A semiconductor cleaning device

Abstract

The present invention discloses a semiconductor cleaning device, which relates to the technical field of ultrasonic cleaning. It includes an ultrasonic cleaning machine body and also includes a fixing component. A placement groove is provided on the front side of the ultrasonic cleaning machine body. A cleaning agent is arranged inside the ultrasonic cleaning machine body. A square groove is provided on the right side of the ultrasonic cleaning machine body. A servo motor is fixedly installed on the inner wall of the square groove. A lead screw is fixedly installed at the output end of the servo motor. A load-bearing rod is fixedly installed on the inner wall of the ultrasonic cleaning machine body. A load-bearing plate is slidably installed on the circumferential surface of the load-bearing rod. The load-bearing plate is limited by the load-bearing frame and cannot continue to move away from the proportioning frame. By restricting the clamping plate, it is possible to avoid the deformation or stress concentration on the surface of the curved semiconductor caused by uneven pressure, thereby reducing the risk of damage to the curved semiconductor during the cleaning process and ensuring more stable and uniform contact between the curved semiconductor and the cleaning agent.

Description

Technical Field

[0001] The present invention relates to the technical field of ultrasonic cleaning, and specifically to a semiconductor cleaning device. Background Art

[0002] Semiconductor cleaning devices usually consist of parts such as an ultrasonic cleaning machine body, a fixture, a protection component, and a control component, and some semiconductor cleaning devices are specifically for cleaning standard semiconductor parts.

[0003] The patent with the patent announcement number CN219292242U relates to a semiconductor ultrasonic cleaning device, including an ultrasonic cleaning machine main body and a cleaning chamber opened at the top of the ultrasonic cleaning machine main body. A plurality of hanging rack components are placed in the cleaning chamber. The hanging rack component includes a U-shaped frame body, a movable clamp and a fixed clamp installed inside the U-shaped frame body, and a semiconductor silicon wafer is clamped between the movable clamp and the fixed clamp. Two cross bars are also fixed inside the U-shaped frame body. The hanging rack component further includes a limiting structure and an adjusting structure. By improving the ultrasonic cleaning machine in the prior art, a limiting structure and an adjusting structure are correspondingly arranged on the hanging rack component. On the one hand, after the operator laterally moves the movable clamp, it can be limited by the limiting structure, which is convenient for taking and placing the semiconductor silicon wafer. On the other hand, the position of the fixed clamp can be adaptively adjusted according to different usage requirements, effectively improving the overall use convenience and flexibility of the ultrasonic cleaning machine.

[0004] In the above patent, after the operator laterally moves the movable clamp, it can be limited by the limiting structure, which is convenient for taking and placing the semiconductor silicon wafer. On the other hand, the position of the fixed clamp can be adaptively adjusted according to different usage requirements, effectively improving the overall use convenience and flexibility of the ultrasonic cleaning machine. However, it is difficult to control the clamping force on the curved surface semiconductor. If the clamping force on the curved surface semiconductor is too large, it will cause uneven contact between the surface of the curved surface semiconductor and the cleaning agent, thereby affecting the ultrasonic cleaning effect. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a semiconductor cleaning device, which solves the problems raised in the above background art.

[0006] To achieve the above objectives, the present invention is realized through the following technical solutions: A semiconductor cleaning device includes an ultrasonic cleaning machine body and further includes a fixing component. A placement groove is opened on the front side of the ultrasonic cleaning machine body. A cleaning agent is provided inside the ultrasonic cleaning machine body. A square groove is opened on the right side of the ultrasonic cleaning machine body. A servo motor is fixedly installed on the inner wall of the square groove. A lead screw is fixedly installed at the output end of the servo motor. A load-bearing rod is fixedly installed on the inner wall of the ultrasonic cleaning machine body. A load-bearing plate is slidably installed on the circumferential surface of the load-bearing rod. A load-bearing frame is fixedly installed on the circumferential surface of the load-bearing rod. A clamping plate is slidably installed on the circumferential surface of the load-bearing rod. The clamping plate is threadedly connected to the lead screw. A connecting plate is fixedly installed on the inner wall of the ultrasonic cleaning machine body. A connecting rod slidably penetrates through the upper and lower walls of the connecting plate. A limiting plate is fixedly installed at the bottom of the connecting rod. A limiting groove is opened at the bottom of the limiting plate. The load-bearing plate is limited by the load-bearing frame and cannot continue to move away from the proportioning frame.

[0007] According to the above technical solution, a first spring is provided between the load-bearing frame and the load-bearing plate. The first spring can drive the load-bearing plate to reset. A control panel is fixedly installed on the inner wall of the placement groove. The control panel is electrically connected to the ultrasonic cleaning machine body. When the clamping plate moves towards the proportioning frame, the load-bearing plate shakes and resets to the right under the elastic force of the first spring.

[0008] According to the above technical solution, a second spring is provided between the connecting plate and the limiting plate. The second spring can drive the limiting plate to reset. A button is fixedly installed on the right side of the ultrasonic cleaning machine body. The button is electrically connected to the ultrasonic cleaning machine body.

[0009] According to the above technical solution, a proportioning component for maintaining the concentration of the cleaning agent is provided inside the ultrasonic cleaning machine body. A protection component is provided on the right side of the ultrasonic cleaning machine body. The proportioning component includes a proportioning frame, a T-shaped rod, a proportioning rod, a dosing frame, a dosing hole, a T-shaped plate, and a dosing pipe. The concentrated cleaning agent inside the dosing pipe enters the ultrasonic cleaning machine body through the dosing pipe. The proportioning frame is fixedly installed on the inner wall of the ultrasonic cleaning machine body. The T-shaped rod is fixedly installed on the inner wall of the proportioning frame. The proportioning rod is slidably installed on the circumferential surface of the T-shaped rod. The dosing frame is fixedly installed at the bottom of the inner wall of the proportioning frame. The dosing hole is opened on the circumferential surface of the dosing frame. The T-shaped plate is slidably installed on the inner wall of the dosing frame. The dosing pipe is fixedly installed at the bottom of the dosing frame. Concentrated cleaning agent is provided inside the proportioning frame.

[0010] According to the above technical solution, the proportioning rod penetrates through the inner and outer walls of the proportioning frame. A sealing plate is fixedly installed on the right side of the proportioning rod. A sealing hole is opened at the top of the sealing plate. A cross rubber valve is provided inside the dosing pipe. When the sealing plate moves to the right, the sealing hole is aligned with the dosing pipe.

[0011] According to the above technical solution, a third spring is arranged between the T-shaped rod and the proportioning rod, and the proportioning rod can be driven to reset by the third spring. A fourth spring is arranged between the dosing frame and the T-shaped plate, and the T-shaped plate can be driven to reset by the fourth spring. The top of the T-shaped plate is set as an inclined surface. The proportioning rod contacts the clamping plate, and the proportioning rod contacts the T-shaped plate.

[0012] According to the above technical solution, the protection component includes a protection tube, a protection plate, a protection rod, a protection tube, a return spring and a protection hole. The protection tube moves forward to contact the button and block the button. The protection tube is fixedly penetrated through the inner and outer walls of the ultrasonic cleaning machine body. The protection plate is slidably installed on the inner wall of the protection tube. The protection rod is fixedly installed on the left side of the protection plate. The protection tube is slidably installed on the inner wall of the protection tube. The return spring is arranged between the protection tube and the protection tube. The protection hole is opened on the circumferential surface of the protection tube.

[0013] According to the above technical solution, a first sealing ring is arranged between the protection tube and the protection plate, and the sealing performance of the protection tube can be improved by the first sealing ring. A second sealing ring is arranged between the protection tube and the protection tube, and the sealing performance of the protection tube can be improved by the second sealing ring. The protection rod contacts the sealing plate. A third sealing ring is arranged between the lead screw and the ultrasonic cleaning machine body, and the sealing performance of the ultrasonic cleaning machine body can be improved by the third sealing ring.

[0014] The present invention provides a semiconductor cleaning device. It has the following beneficial effects:

[0015] (1) In this semiconductor cleaning equipment, the clamping plate is limited by the limiting plate and cannot move further away from the proportioning frame. By restricting the clamping plate, it is possible to avoid deformation or stress concentration on the surface of the curved semiconductor caused by uneven pressure, thereby reducing the risk of damage to the curved semiconductor during the cleaning process and ensuring more stable and uniform contact between the curved semiconductor and the cleaning agent, thus improving the accuracy and consistency of the cleaning process. (2) In this semiconductor cleaning equipment, when the clamping plate moves towards the proportioning frame, the bearing plate shakes and resets to the right under the elastic force of the first spring. The slight shaking of the bearing plate helps to shake off contaminants from the inside of the bearing plate, avoiding secondary contamination of the curved semiconductor by the contaminants, thereby making the cleaning effect of the curved semiconductor more efficient. (3) In this semiconductor cleaning equipment, the quantitative concentrated cleaning agent inside the dosing tube enters the ultrasonic cleaning machine body through the dosing tube. By adding the concentrated cleaning agent quantitatively through the dosing tube, the concentration of the cleaning agent can be precisely controlled, thereby ensuring that the cleaning agent always remains within the optimal cleaning effect range and avoiding the influence of too high or too low concentration on the cleaning effect. (4) In this semiconductor cleaning equipment, after the sealing hole is aligned with the dosing tube, the sealing plate removes the blockage of the bottom of the dosing tube. If the cleaning agent inside the ultrasonic cleaning machine body fluctuates too much and directly impacts the dosing tube, it will cause the reverse flow of the cleaning agent inside the ultrasonic cleaning machine body. By blocking the dosing tube, cross-contamination of the concentrated cleaning agent can be effectively avoided, ensuring the purity and effectiveness of the concentrated cleaning agent. (5) In this semiconductor cleaning equipment, when the protective tube moves forward, it contacts and blocks the button. By blocking the button, accidental restart of the ultrasonic cleaning machine body can be prevented, thereby reducing the risk of accidental injury during the operation and ensuring the safety of the operator and the curved semiconductor. Description of the Drawings

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 It is a schematic diagram of the position structure of the servo motor and the lead screw of the present invention;

[0018] Figure 3 For the present invention Figure 2 It is an enlarged schematic diagram of the structure of part A in the present invention;

[0019] Figure 4 It is a semi-sectional schematic diagram of the ultrasonic cleaning machine body of the present invention;

[0020] Figure 5 It is a semi-sectional schematic diagram of the proportioning frame of the present invention;

[0021] Figure 6 It is a semi-sectional schematic diagram of the protection tube of the present invention;

[0022] Figure 7This is a schematic semi-sectional view of the dosing frame of the present invention.

[0023] In the figure: 1. Ultrasonic cleaning machine body; 2. Placing groove; 3. Control panel; 4. Square groove; 5. Servo motor; 6. Lead screw; 7. Load-bearing rod; 8. Load-bearing plate; 9. Load-bearing frame; 10. Clamping plate; 11. Connecting plate; 12. Connecting rod; 13. Limiting plate; 14. Limiting groove; 151. Proportioning frame; 152. T-shaped rod; 153. Proportioning rod; 154. Dosing frame; 155. Dosing hole; 156. T-shaped plate; 157. Dosing pipe; 158. Sealing plate; 159. Sealing hole; 161. Protection pipe; 162. Protection plate; 163. Protection rod; 164. Protection pipe; 165. Return spring; 166. Protection hole; 167. Button. Specific embodiments

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0025] Please refer to Figures 1-6 , an embodiment of the present invention is: A semiconductor cleaning device includes an ultrasonic cleaning machine body 1 and also includes a fixing component. A placing groove 2 is opened on the front side of the ultrasonic cleaning machine body 1, a cleaning agent is provided inside the ultrasonic cleaning machine body 1, a square groove 4 is opened on the right side of the ultrasonic cleaning machine body 1, a servo motor 5 is fixedly installed on the inner wall of the square groove 4, a lead screw 6 is fixedly installed at the output end of the servo motor 5, a load-bearing rod 7 is fixedly installed on the inner wall of the ultrasonic cleaning machine body 1, a load-bearing plate 8 is slidably installed on the circumferential surface of the load-bearing rod 7, a load-bearing frame 9 is fixedly installed on the circumferential surface of the load-bearing rod 7, a clamping plate 10 is slidably installed on the circumferential surface of the load-bearing rod 7, the clamping plate 10 is threadedly connected with the lead screw 6, a connecting plate 11 is fixedly installed on the inner wall of the ultrasonic cleaning machine body 1, a connecting rod 12 slidably penetrates through the upper and lower walls of the connecting plate 11, a limiting plate 13 is fixedly installed at the bottom of the connecting rod 12, and a limiting groove 14 is opened at the bottom of the limiting plate 13. By restricting the clamping plate 10, it is possible to avoid the deformation or stress concentration on the surface of the curved semiconductor caused by uneven pressure, thereby reducing the risk of damage to the curved semiconductor during the cleaning process and ensuring that the contact between the curved semiconductor and the cleaning agent is more stable and uniform, thereby improving the accuracy and consistency of the cleaning process.

[0026] A first spring is arranged between the load-bearing frame 9 and the load-bearing plate 8. Through the first spring, the load-bearing plate 8 can be driven to reset. The inner wall of the placement groove 2 is fixedly installed with a control panel 3, and the control panel 3 is electrically connected to the ultrasonic cleaning machine body 1. When the clamping plate 10 moves towards the proportioning frame 151, the load-bearing plate 8 shakes and resets to the right under the elastic force of the first spring. The slight shaking of the load-bearing plate 8 helps to shake off the pollutants from the inner side of the load-bearing plate 8, avoiding secondary pollution of the curved semiconductor by the pollutants, thereby making the cleaning effect of the curved semiconductor more efficient.

[0027] A second spring is arranged between the connecting plate 11 and the limiting plate 13. Through the second spring, the limiting plate 13 can be driven to reset. A button 167 is fixedly installed on the right side of the ultrasonic cleaning machine body 1, and the button 167 is electrically connected to the ultrasonic cleaning machine body 1.

[0028] During the operation of this embodiment: Place the curved semiconductor to be cleaned between the load-bearing plate 8 and the clamping plate 10 and immerse it in the cleaning agent. At the same time, the servo motor 5 operates to drive the lead screw 6 to rotate. The rotation of the lead screw 6 drives the clamping plate 10 to move away from the proportioning frame 151. The movement of the clamping plate 10 away from the proportioning frame 151 contacts the curved semiconductor to be cleaned and squeezes the curved semiconductor. The curved semiconductor moves away from the proportioning frame 151 under the extrusion of the clamping plate 10, contacts the load-bearing plate 8 and squeezes the load-bearing plate 8. The load-bearing plate 8 moves away from the proportioning frame 151 under the extrusion of the curved semiconductor, and the load-bearing plate 8 moves away from the proportioning frame 151 to squeeze the first spring. The first spring deforms and stores energy under the extrusion of the load-bearing plate 8. At the same time, the load-bearing plate 8 moves and contacts the load-bearing frame 9 and is limited by the load-bearing frame 9. The load-bearing plate 8 cannot continue to move away from the proportioning frame 151 under the limitation of the load-bearing frame 9. The inability of the load-bearing plate 8 to continue moving away from the proportioning frame 151 cooperates with the clamping plate 10 to clamp the curved semiconductor. At the same time, the movement of the clamping plate 10 away from the proportioning frame 151 will align itself with the limiting groove 14. After the clamping plate 10 is aligned with the limiting groove 14, the limiting plate 13 moves downward under the elastic force of the second spring. The downward movement of the limiting plate 13 makes the limiting groove 14 contact the clamping plate 10 and limit the limiting plate 13. The clamping plate 10 cannot continue to move away from the proportioning frame 151 under the limitation of the limiting plate 13. At the same time, press the button 167 to start the ultrasonic cleaning machine body 1 to clean the curved semiconductor. After the cleaning operation is completed, the servo motor 5 operates to drive the lead screw 6 to rotate in the reverse direction. The reverse rotation of the lead screw 6 drives the clamping plate 10 to move towards the proportioning frame 151. The movement of the clamping plate 10 towards the proportioning frame 151 makes the load-bearing plate 8 shake and reset to the right under the elastic force of the first spring.

[0029] Please refer toFigures 1-7 , on the basis of the above embodiments, in another embodiment of the present invention, a proportioning component for maintaining the concentration of the cleaning agent is provided inside the ultrasonic cleaning machine body 1, and a protection component is provided on the right side of the ultrasonic cleaning machine body 1. The proportioning component includes a proportioning frame 151, a T-shaped rod 152, a proportioning rod 153, a dosing frame 154, a dosing hole 155, a T-shaped plate 156, and a dosing pipe 157. The proportioning frame 151 is fixedly installed on the inner wall of the ultrasonic cleaning machine body 1, the T-shaped rod 152 is fixedly installed on the inner wall of the proportioning frame 151, the proportioning rod 153 is slidably installed on the circumferential surface of the T-shaped rod 152, the dosing frame 154 is fixedly installed at the bottom of the inner wall of the proportioning frame 151, the dosing hole 155 is opened on the circumferential surface of the dosing frame 154, the T-shaped plate 156 is slidably installed on the inner wall of the dosing frame 154, and the dosing pipe 157 is fixedly installed at the bottom of the dosing frame 154. Concentrated cleaning agent is provided inside the proportioning frame 151. By quantitatively adding the concentrated cleaning agent through the dosing pipe 157, the concentration of the cleaning agent can be precisely controlled, so as to ensure that the cleaning agent always maintains within the optimal cleaning effect range, and further avoid the influence of too high or too low concentration on the cleaning effect.

[0030] The proportioning rod 153 penetrates through the inner and outer walls of the proportioning frame 151. A sealing plate 158 is fixedly installed on the right side of the proportioning rod 153. A sealing hole 159 is opened at the top of the sealing plate 158. A cross rubber valve is provided inside the dosing pipe 157. When the sealing plate 158 moves to the right, the sealing hole 159 is aligned with the dosing pipe 157. By blocking the dosing pipe 157, cross-contamination of the concentrated cleaning agent can be effectively avoided, ensuring the purity and effectiveness of the concentrated cleaning agent.

[0031] A third spring is provided between the T-shaped rod 152 and the proportioning rod 153. The third spring can drive the proportioning rod 153 to reset. A fourth spring is provided between the dosing frame 154 and the T-shaped plate 156. The fourth spring can drive the T-shaped plate 156 to reset. The top of the T-shaped plate 156 is set as an inclined surface. The proportioning rod 153 contacts the clamping plate 10, and the proportioning rod 153 contacts the T-shaped plate 156. The concentrated cleaning agent inside the proportioning frame 151 enters the inside of the dosing frame 154 through the dosing hole 155.

[0032] The protection component includes a protection tube 161, a protection plate 162, a protection rod 163, a protection pipe 164, a return spring 165, and a protection hole 166. The protection tube 161 fixedly penetrates through the inner and outer walls of the ultrasonic cleaning machine body 1. The protection plate 162 is slidably installed on the inner wall of the protection tube 161. The protection rod 163 is fixedly installed on the left side of the protection plate 162. The protection pipe 164 is slidably installed on the inner wall of the protection tube 161. The return spring 165 is provided between the protection tube 161 and the protection pipe 164. The protection hole 166 is opened on the circumferential surface of the protection pipe 164. By blocking the button 167, the ultrasonic cleaning machine body 1 can be prevented from accidentally restarting, thereby reducing the risk of accidental injury during the operation process and ensuring the safety of the operator and the curved semiconductor.

[0033] A first sealing ring is provided between the protection tube 161 and the protection plate 162. Through the first sealing ring, the sealing performance of the protection tube 161 can be improved. A second sealing ring is provided between the protection tube 161 and the protection tube 164. Through the second sealing ring, the sealing performance of the protection tube 161 can be improved. The protection rod 163 contacts the sealing plate 158. A third sealing ring is provided between the lead screw 6 and the ultrasonic cleaning machine body 1. Through the third sealing ring, the sealing performance of the ultrasonic cleaning machine body 1 can be improved.

[0034] During the operation of this embodiment: The clamping plate 10 moves towards the proportioning frame 151 and contacts and squeezes the proportioning rod 153. The proportioning rod 153 is squeezed by the clamping plate 10 and moves to the right. The proportioning rod 153 moves to the right and pulls the third spring. The third spring is pulled by the proportioning rod 153 and deforms and stores energy. At the same time, the proportioning rod 153 moves to the right and contacts the inclined surface of the T-shaped plate 156 and squeezes the T-shaped plate 156. The T-shaped plate 156 is squeezed by the proportioning rod 153 and moves downward. The T-shaped plate 156 moves downward and squeezes the fourth spring. The fourth spring is squeezed by the T-shaped plate 156 and deforms and stores energy. At the same time, the T-shaped plate 156 moves downward and seals and squeezes the quantitative concentrated cleaning agent at the bottom of the dosing frame 154. The quantitative concentrated cleaning agent at the bottom of the dosing frame 154 is squeezed by the T-shaped plate 156 and enters the inside of the dosing tube 157. The concentrated cleaning agent entering the inside of the dosing tube 157 squeezes the cross rubber valve. The cross rubber valve is squeezed by the concentrated cleaning agent and deforms and releases the seal of the dosing tube 157. At the same time, the proportioning rod 153 moves to the right and drives the sealing plate 158 to move to the right. The sealing plate 158 moves to the right so that the sealing hole 159 is aligned with the dosing tube 157. After the sealing hole 159 is aligned with the dosing tube 157, the sealing plate 158 releases the occlusion of the bottom of the dosing tube 157. After the occlusion of the bottom of the dosing tube 157 is released, the concentrated cleaning agent inside the dosing tube 157 enters the inside of the ultrasonic cleaning machine body 1 through the dosing tube 157. The concentrated cleaning agent entering the inside of the ultrasonic cleaning machine body 1 is mixed with the cleaning agent inside the ultrasonic cleaning machine body 1, thereby ensuring the stability of the cleaning agent concentration.

[0035] The proportioning rod 153 moves to the right, driving the sealing plate 158 to move to the right. The sealing plate 158 moves to the right and breaks away from the contact with the protection rod 163. After the protection rod 163 breaks away from the contact with the sealing plate 158, the protection tube 164 moves forward under the elastic force of the reset spring 165. The protection tube 164 moves forward to contact and block the button 167. When the proportioning rod 153 moves to the left under the elastic force of the No. 3 spring, the proportioning rod 153 moves to the left, driving the sealing plate 158 to move to the left. The sealing plate 158 moves to the left and contacts the protection rod 163 and squeezes the protection rod 163. 63 is squeezed to the left by the sealing plate 158, and the protection rod 163 moves to the left to drive the protection plate 162 to move to the left. The protection plate 162 moves to the left to suck the liquid inside the protection tube 161. The liquid inside the protection tube 161 is sucked to the left by the protection plate 162. The liquid inside the protection tube 161 moves to the left, so that the protection tube 164 moves backward under the action of the negative pressure inside the protection tube 161. The protection tube 164 moves backward to squeeze the No. 4 spring. The No. 4 spring is squeezed by the protection tube 164 to produce deformation and accumulate force. At the same time, the protection tube 164 moves backward to release the obstruction of the button 167.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor cleaning device, comprising an ultrasonic cleaning machine body (1), characterized in that: A placement groove (2) is formed on the front side of the ultrasonic cleaning machine body (1). A cleaning agent is provided inside the ultrasonic cleaning machine body (1). A square groove (4) is formed on the right side of the ultrasonic cleaning machine body (1). A servo motor (5) is fixedly installed on the inner wall of the square groove (4). A lead screw (6) is fixedly installed at the output end of the servo motor (5). A load-bearing rod (7) is fixedly installed on the inner wall of the ultrasonic cleaning machine body (1). A load-bearing plate (8) is slidably installed on the circumferential surface of the load-bearing rod (7). A load-bearing frame (9) is fixedly installed on the circumferential surface of the load-bearing rod (7). A clamping plate (10) is slidably installed on the circumferential surface of the load-bearing rod (7). The clamping plate (10) is threadedly connected to the lead screw (6). An adapter plate (11) is fixedly installed on the inner wall of the ultrasonic cleaning machine body (1). An adapter rod (12) slidably penetrates through the upper and lower walls of the adapter plate (11). A ratio component for maintaining the concentration of the cleaning agent is provided inside the ultrasonic cleaning machine body (1). A protection component is provided on the right side of the ultrasonic cleaning machine body (1). A limit plate (13) is fixedly installed at the bottom of the adapter rod (12). A limit groove (14) is formed at the bottom of the limit plate (13). A first spring is provided between the load-bearing frame (9) and the load-bearing plate (8). A second spring is provided between the adapter plate (11) and the limit plate (13). The load-bearing plate (8) moves to contact the load-bearing frame (9) and is limited by the load-bearing frame (9). When the clamping plate (10) moves, it will align itself with the limit groove (14). After the clamping plate (10) aligns with the limit groove (14), the limit plate (13) moves downward under the elastic force of the second spring. The downward movement of the limit plate (13) causes the limit groove (14) to contact the clamping plate (10) and limit the limit plate (13).

2. A semiconductor cleaning device according to claim 1, wherein: A control panel (3) is fixedly installed on the inner wall of the placement groove (2). The control panel (3) is electrically connected to the ultrasonic cleaning machine body (1).

3. A semiconductor cleaning device according to claim 2, characterized in that: A button (167) is fixedly installed on the right side of the ultrasonic cleaning machine body (1). The button (167) is electrically connected to the ultrasonic cleaning machine body (1).

4. A semiconductor cleaning device according to claim 3, characterized in that: The ratio component includes a ratio frame (151), a T-shaped rod (152), a ratio rod (153), a dosing frame (154), a dosing hole (155), a T-shaped plate (156), and a dosing pipe (157). The ratio frame (151) is fixedly installed on the inner wall of the ultrasonic cleaning machine body (1). The T-shaped rod (152) is fixedly installed on the inner wall of the ratio frame (151). The ratio rod (153) is slidably installed on the circumferential surface of the T-shaped rod (152). The dosing frame (154) is fixedly installed at the bottom of the inner wall of the ratio frame (151). The dosing hole (155) is formed on the circumferential surface of the dosing frame (154). The T-shaped plate (156) is slidably installed on the inner wall of the dosing frame (154). The dosing pipe (157) is fixedly installed at the bottom of the dosing frame (154). Concentrated cleaning agent is provided inside the ratio frame (151).

5. A semiconductor cleaning device according to claim 4, characterized in that: The proportioning rod (153) penetrates through the inner and outer walls of the proportioning frame (151). A sealing plate (158) is fixedly installed on the right side of the proportioning rod (153). A sealing hole (159) is formed at the top of the sealing plate (158). A cross rubber valve is arranged inside the dosing pipe (157).

6. A semiconductor cleaning device according to claim 5, characterized in that: A third spring is arranged between the T-shaped rod (152) and the proportioning rod (153). A fourth spring is arranged between the dosing frame (154) and the T-shaped plate (156). The top of the T-shaped plate (156) is set as an inclined surface. The proportioning rod (153) contacts the clamping plate (10), and the proportioning rod (153) contacts the T-shaped plate (156).

7. A semiconductor cleaning device according to claim 6, characterized in that: The protection assembly includes a protection pipe (161), a protection plate (162), a protection rod (163), a protection tube (164), a return spring (165) and a protection hole (166). The protection pipe (161) fixedly penetrates through the inner and outer walls of the ultrasonic cleaning machine body (1). The protection plate (162) is slidably installed on the inner wall of the protection pipe (161). The protection rod (163) is fixedly installed on the left side of the protection plate (162). The protection tube (164) is slidably installed on the inner wall of the protection pipe (161). The return spring (165) is arranged between the protection pipe (161) and the protection tube (164). The protection hole (166) is formed on the circumferential surface of the protection tube (164).

8. A semiconductor cleaning device according to claim 7, characterized in that: A first sealing ring is arranged between the protection pipe (161) and the protection plate (162). A second sealing ring is arranged between the protection pipe (161) and the protection tube (164). The protection rod (163) contacts the sealing plate (158). A third sealing ring is arranged between the lead screw (6) and the ultrasonic cleaning machine body (1).

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