Evaluation device and evaluation method

Abstract

The purpose of the present invention is to provide a technique for estimating a foreign matter defect rate. One of the evaluation devices according to the present invention is an evaluation device for evaluating an assembly work for assembling a processing device comprising a plurality of components, and is characterized by being provided with: a calculation function unit for acquiring gravity information indicating the direction in which gravity acts; for each process (hereinafter referred to as "assembly process") included in the assembly work, assembly order information indicating an operation performed on each of the plurality of components and an assembly order is acquired, and work operation information indicating a work operation performed by a worker in the assembly process is acquired. The evaluation surface information indicating the evaluation surface of each of the plurality of components is acquired, and the relative position information indicating the positional relationship between the foreign matter source and the components during the assembly process is acquired. The defect rate calculation unit calculates a foreign matter defect rate indicating the risk of attachment of a foreign matter generated from a foreign matter source to each evaluation surface by the work operation on the basis of the gravity information, the assembly order information, the work operation information, and the relative position information.

Description

Technical Field

[0001] The present invention relates to an evaluation device and an evaluation method. Background Art

[0002] In the past, the following method has been developed: in the equipment design stage, the maintenance work time is estimated based on the equipment design and maintenance work procedures, and the maintenance work time is reduced by improving the design and procedures.

[0003] The subject of Patent Document 1 is to provide a program that can improve the accuracy of the estimated value of assembly time calculated in simulation, and the following contents are disclosed as a program, an assembly time calculation method, and an assembly time calculation device. "A program for calculating the assembly time of a product by simulation, wherein an input unit 1302 obtains animation data for displaying the steps of the assembly operation of the product on a display unit in an animated manner, a change point detection unit 1310 detects the change of the viewpoint of the animation from the obtained animation data, and a standard time calculation unit 1311 calculates the estimated value of the assembly time of the product based on the detected change of the viewpoint of the animation."

[0004] The subject of Patent Document 2 is to provide an assembly evaluation system that not only extracts data used in evaluation from three-dimensional CAD data, but also performs input for realizing functions used in other processes, subsequent processes, or auxiliary processes, thereby making it easy to perform input for evaluation, and the function can also be actually used. The following contents are disclosed as an assembly evaluation method, its system, and program. "The three-dimensional CAD data is taken in, the operation from the user for making an animation is accepted, the movement of the component based on the accepted operation is recorded, the evaluation data is made according to the movement, and the evaluation result is obtained by substituting the made evaluation data into a pre-prepared evaluation formula. Therefore, the input required by the user is the part for making the assembly animation. If the animation is made, the evaluation data can be automatically made afterwards to obtain the evaluation result, which can greatly improve the labor and time of the user's input."

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2014-182557

[0008] Patent Document 2: JP-A-2007-200082 Summary of the invention

[0009] Problems to be solved by the invention

[0010] The maintenance operation time of a semiconductor processing device can be estimated as the sum of the wet operation time, the leakage rework time, and the foreign matter rework time. The wet operation time is the time required for the "disassembly / cleaning / assembly" process, wherein in the "disassembly / cleaning / assembly", the chamber for processing the wafer is mainly disassembled, and the foreign matter generated during the reaction process is cleaned until the chamber is reassembled. The leakage rework time is the time required for reassembly until the leakage test is qualified if the leakage test fails after the wet operation. The foreign matter rework time is the time required for re-performing the wet operation and the leakage test until the foreign matter test is qualified if the foreign matter test fails after the leakage test is passed. In this way, since the maintenance operation time is affected by the wet operation time, the leakage generation rate, and the foreign matter defect rate, a method for pre-estimating the wet operation time, the leakage generation rate, and the foreign matter defect rate is required.

[0011] Patent Document 1 discloses a method for estimating assembly operation time from design data, which can estimate wet operation time. In addition, Patent Document 2 discloses a method for estimating assembly performance (defective rate) from design data, which can estimate leakage generation rate. However, in Patent Documents 1 and 2, foreign matter defective rate is not fully discussed.

[0012] Therefore, an object of the present invention is to provide a technology for estimating the foreign matter defect rate.

[0013] Means for solving problems

[0014] In order to solve the above-mentioned problems, one of the representative evaluation devices of the present invention is an evaluation device for evaluating the assembly operation of a processing device composed of multiple components, the evaluation device comprising a calculation function unit and a defect rate calculation unit, the calculation function unit obtains gravity information indicating the direction in which gravity acts, obtains assembly sequence information indicating the operations performed on each of the multiple components and the assembly order for each process (hereinafter referred to as "assembly process") included in the assembly operation, obtains work action information indicating the work actions of the operators performed in the assembly process, obtains evaluation surface information indicating the evaluation surfaces of each of the multiple components, obtains relative position information indicating the positional relationship between a foreign matter source in the assembly process and the components, and the defect rate calculation unit calculates the foreign matter defect rate indicating the risk of foreign matter generated from the foreign matter source being attached to each of the evaluation surfaces through the work action based on the gravity information, the assembly sequence information, the work action information and the relative position information.

[0015] Effects of the Invention

[0016] According to the present invention, the foreign matter defect rate can be estimated.

[0017] The problems, structures, and effects other than those described above will become clear from the following description of the embodiments for carrying out the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a diagram showing a display example displayed by the evaluation device according to the embodiment.

[0019] Figure 2 It is a diagram showing an example of the configuration of an evaluation device according to the embodiment.

[0020] Figure 3 This is a diagram showing a flowchart of a process for calculating a foreign matter defect rate performed by the evaluation device.

[0021] Figure 4 This is a diagram showing an example of assembly sequence information, work action information, and evaluation surface information.

[0022] Figure 5 This is a diagram showing an example of relative position information.

[0023] Figure 6 It is a diagram showing an example of the foreign matter defect rate DB.

[0024] Figure 7 This is a diagram showing an example of a foreign matter defect rate table.

[0025] Figure 8 This is a diagram showing a method of extracting countermeasure policies from a foreign matter defect rate table.

[0026] Fig. 9 This is a diagram schematically showing a scene of the process of assembling a sub-component into a parent component in a wet process. DETAILED DESCRIPTION

[0027] Hereinafter, the embodiment of the present invention will be described with reference to the accompanying drawings. In addition, the present invention is not limited by the embodiment. In addition, in the description of the accompanying drawings, the same parts are marked with the same reference numerals.

[0028] (Causes of foreign matter defects)

[0029] refer to Fig. 9 To explain the cause of foreign body defects. Fig. 9 This is a diagram schematically showing a scene of the process of assembling a sub-component into a parent component in a wet process.

[0030] Fig. 9Indicates the operation of installing sub-component B into parent component A. Parent component A refers to the component on the side of the component to be installed. In addition, sub-component B refers to the component operated by the operator. For example, when parent component A and sub-component B are components constituting a semiconductor processing device, parent component A corresponds to a chamber, etc., and sub-component B corresponds to a sample stage, etc., arranged in the chamber. Sub-component B is lifted by the operator's hand and arranged inside parent component A.

[0031] The arrow indicates vertical downward, indicating the direction of gravity. During the assembly process, since the operator peeks into the inside of the cylindrical mother component A, the operator's face Of may be located above the mother component A. Assuming that a foreign object is generated from the face Of, the foreign object Co moves vertically downward and reaches the surface of the face As of the mother component A in a direction perpendicular to the vertical direction.

[0032] In addition, the child component B is transferred to the installation position of the parent component A while being held by the operator's hand Oh. The operator's hand Oh may come into contact with the inner side of the parent component A in addition to the child component B. It is assumed that the operator's hand Oh comes into contact with the surface of the face As parallel to the vertical direction, and the foreign matter moves from the hand Oh to the face As.

[0033] In this way, during the assembly process, foreign matter generated from the body or clothes of the operator is considered to be attached to the parts. When estimating the cause of the foreign matter defect, in addition to the foreign matter initially attached to the assembly target part, it is also necessary to consider the attachment of foreign matter generated from parts other than the assembly target part and the influence of the operator's body movement during assembly.

[0034] (Display example of evaluation device)

[0035] Figure 1 1 is a diagram showing a display example displayed by the evaluation device according to the embodiment. As described later, the evaluation device has an input I / F (interface) and an output I / F. The evaluation device has a display function constituted by the input I / F and the output I / F.

[0036] The input I / F and the output I / F include an assembly sequence input unit 201, an operation action input unit 202, an evaluation surface input unit 203, a gravity direction display unit 205, a relative position display unit 204, a defect rate setting unit 206, a gravity input unit 207, a result display unit 301, and a countermeasure display unit 302.

[0037] The assembly sequence input unit 201 displays the set assembly sequence information and receives a user's input operation for the assembly sequence information. The assembly sequence information will be described later.

[0038] An input UI (user interface) can be appropriately set in the assembly order input unit 201. For example, by operating a drill-down menu displayed in a cell, a user can edit a numerical value or text displayed in the cell.

[0039] The work action input unit 202 displays set work action information and receives a user's input operation for the work action information. The work action information will be described later.

[0040] The evaluation surface input unit 203 indicates a portion (surface) of a component for which evaluation of whether or not foreign matter is attached is performed in the evaluation device.

[0041] The relative position display unit 204 displays the relative positional relationship between the foreign matter source and the component in each operation of the operator.

[0042] The gravity direction display unit 205 indicates the direction of gravity acting on the foreign matter source and the components shown in the relative position display unit 204 .

[0043] The defect rate setting unit 206 indicates the relationship between the foreign matter source and the defect rate associated with the foreign matter source. The defect rate setting unit 206 indicates the defect rate index pre-stored in the foreign matter defect rate DB7 described later. In addition, the defect rate setting unit 206 receives the user's input operation for the defect rate index. The foreign matter defect rate DB7 will be described later.

[0044] The gravity input unit 207 displays information specifying the direction of gravity (hereinafter also referred to as "gravity information" d). The gravity input unit 207 receives a user input operation for gravity information. The direction of gravity in the gravity information set by the gravity input unit 207 is displayed as an arrow on the gravity direction display unit 205.

[0045] The result display section 301 displays the result of evaluating the foreign matter defect rate.

[0046] The countermeasure display unit 302 shows the countermeasures for the operator's work action. As the countermeasure with the first priority, "Regarding component X, make improvements so that foreign matter is prevented from falling onto the parent component during the insertion action" is displayed. In addition, as the countermeasure with the second priority, "Regarding component X, make improvements so that foreign matter is prevented from adhering to the parent component during the lateral action" is displayed.

[0047] In addition, other countermeasures can be displayed in the countermeasure display unit 302. For example, a scroll bar can be provided on the side of the countermeasure display unit 302, and a plurality of countermeasures can be displayed through user operation.

[0048] exist Figure 1In the example, a numerical value or text is shown in a plurality of cells. The numerical value and text shown in the cell can be edited by the user selecting the cell. Such display and editing can be realized by using a display device such as a display, an input device such as a keyboard and a mouse as an input I / F and an output I / F. In addition, an input and output device such as a touch panel can also be used as an input I / F and an output I / F. In addition, as an I / F, it is not limited to a display device, and an output device such as sound can also be used.

[0049] (Structure of Evaluation Device)

[0050] Figure 2 1 is a diagram showing an example of the configuration of an evaluation device according to the embodiment. The evaluation device 1 evaluates an assembly operation of assembling a processing device composed of a plurality of components. The evaluation device 1 includes a calculation function unit 4 and a defect rate calculation unit 5 .

[0051] The calculation function unit 4 obtains gravity information indicating the direction in which gravity acts, obtains assembly sequence information indicating the operations performed on each of the multiple components and the assembly sequence according to each process included in the assembly operation (hereinafter referred to as the "assembly process"), obtains work action information indicating the work actions of the workers performed in the assembly process, obtains evaluation surface information indicating the evaluation surfaces of each of the multiple components, and obtains relative position information indicating the positional relationship between the foreign matter source in the assembly process and the components.

[0052] Furthermore, the defect rate calculation unit 5 calculates the foreign matter defect rate indicating the risk of foreign matter generated from the foreign matter source being attached to each evaluation surface by the work action based on the gravity information, assembly sequence information, work action information and relative position information.

[0053] The evaluation device 1 includes an input I / F 2 , an output I / F 3 , a calculation function unit 4 , a defect rate calculation unit 5 , a storage unit 6 , and a foreign matter defect rate DB 7 .

[0054] like Figure 1 As shown, the input I / F 2 displays various information to the user of the evaluation device 1 or receives input operations from the user.

[0055] The input I / F 2 receives information such as assembly sequence information 101 , work movement information 102 , evaluation surface information 103 , relative position information 104 , gravity information 105 , and the like, or user input operations for setting these information.

[0056] The assembly sequence information 101 indicates the operations and assembly sequence of each of the plurality of components for each assembly process included in the assembly operation. The operation action information 102 indicates the actions of the user in the assembly process. The evaluation face information 103 indicates the evaluation face of each of the plurality of components. The assembly sequence information 101, the operation action information 102, and the evaluation face information 103 are respectively transmitted to the user through the user's computer. Figure 1 The assembly sequence input unit 201, the operation action input unit 202 and the evaluation surface input unit 203 are set.

[0057] The relative position information 104 indicates the positional relationship between the foreign matter source and the component in the assembly process. Figure 1 The relative position display unit 204 shows.

[0058] The gravity information 105 indicates the direction in which gravity acts. Figure 1 The gravity direction display unit 205 in FIG. 104 shows the gravity information 105. The gravity information 105 is set via the gravity input unit 207. The gravity input unit 207 can set the magnitude of gravity by dividing it into three axes of xyz, for example.

[0059] In addition, the case where the above information is set via the input I / F2 is described, but the present invention is not limited to this. The above information can also be set in advance in the storage unit 6 described later, and the pre-set information can be displayed to the user. In addition, the above information can be extracted from a camera device, a body sensor, etc. according to the assembly work actually performed by the operator, and displayed to the user at the input I / F2.

[0060] The calculation function unit 4 acquires the gravity information 105, the assembly sequence information 101, the work motion information 102, the evaluation surface information 103, and the relative position information 104. The calculation function unit 4 includes, for example, at least one of a CPU, a ROM, and a RAM.

[0061] The defect rate calculation unit 5 calculates the foreign matter defect rate of the evaluation surface based on the gravity information, the assembly sequence information, the operation action information and the relative position information. The relationship between the evaluation surface and the foreign matter defect rate is calculated for each process included in the assembly sequence and each evaluation surface. The defect rate calculation unit 5 creates a foreign matter defect rate table 111 showing a plurality of relationships.

[0062] In addition, although the calculation function unit 4 and the defect rate calculation unit 5 are shown as different structures, the present disclosure is not limited to this. The defect rate calculation unit 5 can also be included in the structure of the calculation function unit 4.

[0063] The output I / F 3 displays the foreign matter defect rate table 111 to the user. Figure 1 The result display unit 301 displays the information contained in the foreign matter defect rate table 111. In addition, the output I / F3 performs Figure 1The countermeasure display unit 302 displays the display.

[0064] The storage unit 6 stores information inputted via the input I / F 2 and information calculated by the defect rate calculation unit 5. In the storage unit 6, the gravity information storage units 61 and 62 store gravity information 105. The assembly sequence information storage unit 63 stores the assembly sequence information 101. The operation motion information storage unit 64 stores the operation motion information 102. The evaluation surface information storage unit 65 stores the evaluation surface information 103. The relative position information storage unit 66 stores the relative position information 104. The foreign matter defect rate table storage unit 67 stores the foreign matter defect rate table 111.

[0065] Furthermore, although the case where a storage unit is provided for each type of information has been described, the present invention is not limited thereto. The storage unit may be constituted by one piece of hardware, and a plurality of types of information may be stored in one storage unit.

[0066] The foreign matter defect DB 7 holds data indicating the relationship between the foreign matter source and the defect rate shown in the defect rate setting unit 206 .

[0067] The evaluation device 1 may be configured by hardware, or may be configured by information processing resources provided by a cloud service.

[0068] Furthermore, the case where the foreign matter defect rate is calculated in a semiconductor processing apparatus is described, but the present disclosure is not limited to the case of a semiconductor processing apparatus.

[0069] (Calculation of foreign matter defect rate)

[0070] Figure 3 This is a diagram showing a flowchart of a process for calculating a foreign matter defect rate performed by the evaluation device.

[0071] The calculation of the foreign matter defect rate is performed for each unit action (steps S1 to S7), and also for each evaluation surface (steps S2 to S6). The unit action is an action that is subdivided by a given reference in the assembly operation, and refers to an action that is distinguished for the calculation of the foreign matter defect rate. The following describes the case where the operation action included in the operation action information 102 is used as the unit action, but the present disclosure is not limited to this. The method of analyzing the action in the assembly operation can be set appropriately.

[0072] The calculation function unit 4 acquires gravity information 105 , work movement information 102 , evaluation surface information 103 , and relative position information 104 necessary for calculating the foreign matter defect rate for each work movement and each evaluation surface.

[0073] Next, the defect rate calculation unit 5 determines whether the positional relationship between the foreign matter source and the component is a predetermined positional relationship or a positional relationship other than the predetermined positional relationship.

[0074] In determining the given positional relationship, ray tracing is used to determine whether a straight line extending vertically from the evaluation surface of the component collides with the foreign matter source. Specifically, the defect rate calculation unit 5 emits a ray from the evaluation surface in a direction opposite to the direction of gravity indicated by the gravity information 105 (step S3). For example, when the component is represented by a polygon, a half straight line is stretched from the center of gravity of each facet (triangular face) constituting the evaluation surface to the side opposite to gravity.

[0075] The defect rate calculation unit 5 determines whether the foreign matter source and the ray collide (step S4). Specifically, it is determined whether the half-line stretched vertically from the evaluation surface collides with the foreign matter source. In the case of collision, the defect rate calculation unit 5 extracts the defect rate index from the DB (database) based on the positional relationship between the foreign matter source and the evaluation surface and adds it (step S5). As foreign matter sources, the face and hands of the operator, and the tools operated by the operator, etc. can be cited. In addition, as a positional relationship, there is a situation where the foreign matter source is in contact with the evaluation surface (a situation where the half-line set between the foreign matter source and the evaluation surface is less than a given length); or a situation where the foreign matter source is located above the evaluation surface (a situation where the foreign matter source and the evaluation surface are not in contact, but there is a foreign matter source at a position on the evaluation surface in the opposite direction to the gravity direction and the half-line stretched from the evaluation surface reaches the foreign matter source). In addition, the situation where the gravity direction is parallel to the direction perpendicular to the evaluation surface is described, but the present disclosure is not limited to this. The present disclosure can also be applied when the gravity direction and the direction perpendicular to the evaluation surface are not parallel.

[0076] (Details of the information)

[0077] Figure 4 It is a diagram showing an example of assembly sequence information 101 , work movement information 102 , and evaluation surface information 103 . Figure 4 In Figure 1 The display format shown in the assembly sequence input unit 201, the work action input unit 202 and the evaluation surface input unit 203 is displayed.

[0078] In the assembly sequence information 101, the item "ID" indicates the assembly process included in the assembly work. The item "component name" indicates the component operated by the operator in each assembly process. The subcomponents are mainly shown in the component name. The item "action" indicates the action element determined to analyze the assembly work. The symbol "↓" means moving the subcomponent downward (in the direction of gravity), and the symbol "→" means moving the subcomponent laterally. In the assembly process of ID0-0, the cylinder moves laterally. In addition, in the assembly process of ID0-1, the cylinder moves downward (insertion action). The assembly process of ID0-1 is performed immediately after the assembly process of ID0-0, and the assembly processes are arranged in time series.

[0079] The operation action information 102 is time series data that represents the positional relationship between the foreign matter source and the component in the assembly process and is divided into a given time span. The operation action information 102 is, for example, 3D simulation data that represents the process from the beginning to the end of the assembly process, or data that divides the 3D simulation data into fixed time spans. Here, the assembly process of ID0-0 is represented by data in a given format such as 0-0-0.pose, 0-0-1.pose, ... The assembly process of ID0-1 is represented by data such as 0-1-0.pose.

[0080] The evaluation surface information 103 indicates the surface for which evaluation of foreign matter adhesion is to be performed. The evaluation surface is specified by the user. In addition, the evaluation surface may also be a surface selected by the evaluation device 1. The evaluation surface is set as a surface requiring a given degree of cleanliness, i.e., a cleaned surface, and the calculation function unit 4 may also extract the cleaned surface based on the shape data of the semiconductor processing device in the state of being assembled in the middle of assembly and the condition for determining the cleaned surface, i.e., a cleaned surface determination condition. The cleaned surface determination condition may, for example, determine whether it is a set surface to which a mark or the like is pre-attached in the shape data of the component. Here, CB01 is extracted as the evaluation surface. CB01 represents the surface of the parent component in the assembly operation. In addition, the evaluation surface is not limited to the surface of the parent component, but may also be the surface of a child component. In addition, multiple surfaces may also be extracted as evaluation surfaces.

[0081] Figure 5 It is a diagram showing an example of the relative position information 104 . Figure 5 (a) is displayed in the relative position display unit 204. The name column 1021 indicates the name of the data displayed in the work action information 102. The relative position display unit 204 also displays the gravity information 105 set in the gravity input unit 207, and the direction of gravity is indicated by an arrow. Figure 5 In (a), the relative positional relationship among the operator's hand 1041, the operator's face 1045, the child component 1043, the parent component 1044, and the evaluation surface 1042 is schematically shown. The hand 1041 and the face 1045 are particularly the parts that act as foreign matter sources, and therefore, they are extracted from the elements constituting the operator and shown.

[0082] in addition, Figure 5 (a) is a schematic display. The calculation function unit 4 calculates the relative positional relationship between the child component 1043, the parent component 1044 and the foreign matter source based on the assembly sequence information 101, the work action information 102, and the evaluation surface information 103. Figure 5(b) is a diagram showing an example of the work motion information 102. The work motion information 102 is 3D simulation data, and includes the hands 1041 and face 1045 of the worker, the child parts 1043, and the parent parts 1044 (arranged on the work table 1046). The calculation function unit 4 calculates the relative position information 104 based on the position information of the worker's body, the parts to be assembled, the evaluation surface, etc. in the assembly process of the assembly work.

[0083] The evaluation device 1 further includes a database defining a defect rate index for each positional relationship, and the defect rate calculation unit 5 calculates the foreign matter defect rate for each evaluation surface based on the defect index. Figure 6 It is a diagram showing an example of foreign matter defect rate DB7. Foreign matter defect rate DB7 defines a defect rate index representing the risk of foreign matter adhesion based on a foreign matter source according to each relative positional relationship between a component and a foreign matter source. The item "foreign matter source" indicates the cause of the generation of foreign matter. The item "defect rate index" is a numerical value used in calculating the foreign matter defect rate when a foreign matter test of a semiconductor processing device is performed. In addition, the defect rate index is defined when there is a given positional relationship between the foreign matter source and the component. The items "contact" and "above" represent the relative positional relationship between the foreign matter source and the component. "Contact" refers to the situation where the foreign matter source and the component are in contact. "Above" refers to the situation where a foreign matter source exists above the component. In addition, the so-called above, when the component is used as a reference, refers to the direction opposite to the direction of gravity. In addition, the method for calculating the foreign matter defect rate of the entire assembly operation will be described later.

[0084] The foreign matter source "face" refers to the face of the operator. When the face is in contact with the component, the defective rate index is 1.000%, and when the face is located above the component, the defective rate index is 0.002%. The foreign matter source "hand" refers to the hand of the operator. When the hand is in contact with the component, the defective rate index is 0.050%, and when the hand is located above the component, the defective rate index is 0.005%. The foreign matter source "arm (clothing)" refers to the arm of the operator. When the arm is in contact with the component, the defective rate index is 0.020%, and when the arm is located above the component, the defective rate index is 0.002%.

[0085] The foreign matter source "component Z" refers to a component with foreign matter attached. For example, when a subcomponent is fixed to a parent component with an insufficiently processed screw, the screw is equivalent to component Z. For such a screw, it is not assumed that it will come into contact with the component, but it is assumed that the screw will pass over the parent component during transportation. The defect rate index is set to 0.0002%.

[0086] In addition, the foreign matter source "tool Y" refers to a tool with foreign matter attached. For example, when a sub-component is fixed to a parent component with an inadequately treated wrench, the wrench is equivalent to tool Y. Regarding such a wrench, it is not assumed that it will come into contact with the component, but it is assumed that the wrench will pass over the parent component during transportation. The defect rate index is set to 0.0005%.

[0087] In addition, the definitions of foreign matter sources and defect rate index are described, but the present disclosure is not limited to this. Other foreign matter sources and defect rate indexes can also be used. The cases of "contact" and "overhead" are described as given positional relationships, but the defect rate index can also be defined by other positional relationships. In addition, with respect to parts and tools, in addition to screws and wrenches, parts and tools used in assembly operations can also be used.

[0088] Figure 7 301 is a diagram showing an example of the foreign matter defect rate table 111 . The foreign matter defect rate table 111 is information displayed in the result display unit 301 .

[0089] The foreign matter defect rate table 111 shows the result of calculating the relationship between the evaluation surface and the defect rate for each assembly process. The evaluation surface indicates the surface of the component that determines that the positional relationship between the foreign matter and the component is in contact or located above. In the assembly process of ID0-0, the foreign matter defect rate is calculated to be 0.050 on the evaluation surface CA01, and the foreign matter defect rate is calculated to be 0.005 on the evaluation surface CB01. In addition, in the assembly process of ID0-1, the foreign matter defect rate is calculated to be 0.052 on the evaluation surface CB01.

[0090] The defect rate calculation unit 5 adds or multiplies the foreign matter defect rates of each evaluation surface for the same assembly process. In the process of ID0-1, the evaluation surface is CB01, and the foreign matter defect rate of evaluation surface CB01, 0.052%, is recorded as the foreign matter defect rate of the second assembly process of ID0-1 in the item "Total". In this way, by calculating the foreign matter defect rate focusing on the assembly process, the assembly work can be analyzed for each assembly process, thereby evaluating the generation of foreign matter.

[0091] In addition, the defect rate calculation unit 5 adds or multiplies the foreign matter defect rates of each evaluation surface in the assembly operation with respect to the same evaluation surface. The total column of the evaluation surface CA01 shows a defect rate of 0.130%, and the total column of the evaluation surface CB01 shows a defect rate of 0.22%. In this way, by calculating the foreign matter defect rate focusing on the evaluation surface, the parts with the highest risk of foreign matter adhesion in the assembly operation can be extracted, and can be effectively used to improve the operation action.

[0092] Here, reference Figure 5 The relative position information 104 shown in (a) and Figure 6The foreign matter defect rate DB7 shown in FIG. 7 is used to illustrate a specific example of calculating the foreign matter defect rate. Figure 5 As shown in (a), there are face 1045 and hand 1041 as foreign matter sources.

[0093] Regarding the subcomponent 1043, the hand 1041 is in contact with the upper surface (the surface in the direction perpendicular to the gravity direction). In addition, the face 1045 is located in the air. Therefore, regarding the upper surface of the subcomponent 1043, the foreign matter defect rate is calculated as 0.050% (defect rate index when the hand is in contact) + 0.002% (defect rate index when the face is located in the air) = 0.052%.

[0094] In addition, regarding the mother component 1044, the hand 1041 and the face 1045 are located on the bottom surface (the surface in the direction perpendicular to the gravity direction). Therefore, regarding the bottom surface of the mother component 1044, the foreign matter defect rate is calculated as 0.002% (defect rate index when the face is located in the air) + 0.005% (defect rate when the hand is located in the air) = 0.007%.

[0095] In addition, the addition of defect rate index and the multiplication of defect rate index can be set appropriately. For example, on the basis of configuring the sub-component to the parent component by performing a downward action (insertion action), the sub-component is turned and fixed in the insertion groove. In such a case, if there is a correlation between the operation actions, consider multiplying the defect rate index between the operation actions to evaluate the risk of foreign matter adhesion. In addition, in the case of an operation with a large impact on the generation of foreign matter, it is also possible to add the defect rate index based on multiplying the weight.

[0096] (Priority of countermeasures)

[0097] The countermeasure display unit 302 displays the countermeasure policies for the workers in order of priority. Figure 8 The following describes how to set the priority.

[0098] Figure 8 1 is a diagram showing a method of extracting countermeasure policies from the foreign matter defect rate table 111. The defect rate calculation unit 5 assigns priorities to assembly processes included in assembly sequence information based on the foreign matter defect rate and extracts assembly processes to be improved.

[0099] Figure 8(a) is a diagram illustrating the first extraction method. The first extraction method is a method that focuses on the work actions that affect the defect rate. The defect rate calculation unit 5 extracts the ID associated with the unit with the largest foreign matter defect rate from the table of evaluation surfaces and IDs in the foreign matter defect rate table 111 (displayed with oblique lines). The defect rate calculation unit 5 obtains the component name and action corresponding to the ID extracted with reference to the assembly sequence information 101, and further obtains the evaluation surface corresponding to the ID extracted with reference to the evaluation surface information 103. The defect rate calculation unit 5 displays the obtained component name, action, and evaluation surface on the countermeasure display unit 302.

[0100] Figure 8 (b) is a diagram illustrating the second extraction method. The second extraction method is a method that focuses on the evaluation surface that affects the defective rate. The defective rate calculation unit 5 extracts the evaluation surface associated with the unit with the largest defective rate from the column of the total value of the foreign matter defective rate calculated for each evaluation surface in the foreign matter defective rate table 111 (displayed with oblique lines). The defective rate calculation unit 5 extracts the ID with the largest foreign matter defective rate from the column of the extracted evaluation surfaces and IDs. The defective rate calculation unit 5 obtains the component name and action corresponding to the ID extracted with reference to the assembly sequence information 101, and further obtains the evaluation surface corresponding to the ID extracted with reference to the evaluation surface information 103. The defective rate calculation unit 5 displays the obtained component name, action, and evaluation surface on the countermeasure display unit 302.

[0101] Figure 8 (c) is a diagram illustrating the third extraction method. The third extraction method is a method that focuses on the assembly process that affects the defective rate. The defective rate calculation unit 5 extracts the ID associated with the unit with the largest defective rate from the column (displayed with oblique lines) of the total value of the foreign matter defective rate calculated for each ID in the foreign matter defective rate table 111. The defective rate calculation unit 5 extracts the evaluation surface with the largest foreign matter defective rate from the rows of the extracted ID and evaluation surface. The defective rate calculation unit 5 obtains the component name and action corresponding to the ID extracted with reference to the assembly sequence information 101. The defective rate calculation unit 5 displays the extracted evaluation surface, the obtained component name and the action on the countermeasure display unit 302.

[0102] In this way, since the factors that have a greater impact on the foreign matter defect rate are extracted from three viewpoints: work action, evaluation surface, and assembly process, it is possible to display work guidelines such as work instructions that reduce the risk of foreign matter adhesion when designing assembly work.

[0103] (Function, Effect)

[0104] As described above, according to the present disclosure, by setting information such as operation actions and foreign matter sources, the foreign matter defect rate can be estimated, the risk of foreign matter adhesion can be reduced, and assembly operations can be designed to minimize the maintenance operation time of semiconductor processing equipment.

[0105] As mentioned above, although embodiment of this invention is described, this invention is not limited to the said embodiment, Various changes can be made within the range which does not deviate from the summary of this invention.

[0106] The following description is an example of a method that can be used to implement the present invention, but the present invention is not limited thereto.

[0107] (Method 1)

[0108] An evaluation device for evaluating an assembly operation of a processing device composed of a plurality of components, the evaluation device being characterized in that the evaluation device comprises a calculation function unit and a defect rate calculation unit, the calculation function unit obtaining gravity information indicating a direction in which gravity acts, obtaining assembly sequence information indicating operations performed on each of the plurality of components and an assembly sequence for each process (hereinafter referred to as "assembly process") included in the assembly operation, obtaining operation action information indicating operation actions of operators performed in the assembly process, obtaining evaluation surface information indicating evaluation surfaces of each of the plurality of components, obtaining relative position information indicating a positional relationship between a foreign matter source in the assembly process and the components, the defect rate calculation unit calculating a foreign matter defect rate indicating a risk of foreign matter generated from the foreign matter source being attached to each of the evaluation surfaces through the operation based on the gravity information, the assembly sequence information, the operation action information and the relative position information.

[0109] (Method 2)

[0110] According to the evaluation device described in aspect 1, the work movement information is time series data representing the positional relationship in the assembly process and segmented into given time widths.

[0111] (Method 3)

[0112] The evaluation device according to aspect 1 or 2 is characterized in that the evaluation surface is a surface that requires a given degree of cleanliness, that is, a cleaned surface.

[0113] (Method 4)

[0114] The evaluation device according to any one of aspects 1 to 3 is characterized in that the calculation function unit extracts the cleaning surface based on shape data of the processing device in a state of being assembled and a cleaning surface determination condition that is a condition for determining the cleaning surface.

[0115] (Method 5)

[0116] The evaluation device according to any one of aspects 1 to 4 is characterized by further comprising: a database defining a defect rate index for each of the positional relationships, wherein the defect rate calculation unit calculates the foreign matter defect rate based on the defect rate index.

[0117] (Method 6)

[0118] According to the evaluation device described in any one of aspects 1 to 5, the defect rate calculation unit determines whether the positional relationship is a given positional relationship or a positional relationship other than the given positional relationship.

[0119] (Method 7)

[0120] The evaluation device according to any one of aspects 1 to 6 is characterized in that ray tracing for determining whether a straight line extending perpendicularly from the evaluation surface of the component collides with the foreign matter source is used in determining the predetermined positional relationship.

[0121] (Method 8)

[0122] The evaluation device according to any one of aspects 1 to 7 is characterized in that the defect rate calculation unit adds or multiplies the foreign matter defect rates of each of the evaluation surfaces with respect to the same assembly process.

[0123] (Method 9)

[0124] The evaluation device according to any one of aspects 1 to 8 is characterized in that the defect rate calculation unit adds or multiplies the foreign matter defect rates of each of the evaluation surfaces in the assembly operation with respect to the same evaluation surface.

[0125] (Method 10)

[0126] The evaluation device according to any one of aspects 1 to 9 is characterized in that the defect rate calculation unit prioritizes and extracts assembly processes to be improved from assembly processes included in the assembly sequence information based on the foreign matter defect rate.

[0127] (Method 11)

[0128] An evaluation method for evaluating an assembly operation of a processing device composed of multiple components, the evaluation method is characterized in that gravity information indicating the direction in which gravity acts is obtained, assembly sequence information indicating the operations performed on each of the multiple components and the assembly sequence is obtained for each process (hereinafter referred to as "assembly process") included in the assembly operation, work action information indicating the work actions of operators performed in the assembly process, evaluation surface information indicating the evaluation surfaces of each of the multiple components, relative position information indicating the positional relationship between a foreign matter source in the assembly process and the components is obtained, and a foreign matter defect rate indicating the risk of foreign matter generated from the foreign matter source being attached to each of the evaluation surfaces through the work action is calculated based on the gravity information, the assembly sequence information, the work action information and the relative position information.

[0129] Description of Reference Numerals

[0130] 1: Evaluation device, 2: Input I / F, 3: Output I / F, 4: Calculation function unit, 5: Defect rate calculation unit, 6: Storage unit, 61: Gravity information storage unit, 62: Gravity information storage unit, 63: Assembly sequence information storage unit, 64: Operation motion information storage unit, 65: Evaluation surface information storage unit, 66: Relative position information storage unit, 67: Foreign matter defect rate table storage unit, 101: Assembly sequence information, 102: Operation motion information, 103: Evaluation surface information, 104: Relative position information, 105 : Gravity information, 111: Foreign matter defect rate table, 201: Assembly sequence input unit, 202: Operation action input unit, 203: Evaluation surface input unit, 204: Relative position display unit, 205: Gravity direction display unit, 206: Defect rate setting unit, 207: Gravity input unit, 301: Result display unit, 302: Countermeasure display unit, 1021: Name column, 1041: Hand, 1042: Evaluation surface, 1043: Sub-component, 1044: Parent component, 1045: Face, 1046: Workbench.

Claims

1. An evaluation device for evaluating an assembly operation of a processing device composed of a plurality of components, wherein the evaluation device is characterized in that: The evaluation device includes a calculation function unit and a defect rate calculation unit. The computing function unit performs the following processing: Get the gravity information indicating the direction in which gravity acts. Acquiring assembly sequence information indicating operations to be performed on each of the plurality of components and the assembly sequence for each step (hereinafter referred to as “assembly step”) included in the assembly operation, obtaining work action information indicating work actions of workers performed in the assembly process, obtaining evaluation surface information indicating evaluation surfaces of each of the plurality of components, acquiring relative position information indicating a positional relationship between a foreign matter source and the component in the assembly process, The defect rate calculation unit calculates a foreign matter defect rate indicating a risk that foreign matter generated from the foreign matter source will adhere to each of the evaluation surfaces due to the work action, based on the gravity information, the assembly sequence information, the work action information, and the relative position information.

2. The evaluation device according to claim 1, wherein: The work movement information is time-series data that represents the positional relationship in the assembly process and is segmented into given time widths.

3. The evaluation device according to claim 1, wherein: The evaluation surface is a surface that requires a given degree of cleanliness, that is, a cleaned surface.

4. The evaluation device according to claim 3, wherein: The calculation function unit extracts the cleaning surface based on shape data of the processing device in a state in which the processing device is in the process of being assembled and a cleaning surface determination condition that is a condition for determining the cleaning surface.

5. The evaluation device according to claim 1, wherein: The evaluation device further includes: a database defining a defect rate index for each of the positional relationships; The defect rate calculation unit calculates a foreign matter defect rate for each of the evaluation surfaces based on the defect rate index.

6. The evaluation device according to claim 5, wherein: The defect rate calculation unit determines whether the positional relationship is a predetermined positional relationship or a positional relationship other than the predetermined positional relationship.

7. The evaluation device according to claim 6, wherein: The determination of the predetermined positional relationship uses ray tracing for determining whether a straight line extending perpendicularly from the evaluation surface of the component collides with the foreign matter source.

8. The evaluation device according to claim 1, wherein: The defect rate calculation unit adds or multiplies the foreign matter defect rates of each of the evaluation surfaces for the same assembly process.

9. The evaluation device according to claim 1, wherein: The defect rate calculation unit adds or multiplies foreign matter defect rates for each of the evaluation surfaces in the assembly work with respect to the same evaluation surface.

10. The evaluation device according to claim 1, wherein: The defect rate calculation unit prioritizes and extracts assembly processes to be improved from assembly processes included in the assembly sequence information based on the foreign matter defect rate.

11. An evaluation method for evaluating an assembly operation of a processing device composed of a plurality of components, wherein: Get the gravity information indicating the direction in which gravity acts. Acquiring assembly sequence information indicating operations to be performed on each of the plurality of components and the assembly sequence for each step (hereinafter referred to as “assembly step”) included in the assembly operation, obtaining work action information indicating work actions of workers performed in the assembly process, obtaining evaluation surface information indicating evaluation surfaces of each of the plurality of components, acquiring relative position information indicating a positional relationship between a foreign matter source and the component in the assembly process, A foreign matter defect rate indicating a risk that foreign matter generated from the foreign matter source will adhere to each of the evaluation surfaces due to the work action is calculated based on the gravity information, the assembly sequence information, the work action information, and the relative position information.

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