Circuit board, electronic module, electronic equipment and signal transmission method thereof

Abstract

The invention provides a circuit board, an electronic module, electronic equipment and a signal transmission method thereof. The circuit board comprises a golden finger connector, and the golden finger connector is an OSFP-XD golden finger connector. The golden finger connector comprises a first row of golden fingers and a second row of golden fingers which are arranged on the first surface, and a third row of golden fingers and a fourth row of golden fingers which are arranged on the second surface. The first row of golden fingers comprises a first control golden finger and a second control golden finger, the first control golden finger is used for transmitting a serial data signal, and the second control golden finger is used for transmitting an interrupt request signal or a reset control signal. The third row of golden fingers comprises a third control golden finger and a fourth control golden finger, the third control golden finger is used for transmitting a clock signal, and the fourth control golden finger is used for transmitting a low-power-consumption control signal or a module in-place display signal or a reset control signal. The thickness of the circuit board ranges from 0.9 mm to 1.1 mm. The compatibility of the system is improved, and the cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a circuit board, an electronic module, an electronic equipment and a signal transmission method thereof. Background Art

[0002] With the increasing application of 5G communication and artificial intelligence technology, the data traffic of the network is increasing, and the required optical communication bandwidth is increasing. In order to match the bandwidth requirements of the optical communication network, the high-speed signal rate of each optical channel and electrical channel of the optical module is getting higher and higher, and the requirements for the capacity of the optical module are also getting higher and higher.

[0003] The capacity of an optical module = the number of high-speed signal channels x the rate of each channel. Since optical channels can use very high-density optical interface technology, or use wavelength combination and demultiplexing technology to combine light of different wavelengths of multiple channels into one channel for transmission, there is no density problem. As for electrical channels, due to the pluggable requirements of optical modules, the electrical channels of common and widely used optical modules are the gold fingers on the gold finger connector, which cooperate with the female connector on the system board to transmit electrical signals. Therefore, one direction to increase the capacity of optical modules is to increase the number of electrical channels, that is, to increase the number of gold fingers of the gold finger connector. With the increase in the number of gold fingers of the gold finger connector, the female connector adapted to the new generation of gold finger connectors is difficult to be compatible with the previous generation of gold finger connectors. After the system is upgraded, it is difficult to be compatible with the previous generation of gold finger connectors, which will cause the modules with the previous generation of gold finger connectors to be unusable, resulting in waste, increasing the upgrade cost, and easily causing losses to users' assets. Therefore, improving the compatibility of the female connector adapted to the new generation of gold finger connectors is an important development direction. Summary of the invention

[0004] The present application provides a circuit board, an electronic module, an electronic device and a signal transmission method thereof to improve the compatibility of a female connector connected to a gold finger, or to improve system compatibility to reduce the cost of users upgrading the system.

[0005] In a first aspect, the present application provides a circuit board, which includes a gold finger connector, and the gold finger connector can be specifically an OSFP-XD gold finger connector. The gold finger connector is located at the edge of the circuit board, and the gold finger connector includes a plurality of gold fingers. The above-mentioned circuit board includes a first surface and a second surface that are separated from each other, and the gold finger connector includes a first row of gold fingers and a second row of gold fingers arranged on the first surface, and a third row of gold fingers and a fourth row of gold fingers arranged on the second surface. Among them, the first row of gold fingers and the second row of gold fingers are arranged along the plug-in direction of the gold finger connector, and the third row of gold fingers and the fourth row of gold fingers are arranged along the plug-in direction of the gold finger connector.

[0006] In the specific technical solution, the first row of gold fingers includes a first control gold finger, a second control gold finger and two first power gold fingers. The first control gold finger is used to transmit a serial data signal, the second control gold finger is used to transmit an interrupt request signal or a reset control signal, and the two first power gold fingers are arranged between the first control gold finger and the second control gold finger. The third row of gold fingers includes a third control gold finger, a fourth control gold finger and two second power gold fingers. The third control gold finger is used to transmit a clock signal, and the fourth control gold finger is used to transmit a low-power control signal or a module in-position display signal or a reset control signal; the two second power gold fingers are arranged between the third control gold finger and the fourth control gold finger. This makes the female connector adapted to the OSFP-XD gold finger connector compatible with the OSFP gold finger connector from the perspective of pin definition or transmission signal type.

[0007] In addition, the thickness of the above-mentioned circuit board is 0.9 mm to 1.1 mm. The thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' is relatively close to the thickness of the circuit board of the OSFP gold finger connector 4. Therefore, from the perspective of physical structure, the opening size of the female connector used to connect the OSFP-XD gold finger connector 1' can also be compatible with the gold finger connector of the OSFP gold finger connector 4. This makes the female connector adapted to the OSFP-XD gold finger connector 1' also compatible with OSFP in terms of physical size.

[0008] Therefore, the OSFP-XD gold finger connector 1' and the OSFP gold finger connector 4 can share the same female connector 110, thereby improving the compatibility of the female connector 110 and further improving the compatibility of the system. Users can update or replace the electronic module 200 as needed without having to update the system's single board. This solution is beneficial for reducing costs.

[0009] In a further technical solution, the first row of gold fingers and the third row of gold fingers include other gold fingers in addition to the control gold fingers and power gold fingers, such as data signal gold fingers. Specifically, the first row of gold fingers includes four pairs of gold fingers for sending data signals and four pairs of gold fingers for receiving data signals. The four pairs of gold fingers for sending data signals in the first row of gold fingers are sequentially arranged on the side of the first control gold finger away from the second control gold finger, and the four pairs of gold fingers for receiving data signals in the first row of gold fingers are sequentially arranged on the side of the second control gold finger away from the first control gold finger; the second row of gold fingers also includes four pairs of gold fingers for sending data signals and four pairs of gold fingers for receiving data signals. The four pairs of gold fingers for sending data signals in the second row of gold fingers are sequentially arranged on the side of the third control gold finger away from the fourth control gold finger, and the four pairs of gold fingers for receiving data signals in the first row of gold fingers are sequentially arranged on the side of the fourth control gold finger away from the third control gold finger.

[0010] In a technical solution, the two ends of the above-mentioned gold finger connector along the plug-in direction are respectively the first end and the second end, the first end is used to insert the female connector, and the second end is used to connect with the circuit board body. The above-mentioned first row of gold fingers and the second row of gold fingers are arranged in sequence along the direction from the first end to the second end, and the third row of gold fingers and the fourth row of gold fingers are arranged in sequence along the direction from the first end to the second end. The above-mentioned first row of gold fingers and the second row of gold fingers are arranged in sequence along the insertion direction, and the third row of gold fingers and the fourth row of gold fingers are along the insertion direction. In the process of inserting the gold finger connector into the female connector, the second row of gold fingers and the fourth row of gold fingers of the gold finger connector are first inserted into the female connector, and then the first row of gold fingers and the third row of gold fingers are inserted into the female connector. In this solution, the length of the OSFP gold finger connector inserted into the female connector adapted to the OSFP-XD gold finger connector is the same as or similar to the length of the female connector corresponding to the OSFP module. The length of the circuit board of the OSFP gold finger connector does not need to be changed, which can improve the compatibility of the system.

[0011] In one technical solution, the first row of gold fingers and the second row of gold fingers are arranged in sequence from the second end to the first end, that is, arranged in the direction of extraction; the third row of gold fingers and the fourth row of gold fingers are arranged in sequence from the second end to the first end, that is, arranged in the direction of extraction. The OSFP gold finger connector can be inserted into the bottom of the female connector, which is convenient for positioning the gold fingers of the OSFP gold finger connector and the first group of pins of the female connector, which is beneficial to improving the connection reliability of the OSFP gold finger connector and the female connector.

[0012] Specifically, the thickness of the circuit board of the OSFP-XD gold finger connector can be set to 1 mm, which is the same as the thickness of the circuit board of the OSFP gold finger connector in the prior art.

[0013] When the circuit board of the OSFP-XD gold finger connector is specifically implemented, the circuit board includes a conductive layer and a dielectric layer, and there is a dielectric layer between any adjacent conductive layers. The circuit board specifically includes 12 layers of conductive layers. The 12 layers of conductive layers can all be used to prepare routing patterns. The conductive layer used to prepare routing patterns has a larger area and more routing space. The routing prepared on the conductive layer on both sides of the circuit board can be relatively small, so that there is more space on both sides of the circuit board for layout of devices, which is conducive to simplifying the preparation process of electronic modules.

[0014] The thickness of each layer of the circuit board can be made thinner, for example, the thickness of the conductive layer is 10um to 40um, and the thickness of the dielectric layer is 20um to 40um. This solution can realize the transmission of more signals on a thinner circuit board.

[0015] In addition, the conductive layer includes routing lines. In order to arrange more routing lines on the conductive layer, the width of the routing lines can be made narrower. For example, the width of the routing lines includes 20 um to 40 um.

[0016] In a second aspect, the present application further provides an electronic module. The electronic module comprises a housing and the circuit board provided in the first aspect, the circuit board being mounted on the housing. The electronic module may be an optical module, for example, comprising an optical transmitting device and / or an optical receiving device.

[0017] In a third aspect, the present application also provides an electronic device. The electronic device includes an electronic component and the electronic module provided in the second aspect. The electronic component includes a female connector, and the gold finger connector of the electronic module is plugged into the female connector. The female connector of the electronic component has good compatibility and can be compatible with OSFP-XD gold finger connectors and OSFP gold finger connectors, or in other words, the female connector of the electronic component can be compatible with OSFP-XD modules and OSFP modules. After upgrading, the electronic device can also be connected to the previous generation of OSFP modules, so it is not easy to generate waste, which is conducive to reducing the upgrade cost of the electronic device.

[0018] In the fourth aspect, the present application also provides a signal transmission method of the electronic device provided in the third aspect. Specifically, the pins in the female connector of the electronic device include a first control pin, a second control pin, a point control pin, a fourth control pin, a first power pin and a second power pin, and the pins are respectively connected to the gold fingers of the gold finger connector. The signal transmission method specifically includes: the first control gold finger and the first control pin transmit a serial data signal; the second control gold finger and the second control pin transmit an interrupt request signal or a reset control signal; the third control gold finger and the third control pin transmit a clock signal; the fourth control gold finger and the fourth control pin transmit a low power control signal or a module in place display signal or a reset control signal; the first power gold finger and the first power pin transmit a power signal; the second power gold finger and the second power pin also transmit a power signal. This signal transmission method can be used to transmit signals of OSFP-XD modules as well as signals of OSFP modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of an electronic device in an embodiment of the present application;

[0020] Figure 2 This is a schematic diagram of the connection structure between the electronic module and the electronic component in the embodiment of the present application;

[0021] Figure 3 A schematic diagram of the structure of a communication network system in an embodiment of the present application;

[0022] Figure 4 A schematic diagram of the structure of a circuit board in an embodiment of the present application;

[0023] Figure 5 A schematic diagram of the structure of a circuit board in an embodiment of the present application;

[0024] Figure 6 This is a schematic diagram of the expansion of the OSFP-XD gold finger connector in the embodiment of the present application;

[0025] Figure 7 A schematic diagram of the structure of a circuit board with an OSFP gold finger connector;

[0026] Figure 8 This is a schematic diagram of the OSFP gold finger connector;

[0027] Fig. 9 A cross-sectional schematic diagram of the connection between the gold finger connector and the female connector in an embodiment of the present application;

[0028] Fig.10 A cross-sectional schematic diagram of the connection between the gold finger connector and the female connector in an embodiment of the present application;

[0029] Fig.11 This is a schematic diagram of the expansion of the OSFP-XD gold finger connector in the embodiment of the present application;

[0030] Fig.12 A cross-sectional schematic diagram of the connection between the gold finger connector and the female connector in an embodiment of the present application;

[0031] Fig.13 A cross-sectional schematic diagram of the connection between the gold finger connector and the female connector in an embodiment of the present application;

[0032] Fig.14 A schematic diagram of a cross-sectional structure of a circuit board of an OSFP-XD gold finger connector in an embodiment of the present application;

[0033] Fig.15 The following is a schematic diagram of a process flow for preparing an OSFP-XD gold finger connector in an embodiment of the present application.

[0034] Reference numerals:

[0035] 100-electronic component; 110-female connector;

[0036] 200-electronic module; 200'-OSFP-XD module;

[0037] 210-housing; 220-circuit board;

[0038] 300-OSFP module; 1-gold finger connector;

[0039] 1'-OSFP-XD gold finger connector;

[0040] 111- first surface; 112- second surface;

[0041] 113-conductive layer; 114-dielectric layer;

[0042] 1141-adjusting dielectric layer; 115-conductive hole;

[0043] 116-photosensitive film layer; 12-gold finger;

[0044] 121-first row of gold fingers; 1211-first control gold fingers;

[0045] 1212-second control gold finger; 1213-first power gold finger;

[0046] 122-third row of gold fingers; 1221-third control gold fingers;

[0047] 1222-the fourth control gold finger; 1223-the second power gold finger;

[0048] 21-send data signal gold finger; 22-receive data signal gold finger;

[0049] 23-Grounding gold finger; 123-Second row of gold fingers;

[0050] 124-the fourth row of gold fingers; 13-the first end;

[0051] 14-second end; 15-OSFP-XD gold finger connector board edge;

[0052] 3-Electronic devices; 4-OSFP gold finger connector;

[0053] 41- third surface; 42- fourth surface;

[0054] 43-fifth row of gold fingers; 44-sixth row of gold fingers;

[0055] 45-OSFP gold finger connector board edge; 5-first group of pins;

[0056] 6-the second set of pins; 7-connection port;

[0057] X-first direction; Y-plugging direction;

[0058] Y1-insertion direction; Y2-extraction direction. DETAILED DESCRIPTION

[0059] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0060] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0061] References to "one embodiment" or "a specific embodiment" described in this specification mean that one or more embodiments of the present application include a particular feature, structure or characteristic described in conjunction with the embodiment. The terms "include", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0062] In order to facilitate the understanding of the circuit board, electronic module, electronic device and signal transmission method thereof provided in the embodiment of the present application, the main application scenarios are first introduced below. With the development of communication technology, the communication bandwidth is getting larger and larger. Since optical signals have the advantages of fast signal transmission rate and low loss, the application of using optical signals to realize signal transmission has become more and more extensive. For example, optical module products are used in the fields of Passive Optical Network (PON), wireless network, Internet Protocol (IP), etc. In the process of signal transmission, it is necessary to convert between optical signals and electrical signals, so the optical module needs to have an electrical signal transmission interface, and a more commonly used electrical signal transmission interface is a gold finger connector. The gold finger connector provided in the present application is a double-8 channel small package pluggable (octal small form-factor pluggable X double, OSFP-XD) gold finger connector. By improving the OSFP-XD gold finger connector, the compatibility of the female connector adapted to the OSFP-XD gold finger connector is improved, thereby reducing the upgrade cost of electronic modules and electronic devices.

[0063] Figure 1 is a schematic diagram of the structure of an electronic device in an embodiment of the present application, Figure 2 Schematic diagram of the connection structure between the electronic module and the electronic component in the embodiment of the present application. Figure 1 Shown and Figure 2As shown, the electronic device in the embodiment of the present application includes an electronic component 100 and an electronic module 200. The electronic module 200 may be an OSFP-XD module 200'. The electronic module 200 includes a housing 210 and a circuit board 220, and the circuit board 220 includes a gold finger connector 1. The electronic component 100 includes a female connector 110, and the gold finger connector 1 is plugged with the female connector 110, so as to realize the electrical connection between the electronic module 200 and the electronic component 100.

[0064] Figure 3 A schematic diagram of the structure of the communication network system in the embodiment of the present application is shown in FIG. Figure 3 As shown, the communication network system includes a plurality of the electronic devices, and the plurality of electronic devices are connected via the electronic module 200. Figure 3 In the embodiment shown, the communication network system includes a master system and a slave system, and both the master system and the slave system include electronic devices. The electronic module 200 in the embodiment of the present application is an OSFP-XD module 200', and the female connector 110 used for plugging with the gold finger connector 1 of the OSFP-XD module 200' can also be compatible with the gold finger connector of the octal small form-factor pluggable (OSFP) module 300. Specifically, the OSFP-XD module 200' or the OSFP module 300 can be connected to the female connector 110 of the electronic device according to actual needs. In this solution, the electronic device used to connect the gold finger connector 1 of the OSFP-XD module 200' can also be used to connect the gold finger connector of the OSFP module 300, so the upgraded electronic device can also dock with the unupgraded OSFP module 300, which is conducive to improving the flexibility of system networking, protecting existing investments, and reducing costs.

[0065] The electronic module 200 may include an optical device, such as an optical transmitter or an optical receiver. In this case, the electronic module 200 may be an optical module. In addition, the electronic module 200 may not include an optical device and is only used to transmit electrical signals.

[0066] The electronic device may be a communication device, such as a switch, a router, a wavelength division device, a server or a supercomputer, etc. In addition, it may be any electronic device that needs to transmit signals using the OSFP-XD gold finger connector 1 ′.

[0067] Figure 4 is a schematic diagram of the structure of a circuit board in an embodiment of the present application, such as Figure 4As shown, the circuit board 220 in the embodiment of the present application includes a gold finger connector 1, which is located at the edge of the circuit board 220. Specifically, the gold finger connector 1 has a plurality of gold fingers 12, and the gold fingers 12 are formed on the surface of the above-mentioned circuit board 220. Specifically, the above-mentioned circuit board 220 may also include a circuit, which can make the circuit of the circuit board 220 electrically connected to the gold finger 12 so that the circuit of the circuit board 220 can be connected to other electronic components through the gold finger connector. An electronic device 3 can also be set on the above-mentioned circuit board 220, and the electronic device 3 is connected to the circuit of the circuit board 220, so that it can be electrically connected to the gold finger 12 of the gold finger connector 1. When the gold finger connector is connected to other electronic components, the electronic device on the circuit board 220 can be connected to the above-mentioned other electronic components to achieve signal transmission.

[0068] Figure 5 This is a schematic diagram of the structure of a circuit board in an embodiment of the present application. Figure 6 FIG. 1 is a schematic diagram of the expansion of the gold finger connector in the embodiment of the present application. Figure 6 As shown, the bold dashed line in the figure indicates the direction of the gold finger connector board along 15, or in other words, Figure 6 FIG. 1 is a schematic diagram of the gold finger connector being unfolded with the board edge 15 as a fold line. The board edge is the edge of the gold finger connector at the insertion end. Figure 5 and Figure 6As shown, the gold finger connector 1 in the embodiment of the present application can be an OSFP-XD gold finger connector 1'. Specifically, the circuit board 220 of the gold finger connector 1 in the embodiment of the present application includes a first surface 111 and a second surface 112 that are separated from each other, and the gold fingers 12 of the gold finger connector 1 include a first row of gold fingers 121, a second row of gold fingers 123, a third row of gold fingers 122, and a fourth row of gold fingers 124. Among them, the first row of gold fingers 121 and the third row of gold fingers 122 are arranged on the first surface 111 of the circuit board 220, and the first row of gold fingers 121 and the second row of gold fingers 123 are arranged along the plug-in direction of the gold finger connector; the third row of gold fingers 122 and the fourth row of gold fingers 124 are arranged on the second surface 112 of the circuit board 220, and the third row of gold fingers 122 and the fourth row of gold fingers 124 are arranged along the plug-in direction of the gold finger connector. The above-mentioned first row of gold fingers 121 and the second row of gold fingers 123 are arranged in different rows, and the third row of gold fingers 122 and the fourth row of gold fingers 124 are arranged in different rows. The pins of the female connector 110 connected to the first row of gold fingers 121 and the pins connected to the second row of gold fingers 123 are located in different rows along the plugging direction to reduce mutual influence; the pins of the female connector 110 connected to the third row of gold fingers 122 and the pins connected to the fourth row of gold fingers 124 are located in different rows along the plugging direction to reduce mutual influence. The gold finger connector provided in the present application includes a large number of gold fingers, and the number and density of signals that can be transmitted are also large, which is conducive to adapting to the current development trend of high-density electronic equipment.

[0069] In a specific embodiment, the orthographic projection of the first row of gold fingers 121 on the circuit board 220 at least partially overlaps with the orthographic projection of the third row of gold fingers 122 on the circuit board 220. It can be understood that the first row of gold fingers 121 and the third row of gold fingers 122 are located in the same row or approximately in the same row.

[0070] Specifically, the first row of gold fingers 121 includes a plurality of gold fingers 12, and the plurality of gold fingers 12 of the first row of gold fingers 121 are sequentially arranged at intervals along the first direction X on the first surface 111, and the plurality of gold fingers 12 of the first row of gold fingers 121 are arranged in a row, and the row formed by the first row of gold fingers 121 extends along the first direction X. The second row of gold fingers 123 includes a plurality of gold fingers 12, and the plurality of gold fingers 12 of the second row of gold fingers 123 are sequentially arranged at intervals along the first direction X on the first surface 111, and the plurality of gold fingers 12 of the second row of gold fingers 123 are arranged in a row, and the row formed by the second row of gold fingers 123 extends along the first direction X. Similarly, the third row of gold fingers 122 also includes a plurality of gold fingers 12, and the plurality of gold fingers 12 of the third row of gold fingers 122 are sequentially arranged at intervals along the first direction X on the second surface 112, and the plurality of gold fingers 12 of the third row of gold fingers 122 are arranged in a row, and the row of the third row of gold fingers 122 extends along the first direction X. The fourth row of gold fingers 124 includes a plurality of gold fingers 12, and the plurality of gold fingers 12 of the fourth row of gold fingers 124 are sequentially arranged at intervals along the first direction X on the second surface 112, and the plurality of gold fingers 12 of the fourth row of gold fingers 124 are arranged in a row, and the row of the fourth row of gold fingers 124 extends along the first direction X. In a specific embodiment, the first direction X is perpendicular to the plugging direction Y of the gold finger connector.

[0071] Please refer to Figure 6 The first row of gold fingers 121 includes a first control gold finger 1211, a second control gold finger 1212 and two first power gold fingers 1213. The first control gold finger 1211 is used to transmit a serial data signal (SDA), the second control gold finger 1212 is used to transmit an interrupt request signal or a reset control signal (INT / RSTn), and the two first power gold fingers 1213 are arranged between the first control gold finger 1211 and the second control gold finger 1212. The third row of gold fingers 122 includes a third control gold finger 1221, a fourth control gold finger 1222 and two second power gold fingers 1223. The third control gold finger 1221 is used to transmit a clock signal (SCL), and the fourth control gold finger 1222 is used to transmit a low power control signal or a module in place display signal or a reset control signal (LPWn / PRSn / ePPS); the two second power gold fingers 1223 are arranged between the third control gold finger 1221 and the fourth control gold finger 1222.

[0072] The previous generation connector of the OSFP-XD gold finger connector 1' is the OSFP gold finger connector 4. Figure 7 A schematic diagram of the structure of a circuit board with an OSFP gold finger connector. Figure 8 The following is a schematic diagram of the OSFP gold finger connector. Figure 8As shown, the bold dashed line in the figure indicates the OSFP gold finger connector board along the 45 direction, or in other words, Figure 8 FIG. 4 is a schematic diagram of an OSFP gold finger connector unfolded with the board edge 45 as a fold line. The board edge is the edge of the gold finger connector at the insertion end. Figure 7 and Figure 8 As shown, the surfaces on both sides of the OSFP gold finger connector 4 that are opposite to each other are the third surface 41 and the fourth surface 42, respectively. The third surface 41 of the OSFP gold finger connector 4 includes a fifth row of gold fingers 43, and the fifth row of gold fingers 43 includes a plurality of gold fingers that are sequentially spaced and arranged along the first direction X. The fourth surface 42 includes a sixth row of gold fingers 44, and the sixth row of gold fingers 44 also includes a plurality of gold fingers that are sequentially spaced and arranged along the first direction X. Specifically, the plurality of gold fingers in the fifth row of gold fingers 43 of the OSFP gold finger connector 4 meet certain definitions and sorting, and the plurality of gold fingers in the sixth row of gold fingers 44 on the fourth surface 42 of the OSFP gold finger connector 4 also meet certain definitions and sorting.

[0073] like Figure 6 and Figure 8 As shown, the control signals and sequencing transmitted by the first control golden finger 1211, the second control golden finger 1212 and the first power golden finger 1213 of the first row of golden fingers 121 of the OSFP-XD golden finger connector 1' are the same as the signals and sequencing transmitted by the control golden fingers and the power golden fingers of the fifth row of golden fingers 43 of the OSFP golden finger connector 4; the control signals and sequencing transmitted by the third control golden fingers 1221, the fourth control golden fingers 1222 and the second power golden fingers 1223 of the third row of golden fingers 122 are the same as the signals and sequencing transmitted by the control golden fingers and the power golden fingers of the sixth row of golden fingers 44 of the OSFP golden finger connector 4. The rest are all golden fingers for transmitting data and grounding. This makes the female connector adapted to the OSFP-XD golden finger connector 1' compatible with the OSFP golden finger connector from the perspective of pin definition or transmission signal type.

[0074] In addition, the thickness of the circuit board 220 of the gold finger connector provided in the present application is 0.9 mm to 1.1 mm. The thickness of the circuit board of the OSFP gold finger connector 4 in the prior art is 1 mm. The thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' is relatively close to the thickness of the circuit board of the OSFP gold finger connector 4. Therefore, from the perspective of physical structure, the opening size of the female connector used to connect the OSFP-XD gold finger connector 1' can also be compatible with the gold finger connector of the OSFP gold finger connector 4. The female connector adapted to the OSFP-XD gold finger connector 1' can also be compatible with OSFP in terms of physical size.

[0075] Therefore, the OSFP-XD gold finger connector 1' and the OSFP gold finger connector 4 can share the same female connector 110, thereby improving the compatibility of the female connector 110 and further improving the compatibility of the system. Users can update or replace the electronic module 200 as needed without having to update the system's single board. This solution is beneficial for reducing costs.

[0076] Please continue to refer to Figure 6 In addition to the control gold fingers and power gold fingers mentioned above, the gold finger connector provided in the present application also includes data signal gold fingers and ground gold fingers 23. Specifically, the first row of gold fingers 121 includes four pairs of gold fingers 21 (TX) for sending data signals and four pairs of gold fingers 22 (RX) for receiving data signals. The four pairs of gold fingers 21 for sending data signals in the first row of gold fingers 121 are sequentially arranged on the side of the first control gold finger 1211 away from the second control gold finger 1212, and the four pairs of gold fingers 22 for receiving data signals in the first row of gold fingers 121 are sequentially arranged on the side of the second control gold finger 1212 away from the first control gold finger 1211. Similarly, the second row of gold fingers 123 also includes four pairs of gold fingers 21 for sending data signals and four pairs of gold fingers 22 for receiving data signals. The four pairs of gold fingers 21 for sending data signals of the second row of gold fingers 123 are arranged in sequence on the side of the third control gold finger 1221 away from the fourth control gold finger 1222, and the four pairs of gold fingers 22 for receiving data signals of the first row of gold fingers 121 are arranged in sequence on the side of the fourth control gold finger 1222 away from the third control gold finger 1221.

[0077] In addition, the first row of gold fingers 121 may also include ten grounding gold fingers 23, and both ends of any pair of gold fingers 21 for sending data signals or any pair of gold fingers 22 for receiving data signals have a grounding gold finger 23. Two adjacent pairs of gold fingers 21 for sending data signals share one grounding gold finger 23, and two adjacent pairs of gold fingers 22 for receiving data signals share one grounding gold finger 23.

[0078] In a specific embodiment, a pair of transmitting data signal gold fingers 21 may include two transmitting data signal gold fingers 21 arranged along the first direction X, for transmitting a differential signal pair; similarly, a pair of receiving data signal gold fingers 22 may include two receiving data signal gold fingers 22 arranged along the first direction X, for transmitting a differential signal pair. In addition, the order of the data signal gold fingers is also based on Figure 6 As shown, the compatibility of the female connector adapted to the OSFP-XD gold finger connector 1' is further improved and the control program is simplified.

[0079] like Figure 6 and Figure 8As shown, the definition and order of the multiple gold fingers 12 of the first row of gold fingers 121 of the OSFP-XD gold finger connector 1' are the same as the definition and order of the multiple gold fingers 12 of the fifth row of gold fingers 43 of the OSFP gold finger connector 4; the definition and order of the multiple gold fingers 12 of the third row of gold fingers 122 of the OSFP-XD gold finger connector 1' are the same as the definition and order of the multiple gold fingers 12 of the sixth row of gold fingers 44 of the OSFP gold finger connector 4. For example, Figure 6 A definition and ordering of multiple gold fingers 12 in the first row of gold fingers 121 and a definition and ordering of multiple gold fingers 12 in the third row of gold fingers 122 are shown. The definition and ordering of the two rows of gold fingers 12 of the OSFP-XD gold finger connector 1' in the embodiment of the present application are the same as the definition and ordering of the two rows of gold fingers of the OSFP gold finger connector 4.

[0080] Specifically, the female connector 110 adapted to the OSFP-XD gold finger connector 1' includes pins for connecting to the first row of gold fingers 121 and the third row of gold fingers 122 of the OSFP-XD gold finger connector 1', and the above pins can also be used to connect to the gold fingers of the OSFP gold finger connector 4, so that the electronic module 200 with the OSFP-XD gold finger connector 1' and the electronic module with the OSFP gold finger connector 4 can both operate normally.

[0081] It is worth noting that the plug-in direction Y refers to a linear direction, including an insertion direction Y1 and a pull-out direction Y2. The insertion direction is the direction toward the plug-in end of the gold finger connector on the circuit board 220, and the pull-out direction Y2 is the direction away from the plug-in end of the gold finger connector on the circuit board 220.

[0082] Please continue to refer to Figure 5 and Figure 6In one embodiment, the two ends of the above-mentioned gold finger connector 1 along the plug-in direction are respectively the first end 13 and the second end 14. The above-mentioned first end 13 is the end of the OSFP-XD gold finger connector board edge 15 of the gold finger connector 1 along the plug-in direction. The above-mentioned second end 14 and the first end 13 are arranged in sequence along the insertion direction Y1. The above-mentioned first end 13 is used to insert the female connector 110, that is, the plug-in end. In the process of inserting the gold finger connector 1 into the female connector 110, the first end 13 of the gold finger connector 1 is first inserted into the female connector 110, and the second end 14 is inserted into the female connector 110 later, or the second end 14 is not inserted into the female connector 110. The above-mentioned first row of gold fingers 121 and the second row of gold fingers 123 are arranged in sequence along the direction from the second end 14 to the first end 13, or in other words, arranged in sequence along the insertion direction Y1; the third row of gold fingers 122 and the fourth row of gold fingers 124 are arranged in sequence along the direction from the second end 14 to the first end 13, or in other words, along the insertion direction Y1. That is, the first row of gold fingers 121 is located on the inner side of the gold finger connector 1, and the first row of gold fingers 121 and the second row of gold fingers 123 are arranged from the inside to the outside; the third row of gold fingers 122 is located on the inner side of the gold finger connector 1, and the third row of gold fingers 122 and the fourth row of gold fingers 124 are arranged from the inside to the outside. In the process of inserting the gold finger connector 1 into the female connector 110, the second row of gold fingers 123 and the fourth row of gold fingers 124 of the gold finger connector 1 are first inserted into the female connector 110, and then the first row of gold fingers 121 and the third row of gold fingers 122 are inserted into the female connector 110.

[0083] Fig. 9 Schematic diagram of a cross section of the connection between the gold finger connector and the female connector in the embodiment of the present application, as shown in FIG. Fig. 9 As shown, in one embodiment, the pins of the female connector 110 include a first group of pins 5 and a second group of pins 6, and the plurality of pins of the first group of pins 5 are arranged in a row in sequence along the first direction X, and the plurality of pins of the second group of pins 6 are arranged in a row in sequence along the first direction X. The first group of pins 5 and the second group of pins 6 are arranged in the plugging and unplugging direction. Specifically, the first group of pins 5 and the second group of pins 6 are arranged in the unplugging direction Y2, and the first group of pins 5 are located inside the female connector 110. With the connection port 7 of the female connector 110 as a reference, the first group of pins 5 are located in the direction of the second group of pins 6 away from the connection port 7. The second group of pins 6 includes two opposite rows of pins, and the two rows of pins of the second group of pins 6 are respectively used to connect with the first row of gold fingers 121 and the third row of gold fingers 122. The first group of pins 5 includes two opposite rows of pins, and the two rows of pins of the first group of pins 5 are respectively used to connect with the second row of gold fingers 123 and the fourth row of gold fingers 124.

[0084] like Fig. 9 As shown, Figure 6When the gold finger connector 1 in the shown embodiment is inserted into the female connector 110, the second row of gold fingers 123 and the fourth row of gold fingers 124 are inserted into the inner side of the female connector 110 and connected to the first group of pins 5 of the female connector 110; the first row of gold fingers 121 and the third row of gold fingers 122 are inserted into the part of the female connector 110 closer to the connection port 7 and connected to the second group of pins 6 of the female connector 110.

[0085] Fig.10 Schematic diagram of a cross section of the connection between the gold finger connector and the female connector in the embodiment of the present application, as shown in FIG. Fig.10 As shown, insert OSFP gold finger connector 4 into Fig. 9 When the female connector 110 is shown, the gold fingers on both sides of the OSFP gold finger connector 4 are connected to the second group of pins 6. The OSFP gold finger connector 4 is not inserted into the bottom of the female connector 110, and the OSFP gold finger connector 4 does not need to be provided with an additional structure in the direction of the circuit board 220 (away from the direction of the OSFP gold finger connector board along 45) to extend into the female connector 110. In this solution, the length of the OSFP gold finger connector 4 inserted into the female connector 110 is the same as or similar to the length of the female connector 110 corresponding to the OSFP module 300, and the length of the circuit board 220 of the OSFP gold finger connector 4 does not need to be changed, which can improve the compatibility of the system.

[0086] Fig.11 FIG. 1 is a schematic diagram of an OSFP-XD gold finger connector in an embodiment of the present application. Fig.11 As shown, the bold dashed line in the figure indicates the OSFP-XD gold finger connector board along the 15 direction, or in other words, Fig.11 It is a schematic diagram of the OSFP-XD gold finger connector board unfolded along 15 as a broken line. In one embodiment, the first row of gold fingers 121 and the second row of gold fingers 123 are arranged in sequence along the direction from the first end 13 to the second end 14, that is, arranged along the extraction direction Y2; the third row of gold fingers 122 and the fourth row of gold fingers 124 are arranged in sequence along the direction from the first end 13 to the second end 14, that is, arranged along the insertion direction Y1. That is, the first row of gold fingers 121 is located on the outside of the gold finger connector 1, and the first row of gold fingers 121 and the second row of gold fingers 123 are arranged from the outside to the inside; the third row of gold fingers 122 is located on the outside of the gold finger connector 1, and the third row of gold fingers 122 and the fourth row of gold fingers 124 are arranged from the outside to the inside. When inserting the gold finger connector 1 into the female connector 110 , the first row of gold fingers 121 and the third row of gold fingers 122 of the gold finger connector 1 are first inserted into the female connector 110 , and then the second row of gold fingers 123 and the fourth row of gold fingers 124 are inserted into the female connector 110 .

[0087] Fig.12 Schematic diagram of a cross section of the connection between the gold finger connector and the female connector in the embodiment of the present application, as shown in FIG. Fig.12 As shown, in one embodiment, the pins of the female connector 110 include a first group of pins 5 and a second group of pins 6, and the plurality of pins of the first group of pins 5 are arranged in a row in sequence along the first direction X, and the plurality of pins of the second group of pins 6 are arranged in a row in sequence along the first direction X. The first group of pins 5 and the second group of pins 6 are arranged in the plugging and unplugging direction. Specifically, the first group of pins 5 and the second group of pins 6 are arranged in the unplugging direction Y2, and the first group of pins 5 are located inside the female connector 110. With the connection port 7 of the female connector 110 as a reference, the first group of pins 5 are located in the direction of the second group of pins 6 away from the connection port 7. The first group of pins 5 include two opposite rows of pins, and the two rows of pins of the first group of pins 5 are respectively used to connect with the first row of gold fingers 121 and the third row of gold fingers 122. The second group of pins 6 include two opposite rows of pins, and the two rows of pins of the second group of pins 6 are respectively used to connect with the second row of gold fingers 123 and the fourth row of gold fingers 124.

[0088] like Fig.12 As shown, Fig.11 When the gold finger connector 1 in the shown embodiment is inserted into the female connector 110, the first row of gold fingers 121 and the third row of gold fingers 122 are inserted into the inner side of the female connector 110 and connected to the first group of pins 5 of the female connector 110; the second row of gold fingers 123 and the fourth row of gold fingers 124 are inserted into the part of the female connector 110 closer to the connection port 7 and connected to the second group of pins 6 of the female connector 110.

[0089] Fig.13 Schematic diagram of a cross section of the connection between the gold finger connector and the female connector in the embodiment of the present application, as shown in FIG. Fig.13 As shown, insert OSFP gold finger connector 4 into Fig.12 When the female connector 110 is shown, the gold fingers on both side surfaces of the OSFP gold finger connector 4 are connected to the above-mentioned first group of pins 5, and the OSFP gold finger connector 4 can be inserted into the bottom of the female connector 110, which is convenient for positioning the gold fingers of the OSFP gold finger connector 4 and the first group of pins 5 of the female connector 110, which is beneficial to improving the connection reliability of the OSFP gold finger connector 4 and the female connector 110.

[0090] In a further embodiment, the circuit board 220 of the OSFP-XD gold finger connector 1' has a thickness of 1 mm. At present, the thickness of the circuit board of the OSFP gold finger connector 4 in the prior art is 1 mm. Then the thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' is the same as the thickness of the circuit board of the OSFP gold finger connector 4. The height of the opening of the female connector 110 adapted to the OSFP-XD gold finger connector 1' is made to be highly adapted to the thickness of the circuit board of the OSFP gold finger connector 4, so that when the OSFP gold finger connector 4 is inserted into the female connector 110 adapted to the OSFP-XD gold finger connector 1', the connection tightness between the OSFP gold finger connector 4 and the female connector 110 adapted to the OSFP-XD gold finger connector 1' is improved, and the signal transmission rate and quality are improved.

[0091] Specifically, the thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' is 1 mm, which means that the design value of the thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' is 1 mm. In actual products, due to reasons such as the manufacturing process, certain tolerances may occur, making the actual thickness of the circuit board 220 of the OSFP-XD gold finger connector 1' slightly greater than 1 mm, or slightly less than 1 mm.

[0092] Fig.14 FIG. 1 is a schematic diagram of a cross-sectional structure of a circuit board of an OSFP-XD gold finger connector in an embodiment of the present application. Fig.14 As shown, in a specific embodiment, the circuit board 220 includes a conductive layer 113 and a dielectric layer 114, and a dielectric layer 114 is provided between any adjacent conductive layers 113. Specifically, the circuit board 220 includes 12 layers of conductive layers 113. The conductive layers 113 can all be used to prepare the circuits of the circuit board 220. Since the number of the conductive layers 113 of the circuit board 220 is relatively large, the conductive layers 113 used to prepare the circuits have a larger area and more routing space, which can meet the needs of the OSFP-XD gold finger connector 1' to transmit more signals. In addition, the number of circuits prepared by the conductive layers 113 on both sides of the circuit board 220 can be relatively small, so that there is more space on both sides of the circuit board 220 for layout of devices, which is conducive to simplifying the preparation process of the electronic module 200.

[0093] In the embodiment of the present application, the conductive layer 113 and the dielectric layer 114 of the circuit board 220 are both relatively thin. For example, 12 layers of conductive layer 113 can be realized within a thickness range of 1mm under a 100ohm differential impedance. For example, the thickness of the conductive layer 113 can be greater than or equal to 10um, for example, the thickness of the conductive layer can be made to include 10um to 40um. Specifically, the thickness of the conductive layer 113 can include 12um, 15um, 20um, 22um, 25um, 28um, 30um, 32um, 35um, 38um or 42um, etc. The thickness of the dielectric layer 114 can be 20um to 40um. For example, the thickness of the conductive layer can be made to include 10um to 40um. Specifically, the thickness of the dielectric layer 114 can include 12um, 15um, 18um, 20um, 23um, 25um, 27um, 30um, 33um, 35um, 38um or 42um, etc. The dielectric layer 114 of the circuit board 220 includes at least one adjustment dielectric layer 1141, the thickness of which can be adjusted according to the actual preparation process to control the overall thickness of the circuit board 220. For example, the thickness of the adjustment dielectric layer 1141 can be increased, and the thickness of the adjustment dielectric layer 1141 can be 400um. To increase the strength of the circuit board 220. The conductive layer 113 includes a trace, which is used to form the circuit of the circuit board 220. The width of the trace includes 20um to 40um. Specifically, the width of the trace can include 12um, 15um, 17um, 20um, 21um, 25um, 27um, 30um, 32um, 36um, 39um or 45um. The thinner the width of the trace is, the less area occupied by the trace is, and the impedance is controlled.

[0094] In a specific embodiment, a relatively advanced circuit board 220 processing process can be used to prepare the OSFP-XD gold finger connector 1' provided in the present application. For example, mSAP (modified semi-additive process) can be used to optimize the semi-additive process to achieve thinner copper thickness and narrower line width, so that the medium can be made thinner under the same impedance. Therefore, more routing can be achieved by using a thinner board thickness. Fig.15 FIG. 1 is a schematic diagram of a manufacturing process flow of an OSFP-XD gold finger connector in an embodiment of the present application. Fig.15As shown, in one embodiment, a circuit is first etched on the surface of a circuit board with a double-sided conductive layer; a dielectric layer 114 and a conductive layer 113 are added to each of the two sides and pressed together; holes are drilled on both sides; a conductive layer is flash-plated inside and on the surface of the drilled hole, so that the drilled hole is formed into a conductive hole 115; a photosensitive film layer 116 is added to the surface of the conductive layer 113 on both sides and exposed and developed to expose the pattern to be electroplated; electroplating is performed to thicken the conductive layer 113; the remaining photosensitive film layer 116 is removed; micro-etching is then performed to remove the copper layer under the photosensitive film layer 116, and a pattern is formed on the conductive layer 113 on the surface. Repeat the pressing of the dielectric layer 114 and the conductive layer 113 on both sides, as well as the subsequent steps, until a circuit board of the OSFP-XD gold finger connector 1' is formed.

[0095] Based on the same inventive concept, the present application also provides a signal transmission method for the above-mentioned electronic device. Specifically, the pins in the female connector of the electronic device include a first control pin, a second control pin, a point control pin, a fourth control pin, a first power pin and a second power pin, and the above pins are respectively connected to the gold fingers of the gold finger connector. The above-mentioned signal transmission method specifically includes: the first control gold finger and the first control pin transmit a serial data signal; the second control gold finger and the second control pin transmit an interrupt request signal or a reset control signal; the third control gold finger and the third control pin transmit a clock signal; the fourth control gold finger and the fourth control pin transmit a low power control signal or a module in place display signal or a reset control signal; the first power gold finger and the first power pin transmit a power signal; the second power gold finger and the second power pin also transmit a power signal. This signal transmission method can be used to transmit signals of OSFP-XD modules as well as signals of OSFP modules.

[0096] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A circuit board, characterized in that: The gold finger connector is located at the edge of the circuit board, and the gold finger connector includes a plurality of gold fingers; The circuit board comprises a first surface and a second surface which are opposite to each other, and the gold finger connector comprises a first row of gold fingers and a second row of gold fingers arranged on the first surface, and a third row of gold fingers and a fourth row of gold fingers arranged on the second surface; wherein the first row of gold fingers and the second row of gold fingers are arranged along the plugging and unplugging direction of the gold finger connector, and the third row of gold fingers and the fourth row of gold fingers are arranged along the plugging and unplugging direction of the gold finger connector; The first row of gold fingers includes a first control gold finger, a second control gold finger and two first power gold fingers, the first control gold finger is used to transmit a serial data signal, the second control gold finger is used to transmit an interrupt request signal or a reset control signal, and the two first power gold fingers are arranged between the first control gold finger and the second control gold finger; The third row of gold fingers includes a third control gold finger, a fourth control gold finger and two second power gold fingers, the third control gold finger is used to transmit a clock signal, the fourth control gold finger is used to transmit a low power control signal or a module in place display signal or a reset control signal; the two second power gold fingers are arranged between the third control gold finger and the fourth control gold finger; The thickness of the circuit board is 0.9 mm to 1.1 mm.

2. The circuit board according to claim 1, characterized in that The first row of gold fingers includes four pairs of gold fingers for sending data signals and four pairs of gold fingers for receiving data signals, the four pairs of gold fingers for sending data signals of the first row of gold fingers are sequentially arranged on a side of the first control gold finger away from the second control gold finger, and the four pairs of gold fingers for receiving data signals of the first row of gold fingers are sequentially arranged on a side of the second control gold finger away from the first control gold finger; The second row of gold fingers also includes four pairs of gold fingers for sending data signals and four pairs of gold fingers for receiving data signals. The four pairs of gold fingers for sending data signals of the second row of gold fingers are sequentially arranged on a side of the third control gold finger away from the fourth control gold finger, and the four pairs of gold fingers for receiving data signals of the first row of gold fingers are sequentially arranged on a side of the fourth control gold finger away from the third control gold finger.

3. The circuit board according to claim 1 or 2, characterized in that: The first row of gold fingers and the second row of gold fingers are arranged in a direction away from the plugging end of the gold finger connector, and the third row of gold fingers and the fourth row of gold fingers are arranged in a direction away from the plugging end of the gold finger connector.

4. The circuit board according to claim 1 or 2, characterized in that: The first row of gold fingers and the second row of gold fingers are arranged in a direction close to the plug-in end of the gold finger connector, and the third row of gold fingers and the fourth row of gold fingers are arranged in a direction close to the plug-in end of the gold finger connector.

5. The circuit board according to any one of claims 1 to 4, characterized in that: The thickness of the circuit board is 1 mm.

6. The circuit board according to any one of claims 1 to 5, characterized in that: The circuit board includes a conductive layer and a dielectric layer, and the dielectric layer is provided between any adjacent conductive layers; the circuit board includes 12 conductive layers.

7. The circuit board according to claim 6, characterized in that: The thickness of the conductive layer is in the range of 10um to 40um.

8. The circuit board according to claim 6 or 7, characterized in that: The conductive layer includes wiring, the wiring forms the circuit, and the width of the wiring is 20um to 40um.

9. The circuit board according to any one of claims 6 to 8, characterized in that: The thickness of the dielectric layer is 20um to 40um.

10. An electronic module, characterized in that: The invention comprises a housing, an electronic device and a circuit board as claimed in any one of claims 1 to 9, wherein the electronic device is arranged on the circuit board and connected to the circuit of the circuit board, and the circuit board is installed on the housing.

11. An electronic device, characterized in that: It comprises an electronic component and the electronic module as claimed in claim 10, wherein the electronic component comprises a female connector, and the gold finger connector of the electronic module is plugged into the female connector.

12. A signal transmission method for an electronic device, characterized in that: Using the electronic device as claimed in claim 11 to transmit a signal, the female connector includes a first control pin, a second control pin, a point control pin, a fourth control pin, a first power pin and a second power pin, and the method specifically includes: The first control golden finger transmits a serial data signal with the first control pin; The second control golden finger transmits an interrupt request signal or a reset control signal to the second control pin; The third control golden finger transmits a clock signal to the third control pin; The fourth control golden finger transmits a low power consumption control signal or a module presence display signal or a reset control signal to the fourth control pin; The first power gold finger and the first power pin transmit a power signal; The second power gold finger and the second power pin also transmit power signals.

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