Electronic component and mounting structure for electronic component

Abstract

The invention provides an electronic component capable of suppressing generation of cracks and a mounting structure of the electronic component. The present invention is provided with: a component main body (10) having a longitudinal direction (L); and a first external electrode (21) and a second external electrode (22), which are a pair of external electrodes (20), respectively disposed at both ends of the component main body (10) in the longitudinal direction (L). The component main body (10) has, in at least a portion of a portion exposed between the pair of external electrodes (20), a central outer peripheral portion (30) as a protruding portion that protrudes further outward than the pair of external electrodes (20) in one direction orthogonal to the longitudinal direction (L).

Description

Technical Field

[0001] The present invention relates to an electronic component and a mounting structure of the electronic component. Background Art

[0002] In the past, as an electronic component with a two-terminal structure, a laminated ceramic capacitor is known, in which external electrodes are arranged at both ends of a rectangular parallelepiped body in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately laminated. The laminated ceramic capacitor is mounted on a substrate having a circuit by connecting the external electrodes to a pair of connection pads provided on the substrate by welding (see Patent Document 1, etc.). Generally speaking, in a laminated ceramic capacitor, as shown in Patent Document 1, the external electrodes protrude toward the substrate side below the body. Therefore, the structure is such that the external electrodes are in contact with the connection pads, and a space is left between the surface of the substrate and the body.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2014-86606 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] When conventional multilayer ceramic capacitors are mounted on a substrate as described above, it is difficult for solder to penetrate between the connection pad and the external electrode, and it is difficult to provide a sufficient amount of solder between the connection pad and the external electrode. If the amount of solder in this portion is insufficient, if the substrate is bent, stress is likely to concentrate on the edge of the portion of the external electrode extending toward the main body, and cracks may occur in the main body starting from this portion, so there is room for improvement.

[0008] Therefore, an object of the present invention is to provide an electronic component and an electronic component mounting structure capable of suppressing the occurrence of cracks.

[0009] Technical solutions to solve problems

[0010] The electronic component of the present invention comprises: a component body having a length direction; and a pair of external electrodes, respectively arranged at both ends of the component body in the length direction, wherein at least a portion of the component body exposed between the pair of external electrodes has a protrusion that protrudes outwardly than the pair of external electrodes in a direction orthogonal to the length direction.

[0011] The mounting structure of the electronic component of the present invention connects a pair of external electrodes of the electronic component to a pair of connection pads arranged separately from each other on the surface of the substrate. In the mounting structure of the electronic component, the electronic component has a component body and the pair of external electrodes arranged on the component body, the component body is connected to the substrate, and there is a gap between each of the pair of external electrodes and the substrate.

[0012] Effects of the Invention

[0013] According to the present invention, it is possible to provide an electronic component and an electronic component mounting structure capable of suppressing the occurrence of cracks. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic perspective view of a multilayer ceramic capacitor according to an embodiment.

[0015] Figure 2 yes Figure 1 View in direction II.

[0016] Figure 3 yes Figure 1 View in direction III.

[0017] Figure 4 yes Figure 2 IV-IV cross-sectional view.

[0018] Figure 5 yes Figure 3 VV cross-sectional view.

[0019] Figure 6 1 is a diagram schematically showing an example of a method for manufacturing a multilayer ceramic capacitor according to an embodiment, and shows steps in the order of (a) to (d).

[0020] Figure 7 It is a plan view showing the mounting structure according to the embodiment.

[0021] Figure 8 yes Figure 7 VIII-VIII sectional view of the invention.

[0022] Fig. 9 yes Figure 8 Enlarged view of part IX.

[0023] Fig.10 is a diagram showing a conventional installation structure. Fig. 9 The corresponding figure.

[0024] Fig.11 is a cross-sectional view of WT showing a modified example of the multilayer ceramic capacitor according to the embodiment, and is similar to Figure 5 The corresponding figure. DETAILED DESCRIPTION

[0025] Hereinafter, embodiments will be described with reference to the drawings. Figure 1 It is a schematic perspective view of a multilayer ceramic capacitor 1 as an electronic component according to the embodiment. Figure 2 yes Figure 1 View in direction II. Figure 3 yes Figure 1 View in direction III. Figure 4 yes Figure 2 IV-IV cross-sectional view. Figure 5 yes Figure 3 VV cross-sectional view.

[0026] like Figure 1 As shown in FIG. 1 , the multilayer ceramic capacitor 1 of the embodiment has a substantially rectangular parallelepiped shape as a whole. The multilayer ceramic capacitor 1 includes a component body 10 and a pair of external electrodes 20 disposed on the component body 10 so as to be separated from each other.

[0027] like Figure 2 as well as Figure 3 As shown, the component body 10 includes a main body portion 11 and a central peripheral portion 30 provided on the main body portion 11 .

[0028] exist Figure 1 to Figure 3 In FIG. 1 , arrow L indicates the length direction of the multilayer ceramic capacitor 1 and the main body 11. Figure 1 as well as Figure 2 In FIG. 1 , arrow W indicates the width direction of the multilayer ceramic capacitor 1 and the main body 11, which is perpendicular to the longitudinal direction. Figure 1 as well as Figure 3 In FIG. 1 , an arrow T indicates a stacking direction of the multilayer ceramic capacitor 1 and the body portion 11 that is orthogonal to the length direction L and the width direction W. The stacking direction T corresponds to a thickness direction of the multilayer ceramic capacitor 1 and the body portion 11 . Figure 4 The cross-sectional view shown shows a cross section taken along the longitudinal direction L and the stacking direction T at the center of the multilayer ceramic capacitor 1 in the width direction W. The cross section taken along the longitudinal direction L and the stacking direction T is shown in FIG. Figure 5 The cross-sectional view shown shows a WT cross section at the center in the longitudinal direction L of the multilayer ceramic capacitor 1 . The WT cross section is a cross section along the width direction W and the stacking direction T.

[0029] Examples of the dimensions of the multilayer ceramic capacitor 1 include, but are not limited to, 0.2 mm to 1.2 mm in the length direction L, 0.1 mm to 0.7 mm in the width direction W, and 0.1 mm to 0.7 mm in the stacking direction T.

[0030] like Figure 1 to Figure 3As shown, the pair of external electrodes 20 includes a first external electrode 21 disposed at one end portion in the length direction L of the main body 11 and a second external electrode 22 disposed at the other end portion in the length direction L of the main body 11. In the following description, when the first external electrode 21 and the second external electrode 22 having the same structure are not distinguished, both are sometimes referred to as simply the external electrode 20.

[0031] like Figure 4 As shown, the first external electrode 21 and the second external electrode 22 are both composed of a laminated film of a sintered metal layer 20a and a plating layer 20b. The sintered metal layer 20a is formed by, for example, sintering a paste of Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc. The plating layer 20b includes, for example, a Ni plating layer and a Sn plating layer covering the Ni plating layer. Alternatively, the plating layer 20b may be a Cu plating layer or an Au plating layer. In addition, the external electrode 20 may be composed of only a plating layer, and may also be formed using a conductive resin paste.

[0032] like Figure 2 as well as Figure 5 As shown, the main body 11 includes a laminate 12 and a pair of side dielectric ceramic layers 15 covering the side surfaces of the laminate 12 on both sides in the width direction.

[0033] The laminate 12 includes a plurality of dielectric ceramic layers 13 and internal electrode layers 14 serving as internal electrodes alternately laminated in a lamination direction T. The laminate 12 has a lamination direction T, a length direction L, and a width direction W which are the same directions as the laminated ceramic capacitor 1 and the body 11 .

[0034] The dielectric ceramic layer 13 and the side dielectric ceramic layer 15 are formed by, for example, firing a ceramic material containing barium titanate as a main component. The dielectric ceramic layer 13 and the side dielectric ceramic layer 15 may also be formed of other ceramic materials with a high dielectric constant (for example, a ceramic material containing CaTiO3, SrTiO3, CaZrO3, etc. as a main component). The ceramic material forming the dielectric ceramic layer 13 and the side dielectric ceramic layer 15 may contain additives such as Si, Mg, Mn, Sn, Cu, rare earths, Ni, and Al for the purpose of adjusting the composition. The dielectric ceramic layer 13 and the side dielectric ceramic layer 15 may be formed of the same material from among the ceramic materials described above, or may be formed of different materials.

[0035] The internal electrode layer 14 is formed of a metal material represented by, for example, Ni, Cu, Ag, Pd, Ag-Pd alloy, Au, etc. The internal electrode layer 14 is not limited to these metal materials, and may be formed of other conductive materials.

[0036] like Figure 4As shown, one of a pair of internal electrode layers 14 adjacent to each other with a dielectric ceramic layer 13 sandwiched therebetween in the stacking direction T is electrically connected to the first external electrode 21, and the other is electrically connected to the second external electrode 22. Thus, a structure is formed in which a plurality of capacitor elements are electrically connected in parallel between the first external electrode 21 and the second external electrode 22.

[0037] like Figure 4 as well as Figure 5 As shown, the dielectric ceramic layer 13 includes: a plurality of first dielectric ceramic layers 13a sandwiched between internal electrode layers 14; and a pair of second dielectric ceramic layers 13b arranged at both ends in the stacking direction T and having a thickness greater than that of the first dielectric ceramic layers 13a.

[0038] like Figure 4 as well as Figure 5 As shown, the laminate 12 includes an inner layer portion 12A in which a plurality of internal electrode layers 14 are opposed to each other with the first dielectric ceramic layer 13a interposed therebetween, and a pair of outer layer portions 12B disposed to sandwich the inner layer portion 12A in the stacking direction. That is, in the inner layer portion 12A, a plurality of internal electrode layers 14 are alternately stacked with the first dielectric ceramic layer 13a interposed therebetween.

[0039] like Figure 3 to Figure 5 As shown in FIG. 1 , the stacked body 12 has a first main surface 17a1 and a second main surface 17a2 that are opposite to each other in the stacking direction T. Figure 2 as well as Figure 5 As shown in FIG. 1 , the stacked body 12 has a first side surface 17b1 and a second side surface 17b2 that are opposite to each other in the width direction W. Figure 2 to Figure 4 As shown, the laminate 12 has a first end face 17c1 and a second end face 17c2 that are opposed to each other in the longitudinal direction L. The first external electrode 21 is arranged on the first end face 17c1, and the second external electrode 22 is arranged on the second end face 17c2.

[0040] like Figure 2 as well as Figure 5 As shown in FIG. 1 , side dielectric ceramic layers 15 are respectively arranged on the first side surface 17b1 and the second side surface 17b2 of the stacked body 12. The pair of side dielectric ceramic layers 15 includes a first side dielectric ceramic layer 15A covering the first side surface 17b1 and a second side dielectric ceramic layer 15B covering the second side surface 17b2. In the following description, when the first side dielectric ceramic layer 15A and the second side dielectric ceramic layer 15B having the same structure are not distinguished, both are sometimes referred to as simply the side dielectric ceramic layer 15.

[0041] The first side dielectric ceramic layer 15A has a third side surface 15a constituting one side surface of the main body 11. The second side dielectric ceramic layer 15B has a fourth side surface 15b constituting the other side surface of the main body 11. The third side surface 15a and the fourth side surface 15b are opposed to each other in the width direction W as a pair. In addition, the pair of surfaces of the main body 11 that are opposed to each other in the stacking direction T are the same as the first main surface 17a1 and the second main surface 17a2 of the stacked body 12. Therefore, hereinafter, the first main surface 17a1 and the second main surface 17a2 of the stacked body 12 are sometimes referred to as the first main surface 17a1 and the second main surface 17a2 of the main body 11.

[0042] As described above, the first end surface 17c1 is provided with the first external electrode 21, and the second end surface 17c2 is provided with the second external electrode 22. The first external electrode 21 is formed to cover the entire surface of the first end surface 17c1 and to extend over four surfaces, namely, the first main surface 17a1 and the second main surface 17a2 facing each other, and the first side surface 17b1 and the second side surface 17b2 facing each other.

[0043] like Figure 2 to Figure 4 As shown, the first external electrode 21 includes an end surface portion 21a covering the entire surface of the first end surface 17c1, and a square cylindrical bent portion 21b bent from the periphery of the end surface portion 21a to the inside in the length direction L and covering a portion of each of the first main surface 17a1 and the second main surface 17a2 of the main body portion 11, and the third side surface 15a and the fourth side surface 15b of the main body portion 11. Similarly, the second external electrode 22 includes an end surface portion 22a covering the entire surface of the second end surface 17c2, and a square cylindrical bent portion 22b bent from the periphery of the end surface portion 22a to the inside in the length direction L and covering a portion of each of the first main surface 17a1 and the second main surface 17a2 of the main body portion 11, and the third side surface 15a and the fourth side surface 15b of the main body portion 11.

[0044] The central peripheral portion 30 is a portion exposed between the pair of external electrodes 20. The central peripheral portion 30 of the embodiment covers the outer peripheral surface of the main body 11 between the pair of external electrodes 20 (that is, a total of four surfaces, namely, the first main surface 17a1 and the second main surface 17a2, the third side surface 15a and the fourth side surface 15b between the pair of external electrodes 20). That is, the central peripheral portion 30 is provided in the entire outer peripheral area of ​​the component body 10.

[0045] The thickness of the central peripheral portion 30 of the main body 11 covering the first and second main surfaces 17a1, 17a2, the third and fourth side surfaces 15a, 15b (i.e., the dimension from the surface of the first and second main surfaces 17a1, 17a2, the third and fourth side surfaces 15a, 15b to the surface of the central peripheral portion 30) is greater than the film thickness of the bent portions 21b and 22b of the external electrode 20. Therefore, the central peripheral portion 30 protrudes outward in the stacking direction T and outward in the width direction W than the bent portions 21b and 22b.

[0046] The central peripheral portion 30 includes a first protrusion 31 covering the first main surface 17a1, a second protrusion 32 covering the second main surface 17a2, a third protrusion 33 covering the third side surface 15a, and a fourth protrusion 34 covering the fourth side surface 15b between the pair of external electrodes 20. The first protrusion 31 and the second protrusion 32 protrude outward from the surfaces of the bent portions 21b and 22b of the external electrode 20 in the stacking direction T orthogonal to the length direction L. The third protrusion 33 and the fourth protrusion 34 protrude outward from the surfaces of the bent portions 21b and 22b of the external electrode 20 in the width direction W orthogonal to the length direction L. The stacking direction T and the width direction W are each a direction orthogonal to the length direction. The central peripheral portion 30 including the first protrusion 31 , the second protrusion 32 , the third protrusion 33 , and the fourth protrusion 34 is an example of a protrusion that protrudes outward from the external electrode 20 in one direction orthogonal to the longitudinal direction L.

[0047] like Figure 3 As shown, the first protrusion 31 and the second protrusion 32 protrude outward in the stacking direction T by a dimension H from the surfaces of the bent portion 21b of the first external electrode 21 and the bent portion 22b of the second external electrode 22, respectively. Figure 2 As shown, the third protrusion 33 and the fourth protrusion 34 protrude outward by a dimension H from the surfaces of the bent portion 21 b of the first external electrode 21 and the bent portion 22 b of the second external electrode 22 in the width direction W. Here, each dimension H is preferably 15 μm or more.

[0048] The surface of the first protrusion 31 is flat and substantially parallel to the first main surface 17a1. The surface of the second protrusion 32 is flat and substantially parallel to the second main surface 17a2. The surface of the third protrusion 33 is flat and substantially parallel to the third side surface 15a. The surface of the fourth protrusion 34 is flat and substantially parallel to the fourth side surface 15b.

[0049] The central peripheral portion 30 can be formed of at least one material selected from ceramic and resin on the surface of the main body 11. When the central peripheral portion 30 is ceramic, it can be the same ceramic material as the dielectric ceramic layer 13 or the side dielectric ceramic layer 15. When the central peripheral portion 30 is formed of resin, for example, a synthetic resin such as epoxy resin or acrylic resin can be used.

[0050] Here, refer to Figure 6 An example of a method for manufacturing the multilayer ceramic capacitor 1 according to the embodiment will be briefly described. Figure 6 , the steps involved in the method of manufacturing the multilayer ceramic capacitor 1 are schematically shown in the order of (a) to (d). In this case, the central peripheral portion 30 is formed of ceramic.

[0051] First, if Figure 6 As shown in (a), the main body 11 is manufactured. The main body 11 can be manufactured, for example, by stacking ceramic materials such as ceramic green sheets to become the dielectric ceramic layer 13 and conductive materials such as conductive paste to become the internal electrode layer 14 to form a laminate 12, and then, a ceramic material such as ceramic green sheets to become the side dielectric ceramic layer 15 is adhered to the first side surface 17b1 and the second side surface 17b2 of the laminate 12. Figure 6 As shown in (b), a ceramic material such as a ceramic green sheet to be the central peripheral portion 30 is adhered to the main body 11. Thus, the component body 10 before firing is manufactured. Next, the component body 10 is fired to manufacture Figure 6 The fired component body 10 is shown in (c). Next, Figure 6 As shown in (d), external electrodes 20 are formed at both ends of the main body 11 in the longitudinal direction L. When the central peripheral portion 30 is formed of the same ceramic material as the laminate 12 and the side dielectric ceramic layers 15 , the central peripheral portion 30 is integrated with the main body 11 .

[0052] When the central peripheral portion 30 is formed of the above-mentioned resin, the central peripheral portion 30 can be formed in the following manner, that is, after the external electrodes 20 are formed, for example, a liquid resin material is injected into the outer peripheral surface of the main body 11 between the external electrodes 20 using an appropriate fixture for coating, and the coated resin material is cured.

[0053] Next, a mounting structure of the multilayer ceramic capacitor 1 according to the embodiment will be described. Figure 7 It is a plan view showing the mounting structure according to the embodiment. Figure 8 yes Figure 7 In the mounting structure according to the embodiment, the multilayer ceramic capacitor 1 is mounted on the substrate 50 .

[0054] like Figure 7 as well as Figure 8 As shown, the mounting structure according to the embodiment is a structure in which a pair of external electrodes 20 of the multilayer ceramic capacitor 1 are connected to first lands 61 and second lands 62 as lands disposed on the surface of a substrate 50 so as to be separated from each other.

[0055] The substrate 50 is formed into a sheet of a material including an insulating material such as resin, glass, glass epoxy, phenol paper, ceramic, etc. The area on the surface of the substrate 50 that needs to be insulated is covered with a barrier film. The multilayer ceramic capacitor 1 is mounted on the substrate 50 in such a manner that the length direction L is aligned with the substrate 50. Figure 7 as well as Figure 8 The X direction shown is substantially parallel, and the width direction W is substantially parallel to the Y direction orthogonal to the X direction. Figure 7 In FIG. 5 , both the X direction and the Y direction are plane directions along the surface of the substrate 50. Figure 7 In FIG. 1 , the length direction L and the width direction W of the multilayer ceramic capacitor 1 are described together. Figure 8 , the longitudinal direction L and the stacking direction T of the multilayer ceramic capacitor 1 are also described. Figure 8 Z represents the up-down direction orthogonal to the X direction and the Y direction.

[0056] In addition, as for the substrate 50, a substrate using glass or paper fibers as a base material may be used. The fibers constituting the base material may have a fiber direction extending in one direction. In the case where the substrate 50 has a fiber direction extending in one direction, in the embodiment, it is preferable to set the mounting position of the multilayer ceramic capacitor 1 so that the fiber direction is in the direction of the fiber. Figure 7 as well as Figure 8 That is, the multilayer ceramic capacitor 1 is preferably arranged so that the direction in which the pair of external electrodes 20 are separated from each other is parallel to the fiber direction of the substrate 50. Arranged in parallel means that the two directions form an angle of not less than -5° and less than +5°.

[0057] The first connection pad 61 and the second connection pad 62 are arranged to be separated from each other in the X direction. The first connection pad 61 and the second connection pad 62 are both rectangular in a plan view and have the same size. A separation portion 51 covered with a barrier film is provided between the first connection pad 61 and the second connection pad 62. The first connection pad 61 and the second connection pad 62 are arranged to be separated in the X direction with the separation portion 51 sandwiched therebetween so that the positions in the Y direction are the same as each other.

[0058] In the multilayer ceramic capacitor 1, the bent portion 21b of the first external electrode 21 is connected to the first connection pad 61, and the bent portion 22b of the second external electrode 22 is connected to the second connection pad 62. Figure 8As shown, the first connection bent portion 21b1 of the first bent portion 21b, which is a portion covering the second main surface 17a2 of the main body 11, is connected to the first connection pad 61, and the second connection bent portion 22b1 of the second bent portion 22b, which is a portion covering the second main surface 17a2 of the main body 11, is connected to the second connection pad 62. In addition, the connection portion of the first external electrode 21 and the second external electrode 22 to the substrate 50 may also be the portion of the bent portion 21b and the bent portion 22b covering the first main surface 17a1. Furthermore, the connection portion of the first external electrode 21 and the second external electrode 22 to the substrate 50 may be the portion of the bent portion 21b and the bent portion 22b covering the first side surface 17b1, or the portion covering the second side surface 17b2.

[0059] The first land 61 and the second land 62 are connected to wirings (not shown) formed on the substrate 50. The first land 61 and the second land 62 are provided at the ends of the wirings. That is, the wirings are discontinuous with the separation portion 51 sandwiched therebetween, and the multilayer ceramic capacitor 1 is connected to the first land 61 and the second land 62 to be conductive.

[0060] The first land 61, the second land 62 and the above wiring are preferably formed of a highly conductive metal, and can be formed, for example, by forming a Cu film on the surface of the substrate 50. Alternatively, Ag, Au, or the like may be used as the highly conductive metal.

[0061] In the installation configuration of the embodiment, as Figure 8 As shown, the second protrusion 32 of the central peripheral portion 30 of the multilayer ceramic capacitor 1 is disposed on the surface of the separation portion 51 of the substrate 50 and is in contact therewith. The second protrusion 32 is a portion covering the second main surface 17a2 of the main body 11. The surface of the second protrusion 32 in contact with the surface of the substrate 50 is flat and substantially parallel to the second main surface 17a2. Therefore, the multilayer ceramic capacitor 1 can be disposed on the substrate 50 in a stable posture. The first connection bend portion 21b1 of the first external electrode 21 is opposite to the first connection pad 61 of the substrate 50, and the second connection bend portion 22b1 of the second external electrode 22 is opposite to the second connection pad 62 of the substrate 50.

[0062] The second protrusion 32 is disposed farther from the first connection bent portion 21b1 and the second connection bent portion 22b1 on both sides in the longitudinal direction L. Figure 8Therefore, in the multilayer ceramic capacitor 1 in which the second protrusion 32 is provided in the separation portion 51, there is a gap G between the first connection bend portion 21b1 and the first connection land 61 and between the second connection bend portion 22b1 and the second connection land 62. That is, the first external electrode 21 and the second external electrode 22 are in a state of floating from the surface of the substrate 50. The gap G is Figure 3 In the central peripheral portion 30 shown, the protrusions from the first bent portion 21b and the second bent portion 22b have the same dimension H. That is, the gap G is preferably 15 μm or more.

[0063] In the above-described arrangement, the multilayer ceramic capacitor 1 is mounted on the substrate 50. For mounting on the substrate 50, the first external electrode 21 is soldered to the first connection land 61, and the second external electrode 22 is soldered to the second connection land 62. Figure 7 as well as Figure 8 As shown, the first external electrode 21 and the first land 61 , and the second external electrode 22 and the second land 62 are electrically connected via solder 70 .

[0064] Fig. 9 yes Figure 8 IX is an enlarged view of the portion shown in FIG. Fig. 9 As shown, the solder 70 fills the gap G between the first connection bent portion 21 b 1 of the first external electrode 21 and the first land 61 , and is provided so as to extend from the gap G to the end surface portion 21 a of the first external electrode 21 .

[0065] Here, Fig.10 is a diagram showing a state where a conventional multilayer ceramic capacitor is mounted on a substrate 50, and Fig. 9 The corresponding part. Fig.10 In the embodiment, the same reference numerals are used for the components corresponding to those in the embodiment. Fig.10As shown in FIG. 1 , in the conventional multilayer ceramic capacitor, the first external electrode 21 protrudes downward from the main body 11 of the component body 10, so the first external electrode 21 contacts the first land 61. Therefore, when the multilayer ceramic capacitor is set on the substrate 50, there is no gap G between the first external electrode 21 and the first land 61 as in the embodiment. Therefore, when soldering is performed, it is difficult for the solder 70 to penetrate between the first external electrode 21 and the first land 61, and it is difficult to make the amount of solder 70 between the first external electrode 21 and the first land 61 sufficient. When the amount of solder 70 in this part is insufficient, if a stress such as to bend the multilayer ceramic capacitor in the longitudinal direction L is applied to the substrate 50 and the substrate 50 is bent, the stress is likely to concentrate on the end edge 23b of the bent portion 21b, and a crack K may be generated in the main body 11 starting from the end edge 23b.

[0066] In contrast, according to the multilayer ceramic capacitor 1 and the mounting structure of the embodiment, the gap G exists between the first external electrode 21 and the first land 61, so that a sufficient amount of solder 70 can be filled between the first external electrode 21 and the first land 61 in a soldered state. If the gap G is 15 μm or more, the amount of solder 70 between the first external electrode 21 and the first land 61 can be sufficient. Therefore, when the substrate 50 is bent as described above, stress is not easily concentrated on the edge 23b of the bent portion 21b, and cracks can be suppressed from being generated in the body portion 11 starting from the edge 23b.

[0067] In addition, although Fig. 9 2 is a diagram showing the first external electrode 21 of a pair of external electrodes 20, but the second external electrode 22 is also the same. Figure 8 As shown, there is also a gap G between the second connection bend portion 22 b 1 of the second external electrode 22 and the second land 62 , so the solder 70 is also filled in the gap G. Therefore, in the second external electrode 22 , the occurrence of cracks in the main body 11 can be similarly suppressed.

[0068] According to the multilayer ceramic capacitor 1 according to the embodiment described above, the following effects can be achieved.

[0069] The multilayer ceramic capacitor 1 involved in the embodiment includes: a component body 10 having a length direction L; and a pair of external electrodes 20, which are respectively arranged at both ends of the component body 10 in the length direction L, and at least a portion of the component body 10 exposed between the pair of external electrodes 20 has a central peripheral portion 30 that protrudes outward in a direction orthogonal to the length direction L than the pair of external electrodes 20.

[0070] When the multilayer ceramic capacitor 1 according to the embodiment is mounted on the substrate 50, if the multilayer ceramic capacitor 1 is set at a predetermined mounting position on the substrate 50, the central peripheral portion 30 is in contact with the surface of the substrate 50, and a gap G is generated between the external electrode 20 and the first land 61 and the second land 62. When the external electrode 20 is soldered to the first land 61 and the second land 62, the solder 70 is filled in the gap G. Thus, a sufficient amount of solder 70 can be filled between the external electrode 20 and the first land 61 and the second land 62. Therefore, when the substrate 50 is bent, the stress at this time is not easily transmitted to the main body 11, and the generation of cracks in the main body 11 can be suppressed.

[0071] In the multilayer ceramic capacitor 1 according to the embodiment, the central peripheral portion 30 preferably protrudes outward from the external electrode 20 in the one direction by 15 μm or more.

[0072] Thus, the gap G between the external electrode 20 and the first land 61 and the second land 62 can be set to 15 μm or more, so that a sufficient amount of solder 70 can be filled in the gap G. As a result, the solder 70 can sufficiently block the stress from being transferred from the substrate 50 to the main body 11, and the generation of cracks in the main body 11 can be suppressed.

[0073] In the multilayer ceramic capacitor 1 according to the embodiment, the central peripheral portion 30 is provided over the entire periphery of the component body 10 .

[0074] Thus, no matter which part of the central peripheral portion 30 is disposed opposite to the substrate 50, the gap G can be provided between the external electrode 20 and the first land 61 and the second land 62. Therefore, it is not necessary to select the orientation of the multilayer ceramic capacitor 1 relative to the substrate 50, and the mounting operation can be simplified.

[0075] In the multilayer ceramic capacitor 1 according to the embodiment, the component body 10 includes a body portion 11 including an internal electrode layer 14 , and a central peripheral portion 30 is disposed on the surface of the body portion 11 and includes at least one of ceramic and resin.

[0076] In this way, the central peripheral portion 30 can be easily formed at a desired position and in a desired shape. In particular, by forming the central peripheral portion 30 from the same ceramic material as the dielectric ceramic layer 13, the main body 11 and the central peripheral portion 30 can be simultaneously fired and manufactured, thereby improving manufacturing efficiency.

[0077] The mounting structure involved in the embodiment is a mounting structure of a stacked ceramic capacitor 1 in which a first connection plate 61 and a second connection plate 62 are respectively connected to a pair of external electrodes 20 and are arranged separately from each other on the surface of a substrate 50. The stacked ceramic capacitor 1 has a component body 10 and a pair of external electrodes 20 arranged on the component body 10. The component body 10 is connected to the substrate 50, and there is a gap G between each of the pair of external electrodes 20 and the substrate 50.

[0078] When the external electrode 20 is soldered to the first land 61 and the second land 62, the solder 70 is filled into the gap G. Thus, a sufficient amount of solder 70 can be filled between the external electrode 20 and the first land 61 and the second land 62. Therefore, when the substrate 50 is bent, the stress at that time is not easily transmitted to the main body 11, and the occurrence of cracks in the main body 11 can be suppressed.

[0079] In the mounting structure according to the embodiment, the gap G between each of the pair of external electrodes 20 and the substrate 50 is preferably 15 μm or more.

[0080] This makes it possible to make a sufficient amount of solder 70 filling the gap G. As a result, the solder 70 can sufficiently block the stress transfer from the substrate 50 to the main body 11 , thereby suppressing the occurrence of cracks in the main body 11 .

[0081] Preferably, in the mounting structure according to the embodiment, the substrate 50 has a fiber direction extending in one direction, and the multilayer ceramic capacitor 1 is arranged so that the direction in which the pair of external electrodes 20 are separated from each other is parallel to the fiber direction.

[0082] From the viewpoint of rigidity, the laminated ceramic capacitor 1 is more susceptible to stress when stress is applied to the length direction L than when stress is applied to the width direction W. However, by arranging the laminated ceramic capacitor 1 on the substrate 50 so that the length direction L is along the fiber direction of the substrate 50, the laminated ceramic capacitor 1 is less susceptible to stress due to the rigidity provided by the fibers of the substrate 50 than when arranged in a direction intersecting the fiber direction. This can improve the effect of suppressing the occurrence of cracks.

[0083] In addition, the present invention is not limited to the above-mentioned embodiment, and modifications, improvements, etc. within the scope that can achieve the object of the present invention are included in the present invention.

[0084] For example, the protrusion that makes the external electrode 20 float from the surface of the substrate 50 may not exist in the entire outer periphery of the component body 10. Fig.11As shown, there are only two places, namely, the first protrusion 31 provided on the first main surface 17a1 of the body portion 11 and the second protrusion 32 provided on the second main surface 17a2 of the body portion 11. In this case, the multilayer ceramic capacitor 1 is provided on the substrate 50 in a state where either the first protrusion 31 or the second protrusion 32 is in contact with the surface of the substrate 50. Furthermore, a mode in which only either the first protrusion 31 or the second protrusion 32 is provided may be adopted.

[0085] In addition, as the protrusion, only two locations may be provided, namely, the third protrusion 33 provided on the third side surface 15a of the main body 11 and the fourth protrusion 34 provided on the fourth side surface 15b of the main body 11. In this case, the multilayer ceramic capacitor 1 is provided on the substrate 50 in a state where either the third protrusion 33 or the fourth protrusion 34 is in contact with the surface of the substrate 50. Furthermore, a mode in which only either the third protrusion 33 or the fourth protrusion 34 is provided may be adopted.

[0086] The multilayer ceramic capacitor 1 in the above-described embodiment is an example of an electronic component, but the electronic component of the present disclosure is not limited thereto, and other two-terminal electronic components such as a thermistor and an inductor can also be applied.

[0087] Description of Reference Numerals

[0088] 1: Multilayer ceramic capacitors (electronic components);

[0089] 10: Component body;

[0090] 11: Body part;

[0091] 14: internal electrode layer (internal electrode);

[0092] 20: external electrode;

[0093] 21: 1st external electrode;

[0094] 22: second external electrode;

[0095] 30: central peripheral part (protrusion);

[0096] 50: substrate;

[0097] 61: 1st connection plate (connection plate);

[0098] 62: 2nd connection plate (connection plate);

[0099] G: Gap.

Claims

1. An electronic component comprising: a component body having a length direction; and A pair of external electrodes are respectively arranged at both ends of the component body in the longitudinal direction. The component body has a protrusion that protrudes outward from the pair of external electrodes in a direction orthogonal to the longitudinal direction, at least in a portion of a portion exposed between the pair of external electrodes.

2. The electronic component according to claim 1, wherein The protrusion protrudes from the external electrode to the outside in the one direction by more than 15 μm.

3. The electronic component according to claim 1 or 2, wherein: The protrusion is provided over the entire periphery of the component body.

4. The electronic component according to claim 1 or 2, wherein: The component body has a main body portion including an internal electrode, The protrusion is arranged on the surface of the main body. The protrusion includes at least one of ceramic and resin.

5. An electronic component mounting structure, wherein a pair of external electrodes of the electronic component are connected to a pair of connection pads disposed on a surface of a substrate separately from each other, respectively, wherein: The electronic component comprises a component body and the pair of external electrodes arranged on the component body. The component body is in contact with the substrate, and a gap exists between each of the pair of external electrodes and the substrate.

6. The electronic component mounting structure according to claim 5, wherein: The gap is greater than 15 μm.

7. The electronic component mounting structure according to claim 5 or 6, wherein: The substrate has a fiber direction extending in one direction, The electronic component is arranged such that a direction in which the pair of external electrodes are separated from each other is parallel to the fiber direction.

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