Planar surface-mounted waveguide, microwave integrated system and communication device

Abstract

The invention discloses a planar surface-mounted waveguide, a microwave integrated system and a communication device, and the waveguide comprises a first substrate, a second substrate and at least two rows of conductor arrays which are arranged at intervals. A first conductive surface is arranged at one end, facing the second substrate, of the first substrate, a second conductive surface is arranged at one end, facing the first substrate, of the second substrate, and a gap is formed between the first conductive surface and the second conductive surface. The conductor arrays are arranged between the first substrate and the second substrate and electrically connected with the first conductive face and the second conductive face respectively, and an energy transmission channel is defined by the at least two rows of conductor arrays, the first substrate and the second substrate. The waveguide provided by the invention has relatively low loss when transmitting electromagnetic waves of a high-frequency band, can improve the structural reliability through a surface-mount technology, avoids electromagnetic leakage, is simple in structure, and facilitates the realization of miniaturization design.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a planar surface-mounted waveguide, a microwave integrated system and a communication device. Background Art

[0002] In order to develop and utilize the electromagnetic spectrum in the millimeter wave and terahertz frequency bands, it is necessary to develop various functional circuits and radiating antennas, and the development of these circuits depends on transmission lines that can guide the propagation of electromagnetic waves. Commonly used planar transmission lines such as microstrip lines, strip lines, and coplanar waveguides have good transmission performance in the microwave frequency band, but have large transmission losses in the high-frequency band, including conductor loss, dielectric loss, and radiation loss. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a planar surface-mounted waveguide, a microwave integrated system and a communication device to reduce the transmission loss of energy in the high-frequency band.

[0004] In a first aspect, the present application provides a planar surface-mount waveguide, comprising: a first substrate, a second substrate, and at least two rows of conductor arrays arranged at intervals. The first substrate is provided with a first conductive surface at one end facing the second substrate, and the second substrate is provided with a second conductive surface at one end facing the first substrate, and there is a gap between the first conductive surface and the second conductive surface. The conductor array is arranged between the first substrate and the second substrate, and is electrically connected to the first conductive surface and the second conductive surface respectively, and at least two rows of the conductor array, the first substrate, and the second substrate enclose an energy transmission channel.

[0005] In a possible implementation, each row of the conductor array includes a plurality of first conductors, and the plurality of first conductors are spaced apart and distributed in a first direction; the first direction is a transmission direction of energy in the transmission channel.

[0006] In a possible implementation, the first conductor has a width dimension d1 in the first direction, and in each of the conductor arrays, there is a first spacing p between two adjacent first conductors, 1.5d1≤p≤3d1, and p≤λ / 4, where λ is the operating wavelength.

[0007] In a possible implementation, the width dimension d1 is between 0.05 mm and 5 mm.

[0008] In a possible implementation, there is a second spacing a between two adjacent rows of the conductor arrays, where a=c / (2xfc), c is the speed of light propagation in a vacuum, and fc is the cutoff frequency of the planar surface-mounted waveguide.

[0009] In a possible implementation manner, a third distance h is provided between the first substrate and the second substrate, where h≤d1.

[0010] In a possible implementation manner, a plurality of first pads are disposed on the first substrate and / or the second substrate, and the first pads correspond to the first conductors one by one.

[0011] In a possible implementation manner, a diameter of the first pad is d2, and 0.6d1≤d2≤1.2d1.

[0012] In a possible implementation, the planar surface-mounted waveguide further includes a second conductor, which is used to connect a feed source, wherein a first end of the second conductor is electrically connected to the first conductive surface, and a second end of the second conductor is electrically connected to the second conductive surface.

[0013] In a possible implementation, the planar surface-mount waveguide also includes a matching microstrip line, one end of the matching microstrip line is connected to the second conductor, the other end of the matching microstrip line is used to connect to an input microstrip line, and the end of the input microstrip line away from the matching microstrip line is used to feed a radio frequency signal.

[0014] In a possible implementation manner, a metallized via is provided on the second substrate, and the second substrate is grounded through the metallized via.

[0015] In a possible implementation manner, an insulating region is provided on a side of the second substrate facing the first substrate, and the matching microstrip line is provided in the insulating region.

[0016] In a possible implementation, a second pad is disposed on the second conductive surface, a third pad is disposed on the first conductive surface, two ends of the second conductor are respectively connected to the second pad and the third pad, and the matching microstrip line is connected to the second pad.

[0017] In a possible implementation, a slot is provided on the first substrate, the slot is connected to the transmission channel, and the planar surface-mounted waveguide is coupled to the radiation unit through the slot.

[0018] In a possible implementation manner, the transmission channel is a hollow channel.

[0019] In a possible implementation manner, at least a portion of the transmission channel is filled with a dielectric material.

[0020] In a possible implementation, the materials of the first substrate and the second substrate are non-metallic materials, the surface of one side of the first substrate is metallized to form the first conductive surface, and the surface of one side of the second substrate is metallized to form the second conductive surface.

[0021] In a possible implementation, the first substrate and the second substrate are made of metal material, the metal surface on one side of the first substrate is the first conductive surface, and the metal surface on one side of the second substrate is the second conductive surface.

[0022] In a possible implementation manner, the first conductor is a solder ball or a copper core solder ball.

[0023] In a possible implementation, the planar surface-mounted waveguide covers an electromagnetic wave frequency band of 3 GHz to 30 GHz or 30 GHz to 300 GHz.

[0024] In a second aspect, the present application also provides a microwave integrated system, which includes a first device, a second device, an input microstrip line and the planar surface-mount waveguide provided in the first aspect of the present application, one end of the input microstrip line is connected to a matching microstrip line in the waveguide, one end of the input microstrip line away from the matching microstrip line is coupled to the first device, and the waveguide is coupled to the second device.

[0025] In a possible implementation, the microwave integrated system is an electromagnetic wave transmitting system, the first device is an amplifier, a power divider or a feeding network, and the second device is an antenna.

[0026] In a possible implementation, the microwave integrated system is an electromagnetic wave receiving system, the first component is an antenna, and the second component is a chip.

[0027] In a third aspect, the present application further provides a communication device, which includes the microwave integrated system provided in the second aspect of the present application.

[0028] It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0030] Figure 1 A schematic diagram of the structure of a planar surface-mounted waveguide provided in an embodiment of the present application;

[0031] Figure 2 A schematic diagram of the structure of a microwave integrated system provided in an embodiment of the present application;

[0032] Figure 3 A schematic diagram of the structure of a microwave integrated system provided in one embodiment of the present application;

[0033] Figure 4 A schematic diagram of the structure of a microwave integrated system provided in another embodiment of the present application;

[0034] Figure 5 A front view of a planar surface-mounted waveguide provided in an embodiment of the present application;

[0035] Figure 6 A simulation diagram of the planar surface-mounted waveguide provided in an embodiment of the present application during operation;

[0036] Figure 7 Transmission coefficient and return loss curve of the planar surface-mounted waveguide provided in the embodiment of the present application;

[0037] Figure 8 A partial cross-sectional view of a planar surface-mounted waveguide provided in an embodiment of the present application;

[0038] Fig. 9 A side view of a planar surface-mounted waveguide provided in one embodiment of the present application;

[0039] Fig.10 A partial side view of a planar surface-mounted waveguide provided in another embodiment of the present application;

[0040] Fig.11 for Figure 2 The enlarged view at A in FIG.

[0041] Fig.12 Transmission coefficient and return loss curve of the microwave integrated system provided in the embodiment of the present application.

[0042] Reference numerals:

[0043] 10- waveguide;

[0044] 20- Input microstrip line;

[0045] 30- first device;

[0046] 40- second device;

[0047] 1-first substrate;

[0048] 11- a first conductive surface;

[0049] 12- slotting;

[0050] 2- second substrate;

[0051] 21- a second conductive surface;

[0052] 22-insulation area;

[0053] 23-metallized vias;

[0054] 24- second pad;

[0055] 3- Conductor array;

[0056] 31- a first conductor;

[0057] 4-Transmission channel;

[0058] 5- a second conductor;

[0059] 6-Matching microstrip line;

[0060] 7- first pad;

[0061] X-first direction;

[0062] Y-second direction;

[0063] Z-thickness direction. DETAILED DESCRIPTION

[0064] In order to better understand the technical solution of this specification, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0065] It should be clear that the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0066] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit this specification. The singular forms of "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0067] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0068] Surface-mounted waveguide: A device that uses metal wires to conduct current and electromagnetic waves on a dielectric plane, enabling high-speed, high-capacity, and low-loss information transmission.

[0069] Cutoff frequency: refers to the boundary frequency at which the output signal energy of a system begins to drop sharply (or rise sharply in a band-stop filter).

[0070] Wavelength: or operating wavelength, which can be the wavelength corresponding to the center frequency of the resonant frequency or the center frequency of the operating frequency band supported by the antenna. For example, assuming that the center frequency of the B1 uplink frequency band (resonant frequency is 1920MHz to 1980MHz) is 1955MHz, then the operating wavelength can be the wavelength calculated using the frequency of 1955MHz. Not limited to the center frequency, "operating wavelength" can also refer to the wavelength corresponding to the non-center frequency of the resonant frequency or the operating frequency band.

[0071] Coupling: can be understood as direct coupling and / or indirect coupling, and "coupled connection" can be understood as direct coupling connection and / or indirect coupling connection. Direct coupling can also be called "electrical connection", which is understood as the physical contact and electrical conduction between components; it can also be understood as the connection between different components in the circuit structure through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals; "indirect coupling" can be understood as two conductors being electrically conductive in an airless / non-contact manner. In one embodiment, indirect coupling can also be called capacitive coupling, for example, signal transmission is achieved by coupling between the gaps between two conductive parts to form an equivalent capacitor.

[0072] The high-frequency band of electromagnetic waves generally includes microwave band (3GHz ~ 30GHz), millimeter wave band (30GHz ~ 300GHz) or band greater than 300GHz. The guidance and propagation of high-frequency electromagnetic waves usually rely on transmission lines that can guide the propagation of electromagnetic waves. Commonly used planar transmission lines generally include microstrip (MS), stripline (SPL) and coplanar waveguide (CPW). These transmission lines have large transmission losses in high-frequency bands, including conductor loss, dielectric loss and radiation loss.

[0073] Figure 1 This is a schematic diagram of the structure of the planar surface-mounted waveguide provided in the embodiment of the present application, referring to Figure 1 , an embodiment of the present application provides a planar surface mounted waveguide (hereinafter referred to as waveguide). Figure 2 The schematic diagram of the structure of the microwave integrated system provided in the embodiment of the present application is shown in FIG. Figure 2 , the waveguide 10 can be applied to a microwave integrated system, which is mainly used to transmit electromagnetic waves. The microwave integrated system includes a first device 30, a second device 40, and an input microstrip line 20. The input microstrip line 20 includes an input end and an output end, the input end is coupled to the first device 30, and is used to receive an energy signal from the first device 30, the output end can be connected to the waveguide through a matching microstrip line 6, and the input microstrip line 20 can propagate the energy signal to the waveguide through the matching microstrip line 6. The matching microstrip line 6 can match the impedance of the waveguide and the input microstrip line 20 to enhance the effect of energy transmission and reduce energy reflection loss. The waveguide can be coupled to the second device 40 to propagate energy to the second device 40.

[0074] In one embodiment, Figure 3 A schematic diagram of a microwave integrated system according to an embodiment of the present application is shown in FIG. Figure 3 , the microwave integrated system can be an electromagnetic wave receiving system, wherein the first device 30 can be a signal receiving device for receiving external electromagnetic signals, such as a receiving antenna, and the first device 30 can transmit the received electromagnetic signal to the second device 40 through a waveguide, and the second device 40 can be a chip or other device for processing the signal. In another embodiment, Figure 4 A schematic diagram of a microwave integrated system according to another embodiment of the present invention is shown in FIG. Figure 4, the microwave integrated system can also be an electromagnetic wave transmitting system, wherein the first device 30 can be a device for feeding electromagnetic signals into the waveguide, such as an amplifier, a power divider, a coupler, an antenna feeding network, etc., and the second device 40 can be a device for transmitting electromagnetic waves such as an antenna, and the electromagnetic energy fed by the first device 30 can be transmitted to the second device 40 through the waveguide, and radiated outward through the second device 40. Among them, the waveguide provided in this embodiment can play a role in transmitting electromagnetic signals in the system, and can be used for both the emission and reception of electromagnetic signals. It can reduce the loss in the process of electromagnetic energy propagation and improve the quality of electromagnetic signal reception and transmission. In addition, the waveguide provided in this embodiment can be specifically applied to millimeter wave high-density integrated RF front-end, multiple input multiple output (MIMO) phased array, 5G / 6G base station RF front-end and other architectures.

[0075] In one embodiment, the microwave integrated system can be applied to a communication device, which can be a terminal device or a communication base station. In one embodiment, the communication base station can be a 4G base station, a 5G base station, a 6G base station, etc. In one embodiment, the terminal device is also called a terminal, a user equipment (UE), a mobile station, or a mobile terminal. The terminal device can be widely used in various scenarios, such as D2D communication, V2X communication, machine-type communication (MTC), IoT, virtual reality, augmented reality, industrial control, automatic driving, telemedicine, smart grid, smart furniture, smart office, smart wear, smart transportation, or smart city. For example, the terminal device can be: a mobile phone, a computer, a mobile internet device (MID), a wearable device, a virtual reality (VR) device, an augmented reality (AR) device, a robotic arm, a camera, a robot, or a smart home device (such as a TV, an air conditioner, a sweeper, a speaker, a set-top box), a relay, a customer premise equipment (CPE), etc.

[0076] The various terminal devices introduced above, if located on a vehicle (e.g. placed / installed in a vehicle), can all be considered as on-board terminal devices. On-board terminal devices can be built into the vehicle's on-board module, on-board module, on-board component, on-board chip or on-board unit as one or more components or units. The on-board terminal device can be a complete vehicle device, an on-board module, a vehicle, an on-board unit (OBU), a roadside unit (RSU), a telematics box (T-box), a chip or a system on chip (SOC), etc. The above chip or SOC can be installed in a vehicle, OBU, RSU or T-box.

[0077] In the embodiments of the present application, the device for realizing the function of the terminal device may be the terminal device itself, or may be a device capable of supporting the terminal device to realize the function, such as a chip system or a combination device or component capable of realizing the function of the terminal device, and the device may be installed in the terminal device. The embodiments of the present application do not limit the specific technology and specific device form adopted by the terminal device.

[0078] Terminal equipment may also be referred to as terminal, terminal device, user equipment (UE), mobile station, mobile terminal, etc. Terminals can be widely used in various scenarios, for example, device-to-device (D2D), vehicle to everything (V2X) communication, machine-type communication (MTC), Internet of Things (IOT), virtual reality, augmented reality, industrial control, automatic driving, telemedicine, smart grid, smart furniture, smart office, smart wear, smart transportation, smart city, etc. The terminal may be a mobile phone, a tablet computer, a computer with wireless transceiver function, a wearable device, a vehicle, a drone, a helicopter, an airplane, a ship, a robot, a mechanical arm, a smart home device, etc. The embodiments of the present application do not limit the specific technology and specific device form adopted by the terminal.

[0079] In one embodiment, referring to Figure 1The waveguide provided in this embodiment includes a first substrate 1 and a second substrate 2, wherein a first conductive surface 11 is provided at one end of the first substrate 1 facing the second substrate 2, and a second conductive surface 21 is provided at one end of the second substrate 2 facing the first substrate 1, and a gap is provided between the first conductive surface 11 and the second conductive surface 21. Exemplarily, the first substrate 1 and the second substrate 2 can both be made of metal materials, for example, the first substrate 1 and the second substrate 2 can both be made of metal plates, the surface of the first substrate 1 facing the second substrate 2 can be used as the first conductive surface 11, and the surface of the second substrate 2 facing the first substrate 1 can be used as the second conductive surface 21. The first substrate 1 and the second substrate 2 made of metal plates can have good integrity and good structural reliability. Exemplarily, the materials of the first substrate 1 and the second substrate 2 can both be non-metallic materials, the surface of the first substrate 1 facing the first substrate 1 is formed by metallization to form the first conductive surface 11, and the surface of the second substrate 2 facing the first substrate 1 is formed by metallization to form the second conductive surface 21. Compared with the first substrate 1 and the second substrate 2 made of metal plates, the first substrate 1 and the second substrate 2 made of non-metallic materials have relatively light weight, which is conducive to achieving a lightweight design of the entire waveguide.

[0080] Reference Figure 1 , the waveguide also includes at least two rows of conductor arrays 3 arranged at intervals, the conductor arrays 3 are arranged between the first substrate 1 and the second substrate 2, and are electrically connected to the first conductive surface 11 and the second conductive surface 21 respectively, and at least two rows of conductor arrays 3, the first substrate 1 and the second substrate 2 form a transmission channel 4 for transmitting electromagnetic energy. In one embodiment, the transmission channel 4 can be used to propagate electromagnetic waves. Among them, the conductor array 3 is an array structure composed of multiple conductors in a specific arrangement, which is not attached to the dielectric material and can be independently processed and manufactured. In one embodiment, the conductor array 3 can be arranged in a "one" shape along a single direction.

[0081] For the sake of convenience, reference is made to Figure 1 , the propagation direction of the electromagnetic wave can be defined as a first direction X, the arrangement direction of at least two rows of conductor arrays 3 is a second direction Y, and the first direction X, the second direction Y and the thickness direction Z of the waveguide are perpendicular to each other. In one embodiment, Figure 5 This is a front view of a planar surface mounted waveguide provided in an embodiment of the present application, referring to Figure 5, the conductor array 3 has two rows, and a transmission channel 4 is formed between the two rows of conductor arrays 3 and the first conductive surface 11 and the second conductive surface 21. The transmission channel 4 can be an approximately rectangular cavity. Among them, the first substrate 1 and the second substrate 2 can form two side walls with conductive functions of the transmission channel 4 in the thickness direction Z of the waveguide, and the two rows of conductor arrays 3 can form the other two side walls with conductive functions of the transmission channel 4 in the second direction Y. The transmission channel 4 is connected on both sides in the first direction X. Therefore, the electromagnetic field energy can be constrained inside the transmission channel 4 through the first substrate 1, the second substrate 2 and the two rows of conductor arrays 3, thereby ensuring the quality of electromagnetic wave propagation in the first direction X.

[0082] The waveguide provided in this embodiment is not an integrally formed structure, nor is it a waveguide that is physically closed all around. Instead, it adopts a structure in which the first substrate 1, the second substrate 2 and the conductor array 3 are assembled and matched. As described above, the conductor array 3 includes a plurality of independent conductors arranged in an array and having a conductive function. There are certain gaps in space between these conductors, that is, the four sides of the waveguide are not completely closed in physical structure, but the first substrate 1, the second substrate 2 and the conductor array 3 can still be equivalent to a cavity that can constrain electromagnetic waves, thereby making the design of the waveguide more flexible and conducive to miniaturization. In addition, the above-mentioned cavity can be a hollow cavity, so that energy is transmitted in the air in the transmission channel 4, thereby avoiding the dielectric loss caused by transmission in the dielectric material. The waveguide of this structure can achieve low loss in high-frequency bands such as microwave bands (3GHz~30GHz), millimeter wave bands (30GHz~300GHz) or bands greater than 300GHz, and can obtain good high-frequency transmission characteristics.

[0083] Figure 6 This is a simulation diagram of the planar surface-mounted waveguide provided in the embodiment of the present application during operation. Figure 7 The transmission coefficient and return loss curve of the planar surface-mounted waveguide provided in the embodiment of the present application is shown in FIG. Figure 7 The waveguide model corresponding to the curve shown is: the distance between the two rows of conductor arrays 3 is 4mm, the diameter of each conductor in the conductor array 3 is 0.8mm, and the spacing between two adjacent conductors in each conductor array 3 is 1.2mm. The thickness of the first substrate 1 and the second substrate 2 are both 0.254mm, and the material of the first substrate 1 and the second substrate 2 is MT40 material (dielectric constant 3.38, loss tangent 0.008) substrate. The first substrate 1 is formed by metallization to form a first conductive surface 11, and the second substrate 2 is formed by metallization to form a second conductive surface 21. Figure 7Curve a is the return loss (S11) curve, and curve b is the transmission coefficient (S21) curve. In the 50 GHz to 100 GHz millimeter wave frequency band, S11 is better than -20 dB, and S21 is better than -0.01 dB. It can be seen that the waveguide provided in this embodiment has good high-frequency transmission characteristics.

[0084] In addition, in some other embodiments, at least part of the space in the transmission channel 4 may also be filled with dielectric material. The dielectric material can play a role in constraining electromagnetic waves, which is conducive to the miniaturization design of the waveguide. In some scenarios where space is limited, the size of the waveguide can be reduced by filling the transmission channel 4 with a dielectric, thereby broadening the application scenarios of the waveguide. In one embodiment, the dielectric material may be a semi-cured material such as polyimide (PI) or aromatic benzocyclobutene film (ABF), which can ensure the normal transmission of electromagnetic waves while being conducive to the miniaturization design of the waveguide.

[0085] In one embodiment, Figure 8 This is a partial cross-sectional view of the planar surface-mounted waveguide provided in the embodiment of the present application, referring to Figure 8 Each conductor array 3 includes a plurality of first conductors 31, and the plurality of first conductors 31 are spaced apart in the first direction X. Each first conductor 31 is an independent structure and has a conductive function. For example, the first conductor 31 is a sphere or a cylinder made of a metal material. There is a certain interval between two adjacent first conductors 31 along the first direction X. Although there is such an interval in the physical structure, the electromagnetic field energy can still be confined within the transmission channel 4, and there will be no electromagnetic field energy leakage problem. The waveguide of this structure ensures the transmission quality of the electromagnetic field energy, and also achieves low loss in high-frequency bands such as the millimeter wave band, and can obtain good high-frequency transmission characteristics.

[0086] In one embodiment, the first conductor 31 may be a sphere, an ellipsoid, a trapezoid or a regular polygon. The structural shape of the first conductor 31 may be determined accordingly in a specific design scenario. This embodiment is only exemplified by taking the first conductor 31 as a sphere. Among them, the conductor array 3 composed of a plurality of first conductors 31 in the shape of a sphere is a ball grid array (BGA). In one embodiment, the first conductor 31 may be a solder ball or a copper core solder ball, and the first conductor 31 of the solder ball or copper core solder ball material may be easy to weld, and at the same time, the welding reliability between the first conductor 31 and the first substrate 1 and the second substrate 2 may be ensured. In one embodiment, the first conductor 31 may be fixed to the first substrate 1 and the second substrate 2 by surface mount technology (SMT), so as to facilitate the assembly and manufacture of the waveguide, and at the same time, the reliability of the connection between the first conductor 31, the first substrate 1 and the second substrate 2 may be ensured, and electromagnetic leakage may be avoided due to a gap between the first conductor 31 and the first substrate 1 or between the first conductor 31 and the second substrate 2.

[0087] In one embodiment, Fig. 9 This is a side view of a planar surface mounted waveguide provided in an embodiment of the present application, referring to Fig. 9 , the first conductor 31 has a width dimension d1 in the first direction X, and in each conductor array 3, there is a first spacing p between two adjacent first conductors 31, 1.5d1≤p≤3d1, and p≤λ / 4, λ is the working wavelength. Among them, the first spacing p is the distance between the geometric centers of two adjacent first conductors 31. When the first conductor 31 is a sphere, the width dimension d1 is the diameter dimension of the sphere. When the first conductor 31 is a cube or a cuboid, the width dimension d1 is the side length of the cube or cuboid along the first direction X. By making a certain spacing between two adjacent first conductors 31 along the first direction X, it is possible to facilitate the connection operation of each first conductor 31 with the first substrate 1 and the second substrate 2, ensure the connection quality, and reduce the overall weight of the waveguide, which is conducive to achieving light and thin waveguide. In addition, by making the first spacing p between 1.5d1 and 3d1, while facilitating the connection between the first conductor 31 and the first substrate 1 and the second substrate 2, it is possible to avoid leakage of electromagnetic field energy from the first gap p, thereby ensuring effective transmission of electromagnetic field energy in the transmission channel 4 and ensuring transmission quality.

[0088] In one embodiment, referring to Fig.10, the width dimension d1 of the first conductor 31 in the first direction X needs to be controlled within a certain range. If the width dimension d1 is too small, for example, less than 0.05 mm, it is not conducive to the reliable connection of the first conductor 31 with the first substrate 1 and the second substrate 2 respectively. If the width dimension d1 is too large, for example, greater than 5 mm, the waveguide will be required to have a larger structure, which will also cause the transmission frequency band to be lower, which is not conducive to the transmission of electromagnetic waves in the millimeter wave band. For this reason, in this embodiment, the above-mentioned width dimension d1 can be between 0.05 mm and 5 mm, which can not only facilitate the connection between the first conductor 31 and the corresponding substrate and ensure the connection reliability, but also facilitate the high-quality transmission of energy in high-frequency bands such as millimeter wave bands. Exemplarily, the width dimension d1 can be 0.05 mm, 1 mm, 2 mm, 3 mm, 4 mm, and 5 mm.

[0089] In one embodiment, referring to Figure 6 , there is a second spacing a between two adjacent conductor arrays 3, a=c / (2ⅹfc), c is the speed of light propagation in a vacuum, and fc is the cutoff frequency of the waveguide. Among them, the value of the second spacing a can be set according to the operating frequency band of the waveguide. Exemplarily, when transmitting electromagnetic waves in the millimeter wave frequency band, the value of the second spacing a can be set according to the operating frequency band of 30GHz to 300GHz to achieve effective transmission of electromagnetic waves in the millimeter wave frequency band by the waveguide.

[0090] In one embodiment, referring to Fig. 9 , there is a third spacing h between the first substrate 1 and the second substrate 2, h≤d1. The third spacing h is the distance between the first conductive surface 11 and the second conductive surface 21, which is conducive to miniaturization of the waveguide in the thickness direction Z, and can also cooperate with the size of the first conductor 31 and the first gap between two adjacent first conductors 31 to achieve high-quality transmission of electromagnetic waves in the millimeter wave frequency band and reduce losses.

[0091] In one embodiment, Fig.10 A partial side view of a planar surface-mounted waveguide provided in another embodiment of the present application, referring to Fig.10, a plurality of first pads 7 are provided on the first substrate 1 and / or the second substrate 2, and the first pads 7 correspond to the first conductor 31 one by one. For the sake of convenience, the first pads 7 on the first substrate 1 are taken as an example for explanation. The first pads 7 may be a structure independently processed on the first substrate 1, or may be a metal conductive part leaked at a preset position on the first substrate 1, and the first conductor 31 may be welded and connected to the first pads 7 to achieve the connection and fixation of the first conductor 31 to the first substrate 1. The first pads 7 can ensure the position accuracy of the first conductor 31 connected to the first substrate 1, and can also ensure the reliability of the connection of the first conductor 31 on the first substrate 1. In addition, the first pads 7 on the second substrate 2 may have the same structure and function as the first pads 7 on the first substrate 1, which will not be repeated here.

[0092] In order to achieve the welding effect between the first conductor 31 and the first substrate 1 and the second substrate 2, the first pad 7 needs to have certain size requirements. If the size of the first pad 7 is too small, problems such as open welding and the first conductor 31 falling off are likely to occur after welding, and the welding reliability between the first conductor 31 and the first substrate 1 or the second substrate 2 cannot be guaranteed. If the size of the first pad 7 is too large, the position accuracy of the welding will be reduced. In one embodiment, refer to Fig.10 The diameter of the first soldering pad 7 is d2, 0.6d1≤d2≤1.2d1. By making the diameter d2 of the first soldering pad 7 and the size d1 of the first conductor 31 satisfy the above relationship, the size of the first soldering pad 7 can be made close to the size of the first conductor 31, which can ensure the reliability of welding and the position accuracy of welding.

[0093] In one embodiment, referring to Figure 2, the waveguide also includes a second conductor 5, the second conductor 5 is used to connect the feed source, the feed source can be a structure or device for feeding electromagnetic signals to the second conductor 5, and the second conductor 5 can be directly connected to the feed source or indirectly connected. In this embodiment, the second conductor 5 is indirectly connected to the feed source, and specifically can be connected to the feed source through the input microstrip line 20. The first end of the second conductor 5 is electrically connected to the first conductive surface 11, and the second end of the second conductor 5 is electrically connected to the second conductive surface 21. Among them, the second conductor 5 and the first conductor 31 can have the same structure, and the connection form between the second conductor 5 and the first substrate 1 and the second substrate 2 can be the same as the connection form between the first conductor 31 and the first substrate 1 and the second substrate 2. Exemplarily, the second conductor 5 can be soldered to the first substrate 1 and the second substrate 2 by SMT surface mounting technology. The second conductor 5 is used to receive an input signal from the first device 30, and the input signal can be further transmitted to the second device 40 behind through the waveguide. In one embodiment, the second conductor 5 can be arranged at one end of the waveguide along the first direction X and located at the center of the waveguide in the second direction Y, thereby enabling the signal energy input to the waveguide to be transmitted evenly and stably, thereby ensuring the transmission quality.

[0094] In one embodiment, Fig.11 for Figure 2 The enlarged view at A in Figure 2 shows the Fig.11 , the waveguide also includes a matching microstrip line 6, one end of the matching microstrip line 6 is connected to the second conductor 5, and the other end of the matching microstrip line 6 is used to connect the input microstrip line 20. The end of the input microstrip line 20 away from the matching microstrip line 6 can be connected to the first device 30, and is used to receive the radio frequency signal fed from the first device 30. Among them, the impedance of the input microstrip line 20 and the impedance of the waveguide have a certain difference. For example, the input microstrip line 20 transmits the TEM mode, and the waveguide transmits the TE10 mode. If the input microstrip line 20 is directly connected to the waveguide, due to the impedance mismatch of the two modes, part of the electromagnetic wave will be reflected and cannot be effectively transmitted, resulting in energy loss. By setting the matching microstrip line 6 between the input microstrip line 20 and the second conductor 5, the impedance between the input microstrip line 20 and the waveguide can be matched by the matching microstrip line 6, so that energy can be effectively transmitted between the input microstrip line 20 and the waveguide, reducing losses and improving energy transmission quality.

[0095] Fig.12 The transmission coefficient and return loss curve of the microwave integrated system provided in the embodiment of the present application are as follows: Fig.12The model of the microwave integrated system corresponding to the curve shown is: the distance between the two rows of conductor arrays 3 in the waveguide is 6mm, the diameter of each conductor in the conductor array 3 is 0.3mm, and in each conductor array 3, the spacing between two adjacent first conductors 31 is 0.5mm. The thickness of the first substrate 1 and the second substrate 2 are both 0.254mm, and the material of the first substrate 1 and the second substrate 2 is MT40 material (dielectric constant 3.38, loss tangent 0.008) substrate. The first conductive surface 11 is formed by metallization on the first substrate 1, and the second conductive surface 21 is formed by metallization on the second substrate 2. Fig.12 , curve c is the return loss (S11) curve, and curve d is the transmission coefficient (S21) curve. In the 40GHz to 60GHz frequency band, the S11 of the microwave integrated system is better than -15dB, and the insertion loss is less than 0.36dB. It can be seen that the microwave integrated system provided in this embodiment has the characteristics of broadband and low loss. In one embodiment, refer to Fig.11 , a metallized via 23 is provided on the second substrate 2, and the second substrate 2 is grounded through the metallized via 23. The area of ​​the second substrate 2 is larger than that of the first substrate 1. In the thickness direction Z of the waveguide, the portion of the second substrate 2 that overlaps with the projection of the first substrate 1 can be used as a part of the transmission channel 4, and the rest of the second substrate 2 can be used to arrange the input microstrip line 20 and to set the metallized via 23. By setting the metallized via 23 on the second substrate 2, it is possible to design a grounding structure without occupying additional space, which is conducive to the miniaturization and thinness design of the waveguide.

[0096] In one embodiment, referring to Figure 2 An insulating region 22 is provided on the side of the second substrate 2 facing the first substrate 1, and the matching microstrip line 6 is provided in the insulating region 22, so as to avoid the matching microstrip line 6 from contacting with the conductive part on the second substrate 2 and causing a short circuit. The insulating region 22 may be in a circular, square, elliptical, trapezoidal, or other shapes. In addition, the insulating region 22 may also surround the periphery of the second conductor 5 to avoid the second conductor 5 from contacting with the nearby conductive structure and causing a short circuit.

[0097] In one embodiment, referring to Fig.11 , a second pad 24 is provided on the second conductive surface 21, a third pad (not shown in the figure) is provided on the first conductive surface 11, two ends of the second conductor 5 are connected to the second pad 24 and the third pad respectively, and the matching microstrip line 6 is connected to the second pad 24. The second pad 24 and the third pad may have the same structure as the first pad 7, and the reliability of the connection between the second conductor 5 and the first substrate 1 and the second substrate 2 can be ensured by the second pad 24 and the third pad, and the second conductor 5 can be ensured to have a high welding accuracy.

[0098] According to the above description, in the microwave integrated system, the waveguide can be used to connect between the first device 30 and the second device 40, and the waveguide can transmit the electromagnetic signal received from the first device 30 to the second device 40. In one embodiment, referring to Figure 4 When the microwave integrated system can also be an electromagnetic wave transmitting system, the first device 30 can be a feeding network, and the second device 40 can be an antenna. The feeding network can feed the antenna through a waveguide, so that the antenna can radiate high-frequency electromagnetic waves. Among them, a slot 12 can be provided on the first substrate 1 of the waveguide, and the slot 12 is connected to the transmission channel 4. The waveguide is coupled to the antenna through the slot 12 to transmit energy to the antenna by coupling. Among them, the waveguide can be integrated as a whole at the bottom of the antenna, so as to improve the compactness of the waveguide and antenna integration and reduce space occupancy.

[0099] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A planar surface mounted waveguide, characterized in that: include: A first substrate and a second substrate, wherein the first substrate is provided with a first conductive surface at one end facing the second substrate, and the second substrate is provided with a second conductive surface at one end facing the first substrate, and there is a gap between the first conductive surface and the second conductive surface; At least two rows of conductor arrays are arranged at intervals, and the conductor arrays are arranged between the first substrate and the second substrate, and are electrically connected to the first conductive surface and the second conductive surface respectively. At least two rows of conductor arrays, the first substrate and the second substrate form an energy transmission channel.

2. The planar surface-mount waveguide according to claim 1, characterized in that: Each row of the conductor array includes a plurality of first conductors, and the plurality of first conductors are spaced apart and distributed in a first direction; the first direction is a transmission direction of energy in the transmission channel.

3. The planar surface-mount waveguide according to claim 2, characterized in that: The first conductor has a width dimension d1 in the first direction. In each of the conductor arrays, there is a first spacing p between two adjacent first conductors, 1.5d1≤p≤3d1, and p≤λ / 4, where λ is the operating wavelength.

4. The planar surface-mount waveguide according to claim 3, characterized in that: The width dimension d1 is between 0.05 mm and 5 mm.

5. The planar surface-mount waveguide according to any one of claims 1 to 4, characterized in that: There is a second spacing a between two adjacent rows of the conductor arrays, where a=c / (2xfc), c is the speed of light propagation in a vacuum, and fc is the cutoff frequency of the planar surface-mounted waveguide.

6. The planar surface-mount waveguide according to claim 3 or 4, characterized in that: There is a third distance h between the first substrate and the second substrate, where h≤d1.

7. The planar surface-mount waveguide according to claim 3 or 4, characterized in that: A plurality of first pads are disposed on the first substrate and / or the second substrate, and the first pads correspond to the first conductors one by one.

8. The planar surface mounted waveguide according to claim 7, characterized in that: The diameter of the first pad is d2, 0.6d1≤d2≤1.2d1.

9. The planar surface-mount waveguide according to any one of claims 1 to 8, characterized in that: It also includes a second conductor, which is used to connect to a feed source, wherein a first end of the second conductor is electrically connected to the first conductive surface, and a second end of the second conductor is electrically connected to the second conductive surface.

10. The planar surface-mount waveguide according to claim 9, characterized in that: It also includes a matching microstrip line, one end of which is connected to the second conductor, the other end of which is used to connect to an input microstrip line, and the end of the input microstrip line away from the matching microstrip line is used to feed a radio frequency signal.

11. The planar surface-mount waveguide according to claim 10, characterized in that: The second substrate is provided with a metallized via hole, and the second substrate is grounded through the metallized via hole.

12. The planar surface-mount waveguide according to claim 10, characterized in that: An insulating region is arranged on a side of the second substrate facing the first substrate, and the matching microstrip line is arranged in the insulating region.

13. The planar surface-mount waveguide according to any one of claims 10 to 12, characterized in that: A second pad is disposed on the second conductive surface, a third pad is disposed on the first conductive surface, two ends of the second conductor are respectively connected to the second pad and the third pad, and the matching microstrip line is connected to the second pad.

14. The planar surface-mount waveguide according to any one of claims 1 to 13, characterized in that: The first substrate is provided with a slot, the slot is communicated with the transmission channel, and the planar surface-mounted waveguide is coupled with the radiation unit through the slot.

15. The planar surface-mount waveguide according to any one of claims 1 to 14, characterized in that: The transmission channel is a hollow channel.

16. The planar surface-mount waveguide according to any one of claims 1 to 14, characterized in that: At least a portion of the transmission channel is filled with a dielectric material.

17. The planar surface-mount waveguide according to any one of claims 1 to 16, characterized in that: The materials of the first substrate and the second substrate are non-metallic materials. The surface of one side of the first substrate is metallized to form the first conductive surface, and the surface of one side of the second substrate is metallized to form the second conductive surface.

18. The planar surface-mount waveguide according to any one of claims 1 to 16, characterized in that: The materials of the first substrate and the second substrate are metal materials, the metal surface on one side of the first substrate is the first conductive surface, and the metal surface on one side of the second substrate is the second conductive surface.

19. The planar surface-mount waveguide according to any one of claims 1 to 18, characterized in that: The first conductor is a solder ball or a copper core solder ball.

20. The planar surface-mount waveguide according to any one of claims 1 to 19, characterized in that: The electromagnetic wave frequency band covered by the planar surface-mounted waveguide is 3 GHz to 30 GHz or 30 GHz to 300 GHz.

21. A microwave integrated system, characterized in that: It comprises a first device, a second device, an input microstrip line and a planar surface-mount waveguide as described in any one of claims 1 to 20, wherein one end of the input microstrip line is connected to a matching microstrip line in the waveguide, one end of the input microstrip line away from the matching microstrip line is coupled to the first device, and the waveguide is coupled to the second device.

22. The microwave integrated system according to claim 21, characterized in that: The microwave integrated system is an electromagnetic wave transmitting system, the first device is an amplifier, a power divider or a feeding network, and the second device is an antenna.

23. The microwave integrated system according to claim 21, characterized in that: The microwave integrated system is an electromagnetic wave receiving system, the first component is an antenna, and the second component is a chip.

24. A communication device, characterized in that: A microwave integrated system comprising any one of claims 21-23.

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