Manufacturing method of selective laser etching gold-plated printed board
Through selective laser etching technology and protection of protective film layer, the problem of exposed gold-plated layer during the process of gold-plated printing plate is solved, and high-precision and high-reliability printing plate production is achieved.
Patent Information
- Application Number
- CN202510110911.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2025-05-02
AI Technical Summary
The gold-plated layer is exposed during the processing of the gold-plated printed board, resulting in the scrapping of the product and insufficient processing accuracy and reliability.
By adopting selective laser etching technology, the whole plate is plastered with a resistive film on the surface of the gold-plated layer, the outer shape of the resistive film is processed with laser, the unnecessary gold-plated area is removed, the outer layer is etched, the conductive pattern is produced, and the gold-plated protective film is applied to the surface of the plate, and the appearance is processed to obtain a laser-etched gold-plated printed board.
It effectively avoids exposure of gold-plated layers, improves the accuracy and reliability of printed boards, reduces the scrap rate of products, and improves the quality and consistency of processing.
Smart Images
Figure CN119922831A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of printed circuits and relates to a method for manufacturing a gold-plated printed circuit board by selective laser etching. Background Art
[0002] Gold-plated printed circuit boards are made by plating a layer of gold on specific areas of the circuit pattern on the basis of printed circuit boards (PCBs) through a specific process. This process is designed to improve the conductivity, corrosion resistance and aesthetics of the printed circuit boards, while meeting the material performance requirements of some special application scenarios.
[0003] The production process usually includes: graphic design, substrate preparation, graphic transfer, gold electroplating, etching and film stripping and subsequent processing, etc. The production process is complex and delicate.
[0004] The pattern production of conventional gold-plated printed circuit boards is completed through photochemical action. It is to transfer the circuit pattern on the photographic plate to the set copper foil surface through photochemical action to form a mask image with corrosion resistance or electroplating resistance. It is necessary to carry out wet processes such as film lamination, exposure, and development of the printed circuit board. During the processing, the gold-plated layer is exposed, which is easy to form damage defects during the processing, resulting in the scrapping of the product. Summary of the invention
[0005] The purpose of the present invention is to provide a method for manufacturing a gold-plated printed circuit board by selective laser etching, so as to solve the technical problem of exposure of the gold-plated layer during the processing of the gold-plated printed circuit board. The present invention avoids exposure of the gold-plated layer during the processing of the gold-plated printed circuit board, and the manufactured printed circuit board has high precision and good reliability.
[0006] In order to achieve the above object, the present invention adopts the following technical solutions: The invention discloses a method for manufacturing a selective laser-etched gold-plated printed circuit board, comprising the following steps: Gold-plating the entire plate; Paste a resist film on the surface of the gold-plated layer; Use laser to process the outer shape of the resist film, remove the resist film outside the effective gold-plated area, and remove the gold-plated layer in the substrate area within the board frame; Etch the outer copper layer of the board to make the outer conductive pattern; Remove the resist film on the gold layer surface of the plate; A gold-plated protective film is applied to the surface of the plate; The substrate is processed in shape, the gold-plated protective film is removed, and a laser-etched gold-plated printed circuit board is obtained.
[0007] Furthermore, before the step of performing gold plating on the entire plate, the following steps are also included: Cut the plate according to the set size requirements and drill the cut plate; Remove the oxide layer and foreign matter from the board surface after drilling.
[0008] Furthermore, the cutting of the sheet material according to the set size requirements and the drilling of the cut sheet material are specifically as follows: Cutting of sheets, pads and covers according to set size requirements; The plate is placed between the backing plate and the cover plate for drilling.
[0009] Furthermore, the removal of the oxide layer and foreign matter on the plate surface after drilling is specifically as follows: A sandblasting machine is used to remove the oxide layer and foreign matter on the plate surface after drilling. During the process of removing the oxide layer and foreign matter, the conveying speed of the sandblasting machine is 2000 mm / min ~2500 mm / min, and the sandblasting pressure is 1.0 kg / cm 2 ~2.0 kg / cm 2 , pickling concentration is 2 V / V%~5 V / V%, pickling pressure is 1.5 kg / cm 2 ~2.5 kg / cm 2 , pickling temperature is 15℃~30℃, water washing pressure is 1.5 kg / cm 2 ~2.5 kg / cm 2 , the pressure of pressurized water washing is 2 kg / cm 2 ~3 kg / cm 2 , the drying temperature is 80℃~100℃, and the corundum concentration is 15 V / V%~20 V / V%.
[0010] Furthermore, the entire plate is plated with gold. During the gold plating process, the nickel plating, pre-gold plating and gold plating should all be charged into the tank, and the applied current should be greater than 10 times the minimum scale of the power supply. The minimum plating area is 1.0dm 2 .
[0011] Furthermore, the entire plate is gold plated, and during the gold plating process, the electroplating area on the front and back sides of the plate is the same, and the difference in exposed copper area of plates from different batches is less than or equal to 20% and is clamped in the same rack.
[0012] Furthermore, the adhesive film is attached to the surface of the gold-plated layer, specifically as follows: Cut the adhesive barrier film to the corresponding size of the plate; Stick the adhesive film on the gold-plated layer of the board, and there should be no bubbles between the adhesive film and the board.
[0013] Furthermore, the outer layer of the etching plate is copper-clad to produce an outer conductive pattern, as follows: The outer copper layer of the plate is etched by an etching machine. During the etching process, the plates are spaced 10 cm apart. The copper content of the etching solution is 130 g / L ~180 g / L, the chloride ion content is 170 g / L ~220 g / L, the pH value is 7.8~8.8, the specific gravity is 1.19~1.30, the temperature is 48℃~52℃, and the spray pressure on the etching is 2.0 kg / cm 2 ~3.5 kg / cm 2 , the spray pressure during etching is 2.0 kg / cm 2 ~3.5 kg / cm 2 , ammonia washing pressure is 1.0 kg / cm 2 ~2.0 kg / cm 2 , water washing pressure is 1.0 kg / cm 2 ~2.0 kg / cm 2 .
[0014] Furthermore, after the etching is completed, it is checked whether the etched lines are under-etched. If under-etched, a local etching method is used to perform supplementary etching.
[0015] Furthermore, the gold-plated protective film is attached to the surface of the plate, specifically as follows: Use a film laminating machine to paste a gold-plated protective film on the surface of the board; After the gold-plated protective film is applied, use a blade to cut the gold-plated protective film along the edge of the board to separate the boards.
[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. The present invention ensures the accuracy and quality of subsequent laser etching and conductive pattern production by gold-plating the entire plate. A resist film is attached to the surface of the gold-plated layer. The resist film can accurately control the gold-plated area that needs to be retained and removed to provide accurate positioning for subsequent laser processing. The resist film is processed by laser to remove the resist film outside the effective gold-plated area, and the gold-plated layer in the substrate area within the board frame is removed to prepare for the subsequent outer conductive pattern production. The outer copper coating of the plate is etched to produce the outer conductive pattern to form the required outer conductive pattern. The resist film on the gold layer surface of the plate is removed. After the outer conductive pattern is produced, the resist film on the gold layer surface of the plate needs to be removed so as to carry out subsequent gold-plated protective film mounting and shape processing. A gold-plated protective film is attached to the board surface of the plate. The gold-plated protective film is used to protect the gold-plated layer from damage and contamination during subsequent processing, avoiding the exposure of the gold-plated layer during the processing of the gold-plated printed board, which is beneficial to improving the reliability of the printed board. The substrate is processed to the shape, and the gold-plated protective film is removed to obtain a laser-etched gold-plated printed board. The present invention utilizes the protective effect of the protective film layer and the characteristics of laser selective cutting to protect the gold-plated layer of the printed circuit board during the semi-finished product processing, solves the problem of process damage, and thus produces a printed circuit board with high precision and high reliability.
[0017] 2. The present invention sticks the adhesive film on the gold-plated layer of the plate, and there are no bubbles between the adhesive film and the plate, which helps to ensure the quality of the overall product.
[0018] 3. After etching is completed, the present invention checks whether the etched lines are under-etched. If under-etched, a local etching method is used to perform supplementary etching, which helps to improve the overall quality of the product and increase the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 The figure is a flow chart of the method of the present invention. DETAILED DESCRIPTION
[0020] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.
[0021] It should be noted that the terms "first", "second", etc. in the specification of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0022] The present invention is further described in detail below in conjunction with the accompanying drawings: See also Figure 1 The present invention discloses a method for manufacturing a gold-plated printed circuit board by selective laser etching, comprising the following steps: S1, the whole plate is gold-plated. The gold-plated layer not only has good conductivity, but also improves the corrosion resistance and wear resistance of the plate, ensuring the accuracy and quality of subsequent laser etching and conductive pattern production.
[0023] S2, stick a resist film on the surface of the gold-plated layer. The resist film can accurately control the gold-plated area that needs to be retained and removed. It is used to protect the gold-plated layer in a specific area from being removed by laser etching or chemical etching, and provide accurate positioning for subsequent laser processing.
[0024] S3, use laser to process the outer shape of the resist film, remove the resist film outside the effective gold-plated area, expose the substrate area that needs to be etched, and remove the gold-plated layer in the substrate area within the board frame to prepare for the subsequent outer conductive pattern production.
[0025] S4, etching the outer copper coating of the plate, making an outer conductive pattern, and forming the desired outer conductive pattern. The present invention utilizes the characteristic of laser selective processing to perform laser etching on the surface of the printed circuit board with a protective film layer, remove the protective film layer outside the effective pattern area, and then use the laser beam to form a high temperature area on the surface of the gold layer to cause a chemical reaction on the surface of the gold layer, so that the gold layer in the ablation area melts, vaporizes and oxidizes, thereby achieving the purpose of removing the protective gold layer. Finally, the copper plating on the surface of the substrate is removed by chemical etching to obtain the final printed circuit pattern.
[0026] S5, remove the resist film on the gold layer surface of the board. After the outer conductive pattern is made, the resist film on the gold layer surface of the board needs to be removed for subsequent gold-plated protective film mounting and shape processing. The resist film should be removed thoroughly without damaging the gold-plated layer and conductive pattern.
[0027] S6. A gold-plated protective film is attached to the surface of the board. The gold-plated protective film is used to protect the gold-plated layer from damage and contamination during subsequent processing, avoiding exposure of the gold-plated layer during the processing of the gold-plated printed circuit board, which is beneficial to improving the reliability of the printed circuit board.
[0028] S7, performing shape processing on the substrate, removing the gold-plated protective film, and obtaining a laser-etched gold-plated printed circuit board.
[0029] The present invention realizes strict control over the processes of gold plating, resist film mounting, laser processing, etching, protective film mounting and shape processing of the plate through a series of precise steps. By utilizing the protective effect of the protective film layer and the characteristic of laser selective cutting, the gold-plated layer of the gold-plated printed circuit board is protected during the semi-finished product processing process, and the problem of process damage is solved, thereby producing a printed circuit board with high precision and high reliability.
[0030] Embodiment 1: See also Figure 1 This embodiment discloses a method for manufacturing a gold-plated printed circuit board by selective laser etching, comprising the following steps: S1, cutting the sheet material according to the set size requirements, and drilling the cut sheet material, as follows: Cutting of sheets, pads and covers according to set size requirements; The plate is placed between the backing plate and the cover plate for drilling.
[0031] Remove the oxide layer and foreign matter on the board surface after drilling, as follows: A sandblaster is used to remove the oxide layer and foreign matter on the plate surface after drilling. During the process of removing the oxide layer and foreign matter, the conveying speed of the sandblaster is 2000 mm / min and the sandblasting pressure is 1.0 kg / cm 2 , pickling concentration is 2 V / V%, pickling pressure is 1.5 kg / cm 2 , pickling temperature is 15℃, water washing pressure is 1.5 kg / cm 2 , the pressure of pressurized water washing is 2 kg / cm 2 , the drying temperature is 80℃, and the corundum concentration is 15 V / V%.
[0032] The whole plate is gold plated. During the gold plating process, the nickel plating, pre-gold plating and gold plating should be charged into the tank. The applied current is greater than 10 times the minimum scale of the power supply. The minimum plating area is 1.0dm 2 .
[0033] Preferably, during the gold plating process, the electroplating areas on the front and back sides of the plate are the same, and the difference in exposed copper areas of plates from different batches is less than or equal to 20% and is clamped in the same rack.
[0034] S2, stick a resist film on the gold-plated surface, as follows: Cut the adhesive barrier film to the corresponding size of the plate; Stick the adhesive film on the gold-plated layer of the board, and there should be no bubbles between the adhesive film and the board.
[0035] S3, using laser to process the outer shape of the resist film, removing the resist film outside the effective gold-plated area, and removing the gold-plated layer in the substrate area within the board frame; S4, etching the outer copper layer of the plate to make the outer conductive pattern, as follows: The outer copper layer of the plate was etched by an etching machine. During the etching process, the plates were spaced 10 cm apart. The copper content of the etching solution was 130 g / L, the chloride ion content was 170 g / L, the pH value was 7.8, the specific gravity was 1.19, the temperature was 48°C, and the spray pressure on the etching was 2.0 kg / cm 2 , the spray pressure during etching is 2.0 kg / cm 2 , ammonia washing pressure is 1.0 kg / cm 2 , water washing pressure is 1.0 kg / cm 2 .
[0036] Preferably, after the etching is completed, it is checked whether the etched lines are under-etched. If under-etched, a local etching method is used to perform supplementary etching.
[0037] S5, removing the resist film on the gold layer surface of the plate; S6, affix a gold-plated protective film to the surface of the board, as follows: Use a film laminating machine to paste a gold-plated protective film on the surface of the board; After the gold-plated protective film is applied, use a blade to cut the gold-plated protective film along the edge of the board to separate the boards.
[0038] S7, performing shape processing on the substrate, removing the gold-plated protective film, and obtaining a laser-etched gold-plated printed circuit board.
[0039] Embodiment 2: See also Figure 1 This embodiment discloses a method for manufacturing a gold-plated printed circuit board by selective laser etching, comprising the following steps: S1, cutting the sheet material according to the set size requirements, and drilling the cut sheet material, as follows: Cutting of sheets, pads and covers according to set size requirements; The plate is placed between the backing plate and the cover plate for drilling.
[0040] Remove the oxide layer and foreign matter on the board surface after drilling, as follows: A sandblaster is used to remove the oxide layer and foreign matter on the plate surface after drilling. During the process of removing the oxide layer and foreign matter, the conveying speed of the sandblaster is 2250mm / min and the sandblasting pressure is 1.5 kg / cm 2 , pickling concentration is 3.5V / V%, pickling pressure is 2.0kg / cm 2 , pickling temperature is 22.5℃, water washing pressure is 2.0kg / cm 2 The pressure of pressurized water washing is 1.5kg / cm 2 , the drying temperature is 90℃, and the corundum concentration is 17.5V / V%.
[0041] The whole plate is gold plated. During the gold plating process, the nickel plating, pre-gold plating and gold plating should be charged into the tank. The applied current is greater than 10 times the minimum scale of the power supply. The minimum plating area is 1.0dm 2 .
[0042] Preferably, during the gold plating process, the electroplating areas on the front and back sides of the plate are the same, and the difference in exposed copper areas of plates from different batches is less than or equal to 20% and is clamped in the same rack.
[0043] S2, stick a resist film on the gold-plated surface, as follows: Cut the adhesive barrier film to the corresponding size of the plate; Stick the adhesive film on the gold-plated layer of the board, and there should be no bubbles between the adhesive film and the board.
[0044] S3, using laser to process the outer shape of the resist film, removing the resist film outside the effective gold-plated area, and removing the gold-plated layer in the substrate area within the board frame; S4, etching the outer copper layer of the plate to make the outer conductive pattern, as follows: The outer copper layer of the plate was etched by an etching machine. During the etching process, the plates were spaced 10 cm apart. The copper content of the etching solution was 155 g / L, the chloride ion content was 195 g / L, the pH value was 8.3, the specific gravity was 1.245, the temperature was 50°C, and the spray pressure on the etching was 2.75 kg / cm 2 , the spray pressure during etching is 2.75 kg / cm 2 , ammonia washing pressure is 1.5kg / cm 2 , water washing pressure is 1.5kg / cm 2 .
[0045] Preferably, after the etching is completed, it is checked whether the etched lines are under-etched. If under-etched, a local etching method is used to perform supplementary etching.
[0046] S5, removing the resist film on the gold layer surface of the plate; S6, affix a gold-plated protective film to the surface of the board, as follows: Use a film laminating machine to paste a gold-plated protective film on the surface of the board; After the gold-plated protective film is applied, use a blade to cut the gold-plated protective film along the edge of the board to separate the boards.
[0047] S7, performing shape processing on the substrate, removing the gold-plated protective film, and obtaining a laser-etched gold-plated printed circuit board.
[0048] Embodiment three: See also Figure 1 This embodiment discloses a method for manufacturing a gold-plated printed circuit board by selective laser etching, comprising the following steps: S1, cutting the sheet material according to the set size requirements, and drilling the cut sheet material, as follows: Cutting of sheets, pads and covers according to set size requirements; The plate is placed between the backing plate and the cover plate for drilling.
[0049] Remove the oxide layer and foreign matter on the board surface after drilling, as follows: A sandblaster is used to remove the oxide layer and foreign matter on the plate surface after drilling. During the process of removing the oxide layer and foreign matter, the conveying speed of the sandblaster is 2500 mm / min and the sandblasting pressure is 2.0 kg / cm 2 , pickling concentration is 5 V / V%, pickling pressure is 2.5kg / cm 2 , pickling temperature is 30℃, water washing pressure is 2.5kg / cm 2 The pressure of pressurized water washing is 3kg / cm 2 , the drying temperature is 100℃, and the corundum concentration is 20V / V%.
[0050] The whole plate is gold plated. During the gold plating process, the nickel plating, pre-gold plating and gold plating should be charged into the tank. The applied current is greater than 10 times the minimum scale of the power supply. The minimum plating area is 1.0dm 2 .
[0051] Preferably, during the gold plating process, the electroplating areas on the front and back sides of the plate are the same, and the difference in exposed copper areas of plates from different batches is less than or equal to 20% and is clamped in the same rack.
[0052] S2, stick a resist film on the gold-plated surface, as follows: Cut the adhesive barrier film to the corresponding size of the plate; Stick the adhesive film on the gold-plated layer of the board, and there should be no bubbles between the adhesive film and the board.
[0053] S3, using laser to process the outer shape of the resist film, removing the resist film outside the effective gold-plated area, and removing the gold-plated layer in the substrate area within the board frame; S4, etching the outer copper layer of the plate to make the outer conductive pattern, as follows: The outer copper layer of the plate is etched by an etching machine. During the etching process, the distance between the plates is 10 cm. The copper content of the etching solution is 180 g / L, the chloride ion content is 220 g / L, the pH value is 8.8, the specific gravity is 1.30, the temperature is 52 ° C, and the etching spray pressure is 3.5 kg / cm 2 , the spray pressure during etching is 3.5kg / cm 2 , ammonia washing pressure is 2.0kg / cm 2 , water washing pressure is 2.0kg / cm 2 .
[0054] Preferably, after the etching is completed, it is checked whether the etched lines are under-etched. If under-etched, a local etching method is used to perform supplementary etching.
[0055] S5, removing the resist film on the gold layer surface of the plate; S6, affix a gold-plated protective film to the surface of the board, as follows: Use a film laminating machine to paste a gold-plated protective film on the surface of the board; After the gold-plated protective film is applied, use a blade to cut the gold-plated protective film along the edge of the board to separate the boards.
[0056] S7, performing shape processing on the substrate, removing the gold-plated protective film, and obtaining a laser-etched gold-plated printed circuit board.
[0057] Embodiment 4: The present invention aims at the problem that the surface of the gold layer of the gold-plated printed circuit board is easily scratched and damaged in the subsequent wet and dry processes after gold plating, and provides a new processing method. By utilizing the protective effect of the protective film layer and the characteristic of laser selective cutting, the gold-plated layer of the gold-plated printed circuit board is protected during the semi-finished product processing process, and the problem of process damage is solved. The effect is more obvious for some ultra-thick gold-plated plate products, and the processability and product yield of such products can be effectively improved.
[0058] The present invention introduces a protective peelable PI film, and utilizes the high positioning precision processing characteristics of laser cutting to change the processing flow of existing products. The specific steps are as follows: S1, cutting: Cutting according to the set size requirements, as follows: S11, check the equipment status: check if the shearing machine power supply is normal; S12, selecting plates of corresponding type, specification, thickness and quantity; S13, clean the working surface of the shearing machine to ensure that there is no foreign matter such as glue residue, aluminum wire and wood chips that may scratch the surface of the board; S14, cutting the plate according to the set size requirements; S15, cutting the pad and cover plate according to the set size; S16, placing the cut plates, backing plates and cover plates according to uniform size.
[0059] S2, drilling: processing the inner hole of the plate; S21, check the type, processing quantity, thickness and size of the cut plates, confirm whether there are any abnormal phenomena such as scratches and pits on the plate surface, and identify the requirements related to this process; S22, placing the plate between the backing plate and the cover plate according to the plate stacking requirements of the process, installing two positioning pins at the center of the short side of the plate using a pinning machine, and then fixing the plate, the backing plate and the cover plate on the workbench of the CNC drilling machine; S23, checking the state of the drilling equipment, if the equipment state is normal, importing the corresponding NC drilling file, and drilling the plate according to the requirements of the NC drilling file; S24, after drilling each plate, a hole inspection machine is used to conduct the first piece inspection, including the inspection of hole permeability, hole diameter, hole position and hole number. After passing the inspection, batch processing is carried out; S25, after the drilling process is completed, wait until the protective cover of the CNC drilling machine is fully opened, tear off the tape, open the pneumatic clamping device, and take out the plate.
[0060] S3, sandblasting: remove the oxide layer and foreign matter on the plate surface after drilling; S31, check the status of the sandblasting machine to ensure that it meets the operating requirements; S32, turn on the main power of the sandblasting machine, click the touch panel automatic box, press the green "Start" button, and turn on: Automatic and Start in sequence; S33, parameter confirmation: confirm that the parameters such as conveying speed, pickling pressure, water washing pressure, pressurized water washing pressure, high-pressure water washing pressure, sandblasting pressure display and hot air temperature meet the requirements of the following table, see Table 1; S34, wear anti-static gloves, hold the edge of the board with both hands, use tooling to load the board when necessary, do not touch the effective graphic area when inserting the board, only hold the corners or both sides of the board; S35, after the sandblasting is completed, the panels are placed on the racks one by one.
[0061] Table 1, sandblasting and grinding system parameters:
[0062] S4, Graphic gold plating: The whole plate is gold plated according to the design gold thickness requirements; S41, turn on the main power switch of the gold-plated wire control cabinet and confirm that the water, electricity, gas and solution status of the equipment meet the operating requirements; S42, read the process flow card, plan and other attached pages, check the production data number and the number of incoming boards, and clarify the processing requirements; S43, the plating current is calculated based on the exposed copper area. Electroplating nickel, pre-gold plating and electroplating gold should be charged into the tank. The applied current must be greater than 10 times the minimum scale of the power supply. The minimum plating area is 1.0dm 2 ; S44, fix the front and back sides of the plates alternately on the hanger, so that the electroplating areas on the front and back sides of the plates are equal, and plates from different batches with exposed copper areas that differ by no more than 20% are clamped on the same hanger; S45, starting the corresponding program in the control software to process the product; S46, after the program is finished, the plates are removed and placed on the racks.
[0063] S5, apply resist film: Use resist film to protect the gold-plated layer for the whole board; S51, according to the requirements of the process flow card and planning sheet, cut the adhesive barrier film with the corresponding specifications and sizes of the plate; S52, the cut resist film is stored in an electronic drying cabinet; S53, use a resist film of corresponding size to apply to the entire board on the gold-plated surface. The resist film of the product after applying the film should be flat and free of bubbles.
[0064] S6, laser processing; S61, check the status of the laser equipment to ensure that it meets the operating requirements; S62, according to the laser cutting process technical requirements, retrieve the laser file, use ultraviolet laser to process the appearance of the resist film, and require the laser cutting edge to be neat and without residual glue; S63, remove the resist film outside the effective gold-plating area according to the drawing requirements; S64, according to the laser cutting process technical requirements, retrieve the corresponding laser file, and remove the gold plating layer in the substrate area within the board frame according to the drawing requirements; S65, the processed products are placed on the shelves one by one.
[0065] S7, alkaline etching: etching the outer copper layer of the plate to produce an outer conductive pattern; S71, check the status of the alkaline etching machine and confirm that the water, electricity, gas and solution status of the equipment meet the operating requirements; S72, check the surface condition of the board; S73, adjusting the transmission speed according to the copper thickness of the substrate; S74, put the plate into the plate inlet of the etching machine, with the distance between the plates being 10 cm; S75, use a reading microscope to check whether the etched lines are under-etched and whether the line width meets the requirements.
[0066] Table 2. Alkaline etching process parameters (14ET20DPA02-4):
[0067] S8, remove the resist film: remove the resist film on the surface of the gold layer processed in the process; S81, clean the work surface and remove any excess adhesion; S82, place the plate flat on the table and remove the resist film on the surface of the gold layer; S83, the processed products are placed on the shelves in sequence.
[0068] S9, gold-plated protective film: gold-plated protective film for milling processing; S91, turn on the automatic film laminating machine and confirm that the equipment status meets the operation requirements; S92, placing the plate to be coated with a film into a conveying device to sequentially complete the processing of coating the plate with a gold-plated protective film; S93, when taking out, use a blade to cut the gold-plated protective film along the edge of the board to separate the board, and place it on the shelf.
[0069] S10, milling: read the CNC milling file into the CNC milling machine to perform shape processing on the substrate; S101, clarify product processing requirements and accept products; S102, check the equipment status before starting up and confirm that the water, electricity and gas status of the equipment meet the operating requirements; S103, turn on the CNC milling machine switch and the vacuum cleaner switch in sequence; S104, using a USB flash drive to copy the NC milling file into a dedicated computer, transfer it into the equipment computer and read it out, determine the board loading direction according to the NC milling pattern, and fix the board to be processed on the workbench; S105, opening the milling file, checking the tool type and diameter required for milling, and setting the tool to start milling processing; S106, after the milling process is completed, the milling machine will automatically eject the base plate, clean the dust on the plate surface and in the hole with an air gun, take out the product and place it with paper; S107, removing the surface milling protection film.
[0070] In summary, the beneficial effects of the present invention are: Printed circuit boards provide electrical connections and structural support for various electrical components. The surface gold plating process can effectively resist salt spray corrosion, has excellent conductivity and high-frequency characteristics, and is widely used in the processing of various microwave high-frequency products. Such products have high added value, especially for products with thicker boards. This processing method can effectively avoid the occurrence of gold-plated surface defects, improve the product yield of such products, and lay a technical foundation for the smooth completion of the processing of such products.
[0071] The present invention utilizes the characteristic of laser selective processing to perform laser etching on the surface of a printed circuit board with a protective film layer, remove the protective film layer outside the effective graphic area, and then use the laser beam to form a high-temperature zone on the surface of the gold layer to produce a chemical reaction on the surface of the gold layer, so that the gold layer in the ablation area melts, vaporizes and oxidizes, and the purpose of removing the protective gold layer is achieved. Finally, the copper plating layer on the surface of the substrate is removed by chemical etching to obtain the final printed circuit pattern. The surface of the gold-plated layer circuit pattern is always protected by the protective film layer during the process processing, avoiding the damage of the wet and dry processes in the processing process to the gold-plated layer on the graphic surface, and utilizing the processing characteristics of laser high positioning accuracy, the processing pattern has high accuracy. This processing method does not limit the processing thickness of the printed circuit board, especially for some ultra-thick boards, the protective effect of the gold-plated layer during the process processing is more obvious, the processed product has high graphic accuracy, good product consistency and high yield rate, and the laser processing speed is fast and the process is simple. At present, this type of gold-plated printed circuit board products have been mass-produced and the technology is mature.
[0072] The above contents are only for explaining the technical idea of the present invention and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the present invention.
Claims
1. A method for manufacturing a gold-plated printed circuit board by selective laser etching, characterized in that: The following steps are involved: Gold-plating the entire plate; Paste a resist film on the surface of the gold-plated layer; Use laser to process the outer shape of the resist film, remove the resist film outside the effective gold-plated area, and remove the gold-plated layer in the substrate area within the board frame; Etch the outer copper layer of the board to make the outer conductive pattern; Remove the resist film on the gold layer surface of the plate; A gold-plated protective film is applied to the surface of the plate; The substrate is processed in shape, the gold-plated protective film is removed, and a laser-etched gold-plated printed circuit board is obtained.
2. The method for manufacturing a selective laser etched gold-plated printed circuit board according to claim 1, characterized in that: Before the step of performing gold plating on the entire plate, the following steps are also included: Cut the plate according to the set size requirements and drill the cut plate; Remove the oxide layer and foreign matter from the board surface after drilling.
3. The method for manufacturing a selective laser etched gold-plated printed circuit board according to claim 2, characterized in that: The sheet is cut according to the set size requirements, and the cut sheet is drilled, as follows: Cutting of sheets, pads and covers according to set size requirements; The plate is placed between the backing plate and the cover plate for drilling.
4. The method for manufacturing a selective laser etched gold-plated printed circuit board according to claim 2, characterized in that: The removal of the oxide layer and foreign matter on the plate surface after drilling is specifically as follows: A sandblasting machine is used to remove the oxide layer and foreign matter on the plate surface after drilling. During the process of removing the oxide layer and foreign matter, the conveying speed of the sandblasting machine is 2000 mm / min ~2500 mm / min, and the sandblasting pressure is 1.0 kg / cm 2 ~2.0 kg / cm 2 , pickling concentration is 2 V / V%~5 V / V%, pickling pressure is 1.5 kg / cm 2 ~2.5 kg / cm 2 , pickling temperature is 15℃~30℃, water washing pressure is 1.5 kg / cm 2 ~2.5 kg / cm 2 The pressure of pressurized water washing is 2 kg / cm 2 ~3 kg / cm 2 , the drying temperature is 80℃~100℃, and the corundum concentration is 15 V / V%~20 V / V%.
5. The method for manufacturing a selective laser etched gold-plated printed circuit board according to claim 1, characterized in that: The whole plate is gold plated. During the gold plating process, the nickel electroplating, pre-gold plating and gold electroplating should be charged into the tank, and the applied current should be greater than 10 times the minimum scale of the power supply. The minimum plating area is 1.0dm 2 .
6. The method for manufacturing a selective laser etched gold-plated printed circuit board according to claim 1, characterized in that: The entire plate is gold plated. During the gold plating process, the electroplating areas on the front and back sides of the plate are the same, and the exposed copper areas of plates from different batches with a difference of less than or equal to 20% are clamped in the same rack.
7. The method for manufacturing a selective laser etched gold-plated printed circuit board according to claim 1, characterized in that: The method of attaching a resist film on the surface of the gold-plated layer is as follows: Cut the adhesive barrier film to the size corresponding to the plate; Stick the adhesive film on the gold-plated layer of the board, and there should be no bubbles between the adhesive film and the board.
8. The method for manufacturing a selective laser etched gold-plated printed circuit board according to claim 1, characterized in that: The outer layer of the etching plate is copper-clad to produce an outer conductive pattern, which is specifically as follows: The outer copper layer of the plate is etched by an etching machine. During the etching process, the plates are spaced 10 cm apart. The copper content of the etching solution is 130 g / L ~180 g / L, the chloride ion content is 170 g / L ~220 g / L, the pH value is 7.8~8.8, the specific gravity is 1.19~1.30, the temperature is 48℃~52℃, and the spray pressure on the etching is 2.0 kg / cm 2 ~3.5 kg / cm 2 , the spray pressure during etching is 2.0kg / cm 2 ~3.5 kg / cm 2 , ammonia washing pressure is 1.0 kg / cm 2 ~2.0 kg / cm 2 , water washing pressure is 1.0 kg / cm 2 ~2.0 kg / cm 2 .
9. The method for manufacturing a selective laser etched gold-plated printed circuit board according to claim 1, characterized in that: After the etching is completed, check whether the etched lines are under-etched. If they are under-etched, use a local etching method to perform supplementary etching.
10. The method for manufacturing a selective laser etched gold-plated printed circuit board according to claim 1, characterized in that: The gold-plated protective film is attached to the surface of the plate, specifically as follows: Use a film laminating machine to paste a gold-plated protective film on the surface of the board; After the gold-plated protective film is applied, use a blade to cut the gold-plated protective film along the edge of the board to separate the boards.