LED Chip Sorting Machine and LED Chip Sorting Method

Abstract

The present invention discloses an LED chip sorting machine and an LED chip sorting method, relating to the technical field of chip sorting. The LED chip sorting machine includes an orbit module, a wafer storage component, a wafer clamping and moving component, a chip top die sorting component, a wafer clamping and testing fixture, a roller type bin-dividing blue film clamping component, a blue film clamping and moving component, and a blue film storage component; the orbit module includes a first wafer orbit, a second wafer orbit, a main orbit, a second blue film orbit, and a first blue film orbit which are connected in sequence; the wafer storage component is arranged on the first wafer orbit; the blue film storage component is arranged on the first blue film orbit; the wafer clamping and moving component is arranged on the orbit module and conveys wafers back and forth between the wafer storage component and the wafer clamping and testing fixture; the blue film clamping and moving component is arranged on the orbit module and conveys blue films back and forth between the blue film storage component and the roller type bin-dividing blue film clamping component. By adopting the present invention, the running time of the bin-dividing blue film being clamped back and forth can be effectively reduced, and the LED sorting efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip sorting, and particularly to an LED chip sorter and an LED chip sorting method. Background Art

[0002] After the front-end process and dot testing of LED chips are completed, sorting operations need to be carried out, which is generally called binning. Currently, the main components of LED chip sorters on the market include a wafer clamping and testing fixture, a binning blue film clamping and testing fixture, a chip top die sorting component, a binning blue film / wafer picking and placing robotic arm, and a binning blue film / wafer storage area. The specific working process is as follows:

[0003] (1) In the sorting preparation stage of the machine, the binning blue film / wafer picking and placing robotic arm picks up the wafer to be sorted from the binning blue film / wafer storage area, places it in the wafer clamping and testing fixture, and clamps it.

[0004] (2) The binning blue film / wafer picking and placing robotic arm picks up the binning 1 blue film (according to the chip sorting rules, there are N binning blue films, labeled as binning 1 blue film, binning 2 blue film...) from the binning blue film / wafer storage area, places it in the binning blue film clamping and testing fixture, and clamps it.

[0005] (3) The chip top die sorting component obtains the chip position information of the binning 1 blue film in the wafer from the computer, and through the ejector pins and suction nozzles of the sorting machine, transfers the binning 1 grade chips from the wafer to the binning 1 blue film.

[0006] (4) When the transfer of the binning 1 grade chips in the wafer is completed, the binning blue film / wafer picking and placing robotic arm picks up the binning 1 blue film and transfers it to the binning blue film / wafer storage area.

[0007] (5) The binning blue film / wafer picking and placing robotic arm then picks up the binning 2 blue film from the binning blue film / wafer storage area, transfers it to the wafer clamping and testing fixture, and then the chip top die sorting component obtains the chip position information of the binning 2 blue film in the wafer from the computer, and through the ejector pins and suction nozzles of the sorting machine, transfers the binning 2 grade chips from the wafer to the binning 2 blue film; and so on, until the chips on the wafer are sorted by grade, and then the chip sorting of wafer 2 starts.

[0008] As described above, due to the different parameter concentration degrees of different chip sources, the conventional sorting operation method does not classify the sorted chip sources, resulting in that the off-bin chips (the yield of a single blue film is less than 0.5%) sometimes cannot reach full bin for two or three months. The single-bin blue film occupancy rate of the sorting machine is high, and the full-bin out-bin rate is low. After long-term accumulation, the off-bin chips are prone to oxidation and quality risks. Moreover, when the sorting machine needs to be cleared for product sorting change, the number of chips per single off-bin chip is small, wasting blue film resources, and the operation efficiency of the packaging factory using such chips is also low (the number of single chips is small, and the blue film needs to be frequently replaced).

[0009] At the same time, the existing sorting machine does not perform integrated processing on the bin-divided blue film. The LED sorting machine needs to switch and move the bin-divided blue film back and forth over a long distance, resulting in low sorting efficiency. Especially when the chip size is large, the number of grains per single bin is small, and the actions of clamping and moving the bin-divided blue film back and forth are more frequent, and the operation efficiency is even lower. Summary of the Invention

[0010] The technical problem to be solved by the present invention is to provide an LED chip sorter and an LED chip sorting method, which can effectively reduce the running time of clamping and moving the bin-divided blue film back and forth and improve the LED sorting efficiency.

[0011] To solve the above technical problem, the present invention provides an LED chip sorter, which includes a track module, a wafer storage member, a wafer clamping and moving member, a chip top die sorting member, a wafer clamping and testing fixture, a roller-type bin-divided blue film clamping member, a blue film clamping and moving member, and a blue film storage member. The roller-type bin-divided blue film clamping member is used for clamping a plurality of blue films simultaneously. The track module includes a first wafer track, a second wafer track, a main track, a second blue film track, and a first blue film track that are connected in sequence. The chip top die sorting member, the wafer clamping and testing fixture, and the roller-type bin-divided blue film clamping member are arranged in sequence along the transmission path of the main track. The wafer storage member is arranged on the first wafer track and moves back and forth along the first wafer track. The blue film storage member is arranged on the first blue film track and moves back and forth along the first blue film track. The wafer clamping and moving member is arranged on the track module and transports wafers back and forth between the wafer storage member and the wafer clamping and testing fixture along the second wafer track and the main track. The blue film clamping and moving member is arranged on the track module and transports blue films back and forth between the blue film storage member and the roller-type bin-divided blue film clamping member along the second blue film track and the main track.

[0012] As an improvement of the above solution, the roller-type bin-divided blue film clamping member includes a turntable that rotates in the vertical direction and a plurality of blue film clamping members, and the blue film clamping members are arranged in a circular array with the center of the turntable as the center of the circle.

[0013] As an improvement of the above solution, at least one magnetic attraction block is provided on the blue film clamping member.

[0014] As an improvement of the above solution, the first wafer track, the second wafer track, the main track, the second blue film track and the first blue film track are all straight tracks; the transmission directions of the first wafer track, the main track and the first blue film track are parallel to each other; the transmission directions of the second wafer track and the second blue film track are parallel to each other; the transmission direction of the main track is perpendicular to the transmission directions of the second wafer track and the second blue film track.

[0015] As an improvement of the above solution, a plurality of wafer storage slots arranged in sequence along the transmission direction of the first wafer track are provided in the wafer storage member, and / or a plurality of blue film storage slots arranged in sequence along the transmission direction of the first blue film track are provided in the blue film storage member.

[0016] As an improvement of the above solution, the LED chip sorter further includes a wafer barcode scanner and / or a blue film barcode scanner; the wafer barcode scanner is arranged at one end of the main track and is used for scanning the wafer information of the wafer clamped by the wafer clamping and moving member; the blue film barcode scanner is arranged at the other end of the main track and is used for scanning the blue film information of the blue film clamped by the blue film clamping and moving member.

[0017] Correspondingly, the present invention further provides an LED chip sorting method based on an LED chip sorter, including: driving the wafer clamping and moving member to clamp a wafer to be sorted from the wafer storage member and move it to the wafer clamping and testing fixture; driving the blue film clamping and moving member to sequentially clamp a bin-sorted blue film from the blue film storage member and move it to the roller-type bin-sorted blue film clamping member, and a target station is provided on the roller-type bin-sorted blue film clamping member; driving the chip top die sorting member to sort the target chips in the wafer to be sorted on the wafer clamping and testing fixture to the bin-sorted blue film at the target station, and the target chips are the chips belonging to the bin-sorted blue film at the target station; when the target chips in the wafer to be sorted on the wafer clamping and testing fixture are transferred, driving the roller-type bin-sorted blue film clamping member to move to update the bin-sorted blue film at the target station, and continue to sort the chips in the wafer to be sorted on the wafer clamping and testing fixture until the sorting of the chips in the wafer to be sorted on the wafer clamping and testing fixture is completed.

[0018] As an improvement of the above solution, several wafer storage slots arranged in sequence along the transmission direction of the first wafer track are provided in the wafer storage member, and the wafers to be sorted are respectively stored in the wafer storage slots. The steps of driving the wafer clamping and moving member to clamp the wafers to be sorted from the wafer storage member include: driving the first wafer track to move so that the wafer storage member moves synchronously with the first wafer track; when the wafer storage slot where the wafer to be sorted is located is aligned with the second wafer track, controlling the first wafer track to stop moving; driving the wafer clamping and moving member to clamp the wafers to be sorted from the wafer storage member; and / or several blue film storage slots arranged in sequence along the transmission direction of the first blue film track are provided in the blue film storage member, and the binned blue films are respectively stored in the blue film storage slots. The steps of driving the blue film clamping and moving member to clamp the binned blue films from the blue film storage member in sequence include: driving the first blue film track to move so that the blue film storage member moves synchronously with the first blue film track; when the blue film storage slot where the binned blue film is located is aligned with the second wafer track, controlling the first blue film track to stop moving; driving the blue film clamping and moving member to clamp the binned blue films from the blue film storage member.

[0019] As an improvement of the above solution, the LED chip sorting method further includes: during the process of driving the wafer clamping and moving member to move the wafers to be sorted to the wafer clamping and testing fixture, driving the wafer barcode scanner to scan the wafer information of the wafers to be sorted, where the wafer information includes chip probing information; during the process of driving the blue film clamping and moving member to move the binned blue films to the roller-type binned blue film clamping member in sequence, driving the blue film barcode scanner to scan the blue film information of the binned blue films, where the blue film information includes grading information; when sorting the chips in the wafers to be sorted on the wafer clamping and testing fixture, driving the chip top die sorting member to sort the target chips in the wafers to be sorted on the wafer clamping and testing fixture to the binned blue films at the target station according to the wafer information and the blue film information.

[0020] As an improvement of the above solution, the LED chip sorting method further includes: obtaining the chip probing information of each chip in the wafers to be sorted; dividing the chips into different sub-BIN grades according to the chip probing information; counting the number of chips corresponding to different sub-BIN grades; taking the sub-BIN grade with the largest number of chips as the main BIN grade of the wafers to be sorted; and allocating the wafers to be sorted to the corresponding LED chip sorter for sorting according to the main BIN grade.

[0021] In summary, by improving the structure of the LED chip sorter and introducing a unique LED chip sorting method, the present invention can effectively reduce the running time of clamping and unclamping the blue film for binning, and improve the sorting efficiency and accuracy of LEDs. Accordingly, implementing the present invention has the following beneficial effects:

[0022] The LED chip sorter of the present invention adopts an orbital movement design, and a wafer clamping and moving member and a blue film clamping and moving member are respectively arranged on both sides of the roller-type binning blue film clamping member, realizing targeted orbital transmission of the wafer and the blue film, and facilitating control;

[0023] The roller-type binning blue film clamping member in the present invention adopts a rotary clamping and measuring turntable structure, integrating multiple blue film clamping parts into a whole, capable of clamping multiple binning blue films simultaneously, reducing the running stroke of the machine table, realizing centralized processing of the binning blue film, and improving the chip sorting operation efficiency;

[0024] In addition, by pre-classifying the wafers to be sorted, the present invention can greatly improve the chip binning rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic structural diagram of the first embodiment of the LED chip sorter of the present invention;

[0026] Figure 2 is a schematic structural diagram of the embodiment of the roller-type binning blue film clamping member in the LED chip sorter of the present invention;

[0027] Figure 3 is a schematic structural diagram of the embodiment of the blue film clamping part in the LED chip sorter of the present invention;

[0028] Figure 4 is a schematic structural diagram of the embodiment of the track module in the LED chip sorter of the present invention;

[0029] Figure 5 is a schematic structural diagram of the embodiment of the wafer storage member in the LED chip sorter of the present invention;

[0030] Figure 6 is a schematic structural diagram of the second embodiment of the LED chip sorter of the present invention;

[0031] Figure 7 is a flowchart of the first embodiment of the LED chip sorting method based on the LED chip sorter of the present invention;

[0032] Figure 8 is a flowchart of the second embodiment of the LED chip sorting method based on the LED chip sorter of the present invention;

[0033] Figure 9It is a flowchart of the third embodiment of the LED chip sorting method based on the LED chip sorter of the present invention. Detailed implementation manners

[0034] To make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings. It is hereby declared that the orientation terms such as up, down, left, right, front, back, inside and outside that appear or will appear in the text of the present invention are only based on the accompanying drawings of the present invention, and they do not specifically limit the present invention.

[0035] Refer to Figure 1 , Figure 1 which shows the first embodiment of the LED chip sorter of the present invention, including an orbit module, a wafer storage member 2, a wafer clamping and moving member 3, a chip top mold sorting member 4, a wafer clamping and measuring fixture 5, a roller type binning blue film clamping member 6, a blue film clamping and moving member 7 and a blue film storage member 8; the roller type binning blue film clamping member 6 is used to clamp a plurality of blue films simultaneously. Specifically:

[0036] The orbit module includes a first wafer orbit 11, a second wafer orbit 12, a main orbit 13, a second blue film orbit 14 and a first blue film orbit 15 connected in sequence (refer to Figure 4 ), and the chip top mold sorting member 4, the wafer clamping and measuring fixture 5 and the roller type binning blue film clamping member 6 are arranged in sequence along the transmission path of the main orbit 13;

[0037] The wafer storage member 2 is arranged on the first wafer orbit 11 and moves back and forth along the first wafer orbit 11;

[0038] The blue film storage member 8 is arranged on the first blue film orbit 15 and moves back and forth along the first blue film orbit 15;

[0039] The wafer clamping and moving member 3 is arranged on the orbit module and transports the wafer back and forth between the wafer storage member 2 and the wafer clamping and measuring fixture 5 along the second wafer orbit 12 and the main orbit 13;

[0040] The blue film clamping and moving member 7 is arranged on the orbit module and transports the blue film back and forth between the blue film storage member 8 and the roller type binning blue film clamping member 6 along the second blue film orbit 14 and the main orbit 13.

[0041] Different from the prior art, the LED chip sorter of the present invention adopts an orbital movement design, and a wafer clamping and moving member 3 and a blue film clamping and moving member 7 are respectively arranged on both sides of the roller type binning blue film clamping member 6, realizing the targeted orbital transmission of the wafer and the blue film, and facilitating control.

[0042] During operation, first move the wafer storage member 2 to a specific position through the first wafer track 11 to facilitate the wafer clamping and moving member 3 to clamp the wafer. Then, the wafer clamping and moving member 3 clamps the wafer to be sorted in the wafer storage member 2 and transfers the wafer to be sorted to the wafer clamping and testing fixture 5 along the second wafer track 12 and the main track 13. At the same time, move the blue film storage member 8 to a specific position through the first blue film track 15 to facilitate the blue film clamping and moving member 7 to clamp the binning blue film. Then, the blue film clamping and moving member 7 clamps the binning blue film in the blue film storage member 8 and transfers the binning blue film to the roller-type binning blue film clamping member 6 along the second blue film track 14 and the main track 13. Finally, transfer the chips in the wafer to be sorted to the binning blue film through the chip top die sorting member 4.

[0043] As Figure 2 shown, the roller-type binning blue film clamping member 6 includes a turntable 61 that rotates in the vertical direction and a plurality of blue film clamping members 62. The blue film clamping members 62 are arranged in a circular array with the center of the turntable 61 as the center of the circle.

[0044] In the prior art, the binning blue film clamping and testing fixture is a single blue film clamping and testing structure, and only one blue film can be clamped each time. Different from the prior art, the roller-type binning blue film clamping member 6 in the present invention adopts a rotary clamping and testing turntable structure. The roller-type binning blue film clamping member 6 is designed with a plurality of blue film clamping members 62, and multiple binning blue films can be clamped simultaneously.

[0045] For example, there are 12 blue film clamping members A1 to A12 provided on the roller-type binning blue film clamping member 6, that is, there are 12 stations C1 to C12 and 12 binning blue films B1 to B12 corresponding to the roller-type binning blue film clamping member 6. At the same time, there is a wafer to be sorted on the wafer clamping and testing fixture 5, and 6 types of chips L1 to L6 are provided thereon.

[0046] When clamping the binning blue film, first transfer the binning blue film B1 from the blue film storage member 8 to the blue film clamping member A1 (i.e., station C1) through the blue film clamping and moving member 7. Then, the turntable 61 rotates to the next station (i.e., station C2), and then transfer the binning blue film B2 from the blue film storage member 8 to the blue film clamping member A2 (i.e., station C2) through the blue film clamping and moving member 7, and so on, until the clamping of other binning blue films (B3 to B12) is completed.

[0047] During the sorting process, the chip top mold sorting component 4 can first transfer all the chips L1 in the wafer to be sorted to the binning blue film B1 (i.e., station C1), then the turntable 61 rotates to the next station (i.e., station C2), and then the chip top mold sorting component 4 transfers all the chips L2 in the wafer to be sorted to the binning blue film B2 (i.e., station C2), and so on until the clamping of other sub-chips (L3-L6) is completed.

[0048] Therefore, in the present invention, multiple blue film clamping parts 62 are integrated into a whole. After sorting each binning blue film, the turntable 61 rotates to the next station, and then the sorting of the next type of chips can be carried out, and so on, reducing the back-and-forth access movement of the binning blue film, reducing the running stroke of the machine, realizing the centralized processing of the binning blue film, and improving the chip sorting operation efficiency.

[0049] As Figure 3 shown, at least one magnetic block 63 is provided on the blue film clamping part 62, which is convenient for the flexible clamping of the binning blue film and easy to operate.

[0050] As Figure 4 shown, in this embodiment, the first wafer track 11, the second wafer track 12, the main track 13, the second blue film track 14 and the first blue film track 15 are all straight tracks; the transmission directions of the first wafer track 11, the main track 13 and the first blue film track 15 are parallel to each other; the transmission directions of the second wafer track 12 and the second blue film track 14 are parallel to each other; the transmission direction of the main track 13 is perpendicular to the transmission directions of the second wafer track 12 and the second blue film track 14.

[0051] In other embodiments, it can also be designed in other forms as long as the smooth interconnection between the tracks can be achieved.

[0052] As Figure 5 shown, a plurality of wafer storage slots 21 arranged in sequence along the transmission direction of the first wafer track 11 are provided in the wafer storage component 2.

[0053] In the prior art, a plurality of wafer storage slots 21 arranged in sequence in the vertical direction are provided in the wafer storage component 2 to cooperate with the existing wafer clamping robotic arm; different from the prior art, in the present invention, the wafer storage slots 21 are arranged in sequence along the transmission direction of the first wafer track 11 (preferably in the horizontal direction) to cooperate with the wafer clamping and moving component 3 in the present invention.

[0054] Similarly, a plurality of blue film storage slots arranged in sequence along the transmission direction of the first blue film track 15 are provided in the blue film storage component 8.

[0055] See Figure 6 , Figure 6 shows the second embodiment of the LED chip sorter of the present invention. Different fromFigure 1 Different from the first embodiment shown, in this embodiment, the LED chip sorter further includes a wafer barcode scanner 9 and a blue film barcode scanner 10, where:

[0056] The wafer barcode scanner 9 is arranged at one end of the main track 13 and is used to scan the wafer information of the wafer clamped by the wafer clamping and moving member 3.

[0057] The blue film barcode scanner 10 is arranged at the other end of the main track 13 and is used to scan the blue film information of the blue film clamped by the blue film clamping and moving member 7.

[0058] It should be noted that during the process of the wafer clamping and moving member 3 moving the wafer to be sorted to the wafer clamping and testing fixture 5, the wafer barcode scanner 9 can scan the wafer information of the wafer to be sorted in real time. Similarly, during the process of the blue film clamping and moving member 7 moving the sorted BIN blue film to the roller-type sorted BIN blue film clamping member 6 in sequence, the blue film barcode scanner 10 scans the blue film information of the sorted BIN blue film. Therefore, when sorting the chips in the wafer to be sorted on the wafer clamping and testing fixture 5, the chip top die sorting member 4 can be driven according to the wafer information and the blue film information to sort the chips in the wafer to be sorted on the wafer clamping and testing fixture 5 onto the corresponding sorted BIN blue films respectively.

[0059] In practical applications, the wafer barcode scanner 9 and the blue film barcode scanner 10 can be set as required according to actual needs, with strong flexibility.

[0060] Therefore, through the LED chip sorter of the present invention, the running time of the sorted BIN blue film for clamping back and forth can be effectively reduced, and the LED sorting efficiency can be improved.

[0061] See Figure 7 , Figure 7 shows a flowchart of the first embodiment of the LED chip sorting method based on the LED chip sorter of the present invention, which includes:

[0062] S101, driving the wafer clamping and moving member to clamp the wafer to be sorted from the wafer storage member and move it into the wafer clamping and testing fixture;

[0063] As Figure 1 shown, a plurality of wafer storage slots 21 arranged in sequence along the transmission direction of the first wafer track 11 are provided in the wafer storage member 2, and the wafers to be sorted are respectively stored in the wafer storage slots 21.

[0064] Further, the step of driving the wafer clamping and moving member to clamp the wafer to be sorted from the wafer storage member includes:

[0065] (1) Driving the first wafer track 11 to move so that the wafer storage member 2 moves synchronously with the first wafer track 11;

[0066] (2) When the wafer storage slot 21 where the wafer to be sorted is located is aligned with the second wafer track 12, control the first wafer track 11 to stop moving;

[0067] (3) Drive the wafer clamping and moving member 3 to clamp the wafer to be sorted from the wafer storage member 2;

[0068] Therefore, the present invention can align the second wafer track 12 with different wafer storage slots 21 by moving the wafer storage member 2, so as to facilitate the wafer clamping and moving member 3 to clamp / place different wafers to be sorted from the wafer storage member 2.

[0069] S102, drive the blue film clamping and moving member to sequentially clamp the binning blue films from the blue film storage member and move them to the roller-type binning blue film clamping member;

[0070] It should be noted that there are multiple stations on the roller-type binning blue film clamping member 6; generally, a certain specific position can be used as the target station;

[0071] For example, there are 12 stations C1 to C12 on the roller-type binning blue film clamping member 6, and the position of the lowest point can be selected as the target station. During the rotation of the roller-type binning blue film clamping member 6, the binning blue films on the target station change continuously to facilitate the rapid switching of the binning blue films.

[0072] As Figure 1 shown, there are several blue film storage slots arranged in sequence along the transmission direction of the first blue film track 15 in the blue film storage member 8, and the binning blue films are respectively stored in the blue film storage slots.

[0073] Further, the steps of driving the blue film clamping and moving member to sequentially clamp the binning blue films from the blue film storage member include:

[0074] (1) Drive the first blue film track 15 to move so that the blue film storage member 8 moves synchronously with the first blue film track 15;

[0075] (2) When the blue film storage slot where the binning blue film is located is aligned with the second wafer track 12, control the first blue film track 15 to stop moving;

[0076] (3) Drive the blue film clamping and moving member 7 to clamp the binning blue film from the blue film storage member 8.

[0077] Similarly, the present invention can align the second blue film track 14 with different blue film storage slots by moving the blue film storage member 8, so as to facilitate the blue film clamping and moving member 7 to clamp / place different binning blue films from the blue film storage member 8.

[0078] For example, the roller type bin-dividing blue film clamping member 6 is provided with 12 stations C1 to C12, and the blue film storage member 8 is provided with 12 bin-dividing blue films B1 to B12. During the process of moving all the bin-dividing blue films to the roller type bin-dividing blue film clamping member 6, first drive the blue film clamping and moving member 7 to transfer the bin-dividing blue film B1 from the blue film storage member 8 to the station C1. Then, the turntable 61 rotates to the next station (i.e., station C2), and then the blue film clamping and moving member 7 transfers the bin-dividing blue film B2 from the blue film storage member 8 to the station C2, and so on, until the transfer of other bin-dividing blue films (B3 to B12) is completed.

[0079] S103, drive the chip top die sorting member to sort the target chips in the wafers to be sorted on the wafer clamping and testing fixture onto the bin-dividing blue film at the target station;

[0080] It should be noted that different types of chips are provided in the wafers to be sorted, and the purpose of chip sorting is exactly to sort the chips of the same type onto the same bin-dividing blue film, that is, one bin-dividing blue film only corresponds to one type of chip; and in the present invention, the target chips are the chips belonging to the bin-dividing blue film at the target station.

[0081] For example, the roller type bin-dividing blue film clamping member 6 is provided with 12 stations C1 to C12 and 12 bin-dividing blue films B1 to B12. At the same time, the wafer clamping and testing fixture 5 is provided with wafers to be sorted, on which there are 12 types of chips L1 to L12; then the chip L1 is the target chip belonging to the bin-dividing blue film B1 at the station C1, the chip L2 is the target chip belonging to the bin-dividing blue film B2 at the station C2, and so on.

[0082] S104, when the transfer of the target chips in the wafers to be sorted on the wafer clamping and testing fixture is completed, drive the roller type bin-dividing blue film clamping member to move to update the bin-dividing blue film at the target station, and return to step S103 to continue sorting the chips in the wafers to be sorted on the wafer clamping and testing fixture until the sorting of the chips in the wafers to be sorted on the wafer clamping and testing fixture is completed.

[0083] For example, the roller type bin-dividing blue film clamping member 6 is provided with 12 stations C1 to C12 and 12 bin-dividing blue films B1 to B12. At the same time, the wafer clamping and testing fixture 5 is provided with wafers to be sorted, on which there are 12 types of chips L1 to L12; during the sorting process, the chip top die sorting member 4 can first transfer all the chips L1 in the wafers to be sorted to the bin-dividing blue film B1 (i.e., station C1), then the turntable 61 rotates to the next station (i.e., station C2), and then the chip top die sorting member 4 transfers all the chips L2 in the wafers to be sorted to the bin-dividing blue film B2 (i.e., station C2), and so on, until the sorting of other sub-chips is completed.

[0084] Furthermore, when the sorting bin blue film on the target station reaches the requirement of the number of sorted grains (i.e., the sorting bin blue film is full of placed chips), the blue film clamping and moving member 7 can be driven to clamp the sorting bin blue film that meets the requirement of the number of sorted grains from the roller-type sorting bin blue film clamping member 6 and move it to the blue film storage member 8; at the same time, the blue film clamping and moving member 7 is driven to clamp an empty sorting bin blue film from the blue film storage member 8 and move it to the roller-type sorting bin blue film clamping member 6, thereby realizing the replacement of the sorting bin blue film.

[0085] More preferably, a replacement station for realizing the replacement of the sorting bin blue film can be set on the roller-type sorting bin blue film clamping member 6, and the replacement station is different from the target station, so as to ensure that the chip sorting and the blue film replacement are carried out at different stations respectively, reducing the waiting time for replacing the sorting bin blue film due to the full bin of the sorting bin blue film.

[0086] For example, there are 12 stations C1 to C12 on the roller-type sorting bin blue film clamping member 6, and the lowest point position can be selected as the replacement station, and the position of the previous station of the replacement station can be selected as the target station.

[0087] In addition, when there are many wafer sorting bins (i.e., many types of chips in the wafer), the wafer can be sorted multiple times by multiple LED chip sorters.

[0088] For example, there are 12 stations on the roller-type sorting bin blue film clamping member 6, and the wafer has 22 types of chips L1 to L22, then it can be sorted twice. The LED chip sorter E1 sorts the chips L1 to L12, and the LED chip sorter E2 sorts the chips L13 to L22; thus, the problem that the measurement positions of the sorting bin blue film clamps in the roller-type sorting bin blue film clamping member 6 are insufficient due to many wafer sorting bins can be solved.

[0089] See Figure 8 , Figure 8 shows the flowchart of the second embodiment of the LED chip sorting method based on the LED chip sorter of the present invention, which includes:

[0090] S201, driving the wafer clamping and moving member to clamp the wafer to be sorted from the wafer storage member and move it to the wafer clamping and measuring jig;

[0091] S202, during the process of driving the wafer clamping and moving member to move the wafer to be sorted to the wafer clamping and measuring jig, driving the wafer barcode scanner to scan the wafer information of the wafer to be sorted;

[0092] It should be noted that there is a two-dimensional code information on the wafer to be sorted, and the wafer information of the wafer to be sorted can be obtained from the memory by scanning the two-dimensional code information. The wafer information includes chip probing information.

[0093] S203, drive the blue film clamping and moving component to sequentially pick up the binned blue films from the blue film storage component and move them to the roller-type binned blue film clamping component;

[0094] S204, during the process of driving the blue film clamping and moving component to sequentially move the binned blue films to the roller-type binned blue film clamping component, drive the blue film barcode scanner to scan the blue film information of the binned blue films;

[0095] Similarly, the binned blue films are provided with two-dimensional code information. By scanning the two-dimensional code information, the blue film information of the binned blue films can be obtained from the memory, or blue film information can be allocated to the blank binned blue films. The blue film information includes gear information;

[0096] For example, when the sorting process is started for the first time, the binned blue films in the blue film storage component 8 are all blank blue films. At this time, every time a blank blue film is transferred from the blue film storage component 8 to the roller-type binned blue film clamping component 6, blue film information is allocated to the corresponding blank blue film.

[0097] Another example is that when the sorting process is started again, the blue film storage component 8 may store used but not full-bin blue films. At this time, if this blue film is transferred from the blue film storage component 8 to the roller-type binned blue film clamping component 6, the blue film information of this blue film can be obtained from the memory by scanning the two-dimensional code information; thus ensuring that one blue film corresponds to one type of LED chip.

[0098] S205, according to the wafer information and the blue film information, drive the chip top die sorting component to sort the target chips in the wafers to be sorted on the wafer clamping and testing fixture onto the binned blue films at the target stations;

[0099] Since there are multiple binned blue films clamped in the roller-type binned blue film clamping component 6, the controller can find the position of the corresponding target chips in the wafer according to the blue film information of the binned blue films at the target stations, so as to accurately drive the chip top die sorting component 4 to take out the target chips in the wafer and place them on the binned blue films at the target stations; after the sorting is completed, the wafer information of the corresponding wafer in the controller needs to be updated synchronously.

[0100] S206, when the target chips in the wafers to be sorted on the wafer clamping and testing fixture are transferred, drive the roller-type binned blue film clamping component to move to update the binned blue films at the target stations, and return to step S205 to continue sorting the chips in the wafers to be sorted on the wafer clamping and testing fixture until the sorting of the chips in the wafers to be sorted on the wafer clamping and testing fixture is completed.

[0101] Therefore, through the LED chip sorting method based on the LED chip sorter of the present invention, precise control of sorting can be achieved, and the accuracy is high.

[0102] See Figure 9 , Figure 9 which shows the flowchart of the third embodiment of the LED chip sorting method based on the LED chip sorter according to the present invention, and includes:

[0103] S301, obtaining the chip test information of each chip in the wafer to be sorted;

[0104] S302, dividing the chips into different sub-BIN levels according to the chip test information;

[0105] S303, counting the number of chips corresponding to different sub-BIN levels;

[0106] S304, taking the sub-BIN level with the largest number of chips as the main BIN level of the wafer to be sorted;

[0107] S305, allocating the wafer to be sorted to the corresponding LED chip sorter for sorting according to the main BIN level.

[0108] Since the smaller the output ratio of the chip output grade, the larger the number of wafers that need to be sorted for the full BIN output rate of the corresponding grade BIN blue film, and the longer the sorting time required. Therefore, steps S301 to S305 are introduced in this embodiment to classify the wafers to be sorted.

[0109] For example, there are 20 chips divided into grade F1 in the wafer to be sorted, 100 chips divided into grade F2, 200 chips divided into grade F3, and 120 chips divided into grade F4; then the main BIN level of the wafer to be sorted is F3.

[0110] Generally, the wafers to be sorted with the same main BIN level can be allocated to the same LED chip sorter for sorting to improve the chip BIN output rate.

[0111] For example, the main BIN level of the wafer to be sorted Q1 is F3, the main BIN level of the wafer to be sorted Q2 is F1, and the main BIN level of the wafer to be sorted Q3 is F3. Then, the wafer to be sorted Q1 and the wafer to be sorted Q3 can be allocated to the same LED chip sorter for sorting.

[0112] S306, driving the wafer clamping and moving member to clamp the wafer to be sorted from the wafer storage member and move it to the wafer clamping and testing fixture;

[0113] S307, when driving the wafer clamping and moving member to move the wafer to be sorted to the wafer clamping and testing fixture, driving the wafer barcode scanner to scan the wafer information of the wafer to be sorted;

[0114] S308, drive the blue film clamping and moving component to sequentially pick up the binned blue films from the blue film storage component and move them to the roller-type binned blue film clamping component;

[0115] S309, during the process of driving the blue film clamping and moving component to sequentially move the binned blue films to the roller-type binned blue film clamping component, drive the blue film barcode scanner to scan the blue film information of the binned blue films;

[0116] S310, according to the wafer information and the blue film information, drive the chip top mold sorting component to sort the target chips in the wafers to be sorted on the wafer clamping and testing fixture to the binned blue films at the target stations;

[0117] S311, when the transfer of the target chips in the wafers to be sorted on the wafer clamping and testing fixture is completed, drive the roller-type binned blue film clamping component to move to update the binned blue films at the target stations, and return to step S310 to continue sorting the chips in the wafers to be sorted on the wafer clamping and testing fixture until the sorting of the chips in the wafers to be sorted on the wafer clamping and testing fixture is completed.

[0118] As can be seen from the above, by improving the structure of the LED chip sorter and introducing a unique LED chip sorting method, the present invention can effectively reduce the running time of the binned blue films being picked up and moved back and forth, and improve the LED sorting efficiency and accuracy.

[0119] The above is the preferred embodiment of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can still be made, and these improvements and refinements are also regarded as the protection scope of the present invention.

Claims

1. An LED chip sorter, characterized in that, It includes an orbit module, a wafer storage component, a wafer clamping and moving component, a chip top die sorting component, a wafer clamping and testing fixture, a roller type binning blue film clamping component, a blue film clamping and moving component, and a blue film storage component. The roller type binning blue film clamping component is used to clamp a plurality of blue films simultaneously. The orbit module includes a first wafer orbit, a second wafer orbit, a main orbit, a second blue film orbit, and a first blue film orbit that are connected in sequence. The chip top die sorting component, the wafer clamping and testing fixture, and the roller type binning blue film clamping component are arranged in sequence along the transmission path of the main orbit. The wafer storage component is arranged on the first wafer orbit and moves back and forth along the first wafer orbit. The blue film storage component is arranged on the first blue film orbit and moves back and forth along the first blue film orbit. The wafer clamping and moving component is arranged on the orbit module and conveys wafers back and forth between the wafer storage component and the wafer clamping and testing fixture along the second wafer orbit and the main orbit. The blue film clamping and moving component is arranged on the orbit module and conveys blue films back and forth between the blue film storage component and the roller type binning blue film clamping component along the second blue film orbit and the main orbit. The roller type binning blue film clamping component includes a turntable that rotates in the vertical direction and a plurality of blue film clamping parts. The blue film clamping parts are arranged in a circular array with the center of the turntable as the center of the circle. The first wafer orbit, the second wafer orbit, the main orbit, the second blue film orbit, and the first blue film orbit are all straight orbits. The transmission directions of the first wafer orbit, the main orbit, and the first blue film orbit are parallel to each other. The transmission directions of the second wafer orbit and the second blue film orbit are parallel to each other. The transmission direction of the main orbit is perpendicular to the transmission directions of the second wafer orbit and the second blue film orbit.

2. The LED chip sorter according to claim 1, characterized in that, At least one magnetic attraction block is provided on the blue film clamping part.

3. The LED chip sorter according to claim 1, characterized in that, A plurality of wafer storage slots are arranged in sequence in the wafer storage component along the transmission direction of the first wafer orbit, and / or a plurality of blue film storage slots are arranged in sequence in the blue film storage component along the transmission direction of the first blue film orbit.

4. The LED chip sorter according to claim 1, wherein It further includes a wafer barcode scanner and / or a blue film barcode scanner. The wafer barcode scanner is arranged at one end of the main orbit and is used to scan the wafer information of the wafer clamped by the wafer clamping and moving component. The blue film barcode scanner is arranged at the other end of the main orbit and is used to scan the blue film information of the blue film clamped by the blue film clamping and moving component.

5. An LED chip sorting method for an LED chip sorter according to any one of claims 1 to 4, characterized in that, It includes: Driving the wafer clamping and moving component to clamp the wafer to be sorted from the wafer storage component and move it to the wafer clamping and testing fixture. Driving the blue film clamping and moving component to clamp the binning blue film from the blue film storage component in sequence and move it to the roller type binning blue film clamping component. A target station is provided on the roller type binning blue film clamping component. Driving the chip top die sorting component to sort the target chips in the wafer to be sorted on the wafer clamping and testing fixture to the binning blue film at the target station. The target chips are the chips belonging to the binning blue film at the target station. After the target chip in the wafer to be sorted on the wafer clamping and testing fixture is transferred, drive the roller-type binning blue film clamping member to move to update the binning blue film at the target station, and continue to sort the chips in the wafer to be sorted on the wafer clamping and testing fixture until the sorting of the chips in the wafer to be sorted on the wafer clamping and testing fixture is completed.

6. The LED chip sorting method according to claim 5, wherein The wafer storage member is provided with a plurality of wafer storage slots arranged in sequence along the transmission direction of the first wafer track, and the wafers to be sorted are respectively stored in the wafer storage slots. The step of driving the wafer clamping and moving member to clamp the wafer to be sorted from the wafer storage member includes: driving the first wafer track to move so that the wafer storage member moves synchronously with the first wafer track; when the wafer storage slot where the wafer to be sorted is located is aligned with the second wafer track, controlling the first wafer track to stop moving; driving the wafer clamping and moving member to clamp the wafer to be sorted from the wafer storage member; and / or The blue film storage member is provided with a plurality of blue film storage slots arranged in sequence along the transmission direction of the first blue film track, and the binning blue films are respectively stored in the blue film storage slots. The step of driving the blue film clamping and moving member to sequentially clamp the binning blue films from the blue film storage member includes: driving the first blue film track to move so that the blue film storage member moves synchronously with the first blue film track; when the blue film storage slot where the binning blue film is located is aligned with the second wafer track, controlling the first blue film track to stop moving; driving the blue film clamping and moving member to clamp the binning blue film from the blue film storage member.

7. The LED chip sorting method according to claim 5, wherein, Further comprising: During the process of driving the wafer clamping and moving member to move the wafer to be sorted to the wafer clamping and testing fixture, driving the wafer barcode scanner to scan the wafer information of the wafer to be sorted, and the wafer information includes chip point measurement information; During the process of driving the blue film clamping and moving member to sequentially move the binning blue films to the roller-type binning blue film clamping member, driving the blue film barcode scanner to scan the blue film information of the binning blue film, and the blue film information includes grading information; When sorting the chips in the wafer to be sorted on the wafer clamping and testing fixture, driving the chip top die sorting member to sort the target chips in the wafer to be sorted on the wafer clamping and testing fixture to the binning blue film at the target station according to the wafer information and the blue film information.

8. The LED chip sorting method according to claim 5, characterized in that, Further comprising: Obtaining the chip point measurement information of each chip in the wafer to be sorted; Dividing the chips into different sub-bin grades according to the chip point measurement information; Counting the number of chips corresponding to different sub-bin grades; Taking the sub-bin grade with the largest number of chips as the main bin grade of the wafer to be sorted; Allocating the wafer to be sorted to the corresponding LED chip sorter for sorting according to the main bin grade.

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