Method for manufacturing electronic component or semiconductor device

Abstract

Provided is a novel method for improving productivity by making it easy to remove a processed element when manufacturing an electronic component or a semiconductor device. An object to be processed for manufacturing an electronic component or a semiconductor device is adhered to the concave-convex surface of the adhesive layer. And processing the object to be processed on the adhesive layer to obtain a processed object. And removing the processed result from the adhesive layer.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing an electronic component or a semiconductor device, for example, to a technology for sealing a semiconductor element. Background Art

[0002] In the manufacture of electronic parts or semiconductor devices, for example, as described in Patent Document 1, the object to be processed is processed such as sealing or wiring of the element. As described in Patent Document 1, the processing of the object to be processed is often performed in a state where the object to be processed is attached to an adhesive sheet.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: International Publication No. 2018 / 181767 Summary of the invention

[0006] Problems to be solved by the invention

[0007] After the object is processed, the processed object needs to be removed from the adhesive sheet. However, it is not easy to easily remove the processed object from the adhesive sheet. Patent Document 1 proposes adding heat-expandable particles to the adhesive in order to facilitate the removal of the element and improve productivity.

[0008] An object of the present invention is to provide a new method for improving productivity by facilitating the removal of processed products when manufacturing electronic parts or semiconductor devices.

[0009] Solutions for solving problems

[0010] The inventors of the present invention have conducted diligent research and have found that by pasting the object to be processed onto the concave-convex surface of the adhesive layer and then processing the object, the processed object can be easily removed and productivity can be improved. This solves the above-mentioned problem, and the inventors have further repeated various studies to complete the present invention.

[0011] That is, the present invention relates to the following [1] to

[13] .

[0012] [1] A method for manufacturing an electronic component or a semiconductor device, the method comprising the following steps:

[0013] A process of attaching an object to be processed for manufacturing electronic parts or semiconductor devices to the concavo-convex surface of the adhesive layer;

[0014] A step of obtaining a processed object by processing the processed object on the adhesive layer; and

[0015] A step of removing the processed product from the adhesive layer.

[0016] [2] The manufacturing method described in [1], wherein the object to be processed is a device, a semiconductor wafer, or a panel.

[0017] [3] The manufacturing method described in [1], wherein the treatment of the object to be treated includes energy application treatment, liquid contact treatment, vacuum treatment, or sealing treatment.

[0018] [4] The manufacturing method described in [1], wherein in the step of performing the treatment, a sealed body is formed by sealing the object to be treated on the adhesive layer with a sealing material,

[0019] In the removing step, the sealed body including the processed object is removed from the adhesive layer.

[0020] [5] The manufacturing method described in [4], wherein in the step of performing the treatment, the sealing body is formed in a manner such that the sealing material contacts both the treated object and the concavo-convex surface of the adhesive layer.

[0021] [6] The manufacturing method described in [4], wherein in the step of performing the treatment, two or more of the treated objects spaced apart from each other on the concave-convex surface are integrally sealed.

[0022] [7] The manufacturing method as described in [6], wherein in the step of performing the treatment, two or more of the treated objects are sealed integrally and then further separated into individual pieces.

[0023] [8] The manufacturing method described in [1], wherein the step of attaching the object to be processed includes the step of capturing the object to be processed separated from the holding substrate in the adhesive layer.

[0024] [9] The production method described in [1], wherein the adhesive layer includes a substrate and an adhesive layer formed on the substrate and having a surface with irregularities.

[0025]

[10] The production method described in any one of [1] to [9], wherein the adhesive layer has a plurality of convex portions on the surface that are separated from each other by concave portions.

[0026]

[11] The production method according to any one of [1] to [9], wherein the adhesive layer has a convex portion whose boundary is determined by a concave portion,

[0027] A ratio of an area of ​​the protrusions to an area of ​​the adhesive layer is not less than 1% and not more than 95%.

[0028]

[12] A manufacturing method as described in any one of [1] to [9], wherein the adhesive layer is constructed in such a way that the ratio of the bonding area between the adhesive layer and one of the processed objects relative to the area of ​​one of the processed objects is greater than 1% and less than 95%.

[0029]

[13] The method according to any one of [1] to [9], wherein the area of ​​the object to be processed is 100 mm 2 the following.

[0030] Effects of the Invention

[0031] The present invention can provide a new method for improving productivity by making it easier to remove processed products when manufacturing electronic parts or semiconductor devices.

[0032] Other features and advantages of the present invention will become apparent from the following description with reference to the accompanying drawings. In the accompanying drawings, the same or similar components are denoted by the same reference numerals. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention, and together with the description, serve to explain the principles of the present invention.

[0034] Figure 1 This is a schematic diagram of an adhesive sheet according to one embodiment.

[0035] Figure 2A This is a plan view showing an example of the concavities and convexities of the adhesive layer.

[0036] Figure 2B This is a plan view showing an example of the concavities and convexities of the adhesive layer.

[0037] Figure 2C This is a plan view showing an example of the concavities and convexities of the adhesive layer.

[0038] Figure 3A This is a cross-sectional view showing an example of the concavities and convexities of the adhesive layer.

[0039] Figure 3B This is a cross-sectional view showing an example of the concavities and convexities of the adhesive layer.

[0040] Figure 3C This is a cross-sectional view showing an example of the concavities and convexities of the adhesive layer.

[0041] Figure 4A This is a diagram for explaining separation and capture of components.

[0042] Figure 4B This is a diagram for explaining separation and capture of components.

[0043] Figure 5 This is a flow chart of a manufacturing method according to one embodiment.

[0044] Fig. 6A This is a diagram for explaining a production method according to one embodiment.

[0045] Figure 6B This is a diagram for explaining a production method according to one embodiment.

[0046] Figure 6C This is a diagram for explaining a production method according to one embodiment.

[0047] Fig.6D This is a diagram for explaining a production method according to one embodiment.

[0048] Figure 7 This is a diagram for explaining the apparent contact angle. DETAILED DESCRIPTION

[0049] Hereinafter, the embodiments are described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the technical solutions of the claims, and the combination of features described in the embodiments is not necessarily required for the invention. Two or more of the multiple features described in the embodiments can be combined arbitrarily. In addition, the same figure mark is marked for the same or similar structure, and repeated description is omitted.

[0050] (definition)

[0051] In this specification, the mass average molecular weight (Mw) and the number average molecular weight (Mn) are values ​​measured by size exclusion chromatography in terms of standard polystyrene, specifically values ​​measured in accordance with JIS K7252-1: 2016. In addition, in this specification, "(meth)acrylic acid" refers to both "acrylic acid" and "methacrylic acid".

[0052] In this specification, "electronic parts" include all parts used in electronic engineering and electrical engineering, and all parts constituting electronic equipment. "Electronic parts" can be formed by any one of semiconductors, conductors and / or insulators, or by a combination of these. As "electronic parts", for example, active parts (mainly formed by semiconductors, such as transistors, ICs (Integrated Circuits), LSIs (Large Scale Integration), super LSIs, diodes, light-emitting diodes, thyristors, three-terminal regulators, and camera elements, etc.), passive components (such as resistors, capacitors, speakers, coils, transformers, converters, relays, piezoelectric elements, crystal oscillators, ceramic resonators, and varistors, etc.), and structural parts (such as wiring parts, printed circuit boards, connectors, and switches, etc.). In addition, in this specification, "semiconductor devices" refer to all devices used in processors, memories, and sensors that can function by utilizing semiconductor characteristics. As examples of "semiconductor devices", micro light-emitting diodes, sub-millimeter light-emitting diodes, power devices, MEMS (Micro Electro Mechanical Systems), and control chips can be cited.

[0053] In this specification, when more than one lower limit and more than one upper limit of a numerical range (such as a range of content, etc.) are recorded, it can be understood that any lower limit and upper limit and combination thereof are recorded. For example, preferably 1 or more, more preferably 2 or more, further preferably 3 or more and preferably 9 or less, more preferably 8 or less, and further preferably 7 or less records indicate that the numerical range can be any of 1 or more and 9 or less, 1 or more and 8 or less, 1 or more and 7 or less, 2 or more and 9 or less, 2 or more and 8 or less, 2 or more and 7 or less, 3 or more and 9 or less, 3 or more and 8 or less, and 3 or more and 7 or less.

[0054] In the manufacturing method of an electronic component or semiconductor device according to one embodiment of the present invention, an adhesive layer having a concavo-convex surface is used. For example, in the manufacturing method, a processed object adhered to the adhesive layer is processed. In addition, as described later, in order to adhere the processed object to the adhesive layer, a component separated from a holding substrate can also be captured in the adhesive layer. In this specification, first, the adhesive layer having a concavo-convex surface used in the manufacturing method of the electronic component or semiconductor device is described.

[0055] (Base material)

[0056] The adhesive layer may be provided on the substrate. Figure 1As shown, an adhesive sheet having a base material 110 and an adhesive layer 120 can be used. In this case, the object to be processed attached to the adhesive layer 120 of the adhesive sheet can be processed. However, the adhesive sheet does not necessarily have the base material 110. For example, the adhesive sheet can also be composed of only the adhesive layer 120. In this case, an adhesive layer 120 with high support can be used.

[0057] The substrate 110 functions as a support for the adhesive layer 120. The type of the substrate 110 is not particularly limited, and may be a hard substrate or a flexible substrate. From the perspective of being easy to install on other components such as a substrate, improving peelability, being easy to stack, or being able to be made into a roll form, the substrate 110 is preferably a flexible substrate. As the substrate 110, for example, a resin film can be used.

[0058] The resin film is a film using a resin material as a main material, and may be formed of the resin material or may contain additives in addition to the resin material. The resin film may also have laser transmittance.

[0059] As the specific example of resin film, for example: polyethylene films such as low-density polyethylene (LDPE) film, linear low-density polyethylene (LLDPE) film and high-density polyethylene (HDPE) film, polypropylene film, polybutylene film, polybutadiene film, polymethylpentene film, ethylene-norbornene copolymer film and norbornene resin film; ethylene copolymer films such as ethylene-vinyl acetate copolymer film, ethylene-(methyl) acrylic acid copolymer film and ethylene-(methyl) acrylic acid ester copolymer film; polyvinyl chloride films such as polyvinyl chloride film and vinyl chloride copolymer film; polyester films such as polyethylene terephthalate film and polybutylene terephthalate film; polyurethane film; polyimide film; polystyrene film; polycarbonate film; and fluororesin film, etc. In addition, the film containing a mixture of two or more materials, the cross-linked film formed by the cross-linked resins forming these films, and the modified film such as ionomer film can also be used. In addition, substrate 110 can also be a laminated film formed by stacking two or more resin films.

[0060] From the viewpoint of versatility, relatively high strength and easy prevention of warping, and heat resistance, the resin film is preferably a single-layer film selected from the group consisting of polyethylene film, polyester film, and polypropylene film, or a laminated film formed by laminating two or more films selected from the group.

[0061] The thickness of the substrate 110 is not particularly limited, but is preferably in the range of 10 μm to 500 μm, more preferably 25 μm to 200 μm, and even more preferably 40 μm to 90 μm from the viewpoint of achieving both support and roll-winding properties.

[0062] (Adhesive layer)

[0063] The adhesive layer 120 is an adhesive layer and may contain a resin. The surface of the adhesive layer 120 may have unevenness. In addition, the adhesive sheet may have two or more adhesive layers 120. For example, the adhesive sheet may have a laminate of one or more adhesive layers 120.

[0064] (Composition of adhesive layer)

[0065] Examples of resins included in the adhesive layer include: polyisobutylene resins, polybutadiene resins, and rubber resins such as styrene-butadiene resins, acrylic resins, urethane resins, polyester resins, olefin resins, silicone resins, and polyvinyl ether resins. The adhesive layer can have heat resistance, and as materials for such heat-resistant adhesive layers, polyimide resins and silicone resins can be exemplified. The adhesive layer can include a copolymer having two or more constituent units. The form of such a copolymer is not particularly limited, and can be any of a block copolymer, a random copolymer, an alternating copolymer, and a graft copolymer.

[0066] The resin contained in the adhesive layer 120 is preferably an adhesive resin that has adhesiveness alone. In addition, the resin is preferably a polymer with a mass average molecular weight (Mw) of 10,000 or more. From the viewpoint of improving adhesion, the mass average molecular weight (Mw) of the resin is preferably 10,000 or more, more preferably 70,000 or more, and further preferably 140,000 or more. In addition, from the viewpoint of suppressing the storage modulus to be below the specified value, the Mw is preferably 2 million or less, more preferably 1.2 million or less, and further preferably 900,000 or less. In addition, from the viewpoint of improving adhesion, the number average molecular weight (Mn) of the resin is preferably 10,000 or more, more preferably 50,000 or more, and further preferably 100,000 or more. In addition, from the viewpoint of suppressing the storage modulus to be below the specified value, the Mn is preferably 2 million or less, more preferably 1 million or less, and further preferably 700,000 or less. In addition, as described later, when the adhesive layer 120 includes a resin derived from an energy-reactive resin, its mass average molecular weight (Mw) and number average molecular weight (Mn) refer to the mass average molecular weight (Mw) and number average molecular weight (Mn) before the cross-linking reaction is performed by energy imparting. In addition, the glass transition temperature (Tg) of the resin is preferably above -70°C, more preferably above -60°C, and preferably below -10°C, more preferably below -20°C. By making Tg within this range, it is easy to make the adhesion and storage modulus of the obtained adhesive within the range described later.

[0067] The amount of resin contained in the adhesive layer 120 relative to the total amount of components constituting the adhesive layer 120 can be appropriately set according to the required adhesion and storage modulus of the adhesive layer 120, and is preferably 30 mass% or more, more preferably 40 mass% or more, further preferably 50 mass% or more, further preferably 55 mass% or more, further preferably 60 mass% or more, and preferably 99.99 mass% or less, more preferably 99.95 mass% or less, further preferably 99.90 mass% or less, further preferably 99.80 mass% or less, and further preferably 99.50 mass% or less.

[0068] The resin contained in the adhesive layer 120 is preferably derived from an energy-reactive resin. An energy-reactive resin refers to a resin whose elastic modulus is increased by imparting energy. As energy-reactive resins, energy-ray reactive resins and heat-reactive resins can be exemplified. An energy-ray reactive resin refers to a resin whose elastic modulus is increased by irradiating energy rays. In addition, a heat-reactive resin refers to a resin whose elastic modulus is increased by heating. The type of energy ray is not particularly limited, and examples thereof include ultraviolet rays, electron beams, or ionizing radiation. The energy ray is preferably ultraviolet rays, that is, the resin is preferably an ultraviolet-reactive resin. The resin derived from the energy-reactive resin means that the resin is obtained from the energy-reactive resin. For example, the resin derived from the energy-reactive resin is an energy-reactive resin after cross-linking. When using such an energy-reactive resin, it is easy to maintain the formed concave-convex shape by imparting energy (e.g., irradiating energy rays) after the resin is formed into concave-convex shapes.

[0069] The adhesive layer may contain components other than the resin. For example, the adhesive layer may contain one or more of a tackifier, a polymerization initiator, a UV (ultraviolet) absorber, and other additives.

[0070] A polymerization initiator is a component that initiates a crosslinking reaction by applying energy (eg, irradiation with energy rays). When the adhesive layer contains an energy-reactive resin, the adhesive layer further contains a polymerization initiator, so that the crosslinking reaction proceeds even when a relatively low energy is applied.

[0071] As the polymerization initiator, for example, a photopolymerization initiator can be used. Examples of the photopolymerization initiator include 1-hydroxycyclohexyl phenyl ketone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzyl phenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, bibenzyl, biacetyl, and 8-chloroanthraquinone.

[0072] The adhesive layer may include a polymerization initiator or may include two or more polymerization initiators. When the adhesive layer contains a polymerization initiator, the content of the polymerization initiator in the adhesive layer is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, further preferably 1% by mass or more, and preferably 10% by mass or less, more preferably 5% by mass or less, further preferably 2% by mass or less, from the viewpoint of causing the crosslinking reaction to proceed at an appropriate speed.

[0073] Examples of the UV absorber include benzotriazole compounds, oxazolic acidamide compounds, and benzophenone compounds.

[0074] There is no particular limitation on other additives that the adhesive layer may contain, and examples thereof include: light stabilizers such as hindered amine, benzophenone, or benzotriazole; antioxidants such as phenolic, aromatic amine, sulfur, or phosphorus such as phosphate compounds; resin stabilizers such as imidazole resin stabilizers, dithiocarbamate resin stabilizers, phosphorus resin stabilizers, or thioester resin stabilizers; fillers; pigments; extenders; and softeners, etc.

[0075] When the adhesive layer contains these additives, the content of the additives in the adhesive layer is preferably 0.0001 mass % or more, more preferably 0.01 mass % or more, particularly preferably 0.1 mass % or more, further preferably 1 mass % or more, and preferably 20 mass % or less, more preferably 10 mass % or less, further preferably 5 mass % or less.

[0076] (Shape of adhesive layer)

[0077] The surface of the adhesive layer has concavoconvex. As described later, after the processed object attached to the adhesive layer is processed, the processed object is removed from the adhesive layer. If the surface of the adhesive layer is flat, the adhesive layer and the processed object are in close contact. At this time, even if the processed object is to be removed from the adhesive layer, it is difficult for air to enter between the adhesive layer and the processed object, so it takes a sufficiently large force to remove the processed object from the adhesive layer. On the other hand, there is a gap between the adhesive layer with concavoconvex surface and the processed object, so it is easy to remove the processed object from the adhesive layer.

[0078] In addition, as described later, in order to stick the processed object on the adhesive layer, the processed object separated from the holding substrate can be captured in the adhesive layer. Specifically, the adhesive layer can capture the processed object at the convex portion. At this time, the compressed gas between the processed object and the adhesive layer can escape to the concave portion of the adhesive layer by the proximity of the processed object and the adhesive layer. In this way, the pressure generated between the processed object and the adhesive layer can be eased by the adhesive layer having concave and convex. Therefore, it is also possible to suppress the displacement of the holding position of the processed object on the adhesive layer caused by the pressure generated between the processed object and the adhesive layer.

[0079] If the surface of the adhesive layer has a concave portion as described above, the force required to remove the processed object from the adhesive layer can be adjusted by controlling the contact area between the processed object and the adhesive layer. In addition, as long as the surface of the adhesive layer has a concave portion, the pressure generated between the processed object and the adhesive layer can be eased. Therefore, the specific shape of the concave and convex surface of the adhesive layer is not limited.

[0080] For example, in one embodiment, the adhesive layer has a plurality of convex portions separated from each other via concave portions on the surface. A plurality of convex portions can be separated by a concave portion that is continuous across the entirety of the adhesive layer. By arranging a continuous concave portion around such a convex portion, air can more easily enter between the adhesive layer and the processed object, and therefore it is easier to remove the processed object from the adhesive layer. In addition, in one embodiment, the concave portion located around each of the plurality of convex portions is continuous to the end of the adhesive layer. In this way, by arranging a concave portion that is continuous to the end of the adhesive layer, air can more easily enter between the processed object and the adhesive layer. In addition, according to these configurations, the air compressed between the processed object and the convex portion can be efficiently released to the outside of the processed object, so the pressure relief effect also becomes greater. FIG. 2A to FIG. 2C It is a top view showing the shape of such an adhesive layer.

[0081] like Figure 2A As shown in FIG. 1 , the surface of the adhesive layer may have protrusions arranged regularly. Regular arrangement of protrusions means that the protrusions are arranged on a straight line at fixed intervals. Figure 2B As shown, the protrusions may also be arranged in a manner with regularly varying intervals. Figure 2B In the example of , the intervals between the convex parts in the center of the adhesive layer are shortened, and the intervals between the convex parts in the peripheral part of the adhesive layer are lengthened. According to this structure, while improving the holding force of the adhesive layer, air can easily enter between the adhesive layer and the processed object from the peripheral part of the processed object through the wide concave part, thereby effectively escaping the pressure from the peripheral part of the processed object. In addition, the convex parts can also be arranged irregularly.

[0082] Figure 2C is a top view showing other shapes of the adhesive layer. Figure 2C As shown, stripe-shaped protrusions may be provided on the surface of the adhesive layer. Figure 2CIn the embodiment, linear protrusions with a fixed width are arranged at fixed intervals. Figure 2B Likewise, the width or interval of the linear protrusions may be varied regularly, or the linear protrusions may be arranged irregularly.

[0083] From the viewpoint of facilitating the removal of the processed object or improving the pressure relief effect, the pitch of the convex portions is preferably 1 μm or more, more preferably 5 μm or more, further preferably 10 μm or more, and further preferably 15 μm or more. Here, the pitch of the convex portions refers to the smallest spacing among all the convex portion spacings in the adhesive layer as a whole. For example, Figure 2A In the case of , the pitch of the convex portions means the spacing between the convex portions on the straight line where the convex portions are arranged at a fixed interval. When the convex portions are arranged on multiple straight lines, the pitch means the spacing between the convex portions on the straight line where the convex portions are arranged at the shortest interval. Figure 2C In the case of, the pitch of the convex portions means the interval between the linear convex portions. In this specification, the interval between the convex portions means the interval between the centers of the convex portions.

[0084] On the other hand, by reducing the spacing of the convex portions, the contact area between the adhesive layer and the processed object can be increased to suppress the positional deviation during capture. In addition, as described later, in one embodiment, the processed object on the adhesive is sealed with a sealing material. At this time, by making the surface of the adhesive layer have a finer structure, the wettability of the sealing material to the surface of the adhesive layer before curing becomes lower, and the sealing material is difficult to enter the concave and convex. As mentioned above, the phenomenon of lower wettability on the surface with a fine structure is generally referred to as the lotus effect. For example, it is known that the lotus leaf has a fine structure with a spacing of 20μm to 30μm and a height of about 10μm on the surface and shows high hydrophobicity. As one of the reasons for this decrease in wettability, it can be cited that when the fluid contacts the surface of the adhesive layer, a space for air is formed in the concave portion of the surface. From these viewpoints, the spacing of the convex portions is preferably less than 100μm, more preferably less than 75μm, more preferably less than 50μm, more preferably less than 35μm, and more preferably less than 25μm.

[0085] In addition, if Figure 2B As shown, the minimum interval among all the convex intervals in the central part of the adhesive layer can be shorter than the minimum interval among all the convex intervals in the peripheral part of the adhesive layer. Here, the central part is, for example, a circular area having 1 / 4 of the area of ​​the adhesive layer and centered on the center of gravity of the adhesive layer, and the peripheral part is, for example, all areas outside the central part of the adhesive layer.

[0086] The specific shape of the convex portion is not particularly limited. For example, the convex portion may also have a pillar shape. As a specific example, the convex portion may have a cylindrical shape or a prism shape. In addition, as described above, the convex portion may extend in a linear shape or in a curved shape such as a wave shape. In addition, these convex portions may be provided with a slope.

[0087] Figure 3A A cross-sectional view of an adhesive layer according to an embodiment of the present invention is shown, which passes through a protrusion and is perpendicular to the surface of the adhesive layer. Figure 3A The convex portion shown is provided with an inclination, that is, the front end of the convex portion becomes thinner. Figure 3A As shown, the front end of the convex portion can be a curved surface. According to this structure, the impact when the processed object separated from the holding substrate contacts the adhesive layer is further mitigated, so the adhesive layer is easy to hold the processed object without offset. On the other hand, the front end of the convex portion can also be a plane.

[0088] like Figure 3A As shown, the surface of the adhesive layer may have flat concave portions and convex portions protruding from the concave portions. As described above, the adhesive layer may have a plurality of convex portions spaced apart from each other defined by the concave portions.

[0089] As another example, the protrusion may be Figure 3B The convex portion may be a hemisphere or a part of a sphere. Figure 3C As shown, it is T-shaped. As another example, the convex portion can be in the shape of a plurality of particle collections, mushroom-shaped, lotus leaf-shaped, or needle-shaped. As yet another example, the surface of the adhesive layer can be rough or fibrous, and this surface can also be said to have concave-convex.

[0090] From the viewpoint of maintaining adhesion, the width or diameter of each convex portion is preferably 1 μm or more, more preferably 2 μm or more, further preferably 5 μm or more, further preferably 10 μm or more. On the other hand, from the viewpoint of facilitating the removal of the processed object or improving the pressure relief effect, the width or diameter of each convex portion is preferably 100 μm or less, more preferably 50 μm or less, further preferably 30 μm or less, further preferably 20 μm or less. Here, the width and diameter of the convex portion respectively represent the minimum distance and maximum distance ( Figure 3A Indicated by B).

[0091] In addition, from the viewpoint of maintaining adhesiveness, the area of ​​each convex portion is preferably 10 μm. 2 More preferably, 20 μm 2 More preferably, 30 μm 2 On the other hand, from the viewpoint of facilitating the removal of the processed object or improving the pressure relaxation effect, the area of ​​each convex portion is preferably 2000 μm 2 Below, more preferably 1000 μm 2 Below, more preferably 500 μm 2 Here, the area of ​​the convex portion refers to the area of ​​the portion protruding from the surface of the concave portion ( Figure 3AIn the case of , it is the area of ​​a circle with diameter B).

[0092] In addition, from the viewpoint of air easily entering the concave portion, the height of each convex portion is preferably 1 μm or more, more preferably 3 μm or more, and further preferably 5 μm or more. On the other hand, from the viewpoint of improving the morphological stability, the height of each convex portion is preferably 20 μm or less, more preferably 15 μm or less, and further preferably 10 μm or less. Here, the height of the convex portion is Figure 3A Indicated by H.

[0093] In addition, from the viewpoint of maintaining adhesion, the area occupied by the plurality of convex portions relative to the area of ​​the adhesive layer is preferably 1% or more, more preferably 5% or more, further preferably 10% or more, further preferably 18% or more, further preferably 40% or more. On the other hand, from the viewpoint of improving the pressure relaxation effect, the area of ​​each convex portion is preferably 95% or less, more preferably 75% or less, further preferably 60% or less.

[0094] The concavoconvexity of the adhesive layer can also be designed according to the shape of the processed object. For example, from the viewpoint of maintaining adhesion, the ratio of the bonding area between the adhesive layer and one processed object relative to the area of ​​one processed object is preferably 1% or more, more preferably 2% or more, further preferably 3% or more, further preferably 4% or more, further preferably 5% or more, further preferably 7% or more, further preferably 10% or more. On the other hand, from the viewpoint of easily removing the processed object or improving the pressure relaxation effect, the area of ​​each convex portion is preferably 95% or less, more preferably 70% or less, further preferably 50% or less, further preferably 30% or less. Figure 3A In the case of, the bonding area is equivalent to the area of ​​a circle of diameter T. In addition, when the position of the processed object on the adhesive layer is offset, the bonding area may change. At this time, it is preferred that the ratio of the bonding area is within the above range regardless of the position of the processed object.

[0095] (Other layers)

[0096] The adhesive sheet may also have a layer other than the substrate 110 and the adhesive layer 120. For example, an adhesive layer may be further provided on the surface of the substrate 110 opposite to the adhesive layer 120. The adhesive sheet may be attached to other substrates such as quartz glass via such an adhesive layer. The type of the further provided adhesive layer is not particularly limited, and for example, the further provided adhesive layer may be formed using a common adhesive.

[0097] (Method for producing adhesive layer and adhesive sheet)

[0098] There is no particular limitation on the method for manufacturing the adhesive layer and the adhesive sheet. For example, an adhesive sheet having an adhesive layer 120 on a substrate 110 can be made as follows. First, an organic solvent is added to a raw material composition containing the components of the above-mentioned adhesive layer to prepare a solution of the raw material composition. Next, the solution is applied to the substrate to form a coating film and then dried, thereby providing an adhesive layer on the substrate 110. Furthermore, by performing a process of providing a concavo-convex surface on the adhesive layer, an adhesive layer 120 having a concavo-convex surface can be formed.

[0099] As examples of organic solvents for preparing the solution of the raw material composition, toluene, ethyl acetate and methyl ethyl ketone can be exemplified. The solid content concentration of the solution of the raw material composition is preferably 10% by mass or more, more preferably 25% by mass or more, more preferably 45% by mass or more, and preferably 80% by mass or less, more preferably 70% by mass or less, and more preferably 65% ​​by mass or less. As a coating method for the solution, for example, spin coating, spray coating, rod coating, knife coating, roll coating, roll knife coating, scraping, die coating, gravure coating, and printing (such as screen printing and inkjet) can be exemplified.

[0100] The processing of setting concavoconvex on the surface of the adhesive layer is also not particularly limited. For example, concavoconvex can be set on the surface of the adhesive layer using an embossing method. In the embossing method, a mold having a shape complementary to the concavoconvex to be set can be used on the surface. Specifically, the concavoconvex can be set on the surface of the adhesive layer by heating the adhesive layer while pressing the adhesive layer on the substrate using a mold. As a more specific method, the adhesive layer can be pressed by a mold, the adhesive layer is heated and maintained for a specified time, and then the adhesive layer is cooled and the mold is removed. When the adhesive layer is heated, for example, the adhesive layer can be heated to a temperature higher than the softening point of the adhesive layer. In addition, the time for maintaining the adhesive layer in a heated state is also not particularly limited, for example, it can be maintained for more than 10 seconds, or it can be maintained for less than 10 minutes. As a specific method for heating the adhesive layer while pressing the adhesive layer using a mold, a method in which the adhesive layer on the substrate and the mold are vacuum laminated can be exemplified. Alternatively, instead of performing the two-step process of forming the adhesive layer and forming the irregularities, the adhesive layer 120 having the irregularities on the surface may be formed on the base material 110 in a one-step process.

[0101] As another method, an adhesive layer having a rough surface can be provided by spraying a solution of the raw material composition. In addition, a filler can be added to the solution of the raw material composition, and an adhesive layer having a rough surface or a fibrous surface can be provided by coating the solution. As another method, an adhesive layer having a concave-convex shape can be directly provided on the substrate by adopting a printing method such as an inkjet method and coating the solution of the raw material composition according to a desired pattern.

[0102] In addition, the adhesive sheet without substrate 110 can be made by forming the composition of each component containing the adhesive layer into a sheet. In addition, the adhesive layer can also be formed by applying the liquid adhesive containing each component of the adhesive layer to any object. In these cases, the surface of the adhesive layer can be treated with unevenness after the adhesive layer is formed, and the adhesive layer can also be formed by forming unevenness on the surface.

[0103] (Method for manufacturing electronic parts or semiconductor devices using adhesive layer)

[0104] Next, a method for manufacturing an electronic component or a semiconductor device using the adhesive layer described above will be described with reference to Figure 5 The flowchart is explained in detail.

[0105] (S10: Pasting of the processed object)

[0106] In step S10, a workpiece for manufacturing electronic components or semiconductor devices is attached to the concave-convex surface of the adhesive layer. Fig. 6A As shown, the object to be processed 520 can be attached to the surface of the adhesive sheet 510. The method of attaching the object to be processed is not particularly limited. For example, a device such as a flip chip bonder or a die bonding machine can be used to place the object to be processed on the adhesive layer. The configuration layout and number of configurations of the object to be processed can be appropriately determined according to the shape and output of the seal to be produced.

[0107] The type of the processed object is not particularly limited. The processed object may be, for example, a component, a wafer, a panel, or a substrate. The component may be, for example, a semiconductor chip such as an LED chip, a semiconductor chip with a protective film, or a semiconductor chip with a die-bonding film (DAF). In addition, the component may be a micro-light-emitting diode, a sub-millimeter light-emitting diode, a power device, a MEMS (MicroElectro Mechanical Systems), or a control chip, or may be a component thereof. In addition, the component may be a monolithic object such as a wafer, a panel, or a substrate. The component may also have a circuit surface, formed with an integrated circuit having circuit elements such as a transistor, a resistor, and a capacitor.

[0108] The size of the element is not particularly limited. For example, the size of the element can be 100 μm. 2 Above, 500μm 2 Above, or 1000μm 2 On the other hand, the size of the element can be 100mm 2 Below, 25mm 2 Below, or 1mm 2 When using small-sized components, the laser lift-off method described later is suitable for attaching the components because it is easy to selectively separate the small components.

[0109] The object to be processed is not necessarily limited to a singulated object. For example, the object to be processed may be various wafers, various panels, or various substrates that are not singulated.

[0110] As wafers, for example, semiconductor wafers such as silicon wafers, silicon carbide (SiC) wafers, compound semiconductor wafers (such as gallium phosphide (GaP) wafers, gallium arsenide (GaAs) wafers, indium phosphide (InP) wafers, and gallium nitride (GaN) wafers) can be cited. The size of the wafer is not particularly limited, and can be 8 inches (200 mm in diameter) or more, preferably 12 inches (300 mm in diameter) or more. In addition, the shape of the wafer is not limited to a circle, and can be a square or a rectangle, for example.

[0111] As the panel, a fan-out semiconductor package (such as FOWLP or FOPLP) can be exemplified. That is, the processed object can be a semiconductor package before or after singulation in the fan-out semiconductor package manufacturing technology. The size of the panel is not particularly limited, for example, it can be a square substrate of about 300 mm to 700 mm.

[0112] Examples of the substrate include a glass substrate, a sapphire substrate, and a compound semiconductor substrate.

[0113] Hereinafter, the case where a device is used as a processed object will be mainly described, but the method described below can also be applied to the case where other processed objects are used.

[0114] When using an adhesive layer having a concavo-convex surface, it is preferred to transfer the component from the holding substrate to the adhesive layer by a method including a step of separating the component from the holding substrate and a step of capturing the component in the adhesive layer. In this way, the component can be attached to the concavo-convex surface of the adhesive layer. This method is described below.

[0115] (S10-1: Preparation of Holding Substrate)

[0116] First, a holding substrate to which the components are attached is prepared. The type of the holding substrate is not particularly limited. For example, the holding substrate may be an adhesive sheet or a tray. The adhesive sheet may have an adhesive layer, and the adhesive layer may be provided on a substrate. In this case, the holding substrate may hold the components on the adhesive layer. The substrate may be a resin film or a hard substrate.

[0117] The method for preparing the holding substrate for holding the element is also not particularly limited. For example, a semiconductor wafer may be attached to the holding substrate, and then the semiconductor wafer may be cut. By cutting the semiconductor wafer, the element may be obtained, and thus the holding substrate with the element attached thereto may be obtained.

[0118] As another method, the element obtained by cutting the semiconductor wafer can be transferred to the holding substrate, thereby obtaining the holding substrate with the element attached thereto. For example, after cutting the semiconductor wafer held on the wafer substrate, the obtained element can be brought into close contact with the adhesive layer of the holding substrate. Then, by applying an external stimulus such as a laser, the adhesion between the wafer substrate and the element can be reduced. Through this process, the element can be transferred from the wafer substrate to the holding substrate.

[0119] In addition, as described later, the element can be separated from the holding substrate by irradiation with laser (laser lift-off method). When using this method, the adhesive layer of the holding substrate preferably contains a laser absorbent. As the laser absorbent, for example, one or more selected from pigments and dyes can be exemplified.

[0120] (S10-2: Separation of components)

[0121] Next, the component attached to the holding substrate is separated from the holding substrate by external stimulation. The type of external stimulation is not particularly limited, and examples thereof include energy application, cooling, extension of the holding substrate, and physical stimulation (for example, using a pin to push the back of the holding substrate). By using one or more of these external stimulations, the bonding force between the holding substrate and the component can be reduced, and then the component can be separated from the holding substrate.

[0122] As described later, after the components are separated, the components can be captured in a manner that the relative arrangement of the plurality of components on the holding substrate is different from the relative arrangement of the plurality of components on the adhesive layer. For this purpose, it is preferred to selectively separate a portion of the plurality of components attached to the holding substrate. Therefore, an external stimulus can be selectively applied to a portion of the plurality of components attached to the holding substrate or to the attachment portion of the component in the holding substrate.

[0123] As methods of imparting energy, local heating, light irradiation, or heat ray irradiation can be exemplified. In addition, as methods of light irradiation, infrared irradiation, visible light irradiation, and laser irradiation can be exemplified. It is preferred to perform laser irradiation as an external stimulus, that is, to separate the component from the holding substrate using a laser stripping method. At this time, the laser is irradiated toward the pasting portion of the specific component in the holding substrate. For example, such laser irradiation can be performed from the surface of the holding substrate that is opposite to the component. As a result, gas is generated at the contact portion between the specific component and the holding substrate. For example, if the laser is absorbed by the adhesive layer, gas is generated by sublimation of at least a portion of the adhesive layer. As described above, by sublimation of at least a portion of the adhesive layer, the bonding area between the specific component and the adhesive layer is reduced, and therefore the bonding force between the specific component and the holding substrate is reduced. In addition, the pressure of the generated gas also reduces the bonding force between the specific component and the holding substrate. As a result, the specific component is separated from the holding substrate.

[0124] The irradiation conditions of the laser are not particularly limited. From the perspective of selectively separating a portion of the components efficiently, the frequency of the laser is preferably above 10000 Hz and below 100000 Hz. In addition, the beam diameter of the laser is preferably above 10 μm, more preferably above 20 μm, on the other hand, preferably below 100 μm, more preferably below 40 μm. The output of the laser is preferably above 0.1 W and below 10 W. The scanning speed of the laser is preferably above 50 mm / sec and below 2000 mm / sec.

[0125] (S10-3: Capturing of components)

[0126] Furthermore, the element separated from the holding substrate is captured by the adhesive layer. Specifically, the element is relatively far away from the holding substrate. Moreover, the element is relatively close to the adhesive layer. Then, the element is captured by the adhesive layer through contact with the adhesive layer of the adhesive sheet.

[0127] like Figure 4A As shown in FIG. 1 , the separated component 420 is captured at the position A on the adhesive sheet 450 by positioning the position A on the adhesive sheet 450 so as to face the component 420 attached to the holding substrate 410. Figure 4B As shown, by positioning position B on adhesive sheet 450 in a manner opposite to component 430 adhered to holding substrate 410, separated component 430 is captured at position B on adhesive sheet 450. As described above, separation and capture of components can be performed while changing the relative position of the holding substrate and the adhesive layer in the surface direction. As described above, positioning of components can be performed in a manner that the relative configuration of multiple components on the holding substrate is different from the relative configuration of multiple components on the adhesive layer. However, when an adhesive layer having a flat surface is used as described above, the pressure generated between the component and the adhesive layer may cause the components to be stuck to the adhesive layer. Figure 4A In the example of , the component 420 may be captured at a position offset from position A. However, since the surface of the adhesive layer has projections and depressions, the pressure generated between the component and the adhesive layer is relieved, so it is easier to capture the component at a desired position of the adhesive layer.

[0128] In one embodiment, the holding substrate and the adhesive layer are stationary, and the element separated from the holding substrate moves toward the adhesive layer. For example, when using the laser lift-off method, the element can be moved toward the adhesive layer by using the pressure of the gas generated by the irradiation of the laser. On the other hand, the element does not necessarily have to move. For example, the holding substrate can be moved away from the element. In addition, the adhesive layer can also be moved toward the element.

[0129] (S20: Processing of the object to be processed)

[0130] In step S20, the object to be processed on the adhesive layer is processed. The method of processing is not particularly limited. For example, wiring formation, backing metal formation, cleaning, plating treatment, monolithic, and thin film processing can be performed. In addition, the processing of the object to be processed can also include energy imparting processing (such as heating, or energy ray irradiation such as light), liquid contact processing (such as etching), vacuum processing (such as vacuum evaporation or sputtering), or sealing processing. Through such processing, the processing result can be obtained. Below, an example is given to illustrate the situation of component sealing.

[0131] In one embodiment, the sealed body is formed by sealing the element on the adhesive layer with a sealing material. First, the element attached to the adhesive layer is covered with a sealing material. Specifically, Figure 6B As shown, the element 520 can be covered with the sealing material 530 in a manner of covering the exposed surface of the element 520, for example, the surface and side surface of the element 520 opposite to the adhesive sheet 510. On the other hand, when the element 520 is covered with the sealing material 530, the surface of the element 520 on the adhesive sheet 510 side may not be covered. In this case, two or more elements 520 can be covered integrally with the sealing material 530. Figure 6B In the example of FIG. 5 , two or more components 520 spaced apart on the concave-convex surface are sealed integrally. At this time, the gap between the two or more components 520 is filled with a sealing material 530. After the components attached to the adhesive layer are covered with the sealing material, the sealing material is then cured. By curing the sealing material 530, Figure 6C As shown, a sealing body 550 including the element 520 is formed. In this way, the sealing body 550 can be formed so that the sealing material contacts both the element and the concavo-convex surface of the adhesive layer.

[0132] In addition, as described above, due to the lotus effect, it is difficult for the fluid to enter the fine structure of the concave and convex surface of the adhesive layer. Therefore, the concave portion on the surface of the adhesive sheet 510 is not filled with the sealing material 530, and the sealing body 550 can be formed in such a way that air exists in the concave portion. From the point of view that it is difficult for the sealing material 530 to enter the concave and convex surface of the adhesive layer, the apparent contact angle (the contact angle when the concave and convex surface is regarded as a flat surface, Figure 7 In the embodiment of the present invention, the contact angle between the adhesive layer and the sealing material before curing is preferably greater than 90°, more preferably greater than 100°, and more preferably greater than 110°. In addition, with respect to the same viewpoint, it is preferred to select the adhesive in the following manner, that is, when a flat adhesive layer is formed, the contact angle between the layer and the sealing material before curing is preferably greater than 90°, more preferably greater than 100°, and greater than 110°. It is preferred that the apparent contact angle between the concave-convex surface of the adhesive layer and the sealing material before curing is greater than the contact angle between the layer and the sealing material before curing when the flat layer of the adhesive is formed.

[0133] The sealing material has the function of protecting the element and its associated parts from the external environment. The type of sealing material is not particularly limited. From the perspective of mechanical strength, heat resistance, and insulation, the sealing material has curing properties.

[0134] As the sealing material, for example, thermosetting resin composition and energy ray curing resin composition etc. can be exemplified. As the thermosetting resin contained in the thermosetting resin composition, for example, epoxy resin, phenol resin and cyanate resin etc. can be exemplified. From the viewpoints of mechanical strength, heat resistance, insulation and formability, the thermosetting resin is preferably epoxy resin. The thermosetting resin composition can also contain curing agents such as phenol resin curing agents or amine curing agents, curing accelerators, inorganic filling materials such as silicon dioxide or elastomers as needed in addition to the thermosetting resin. The sealing material can be solid at room temperature or liquid. In addition, the form of the sealing material that is solid at room temperature is not particularly limited, for example, it can be granular or flaky.

[0135] The method of covering the element with the sealing material is not particularly limited, and for example, roll lamination, vacuum pressing, vacuum lamination, spin coating, die coating, transfer molding, or compression molding can be used. In these methods, in order to improve the filling property of the sealing material, the sealing material can be heated during covering to give fluidity.

[0136] As a sealing method for the element, compression molding is preferably used. In the compression molding method, a sealing body having a desired shape can be obtained by filling a sealing material in a mold cavity having a desired shape and applying pressure. For example Figure 6B In the example, the sealing material 530 is filled in the cavity in the mold 540. The molding pressure at this time is, for example, 0.1MPa or more, preferably 0.2MPa or more, more preferably 0.3MPa or more, and, for example, 2.0MPa or less, preferably 1.8MPa or less, more preferably 1.6MPa or less. In addition, the compression molding method can be performed while reducing the pressure in the cavity. In addition, when the compression molding method is performed, the sealing material can be cured under pressure.

[0137] When a thermosetting resin composition is used as a sealing material, the sealing material can be cured by heating the sealing material. The heating temperature at this time can be selected according to the type of the sealing material, for example, 30°C or more, preferably 50°C or more, more preferably 70°C or more, and for example, 180°C or less, preferably 170°C or less, more preferably 150°C or less. In addition, the heating time is, for example, 5 seconds or more, preferably 10 seconds or more, more preferably 15 seconds or more, and for example, 60 minutes or less, preferably 45 minutes or less, more preferably 30 minutes or less.

[0138] As mentioned above, more than two processed objects separated by configuration on the concavo-convex surface can be sealed in one piece. In addition, it is also possible to further monolithicize after more than two processed objects are sealed in one piece. For example, after making a packaged aggregate comprising more than two processed objects by one piece sealing, the aggregate is monolithicized, and thus a plurality of packages comprising the processed objects respectively can be made.

[0139] In addition, the thus obtained sealed body can be further processed. For example, a rewiring layer can be formed on the surface of the sealed body. That is, the manufacturing method of the electronic component or semiconductor device of this embodiment can be used for fan-out processes such as FOWLP or FOPLP. For example, a sealing material can be used to cover an area larger than the size of the component, and further, a rewiring layer and an external electrode can be formed not only on the circuit surface of the component but also on the surface of the sealing material.

[0140] The above-mentioned treatments of the processed objects may also be used in combination. For example, two or more processed objects may be sealed integrally, and after a rewiring layer is formed on the surface of the sealing material, the obtained structure may be separated into individual pieces.

[0141] (S30: Discharging of Processing Result)

[0142] In step S30, the processed product obtained by processing the processed object is removed from the adhesive layer. Fig.6D As shown, the sealant 550 is removed from the adhesive sheet 510. As described above, air exists in the concave portion of the surface of the adhesive sheet 510, so although the sealant 550 is attached to the adhesive sheet 510, the sealant 550 has a portion that is not in close contact with the adhesive sheet 510. Therefore, compared with the case where the adhesive layer is not formed with concave and convex portions, the sealant 550 can be easily removed from the adhesive sheet 510.

[0143] When the surface of the sealant pasted on the adhesive layer is further processed, in order to improve the operability of the sealant, it is also possible to paste a reinforcing member on the surface of the sealant that is opposite to the surface pasted on the adhesive layer as needed. The reinforcing member is not particularly limited, for example, a reinforcing plate with excellent heat resistance such as glass epoxy resin can be used. This reinforcing plate can be pasted on the entire surface of the sealant. The reinforcing member can be pasted, for example, via an adhesive layer. The reinforcing member will be removed after further processing, so it is preferred to select an adhesive layer that can achieve the peeling of the reinforcing member. The pasting of this reinforcing member can be carried out, for example, by sequentially stacking a thermosetting adhesive layer and a reinforcing plate on the sealant. Furthermore, it is also possible to use a plate-like member to clamp the two sides of the reinforcing plate side and the adhesive layer side, and pressurize under the conditions of specified temperature, time and pressure. As the plate-like member at this time, for example, a metal plate such as stainless steel can be used.

[0144] The present invention is not limited to the above-described embodiments, and various changes and modifications can be made within the scope of the gist of the invention.

[0145] This application claims priority based on Japanese patent application No. 2022-151756 filed on September 22, 2022 and Japanese patent application No. 2022-151757 filed on September 22, 2022, and all the contents recorded therein are incorporated herein by reference.

Claims

1. A method for manufacturing an electronic component or a semiconductor device, the method comprising the following steps: A process of attaching an object to be processed for manufacturing electronic parts or semiconductor devices to the concavo-convex surface of the adhesive layer; A step of obtaining a processed object by processing the processed object on the adhesive layer; and A step of removing the processed product from the adhesive layer. 2 . The manufacturing method according to claim 1 , wherein the object to be processed is a device, a semiconductor wafer, or a panel.

3. The manufacturing method according to claim 1, wherein the treatment of the object to be treated comprises energy imparting treatment, liquid contact treatment, vacuum treatment, or sealing treatment.

4. The manufacturing method according to claim 1, wherein in the step of performing the treatment, a sealed body is formed by sealing the object to be treated on the adhesive layer with a sealing material, In the removing step, the sealed body including the processed object is removed from the adhesive layer. 5 . The manufacturing method according to claim 4 , wherein in the step of performing the treatment, the sealing body is formed so that the sealing material contacts both the object to be treated and the concavo-convex surface of the adhesive layer. 6 . The manufacturing method according to claim 4 , wherein in the step of performing the treatment, two or more of the objects to be treated arranged at a distance from each other on the concave-convex surface are integrally sealed. 7 . The manufacturing method according to claim 6 , wherein in the step of performing the treatment, two or more of the objects to be treated are sealed integrally and then separated into individual pieces. 8 . The manufacturing method according to claim 1 , wherein the step of attaching the object to be processed includes the step of capturing the object to be processed separated from a holding substrate in the adhesive layer. 9 . The manufacturing method according to claim 1 , wherein the adhesive layer comprises a substrate and an adhesive layer formed on the substrate and having a surface with projections and depressions. 10 . The production method according to claim 1 , wherein the adhesive layer has a plurality of convex portions on the surface that are separated from each other via concave portions.

11. The manufacturing method according to any one of claims 1 to 9, wherein the adhesive layer has a convex portion whose boundary is determined by a concave portion, A ratio of an area of ​​the protrusions to an area of ​​the adhesive layer is not less than 1% and not more than 95%.

12. The manufacturing method according to any one of claims 1 to 9, wherein the adhesive layer is configured so that a ratio of an area of ​​the adhesive layer adhering to one of the processed objects relative to an area of ​​one of the processed objects is 1% to 95%.

13. The manufacturing method according to any one of claims 1 to 9, wherein the area of ​​the processed object is 100 mm 2 the following.

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