Manufacturing method of display panel, display panel and electronic equipment

Abstract

A display panel manufacturing method, a display panel and an electronic device, the display panel manufacturing method comprises: sequentially forming a pixel definition layer and an isolation layer on a driving backboard along a first direction, the pixel definition layer comprising a plurality of pixel definition structures arranged at intervals along a second direction, the isolation layer comprising a plurality of isolation columns, the isolation columns being in one-to-one correspondence with the plurality of pixel definition structures, the isolation columns being in one-to-one correspondence with the plurality of pixel definition structures, and the isolation columns being in one-to-one correspondence with the plurality of pixel definition structures; the isolation column comprises a first surface and a second surface which are oppositely arranged in the first direction, the first surface faces the pixel definition structure, and in the orthographic projection of the first direction, the second surface is located in the first surface; a first light-emitting structure is formed, the first light-emitting structure comprises a first light-emitting part and a first residual part which are spaced, the first light-emitting part is formed on the driving backboard and located between every two adjacent pixel definition structures, and the first residual part is formed on the second surface; and separating the isolation layer from the pixel definition layer. According to the preparation method of the display panel, the display effect of the display panel can be improved, and the manufacturing difficulty is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of display panels, and in particular to a method for manufacturing a display panel, a display panel and an electronic device. Background Art

[0002] With the development of optoelectronic display technology and semiconductor manufacturing technology, OLED (Organic Light-Emitting Diode) display technology has been mass-produced. With its advantages of high color gamut, high contrast, and wide viewing angle, OLED display technology has become more and more popular in the market, especially flexible OLED products, which are being used more and more frequently.

[0003] During the production process of OLED products, light-emitting materials can be evaporated through a fine metal mask (FMM) to form a light-emitting structure. However, the precision of evaporation is limited, and in order to ensure the aperture ratio of the pixel, the opening size of the mask is generally larger than the size of the formed light-emitting structure. During evaporation, the light-emitting material is easily offset, causing adjacent light-emitting materials to contact, resulting in cross-color and other problems, affecting the display effect of the display panel. Summary of the invention

[0004] An object of the present invention is to provide a method for manufacturing a display panel, a display panel and an electronic device, so as to improve the display effect of the display panel.

[0005] To achieve the purpose of the present invention, the present invention provides the following technical solutions: In a first aspect, the present invention provides a method for manufacturing a display panel, comprising: A pixel definition layer and an isolation layer are sequentially formed on the driving backplane along a first direction; the pixel definition layer includes a plurality of pixel definition structures spaced apart along a second direction, and the isolation layer includes a plurality of isolation columns; the plurality of isolation columns correspond one to one to the plurality of pixel definition structures; the isolation columns include a first surface and a second surface disposed opposite to each other in the first direction, the first surface faces the pixel definition structure, the first surface is located within the second surface in an orthographic projection of the first direction, and the second direction intersects with the first direction; forming a first light-emitting structure, wherein the first light-emitting structure comprises a first light-emitting portion and a first residual portion which are spaced apart from each other, wherein the first light-emitting portion is formed on the driving backplane and is located between two adjacent pixel definition structures, and the first residual portion is formed on the second surface; The isolation layer is separated from the pixel definition layer.

[0006] In one embodiment, it further includes: A second light-emitting structure is formed, wherein the second light-emitting structure includes a second light-emitting portion and a second residual portion spaced apart from each other, wherein the second light-emitting portion is formed on the driving backplane and is located between two adjacent pixel definition structures, and the first light-emitting portion and the second light-emitting portion are respectively formed on opposite sides of the same pixel definition structure, and the second residual portion is formed on the second surface.

[0007] In one embodiment, the pixel definition structure includes a third surface facing away from the driving backplane, and in the second direction, the size of the second surface is L1, and the size of the third surface is L2, satisfying: 0.8≤L1 / L2≤1.2.

[0008] In one embodiment, a pixel definition layer and an isolation layer are sequentially formed on a driving backplane along a first direction, and further comprising: forming a sacrificial layer on the pixel definition layer, wherein the sacrificial layer comprises a plurality of sacrificial portions, and the plurality of sacrificial portions correspond one-to-one to the plurality of pixel definition structures; The isolation column is formed on a surface of the sacrificial portion facing away from the pixel definition structure, and the sacrificial portion is used for decomposition to separate the isolation layer from the pixel definition layer.

[0009] In one embodiment, a pixel definition layer and an isolation layer are sequentially formed on a driving backplane along a first direction, and further comprising: forming a light shielding layer on the pixel definition layer, wherein the light shielding layer comprises a plurality of light shielding portions, and the plurality of light shielding portions correspond one-to-one to the plurality of pixel definition structures; The isolation column is formed on a surface of the light shielding portion facing away from the pixel definition structure.

[0010] In one embodiment, the isolation layer is separated from the pixel definition layer, further comprising: Provide transfer plates; Bring the transfer plate and the isolation layer relatively close to each other to connect the isolation layer and the transfer plate; The transfer plate is relatively far away from the pixel definition layer, so that the isolation layer is separated from the pixel definition layer by the transfer plate.

[0011] In one embodiment, the method further comprises repeating the following steps at least once: Providing the N+1th driving backplane, and forming the N+1th pixel definition layer on the N+1th driving backplane; The transfer plate is relatively close to the N+1th driving backplane to connect the isolation layer separated from the Nth pixel definition layer to the N+1th pixel definition layer; Separating the transfer plate from the isolation layer to form the N+1th isolation layer on the N+1th pixel definition layer; forming the N+1th first light-emitting structure; Separating the N+1th isolation layer from the N+1th pixel definition layer; Wherein, N is a positive integer.

[0012] In a second aspect, the present invention further provides a display panel, which is manufactured using the method for manufacturing a display panel as described in any one of the various embodiments of the first aspect, and includes a driving backplane, a pixel definition layer and a first light-emitting portion, wherein the pixel definition layer is arranged on the driving backplane along a first direction, and the pixel definition layer includes a plurality of pixel definition structures arranged at intervals along a second direction, and the second direction intersects with the first direction; the first light-emitting portion is arranged on the driving backplane and is located between two adjacent pixel definition structures.

[0013] In one embodiment, the display panel further includes a shading layer, the shading layer includes a plurality of shading portions, the plurality of shading portions correspond one-to-one to the plurality of pixel definition structures, and the shading portions are arranged on a surface of the pixel definition structure facing away from the driving backplane.

[0014] In a third aspect, the present invention further provides an electronic device comprising a housing and a display panel manufactured by the method for manufacturing a display panel as described in any one of the various embodiments of the first aspect or a display panel as described in any one of the various embodiments of the second aspect, wherein the display panel is accommodated in the housing.

[0015] By forming an isolation layer on the pixel definition layer, the first light-emitting portion is formed on the driving backplane, and the first residual portion is formed on the isolation layer, it is possible to avoid the first residual portion being formed on the pixel definition layer and contacting the adjacent light-emitting structure, and there will be no cross-color between adjacent light-emitting structures, which can improve the display effect of the display panel. In addition, after the first light-emitting portion is formed, the isolation layer is separated from the pixel definition layer to simplify the structure, which can reduce the difficulty of the subsequent manufacturing process of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 is a flow chart of a method for manufacturing a display panel according to an embodiment; Figure 2is a structural diagram of steps S10 to S50 in a method for manufacturing a display panel according to an embodiment; Figure 3 is a structural diagram of some steps in a method for manufacturing a display panel according to an embodiment; Figure 4 is a flow chart of step S10 in a method for manufacturing a display panel according to another embodiment; Figure 5 is a structural diagram of step S10 in a method for manufacturing a display panel according to another embodiment; Figure 6 is a flow chart of step S40 in a method for manufacturing a display panel according to an embodiment; Figure 7 is a structural diagram of step S40 in a method for manufacturing a display panel according to an embodiment; Figure 8 is a flow chart of a method for manufacturing a display panel according to another embodiment; Fig. 9 is a structural diagram of steps C1 to C5 in a method for manufacturing a display panel according to an embodiment; Fig.10 is a schematic structural diagram of a display panel according to an embodiment; Fig.11 The present invention is a schematic structural diagram of an electronic device according to an embodiment.

[0018] Description of reference numerals: 1000-Electronic equipment; 100-display panel, 10-driving backplane, 20-pixel definition layer, 21-pixel definition structure, 22-third surface, 31-first light-emitting portion, 32-first residual portion, 41-second light-emitting portion, 42-second residual portion, 50-light shielding layer, 51-light shielding portion, 60-functional layer; 200 - isolation layer, 210 - isolation column, 211 - first surface, 212 - second surface, 213 - first side surface; 300-sacrificial layer, 310-sacrificial part; 400-transfer plate, 410-transfer substrate, 420-adhesive layer; 500-housing; X-first direction, Y-second direction, Z-third direction, α-first angle, L1-dimension of the second surface in the second direction, L2-dimension of the third surface in the second direction. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there can be a central component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there can be a central component at the same time.

[0021] Unless otherwise defined, all technical and scientific terms used in the present invention have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in the present invention includes any and all combinations of one or more of the related listed items.

[0022] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0023] First, define the directions, as shown in the figure, X is the first direction, Y is the second direction, and Z is the third direction, and the first direction X, the second direction Y, and the third direction Z intersect each other. Optionally, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

[0024] Please refer to Figure 1 and Figure 2 , an embodiment of the present invention provides a method for manufacturing a display panel 100, comprising: Step S10 , forming a pixel definition layer 20 and an isolation layer 200 in sequence along a first direction X on the driving backplane 10 .

[0025] The pixel definition layer 20 includes a plurality of pixel definition structures 21 spaced apart along the second direction Y, and the isolation layer 200 includes a plurality of isolation columns 210 . The plurality of isolation columns 210 correspond one-to-one to the plurality of pixel definition structures 21 .

[0026] The driving backplane 10 may be any feasible driving backplane 10 in the art, such as LTPS (Low-Temperature Polycrystalline Silicon), IGZO (Indium Gallium Zinc Oxide), etc. Optionally, a pixel definition layer 20 is formed on the topmost layer of the driving backplane 10, and a driving backplane 10 with a film layer of the pixel definition layer 20 may also be used, without limitation.

[0027] The pixel definition layer 20 (PDL) is a microstructure formed by a photolithography process, usually composed of insulating materials (such as photoresist, polyimide). It can form physical isolation on the driving backplane 10 to define the boundaries of each pixel or sub-pixel, and can also serve as a template for subsequent material (such as OLED light-emitting layer, electrode) evaporation or printing. The pixel definition layer 20 can prevent optical or electrical crosstalk between adjacent pixels and improve display contrast and color purity.

[0028] Optionally, the pixel definition layer 20 further includes a plurality of pixel definition structures 21 spaced apart in the third direction Z, that is, the plurality of pixel definition structures 21 are arranged in an array with multiple rows and columns. Optionally, two adjacent pixel definition structures 21 in the second direction Y are connected to the two ends of the same pixel definition structure 21 at the two ends on the same side in the third direction Z, and are connected to the two ends of another pixel definition structure 21 at the two ends on the other side, that is, the four pixel definition structures 21 are roughly in the shape of a "mouth", and enclose the boundary of a single pixel.

[0029] Optionally, the shape of the pixel definition structure 21 can be block-shaped, column-shaped, etc., without limitation. Optionally, the size and shape of the plurality of pixel definition structures 21 are substantially the same, which is convenient for subsequent process manufacturing.

[0030] The isolation layer 200 is used to prevent the material from being deposited on the non-target area, thereby improving the clarity of the pixel edge. Optionally, the number and formation position of the isolation column 210 correspond to the pixel definition structure 21. Optionally, the isolation column 210 can be made by a method of making a suspension structure or a similar suspension structure in the art. When the first light-emitting structure is subsequently formed, the isolation column 210 can prevent the organic light-emitting material from being deposited on the pixel definition structure 21, and can also reduce light leakage between pixels. The material of the isolation column 210 can be transparent SiN x (Silicon Nitride), SiO x (silicon oxide), etc., without limitation.

[0031] Optionally, the connection between the isolation column 210 and the pixel definition structure 21 may be bonding, clamping, etc., without limitation.

[0032] The isolation column 210 includes a first surface 211 and a second surface 212 which are arranged opposite to each other in the first direction X. The first surface 211 faces the pixel definition structure 21 . In the orthographic projection of the first direction X, the first surface 211 is located inside the second surface 212 .

[0033] Optionally, the shapes of the first surface 211 and the second surface 212 may be square, rectangular, trapezoid, regular polygon, irregular shape, etc. The shapes of the first surface 211 and the second surface 212 may be the same or different, without limitation. In the orthographic projection of the first direction X, the area of ​​the first surface 211 may be less than or equal to the area of ​​the second surface 212. Such a configuration can prevent the evaporated material from climbing onto the isolation column 210, resulting in the subsequent inability to separate the isolation column 210 from the pixel definition structure 21. In a specific embodiment, as shown in the figure, in the orthographic projection of the third direction Z, the shape of the isolation column 210 is an inverted trapezoid, the first surface 211 forms the upper base of the trapezoid, and the second surface 212 forms the lower base of the trapezoid.

[0034] Optional, such as Figure 1 As shown, the isolation column 210 also includes a first side surface 213 connecting the first surface 211 and the second surface 212, and the first angle α between the first side surface and the second surface 212 is less than or equal to 90°. Similarly, the isolation column 210 also includes a second side surface (not shown in the figure), the first side surface 213 and the second side surface are opposite to each other in the second direction Y, and the second angle between the second side surface and the second surface 212 is less than or equal to 90°. The angles of the first angle α and the second angle can be the same or different, without limitation.

[0035] Step S20: forming a first light emitting structure.

[0036] Please refer to Figure 2 The first light-emitting structure includes a first light-emitting portion 31 and a first residual portion 32 which are spaced apart. The first light-emitting portion 31 is formed on the driving backplane 10 and is located between two adjacent pixel definition structures 21 . The first residual portion 32 is formed on the second surface 212 .

[0037] Optionally, the first light-emitting structure can be formed on the driving backplane 10 and the isolation layer 200 by evaporating an organic light-emitting material. Since the spacing between the pixel definition structures 21 is small, the light-emitting material cannot be accurately formed between two adjacent pixel definition structures 21 during evaporation, and a portion of the light-emitting material may fall on the second surface 212 of the pixel definition structure 21, thereby forming a first residual portion 32. The first light-emitting portion 31 is formed on the driving backplane 10 and fills the gap between two adjacent pixel definition structures 21 to ensure the aperture ratio of the pixel. Optionally, the first light-emitting portion 31 can also be formed on the sides of two adjacent pixel definition structures 21 facing each other, without limitation.

[0038] Optionally, when the luminescent material precisely falls between two adjacent pixel definition structures 21, a first luminescent portion 31 is formed between the two adjacent pixel definition structures 21, and no first residual portion 32 may be formed at this time; when part of the luminescent material falls on one of the two adjacent pixel definition structures 21, a first residual portion 32 is formed on the pixel definition structure 21, and no first residual portion 32 is formed on the other pixel definition structure 21; when the second surfaces 212 of two adjacent pixel definition structures 21 are both covered with luminescent material, first residual portions 32 are formed on the second surfaces 212 of the two adjacent pixel definition structures 21.

[0039] Optionally, in the first direction X, the size (ie, thickness) of the first light emitting portion 31 and the size of the first residual portion 32 may be substantially the same.

[0040] Such a configuration can avoid forming the first residual portion 32 on the pixel definition structure 21 , and avoid contact between adjacent light-emitting structures, which would affect the display effect of the display panel 100 .

[0041] Step S40 , separating the isolation layer 200 from the pixel definition layer 20 .

[0042] If the isolation column 210 is retained, in the subsequent manufacturing process of the display panel 100, the cathode will be broken at the position of the isolation column 210, and the cathode cannot be covered by the whole surface evaporation method. The cathode needs to be prepared by a special method, which is troublesome to manufacture; it is also easy to affect the subsequent packaging process, causing the packaging effect to decrease or fail, resulting in a shorter life of the display panel 100 or water vapor intrusion. Therefore, after the first light-emitting portion 31 is formed, the isolation column 210 is removed from the pixel definition structure 21, which is convenient for subsequent process preparation, and at the same time, the impact on the packaging process of the display panel 100 can be reduced to prevent water vapor from intruding into the display panel 100.

[0043] Optionally, when the isolation column 210 is separated from the pixel definition structure 21, since the first residual portion 32 is attached to the first surface 211 of the isolation column 210, the first residual portion 32 will also be separated from the pixel definition structure 21 together with the isolation column 210, thereby avoiding the pixel's light-emitting position error caused by the first residual portion 32 and affecting the display effect of the display panel 100.

[0044] Optionally, the method for manufacturing the display panel 100 further includes: Step S50 , forming a functional layer 60 on the pixel definition layer 20 and the first light emitting portion 31 .

[0045] With the development of optoelectronic display technology and semiconductor manufacturing technology, OLED display technology has been put into mass production. With its advantages such as high color gamut, high contrast and wide viewing angle, OLED display technology has become more and more popular in the market, especially flexible OLED products, which are being used more and more frequently.

[0046] During the production process of OLED products, it is necessary to form a light-emitting pattern by evaporating light-emitting materials, such as evaporating light-emitting materials through a fine metal mask. However, the precision of evaporation is limited. When the spacing between adjacent pixels in the display panel 100 is very close, the light-emitting material is easily offset during evaporation, causing adjacent light-emitting materials to contact, resulting in problems such as cross-color, affecting the display effect of the display panel 100. In one embodiment, an isolation column 210 can be formed before evaporation of the light-emitting material to limit the formation position of the light-emitting structure. However, after preparing this structure, the cathode cannot be covered by evaporation of the entire surface, because a break will occur at the overhanging structure, so that the cathode signal cannot be transmitted normally, and a special method needs to be used to prepare the cathode; at the same time, it is also easy to affect the subsequent packaging process, causing the packaging effect to decrease or fail, resulting in a shorter life of the display panel 100 or water vapor intrusion.

[0047] The manufacturing method of the display panel 100 in the embodiment of the present invention forms an isolation layer 200 on the pixel definition layer 20, the first light-emitting portion 31 is formed on the driving backplane 10, and the first residual portion 32 is formed on the isolation layer 200. This can avoid the first residual portion 32 being formed on the pixel definition layer 20 and contacting the adjacent light-emitting structure, and there will be no cross-color between adjacent light-emitting structures, which can improve the display effect of the display panel 100. In addition, after the first light-emitting portion 31 is formed, the isolation layer 200 is separated from the pixel definition layer 20 to simplify the structure, which can reduce the difficulty of the subsequent manufacturing process of the display panel 100.

[0048] In one embodiment, please refer to Figure 1 and Figure 2 , the manufacturing method of the display panel 100 further includes: Step S30: forming a second light emitting structure.

[0049] Please refer to Figure 2 The second light-emitting structure includes a second light-emitting portion 41 and a second residual portion 42 spaced apart. The second light-emitting portion 41 is formed on the driving backplane 10 and is located between two adjacent pixel definition structures 21. The first light-emitting portion 31 and the second light-emitting portion 41 are respectively formed on opposite sides of the same pixel definition structure 21, and the second residual portion 42 is formed on the second surface 212.

[0050] Similar to the first light-emitting structure, the second light-emitting structure can be formed on the driving backplane 10 and the isolation layer 200 by evaporating an organic light-emitting material. Optionally, the light-emitting material used to form the second light-emitting structure falls on the second surface 212 of the pixel definition structure 21, thereby forming a second residual portion 42; the light-emitting material used to form the second light-emitting structure falls between two adjacent pixel definition structures 21, thereby forming a second light-emitting portion 41. The second light-emitting portion 41 is formed on the driving backplane 10 and fills the gap between two adjacent pixel definition structures 21 to ensure the aperture ratio of the pixel. Optionally, the second light-emitting portion 41 can also be formed on the sides of two adjacent pixel definition structures 21 facing each other, without limitation.

[0051] Optionally, when the luminescent material precisely falls between two adjacent pixel definition structures 21, a second luminescent portion 41 is formed between the two adjacent pixel definition structures 21, and no second residual portion 42 may be formed at this time; when part of the luminescent material falls on one of the two adjacent pixel definition structures 21, a second residual portion 42 is formed on the pixel definition structure 21, and no second residual portion 42 is formed on the other pixel definition structure 21; when the second surfaces 212 of two adjacent pixel definition structures 21 are both covered with luminescent material, second residual portions 42 are formed on the second surfaces 212 of the two adjacent pixel definition structures 21.

[0052] Optionally, the color of the light-emitting material forming the second light-emitting structure may be the same as or different from the color of the light-emitting material forming the first light-emitting structure, without limitation. In a specific embodiment, the color of the first light-emitting structure is different from the color of the second light-emitting structure, and the first light-emitting portion 31 and the second light-emitting portion 41 are respectively provided on opposite sides of the same pixel definition structure 21 to produce a rich display effect. At this time, the isolation column 210 can avoid the first light-emitting portion 31 and the second light-emitting portion 41 from being connected to each other and causing problems such as color deviation.

[0053] For the three pixel definition structures 21 arranged sequentially in the second direction Y, as shown in FIG. Figure 1 As shown, a first light-emitting portion 31 is formed between the first two pixel definition structures 21 from left to right, and a first residual portion 32 is formed on the second surfaces 212 of the two pixel definition structures 21. A second light-emitting portion 41 is formed between the second and third pixel definition structures 21 from left to right, and a second residual portion 42 is formed on the second surfaces 212 of the second and third pixel definition structures 21. That is, the first light-emitting portion 31 is formed on one side of the second pixel definition structure 21 in the second direction Y, and the second light-emitting portion 41 is formed on the other side, and the first residual portion 32 and the second residual portion 42 are formed on the second surface 212 of the pixel definition structure 21.

[0054] Optionally, the manufacturing method of the display panel 100 further includes: forming a third light emitting structure, the third light emitting structure is formed in a similar manner to the second light emitting structure, and the first light emitting structure, the second light emitting structure, and the third light emitting structure are alternately arranged in sequence in the second direction Y. The display panel 100 may also form a fourth light emitting structure, a fifth light emitting structure, ..., without limitation.

[0055] Optionally, step S20 and step S30 may be executed simultaneously, or step S20 may be executed first and then step S30, or step S30 may be executed first and then step S20, without limitation.

[0056] By forming the first light-emitting portion 31 and the second light-emitting portion 41 on opposite sides of the same pixel definition structure 21, while producing a rich display effect, the isolation column 210 can avoid the first light-emitting portion 31 and the second light-emitting portion 41 from contacting each other to cause problems such as color deviation, thereby improving the display effect of the display panel 100.

[0057] In one embodiment, please refer to Figure 2 , the pixel definition structure 21 includes a third surface 22 facing away from the driving backplane 10. In the second direction Y, the size of the second surface 212 is L1, and the size of the third surface 22 is L2, which satisfies: 0.8≤L1 / L2≤1.2. By setting the size of the second surface 212 and the size of the third surface 22 to meet the above range, the pixel aperture ratio can be guaranteed, and at the same time, the excessive displacement of the first light-emitting portion 31 can be avoided, so as to ensure the display effect of the display panel 100. When the value of L1 / L2 is too large, the size of the second surface 212 is too large, which may block the formation area of ​​the first light-emitting portion 31, resulting in a reduction in the area of ​​the formed first light-emitting portion 31, affecting the pixel aperture ratio, and further affecting the display effect of the display panel 100; when the value of L1 / L2 is too small, the isolation column 210 cannot effectively block the third surface 22 of the pixel definition structure 21, which may cause more light-emitting materials to fall on the third surface 22, thereby causing the formation position of the first light-emitting portion 31 to be offset, which also affects the display effect of the display panel 100. Optionally, the ratio of L1 / L2 can be 0.8, 0.85, 0.9, 0.95, 1, 1.05, 1.1, 1.15, or 1.2.

[0058] In a specific embodiment, Figure 2As shown, in the orthographic projection of the third direction Z, the shape of the pixel definition structure 21 is roughly a regular trapezoid, the third surface 22 is the upper base of the trapezoid, the pixel definition structure 21 also includes a bottom surface opposite to the third surface 22 in the first direction X, the bottom surface faces the driving backplane 10, the bottom surface is the lower base of the trapezoid, and the edge of the second surface 212 in the second direction Y falls on the waist of the trapezoid. That is, in the second direction Y, the size L1 of the second surface 212 is larger than the size L2 of the third surface 22, and smaller than the size of the bottom surface. In this way, it is possible to avoid the light-emitting structure being formed on the third surface 22 of the pixel definition structure 21, affecting the display effect, and at the same time, the size of the second surface 212 is not too large to block the formation area of ​​the first light-emitting portion 31, affecting the aperture ratio of the pixel.

[0059] In one embodiment, Figure 3 As shown, a pixel definition layer 20 and an isolation layer 200 are sequentially formed on the driving backplane 10 along a first direction X, and further includes: A sacrificial layer 300 is formed on the pixel definition layer 20, and the sacrificial layer 300 includes a plurality of sacrificial portions 310, and the plurality of sacrificial portions 310 correspond to the plurality of pixel definition structures 21. Isolation columns 210 are formed on the surface of the sacrificial portions 310 facing away from the pixel definition structure 21, and the sacrificial portions 310 are used for decomposition to separate the isolation columns 210 from the pixel definition structure 21.

[0060] The sacrificial layer 300 can be made of materials that can be decomposed under external conditions or can be decomposed by itself, such as GaN (gallium nitride), photolytic glue and other materials that can be decomposed by laser, or pyrolytic glue, pyrolytic plastic and other materials that are easily decomposed by heat, or materials that are easily decomposed by chemical reagents, etc., without limitation.

[0061] After forming the first light-emitting structure, the display panel 100 can be turned over so that the isolation column 210 faces downward in the direction of gravity (the first direction X can be the direction of gravity), and the sacrificial layer 300 is decomposed by pyrolysis, photolysis, etc., and N2 or other gas is used to blow, so that the isolation column 210 is separated from the pixel definition structure 21 under gravity and gas blowing. At this time, Figure 3 As shown, the isolation layer 200 is removed from the display panel 100 , and there is no contact between adjacent light-emitting parts. The subsequent preparation of the cathode layer, encapsulation layer and other functional layers 60 can be made in a conventional manner and will not be affected by the shape of the isolation layer 200 .

[0062] By forming a sacrificial layer 300 on the pixel definition layer 20, the sacrificial layer 300 includes a plurality of sacrificial parts 310, and forming an isolation column 210 on the surface of the sacrificial part 310 facing away from the pixel definition structure 21, after the light-emitting structure is formed, the sacrificial part 310 is decomposed to separate the isolation column 210 from the pixel definition structure 21. The operation is simple, and the subsequent manufacturing process can be simplified, while improving the packaging effect of the display panel 100.

[0063] In one embodiment, a pixel definition layer 20 and an isolation layer 200 are sequentially formed on the driving backplane 10 along a first direction X, and further includes: A light shielding layer 50 is formed on the pixel definition layer 20 , and the light shielding layer 50 includes a plurality of light shielding portions 51 , and the plurality of light shielding portions 51 correspond one-to-one to the plurality of pixel definition structures 21 ; isolation columns 210 are formed on the surfaces of the light shielding portions 51 facing away from the pixel definition structures 21 .

[0064] The light shielding layer 50 can be made of light absorbing, heat absorbing or heat insulating materials, such as metal chromium, acrylic material containing carbon powder, etc., without limitation. This arrangement can prevent the pixel definition structure 21 and other lower film layers from being damaged when the isolation column 210 and the pixel definition structure 21 are separated.

[0065] Optionally, when the driving backplane 10 sequentially forms the pixel definition layer 20 and the isolation layer 200 along the first direction X, the light-shielding layer 50 and the sacrificial layer 300 may be sequentially formed on the pixel definition layer 20 first, and then the isolation layer 200 may be formed, and the isolation layer 200 may be separated from the sacrificial layer 300 after the light-emitting structure is formed; alternatively, the light-shielding layer 50 may be formed on the pixel definition layer 20, and then the isolation layer 200 may be formed on the light-shielding layer 50, and the isolation layer 200 may be separated from the light-shielding layer 50 after the light-emitting structure is formed; alternatively, the sacrificial layer 300 may be directly formed on the pixel definition layer 20, and the isolation layer 200 may be formed on the sacrificial layer 300, and the isolation layer 200 may be separated from the sacrificial layer 300 after the light-emitting structure is formed. All of the above methods are possible and are not specifically limited.

[0066] In a specific embodiment, please refer to Figure 4 and Figure 5 , a pixel definition layer 20 and an isolation layer 200 are sequentially formed on the driving backplane 10 along a first direction X, and further comprising: Step S11 , forming a light shielding layer 50 on the pixel definition layer 20 , wherein the light shielding layer 50 includes a plurality of light shielding portions 51 , and the plurality of light shielding portions 51 correspond to the plurality of pixel definition structures 21 one by one.

[0067] In step S12 , a sacrificial layer 300 is formed on the light shielding layer 50 . The sacrificial layer 300 includes a plurality of sacrificial portions 310 . The plurality of sacrificial portions 310 correspond to the plurality of pixel definition structures 21 one by one.

[0068] In step S13 , a spacer column 210 is formed on a surface of the sacrificial portion 310 facing away from the pixel definition structure 21 .

[0069] In one embodiment, please refer to Figure 6 and Figure 7 , separating the isolation layer 200 from the pixel definition layer 20, further comprising: Step S41, providing a transfer plate 400.

[0070] Step S42 , bringing the transfer plate 400 and the isolation layer 200 relatively close to each other, so as to connect the isolation layer 200 and the transfer plate 400 .

[0071] In step S43 , the transfer plate 400 is relatively far away from the pixel definition layer 20 , so as to separate the isolation layer 200 from the pixel definition layer 20 through the transfer plate 400 .

[0072] The transfer plate 400 is used to receive the isolation layer 200 after being separated from the pixel definition layer 20. The connection method between the transfer plate 400 and the isolation layer 200 is not limited. The transfer plate 400 can be an integrated structure or a split structure, without limitation.

[0073] Optional, such as Figure 7 As shown, the transfer plate 400 includes a transfer substrate 410, on which an adhesive layer 420 is formed, and the adhesive layer 420 is used to adhere the separated isolation layer 200. The transfer substrate 410 can be any feasible substrate in the art, and its transparency and thickness are not limited. The adhesive layer 420 can be made of a weakly sticky material, such as polydimethylsiloxane (PDMS), etc., without limitation.

[0074] When separating the isolation layer 200 and the pixel definition layer 20, the surface of the isolation layer 200 facing away from the pixel definition layer 20 is connected to the transfer plate 400 (for example, the isolation layer 200 is adhered to the transfer plate 400, and other feasible connection methods can also be used). At this time, the operation of separating the isolation layer 200 and the pixel definition layer 20 can be performed simultaneously, such as decomposing the sacrificial layer 300 by pyrolysis, photolysis, etc., and using N2 or other gas to blow the isolation column 210 to separate from the pixel definition structure 21 under gravity and gas blowing. It is also possible to first connect the surface of the isolation layer 200 facing away from the pixel definition layer 20 to the transfer plate 400, and then perform the operation of separating the isolation layer 200 and the pixel definition layer 20, without limitation. Then, the transfer plate 400 is moved to synchronously move the isolation layer 200 on the transfer plate 400 to complete the separation of the isolation layer 200 and the pixel definition layer 20.

[0075] With such a configuration, the separated isolation layer 200 is transferred onto the transfer plate 400 . When manufacturing the next batch of new display panels 100 , the isolation layer 200 can be reused without the need to prepare the isolation layer 200 . This can improve production efficiency and reduce costs.

[0076] In one embodiment, please refer to Figure 7 , Figure 8 and Fig. 9 , further comprising repeating the following steps at least once: Step C1 , providing an N+1th driving backplane 10 , and forming an N+1th pixel definition layer 20 on the N+1th driving backplane 10 .

[0077] Step C2 , bringing the transfer plate 400 and the N+1th driving backplane 10 relatively close to each other, so as to connect the isolation layer 200 separated from the Nth pixel definition layer with the N+1th pixel definition layer 20 .

[0078] Step C3 , separating the transfer plate 400 from the isolation layer 200 to form an N+1th isolation layer 200 on the N+1th pixel definition layer 20 .

[0079] Step C4, forming the N+1th first light-emitting structure.

[0080] Step C5, separating the N+1th isolation layer 200 from the N+1th pixel definition layer 20; Where N is a positive integer. Optional. Figure 7 , the Nth driving backplane 10, the Nth pixel definition layer 20 and the Nth isolation layer 200, Fig. 9 , which is the N+1th driving backplane 10, the N+1th pixel definition layer 20 and the Nth isolation layer 200, that is, Figure 7 and Fig. 9 The isolation layer 200 in is the same isolation layer 200.

[0081] In the manufacturing process of the display panel 100, the manufacturing process of the display panel 100 needs to perform steps C1 to C5 once, and the manufacturing process of the display panel 100 is completed N times by repeating the above steps C1 to C5 N times. In the same manufacturing process, a single display panel 100 can be formed, and multiple display panels 100 can also be manufactured at the same time, without limitation.

[0082] Optionally, in step C1 , an N+1th sacrificial layer 300 and / or an N+1th light shielding layer 50 may be formed on the N+1th pixel definition layer 20 , without limitation.

[0083] Optionally, in step C2, the isolation layer 200 separated from the Nth pixel definition layer 20 may be the isolation layer 200 separated from the Nth pixel definition layer 20, or the isolation layer 200 formed on the Nth pixel definition layer 20, without limitation. Optionally, the above steps are repeated N times, and the isolation layers 200 in the N steps are all the same isolation layers 200. The isolation layers 200 are reused, which can reduce costs. Alternatively, the above steps are repeated once, that is, the isolation layer 200 separated in the Nth process can be reused in the N+1th process, and in the N+2th process, that is, a new isolation layer 200 can be made on the N+2th pixel definition layer, without limitation.

[0084] Optionally, in step C3, the connection force (e.g., adhesion force) between the transfer plate 400 and the isolation layer 200 is smaller than the connection force (e.g., adhesion force) between the isolation layer 200 and the pixel definition layer 20, so that in step C3, the isolation layer 200 can be separated from the transfer plate 400 by relying on the connection force between the isolation layer 200 and the pixel definition layer 20 to form the isolation layer 20 on the pixel definition layer 20.

[0085] Optionally, in step C4, if the first residual portion 32 formed on the isolation column 210 when forming the first light-emitting structure is too thick, the first residual portion 32 on the second surface 212 of the isolation column 210 can be removed by oxygen plasma (O2 Plasma) treatment before the isolation layer 200 is separated from the pixel definition layer 20 to avoid affecting subsequent operations.

[0086] As can be understood by those skilled in the art, oxygen plasma treatment is to generate highly active particles (such as oxygen free radicals, ozone, ions, etc.) by ionizing oxygen (O2), and utilize its chemical and physical effects to modify the surface of the material, thereby removing organic pollutants (photoresist, grease, etc.) on the surface of the target object.

[0087] Optionally, in step C5 , steps S41 to S43 may be repeatedly performed to separate the isolation layer 200 from the pixel definition layer 20 by the transfer plate 400 .

[0088] By repeatedly performing the above steps C1 to C5 at least once, the isolation layer 200 can be reused without the need to prepare the isolation layer 200 again, thereby improving production efficiency and reducing costs.

[0089] Please refer to Fig.10 The embodiment of the present invention further provides a display panel 100, which is manufactured using the manufacturing method of the display panel 100 in the embodiment of the present invention, and includes a driving backplane 10, a pixel definition layer 20 and a first light-emitting portion 31. The pixel definition layer 20 is arranged on the driving backplane 10 along a first direction X, and the pixel definition layer 20 includes a plurality of pixel definition structures 21 arranged at intervals along a second direction Y. The first light-emitting portion 31 is arranged on the driving backplane 10 and is located between two adjacent pixel definition structures 21.

[0090] Optionally, two opposite surfaces of the first light-emitting portion 31 in the second direction Y are respectively connected to the side surfaces of a pixel definition structure 21 , and the light-emitting area of ​​the first light-emitting portion 31 is sufficient to improve the display effect.

[0091] Optionally, the display panel 100 further includes a second light emitting portion 41, which is disposed on the driving backplane 10 and between two adjacent pixel definition structures 21, and the first light emitting portion 31 and the second light emitting portion 41 are respectively formed on opposite sides of the same pixel definition structure 21. The first light emitting portion 31 and the second light emitting portion 41 may be formed of light emitting materials of different colors or of the same color, without limitation.

[0092] In the display panel 100 in the embodiment of the present invention, the pixel definition structure 21 can separate adjacent light-emitting parts, and adjacent light-emitting parts will not contact each other to cause cross-color. The display panel 100 has a good display effect. At the same time, the structure of the display panel 100 is relatively simple and easy to manufacture.

[0093] In one embodiment, Fig.10 As shown, the display panel 100 also includes a light shading layer 50, which includes a plurality of light shading portions 51, and the plurality of light shading portions 51 correspond one-to-one to the plurality of pixel definition structures 21. The light shading portions 51 are arranged on the surface of the pixel definition structure 21 facing away from the driving backplane 10, and the functional layer 60 is arranged on the surface of the light shading portions 51 facing away from the pixel definition structure 21.

[0094] Optionally, the light shielding portion 51 and the pixel definition structure 21 can be connected by bonding, clamping, etc., without limitation. Optionally, in the orthographic projection of the first direction X, the light shielding layer 50 is located on the surface of the pixel definition structure 21 facing away from the driving backplane 10 (i.e., the third surface 22).

[0095] By providing the light shielding layer 50 , it is possible to effectively prevent light or external temperature changes from affecting the pixel definition structure 21 , thereby increasing the service life of the display panel 100 .

[0096] In one embodiment, Fig.10 As shown, the display panel 100 further includes a functional layer 60 , which is disposed on the pixel definition layer 20 and the first light emitting structure.

[0097] Optionally, the functional layer 60 includes a cathode layer, a passivation layer, an encapsulation layer, etc., which are sequentially arranged along the first direction X on the pixel definition layer 20 and the first light emitting structure.

[0098] Optionally, the cathode layer can be formed on the surface of the pixel definition layer 20 and the first light-emitting structure by evaporating the cathode material on the entire surface, and the manufacturing method is simple. Similarly, the encapsulation layer can be disposed on the surface of the cathode layer facing away from the pixel definition layer 20 and the first light-emitting structure by conventional means in the art, and the encapsulation process is simple and effective.

[0099] Please refer to Fig.11The embodiment of the present application further provides an electronic device 1000, including a housing 500 and a display panel 100 manufactured by the manufacturing method of the display panel 100 in the embodiment of the present invention or the display panel 100 in the embodiment of the present invention, and the display panel 100 is accommodated in the housing 500.

[0100] Optionally, the electronic device 1000 may be a mobile phone, a tablet, a computer, an electronic paper, etc., without specific limitation. The electronic device 1000 may be a flexible foldable electronic device, a touch-sensitive electronic device, etc., without specific limitation.

[0101] Optionally, the connection between the housing 500 and the display panel 100 may be bonding, snap-on, screw-on, magnetically connected, etc., without specific limitation. The shape of the display panel 100 may be square, circular, rectangular, trapezoidal, irregular, etc., and the shape of the housing 500 may correspond to that of the display panel 100, without limitation.

[0102] The electronic device 1000 in the embodiment of the present invention adopts the display panel 100 in the embodiment of the present invention, so the display panel 100 has good display effect and long service life.

[0103] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship of terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inside" and "outside" are based on the orientation or positional relationship of the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0104] What is disclosed above is only a preferred embodiment of the present invention, and it certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope covered by the present invention.

Claims

1. A method for manufacturing a display panel, characterized in that: include: Forming a pixel definition layer and an isolation layer in sequence along a first direction on the driving backplane; The pixel definition layer includes a plurality of pixel definition structures spaced apart along a second direction, and the isolation layer includes a plurality of isolation columns; the plurality of isolation columns correspond one to one to the plurality of pixel definition structures; the isolation columns include a first surface and a second surface disposed opposite to each other in the first direction, the first surface faces the pixel definition structure, the first surface is located within the second surface in an orthographic projection of the first direction, and the second direction intersects with the first direction; forming a first light-emitting structure, wherein the first light-emitting structure comprises a first light-emitting portion and a first residual portion which are spaced apart from each other, wherein the first light-emitting portion is formed on the driving backplane and is located between two adjacent pixel definition structures, and the first residual portion is formed on the second surface; The isolation layer is separated from the pixel definition layer.

2. The method for manufacturing a display panel according to claim 1, characterized in that: Also includes: A second light-emitting structure is formed, wherein the second light-emitting structure includes a second light-emitting portion and a second residual portion spaced apart from each other, wherein the second light-emitting portion is formed on the driving backplane and is located between two adjacent pixel definition structures, and the first light-emitting portion and the second light-emitting portion are respectively formed on opposite sides of the same pixel definition structure, and the second residual portion is formed on the second surface.

3. The method for manufacturing a display panel according to claim 1, wherein: The pixel definition structure includes a third surface facing away from the driving backplane. In the second direction, the size of the second surface is L1, and the size of the third surface is L2, satisfying: 0.8≤L1 / L2≤1.

2.

4. The method for manufacturing a display panel according to claim 1, wherein: A pixel definition layer and an isolation layer are sequentially formed on the driving backplane along a first direction, and further comprising: forming a sacrificial layer on the pixel definition layer, wherein the sacrificial layer comprises a plurality of sacrificial portions, and the plurality of sacrificial portions correspond one-to-one to the plurality of pixel definition structures; The isolation column is formed on a surface of the sacrificial portion facing away from the pixel definition structure, and the sacrificial portion is used for decomposition to separate the isolation layer from the pixel definition layer.

5. The method for manufacturing a display panel according to claim 1 or 4, characterized in that: A pixel definition layer and an isolation layer are sequentially formed on the driving backplane along a first direction, and further comprising: forming a light shielding layer on the pixel definition layer, wherein the light shielding layer comprises a plurality of light shielding portions, and the plurality of light shielding portions correspond one-to-one to the plurality of pixel definition structures; The isolation column is formed on a surface of the light shielding portion facing away from the pixel definition structure.

6. The method for manufacturing a display panel according to claim 1, characterized in that: Separating the isolation layer from the pixel definition layer, further comprising: Provide transfer plates; Bring the transfer plate and the isolation layer relatively close to each other to connect the isolation layer and the transfer plate; The transfer plate is relatively far away from the pixel definition layer, so that the isolation layer is separated from the pixel definition layer by the transfer plate.

7. The method for manufacturing a display panel according to claim 6, characterized in that: The process also includes repeating the following steps at least once: Providing the N+1th driving backplane, and forming the N+1th pixel definition layer on the N+1th driving backplane; The transfer plate is relatively close to the N+1th driving backplane to connect the isolation layer separated from the Nth pixel definition layer to the N+1th pixel definition layer; Separating the isolation layer of the transfer plate to form the N+1th isolation layer on the N+1th pixel definition layer; forming the N+1th first light-emitting structure; Separating the N+1th isolation layer from the N+1th pixel definition layer; Wherein, N is a positive integer.

8. A display panel, characterized in that: The display panel is manufactured by the manufacturing method according to any one of claims 1 to 7, comprising: Driver backplane; A pixel definition layer is arranged on the driving backplane along a first direction, the pixel definition layer includes a plurality of pixel definition structures arranged at intervals along a second direction, and the second direction intersects with the first direction; The first light emitting portion is disposed on the driving backplane and is located between two adjacent pixel definition structures.

9. The display panel according to claim 8, characterized in that: The display panel further includes a light shielding layer, which includes a plurality of light shielding portions, the plurality of light shielding portions correspond one-to-one to the plurality of pixel definition structures, and the light shielding portions are arranged on a surface of the pixel definition structure facing away from the driving backplane.

10. An electronic device, characterized in that: The invention comprises a housing and a display panel manufactured by the method for manufacturing a display panel according to any one of claims 1 to 7 or a display panel according to claim 8 or 9, wherein the display panel is accommodated in the housing.

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