IGBT support, IGBT module and electronic device

Abstract

The invention discloses an IGBT support, an IGBT module and an electronic device. The IGBT support comprises one or more containing parts, each containing part is arranged to be used for containing an IGBT and is provided with a first containing area used for containing a part of a collector pin of the IGBT, a second containing area used for containing a part of a gate pin of the IGBT, and a third containing area used for containing a part of an emitter pin of the IGBT, the respective portions of the collector pin and the gate pin are electrically spaced apart via the first receiving region and / or the second receiving region, and the respective portions of the collector pin and the emitter pin are electrically spaced apart via the first receiving region and / or the third receiving region; and the mounting part is arranged to be used for mounting the IGBT bracket in place at a target position. The device has the advantages of simple overall structure, small occupied space, stable working performance, flexible configuration and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to an IGBT (Insulated Gate Bipolar Transistor) bracket, an IGBT module and an electronic device. Background Art

[0002] Insulated gate bipolar transistor (IGBT) is a power semiconductor device with excellent characteristics. It has been widely used in many fields such as rail transportation, new energy vehicles, smart grid, aerospace, etc. However, this application finds that some existing insulated gate bipolar transistor products still have defects and shortcomings.

[0003] For example, for example Figure 1 In the example of an existing IGBT product shown in FIG, since the gap distance S between adjacent electrode pins a, b and c at their adjacent root positions is usually small, it may be difficult to meet electrical design requirements, such as electrical design requirements under high voltage working conditions such as 800V. Figure 2 In the existing IGBT product shown in the figure, the distance P between the electrode pin a, b or c and the high-voltage conductive part d is relatively small, which may cause insufficient electrical creepage distance and fail to meet the electrical design requirements, thereby affecting the working performance. For another example, the structure of some existing IGBT products is relatively complex, and when used, they will occupy a relatively large area on the PCBA (Printed Circuit Board Assembly), which is not conducive to the design and layout of other electronic components. In addition, when the existing IGBT product is welded to the PCBA, there is often a lack of reliable fixation of the IGBT product and the PCBA, which affects the welding operation and production efficiency, and is not conducive to ensuring product quality. Summary of the invention

[0004] In view of this, the present invention provides an IGBT bracket, an IGBT module and an electronic device, so as to solve or at least alleviate one or more of the above-mentioned problems and other problems existing in the prior art, or provide an alternative technical solution for the prior art.

[0005] First, according to one aspect of the present invention, an IGBT bracket is provided, and the IGBT bracket comprises:

[0006] one or more accommodating parts, the accommodating parts are configured to accommodate an IGBT and have a first accommodating area for accommodating a portion of a collector pin of the IGBT, a second accommodating area for accommodating a portion of a gate pin of the IGBT, and a third accommodating area for accommodating a portion of an emitter pin of the IGBT, the respective portions of the collector pin and the gate pin being electrically spaced apart via the first accommodating area and / or the second accommodating area, and the respective portions of the collector pin and the emitter pin being electrically spaced apart via the first accommodating area and / or the third accommodating area; and

[0007] The mounting portion is configured to mount the IGBT bracket in place at a target position.

[0008] In the IGBT bracket according to the present invention, optionally, the first accommodating area and / or the second accommodating area and / or the third accommodating area are configured in a groove shape and are filled with potting glue.

[0009] In the IGBT bracket according to the present invention, optionally, the respective parts of the collector pin and the gate pin are electrically separated in the lateral direction of the housing of the IGBT by the side wall of the second accommodating area, and the respective parts of the collector pin and the emitter pin are electrically separated in the lateral direction by the side wall of the third accommodating area; and / or

[0010] The gap distance between the outer end of the collector pin and the outer end of the gate pin in the longitudinal direction of the shell is not less than a first preset value, and the gap distance between the outer end of the collector pin and the outer end of the emitter pin in the longitudinal direction is not less than a second preset value.

[0011] In the IGBT bracket according to the present invention, optionally, the outer end of the collector pin is closer to the shell than the outer ends of the gate pin and the emitter pin, and / or the first preset value is equal to the second preset value.

[0012] In the IGBT bracket according to the present invention, optionally, the first accommodating area is located between the second accommodating area and the third accommodating area, and the first accommodating area, the second accommodating area and the third accommodating area are arranged side by side in a lateral direction of the housing.

[0013] In the IGBT bracket according to the present invention, optionally, a reinforcement structure is provided between two adjacent accommodating portions among the accommodating portions, and the reinforcement structure has an extension portion for spacing apart adjacent electrode pins between two IGBTs respectively located in the two adjacent accommodating portions.

[0014] In the IGBT bracket according to the present invention, optionally, the mounting portion includes a mounting hole and a bushing arranged in the mounting hole, and the IGBT bracket is mounted at the target position via a connecting member passing through the mounting hole and the bushing.

[0015] In the IGBT bracket according to the present invention, optionally, the IGBT bracket is configured in a long strip shape, the mounting portions are arranged at both ends of the IGBT bracket, and a reinforcement structure is provided between the mounting portion and the adjacent accommodating portion.

[0016] In addition, according to a second aspect of the present invention, an IGBT module is also provided, the IGBT module comprising:

[0017] one or more IGBTs; and

[0018] In the IGBT bracket as described in any one of the above items, the IGBT is arranged in a receiving portion of the IGBT bracket.

[0019] In the IGBT module according to the present invention, optionally, at least one of the IGBTs is provided with a cooling plate, which is joined to the housing of the IGBT and electrically connected to the collector pin, and the respective portions of the gate pin and the emitter pin are electrically separated from the cooling plate via the second accommodating area and the third accommodating area, respectively.

[0020] In the IGBT module according to the present invention, optionally, a heat-conducting layer made of a heat-conducting material is arranged between the cooling plate and the IGBT bracket, and / or the cooling plate is made of a copper material.

[0021] In addition, according to a second aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0022] a printed circuit board having a circuit layer formed of circuit traces;

[0023] One or more IGBT modules as described in any one of the above items, the IGBT bracket in the IGBT module is installed in place at the target position together with the printed circuit board, and the collector pin, gate pin and emitter pin of the IGBT in the IGBT module are electrically connected to the circuit layer.

[0024] The present invention has the advantages of simple overall structure, small space occupation, stable working performance and flexible configuration, etc. It can not only meet the electrical design requirements between different electrode pins of IGBT, but also meet the electrical creepage distance requirements between these electrode pins and the cooling plate of IGBT, and will not affect the design and layout of other electronic components on PCBA. In addition, the scheme of the present invention can provide reliable fixation of IGBT to PCBA, thereby facilitating the implementation of welding connection operation between them, which is beneficial to improve production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The present invention is a front view structural schematic diagram of an existing insulated gate bipolar transistor.

[0026] Figure 2 yes Figure 1 The three-dimensional structure schematic diagram of the conventional insulated gate bipolar transistor is shown.

[0027] Figure 3 It is a schematic diagram of the three-dimensional structure of an IGBT module according to an embodiment of the present invention.

[0028] Figure 4 Yes Figure 3 The illustrated embodiment of the IGBT module is a partial cross-sectional structural schematic diagram after being installed in place at a target position.

[0029] Figure 5 Yes Figure 3 The illustrated embodiment of the IGBT module is another partial cross-sectional structural schematic diagram after being installed in place at a target position. DETAILED DESCRIPTION

[0030] It should be noted that the structural composition, features and advantages of the IGBT bracket, IGBT module and electronic device according to the present invention will be described below by way of example, but all descriptions should not be used to form any limitation on the present invention. In this article, the technical terms "first", "second" and "third" are only used for distinguishing purposes and are not intended to indicate their order and relative importance. In addition, in order to simplify the drawings and facilitate clear description, the same or similar parts and features may be marked in only one or several places in the same drawing.

[0031] The present invention provides a novel IGBT module, wherein the IGBT bracket according to the present invention is configured and used. Figures 3 to 5 A specific embodiment is shown in the figure, and the present invention is described in detail below in conjunction with this embodiment.

[0032] like Figure 3As shown, the IGBT module 100 is provided with an IGBT bracket 10, on which three IGBTs 20 are exemplarily arranged, and these IGBTs 20 are respectively placed in respective receiving portions 11 of the IGBT bracket 10, and the IGBT module 100 can be installed in place at a target position through a mounting portion 12 on the IGBT bracket 10, for example, the IGBT module can be fixed to a component 60 (such as a housing, etc.) of a device such as an inverter by means of a connecting member 50 (such as a screw, a bolt, a buckle, etc.) and the mounting portion 12. Figure 4 and Figure 5 An exemplary illustration of this has been given in , and will be presented in more detail later.

[0033] The IGBT bracket 10 can be made of any suitable electrically insulating material such as plastic, and can be configured into a suitable shape structure that meets application requirements, such as Figure 3 The long strip shape shown can not only be used to place the IGBT 20 through the IGBT bracket 10, but also provide mechanical rigid support for the entire IGBT module and provide fixed support for the printed circuit board 40 subsequently connected to the IGBT module.

[0034] On the IGBT support 10, the accommodation portion 11 may be configured to include a first accommodation area 13, a second accommodation area 14, and a third accommodation area 15, so that the above three areas are used to respectively accommodate a portion of the collector pin 21, a portion of the gate pin 22, and a portion of the emitter pin 23 of the IGBT 20, so that the respective portions of the collector pin 21 and the gate pin 22 can be electrically separated through the first accommodation area 13 and / or the second accommodation area 14, and the respective portions of the collector pin 21 and the emitter pin 23 can be electrically separated through the first accommodation area 13 and / or the third accommodation area 15. The collector pin 21, the gate pin 22, and the emitter pin 23 of the IGBT 20 are arranged through the above corresponding accommodation areas of the accommodation portion 11, so that the electrical requirements of the application can be better met, and when the outer ends of these electrode pins exposed to the outside are electrically connected to the circuit configured according to the specific application, the IGBT 20 can be put into operation.

[0035] In one or some embodiments, any one or more of the first accommodation area 13, the second accommodation area 14 and the third accommodation area 15 may be configured as a groove shape to better accommodate the respective parts of the collector pin 21, the gate pin 22 and the emitter pin 23. As an optional situation, an opening may be provided at a position such as the top of the above groove structure, and then the potting glue 16 may be filled into the groove to more effectively fix and separate the electrode pins of the IGBT 20 from each other. It should be understood that the potting glue that can be used in the solution of the present invention allows many types, such as silicone resin, epoxy resin glue, polyurethane, acrylic resin, etc.

[0036] As an illustrative example, the first accommodation area 13 may be arranged in the center of the accommodation portion 11 relative to the other two accommodation areas, that is, the second accommodation area 14 and the third accommodation area 15 may be arranged on the left and right sides of the first accommodation area 13, respectively, so that these areas are arranged side by side in the lateral direction Y of the housing of the IGBT 20 that has been placed in the accommodation portion 11. As an optional situation, the second accommodation area 14 and the third accommodation area 15 may be symmetrically arranged and designed relative to the first accommodation area 13 or the housing of the IGBT 20, so as to facilitate manufacturing, assembly, application, etc.

[0037] In one or some embodiments, the first accommodation area 13 can be optionally defined by the outer wall of the second accommodation area 14, the outer wall of the third accommodation area 15 and some parts on the IGBT bracket 10, that is, the first accommodation area 13 can be directly constructed as an open cavity in one or some application scenarios. A part of the gate pin 22 can be electrically separated from a part of the collector pin 21 by the side wall of the second accommodation area 14, especially at the root position where the collector pin 21 and the gate pin 22 extend from the shell, so that electrical isolation is formed. That is, since the IGBT bracket 10 itself is made of electrically insulating material, the above parts can form a good electrical isolation effect between the respective parts of the collector pin 21 and the gate pin 22, so that the electrical design requirements are met between them. It can be understood that the present invention allows the third accommodation area 15 for the emitter pin 23 to adopt the same or similar structural design as described above, so as to achieve the same electrical isolation effect between the respective parts of the collector pin 21 and the emitter pin 23, so it will not be repeated.

[0038] As an optional situation, in the IGBT 20, the gap distance between the outer end of the collector pin 21 and the outer end of the gate pin 22 in the longitudinal direction X of the IGBT housing can also be set to be not less than a preset value (which can be set according to specific application requirements), which can be achieved, for example, by making the outer end of the collector pin 21 closer to the IGBT housing than the outer end of the gate pin 22, which will be conducive to better control and guarantee that the IGBT, and even the IGBT module as a whole, has good electrical safety performance. Similarly, the gap distance between the outer end of the collector pin 21 and the outer end of the emitter pin 23 in the longitudinal direction X can be set to be not less than another preset value, which is also allowed to be set according to specific application requirements, and can be achieved, for example, by making the outer end of the collector pin 21 closer to the housing relative to the outer end of the emitter pin 23. In one or some embodiments, the above two preset values ​​can be set to the same value, for example, when the gate pin 22 and the emitter pin 23 are configured to be symmetrically arranged relative to the collector pin 21.

[0039] refer to Figure 3 and Figure 4 As shown, a cooling plate 24 can be optionally provided on one or more IGBTs 20 in the IGBT module. The cooling plate 24 can be made of any suitable material such as copper, aluminum, aluminum alloy, etc., so as to further promote the formation of a good heat dissipation and temperature reduction treatment effect when the IGBT 20 is working. The cooling plate 24 can be joined to the IGBT housing by processes such as molding and welding, and the cooling plate 24 and the collector pin 21 are electrically connected. With the help of the first accommodating area 13, the second accommodating area 14 and the third accommodating area 15 on the aforementioned IGBT bracket 10, and as an optional potting glue arrangement, the gate pin 22 and the emitter pin 23 can be advantageously electrically separated from the cooling plate 24 by the portions located in their respective portions, so that the electrical creepage distance between the cooling plate 24 and the gate pin 22 and the emitter pin 23 can be easily promoted to meet the application design requirements. As mentioned above, the second accommodating area 14 and the third accommodating area 15 can be arranged symmetrically relative to the cooling plate 24, and the cooling plate 24 itself allows configuration according to actual application requirements.

[0040] In addition, in one or some embodiments, when one or more IGBTs 20 are arranged in the corresponding accommodation portion 11 on the IGBT bracket 10, a heat-conducting layer 30 made of a heat-conducting material may be arranged between the cooling plate 24 and the IGBT bracket 10 to further enhance the heat dissipation and temperature reduction effect. The specific material used, thickness, and arrangement position of the heat-conducting layer 30 may be arranged according to the specific application scenario.

[0041] The mounting portion 12 may be provided at any suitable position on the IGBT bracket 10, for example, at both ends of the IGBT bracket 10, so as to be used to mount the IGBT module 100 at a target position. The mounting portion may be in any feasible form, for example, Figure 3 In the example, it is shown that it can be constructed in the form of a mounting hole, so that the IGBT bracket 10 can be easily fixed in place by using a connecting member 50 such as a screw to pass through the mounting hole.

[0042] In one or some embodiments, the mounting portion 12 may be optionally provided with a bushing 17. The bushing 17 may be generally made of a rigid material such as steel or iron, and may provide a better rigid support for the mounting connection in some applications, so that the IGBT module can properly resist external impact and be durable after installation, and may especially protect the IGBT therein.

[0043] The scheme of the present invention has been described in detail above in conjunction with specific embodiments. However, it should be noted that, according to the needs of different actual application scenarios, the present invention allows for flexible design of the structure, configuration, etc. of the IGBT bracket 10 to meet specific electrical design requirements. For example, those skilled in the art can make specific designs and adjustments to the accommodating portion 11 of the IGBT bracket 10 and the structural structure of the above-mentioned three accommodating areas, the structural structure of the mounting portion 12, the configuration of the IGBT, etc. under the design concept of the present invention. The present invention does not impose any restrictions in this regard.

[0044] For example, although three IGBTs 20 are shown arranged side by side in the IGBT module 100 in the given embodiment, it should be understood that the present invention allows the IGBTs in the IGBT module to be configured in appropriate numbers as required, and they can use the same or different product models as required, and allow them to be constructed on the IGBT bracket to form a layout form that meets the requirements of specific applications.

[0045] For another example, a reinforcing structure 18 (such as a reinforcing rib, etc.) can be provided on the IGBT bracket 10 as needed to enhance the bracket rigidity, such as being arranged at any suitable position such as between two adjacent accommodating portions 11, between the mounting portion 12 and an adjacent accommodating portion 11, etc. In addition, when a reinforcing structure 18 is provided between two adjacent accommodating portions 11, it can be extended to separate adjacent electrode pins between two IGBTs 20 located in two adjacent accommodating portions 11. Figure 3 The above-mentioned extended part is schematically indicated by the reference numeral 19.

[0046] According to the solution of the present invention, an electronic device is also provided, in which the IGBT module according to the present invention can be configured. Specifically, a printed circuit board (PCB) is provided in the electronic device as a support carrier for electronic circuit connection of electronic components (such as resistors, capacitors, field effect transistors, integrated chips, etc.) required for specific applications, wherein relatively simple or complex circuit traces can be provided as required to form a circuit layer that meets the application expectations, and the printed circuit board can be designed to have a single-layer, two-layer or more-layer structure, which can be achieved by, for example, etching one or more copper layers.

[0047] According to the specific application of the electronic device, the IGBT module 100 that meets the configuration requirements can be installed and fixed together with the printed circuit board 40 at the target position, for example Figure 4 and Figure 5 As shown in the figure, the IGBT module 100 is fixed to a suitable target position through the mounting portion 12 of the IGBT module 100 by the connector 50, for example, it is mounted on a component 60 of an electronic device. Then, the corresponding collector pins 21, gate pins 22, and emitter pins 23 of the IGBT 20 located in the respective receiving portions 11 of the IGBT bracket 10 can be electrically connected to the circuit layer on the printed circuit board 40, for example, by welding, so as to form a working circuit. Since the IGBT module 100 and the printed circuit board 40 have been pre-selected and fixed in place together, the electrical connection operation between the IGBT 20 and the printed circuit board 40 is then performed, which not only ensures stable, reliable and efficient operation, but also helps to improve product quality.

[0048] Since the IGBT module, IGBT bracket, etc. according to the present invention have outstanding performances that are significantly better than existing IGBT products as described above, they can have good electrical working performance under high voltage working conditions such as 800V, which is very conducive to long-term stable and reliable operation, and the IGBT module will not occupy a large space, will not affect the layout of other electronic components on the printed circuit board, and can effectively solve the problems of reliable and efficient electrical connection operation between the IGBT module and the printed circuit board. In addition, the position of such an IGBT module on the printed circuit board is also relatively easy to adjust and change as needed.

[0049] The electronic device according to the present invention can be applied to many types of electromechanical equipment, including but not limited to motors, inverters, electric power steering gears, electronic compressors, electric vehicle brake air pumps, etc.

[0050] The above only illustrates the IGBT bracket, IGBT module and electronic device according to the present invention in detail by way of example. These examples are only used to illustrate the principle and implementation method of the present invention, but not to limit the present invention. Those skilled in the art can also make various modifications and improvements without departing from the scope of the present invention. Therefore, all equivalent technical solutions should belong to the scope of the present invention and be defined by the claims of the present invention.

Claims

1. An IGBT bracket (10), characterized in that: The IGBT bracket (10) comprises: One or more accommodating portions (11), the accommodating portions (11) being configured to accommodate an IGBT (20), and having a first accommodating area (13) for accommodating a portion of a collector pin (21) of the IGBT (20), a second accommodating area (14) for accommodating a portion of a gate pin (22) of the IGBT (20), and a third accommodating area (15) for accommodating a portion of an emitter pin (23) of the IGBT (20), the respective portions of the collector pin (21) and the gate pin (22) being electrically spaced apart via the first accommodating area (13) and / or the second accommodating area (14), and the respective portions of the collector pin (21) and the emitter pin (23) being electrically spaced apart via the first accommodating area (13) and / or the third accommodating area (15); and The mounting portion (12) is configured to mount the IGBT bracket (10) in place at a target position.

2. The IGBT bracket (10) according to claim 1, wherein: The first accommodating area (13) and / or the second accommodating area (14) and / or the third accommodating area (15) are configured in a groove shape and are filled with potting compound.

3. The IGBT bracket (10) according to claim 1, wherein: The respective portions of the collector pin (21) and the gate pin (22) are electrically separated in the lateral direction (Y) of the housing of the IGBT (20) by the side wall of the second accommodating area (14), and the respective portions of the collector pin (21) and the emitter pin (23) are electrically separated in the lateral direction (Y) by the side wall of the third accommodating area (15); and / or The gap distance between the outer end of the collector pin (21) and the outer end of the gate pin (22) in the longitudinal direction (X) of the shell is not less than a first preset value, and the gap distance between the outer end of the collector pin (21) and the outer end of the emitter pin (23) in the longitudinal direction (X) is not less than a second preset value.

4. The IGBT bracket (10) according to claim 3, wherein: The outer end of the collector pin (21) is closer to the housing than the outer end of the gate pin (22) and the outer end of the emitter pin (23), and / or the first preset value is equal to the second preset value.

5. The IGBT bracket (10) according to claim 1, wherein: The first accommodating area (13) is located between the second accommodating area (14) and the third accommodating area (15), and the first accommodating area (13), the second accommodating area (14) and the third accommodating area (15) are arranged side by side in the transverse direction (Y) of the shell.

6. The IGBT bracket (10) according to claim 1, wherein: A reinforcement structure (18) is provided between two adjacent accommodating portions (11) in the accommodating portions (11), and the reinforcement structure (18) has an extension portion for spacing apart adjacent electrode pins between two IGBTs (20) respectively located in the two adjacent accommodating portions (11).

7. The IGBT bracket (10) according to any one of claims 1 to 6, wherein: The mounting portion (12) comprises a mounting hole and a bushing (17) arranged in the mounting hole, and the IGBT bracket (10) is installed at the target position via a connecting member (50) passing through the mounting hole and the bushing (17).

8. The IGBT bracket (10) according to claim 7, wherein: The IGBT bracket (10) is configured in a long strip shape, the mounting portion (12) is arranged at both ends of the IGBT bracket (10), and a reinforcement structure (18) is provided between the mounting portion (12) and an adjacent accommodating portion (11).

9. An IGBT module (100), characterized in that: include: one or more IGBTs (20); as well as According to the IGBT bracket (10) according to any one of claims 1 to 8, the IGBT (20) is arranged in a receiving portion (11) of the IGBT bracket (10).

10. The IGBT module (100) according to claim 9, wherein: At least one of the IGBTs (20) is provided with a cooling plate (24), the cooling plate (24) being joined to the housing of the IGBT (20) and being electrically connected to the collector pin (21), and the respective portions of the gate pin (22) and the emitter pin (23) being electrically separated from the cooling plate (24) via the second accommodating area (14) and the third accommodating area (15), respectively.

11. The IGBT module (100) according to claim 10, wherein: A heat-conducting layer (30) made of a heat-conducting material is arranged between the cooling plate (24) and the IGBT bracket (10), and / or the cooling plate (24) is made of a copper material.

12. An electronic device, characterized in that: include: a printed circuit board (40) having a circuit layer formed of circuit traces; One or more IGBT modules (100) according to any one of claims 9 to 11, wherein the IGBT bracket (10) in the IGBT module (100) is installed in place at the target position together with the printed circuit board (40), and the collector pin (21), gate pin (22) and emitter pin (23) of the IGBT (20) in the IGBT module (100) are electrically connected to the circuit layer.

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