LED chip sorting machine and LED chip sorting method

Abstract

The invention discloses an LED chip sorting machine and an LED chip sorting method, and relates to the technical field of chip sorting, the LED chip sorting machine comprises a track module, a wafer storage component, a wafer clamping and moving component, a chip top die sorting component, a wafer clamping and measuring jig, a roller type BIN separating blue film clamping component, a blue film clamping and moving component and a blue film storage component; the track module comprises a first wafer track, a second wafer track, a main track, a second blue film track and a first blue film track which are connected in sequence; the wafer storage component is arranged on the first wafer track; the blue film storage component is arranged on the first blue film track; the wafer clamping and moving component is arranged on the track module and conveys wafers back and forth between the wafer storage component and the wafer clamping and testing jig; the blue film clamping and moving component is arranged on the track module and conveys blue films back and forth between the blue film storage component and the roller type BIN blue film clamping component. By the adoption of the method and device, the back-and-forth clamping operation time of BIN blue film separation can be effectively shortened, and the LED separation efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip sorting, and in particular to an LED chip sorting machine and an LED chip sorting method. Background Art

[0002] LED chips need to be sorted after completing the front-end process and spot testing, which is generally called BIN sorting. At present, the main components of LED chip sorting machines on the market include wafer clamping and testing fixtures, BIN blue film clamping and testing fixtures, chip top mold sorting components, BIN blue film / wafer clamping mechanical arms and BIN blue film / wafer storage areas. The specific workflow is as follows: (1) During the sorting preparation stage of the machine, the BIN blue film / wafer gripping robot grabs the wafer to be sorted from the BIN blue film / wafer storage area, places it in the wafer clamping fixture, and clamps it; (2) The BIN blue film / wafer gripping robot grabs the BIN1 blue film from the BIN blue film / wafer storage area (according to the chip sorting rules, there are N BIN blue films, labeled BIN1 blue film, BIN2 blue film...), places it in the BIN blue film clamping fixture, and clamps it; (3) The chip top mold sorting component obtains the chip position information of the BIN1 blue film in the wafer from the computer, and transfers the BIN1 gear chip from the wafer to the BIN1 blue film through the ejector pin and nozzle components of the sorting machine; (4) When the transfer of the chip in BIN1 of the wafer is completed, the BIN blue film / wafer gripping robot grabs the BIN1 blue film and transfers it to the BIN blue film / wafer storage area; (5) The BIN blue film / wafer gripping robot grabs the BIN2 blue film from the BIN blue film / wafer storage area and transfers it to the wafer clamping fixture. Then, the chip top mold sorting component obtains the chip position information of the BIN2 blue film in the wafer from the computer, and transfers the BIN2 gear chip from the wafer to the BIN2 blue film through the ejector pin and nozzle components of the sorting machine. This process is repeated until the chips on the wafer are sorted according to the gear position, and then the chip sorting of wafer 2 is started.

[0003] As can be seen from the above, due to the different concentrations of parameters of different chip sources, the conventional sorting operation method does not classify the sorting sources, resulting in the fact that the biased BIN chips (the output rate of a single blue film is less than 0.5%) sometimes cannot be fully BINed for two or three months, the sorting machine has a high single BIN blue film occupancy rate, and the full BIN output rate is low; after a long period of accumulation, the biased BIN is easy to oxidize, which is easy to cause quality risks; and every time the sorting machine needs to change products for sorting and cleaning, the number of single chips of the biased BIN chips is small, wasting blue film resources, and the packaging factory's operation efficiency using such chips is also low (small number of single chips, need to frequently replace blue film); At the same time, the existing sorting machines do not perform integrated processing of BIN blue film. The LED sorting machines need to switch and move the BIN blue film back and forth over long distances, resulting in low sorting efficiency; especially when the chip size is large, the number of single BIN grains is small, and the back and forth clamping of the BIN blue film is more frequent, resulting in lower operating efficiency. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide an LED chip sorting machine and an LED chip sorting method, which can effectively reduce the running time of clamping back and forth of BIN blue film and improve the LED sorting efficiency.

[0005] In order to solve the above technical problems, the present invention provides an LED chip sorting machine, including a track module, a wafer storage component, a wafer clamping and moving component, a chip top mold sorting component, a wafer clamping and measuring fixture, a roller-type BIN blue film clamping component, a blue film clamping and moving component and a blue film storage component, wherein the roller-type BIN blue film clamping component is used to clamp a plurality of blue films at the same time; the track module includes a first wafer track, a second wafer track, a main track, a second blue film track and a first blue film track connected in sequence, and the chip top mold sorting component, the wafer clamping and measuring fixture and the roller-type BIN blue film clamping component are connected along the main track The transmission paths of the tracks are arranged in sequence; the wafer storage component is arranged on the first wafer track and moves back and forth along the first wafer track; the blue film storage component is arranged on the first blue film track and moves back and forth along the first blue film track; the wafer clamping moving component is arranged on the track module, and transports the wafer back and forth between the wafer storage component and the wafer clamping fixture along the second wafer track and the main track; the blue film clamping moving component is arranged on the track module, and transports the blue film back and forth between the blue film storage component and the roller-type BIN blue film clamping component along the second blue film track and the main track.

[0006] As an improvement of the above solution, the roller-type BIN blue film clamping component includes a turntable rotating in the vertical direction and a plurality of blue film clamping parts, and the blue film clamping parts are arranged in a circular array with the center of the turntable as the center of the circle.

[0007] As an improvement of the above solution, at least one magnetic block is provided on the blue film clamping piece.

[0008] As an improvement of the above scheme, the first wafer track, the second wafer track, the main track, the second blue film track and the first blue film track are all straight tracks; the transmission directions of the first wafer track, the main track and the first blue film track are parallel to each other; the transmission directions of the second wafer track and the second blue film track are parallel to each other; the transmission direction of the main track is perpendicular to the transmission direction of the second wafer track and the second blue film track.

[0009] As an improvement of the above scheme, the wafer storage component is provided with a plurality of wafer storage slots arranged in sequence along the transmission direction of the first wafer track, and / or the blue film storage component is provided with a plurality of blue film storage slots arranged in sequence along the transmission direction of the first blue film track.

[0010] As an improvement of the above-mentioned solution, the LED chip sorting machine also includes a wafer scanning gun and / or a blue film scanning gun; the wafer scanning gun is arranged at one end of the main track, and is used to scan the wafer information of the wafer clamped on the wafer clamping moving member; the blue film scanning gun is arranged at the other end of the main track, and is used to scan the blue film information of the blue film clamped on the blue film clamping moving member.

[0011] Correspondingly, the present invention also provides an LED chip sorting method based on an LED chip sorting machine, comprising: driving a wafer clamping moving component to clamp a wafer to be sorted from a wafer storage component and move it to a wafer clamping and testing fixture; driving a blue film clamping moving component to sequentially clamp a BIN blue film from a blue film storage component and move it to a roller-type BIN blue film clamping component, wherein the roller-type BIN blue film clamping component is provided with a target station; driving a chip top mold sorting component to clamp a wafer to be sorted on the wafer clamping and testing fixture; The target chip is sorted onto the BIN blue film of the target station, and the target chip is the chip belonging to the BIN blue film on the target station; when the target chip in the wafer to be sorted on the wafer clamping and testing jig is transferred, the roller-type BIN blue film clamping component is driven to move to update the BIN blue film on the target station, and the chips in the wafer to be sorted on the wafer clamping and testing jig are continued to be sorted until the chip sorting in the wafer to be sorted on the wafer clamping and testing jig is completed.

[0012] As an improvement of the above scheme, the wafer storage component is provided with a plurality of wafer storage slots arranged in sequence along the transmission direction of the first wafer track, and the wafers to be sorted are stored in the wafer storage slots respectively. The step of driving the wafer clamping moving component to clamp the wafers to be sorted from the wafer storage component includes: driving the first wafer track to move so that the wafer storage component moves synchronously with the first wafer track; when the wafer storage slot where the wafer to be sorted is located is aligned with the second wafer track, controlling the first wafer track to stop moving; driving the wafer clamping moving component to clamp the wafer to be sorted from the wafer storage component ; and / or the blue film storage component is provided with a plurality of blue film storage slots arranged in sequence along the transmission direction of the first blue film track, and the BIN blue films are stored in the blue film storage slots respectively, and the step of driving the blue film clamping moving component to clamp the BIN blue films from the blue film storage component in sequence includes: driving the first blue film track to move so that the blue film storage component moves synchronously with the first blue film track; when the blue film storage slot where the BIN blue film is located is aligned with the second wafer track, controlling the first blue film track to stop moving; driving the blue film clamping moving component to clamp the BIN blue film from the blue film storage component.

[0013] As an improvement of the above-mentioned scheme, the LED chip sorting method also includes: in the process of driving the wafer clamping moving component to move the wafer to be sorted to the wafer clamping and testing jig, driving the wafer scanning gun to scan the wafer information of the wafer to be sorted, and the wafer information includes chip point measurement information; in the process of driving the blue film clamping moving component to move the BIN blue film to the roller-type BIN blue film clamping component in sequence, driving the blue film scanning gun to scan the blue film information of the BIN blue film, and the blue film information includes gear information; when sorting the chips in the wafer to be sorted on the wafer clamping and testing jig, driving the chip top mold sorting component according to the wafer information and blue film information to sort the target chips in the wafer to be sorted on the wafer clamping and testing jig to the BIN blue film of the target station.

[0014] As an improvement of the above scheme, the LED chip sorting method also includes: obtaining chip point measurement information of each chip in the wafer to be sorted; dividing the chips into different sub-BIN levels according to the chip point measurement information; counting the number of chips corresponding to different sub-BIN levels; taking the sub-BIN level with the largest number of chips as the main BIN level of the wafer to be sorted; and allocating the wafer to be sorted to the corresponding LED chip sorting machine for sorting according to the main BIN level.

[0015] In summary, the present invention improves the structure of the LED chip sorting machine and introduces a unique LED chip sorting method, which can effectively reduce the running time of the BIN blue film back and forth clamping and improve the LED sorting efficiency and accuracy. Accordingly, the implementation of the present invention has the following beneficial effects: The LED chip sorting machine of the present invention adopts a track-type moving design, and a wafer clamping moving component and a blue film clamping moving component are respectively arranged on both sides of the roller-type BIN blue film clamping component, so as to realize the targeted track transmission of the wafer and the blue film, and the control is convenient; The roller-type BIN blue film clamping component of the present invention adopts a rotating clamping and measuring turntable structure, which integrates multiple blue film clamping parts into a whole, and can clamp multiple BIN blue films at the same time, reducing the machine operation stroke, realizing centralized processing of BIN blue films, and improving chip sorting operation efficiency; In addition, the present invention can greatly improve the chip BIN rate by pre-sorting the wafers to be sorted. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of a first embodiment of an LED chip sorting machine of the present invention; Figure 2 It is a schematic diagram of the structure of an embodiment of a roller-type BIN blue film clamping component in an LED chip sorting machine of the present invention; Figure 3 It is a schematic diagram of the structure of an embodiment of a blue film clamping part in an LED chip sorting machine of the present invention; Figure 4 It is a schematic diagram of the structure of an embodiment of a track module in an LED chip sorting machine of the present invention; Figure 5 It is a schematic diagram of the structure of an embodiment of a wafer storage component in an LED chip sorting machine of the present invention; Figure 6 It is a structural schematic diagram of a second embodiment of the LED chip sorting machine of the present invention; Figure 7 It is a flow chart of a first embodiment of an LED chip sorting method based on an LED chip sorting machine of the present invention; Figure 8 is a flow chart of a second embodiment of an LED chip sorting method based on an LED chip sorting machine of the present invention; Fig. 9 It is a flow chart of the third embodiment of the LED chip sorting method based on the LED chip sorting machine of the present invention. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. It is hereby stated that the directional terms such as up, down, left, right, front, back, inside, outside, etc. that appear or will appear in the text of the present invention are only based on the accompanying drawings of the present invention, and are not specific limitations of the present invention.

[0018] See also Figure 1 , Figure 1 The first embodiment of the LED chip sorting machine of the present invention is shown, which includes a track module, a wafer storage component 2, a wafer clamping and moving component 3, a chip top mold sorting component 4, a wafer clamping and measuring fixture 5, a roller-type BIN blue film clamping component 6, a blue film clamping and moving component 7 and a blue film storage component 8; the roller-type BIN blue film clamping component 6 is used to clamp several blue films at the same time, specifically: The track module includes a first wafer track 11, a second wafer track 12, a main track 13, a second blue film track 14 and a first blue film track 15 which are connected in sequence (see Figure 4 ), the chip top mold sorting component 4, the wafer clamping fixture 5 and the roller type BIN blue film clamping component 6 are arranged in sequence along the transmission path of the main track 13; The wafer storage member 2 is disposed on the first wafer track 11 and moves back and forth along the first wafer track 11; The blue film storage member 8 is disposed on the first blue film track 15 and moves back and forth along the first blue film track 15; The wafer clamping and moving member 3 is arranged on the track module, and transports the wafer back and forth between the wafer storage member 2 and the wafer clamping and testing fixture 5 along the second wafer track 12 and the main track 13; The blue film clamping and moving member 7 is arranged on the track module, and transports the blue film back and forth between the blue film storage member 8 and the roller type BIN blue film clamping member 6 along the second blue film track 14 and the main track 13 .

[0019] Different from the prior art, the LED chip sorting machine of the present invention adopts a track-type moving design, and a wafer clamping moving component 3 and a blue film clamping moving component 7 are respectively arranged on both sides of the roller-type BIN blue film clamping component 6, thereby realizing targeted track transmission of wafers and blue films and convenient control.

[0020] During operation, the wafer storage component 2 is first moved to a specific position through the first wafer track 11, so that the wafer clamping moving component 3 can clamp the wafer; then, the wafer to be sorted is clamped in the wafer storage component 2 through the wafer clamping moving component 3, and the wafer to be sorted is transferred to the wafer clamping fixture 5 along the second wafer track 12 and the main track 13; at the same time, the blue film storage component 8 is moved to a specific position through the first blue film track 15, so that the blue film clamping moving component 7 can clamp the BIN blue film; then, the BIN blue film is clamped in the blue film storage component 8 through the blue film clamping moving component 7, and the BIN blue film is transferred to the roller-type BIN blue film clamping component 6 along the second blue film track 14 and the main track 13; finally, the chip in the wafer to be sorted is transferred to the BIN blue film through the chip top mold sorting component 4.

[0021] like Figure 2 As shown, the roller-type BIN blue film clamping component 6 includes a turntable 61 rotating in the vertical direction and a plurality of blue film clamping members 62 , and the blue film clamping members 62 are arranged in a circular array with the center of the turntable 61 as the center.

[0022] In the prior art, the BIN blue film clamping and testing fixture is a single blue film clamping and testing structure, and can only clamp one blue film at a time. Different from the prior art, the roller-type BIN blue film clamping component 6 in the present invention adopts a rotating clamping and testing turntable structure, and the roller-type BIN blue film clamping component 6 is designed with multiple blue film clamping parts 62, which can clamp multiple BIN blue films at the same time.

[0023] For example, the roller-type BIN blue film clamping component 6 is provided with 12 blue film clamping parts A1~A12, that is, the roller-type BIN blue film clamping component 6 corresponds to 12 workstations C1~C12 and 12 BIN blue films B1~B12. At the same time, the wafer clamping fixture 5 is provided with wafers to be sorted, and 6 types of chips L1~L6 are arranged thereon.

[0024] When clamping the BIN blue film, first transfer the BIN blue film B1 from the blue film storage component 8 to the blue film clamping component A1 (i.e., station C1) through the blue film clamping moving component 7, then, the turntable 61 rotates to the next station (i.e., station C2), and then transfer the BIN blue film B2 from the blue film storage component 8 to the blue film clamping component A2 (i.e., station C2) through the blue film clamping moving component 7, and repeat this process until the clamping of other BIN blue films (B3~B12) is completed.

[0025] During the sorting process, the chip top mold sorting component 4 can first transfer all the chips L1 in the wafer to be sorted to the BIN blue film B1 (i.e., station C1), and then the turntable 61 rotates to the next station (i.e., station C2), and then the chip top mold sorting component 4 transfers all the chips L2 in the wafer to be sorted to the BIN blue film B2 (i.e., station C2), and so on and so forth until the clamping of other chips (L3~L6) is completed.

[0026] Therefore, the present invention integrates multiple blue film clamps 62 into a whole. After each BIN blue film is sorted, the turntable 61 rotates to the next workstation and can enter the sorting of the next type of chip. This reciprocating motion reduces the back and forth storage and retrieval action of the BIN blue film, reduces the machine's operating stroke, realizes centralized processing of the BIN blue film, and improves the efficiency of chip sorting operations.

[0027] like Figure 3 As shown, at least one magnetic block 63 is provided on the blue film clamping piece 62, which can facilitate the flexible clamping of the BIN blue film and is easy to operate.

[0028] like Figure 4 As shown, in this embodiment, the first wafer track 11, the second wafer track 12, the main track 13, the second blue film track 14 and the first blue film track 15 are all straight tracks; the transmission directions of the first wafer track 11, the main track 13 and the first blue film track 15 are parallel to each other; the transmission directions of the second wafer track 12 and the second blue film track 14 are parallel to each other; the transmission direction of the main track 13 and the transmission directions of the second wafer track 12 and the second blue film track 14 are perpendicular to each other.

[0029] In other embodiments, other forms may be designed as long as smooth interconnection between the tracks can be achieved.

[0030] like Figure 5 As shown, the wafer storage component 2 is provided with a plurality of wafer storage slots 21 arranged in sequence along the transmission direction of the first wafer track 11 .

[0031] In the prior art, a wafer storage component 2 is provided with a plurality of wafer storage slots 21 arranged in sequence along the vertical direction to cooperate with the existing wafer clamping robot arm; different from the prior art, the wafer storage slots 21 in the present invention are arranged in sequence along the transmission direction (preferably the horizontal direction) of the first wafer track 11 to cooperate with the wafer clamping moving component 3 in the present invention.

[0032] Similarly, the blue film storage component 8 is provided with a plurality of blue film storage slots arranged in sequence along the transmission direction of the first blue film track 15 .

[0033] See also Figure 6 , Figure 6 The second embodiment of the LED chip sorting machine of the present invention is shown. Figure 1 The difference from the first embodiment shown is that in this embodiment, the LED chip sorting machine further includes a wafer barcode scanning gun 9 and a blue film barcode scanning gun 10, wherein: The wafer barcode scanning gun 9 is arranged at one end of the main track 13, and is used to scan the wafer information of the wafer clamped by the wafer clamping moving member 3; The blue film barcode scanning gun 10 is disposed at the other end of the main track 13 and is used for scanning the blue film information of the blue film clamped by the blue film clamping moving member 7 .

[0034] It should be noted that, in the process of the wafer clamping moving component 3 moving the wafer to be sorted to the wafer clamping and testing jig 5, the wafer scanning gun 9 can scan the wafer information of the wafer to be sorted in real time. Similarly, in the process of the blue film clamping moving component 7 successively moving the BIN blue film to the roller-type BIN blue film clamping component 6, the blue film scanning gun 10 scans the blue film information of the BIN blue film. Therefore, when sorting the chips in the wafer to be sorted on the wafer clamping and testing jig 5, the chip top mold sorting component 4 can be driven according to the wafer information and the blue film information to sort the chips in the wafer to be sorted on the wafer clamping and testing jig 5 to the corresponding BIN blue film.

[0035] In practical applications, the wafer barcode scanning gun 9 and the blue film barcode scanning gun 10 can be set as needed according to actual needs, which has strong flexibility.

[0036] Therefore, the LED chip sorting machine of the present invention can effectively reduce the running time of clamping the BIN blue film back and forth, and improve the LED sorting efficiency.

[0037] See also Figure 7 , Figure 7 The flowchart of the first embodiment of the LED chip sorting method based on the LED chip sorting machine of the present invention is shown, which includes: S101, driving the wafer clamping moving component to clamp the wafer to be sorted from the wafer storage component and move it to the wafer clamping and testing fixture; like Figure 1 As shown, the wafer storage component 2 is provided with a plurality of wafer storage slots 21 arranged in sequence along the transmission direction of the first wafer track 11 , and the wafers to be sorted are stored in the wafer storage slots 21 respectively.

[0038] Further, the step of driving the wafer grabbing moving component to grab the wafer to be sorted from the wafer storage component includes: (1) driving the first wafer track 11 to move so that the wafer storage member 2 moves synchronously with the first wafer track 11; (2) When the wafer storage slot 21 where the wafer to be sorted is located is aligned with the second wafer track 12, the first wafer track 11 is controlled to stop moving; (3) driving the wafer grabbing moving member 3 to grab the wafer to be sorted from the wafer storage member 2; Therefore, the present invention can move the wafer storage component 2 so that the second wafer track 12 is aligned with different wafer storage slots 21 respectively, thereby facilitating the wafer clamping moving component 3 to clamp / place different wafers to be sorted from the wafer storage component 2.

[0039] S102, driving the blue film clamping moving component to sequentially clamp the BIN blue films from the blue film storage component and move them to the roller-type BIN blue film clamping component; It should be noted that the roller type BIN blue film clamping member 6 is provided with a plurality of workstations; generally, a specific position can be used as a target workstation; For example, there are 12 workstations C1~C12 on the roller-type BIN blue film clamping component 6, among which the lowest point can be selected as the target workstation. During the rotation of the roller-type BIN blue film clamping component 6, the BIN blue film on the target workstation keeps changing to facilitate the rapid switching of the BIN blue film.

[0040] like Figure 1 As shown, the blue film storage component 8 is provided with a plurality of blue film storage slots arranged in sequence along the transmission direction of the first blue film track 15, and the BIN blue films are stored in the blue film storage slots respectively.

[0041] Further, the step of driving the blue film clamping moving component to sequentially clamp the BIN blue films from the blue film storage component includes: (1) driving the first blue film track 15 to move so that the blue film storage member 8 moves synchronously with the first blue film track 15; (2) When the blue film storage slot where the BIN blue film is located is aligned with the second wafer track 12, the first blue film track 15 is controlled to stop moving; (3) Drive the blue film grabbing and moving member 7 to grab the BIN blue film from the blue film storage member 8.

[0042] Similarly, the present invention can move the blue film storage component 8 so that the second blue film track 14 is aligned with different blue film storage slots, thereby facilitating the blue film clamping moving component 7 to clamp / place different BIN blue films from the blue film storage component 8.

[0043] For example, 12 workstations C1~C12 are provided on the roller-type BIN blue film clamping component 6, and 12 BIN blue films B1~B12 are provided in the blue film storage component 8; in the process of moving all the BIN blue films to the roller-type BIN blue film clamping component 6, the blue film clamping moving component 7 is first driven to transfer the BIN blue film B1 from the blue film storage component 8 to the workstation C1, and then the turntable 61 rotates to the next workstation (i.e., workstation C2), and then the blue film clamping moving component 7 is used to transfer the BIN blue film B2 from the blue film storage component 8 to the workstation C2, and this process is repeated until the transfer of other BIN blue films (B3~B12) is completed.

[0044] S103, driving the chip top mold sorting component to sort the target chip in the wafer to be sorted on the wafer clamping fixture to the BIN blue film of the target station; It should be noted that there are different types of chips in the wafer to be sorted, and the purpose of chip sorting is to sort the chips of the same type onto the same BIN blue film, that is, a BIN blue film only corresponds to one type of chip; and the target chip in the present invention is the chip with the BIN blue film on the target station.

[0045] For example, the roller-type BIN blue film clamping component 6 is provided with 12 workstations C1~C12 and 12 BIN blue films B1~B12. At the same time, the wafer clamping fixture 5 is provided with wafers to be sorted, which are provided with 12 types of chips L1~L12; then chip L1 is the target chip belonging to the BIN blue film B1 on the workstation C1, chip L2 is the target chip belonging to the BIN blue film B2 on the workstation C2, and so on.

[0046] S104, when the target chip in the wafer to be sorted on the wafer clamping fixture is transferred, drive the roller-type BIN blue film clamping component to move to update the BIN blue film on the target station, and return to step S103 to continue sorting the chips in the wafer to be sorted on the wafer clamping fixture until the chips in the wafer to be sorted on the wafer clamping fixture are sorted.

[0047] For example, the roller-type BIN blue film clamping component 6 is provided with 12 workstations C1~C12 and 12 BIN blue films B1~B12. At the same time, the wafer clamping fixture 5 is provided with a wafer to be sorted, on which are arranged 12 types of chips L1~L12; during the sorting process, the chip top mold sorting component 4 can first transfer all the chips L1 in the wafer to be sorted to the BIN blue film B1 (i.e., workstation C1), and then the turntable 61 rotates to the next workstation (i.e., workstation C2), and then the chip top mold sorting component 4 transfers all the chips L2 in the wafer to be sorted to the BIN blue film B2 (i.e., workstation C2), and so on and so forth until the sorting of other chips is completed.

[0048] Furthermore, if the BIN blue film on the target workstation reaches the requirement for the number of sorted grains (i.e., the BIN blue film is full of chips), the blue film clamping moving component 7 can be driven to clamp the BIN blue film that meets the requirement for the number of sorted grains from the roller-type BIN blue film clamping component 6 and move it to the blue film storage component 8; at the same time, the blue film clamping moving component 7 is driven to clamp the empty BIN blue film from the blue film storage component 8 and move it to the roller-type BIN blue film clamping component 6, thereby realizing the replacement of the BIN blue film.

[0049] More preferably, a replacement station for replacing the BIN blue film can be set on the roller-type BIN blue film clamping component 6, and the replacement station is different from the target station, thereby ensuring that chip sorting and blue film replacement are carried out at different stations respectively, reducing the waiting time for replacing the BIN blue film due to the BIN blue film being full.

[0050] For example, the roller-type BIN blue film clamping component 6 is provided with 12 workstations C1-C12, among which the lowest point can be selected as the replacement workstation, and the previous workstation position of the replacement workstation can be selected as the target workstation.

[0051] In addition, when there are many BINs in the wafer (that is, there are many types of chips in the wafer), the wafer can be sorted multiple times by multiple LED chip sorting machines.

[0052] For example, there are 12 workstations on the roller-type BIN blue film clamping component 6, and the wafer has 22 types of chips L1~L22, which can be sorted twice. The LED chip sorting machine E1 sorts the chips L1~L12, and the LED chip sorting machine E2 sorts the chips L13~L22; thereby solving the problem of insufficient BIN blue film clamping positions in the roller-type BIN blue film clamping component 6 due to the large number of BINs in the wafer.

[0053] See also Figure 8 , Figure 8 The flowchart of the second embodiment of the LED chip sorting method based on the LED chip sorting machine of the present invention is shown, which includes: S201, driving the wafer clamping moving component to clamp the wafer to be sorted from the wafer storage component and move it to the wafer clamping and testing fixture; S202, in the process of driving the wafer clamping moving component to move the wafer to be sorted to the wafer clamping and testing fixture, driving the wafer barcode scanning gun to scan the wafer information of the wafer to be sorted; It should be noted that two-dimensional code information is provided on the wafer to be sorted, and the wafer information of the wafer to be sorted can be obtained from the memory by scanning the two-dimensional code information, and the wafer information includes chip point measurement information.

[0054] S203, driving the blue film clamping moving component to sequentially clamp the BIN blue films from the blue film storage component and move them to the roller-type BIN blue film clamping component; S204, driving the blue film clamping moving component to sequentially move the BIN blue film to the roller-type BIN blue film clamping component, and driving the blue film barcode scanning gun to scan the blue film information of the BIN blue film; Similarly, a two-dimensional code information is provided on the sub-BIN blue film, and the blue film information of the sub-BIN blue film can be obtained from the memory by scanning the two-dimensional code information, or the blue film information can be allocated to the blank sub-BIN blue film, and the blue film information includes the gear information; For example, when the sorting process is first started, the BIN blue films in the blue film storage component 8 are all blank blue films. At this time, each time a blank blue film is transferred from the blue film storage component 8 to the roller-type BIN blue film clamping component 6, blue film information is allocated to the corresponding blank blue film.

[0055] For another example, when the sorting process is started again, the blue film storage component 8 may store blue film that has been used but has not filled up the BIN. At this time, if the blue film is transferred from the blue film storage component 8 to the roller-type BIN blue film clamping component 6, the blue film information of the blue film can be obtained from the memory by scanning the QR code information; thereby ensuring that a piece of blue film corresponds to one type of LED chip.

[0056] S205, according to the wafer information and blue film information, the chip top mold sorting component is driven to sort the target chip in the wafer to be sorted on the wafer clamping fixture to the BIN blue film of the target station; Since multiple BIN blue films are clamped in the roller-type BIN blue film clamping component 6, the controller can search for the position of the corresponding target chip in the wafer according to the blue film information of the BIN blue film on the target station, thereby accurately driving the chip top mold sorting component 4 to take out the target chip from the wafer and place it on the BIN blue film at the target station; when the sorting is completed, the wafer information of the corresponding wafer in the controller needs to be updated synchronously.

[0057] S206, when the target chip in the wafer to be sorted on the wafer clamping jig is transferred, drive the roller-type BIN blue film clamping component to move to update the BIN blue film on the target workstation, and return to step S205 to continue sorting the chips in the wafer to be sorted on the wafer clamping jig until the chips in the wafer to be sorted on the wafer clamping jig are sorted.

[0058] Therefore, the LED chip sorting method based on the LED chip sorting machine of the present invention can achieve precise control of sorting with high accuracy.

[0059] See also Fig. 9 , Fig. 9The flowchart of the third embodiment of the LED chip sorting method based on the LED chip sorting machine of the present invention is shown, which includes: S301, obtaining chip spot measurement information of each chip in the wafer to be sorted; S302, classifying the chip into different sub-BIN levels according to the chip point measurement information; S303, counting the number of chips corresponding to different sub-BIN levels; S304, taking the sub-BIN level with the largest number of chips as the main BIN level of the wafer to be sorted; S305, allocating the wafers to be sorted to the corresponding LED chip sorting machine for sorting according to the main BIN level.

[0060] Since the smaller the chip output grade output ratio, the more wafers need to be sorted for the corresponding grade BIN blue film full BIN output rate, and the longer the sorting time is required. Therefore, steps S301 to S305 are introduced in this embodiment to classify the wafers to be sorted.

[0061] For example, there are 20 chips classified as level F1, 100 chips classified as level F2, 200 chips classified as level F3, and 120 chips classified as level F4 in the wafer to be sorted; then the main BIN level of the wafer to be sorted is F3.

[0062] Generally speaking, wafers to be sorted of the same main BIN level can be assigned to the same LED chip sorting machine for sorting to improve the chip BIN rate.

[0063] For example, the main BIN level of the wafer Q1 to be sorted is F3, the main BIN level of the wafer Q2 to be sorted is F1, and the main BIN level of the wafer Q3 to be sorted is F3. Then the wafer Q1 to be sorted and the wafer Q3 to be sorted can be assigned to the same LED chip sorting machine for sorting.

[0064] S306, driving the wafer clamping and moving component to clamp the wafer to be sorted from the wafer storage component and move it to the wafer clamping and testing fixture; S307, in the process of driving the wafer clamping moving component to move the wafer to be sorted to the wafer clamping and testing fixture, driving the wafer barcode scanning gun to scan the wafer information of the wafer to be sorted; S308, driving the blue film clamping moving component to sequentially clamp the BIN blue films from the blue film storage component and move them to the roller-type BIN blue film clamping component; S309, driving the blue film clamping moving component to sequentially move the BIN blue film to the roller-type BIN blue film clamping component, and driving the blue film barcode scanning gun to scan the blue film information of the BIN blue film; S310, driving the chip top mold sorting component to sort the target chip in the wafer to be sorted on the wafer clamping fixture to the BIN blue film of the target station according to the wafer information and the blue film information; S311, when the target chip in the wafer to be sorted on the wafer clamping jig is transferred, drive the roller-type BIN blue film clamping component to move to update the BIN blue film on the target workstation, and return to step S310 to continue sorting the chips in the wafer to be sorted on the wafer clamping jig until the chip sorting in the wafer to be sorted on the wafer clamping jig is completed.

[0065] As can be seen from the above, the present invention improves the structure of the LED chip sorting machine and introduces a unique LED chip sorting method, which can effectively reduce the running time of clamping the BIN blue film back and forth and improve the LED sorting efficiency and accuracy.

[0066] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. An LED chip sorting machine, characterized in that: It includes a track module, a wafer storage component, a wafer clamping and moving component, a chip top mold sorting component, a wafer clamping and testing fixture, a roller-type BIN blue film clamping component, a blue film clamping and moving component and a blue film storage component. The roller-type BIN blue film clamping component is used to clamp several blue films at the same time; The track module includes a first wafer track, a second wafer track, a main track, a second blue film track and a first blue film track which are connected in sequence, and the chip top mold sorting component, the wafer clamping fixture and the roller type BIN blue film clamping component are arranged in sequence along the transmission path of the main track; The wafer storage component is arranged on the first wafer track and moves back and forth along the first wafer track; The blue film storage component is arranged on the first blue film track and moves back and forth along the first blue film track; The wafer clamping and moving component is arranged on the track module, and transports the wafer back and forth between the wafer storage component and the wafer clamping and testing fixture along the second wafer track and the main track; The blue film clamping and moving component is arranged on the track module, and transports the blue film back and forth between the blue film storage component and the roller type BIN blue film clamping component along the second blue film track and the main track.

2. The LED chip sorting machine according to claim 1, characterized in that: The roller-type BIN blue film clamping component comprises a turntable rotating in a vertical direction and a plurality of blue film clamping parts, wherein the blue film clamping parts are arranged in a circular array with the center of the turntable as the center of the circle.

3. The LED chip sorting machine according to claim 2, characterized in that: At least one magnetic block is arranged on the blue film clamping piece.

4. The LED chip sorting machine according to claim 1, characterized in that: The first wafer track, the second wafer track, the main track, the second blue film track and the first blue film track are all linear tracks; The transmission directions of the first wafer track, the main track and the first blue film track are parallel to each other; The transmission directions of the second wafer track and the second blue film track are parallel to each other; The transmission direction of the main track is perpendicular to the transmission directions of the second wafer track and the second blue film track.

5. The LED chip sorting machine according to claim 1, characterized in that: The wafer storage component is provided with a plurality of wafer storage slots arranged in sequence along the transmission direction of the first wafer track, and / or the blue film storage component is provided with a plurality of blue film storage slots arranged in sequence along the transmission direction of the first blue film track.

6. The LED chip sorting machine according to claim 1, characterized in that: It also includes wafer barcode scanners and / or blue film barcode scanners; The wafer barcode scanning gun is arranged at one end of the main track, and is used to scan the wafer information of the wafer clamped by the wafer clamping moving member; The blue film barcode scanning gun is arranged at the other end of the main track, and is used for scanning the blue film information of the blue film clamped by the blue film clamping moving member.

7. A method for sorting LED chips based on the LED chip sorting machine according to any one of claims 1 to 6, characterized in that: include: Drive the wafer clamping and moving component to clamp the wafer to be sorted from the wafer storage component and move it to the wafer clamping and testing fixture; The blue film clamping moving component is driven to sequentially clamp the BIN blue film from the blue film storage component and move it to the roller-type BIN blue film clamping component, on which a target station is provided; The chip top mold sorting component is driven to sort the target chip in the wafer to be sorted on the wafer clamping and testing fixture onto the BIN blue film of the target station, wherein the target chip is the chip belonging to the BIN blue film on the target station; When the target chip in the wafer to be sorted on the wafer clamping jig is transferred, the roller-type BIN blue film clamping component is driven to move to update the BIN blue film on the target station, and the chips in the wafer to be sorted on the wafer clamping jig are continued to be sorted until the chip sorting in the wafer to be sorted on the wafer clamping jig is completed.

8. The LED chip sorting method according to claim 7, characterized in that: The wafer storage component is provided with a plurality of wafer storage slots sequentially arranged along the transmission direction of the first wafer track, and the wafers to be sorted are respectively stored in the wafer storage slots. The step of driving the wafer clamping moving component to clamp the wafers to be sorted from the wafer storage component comprises: driving the first wafer track to move so that the wafer storage component moves synchronously with the first wafer track; when the wafer storage slot where the wafer to be sorted is located is aligned with the second wafer track, controlling the first wafer track to stop moving; driving the wafer clamping moving component to clamp the wafer to be sorted from the wafer storage component; and / or The blue film storage component is provided with a plurality of blue film storage slots arranged in sequence along the transmission direction of the first blue film track, and the BIN blue films are stored in the blue film storage slots respectively. The step of driving the blue film clamping moving component to clamp the BIN blue films from the blue film storage component in sequence includes: driving the first blue film track to move so that the blue film storage component moves synchronously with the first blue film track; when the blue film storage slot where the BIN blue film is located is aligned with the second wafer track, controlling the first blue film track to stop moving; driving the blue film clamping moving component to clamp the BIN blue film from the blue film storage component.

9. The LED chip sorting method according to claim 7, characterized in that: Also includes: In the process of driving the wafer clamping moving component to move the wafer to be sorted to the wafer clamping and testing fixture, driving the wafer barcode scanning gun to scan the wafer information of the wafer to be sorted, wherein the wafer information includes chip spot testing information; In the process of driving the blue film clamping moving component to sequentially move the BIN blue film to the roller-type BIN blue film clamping component, driving the blue film barcode scanning gun to scan the blue film information of the BIN blue film, wherein the blue film information includes the gear position information; When sorting the chips in the wafer to be sorted on the wafer clamping fixture, the chip top mold sorting component is driven according to the wafer information and the blue film information to sort the target chips in the wafer to be sorted on the wafer clamping fixture onto the BIN blue film of the target station.

10. The LED chip sorting method according to claim 7, characterized in that: Also includes: Obtaining chip spot measurement information of each chip in the wafer to be sorted; Dividing the chip into different sub-BIN levels according to the chip point measurement information; Count the number of chips corresponding to different sub-BIN levels; The sub-BIN level with the largest number of chips is used as the main BIN level of the wafer to be sorted; The wafers to be sorted are allocated to corresponding LED chip sorting machines for sorting according to the main BIN level.

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