Heat dissipation circuit board and manufacturing method thereof

Abstract

The invention provides a manufacturing method of a heat dissipation circuit board, and the method comprises the steps: one side of a first circuit substrate is provided with a first groove, the first circuit substrate comprises a first base material layer and a plurality of first conductive circuits arranged at one side of the first base material layer at intervals, a first wire groove is formed between every two adjacent first conductive circuits, and a second groove is formed between every two adjacent first conductive circuits; the first slot is formed in the first base material layer, and the first slot corresponds to the first wire slot. A first cooling medium is arranged in the first open groove, a first insulation protection layer is arranged on the plurality of first conductive circuits, and a part of the first insulation protection layer is filled into the first wire groove to form a first insulation part; the first insulator isolates the first cooling medium from the first conductive line adjacent to the first cooling medium. In addition, the invention also provides a heat dissipation circuit board.

Description

Technical Field

[0001] The present application belongs to the field of circuit boards, and in particular, relates to a heat dissipation circuit board and a manufacturing method thereof. Background Art

[0002] With the development of science and technology, consumer electronic products are rapidly evolving towards functional diversification and intelligence. Products need to support higher screen refresh rates, faster wireless transmission rates, and more powerful data processing capabilities, all of which require chips and circuits to work under high load conditions, which will generate a lot of heat. At the same time, consumer electronic products are also being designed to be thinner and lighter, and the density of internal parts is getting higher and higher. This exacerbates the difficulty of heat dissipation in limited spaces.

[0003] Traditional circuit boards and their components have poor heat dissipation effects and cannot effectively remove the generated heat, causing the operating temperature of chips and circuits to continue to accumulate and increase, seriously affecting the performance and stability of the product. When the temperature is too high, it may cause component aging, failure, and even explosions and other safety accidents. Summary of the invention

[0004] In order to solve the above deficiencies in the prior art, the present application provides a method for manufacturing a heat dissipation circuit board.

[0005] In addition, the present application also provides a heat dissipation circuit board.

[0006] A method for manufacturing a heat dissipation circuit board comprises the following steps:

[0007] A first slot is provided on one side of a first circuit substrate, wherein the first circuit substrate includes a first substrate layer and a plurality of first conductive lines spaced apart and arranged on one side of the first substrate layer, a first line slot is formed between each two adjacent first conductive lines, the first slot is provided on the first substrate layer, and the first slot corresponds to the first line slot;

[0008] placing a first cooling medium in the first slot, and

[0009] A first insulating protection layer is disposed on the first conductive lines. The first insulating protection layer partially fills the first wire slot to form a first insulating member. The first insulating member isolates the first cooling medium and the first conductive lines adjacent to the first cooling medium.

[0010] In some possible implementations, the first circuit substrate further includes a plurality of second conductive circuits spaced apart on the other side of the first base material layer, and a second wire groove is formed between every two adjacent second conductive circuits. The manufacturing method further includes the steps of:

[0011] A second slot is provided on the other side of the first circuit substrate, wherein the second slot is provided on the other side of the first base material layer and corresponds to the second line slot;

[0012] placing a second cooling medium in the second slot, and

[0013] A second insulating protection layer is disposed on the plurality of second conductive lines. The second insulating protection layer partially fills the second wire slot to form a second insulating member. The second insulating member isolates the second cooling medium and the second conductive lines adjacent to the second cooling medium.

[0014] In some possible implementations, the second wire groove is connected to the first slot.

[0015] In some possible implementations, the first circuit substrate further includes a plurality of second conductive circuits spaced apart on the other side of the first base material layer, and a second wire groove is formed between every two adjacent second conductive circuits. The manufacturing method further includes the steps of:

[0016] A second slot is provided on the other side of the first circuit substrate, wherein the second slot is provided on the other side of the first base material layer and corresponds to the second line slot;

[0017] A second cooling medium is arranged in the second slot:

[0018] An insulating adhesive layer is provided on the plurality of second conductive lines, wherein the insulating adhesive layer partially fills the second wire slot to form a third insulating member, wherein the third insulating member isolates the second cooling medium and the second conductive lines adjacent to the second cooling medium;

[0019] A second circuit substrate is arranged on the insulating adhesive layer, wherein the second circuit substrate includes a second base material layer and a plurality of third conductive circuits arranged on the second base material layer, the second base material layer is arranged between the insulating adhesive layer and the plurality of third conductive circuits, a third wire groove is formed between each two adjacent third conductive circuits, and the third wire groove is arranged corresponding to the second wire groove;

[0020] A third slot is provided on the second substrate layer, wherein the third slot corresponds to the third wire slot;

[0021] A third cooling medium is disposed in the third slot, and

[0022] A third insulating protection layer is disposed on the plurality of third conductive lines. The third insulating protection layer partially fills the third wire slot to form a fourth insulating member. The fourth insulating member isolates the third cooling medium and the third conductive lines adjacent to the third insulating medium.

[0023] In some possible implementations, the third slot is connected to the second slot.

[0024] In some possible implementations, the steps are further included:

[0025] An interlayer conductor is disposed on the first circuit substrate and the second circuit substrate, and the interlayer conductor electrically connects the first conductive circuit, the second conductive circuit, and the third conductive circuit.

[0026] A heat dissipation circuit board, comprising:

[0027] A first circuit substrate, wherein a first slot is disposed on one side of the first circuit substrate, the first circuit substrate comprises a first substrate layer and a plurality of first conductive lines spaced apart and disposed on one side of the first substrate layer, a first line slot is formed between each two adjacent first conductive lines, the first slot is disposed on the first substrate layer, and the first slot corresponds to the first line slot;

[0028] a first cooling medium, the first cooling medium being disposed in the first slot, and

[0029] A first insulating protective layer is disposed on the first conductive lines. The first insulating protective layer partially fills the first wire slot to form a first insulating member. The first insulating member isolates the first cooling medium and the first conductive line adjacent to the first cooling medium.

[0030] In some possible implementations, the first circuit substrate further includes a plurality of second conductive circuits spaced apart on the other side of the first substrate layer, a second wire groove is formed between every two adjacent second conductive circuits, and a second slot is provided on the other side of the first substrate layer corresponding to the second wire groove, and the heat dissipation circuit board further includes:

[0031] a second cooling medium, the second cooling medium being disposed in the second slot, and

[0032] A second insulating protective layer, wherein the second insulating protective layer partially fills the second wire slot to form a second insulating member, and the second insulating member isolates the second cooling medium and the second conductive line adjacent to the second cooling medium.

[0033] In some possible implementations, the first circuit substrate further includes a plurality of second conductive circuits spaced apart on the other side of the first substrate layer, a second wire groove is formed between every two adjacent second conductive circuits, and a second slot is provided on the other side of the first substrate layer corresponding to the second wire groove, and the heat dissipation circuit board further includes:

[0034] a second cooling medium, the second cooling medium being disposed in the second slot;

[0035] an insulating adhesive layer, the insulating adhesive layer being disposed on the plurality of second conductive lines, the insulating adhesive layer partially filling the second wire slot to form a third insulating member, the third insulating member isolating the second cooling medium and the second conductive lines adjacent to the second cooling medium;

[0036] A second circuit substrate, the second circuit substrate is arranged on the insulating adhesive layer, the second circuit substrate includes a second base material layer and a plurality of third conductive lines arranged on the second base material layer, the second base material layer is arranged between the insulating adhesive layer and the plurality of third conductive lines, a third wire groove is formed between every two adjacent third conductive lines, the third wire groove is arranged corresponding to the second wire groove, the second base material layer is provided with a third open groove, the third open groove is arranged corresponding to the third wire groove;

[0037] a third cooling medium, the third cooling medium being disposed in the third slot;

[0038] A third insulating protective layer is disposed on the plurality of third conductive lines, the third insulating protective layer partially fills the third wire slot to form a fourth insulating member, and the fourth insulating member isolates the third cooling medium and the third conductive line adjacent to the third insulating medium.

[0039] In some possible implementations, the second wire groove is connected to the first slot, and the third slot is connected to the second slot.

[0040] The heat dissipation circuit board provided in the above embodiments of the present application is provided with a first cooling medium in the first slot, and the first cooling medium can absorb the heat in the heat dissipation circuit board, thereby helping to reduce the heat accumulation in the heat dissipation circuit board, reduce the temperature rise rate and reduce the adverse effects on other electronic components. In addition, by setting the first slot corresponding to the first wire slot, the first cooling medium and the first conductive circuit are staggered, which is helpful to reduce the thickness of the heat dissipation circuit board. In addition, the first insulating protective layer partially fills the first wire slot to form a first insulating member, which isolates the first cooling medium and the adjacent first conductive circuit, which is helpful to improve the stability of the heat dissipation circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 A schematic cross-sectional view of a first single-sided copper-clad substrate provided in the first embodiment of the present application.

[0042] Figure 2 For etching Figure 1 The first copper foil layer is shown as a cross-sectional schematic diagram for forming a first conductive circuit.

[0043] Figure 3 for Figure 2 The cross-sectional schematic diagram of the first substrate layer after the first groove is provided is shown.

[0044] Figure 4 for Figure 3 A cross-sectional schematic diagram showing that a first cooling medium is arranged in a first slot is shown.

[0045] Figure 5 for Figure 4 The cross-sectional schematic diagram of the first conductive circuit after the first insulating protection layer is provided is shown.

[0046] Figure 6 A schematic cross-sectional view of a double-sided copper clad substrate provided in the second embodiment of the present application.

[0047] Figure 7 For etching Figure 6 The second copper foil layer is shown as a cross-sectional schematic diagram for forming a second conductive circuit.

[0048] Figure 8 for Figure 7 The cross-sectional schematic diagram shown is a first substrate layer after a second groove is provided.

[0049] Fig. 9 for Figure 8 The second slot shown is a schematic cross-sectional view of a second cooling medium.

[0050] Fig.10 for Fig. 9 The second slot is shown as a top view of the second cooling medium.

[0051] Fig.11 for Fig. 9 The cross-sectional schematic diagram of the second conductive circuit after the second insulating protection layer is provided is shown.

[0052] Fig.12 A cross-sectional schematic diagram of a heat dissipation circuit board provided in another embodiment of the present application.

[0053] Fig.13 A schematic cross-sectional view of a second single-sided copper clad substrate provided in the third embodiment of the present application.

[0054] Fig.14 for Fig.13 The cross-sectional schematic diagram shown is a diagram of a third substrate layer after a third groove is provided.

[0055] Fig.15 for Fig.14 The third slot shown is a schematic cross-sectional view of a third cooling medium.

[0056] Fig.16 for Fig.15 The third conductive circuit shown is a schematic cross-sectional view of a third insulating protection layer.

[0057] Fig.17 A schematic cross-sectional view of a heat dissipation circuit board provided in another embodiment of the present application.

[0058] Main component symbols

[0059] First heat dissipation circuit board 100

[0060] The first single-sided copper clad laminate 10

[0061] First base material layer 11

[0062] The first copper foil layer 12

[0063] The first conductive circuit 121

[0064] First line slot 122

[0065] First circuit substrate 123

[0066] The second copper foil layer 13

[0067] The second conductive circuit 131

[0068] Second line slot 132

[0069] First slot 14

[0070] Second slot 15

[0071] First Intermediate 151

[0072] First interlayer conductive body 152

[0073] First cooling medium 20

[0074] Second cooling medium 21

[0075] Insulating adhesive layer 22

[0076] The third insulating member 221

[0077] Second single-sided copper-clad substrate 23

[0078] Second base material layer 231

[0079] The third copper foil layer 232

[0080] The third conductive circuit 233

[0081] Second interlayer conductive body 234

[0082] Second circuit substrate 235

[0083] The third line slot 236

[0084] Double-sided copper clad substrate 25

[0085] The first insulating protective layer 30

[0086] First insulating member 301

[0087] The second insulating protective layer 31

[0088] The second insulating member 311

[0089] The third slot 32

[0090] The third cooling medium 33

[0091] The third insulating protection layer 34

[0092] The third insulating member 35

[0093] Second heat dissipation circuit board 200

[0094] The third heat dissipation circuit board 300

[0095] Thickness direction A

[0096] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0097] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0098] See also Figures 1 to 5 The first embodiment of the present application provides a method for manufacturing a first heat dissipation circuit board 100, comprising the steps of:

[0099] S100: See Figure 1 A first single-sided copper clad laminate 10 is provided, wherein the first single-sided copper clad laminate 10 includes a first copper foil layer 12 of a first substrate layer 11. The first single-sided copper clad laminate 10 has a thickness direction A.

[0100] In this embodiment, the material of the first substrate layer 11 includes but is not limited to polyimide (PI), polyester resin (PET), polyethylene naphthalate diformic acid glycol ester (PEN), liquid crystal polymer (LCP) and modified polyimide (MPI).

[0101] See also Figures 6 to 10 The second embodiment of the present application provides a method for manufacturing a second heat dissipation circuit board 200. In the second embodiment of the present application, the first single-sided copper clad laminate 10 can also be replaced by a double-sided copper clad substrate 25. The double-sided copper clad substrate 25 includes the single-sided copper clad laminate 10 and a second copper foil layer 13. The second copper foil layer 13 and the first copper foil layer 12 are respectively disposed on opposite sides of the first substrate layer 11.

[0102] S101: See Figure 2 The first copper foil layer 12 is etched to form a plurality of first conductive circuits 121, and the plurality of first conductive circuits 121 are arranged at intervals to obtain a first circuit substrate 123. A first wire groove 122 is formed between each two adjacent first conductive circuits 121, and a portion of the first substrate layer 11 is exposed in the first wire groove 122.

[0103] In this embodiment, the plurality of first conductive circuits 121 may be power circuits or impedance circuits or other circuits with a large current flow. The first conductive circuits 121 may generate and accumulate heat when current flows through them.

[0104] In the second embodiment of this application, see Figure 7 , step S101 further includes: etching the second copper foil layer 13 to form a plurality of second conductive circuits 131, wherein the plurality of second conductive circuits 131 are arranged at intervals. A second wire groove 132 is formed between each two adjacent second conductive circuits 131, and a portion of the first substrate layer 11 is exposed in the second wire groove 132. The second wire groove 132 is arranged substantially corresponding to the second wire groove 132. That is, the plurality of first conductive circuits 121 and the plurality of second conductive circuits 131 are substantially one-to-one corresponding.

[0105] S102: See Figure 3 A first slot 14 is disposed on the first substrate layer 11 exposed in the first wire slot 122 , and the first slot 14 is staggered with the first conductive line 121 .

[0106] In this embodiment, along the thickness direction A, the first groove 14 does not penetrate the first substrate layer 11, and the depth of the first groove 14 is less than half of the thickness of the first substrate layer 11. Preferably, the depth of the first groove 14 is one third of the thickness of the first substrate layer 11.

[0107] In this embodiment, along the direction perpendicular to the thickness direction A, the cross-sectional width of the first slot 14 is smaller than the cross-sectional width of the first wire slot 122 , and both side edges of the first slot 14 are spaced apart from the side edges of the first wire slot 122 .

[0108] In the second embodiment of this application, see Figure 8 Step S102 further includes: providing a second slot 15 in the portion of the first substrate layer 11 exposed in the second line slot 132 to obtain a first intermediate body 151. The second slot 15 is provided corresponding to the first slot 14. The cross-sectional width of the second slot 15 is substantially the same as the cross-sectional width of the first slot 14, and the depth of the second slot 15 is substantially the same as the depth of the first slot 14; and providing a plurality of first interlayer conductors 152 in the first intermediate body 151, wherein the first interlayer conductors 152 are connected to the first conductive circuit 121 and the second conductive circuit 131 provided correspondingly.

[0109] S103: See Figure 4 , a first cooling medium 20 is arranged in the first slot 14. The first cooling medium 20 is used to absorb the heat of the first substrate layer 11 and the plurality of first conductive lines 121. The first cooling medium 20 may be at least one of paraffin, a combination of paraffin and helium, a combination of paraffin and hydrofluoroether, a non-paraffin organic compound, an inorganic phase change material, hydrofluorocarbon and hydrofluoroether. The paraffin is a paraffin with a carbon number of 13 to 34; the paraffin and hydrofluoroether combination includes paraffin filled with hydrofluoroether; the paraffin and helium combination includes paraffin filled with helium; the non-paraffin organic compound includes: stearic acid, acetamide, lauric acid, etc.; the inorganic phase change material includes sodium sulfate decahydrate, sodium acetate trihydrate, lithium chlorate trihydrate, etc.; the hydrofluorocarbon includes CF3CF2-CF-OMe-CF(CF3)2 and other fluorides.

[0110] When dissipating heat, the first cooling medium 20 has different heat absorption principles according to the different types of the first cooling medium 20. For example, when the first cooling medium 20 is paraffin, the paraffin absorbs heat and undergoes a phase change, thereby changing from a solid state to a liquid state. The liquid paraffin conducts the heat of the first substrate layer 11 and the first conductive circuit 121 quickly and over a large area, thereby effectively increasing the heat dissipation area and improving the heat dissipation effect. When the first cooling medium 20 is sodium acetate trihydrate, the sodium acetate trihydrate has a large specific heat capacity and latent heat of phase change, thereby absorbing the heat of the first substrate layer 11 and the first conductive circuit 121 without causing a rapid increase in temperature. When the first cooling medium 20 is hydrofluorocarbon, the hydrofluorocarbon absorbs heat and undergoes a phase change, thereby changing from a liquid state to a gaseous state. Since the hydrofluorocarbon has a high heat capacity and thermal conductivity, the heat can be conducted quickly over a large area.

[0111] In the second embodiment of this application, see Fig. 9Step S103 further includes: disposing a second cooling medium 21 in the second slot 15. The second cooling medium 21 is used to absorb the heat of the first substrate layer 11 and the plurality of second conductive lines 131. The material of the first cooling medium 20 is substantially the same as that of the second cooling medium 21. Fig.10 The first wire groove 122 is roughly annular, the first slot 14 is also roughly annular, and the first cooling medium 20 is disposed in the first annular slot 14.

[0112] S104: See Figure 5 , a first insulating protective layer 30 is disposed on the plurality of first conductive lines 121, the first insulating protective layer 30 partially fills the first wire groove 122 to form a first insulating member 301, the first insulating member 301 is located between the side of the first slot 14 and the side of the first wire groove 122, and the first heat dissipation circuit board 100 is obtained. The first insulating member 301 is used to isolate the first cooling medium 20 and the first conductive line 121 adjacent to the first cooling medium 20. The material of the first insulating protective layer 30 includes acrylate, phenolic resin, polyimide, polytetrafluoroethylene, etc.

[0113] See also Figure 5 The first embodiment of the present application further provides a first heat dissipation circuit board 100, which includes a first circuit substrate 123, a first cooling medium 20, and a first insulating protective layer 30. A first slot 14 is provided on one side of the first circuit substrate 123. The first circuit substrate 123 includes a first substrate layer 11 and a plurality of first conductive lines 121 spaced apart on one side of the first substrate layer 11. A first wire slot 122 is formed between each two adjacent first conductive lines 121. The first slot 14 is provided on the first substrate layer 11, and the first slot 14 corresponds to the first wire slot 122. The first cooling medium 20 is provided in the first slot 14. The first insulating protective layer 30 is provided on the plurality of first conductive lines 121, and a portion of the first insulating protective layer 30 fills the first wire slot 122 to form a first insulating member 301. The first insulating member 301 isolates the first cooling medium 20 and the first conductive line 121 adjacent to the first cooling medium 20.

[0114] In the second embodiment of this application, see Fig.11, step S104 further includes: setting a second insulating protective layer 31 on the plurality of second conductive lines 131, the second insulating protective layer 31 partially fills the second wire groove 132 to form a second insulating member 311, the second insulating member 311 is located between the side of the second slot 15 and the side of the second wire groove 132, and the second heat dissipation circuit board 200 is obtained. The second insulating member 311 is used to isolate the second cooling medium 21 and the second conductive line 131 adjacent to the second cooling medium 21. The material of the second insulating protective layer 31 is substantially the same as that of the first insulating protective layer 30.

[0115] See also Fig.11 The second embodiment of the present application also provides a second heat dissipation circuit board 200, which is different from the first heat dissipation circuit board 100 in that: the first circuit substrate 123 also includes a plurality of second conductive circuits 131 spaced apart on the other side of the first substrate layer 11, and a second wire groove 132 is formed between each two adjacent second conductive circuits 131. A second slot 15 is provided on the other side of the first substrate layer 11 corresponding to the second wire groove 132. The second heat dissipation circuit board 200 also includes a second cooling medium 21 and a second insulating protective layer 31. The second cooling medium 21 is disposed in the second slot 15. Part of the second insulating protective layer 31 fills the second wire groove 132 to form a second insulating member 311, and the second insulating member 311 isolates the second cooling medium 21 and the second conductive circuit 131 adjacent to the second cooling medium 21. It can be understood that, please refer to Fig.12 In other embodiments of the present application, the first groove 14 is connected to the second groove 15.

[0116] See also Figures 13 to 16 The third embodiment of the present application provides a method for manufacturing a third heat dissipation circuit board 300, which is different from the second embodiment in that the manufacturing method includes the steps of:

[0117] S105: See Fig.13 , an insulating adhesive layer 22 is disposed on the plurality of second conductive lines 131, and the insulating adhesive layer 22 partially fills the second wire groove 132 to form a third insulating member 221. The third insulating member 221 is located between the side of the second slot 15 and the side of the second wire groove 132, so as to isolate the second cooling medium 21 from the second conductive line 131 adjacent to the second cooling medium 21. The insulating adhesive layer 22 is made of epoxy resin, polyimide, acrylic resin, silicone resin and polyurethane.

[0118] S106: Please see again Fig.13A second single-sided copper-clad substrate 23 is disposed on the insulating adhesive layer 22. The second single-sided copper-clad substrate 23 includes a second substrate layer 231 and a third copper foil layer 232. The second substrate layer 231 is disposed between the insulating adhesive layer 22 and the third copper foil layer 232. The second substrate layer 231 closes the second wire groove 132 and the second slot 15.

[0119] S107: See Fig.14 , etching the third copper foil layer 232 to form a plurality of third conductive circuits 233, forming a second circuit substrate 235. The plurality of third conductive circuits 233 are arranged at intervals. A third line groove 236 is formed between each two adjacent third conductive circuits 233. Part of the second substrate layer 231 is exposed at the bottom of the third line groove 236.

[0120] In this embodiment, step S107 further includes: disposing a plurality of second interlayer conductors 234 in the second substrate layer 231 , wherein the second interlayer conductors 234 connect the second conductive circuits 131 and the third conductive circuits 233 which are disposed opposite to each other.

[0121] S108: Please see again Fig.14 A third slot 32 is provided in the portion of the second substrate layer 231 exposed at the bottom of the third slot 236. The third slot 32 is substantially provided corresponding to the second slot 15. The cross-sectional width of the third slot 32 is smaller than the cross-sectional width of the third slot 236, and the depth of the third slot 32 is smaller than the thickness of the second substrate layer 231.

[0122] S109: See Fig.15 A third cooling medium 33 is disposed in the third slot 32 , and the third cooling medium 33 is used to absorb heat from the second substrate layer 231 and the third conductive circuits 233 . The material of the third cooling medium 33 is substantially the same as that of the first cooling medium 20 .

[0123] S110: See Fig.16 , a third insulating protective layer 34 is provided on the plurality of the third conductive lines 233, and a portion of the third insulating protective layer 34 fills the third wire slot 236 to form a third insulating member 35. The third insulating member 35 isolates the third cooling medium 33 and the third conductive line 233 adjacent to the third cooling medium 33, thereby obtaining the third heat dissipation circuit board 300. It can be understood that in other embodiments of the present application, see Fig.17 The third groove 32 penetrates the second substrate layer 231 and communicates with the second groove 15 .

[0124] See also Fig.16The third embodiment of the present application further provides a third heat dissipation circuit board 300, wherein the first circuit substrate 123 further includes a plurality of second conductive circuits 131 spaced apart on the other side of the first substrate layer 11, a second line groove 132 is formed between each two adjacent second conductive circuits 131, and a second slot 15 is provided on the other side of the first substrate layer 11 corresponding to the second line groove 132, and the third heat dissipation circuit board 300 further includes a second cooling medium 21, an insulating adhesive layer 22, a second circuit substrate 235, a third cooling medium 33 and a third insulating protective layer 34. The second cooling medium 21 is provided in the second slot 15. The insulating adhesive layer 22 is provided on the plurality of second conductive circuits 131, and a portion of the insulating adhesive layer 22 fills the second line groove 132 to form a third insulating member 35, and the third insulating member 35 isolates the second cooling medium 21 and the second conductive circuits 131 adjacent to the second cooling medium 21. The second circuit substrate 235 is disposed on the insulating adhesive layer 22. The second circuit substrate 235 includes a second base material layer 231 and a plurality of third conductive lines 233 disposed on the second base material layer 231. The second base material layer 231 is disposed between the insulating adhesive layer 22 and the plurality of third conductive lines 233. A third wire groove 236 is formed between each two adjacent third conductive lines 233. The third wire groove 236 is disposed corresponding to the second wire groove 132. The second base material layer 231 is provided with a third slot 32. The third slot 32 is disposed corresponding to the third wire groove 236. The third cooling medium 33 is disposed in the third slot 32. The third insulating protective layer 34 is disposed on the plurality of third conductive lines 233. Part of the third insulating protective layer 34 fills the third wire groove 236 to form a third insulating member 35. The third insulating member 35 isolates the third cooling medium 33 and the third conductive lines 233 adjacent to the third insulating medium.

[0125] Compared with the prior art, the heat dissipation circuit boards (the first heat dissipation circuit board 100, the second heat dissipation circuit board 200, and the third heat dissipation circuit board 300) provided in the above embodiments of the present application have the following advantages:

[0126] (i) The cooling medium (the first cooling medium 20, the second cooling medium 21 and the third cooling medium 33) is arranged in the slots (the first slot 14, the second slot 15 and the third slot 32) to achieve effective heat conduction, which is beneficial to reduce the heat accumulation of the heat dissipation circuit board and reduce the adverse effects on other electronic components (such as chips).

[0127] (ii) The grooves are arranged corresponding to the wire grooves (the first wire grooves 122, the second wire grooves 132 and the third wire grooves 236), so that the grooves avoid the conductive lines (the first conductive lines 121, the second conductive lines 131 and the third conductive lines 233), thereby facilitating the effective balance between the density and the heat dissipation efficiency of the heat dissipation circuit board without increasing the thickness of the heat dissipation circuit board.

[0128] (iii) The insulating protective layers (the first insulating protective layer 30, the second insulating protective layer 31 and the third insulating protective layer 34) partially fill the wire grooves to form insulating members (the first insulating member 301, the second insulating member 311 and the third insulating member 35), which isolate the conductive lines from the adjacent cooling medium, thereby improving the stability of the heat dissipating circuit board.

[0129] The above description is only an optimized specific implementation of the present application, but it cannot be limited to this implementation in the actual application process. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should all fall within the protection scope of the present application.

Claims

1. A method for manufacturing a heat dissipation circuit board, characterized in that: Includes steps: A first slot is provided on one side of a first circuit substrate, wherein the first circuit substrate includes a first substrate layer and a plurality of first conductive lines spaced apart and arranged on one side of the first substrate layer, a first line slot is formed between each two adjacent first conductive lines, the first slot is provided on the first substrate layer, and the first slot corresponds to the first line slot; placing a first cooling medium in the first slot, and A first insulating protection layer is disposed on the first conductive lines. The first insulating protection layer fills a portion of the first wire slot to form a first insulating member. The first insulating member isolates the first cooling medium and the first conductive lines adjacent to the first cooling medium.

2. The manufacturing method according to claim 1, characterized in that The first circuit substrate further includes a plurality of second conductive circuits spaced apart on the other side of the first base material layer, and a second wire groove is formed between every two adjacent second conductive circuits. The manufacturing method further includes the steps of: A second slot is provided on the other side of the first circuit substrate, wherein the second slot is provided on the other side of the first base material layer and corresponds to the second line slot; placing a second cooling medium in the second slot, and A second insulating protective layer is disposed on the plurality of second conductive lines. The second insulating protective layer fills a portion of the second wire slot to form a second insulating member. The second insulating member isolates the second cooling medium and the second conductive lines adjacent to the second cooling medium.

3. The manufacturing method according to claim 2, characterized in that: The second slot is connected to the first slot.

4. The manufacturing method according to claim 3, characterized in that: The first circuit substrate further includes a plurality of second conductive circuits spaced apart on the other side of the first base material layer, and a second wire groove is formed between every two adjacent second conductive circuits. The manufacturing method further includes the steps of: A second slot is provided on the other side of the first circuit substrate, wherein the second slot is provided on the other side of the first base material layer and corresponds to the second line slot; A second cooling medium is arranged in the second slot: An insulating adhesive layer is provided on the plurality of second conductive lines, wherein the insulating adhesive layer partially fills the second wire slot to form a third insulating member, wherein the third insulating member isolates the second cooling medium and the second conductive lines adjacent to the second cooling medium; A second circuit substrate is arranged on the insulating adhesive layer, wherein the second circuit substrate includes a second base material layer and a plurality of third conductive circuits arranged on the second base material layer, the second base material layer is arranged between the insulating adhesive layer and the plurality of third conductive circuits, a third wire groove is formed between each two adjacent third conductive circuits, and the third wire groove is arranged corresponding to the second wire groove; A third slot is provided on the second substrate layer, wherein the third slot corresponds to the third wire slot; A third cooling medium is disposed in the third slot, and A third insulating protection layer is disposed on the plurality of third conductive lines. The third insulating protection layer partially fills the third wire slot to form a fourth insulating member. The fourth insulating member isolates the third cooling medium and the third conductive lines adjacent to the third insulating medium.

5. The manufacturing method according to claim 4, characterized in that: The third slot is connected to the second slot.

6. The manufacturing method according to claim 4, characterized in that: Also includes the steps: An interlayer conductor is disposed on the first circuit substrate and the second circuit substrate, and the interlayer conductor electrically connects the first conductive circuit, the second conductive circuit, and the third conductive circuit.

7. A heat dissipation circuit board, characterized in that: include: A first circuit substrate, wherein a first slot is disposed on one side of the first circuit substrate, the first circuit substrate comprises a first substrate layer and a plurality of first conductive lines spaced apart and disposed on one side of the first substrate layer, a first line slot is formed between each two adjacent first conductive lines, the first slot is disposed on the first substrate layer, and the first slot corresponds to the first line slot; a first cooling medium, the first cooling medium being disposed in the first slot, and A first insulating protective layer is disposed on the first conductive lines. The first insulating protective layer partially fills the first wire slot to form a first insulating member. The first insulating member isolates the first cooling medium and the first conductive line adjacent to the first cooling medium.

8. The heat dissipation circuit board according to claim 7, characterized in that: The first circuit substrate further includes a plurality of second conductive circuits spaced apart on the other side of the first substrate layer, a second wire groove is formed between each two adjacent second conductive circuits, and a second slot is provided on the other side of the first substrate layer corresponding to the second wire groove. The heat dissipation circuit board further includes: a second cooling medium, the second cooling medium being disposed in the second slot, and A second insulating protective layer, wherein the second insulating protective layer partially fills the second wire slot to form a second insulating member, and the second insulating member isolates the second cooling medium and the second conductive line adjacent to the second cooling medium.

9. The heat dissipation circuit board according to claim 7, characterized in that: The first circuit substrate further includes a plurality of second conductive circuits spaced apart on the other side of the first substrate layer, a second wire groove is formed between each two adjacent second conductive circuits, and a second slot is provided on the other side of the first substrate layer corresponding to the second wire groove. The heat dissipation circuit board further includes: a second cooling medium, the second cooling medium being disposed in the second slot; an insulating adhesive layer, the insulating adhesive layer being disposed on the plurality of second conductive lines, the insulating adhesive layer partially filling the second wire slot to form a third insulating member, the third insulating member isolating the second cooling medium and the second conductive lines adjacent to the second cooling medium; A second circuit substrate, the second circuit substrate is arranged on the insulating adhesive layer, the second circuit substrate includes a second base material layer and a plurality of third conductive lines arranged on the second base material layer, the second base material layer is arranged between the insulating adhesive layer and the plurality of third conductive lines, a third wire groove is formed between every two adjacent third conductive lines, the third wire groove is arranged corresponding to the second wire groove, the second base material layer is provided with a third open groove, the third open groove is arranged corresponding to the third wire groove; a third cooling medium, the third cooling medium being disposed in the third slot; A third insulating protective layer is disposed on the plurality of third conductive lines, the third insulating protective layer partially fills the third wire slot to form a fourth insulating member, and the fourth insulating member isolates the third cooling medium and the third conductive line adjacent to the third insulating medium.

10. The heat dissipation circuit board according to claim 9, characterized in that: The second wire groove is connected to the first slot, and the third slot is connected to the second slot.

Images