4 for Figure 3 An enlarged schematic diagram of point A.

[0021] Figure 5 It is a cross-sectional view of the supporting mechanism of an embodiment of the present application.

[0022] Figure 6 It is a three-dimensional schematic diagram of a carrying plate according to an embodiment of the present application.

[0023] Figure 7 This is a schematic diagram of the cross-sectional structure of the carrier plate according to an embodiment of the present application.

[0024] Figure 8 for Figure 7 An enlarged schematic diagram of point B.

[0025] Fig. 9 This is a schematic diagram of the baffle installation of an embodiment of the present application.

[0026] Fig.10 It is a schematic diagram of the cooperation between the carrier plate and the clamping ring according to an embodiment of the present application.

[0027] Description of the accompanying drawings: 100-working table, 200-carrying mechanism, 300-transfer mechanism, 101-top plate, 102-limiting hole, 103-moving ring, 201-limiting plate, 202-connecting plate, 203-long hole, 204-support plate, 205-support bar, 206-guide rod, 207-first retaining ring, 208-first spring, 209-support rod, 210-connecting rod, 211-lifting plate, 212-first screw rod, 213-rectangular ring, 214-limiting rod, 215-push rod, 216-mounting block, 217-lifting frame, 301-carrying Plate, 302-limiting strip, 303-first through slot, 304-second through slot, 305-slide slot, 306-slider, 307-slide rod, 308-vertical rod, 309-second retaining ring, 310-second spring, 311-support seat, 312-clamping ring, 313-clamping slot, 314-pressing block, 315-notch, 316-support ring, 317-support frame, 318-first positioning rod, 319-support plate, 320-second positioning rod, 321-center rod, 322-baffle, 323-bracket, 324-second screw, 325-convex plate, 326-third spring. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the implementation modes of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0029] like Figure 1 to Figure 10 As shown, an embodiment of the present application provides a transfer device for wafer film bonding, including: a workbench 100, a carrying mechanism 200, and a transfer mechanism 300.

[0030] The workbench 100 is provided with a top plate 101 movable in the vertical direction for lifting the storage plate, and a stop bar can be provided on the workbench 100 to abut against one side of the storage plate to prevent it from moving too far during being pushed onto the workbench 100; the bearing mechanism 200 includes two limit plates 201 respectively installed on both sides of one end of the workbench 100, and two connecting plates 202 are provided between the limit plates 201. When the storage plate is located on the workbench 100, the four sides of the storage plate are flush with the inner walls of the limit plates 201 and the connecting plates 202, and the storage plate is limited in the process of moving the storage plate upward in the vertical direction. The side surfaces of the limit plates 201 and the connecting plates 202 are provided with long holes 203, and the long holes 203 are penetrated by support plates 204 movable along their length direction for supporting the storage plate for placing wafers. After the wafer film is pasted, the storage plate is moved from The long holes 203 on the limiting plates 201 pass through, and a plurality of support bars 205 arranged at intervals along the circumferential direction are provided between the limiting plates 201. If the top plate 101 is set to be circular, the length direction of the support bars 205 is parallel to the radius of the top plate 101, and the support bars 205 are synchronously moved along the radial direction of the top plate 101 to carry the wafer; the transfer mechanism 300 includes a carrier plate 301 provided above the workbench 100 and movably provided along its length direction and vertical direction to carry the wafer. The carrier plate 301 is rotatably provided around its own axis, and two symmetrically arranged, adjustable spacing, and movably provided along the vertical direction are provided on the top surface to limit the circumferential side of the wafer. When the carrier plate 301 is located between the two limiting plates 201 and the carrier plate 301 is located between the support bars 205, the carrier plate 301 moves from top to bottom to transfer the wafer to the support bars 205.

[0031] When in use, the carrier plate 301 carrying the wafer is moved between the two limit plates 201, and then the carrier plate 301 is moved downward, the support bar 205 will lift the wafer, and then the carrier plate 301 is moved out from between the two limit plates 201, and then the top plate 101 is moved upward to lift the storage plate on the workbench 100, and at the same time, the support bar 205 is moved downward to make the storage plate lift the wafer until the storage plate is above the support plate 204, and the storage plate is supported by the support plate 204, and then the wafer film pasting operation can be carried out. After the film pasting is completed, the storage plate can be pushed away from the long strip hole 203.

[0032] Specifically, Figure 1-Figure 4As shown, the support plate 204 is in an inverted L-shape, and the horizontal section is located on the inner side of the limiting plate 201 / connecting plate 202, and the bottom of the horizontal section is arc-shaped, and the vertical section is located on the outer side of the limiting plate 201 / connecting plate 202, and is sleeved on the guide rod 206, and the guide rod 206 is installed on the limiting plate 201 / connecting plate 202. A first retaining ring 207 is provided at the end of the guide rod 206, and a first spring 208 is sleeved on the guide rod 206. The two ends of the first spring 208 are respectively abutted against the vertical section of the support plate 204 and the first retaining ring 207, and are always in a compressed state. When the storage is needed, When the plate receives the wafer, the storage plate is driven to move upward through the top plate 101, and the storage plate passes through the support bar 205. The wafer on the support bar 205 will be lifted by the storage plate. As the storage plate continues to move upward, the edge of the storage plate will contact the arc-shaped part of the support plate 204, and will force the support plate 204 to move, and the first spring 208 will be further compressed. After the storage plate completely passes through the support plate 204, the support plate 204 will be reset under the action of the first spring 208 to support the storage plate, and then the wafer can be filmed.

[0033] Specifically, Figure 2-Figure 3 As shown, during the resetting process of the support plate 204, the limiting plate 201 and other components will be impacted. In order to prevent the storage plate from being displaced due to the impact, a rectangular ring 213 is provided above the limiting plate 201. The rectangular ring 213 is connected to the moving end of the first vertical lifting mechanism. The first vertical lifting mechanism is installed on the connecting plate 202. A plurality of limiting rods 214 are provided at the bottom of the rectangular ring 213. When the storage plate moves upward, the rectangular ring 213 is driven downward by the first vertical lifting mechanism so that the rectangular ring 213 is located at the lowest point of its travel. At this time, the bottom of the limiting rod 214 is lower than the horizontal section of the support plate 204. When the storage plate has not yet contacted the support plate 204, the limiting rod 214 will first pass through the storage plate to limit the storage plate.

[0034] Specifically, Figure 2-Figure 5As shown, in order to adapt to wafers of different sizes and to improve the versatility of the device, a plurality of spaced-apart limiting holes 102 are provided on the top surface of the workbench 100 along the circumferential direction and penetrate up and down. The length direction of the limiting holes 102 is parallel to the moving direction of the support bar 205, and a moving ring 103 is slidably fitted in the limiting holes 102. A support rod 209 is passed through the moving ring 103. The support bar 205 is mounted on the support rod 209. A mounting block 216 is sleeved on the support rod 209. The inner side of the mounting block 216 is rotatably connected to one end of the connecting rod 210. The other end of the connecting rod 210 is rotatably connected to the lifting plate 211. The lifting plate 211 is sleeved on the first screw 212 and locked with a nut. The first screw 212 is installed at the bottom of the workbench 100. By driving the lifting plate 211 to move up and down, the support bars 205 can be synchronously driven to move closer to or away from each other. The lower end of the support rod 209 slides in the lifting frame 217, and the lifting frame 217 is connected to the moving end of the third vertical lifting mechanism. The third vertical lifting mechanism is installed at the bottom of the workbench 100. In the process of the storage plate moving upward, the lifting frame 217 is synchronously driven to move downward through the third vertical lifting mechanism, and the support bar 205 moves downward synchronously, so that the storage plate holds up the wafer to facilitate the subsequent wafer film pasting operation. In order to facilitate the transfer of the new storage plate to the workbench 100, the top of the support rod 209 is made flush with the top of the workbench 100. After the storage plate is transferred to the workbench 100, the support bar 205 can be driven to move upward again through the third vertical lifting mechanism to pass through the storage plate and wait for the wafer to be placed on the support bar 205; the pushing operation of the storage plate and the film pasting operation of the wafer can be carried out at the same time, thereby improving production efficiency.

[0035] Specifically, Figure 3 , Figure 5 As shown, a push rod 215 is provided on the inner side of the connecting plate 202. The push rod 215 is U-shaped, and both sides are located in the long holes 203 of the connecting plate 202. The bottom end is located in the long holes 203 of one of the limiting plates 201, and the inner sides of the push rod 215 are flush with the inner walls of the limiting plates 201 and the connecting plate 202. One end of the push rod 215 is connected to the moving end of the first horizontal linear mechanism, and the first horizontal linear mechanism is installed on the connecting plate 202. After the wafer film pasting operation is completed, the push rod 215 can be driven to move by the first horizontal linear mechanism to remove the storage plate from the area between the limiting plates 201.

[0036] Specifically, Figure 6-Figure 8As shown, both ends of the carrier plate 301 are respectively provided with a first through slot 303 and a second through slot 304 for passing the limiting strip 302, and the side wall of the first through slot 303 is provided with a slide slot 305 extending toward the center of the carrier plate 301 for passing the limiting strip 302, and the lower end of the limiting strip 302 is detachably mounted on a slider 306, and the slider 306 is sleeved on a slide rod 307, and the slide rod 307 located below the second through slot 304 is provided with a thread and a nut for locking the slider 306, and the slider 306 can be moved by rotating the nut, thereby adjusting the distance between the limiting strip 302 and the center of the carrier plate 301 to accommodate wafers of different sizes, and then the slider 306 can be locked again with the nut, and both ends of the slide rod 307 are sleeved on a vertical rod 308, and the vertical rod 308 is installed at the bottom of the carrier plate 301, and the lower end A second retaining ring 309 is provided, and a second spring 310 is sleeved on the vertical rod 308. The two ends of the second spring 310 are respectively abutted against the sliding rod 307 and the second retaining ring 309, and are always in a compressed state. Under the action of the second spring 310, the limit bar 302 always has a tendency to move upward, thereby ensuring the limiting effect on the wafer. Before pushing the wafer to the supporting plate 301, it is only necessary to apply a downward external force to the limit bar 302 above the first through groove 303 to make its top surface flush with the top surface of the supporting plate 301. During the transfer of the wafer, the wafer is supported by the supporting plate 301, and then the supporting plate 301 carrying the wafer is moved to the area surrounded by the limiting plate 201 and the connecting plate 202. Then, the supporting plate 301 is moved downward to place the wafer on the supporting bar 205.

[0037] Specifically, Figure 7-Figure 8 As shown, in order to facilitate adaptation to wafers of different sizes, one end of the slider 306 located below the first through groove 303 can be slidably engaged in the connecting block in the vertical direction, and one end of the connecting block is connected to the movable end of the second horizontal linear mechanism, and the second horizontal linear mechanism is installed at the bottom of the supporting plate 301. When the limit bar 302 is located above the supporting plate 301, the connecting block can be driven to move toward the center of the supporting plate 301 through the second horizontal linear mechanism.

[0038] Specifically, Figure 1 , Figure 9-10As shown, in order to facilitate pushing the wafer onto the carrier plate 301, the transfer mechanism 300 also includes a support seat 311 arranged above one end of the workbench 100, the support seat 311 is set through the center, and a retaining ring 312 is rotatably installed, the inner side of the retaining ring 312 is provided with two symmetrically arranged retaining grooves 313, and one of the retaining grooves 313 is provided with a pressing block 314, and a notch 315 is provided on the outer side of the first through groove 303. After the carrier plate 301 is moved out of the area of ​​the carrier mechanism 200, the carrier plate 301 is driven to move upward, so that the two ends of the carrier plate 301 are matched in the retaining grooves 313, and the top surface of the carrier plate 301 is flush with the top surface of the retaining ring 312, and The pressure block 314 fits in the notch 315 and abuts against the top surface of the limit strip 302. Under the action of the pressure block 314, the limit strip 302 above the first through groove 303 will be forced to move downward to be flush with the top surface of the carrier plate 301, ensuring that the wafer can be smoothly pushed between the two limit strips 302. Then, the retaining ring 312 is rotated 90 degrees, and the carrier plate 301 is driven to rotate synchronously to facilitate the transfer of the wafer. The rotation of the retaining ring 312 can be achieved by a gear and a gear ring structure, that is, a gear ring is set on the outer side of the retaining ring 312, and the gear ring is meshed with the gear. The rotation of the retaining ring 312 can be achieved by driving the gear to rotate through a power device.

[0039] Specifically, Figure 9-10As shown, in order to ensure that the wafer can be smoothly pushed onto the carrier plate 301, baffles 322 are provided on both sides of the top surface of the support seat 311, and brackets 323 are provided on the baffles 322. The brackets 323 are sleeved on the second screw rod 324. Both ends of the second screw rod 324 are mounted on the convex plate 325. The convex plate 325 is mounted on the support seat 311. Both ends of the second screw rod 324 are sleeved with a third spring 326 and a nut. The nut is located between the two brackets 323 and is used to abut against the inner side of the bracket 323. The two ends of the third spring 326 abut against the convex plate 325 and the nut respectively. The bracket 323 is always in a compressed state. The distance between the two baffles 322 can be adjusted by turning the nut to adapt to wafers of different sizes. During the upward movement of the carrier plate 301, one of the limit bars 302 is located in the first through groove 303, and then until the top surface of the carrier plate 301 is flush with the top surface of the retaining ring 312. At this time, one of the limit bars 302 moves downward under the action of the pressure block 314 to be flush with the top surface of the carrier plate 301, and the other limit bar 302 moves downward under the action of a baffle 322 to be flush with the carrier plate 301. The top surface of the carrier plate 301 is flush, and then the carrier plate 301 is rotated 90 degrees, so that the two limit bars 302 are located between the two baffles 322, and the line between the centers of the two limit bars 302 is parallel to the length direction of the baffle 322, and during the rotation of the carrier plate 301, the other limit bar 302 gradually loses contact with the bottom surface of the baffle 322, so that the limit bar 302 can be ejected under the action of the second spring 310, and then the wafer can be pushed onto the carrier plate 301, so that the wafer abuts against the limit bar 302, and then the carrier plate is 301 is reversed and reset. During the reversal process, another limit bar 302 will contact the inner side of the baffle 322 and force one baffle 322 to move in the direction away from the center of the retaining ring 312. After reversing 90 degrees, the carrier plate 301 is moved downward, and one of the limit bars 302 will gradually exceed the top surface of the carrier plate 301 until the carrier plate 301 is completely lower than the retaining ring 312. Then, one of the limit bars 302 can be driven to move toward the center of the carrier plate 301 to limit the wafer and prevent it from shifting during the transfer process.

[0040] Specifically, Figure 7-10As shown, the bottom of the carrier plate 301 is rotatably installed in the support ring 316, the support ring 316 is connected to the moving end of the second vertical lifting mechanism, the second vertical lifting mechanism is installed on the support frame 317, the support frame 317 moves along the length direction of the workbench 100, the bottom surface of the carrier plate 301 is provided with a first positioning rod 318, a center rod 321 and a support plate 319, the axis of the center rod 321 is located on the rotation axis of the clamping ring 312, and is penetrated in the support frame 317, and a second positioning rod 320 is provided at the bottom of the clamping ring 312. When the carrier plate 301 is located at the highest point of its vertical travel, , a second positioning rod 320 is passed through the support plate 319, while the first positioning rod 318 is not passed through the support frame 317. When the bearing plate 301 is located at the lowest point of its vertical travel, the first positioning rod 318 is passed through the support frame 317, while the second positioning rod 320 is not passed through the support plate 319. In addition, during the upward movement of the bearing plate 301, there is at least a period of time when the first positioning rod 318 is passed through the support frame 317, and the second positioning rod 320 is also passed through the support plate 319, thereby limiting the bearing plate 301 throughout the entire process to prevent it from rotating arbitrarily.

[0041] During actual operation, the support frame 317 is moved to the bottom of the support seat 311, and then the support ring 316 is driven to move upward through the second vertical lifting mechanism, and the supporting plate 301 is also driven to move upward synchronously. As the supporting plate 301 moves, the second positioning rod 320 is penetrated through the support plate 319, and then the first positioning rod 318 is moved out of the support frame 317 until the two ends of the supporting plate 301 are engaged in the slot 313, and the top surface of the supporting plate 301 is flush with the top surface of the retaining ring 312, and then the retaining ring 312 can be used to drive the supporting plate 301 to rotate 90 degrees. For the movement of the support frame 317, a gear rack structure can be adopted, which can also enhance the supporting effect of the support frame 317.

[0042] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A transfer device for wafer film bonding, characterized in that: include: A workbench (100) is movable in a vertical direction and is provided with a top plate (101) for lifting a storage plate for placing wafers; The carrying mechanism (200) comprises two limit plates (201) respectively arranged on both sides of the workbench (100) and two connecting plates (202) arranged between the limit plates (201); the limit plates (201) and the connecting plates (202) are both provided with elongated holes (203); a supporting plate (204) is passed through the elongated holes (203) and is arranged to move along the depth direction thereof, and is used to support a storage plate; when in use, the storage plate passes through the elongated holes (203) on the limit plates (201); a plurality of supporting bars (205) are arranged at intervals along the circumferential direction and are synchronously arranged to move along the radial direction, and are used to carry wafers; The transfer mechanism (300) comprises a carrier plate (301) disposed above the workbench (100) and movably disposed along the length direction and the vertical direction thereof, and used for carrying wafers. The carrier plate (301) is rotatably disposed around its own axis, and a top surface is provided with two symmetrically arranged limiting bars (302) with adjustable spacing and movably disposed along the vertical direction, and used for limiting the circumferential side of the wafer. When in use, the carrier plate (301) is located between the support bars (205), and the wafer is transferred to the support bars (205).

2. The wafer film transfer device according to claim 1, characterized in that: The support plate (204) is in an inverted L-shape, and the horizontal section is located inside the limiting plate (201) / the connecting plate (202), and the bottom is arc-shaped, and the vertical section is located outside the limiting plate (201) / the connecting plate (202) and is sleeved on the guide rod (206), the guide rod (206) is installed on the limiting plate (201) / the connecting plate (202), a first retaining ring (207) is provided at the end of the guide rod (206), and a first spring (208) is sleeved on the guide rod (206), and the two ends of the first spring (208) respectively abut against the vertical section of the support plate (204) and the first retaining ring (207), and are always in a compressed state.

3. The wafer film transfer device according to claim 1, characterized in that: The top surface of the workbench (100) is provided with a plurality of limiting holes (102) extending radially along the top plate (101) and penetrating up and down along the circumferential direction; a moving ring (103) is slidably fitted in the limiting hole (102); a support rod (209) is passed through the moving ring (103); the support bar (205) is mounted on the support rod (209); a mounting block (216) is sleeved on the support rod (209); the inner side of the mounting block (216) is rotatably connected to the connecting rod ( The connecting rod (210) is connected to one end of the connecting rod (210), and the other end of the connecting rod (210) is rotatably connected to the lifting plate (211). The lifting plate (211) is sleeved on the first screw rod (212) and locked with a nut. The first screw rod (212) is installed at the bottom of the workbench (100). The lower end of the support rod (209) is slidably matched in the lifting frame (217). The lifting frame (217) is connected to the moving end of the third vertical lifting mechanism. The third vertical lifting mechanism is installed at the bottom of the workbench (100).

4. The wafer film transfer device according to claim 2, characterized in that: A rectangular ring (213) is provided above the limit plate (201). The rectangular ring (213) is connected to the movable end of a first vertical lifting mechanism. The first vertical lifting mechanism is installed on the connecting plate (202). A plurality of limit rods (214) are provided at the bottom of the rectangular ring (213). When the rectangular ring (213) is located at the lowest point of its travel, the bottom of the limit rod (214) is lower than the horizontal section of the support plate (204). When in use, the limit rod (214) passes through the storage plate.

5. The wafer film transfer device according to claim 1, characterized in that: A push rod (215) is provided on the inner side of the connecting plate (202). The push rod (215) is U-shaped, and both sides are located in the long holes (203) of the connecting plate (202). The bottom end is located in the long holes (203) of one of the limiting plates (201). The inner side of the push rod (215) is flush with the inner walls of the limiting plate (201) and the connecting plate (202). One end of the push rod (215) is connected to the moving end of the first horizontal linear mechanism, and the first horizontal linear mechanism is installed on the connecting plate (202).

6. The wafer film transfer device according to claim 1, characterized in that: The two ends of the bearing plate (301) are respectively provided with a first through slot (303) and a second through slot (304) for passing the limiting strip (302); the side wall of the first through slot (303) is provided with a sliding slot (305) extending towards the center of the bearing plate (301); The lower end of the limit bar (302) is detachably mounted on the slider (306). The slider (306) is sleeved on the slide bar (307). The slide bar (307) located below the second through slot (304) is provided with a thread and a nut for locking the slider (306). Both ends of the slide bar (307) are sleeved on the vertical bar (308). The vertical bar (308) is mounted on the bottom of the bearing plate (301) and has a second retaining ring (309) at the lower end. A second spring (310) is sleeved on the vertical bar (308). Both ends of the second spring (310) are respectively abutted against the slide bar (307) and the second retaining ring (309) and are always in a compressed state.

7. The wafer film transfer device according to claim 6, characterized in that: One end of the sliding block (306) located below the first through slot (303) is slidably engaged in a connecting block in a vertical direction, and one end of the connecting block is connected to a moving end of a second horizontal linear mechanism, and the second horizontal linear mechanism is installed at the bottom of the supporting plate (301).

8. The wafer film transfer device according to claim 6, characterized in that: The transfer mechanism (300) further comprises a support seat (311) arranged above one end of the workbench (100); the support seat (311) is provided with a through-center and a snap ring (312) rotatably mounted thereon; two symmetrically arranged snap grooves (313) are provided on the inner side of the snap ring (312); when in use, the two ends of the carrier plate (301) fit into the snap grooves (313), and a pressure block (314) is provided in one of the snap grooves (313); a notch (315) is provided on the outer side of the first through groove (303); the pressure block (314) fits into the notch (315) and abuts against the top surface of the limit strip (302).

9. The wafer film transfer device according to claim 8, characterized in that: The bottom of the bearing plate (301) is rotatably mounted in a support ring (316), the support ring (316) is connected to a movable end of a second vertical lifting mechanism, the second vertical lifting mechanism is mounted on a support frame (317), the support frame (317) is movably arranged along the length direction of the workbench (100), the bottom surface of the bearing plate (301) is provided with a first positioning rod (318), a center rod (321) and a support plate (319), the axis of the center rod (321) is located on the rotation axis of the clamping ring (312), and is passed through the support frame (317), when the bearing plate (301) is located at the lowest point of its vertical travel, the first positioning rod (318) is passed through the support frame (317); A second positioning rod (320) is provided at the bottom of the clamping ring (312); when the bearing plate (301) is located at the highest point of its vertical travel, the second positioning rod (320) is inserted into the support plate (319).

10. The wafer film transfer device according to claim 8, characterized in that: Baffles (322) are provided on both sides of the top surface of the support seat (311), and brackets (323) are provided on the baffles (322). The brackets (323) are sleeved on the second screw rod (324), and both ends of the second screw rod (324) are mounted on the convex plate (325). The convex plate (325) is mounted on the support seat (311). Both ends of the second screw rod (324) are sleeved with a third spring (326) and a nut, and the nut is used to abut against the inner side of the bracket (323). Both ends of the third spring (326) abut against the convex plate (325) and the bracket (323) respectively, and are always in a compressed state.

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