Base

Abstract

The present invention relates to a base in which a heating element pattern having a multi-layer structure is provided so that arc portions do not overlap, or heating element linear sections are provided at mutually different angles with respect to the center in mutually different layers, or even in a heating element pattern having a single-layer structure, the heating element pattern does not overlap the arc portions. In addition, the linear sections of the heating body can be arranged at different angles relative to the center, so that the temperature uniformity in the whole area of the upper surface of the base can be improved.

Description

Technical Field

[0001] The present invention relates to a ceramic susceptor, and more particularly to a ceramic susceptor using a heating pattern for improving temperature uniformity. Background Art

[0002] Typically, a semiconductor device or display device is manufactured by patterning a plurality of thin film layers including a dielectric layer and a metal layer after being sequentially stacked on a glass substrate, a flexible substrate or a semiconductor wafer substrate. These thin film layers are sequentially deposited on the substrate by a chemical vapor deposition (CVD) process or a physical vapor deposition (PVD) process. The CVD process includes a low pressure chemical vapor deposition (LPCVD) process, a plasma enhanced chemical vapor deposition (PECVD) process and an organic metal chemical vapor deposition (MOCVD) process. A ceramic base for supporting a glass substrate, a flexible substrate or a semiconductor wafer substrate and for generating a predetermined heat or generating plasma by a high frequency (RF) electrode is provided on such a CVD device and a PVD device. For precision processes such as miniaturization of wiring of semiconductor devices, the ceramic base is widely used in plasma deposition processes based on accurate temperature control and heat treatment requirements. In addition, the ceramic base is used for plasma formation or substrate heating in the etching process of a thin film layer formed on a semiconductor wafer substrate or the firing process of a photoresist.

[0003] A common ceramic base includes a heating element disposed between ceramic materials for a heating function. In the ceramic base structure, the heating element receives power and generates heat to heat a semiconductor wafer substrate, etc. In order to improve the yield through a stable semiconductor process, the temperature uniformity of the substrate is important.

[0004] Figure 1A This is a plan view of the heating element pattern of a conventional ceramic base.

[0005] Reference Figure 1A The existing ceramic base usually has an inner heating element pattern 10 in the diameter direction and an outer heating element pattern 20 in the diameter direction on the same plane, and the inner heating element pattern 10 is a pattern extending in an arc shape between a first terminal pair 10a and 10b in the center, and the outer heating element pattern 20 is a pattern extending in an arc shape between a second terminal pair 20a and 20b in the center.

[0006] However, the existing ceramic base has an inner heating element pattern 10 and an outer heating element pattern 20 formed on the same plane in the same layer. Therefore, when the temperature of the upper surface of the base on which the substrate is placed is uneven in the entire area, an attempt is made to increase or decrease the temperature of the corresponding part by adjusting the setting pitch of the heating element to improve the temperature uniformity.

[0007] In addition, in the existing ceramic base, one side of the straight section 21a, 21b is connected to the second terminal pair 20a, 20b and extends to two connection points of the outer heating element pattern 20 having the resistance pattern, and forms the outer heating element pattern 20 connected to and extending from the second terminal pair 20a, 20b. Figure 1B As shown, since defects such as cracks are generated due to oxidation or the like in the narrowly spaced straight sections 21a and 21b of the heating element, the resistance value may change or a short circuit may occur, which is a problem that affects the temperature uniformity. Summary of the invention

[0008] Problem that the invention aims to solve

[0009] Therefore, the present invention is proposed to solve the above-mentioned problems. The purpose of the present invention is to provide a ceramic base, which arranges a multi-layer structure of the heating element pattern in a manner that the arc parts do not overlap or makes the straight line intervals of the heating element in different layers to be arranged at different angles relative to the center, or, even in a single-layer structure of the heating element pattern, the straight line intervals of the heating element can be arranged at different angles relative to the center, thereby improving the temperature uniformity in the entire area of ​​the upper surface of the base.

[0010] Means used to solve problems

[0011] First, summarizing the features of the present invention, a ceramic base according to one aspect of the present invention for achieving the purpose includes an insulating plate provided with a plurality of heating element layers; the plurality of heating element layers include: a first heating element layer having a first pattern, the first pattern including a first resistor portion and a first connecting portion connected between a first terminal pair, and a second heating element layer having a second pattern, the second pattern including a second resistor portion and a second connecting portion connected between a second terminal pair; the first connecting portion connects an end portion of the first resistor portion with any one of the terminals in the first terminal pair, and the second connecting portion connects an end portion of the second resistor portion with any one of the terminals in the second terminal pair.

[0012] The first resistor portion and the second resistor portion may respectively include a plurality of arc portions extending in a circumferential direction and a plurality of folding portions for connecting the arc portions. When the arc portions of the first resistor portion and the arc portions of the second resistor portion are projected onto the plane of the insulating plate, the arc portion of the second resistor portion may be located between the arc portions of the first resistor portion.

[0013] The first connection portion and the second connection portion may be radially disposed at positions at different angles relative to the center of the insulating plate.

[0014] The multiple heat-generating body layers may also include a third heat-generating body layer, the third heat-generating body layer having a third pattern, the third pattern including a third resistor portion and a third connecting portion connected between a third terminal pair, the third connecting portion may connect an end portion of the third resistor portion with any one terminal of the third terminal pair, and the third resistor portion may include a plurality of arc portions extending in a circumferential direction and a plurality of folding portions for connecting the arc portions.

[0015] When the arc portions of the first resistor portion, the second resistor portion and the third resistor portion are projected onto the plane of the insulating plate, the arc portion of the third resistor portion may be located between the arc portions of the first resistor portion and the second resistor portion.

[0016] The first connection portion, the second connection portion, and the third connection portion may be radially disposed at positions at different angles relative to the center of the insulating plate.

[0017] The first pattern and the second pattern may be respectively provided in the same number of one or more divided provision areas.

[0018] The first pattern and the second pattern may be respectively provided in one or more divided provision areas of different numbers from each other.

[0019] The first connection portion and the second connection portion may include corrugated connection lines, respectively.

[0020] In addition, as other examples of the present invention, the first resistor portion and the second resistor portion may respectively include a plurality of arc portions extending in a circumferential direction and a plurality of folding portions for connecting the arc portions, one or more of the first patterns and one or more of the second patterns are respectively arranged in different setting areas without interlayer overlap and include the arc portions and the folding portions that are symmetrical relative to the center, and the first connecting portion and the second connecting portion may be radially arranged at positions with different angles relative to the center.

[0021] Preferably, the two connecting parts of the first heating element layer are arranged at 180° to each other in the outer diameter direction, the two connecting parts of the second heating element layer are arranged at 180° to each other in the outer diameter direction, and the extension lines of the two connecting parts of the first heating element layer and the extension lines of the two connecting parts of the second heating element layer are perpendicular to each other.

[0022] In addition, another aspect of the present invention includes an insulating plate provided with a heating element, wherein the heating element includes patterns respectively arranged in a plurality of divided setting areas on the same plane, each of the patterns includes a resistor portion and a connecting portion connected between a pair of terminals, and each of the connecting portions connects an end portion of a corresponding resistor portion connected to a first terminal and a second terminal.

[0023] Each resistor portion may include a plurality of arc portions extending along a circumferential direction and a plurality of folded portions for connecting the arc portions.

[0024] The connection portions of the patterns may be radially disposed at positions at different angles relative to the center of the insulating plate.

[0025] Effects of the Invention

[0026] According to the ceramic base of the present invention, the heating element pattern of the multi-layer structure is arranged in a manner that the arc parts do not overlap, so that the heating elements are evenly distributed in each area and heated, thereby improving the temperature uniformity. In the heating element pattern of the multi-layer structure, the straight line interval connecting lines between the multiple layers do not overlap or are not arranged side by side, or even in the heating element pattern of the single-layer structure, two or more straight line interval connecting lines are arranged at different angles relative to the center, thereby improving the temperature uniformity in the entire area of ​​the upper surface of the base. In addition, the structure as described above can reduce the occurrence of defects such as cracks caused by oxidation of the straight line interval connecting lines, and because the heating element pattern of the multi-layer structure can freely adjust the temperature of each setting area in each layer, the degree of freedom of temperature control for temperature uniformity can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] To help understanding of the present invention, the accompanying drawings, which are included as a part of the detailed description, provide embodiments of the present invention and are used to explain the technical concept of the present invention together with the detailed description.

[0028] Figure 1A This is a plan view of the heating element pattern of a conventional ceramic base.

[0029] Figure 1B Exemplary defects in the linear region of the heat generating element of a conventional ceramic base are shown.

[0030] Figure 2 This is a schematic cross-sectional view of a ceramic base according to an embodiment of the present invention.

[0031] FIG. 3A to FIG. 3D The figures are for explaining various patterns of exemplary single-layer structures of the heat generating element pattern of the ceramic base of the present invention.

[0032] Figure 4 The connecting portion between the terminal and the resistor portion in the heating element pattern of the ceramic base of the present invention is shown.

[0033] FIG. 5A to FIG. 5D This is a diagram for explaining an exemplary double-layer structure of a heating element pattern of a ceramic base of the present invention.

[0034] FIG. 6A to FIG. 6D It is a diagram for explaining another pattern of an exemplary double-layer structure of the heating element pattern of the ceramic base of the present invention.

[0035] Figure 7 This is a diagram for explaining an exemplary three-layer structure pattern of the heating element pattern of the ceramic base of the present invention.

[0036] Description of Reference Numerals

[0037] 110: Insulation board

[0038] 114: Heating element

[0039] 90: Pattern

[0040] 81a, 81b: Terminal pair

[0041] 85: Arc

[0042] 86: Folding

[0043] 91: Resistor

[0044] 92: Connection

[0045] 511: First heating element layer

[0046] 512: Second heating element layer

[0047] 513: The third heating element layer DETAILED DESCRIPTION

[0048] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. At this time, in each of the accompanying drawings, the same components are represented by the same figure marks as much as possible. In addition, the detailed description of the known functions and / or structures is omitted. The content disclosed below focuses on the parts required for understanding the actions of various embodiments, and omits the description of the elements that make the main purpose of the description unclear. In addition, some of the components in the drawings may be enlarged or omitted, or shown schematically. The size of each component does not fully reflect the actual size, so the content recorded here is not limited to the relative size or spacing of the components shown in each of the accompanying drawings.

[0049] In the process of describing the embodiments of the present invention, when it is judged that the specific description of the known technology related to the present invention unnecessarily confuses the main idea of ​​the present invention, the detailed description thereof will be omitted. Moreover, the terms described below, as terms defined by considering the functions in the present invention, can be changed according to the intention or convention of the user, operator. Therefore, it should be defined based on the content of the full text of this specification. The terms used in the detailed description are only used to describe the embodiments of the present invention and should not be restrictive. Unless otherwise explicitly stated, the expression of a single number of forms includes the meaning of a plurality of numbers of forms. In the process of this description, expressions such as "including" or "having" are used to indicate certain characteristics, numbers, steps, actions, elements, parts or combinations of these, and should not be interpreted as excluding the existence or possibility of one or more other characteristics, numbers, steps, actions, elements, parts or combinations of these other than those described.

[0050] In addition, terms such as “first” and “second” may be used to describe a plurality of components, but the components are not limited to the terms, and the terms are only used to distinguish one component from other components.

[0051] Figure 2 FIG. 1 is a schematic cross-sectional view of a ceramic base 100 according to an embodiment of the present invention.

[0052] Reference Figure 2 A (ceramic) base 100 according to an embodiment of the present invention includes an insulating plate 110 and a shaft 120 .

[0053] The ceramic susceptor 100 of one embodiment of the present invention is a semiconductor device for supporting a processing target substrate (semiconductor wafer, glass substrate, flexible substrate, etc.) for various purposes and heating the processing target substrate at a predetermined temperature. The ceramic susceptor 100 can also be used in a semiconductor process using plasma (plasma enhanced chemical vapor deposition or dry etching, etc.).

[0054] The insulating plate 110 may be configured to space (embed) a high-frequency electrode 112 for generating plasma and (or) a heating element 114 for heating a substrate between ceramic materials at a predetermined interval. The insulating plate 110 can perform a semiconductor process of heating a substrate using the heating element 114 and (or) using plasma generated by the high-frequency electrode 112 while stably supporting the substrate to be processed.

[0055] Although not shown in the ceramic base 100 of the present invention, one or more chuck electrodes having an electrostatic chuck function may be provided to support the substrate 11 placed on the insulating plate 110. For example, one or more chuck electrodes may be provided (buried) at predetermined intervals above or below the high-frequency electrode 112 or the heating element 114.

[0056] The insulating plate 110 may be formed into a plate-like structure having a predetermined shape. As an example, the insulating plate 110 may be formed into a circular plate-like structure, but is not necessarily limited thereto. The ceramic material may be at least one of Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, autoclaved lightweight concrete (AlC), TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, BxCy, BN, SiO2, SiC, YAG, mullite and AlF3, preferably aluminum nitride (AlN). In addition, each ceramic powder may selectively contain about 0.1% to 10% of yttrium oxide powder, preferably about 1% to 5% of yttrium oxide powder.

[0057] The shaft 120 has a pipe shape having a through hole and is joined or bonded to the lower surface of the insulating plate 110. The shaft 120 may be formed of the same ceramic material as the insulating plate 110 and joined or bonded to the insulating plate 110.

[0058] The high-frequency electrode 112 or one or more chuck electrodes can be formed of tungsten (W), molybdenum (Mo), silver (Ag), gold (Au), niobium (Nb), titanium (Ti), aluminum nitride (AlN) or their alloys, and preferably, can be formed of molybdenum (Mo). The high-frequency electrode 112 can be connected to or grounded with an RF (radio) power supply through a connecting rod 121 contained in the hollow shaft 120, and one or more chuck electrodes can be connected to a chuck electrode driving power supply (DC power supply or AC power supply) through other connecting rods contained in the hollow shaft 120. The high-frequency electrode 112 has a wire type or sheet type mesh structure. Among them, the mesh structure is a mesh structure formed by a plurality of metals arranged along a first direction and a plurality of metals arranged along a second direction interlaced with each other.

[0059] The heating element 114 is formed of tungsten, molybdenum or their alloys or carbides and has a high melting point and high resistance. The heating element 114 can be formed in a plate-shaped coil form based on a heating wire (or a resistance wire or a heating electrode). In addition, for precise temperature control, the heating element 114 can also be formed into a multilayer structure. This heating element 114 can be connected to a power supply through a connecting rod 123 included in the shaft 120 in a semiconductor manufacturing process. In order to perform a smooth deposition process and an etching process, the heating element 114 can perform the function of heating the processing object substrate on the insulating plate 110 at a predetermined constant temperature.

[0060] like FIG. 3A to FIG. 7As shown, in a ceramic base 100 of an embodiment of the present invention, in a heating element 114 formed by a heating wire (or a resistor wire), a multi-layer structure of the heating element pattern is arranged in a manner that the arc portions do not overlap, so that the heating element is evenly distributed in each area and heated, thereby improving the temperature uniformity. In addition, in the pattern of the heating element 114 with a multi-layer structure, the pattern of the heating element 114 with a multi-layer structure can be arranged so that a plurality of inter-layer straight line sections (connecting portions for connecting terminals and resistor portions) do not overlap or are not arranged side by side, thereby further improving the temperature uniformity. In addition, even in the case of FIG. 3A to FIG. 3D In the pattern of the single-layer heating element 114 shown, two or more straight line sections (connecting portions for connecting terminals and resistor portions) are arranged at different angles relative to the center, thereby improving the temperature uniformity in the entire area of ​​the upper surface of the base.

[0061] Below, refer to FIG. 3A to FIG. 7 , the above-mentioned structure of the present invention is specifically described.

[0062] FIG. 3A to FIG. 3D The diagrams are diagrams for explaining the patterns of the heat generating elements 114 of the ceramic susceptor 100 of the present invention, showing various patterns of the heat generating elements 114 in a single-layer structure as an example of a heat generating element layer.

[0063] Figure 3A The structure of the pattern 90 is shown in which the heat generating element 114 of a single layer structure is provided in each of the two equally divided installation areas 311 and 312 of the ceramic base 100 in a plan view. Figure 3B The structure of the pattern 90 is shown in which the heat generating elements 114 of a single layer structure are respectively provided in the arrangement regions 321 , 322 , and 323 divided into three equal parts in a plan view of the ceramic base 100 . Figure 3C The structure of the pattern 90 is shown in which the heat generating elements 114 of a single layer structure are respectively provided in the arrangement regions 331 , 332 , 333 , and 334 divided into four equal parts in a plan view of the ceramic base 100 . Figure 3D The structure of the pattern 90 in which the heat generating element 114 of a single layer structure can be respectively arranged in a plurality of equally divided arrangement regions of the ceramic base 100 in a plan view is shown.

[0064] Reference FIG. 3A to FIG. 3D The heating element 114 may include patterns disposed in two or more equal or not equal parts of the same plane inside the insulating plate 110 .

[0065] That is, the heating element 114 includes patterns 90 provided in a plurality of arrangement regions divided on the same plane inside the insulating plate 110. Each pattern 90 includes a resistor portion 91 and a connection portion 92 connected between the terminal pair 81a, 81b.

[0066] Each connecting portion 92 connects the end of the corresponding resistor portion 91 connected to the first terminal 81 a and the second terminal 81 b , and each resistor portion 91 includes a plurality of arc portions 85 extending along the circumferential direction and a plurality of folded portions 86 for connecting the arc portions 85 .

[0067] In addition, the connection parts 92 of each pattern 90 are arranged so that no two connection parts are parallel to each other, and the connection parts 92 of each pattern 90 are arranged radially at different angles relative to the center. That is, the connection parts 92 of adjacent patterns 90 are arranged in a non-adjacent manner.

[0068] Figure 4 The connecting portion 92 between the terminal 81 b and the resistor portion 91 in the pattern of the heat generating element 114 of the ceramic base 100 of the present invention is shown.

[0069] Reference Figure 4 Each pattern 90 provided in the divided plurality of setting regions includes a resistor portion 91 and a connection portion 92 connected between the terminal pair 81a and 81b, and the connection portion 92 includes a connection line having a waveform such as a sine wave.

[0070] That is, the waveform has a shape in which the downwardly protruding part and the upwardly protruding part are connected to each other, and the curvature of each protruding part is preferably designed to be about R400 to R500. This is to form a gentle curve by increasing the curvature, thereby reducing defects caused by oxidation and the like.

[0071] As described above, the resistor portion 91 and the connecting portion 92 of the heating element 114 are formed of tungsten, molybdenum, or their alloys or carbides, etc. The resistor portion 91 is a portion that increases the moving distance of electrons and improves resistance by processing the heating element 114 material as described above into a coil shape (or a sawtooth shape or a zigzag shape, etc., depending on the situation), and the connecting portion 92 is a connecting wire portion for electrical connection.

[0072] Similarly, the concepts of the pattern 90, terminal pair 81a, 81b, arc portion 85, folded portion 86, resistor portion 91, connecting portion 92, etc. of the above-mentioned heating element 114 are also applicable to a multilayer structure having more than two heating element layers.

[0073] FIG. 5A to FIG. 5D This is a diagram showing an exemplary double-layer structure of a heat generating element layer for explaining the pattern of the heat generating element 114 of the ceramic susceptor 100 of the present invention. Figure 5A The plan view shows a pattern 90 of the heat generating element 114 provided in a double-layer structure on different planes inside the ceramic base 100 . Figure 5B Show Figure 5A Schematic stacking structure of the upper first heat generating layer 511 and the lower second heat generating layer 512 in the cross-sectional structure of . Figure 5C Show Figure 5A A plan view of the first heat generating layer 511 is shown in FIG. Figure 5D Show Figure 5A A plan view of the second heat generating layer 512 is shown in FIG.

[0074] Reference FIG. 5A to FIG. 5D The double-layered heating element 114 of the ceramic base 100 of the present invention includes a first heating element layer 511 and a second heating element layer 512 which are separated by a predetermined distance via a ceramic material.

[0075] The first heating element layer 511 includes a first pattern 90-1 including a first resistor portion 91-1 and a first connecting portion 92-1 connected between the terminal pair 81a-1 and 81b-1. In addition, the second heating element layer 512 includes a second pattern 90-2 including a second resistor portion 91-2 and a second connecting portion 92-2 connected between the terminal pair 81a-2 and 81b-2 of the other layer.

[0076] In addition, the first connection portion 92-1 and the second connection portion 92-2 respectively connect the end of the corresponding resistor portion 91-1 / 91-2 connected to the first terminal 81a-1 / 81a-2 and the second terminal 81b-1 / 81b-2. In addition, the first resistor portion 91-1 and the second resistor portion 91-2 each include a plurality of arc portions 85-1 / 85-2 extending in the circumferential direction and a folded portion 86-1 / 86-2 for connecting the arc portions 85-1 / 85-2.

[0077] Among them, Figure 5A As shown, the arc portion 85-1 of the first resistor portion 91-1 and the arc portion 85-2 of the second resistor portion 91-2 can be set in the setting area where the layers overlap. That is, when the first pattern 90-1 and the second pattern 90-2 are projected onto the plane of the insulating plate 110, that is, when the arc portion 85-1 of the first resistor portion 91-1 and the arc portion 85-2 of the second resistor portion 91-2 are projected onto the plane of the insulating plate 110, the arc portion 85-2 of the second resistor portion 91-2 can be located between the arc portions 85-1 of the first resistor portion 91-1. At this time, the arc portion 85-1 of the first resistor portion 91-1 and the arc portion 85-2 of the second resistor portion 91-2 can be set at positions with different radii relative to the center O, thereby ensuring the heating temperature between the patterns to improve the temperature uniformity.

[0078] In addition, the first connection portion 92-1 and the second connection portion 92-2 are radially disposed at positions with different angles relative to the center O. Figure 5A As shown, preferably, in a structure in which one pattern 90-1 / 90-2 is arranged in each layer, the first connecting portion 92-1 and the second connecting portion 92-2 are arranged in directions 180° to each other in the radially outer direction relative to the center O.

[0079] exist Figure 5A For example, FIG. 3A to FIG. 3D As shown, instead of the first pattern 90-1 of the first heat generating layer 511, a heat generating layer having a pattern of the heat generating elements 114 may be arranged in two or more multiply divided arrangement regions. In this case, the second pattern 90-2 may be applied as it is.

[0080] In addition, in the present invention, if FIG. 3A to FIG. 3D As shown, the present invention can also replace Figure 5A In the second pattern 90-2 of the second heat generating layer 512, a heat generating layer having a pattern of the heat generating element 114 is arranged in two or more multi-divided arrangement regions. In this case, the first pattern 90-1 can be applied as it is.

[0081] That is, in the present invention, in the double-layer stacked structure of the first heating element layer 511 and the second heating element layer 512, all combinations of pattern structures in which each heating element layer has a pattern of the heating element 114 in one pattern or two or more multi-divided setting areas (the divided setting areas in each layer may be the same or different) can be implemented in the above-mentioned manner. In addition, this principle is that when the stacked structure of the heating element 114 of three or more layers (refer to Figure 7 ) when each heating element layer is constituted as a pattern or a pattern structure of all combinations of patterns having the heating element 114 in two or more multi-divided setting areas (the divided setting areas in each layer may be the same or different), the heating element layers can be implemented by the method as described above.

[0082] FIG. 6A to FIG. 6D FIG. 1 is a diagram for explaining another exemplary double-layer structure of the pattern of the heat generating element 114 of the ceramic susceptor 100 of the present invention. FIG. 6A to FIG. 6D The example shows a structure in which each heat generating layer in the double-layer stacked structure of the first heat generating layer 511 and the second heat generating layer 512 has the same pattern of the heat generating body 114 in the double-divided, triple-divided, quadruple-divided or other multi-divided arrangement regions.

[0083] First, in FIG. 6B to FIG. 6D In Figure 5AAs shown, the arc portion 85-1 of the first resistor portion 91-1 included in the first pattern 90-1 of the first heating element layer 511 and the arc portion 85-2 of the second resistor portion 91-2 included in the second pattern 90-2 of the second heating element layer 512 can be set in the overlapping setting area between the layers. That is, when the first pattern 90-1 and the second pattern 90-2 are projected onto the plane of the insulating plate 110, that is, when the arc portion 85-1 of the first resistor portion 91-1 and the arc portion 85-2 of the second resistor portion 91-2 are projected onto the plane of the insulating plate 110, the arc portion 85-2 of the second resistor portion 91-2 can be located between the arc portions 85-1 of the first resistor portion 91-1 (refer to Figure 5A ). At this time, the arc portion 85-1 of the first resistor portion 91-1 and the arc portion 85-2 of the second resistor portion 91-2 can be set at positions with different radii relative to the center O, thereby ensuring the heating temperature between the patterns to improve temperature uniformity. In addition, the first connecting portion 92-1 of the first heating element layer 511 and the second connecting portion 92-2 of the second heating element layer 512 are radially set at positions with different angles relative to the center O.

[0084] In addition, refer to Fig. 6A ,like Figure 5A As shown, the first heat generating layer 511 and the second heat generating layer 512 are identical in that they have a terminal pair 81 a , 81 b , an arc portion 85 , a folded portion 86 , a resistor portion 91 , and a connecting portion 92 .

[0085] However, the heating element 114 may include: a first heating element layer 511, having one or more first patterns 90-1, wherein the first pattern 90-1 includes a first resistor portion 91-1 and a first connecting portion 92-1 connected between terminal pairs 81a-1 and 81b-1; and a second heating element layer 512, having one or more second patterns 90-2, wherein the second pattern 90-2 includes a second resistor portion 91-2 and a second connecting portion 92-2 connected between other terminal pairs 81a-2 and 81b-2.

[0086] In addition, one or more first patterns 90-1 and second patterns 90-2 are arranged in different arrangement areas without interlayer overlap (arrangement areas do not overlap). That is, one or more first patterns 90-1 may include an arc portion 85 symmetrical with respect to the center O and a folding portion 86 symmetrical with respect to the center O, and one or more second patterns 90-2 may include an arc portion 85 symmetrical with respect to the center O and a folding portion 86 symmetrical with respect to the center O.

[0087] In addition, the first connection portion 92-1 of the first heat generating body layer 511 and the second connection portion 92-2 of the second heat generating body layer 512 are radially arranged at different angles relative to the center O. In particular, preferably, the two connection portions 92-1 of the first heat generating body layer 511 are arranged in directions 180° to each other in the outer diameter direction, and the two connection portions 92-2 of the second heat generating body layer 512 are arranged in directions 180° to each other in the outer diameter direction, and the extension lines of the two connection portions 92-1 of the first heat generating body layer 511 and the extension lines of the two connection portions 92-2 of the second heat generating body layer 512 are preferably perpendicular to each other.

[0088] Figure 7 This is a diagram for explaining an exemplary pattern of the heat generating element 114 of the ceramic susceptor 100 of the present invention, showing a pattern of the heat generating element 114 having a three-layer structure.

[0089] Reference Figure 7 The heating element 114 of the ceramic base 100 of the present invention includes the following identical or similar components: Figure 5A or FIG. 6A to FIG. 6D The first heat generating layer 511 and the second heat generating layer 512 in the embodiment described above may additionally include a third heat generating layer 513 separated from the second heat generating layer 512 via a ceramic material.

[0090] As described above, each heating element layer in the first heating element layer 511, the second heating element layer 512 and the third heating element layer 513 can use a pattern structure having all combinations of patterns of the heating element 114 in two or more multiply divided setting areas as described above (the setting areas divided in each layer can be the same or different).

[0091] The structures of the first heating element layer 511 and the second heating element layer 512 are as follows: Figure 5A As described in the description of , the third heat generating layer 513 may include a third pattern 90 - 3 , and the third pattern 90 - 3 includes a third resistor portion 91 - 3 and a third connection portion 92 - 3 connected between the third terminal pair 81 a - 3 and 81 b - 3 .

[0092] The third connection part 92-3 includes a connecting line of the waveform as described above, which is used to connect the end of the corresponding resistor part 91-3 connected to the first terminal 81a-3 in the third terminal pair 81a-3, 81b-3 and the second terminal 81b-3 in the third terminal pair 81a-3, 81b-3.

[0093] The third resistor portion 91 - 3 includes an arc portion 85 - 3 extending in the circumferential direction and a folded portion 86 - 3 for connecting the arc portion 85 - 3 .

[0094] and Figure 5ASimilar to the double-layer stacked structure, the arc portions 85-1, 85-2, 85-3 of the resistor portions 91-1, 91-2, 91-3 of the first heating element layer 511, the second heating element layer 512 and the third heating element layer 513 can be set in the overlapping setting area between layers. At this time, they can be set at positions with different radii relative to the center O. That is, when the first pattern 90-1, the second pattern 90-2 and the third pattern 90-3 are projected onto the plane of the insulating plate 110, that is, when the arc portion 85-1 of the first resistor part 91-1, the arc portion 85-2 of the second resistor part 91-2 and the arc portion 85-3 of the third resistor part 91-3 are projected onto the plane of the insulating plate 110, the arc portion 85-3 of the third resistor part 91-3 can be located between the arc portion 85-2 of the second resistor part 91-2 and the arc portion 85-1 of the first resistor part 91-1 (arc portions of three layers are arranged not to overlap each other). This makes the arc portions existing in any two layers of the first heating element layer 511, the second heating element layer 512 and the third heating element layer 513 not overlap each other. Therefore, the heating temperature between the patterns can be guaranteed to improve the temperature uniformity.

[0095] The connection parts 92-1, 92-2, 92-3 of the first, second, and third heat generating layers 511, 512, and 513 are radially arranged at different angles relative to the center O. This also applies between adjacent layers of the first, second, and third heat generating layers 511, 512, and 513.

[0096] As described above, in the ceramic base 100 of the present invention, the pattern of the multilayer structure of the heating element 114 is arranged in a manner that the arc portions do not overlap, so that the heating element 114 is evenly distributed in each area and heated, thereby improving the temperature uniformity. In the pattern of the multilayer structure of the heating element 114, the plurality of connecting portions 92 as the straight line intervals between layers do not overlap or are not arranged side by side, or even in the pattern of the single-layer structure of the heating element 114, two or more straight line interval connecting portions 92 are arranged at different angles relative to the center, thereby improving the temperature uniformity in the entire area of ​​the upper surface of the base. In addition, the structure as described above can reduce the occurrence of defects such as cracks caused by oxidation of the connecting portion 92, and since the pattern of the multilayer structure of the heating element 114 can freely adjust the temperature of each setting area in each layer, the degree of freedom of temperature control for temperature uniformity can be improved.

[0097] As described above, in the present invention, specific matters such as specific constituent elements and limited embodiments and drawings are used for explanation, but this is only provided for a more comprehensive understanding of the present invention, and the present invention is not limited to the embodiments, and a person of ordinary skill in the technical field to which the present invention belongs can make various modifications and variations within the scope of the essential characteristics of the present invention. Therefore, the idea of ​​the present invention should not be limited to the illustrated embodiments, and not only the attached claims, but all technical ideas that are equivalent to or have equivalent variations of the claims should be interpreted as being included in the scope of the present invention.

Claims

1. A base, wherein: The invention comprises an insulating plate provided with a plurality of heat generating body layers, The plurality of heat generating layers include: A first heating element layer having a first pattern including a first resistor portion and a first connecting portion connected between the first terminal pair; and The second heating element layer has a second pattern, wherein the second pattern includes a second resistor portion and a second connecting portion connected between the second terminal pair. The first connection portion connects an end portion of the first resistor portion and one terminal of the first terminal pair, and the second connection portion connects an end portion of the second resistor portion and one terminal of the second terminal pair.

2. The base according to claim 1, wherein: The first resistor portion and the second resistor portion respectively include a plurality of arc portions extending along a circumferential direction and a plurality of folded portions for connecting the arc portions. When the arc portion of the first resistor portion and the arc portion of the second resistor portion are projected onto the plane of the insulating plate, the arc portion of the second resistor portion is located between the arc portions of the first resistor portion.

3. The base according to claim 1, wherein: The first connection portion and the second connection portion are radially provided at positions at different angles relative to the center of the insulating plate.

4. The base according to claim 1, wherein: The plurality of heat generating layers further include a third heat generating layer, the third heat generating layer having a third pattern, the third pattern including a third resistor portion and a third connecting portion connected between a third terminal pair, The third connection portion connects an end of the third resistor portion and any one terminal of the third terminal pair, and the third resistor portion includes a plurality of arc portions extending along a circumferential direction and a plurality of folded portions for connecting the arc portions.

5. The base according to claim 4, wherein: When the arc portions of the first resistor, the second resistor, and the third resistor are projected onto the plane of the insulating plate, the arc portion of the third resistor is located between the arc portions of the first resistor and the second resistor.

6. The base according to claim 4, wherein: The first connection portion, the second connection portion, and the third connection portion are radially disposed at positions at different angles relative to the center of the insulating plate.

7. The base according to claim 1, wherein: The first pattern and the second pattern are respectively provided in the same number of one or more divided provision areas.

8. The base according to claim 1, wherein: The first pattern and the second pattern are respectively provided in one or more divided provision areas of different numbers from each other.

9. The base according to claim 1, wherein: The first connection portion and the second connection portion include corrugated connection lines respectively.

10. The base according to claim 1, wherein: The first resistor portion and the second resistor portion respectively include a plurality of arc portions extending in a circumferential direction and a plurality of folded portions for connecting the arc portions, and one or more of the first patterns and one or more of the second patterns are respectively arranged in mutually different setting areas without interlayer overlap and include the arc portions and the folded portions symmetrical with respect to the center. The first connection portion and the second connection portion are radially disposed at positions at different angles relative to the center.

11. The base according to claim 10, wherein: The two connecting parts of the first heating element layer are arranged in directions 180° to each other in the outer diameter direction, the two connecting parts of the second heating element layer are arranged in directions 180° to each other in the outer diameter direction, and the extension lines of the two connecting parts of the first heating element layer and the extension lines of the two connecting parts of the second heating element layer are perpendicular to each other.

12. A base, wherein: The invention comprises an insulating plate provided with a heating element, The heating element includes patterns respectively arranged in a plurality of divided arrangement areas on the same plane, each of the patterns including a resistor portion and a connection portion connected between a pair of terminals, Each of the connecting portions connects an end portion of a corresponding resistor portion connected to the first terminal and the second terminal.

13. The base according to claim 12, wherein: The connection portions of the patterns are radially arranged at positions with different angles from each other with respect to the center of the insulating plate.

14. The base according to claim 12, wherein: The connecting portion of each of the patterns includes a wave-shaped connecting line.

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