Small chip box
By forming specific pad structures on the chiplet surface and coupling micro devices to these pads, the problem of pixel component manufacturing and transfer in the chiplet box structure in the prior art is solved, stable connection and efficient transfer are achieved, and overall circuit performance and reliability are improved.
Patent Information
- Application Number
- CN202380066857.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-10-07
- Filing Date
- 2023-10-10
- Publication Date
- 2025-05-02
AI Technical Summary
The prior art is difficult to efficiently manufacture and transfer pixel elements in a box structure including chiplets, especially in the process of maintaining component stability and efficient coupling to the system substrate.
A specific pad structure is formed on the surface of the chiplet, including a first set of chiplet pads facing away from the substrate and a second set of chiplet pads facing the substrate, and coupling the micro-device to these pads, to achieve stable connection and transfer of pixel elements.
The stable manufacturing and efficient transfer of pixel components in the chip small box structure is realized, ensuring good coupling between the components and the system substrate, and improving overall circuit performance and reliability.
Smart Images
Figure CN119923978A_ABST
Abstract
Description
[0001] Background and technical field
[0002] The present invention relates to a box structure, a pixel element and their manufacturing and transfer processes. Summary of the invention
[0003] The present invention relates to a box structure, wherein the structure includes a substrate, a box layer and a pixel element, the pixel element includes a microdevice, the microdevice has at least one first group of contact pads facing a small chip, a small chip with a pixel driving circuit has at least one first group of small chip pads coupled to the first group of contact pads of the microdevice, and the small chip has a second group of small chip pads on the side opposite to the first small chip pads.
[0004] The present invention also relates to a method for transferring a small chip box, the method comprising a small chip box, wherein the small chip box comprises: a substrate, a box layer and a pixel element, wherein the pixel element comprises a microdevice, the microdevice having at least one first group of contact pads facing the small chip, a small chip having a pixel driving circuit having at least one first group of small chip pads coupled to the first group of contact pads of the microdevice, and the small chip having a second group of small chip pads on the side opposite to the first small chip pads; the method also includes: bonding the second group of pads to a system substrate and coupling to electrodes on the system substrate; and causing the box layer to release the bonded pixel element to remain in the system substrate.
[0005] The present invention also relates to a method for manufacturing a pixel element including a chiplet box, the method comprising: manufacturing a microchip; forming a solder pad on the surface of the microchip; bonding a microdevice to the microchip; forming an interconnect structure, an optical layer, and a color conversion layer; thinning the back side of the microchip; forming a via to connect the microchip interface signal to the other side of the microchip; forming a solder pad on the second side of the microchip; and bonding the structure on the microdevice side to the box layer.
[0006] The present invention also relates to a box structure, which includes a substrate, a box layer and a pixel element, wherein the pixel element includes a small chip connected to the box layer, a small chip having a first group of small chip pads facing away from the substrate and a second group of small chip pads facing the substrate, a microdevice coupled to the small chip through at least one small chip pad in the first group of small chip pads, and the microdevice has at least one first group of microdevice pads facing the small chip.
[0007] The present invention also relates to a method for transferring a small chip box, the method comprising a small chip box, wherein the small chip box comprises: a substrate, a box layer and a pixel element, the pixel element comprising a small chip connected to the box layer, a small chip having a first group of small chip pads facing away from the substrate and a second group of small chip pads facing the substrate, a microdevice coupled to the small chip through at least one small chip pad in the first group of small chip pads, and the microdevice has at least one first group of microdevice pads facing the small chip, the method also includes: bonding the second group of pads to a system substrate and coupling to electrodes on the system substrate, and causing the box layer to release the bonded pixel element to remain in the system substrate.
[0008] The present invention also relates to a method for manufacturing a pixel element including a chiplet box, the method comprising: manufacturing a microchip; forming pads on the surface of the microchip, wherein the microchip has a first group of chiplet pads facing away from the substrate and a second group of chiplet pads facing the substrate; bonding a microdevice to the microchip, wherein the microchip is coupled to the chiplet through at least one chiplet pad in the first group of chiplet pads; forming an interconnect structure, an optical layer, and a color conversion layer; thinning the back side of the microchip; forming vias to connect the microchip interface signal to the other side of the microchip; forming pads on the second side of the microchip; and bonding the structure on the microdevice side to the box layer. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The foregoing and other advantages of the present disclosure will become apparent by reading the following detailed description and referring to the accompanying drawings.
[0010] Figure 1A and Figure 1B A box including a pixel element and a box layer is shown.
[0011] Figure 2A and Figure 2B Another cell structure including a pixel element and a cell layer is shown. DETAILED DESCRIPTION
[0012] The following description relates to the structure and manufacturing method of the chiplet cassette. Various aspects of the transfer mechanism and method of the chiplet cassette are also described in detail.
[0013] Figure 1AA box structure including a substrate 100, a box layer 102, and a pixel element 150 is shown. The pixel element 150 may include microdevices 104, 106, and 108. The microdevices 104, 106, and 108 may be devices of the same or different types. The microdevice may have at least one first set of contact pads 110 facing away from the substrate 100. A chiplet 112 having a pixel drive circuit has at least one first set of chiplet pads 114 coupled to the pads 110 of the microdevice. The chiplet may have a second set of chiplet pads 116 on the side opposite to the first chiplet pads 114. The chiplet may be coupled to more than one microdevice 104, 106, and 108. There may be a separate bonding material that holds the chiplet and the microdevice together. The first set of microdevice pads 110 and the chiplet pads 114 may be bonded together and hold the microdevice and the chiplet together. Herein, the microdevice may be a micro-LED.
[0014] The chiplet 112 may include a substrate. The first set of pads 114 or the second set of pads 116 are coupled to the pixel circuitry through vias in the chiplet substrate.
[0015] During the transfer mechanism, the second set of pads can be bonded to the system substrate and coupled to electrodes on the system substrate. The electrodes can provide power, control signals, data, or another form of voltage or current. The box layer 102 releases the bonded pixel element 150 to remain in the system substrate.
[0016] In one embodiment, micro devices 104, 106, and 108 may have pads on device sides that are different from the first set of micro device pads.After transferring pixel element 150 to a system substrate, electrodes may be formed to couple the second set of micro device pads to electrodes or contacts in the system substrate.
[0017] In development and Figure 1A In one method of a related pixel element, a microchip is manufactured using circuit technology such as CMOS or other technology. Pad 114 is formed on the surface of microchip 112. Microdevices 104, 106, 108 are combined with microchip 112. Here, other processes may be performed, such as forming interconnect structures, optical layers, color conversion layers or other device types. After such a process, the back of the microchip is thinned or the wafer is removed. In this article, vias are formed to connect the microchip interface signals to the other side of the microchip. Pad 116 can be formed on the second side of the microchip. The structure on the microdevice side is combined with a box substrate, or a box layer is formed on the surface of the structure including the microdevice. The process of via formation and interconnection with the chiplet signal can be performed before the microdevice is integrated.
[0018] In another related approach to developing pixel elements, a micro device is integrated into a cell substrate. A microchiplet is then bonded to the micro device.
[0019] Figure 1B A related embodiment is shown in which the first surface of the microchiplet, including the microdevice, is covered by a passivation layer 130. In a related embodiment, the passivation layer 130 is bonded to the box layer.
[0020] Figure 2A A box structure including a substrate 100, a box layer 102, and a pixel element 150 is shown. The pixel element 150 may include a chiplet 114 connected to the box layer 102. The chiplet 112 may have a first set of chiplet pads facing away from the substrate 100 and a second set of chiplet pads facing the substrate 100. Microdevices 104, 106, and 108 are connected to the chiplet through at least one of the first chiplet pads. The microdevices 104, 106, and 108 may be the same or different types of devices. The microdevice may have at least one first set of microdevice pads 110 facing the chiplet 112. The chiplet may have a second set of chiplet pads 116 on the side opposite to the first chiplet pads 114. The chiplet may be coupled to more than one microdevice 104, 106, and 108. There may be a separate bonding material that holds the chiplet and the microdevice together. The first set of microdevice pads 110 and the chiplet pads 114 may be bonded together and hold the microdevice and the chiplet together. There may be pads 120 for micro devices that can be connected to the system substrate.
[0021] The chiplet 112 may include a substrate. The first set of pads 114 or the second set of pads 116 are coupled to the pixel circuitry through vias in the chiplet substrate.
[0022] During the transfer mechanism, the second set of pads can be bonded to the system substrate and coupled to electrodes on the system substrate. The electrodes can provide power, control signals, data, or another form of voltage or current. The box layer 102 releases the bonded pixel element 150 to remain in the system substrate.
[0023] In one embodiment, the second set of chiplet pads can be formed to couple the second set of micro device pads to electrodes or contacts in the system substrate.
[0024] Figure 2B A related embodiment is shown in which the first surface of the microchiplet, including the microdevice, is covered by a passivation layer 130. In a related embodiment, the passivation layer 130 is bonded to the box layer.
[0025] and Figure 1A Compared with Figure 2BIn a related method of developing pixel elements, a microchip is manufactured using circuit technology such as CMOS or other technology. Pad 114 is formed on the surface of microchip 112. Microdevices 104, 106 and 108 are bonded to the microchip. Here, other processes may be performed, such as forming interconnect structures, optical layers, color conversion layers or other device types. After such a process, the back of the microchip is thinned or the wafer is removed. Herein, vias are formed to connect the microchip interface signals to the other side of the microchip. Pad 116 can be formed on the second side of the microchip. The process of via formation and interconnection with the chiplet signal can be performed before the microdevice is integrated. The microchip is bonded to a box substrate, or a box structure is formed on the surface of the chiplet.
[0026] In another related approach to developing pixel elements, microchiplets are integrated into a cell substrate. Microdevices are then bonded to microdevices.
[0027] Although the present disclosure is susceptible to various modifications and alternative forms, specific embodiments or implementations have been shown in the drawings by way of example and will be described in detail herein. However, it should be understood that the present disclosure is not intended to be limited to the specific forms disclosed. On the contrary, the present disclosure will cover all modifications, equivalents and alternative forms that fall within the spirit and scope of the present invention as defined by the appended claims.
Claims
1. A box structure, comprising: Substrate, box layer and pixel element; The pixel element includes a micro device; The micro device has at least one first set of contact pads facing the chiplet; The chiplet has a pixel drive circuit having at least one first set of chiplet pads coupled to a first set of contact pads of the micro device; and The chiplet has a second set of chiplet pads on an opposite side from the first chiplet pads.
2. The box structure of claim 1, wherein the chiplet is coupled to more than one micro device.
3. The box structure of claim 2, wherein there is a separate bonding material holding the chiplets and microdevices together.
4. The box structure of claim 3, wherein the first set of micro device pads and the chiplet pads are bonded together.
5. The box structure of claim 4, wherein the chiplet includes a substrate, and the first set of chiplet pads or the second set of pads are coupled to the pixel circuit through vias in the chiplet substrate. 6 . The box structure of claim 5 , wherein the second set of pads are bonded to a system substrate and are coupled to electrodes on the system substrate during transfer.
7. A method for transferring a small chip box, the method comprising: Having the chiplet box, wherein the chiplet box includes: a substrate, a cartridge layer, and a pixel element, wherein the pixel element comprises a microdevice having at least one first set of contact pads facing a chiplet, the chiplet having a pixel drive circuit having at least one first set of chiplet pads coupled to a first set of contact pads of the microdevice, the chiplet having a second set of chiplet pads on an opposite side from the first chiplet pads; The method further comprises: bonding the second set of pads to a system substrate and coupling to electrodes on the system substrate; and The box layer is caused to release the bonded pixel elements to remain in the system substrate. 8 . The method of claim 7 , wherein the micro device has pads on a side of the micro device that are different from the first set of micro device pads.
9. The method of claim 8, wherein the electrodes are formed to couple the second set of micro device pads to electrodes or contacts in the system substrate after transferring the pixel elements to the system substrate.
10. A method of manufacturing a pixel element comprising a chiplet box, the method comprising: manufacturing of microchips; forming bonding pads on a surface of the microchiplet; bonding a micro-device to the micro-chiplet; forming interconnect structures, optical layers, and color conversion layers; thinning the back side of the microchip; forming vias to connect microchiplet interface signals to another side of the microchiplet; forming a bonding pad on a second side of the microchiplet; and The structure on the micro-device side is bonded to the box layer. 11 . The method according to claim 10 , wherein a box layer is formed on a surface of the structure including the micro device, the micro device being not bonded to the box layer.
12. The method of claim 10, wherein the micro device is integrated into the cartridge substrate and then a microchiplet is bonded to the micro device.
13. The method of claim 10, wherein the first surface of the microchiplet including the microdevice is covered by a passivation layer. The method of claim 11 , wherein the passivation layer is bonded to the box layer.
15. A box structure comprising: Substrate, box layer and pixel element; The pixel element comprises a chiplet connected to the box layer; a chiplet having a first set of chiplet pads facing away from the substrate and a second set of chiplet pads facing toward the substrate; a micro device connected to the chiplet via at least one chiplet pad of the first set of chiplet pads; and The micro device has at least one first set of micro device pads facing the chiplet.
16. The box structure of claim 15, wherein the chiplet is coupled to more than one micro device.
17. The cartridge structure of claim 16 wherein there is a separate bonding material holding the chiplets and microdevices together.
18. The box structure of claim 17, wherein the first set of micro device pads and the chiplet pads are bonded together.
19. The box structure of claim 18, wherein the chiplet includes a substrate, and the first set of chiplet pads or the second set of pads are coupled to the pixel circuit through vias in the chiplet substrate.
20. The box structure of claim 19, wherein the second set of pads are bonded to a system substrate and are coupled to electrodes on the system substrate during transfer.
21. A method for transferring a chiplet box, the method comprising: Having the chiplet box, wherein the chiplet box includes: Substrate, box layer and pixel element; The pixel element comprises a chiplet connected to the box layer; a chiplet having a first set of chiplet pads facing away from the substrate and a second set of chiplet pads facing toward the substrate; a micro device connected to the chiplet via at least one chiplet pad of the first set of chiplet pads; and The micro device has at least one first set of micro device pads facing the chiplet; the method further comprising: bonding the second set of pads to a system substrate and coupling to electrodes on the system substrate; and The box layer is caused to release the bonded pixel elements to remain in the system substrate.
22. The method of claim 21, wherein the micro device has pads on a side of the micro device that are different from the first set of micro device pads.
23. The method of claim 22, wherein the electrodes are formed to couple the second set of micro device pads to electrodes or contacts in the system substrate after transferring pixel elements to the system substrate.
24. A method of manufacturing a pixel element comprising a chiplet box, the method comprising: manufacturing of microchips; forming bonding pads on a surface of the microchiplet, wherein the microchiplet has a first set of chiplet bonding pads facing away from the substrate and a second set of chiplet bonding pads facing the substrate; bonding a micro device to the micro chiplet, wherein the micro device is coupled to the chiplet via at least one chiplet bond pad of the first set of chiplet bond pads; forming interconnect structures, optical layers, and color conversion layers; thinning the back side of the microchip; forming vias to connect microchiplet interface signals to another side of the microchiplet; forming a bonding pad on a second side of the microchiplet; and The structure on the micro-device side is bonded to the box layer.
25. The method of claim 24, wherein the micro device has at least one first set of micro device pads facing the chiplet. 26 . The method of claim 24 , wherein a box layer is formed on a surface of the structure including the micro device, the micro device being not bonded to the box layer.
27. The method of claim 24, wherein the micro device is integrated into the cartridge substrate and then a microchiplet is bonded to the micro device.
28. The method of claim 24, wherein the first surface of the microchiplet including the microdevice is covered by a passivation layer.
29. The method of claim 26, wherein the passivation layer is bonded to the box layer.