Endoscope system, image optimization method and related device

Abstract

The invention discloses an endoscope system, an image optimization method and a related device, and belongs to the technical field of endoscopes. The endoscope system comprises an endoscope and a processing unit. The endoscope comprises an image sensor, a first plugging port, a power supply generation assembly and an illumination module. The endoscope is used for collecting images and obtaining image signals through the image sensor. The power supply generation assembly is used for generating power supply voltage required by the image sensor; the lighting module is used for lighting; the processing unit comprises a second plugging port, an electrical isolation assembly and an image processing assembly; the second plugging port is connected with the electrical isolation assembly; the electrical isolation assembly comprises a plurality of electrical isolation modules corresponding to the image sensors of different interface types; and the image processing assembly is used for optimizing the electrically isolated image signals. The endoscope system not only can be compatible with image sensors with various interface types, but also can perform electrical isolation aiming at different image signals, so that safer electrical isolation is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of endoscopes, and in particular to an endoscope system, an image optimization method and related devices. Background Art

[0002] With the development of medical technology, endoscopic treatment is becoming more and more popular. Different endoscopes may use different types of image sensor interfaces. The endoscope system acquires image signals through the image sensor in the endoscope, processes them, and displays them. However, the current endoscope system only supports endoscopes that use image sensors with analog interfaces and endoscopes that use MIPI (Mobile Industry Processor Interface). In addition, due to the limitations of the devices in the endoscope system, the image signals corresponding to the analog interface and the image signals corresponding to MIPI need to be converted before they can be processed accordingly, which increases the cost of the endoscope system. Summary of the invention

[0003] The present application provides an endoscope system, an image optimization method and related devices, the endoscope system is not only compatible with image sensors of various interface types, but also can electrically isolate image signals corresponding to different interfaces, thereby achieving low-cost and safe electrical isolation. The technical solution is as follows:

[0004] In one aspect, an endoscope system is provided, comprising one or more endoscopes and a processing unit;

[0005] The endoscope comprises an image sensor, a first plug interface, a power generation component and a lighting module, and one or more of the image sensors included in the endoscope have different interface types; the endoscope is used to collect images and obtain image signals through the image sensor; one end of the first plug interface is connected to the image sensor, and the other end of the first plug interface is used to connect to the processing unit; the power generation component is connected to the image sensor, and is used to generate the power supply voltage required by the image sensor; the lighting module is used to illuminate when collecting images;

[0006] The processing unit comprises a second plug interface that matches the first plug interface, an electrical isolation component and an image processing component;

[0007] The second plug interface has multiple pins, and the second plug interface and the first plug interface are pluggable connections, and the multiple pins of the second plug interface can be reused by the image sensors of different interface types; the power supply pin of the second plug interface is connected to the power generation component through the first plug interface, so that the power generation component adjusts the voltage provided by the power supply pin, and the second plug interface is also connected to the electrical isolation component, so that the electrical isolation component receives the image signal sent by the image sensor; the electrical isolation component is also connected to the image processing component, and the electrical isolation component includes multiple electrical isolation modules corresponding to image sensors of different interface types, and each of the electrical isolation modules is used to perform electrical isolation operations on the image signal of the image sensor of the corresponding interface type; the image processing component is used to optimize the image signal after electrical isolation based on the image parameters corresponding to the endoscope after receiving the image signal after electrical isolation, so as to optimize the image captured by the endoscope.

[0008] Optionally, the interface of the image sensor is one or more of MIPI, LVDS (Low-Voltage DifferentialSignaling) interface, analog interface, SerDes (Serializer and Deserializer) interface;

[0009] When the interface of the image sensor is MIPI, the image signal is a first signal, and the electrical isolation module corresponding to the image sensor of MIPI includes a signal separation submodule, a first isolation submodule and a second isolation submodule; the signal separation submodule is respectively connected to the second plug interface, the first isolation submodule and the second isolation submodule, and the first isolation submodule and the second isolation submodule are also connected to the image processing component; the signal separation submodule is used to separate a low-power signal and a high-speed signal from the received first signal, and send the low-power signal to the first isolation submodule, and send the high-speed signal to the second isolation submodule; the first isolation submodule is used to electrically isolate the low-power signal, and send the low-power signal after electrical isolation to the image processing component; the second isolation submodule is used to electrically isolate the high-speed signal, and send the high-speed signal after electrical isolation to the image processing component;

[0010] and / or,

[0011] When the interface of the image sensor is the analog interface or the SerDes interface, the image signal is the second signal, and the electrical isolation module corresponding to the image sensor of the analog interface and the image sensor of the SerDes interface includes a signal conversion submodule and a first isolation submodule; the signal conversion submodule is connected to the second plug interface and the first isolation submodule respectively, and the first isolation submodule is also connected to the image processing component; the signal conversion submodule is used to convert the received second signal into a DVP (Digital Video Port) signal, and send the DVP signal to the first isolation submodule; the first isolation submodule is used to electrically isolate the DVP signal, and send the DVP signal after electrical isolation to the image processing component;

[0012] and / or,

[0013] When the interface of the image sensor is the LVDS interface, the image signal is a third signal, and the electrical isolation module corresponding to the image sensor of the LVDS interface includes a second isolation sub-module; the second isolation sub-module is respectively connected to the second plug interface and the image processing component; the second isolation sub-module is used to electrically isolate the third signal, and send the third signal after electrical isolation to the image processing component.

[0014] Optionally, the electrical isolation module corresponding to the image sensor of MIPI and the electrical isolation modules corresponding to the image sensor of the analog interface and the image sensor of the SerDes interface reuse the same first isolation sub-module; the electrical isolation module corresponding to the image sensor of MIPI and the electrical isolation module corresponding to the image sensor of the LVDS interface reuse the same second isolation sub-module.

[0015] Optionally, the signal separation submodule includes at least one transistor, the first isolation submodule includes a digital isolator, the second isolation submodule includes an LVDS isolator, and the signal conversion submodule includes a decoding chip.

[0016] Optionally, the first plug interface is a microHDMI (micro High Definition Multimedia Interface) male interface, and the second plug interface is a microHDMI female interface.

[0017] Optionally, the power generation component includes a plurality of voltage regulators;

[0018] The plurality of voltage regulators are connected to the power supply pins of the second plug interface through the first plug interface, and the plurality of voltage regulators are also respectively connected to the image sensors for adjusting the voltage output by the power supply pins to generate the voltage required by the image sensor.

[0019] Optionally, the second plug interface further includes a function pin, a lighting power supply pin, a first data transmission pin and a second data transmission pin;

[0020] The function pin can establish a connection with the image sensor of MIPI, the image sensor of LVDS interface, the image sensor of analog interface or the image sensor of SerDes interface, so that the endoscope realizes relevant functions;

[0021] The lighting power supply pin can establish a connection with the image sensor of MIPI, the image sensor of LVDS interface, the image sensor of analog interface or the image sensor of SerDes interface to power the lighting module included in the endoscope;

[0022] The first data transmission pin and the second data transmission pin can both establish a connection with the MIPI image sensor or the LVDS interface image sensor to achieve data transmission of the above-mentioned image sensor;

[0023] The first data transmission pin or the second data transmission pin can be connected to the image sensor of the SerDes interface to implement data transmission of the image sensor of the SerDes interface.

[0024] On the other hand, an image optimization method is provided, which is applied to an endoscope system, wherein the endoscope system includes one or more endoscopes, and the endoscope includes an image sensor, and the image optimization method includes:

[0025] In response to a user's photographing operation, acquiring an image signal;

[0026] Determining a target electrical isolation operation based on the type of the image signal, and electrically isolating the image signal according to the target electrical isolation operation, wherein the target electrical isolation mode is one of a plurality of electrical isolation operations, and the type of the image signal is related to an interface type of the image sensor;

[0027] The image signal after electrical isolation is optimized based on the image parameters corresponding to the endoscope, so as to optimize the image collected by the endoscope.

[0028] On the other hand, a computer-readable storage medium is provided, wherein a computer program is stored in the storage medium, and the computer program can be executed by a processor to implement the steps of the above-mentioned image optimization method.

[0029] On the other hand, a computer program product comprising instructions is provided. When the instructions are executed on a computer, the computer executes the steps of the above-mentioned image optimization method.

[0030] The technical solution provided by this application can at least bring the following beneficial effects:

[0031] The image sensors included in the endoscope in the endoscope system in the embodiment of the present application have different interface types, that is, the endoscope system is compatible with image sensors of different interface types, and the application scenarios are more extensive; moreover, the endoscope also includes a power generation component, and the second plug interface of the processing unit also includes a power supply pin, the power generation component is respectively connected to the image sensor and the power supply pin, and can adjust the voltage from the power supply pin to the power supply voltage required by the image sensor to meet the power demand of the image sensor. Only one power supply pin is needed to provide the corresponding power supply voltage for the endoscope, which can save resources; in addition, the electrical isolation component in the processing unit also includes multiple electrical isolation modules corresponding to image sensors of different interface types, and each electrical isolation module can be used to perform electrical isolation operations on image signals sent by image sensors of the corresponding interface type, that is, the electrical isolation of image signals sent by image sensors of different interface types is separate, thereby performing more targeted electrical isolation on the image signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a schematic structural diagram of an endoscope system provided in an embodiment of the present application;

[0033] Figure 2 is a structural schematic diagram of an electrical isolation module provided in an embodiment of the present application;

[0034] Figure 3 is a schematic diagram of the structure of another electrical isolation module provided in an embodiment of the present application;

[0035] Figure 4 is a structural schematic diagram of another electrical isolation module provided in an embodiment of the present application;

[0036] Figure 5 is a structural schematic diagram of another electrical isolation module provided in an embodiment of the present application;

[0037] Figure 6 is a structural schematic diagram of another electrical isolation module provided in an embodiment of the present application;

[0038] Figure 7 It is a schematic diagram of the connection relationship of a power generation component provided in an embodiment of the present application;

[0039] Figure 8 is a structural schematic diagram of a second plug interface provided in an embodiment of the present application;

[0040] Fig. 9 It is a flowchart of an image optimization method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] The present invention is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are for making the present application better understood. However, those skilled in the art can easily recognize that some features can be omitted in different situations, or can be replaced by other elements, materials, methods. In some cases, some operations related to the present application are not shown or described in the specification, this is to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations according to the description in the specification and the general technical knowledge in the art.

[0042] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations. At the same time, the steps or actions in the method description can also be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment and are not meant to be a required sequence, unless otherwise specified that a certain sequence must be followed.

[0043] The serial numbers of the components in this document, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0044] With the development of medical technology, endoscopic treatment is becoming more and more popular. The interface types of image sensors used by different endoscopes may be different. Endoscopic systems are divided according to functional modules, mainly including image acquisition module, electrical isolation module and image processing module. The image acquisition module is mainly performed by the endoscope for image acquisition. That is to say, the endoscope system will obtain image signals through the image sensor in the endoscope, and then the image signals will be sent to the image processing module after passing through the electrical isolation module, and then the image processing module will optimize the image and then project it to the display screen.

[0045] The current endoscope system only supports endoscopes that use image sensors with analog interfaces and endoscopes that use MIPI (Mobile Industry Processor Interface) image sensors. In addition, due to the limitations of the electrical isolation module on the interface type, the image signal corresponding to the analog interface needs to be converted into parallel data before passing through the isolation module. The image signal corresponding to MIPI also needs to be converted into other signals before passing through the isolation module, which increases the isolation cost.

[0046] Based on this, an embodiment of the present application provides an endoscope system that is not only compatible with image sensors of various interface types, but also can electrically isolate image signals corresponding to different interfaces, thereby achieving low-cost and safe electrical isolation.

[0047] Next, the endoscope system provided in the embodiment of the present application is introduced in detail.

[0048] Please refer to Figure 1 , Figure 1It is a structural schematic diagram of an endoscope system provided by an embodiment of the present application. The endoscope system includes one or more endoscopes 1 and a processing unit 2; the endoscope 1 includes an image sensor 11, a first plug interface 12, a power generation component 13 and an illumination module 14, and the interface types of the image sensor 11 included in the one or more endoscopes 1 are different; the endoscope 1 is used to collect images and obtain image signals through the image sensor 11; one end of the first plug interface 12 is connected to the image sensor 11, and the other end of the first plug interface 12 is used to connect to the processing unit 2; the power generation component 13 is connected to the image sensor 11, and is used to generate the power supply voltage required by the image sensor 11; the illumination module 14 is used to illuminate when collecting images. The processing unit 2 includes a second plug interface 21 that matches the first plug interface 12 in terms of plugging, an electrical isolation component 22, and an image processing component 23; the second plug interface 21 has a plurality of pins, the second plug interface 21 and the first plug interface 12 are pluggable, and the plurality of pins of the second plug interface 21 can be reused by image sensors 11 of different interface types; the power supply pin 211 of the second plug interface 21 is connected to the power supply generation component 13 through the first plug interface 12, so that the power supply generation component 13 adjusts the voltage provided by the power supply pin 211, and the second plug interface 21 is also connected to the electrical isolation component 22, so that the electrical The isolation component 22 receives the image signal sent by the image sensor 11; the electrical isolation component 22 is also connected to the image processing component 23, and the electrical isolation component 22 includes multiple electrical isolation modules 221 corresponding to image sensors 11 of different interface types, and each electrical isolation module 221 is used to perform electrical isolation operations on the image signal of the image sensor 11 of the corresponding interface type; the image processing component 23 is used to optimize the image signal after electrical isolation based on the image parameters corresponding to the endoscope 1 after receiving the image signal after electrical isolation, so as to optimize the image captured by the endoscope 1.

[0049] One or more endoscopes 1 include image sensors 11 with different interface types, that is, the endoscope system supports image sensors with multiple interface types.

[0050] Since the power supply pin 221 of the second socket 21 is connected to the power generation component 13 through the first socket 12, and the power generation component 13 is also connected to the image sensor 11, when the first socket 12 and the second socket 21 are connected, the power generation component 13 can obtain voltage from the power supply pin 221, and the power generation component 13 can adjust the obtained voltage to generate the voltage required by the image sensor 11, so that the image sensor 11 can capture the image signal.

[0051] Since the endoscope 1 further includes a first plug interface 12, and one end of the first plug interface 12 is connected to the image sensor 11, and the processing unit 2 further includes a second plug interface 21 that matches the first plug interface 12, and the second plug interface 21 is also connected to the electrical isolation component 22, the first plug interface 12 and the second plug interface 21 are pluggable. Therefore, when the first plug interface 12 and the second plug interface 21 are connected, the image sensor 11 can send the collected image signal to the processing unit 2, and the electrical isolation component 22 can receive the image signal sent by the image sensor 11. When the first plug interface 12 and the second plug interface 21 are not connected, the electrical isolation component 22 cannot receive the image signal sent by the image sensor 11.

[0052] Continuing with the above description, after the electrical isolation component 22 receives the image signal, it can perform an electrical isolation operation on the received image signal. Moreover, the electrical isolation component 22 includes a plurality of electrical isolation modules 221 corresponding to image sensors 11 of different interface types, that is, since the types of image signals sent by image sensors 11 of different interface types are also different, the electrical isolation component 22 needs to perform different electrical isolation operations for different image signals, so the electrical isolation component 22 includes a plurality of electrical isolation modules 221, and the plurality of different electrical isolation modules 221 correspond to different types of image signals, that is, each electrical isolation module in the plurality of electrical isolation modules 221 is used to perform an electrical isolation operation on the corresponding image signal.

[0053] Since the electrical isolation component 22 is also connected to the image processing component 23, after the electrical isolation component 22 performs an electrical isolation operation on the image signal, the image component 23 can receive the image signal after the electrical isolation. Then, the image signal can be optimized according to the image parameters corresponding to the endoscope 1. Since the image signal is obtained based on the image collected by the endoscope 1, the image collected by the endoscope 1 can be optimized by optimizing the image signal.

[0054] In some embodiments, the first plug interface 12 further includes a first encryption circuit, which stores the identification and image parameters of the endoscope 1; and the second plug interface 21 further includes a second encryption circuit, which can be bound to the first encryption circuit, so that when the second plug interface 21 receives an image signal, the image parameters corresponding to the image signal can be obtained, so that in the subsequent process, the image processing component 23 optimizes the image signal according to the image parameters corresponding to the endoscope 1. Moreover, since the first encryption circuit is bound to the second encryption circuit, it is possible to avoid the illegal replacement of accessories in the endoscope system and achieve safe management of the endoscope system.

[0055] In some embodiments, the interface of the image sensor 11 is one or more of MIPI, LVDS interface, analog interface, and SerDes interface.

[0056] That is to say, the interface of the image sensor 11 used by the endoscope 1 in the endoscope system can be MIPI, LVDS interface, analog interface or SerDes interface. Of course, in the application, the interface of the image sensor 11 can also be other interfaces, which is not limited in the embodiment of the present application.

[0057] Next, the electrical isolation submodules corresponding to the image sensor interfaces MIPI, LVDS interface, analog interface, and SerDes interface will be described respectively.

[0058] When the interface of the image sensor 11 is MIPI, the image signal is the first signal, such as Figure 2 As shown, the electrical isolation module 221 corresponding to the MIPI image sensor 11 includes a signal separation submodule 2211, a first isolation submodule 2212 and a second isolation submodule 2213; the signal separation submodule 2211 is respectively connected to the second plug interface 21, the first isolation submodule 2212 and the second isolation submodule 2213, and the first isolation submodule 2212 and the second isolation submodule 2213 are also connected to the image processing component 23; the signal separation submodule 2211 is used to separate the low-power signal and the high-speed signal from the received first signal, and send the low-power signal to the first isolation submodule 2212, and send the high-speed signal to the second isolation submodule 2213; the first isolation submodule 2212 is used to electrically isolate the low-power signal, and send the low-power signal after electrical isolation to the image processing component 23; the second isolation submodule 2213 is used to electrically isolate the high-speed signal, and send the high-speed signal after electrical isolation to the image processing component 23.

[0059] In some embodiments, the image signal sent by the image sensor 11 whose interface is MIPI is a first signal, and the electrical isolation component 22 includes multiple electrical isolation modules 221 corresponding to image sensors of different interface types. Therefore, the electrical isolation component 22 also includes an electrical isolation module 221 corresponding to the image sensor of MIPI, and the electrical isolation module 221 is used to perform electrical isolation operations on the first signal.

[0060] Since the image signal sent by the image sensor 11 with a MIPI interface may include a low-power signal and a high-speed signal, and the electrical isolation operations required for the above two signals are different, the electrical isolation module 221 corresponding to the image sensor 11 with a MIPI interface may include a signal separation submodule 2211, and the signal separation submodule 2211 is also connected to the second plug interface. Therefore, when the endoscope 1 using the MIPI image sensor 11 is connected to the processing unit 2, the signal separation submodule 2211 can receive the first signal, and after receiving the first signal, separate the low-power signal and the high-speed signal therein, thereby performing electrical isolation operations separately in subsequent processes.

[0061] Continuing with the above description, since the low-power signal and the high-speed signal need to be electrically isolated respectively, the electrical isolation module 221 corresponding to the image sensor 11 of the MIPI interface may include a first isolation submodule 2212 for electrically isolating the low-power signal, and may also include a second isolation submodule 2213 for electrically isolating the high-speed signal. And the signal separation submodule 2211 is also connected to the first isolation submodule 2212 and the second isolation submodule 2213 respectively, so that the first isolation submodule 2212 can receive the low-power signal, and the second isolation submodule 2213 can receive the high-speed signal, so that the first isolation submodule 2212 and the second isolation submodule 2213 can perform electrical isolation operations on the corresponding signals.

[0062] Moreover, the first isolation module 2212 and the second isolation module 2213 are also connected to the image processing component 23, so the image processing component 23 can receive the low-power signal and the high-speed signal after electrical isolation, and optimize the above two.

[0063] Since only the low-power signal and the high-speed signal in the first signal need to be electrically isolated respectively without converting the first signal, the cost of electrical isolation of the first signal can be reduced.

[0064] It should be noted that the above description is based on the electrical isolation module 221 corresponding to the image sensor 11 of the MIPI interface, which includes a signal separation sub-module 2211, a first isolation sub-module 2212 and a second isolation sub-module 2213. Alternatively, in an application, the electrical isolation module 221 corresponding to the image sensor 11 of the MIPI interface may also include other components, which is not limited in the embodiments of the present application.

[0065] In the case where the interface of the image sensor 11 is an analog interface or a SerDes interface, the image signal is the second signal, such as Figure 3As shown, the electrical isolation module 221 corresponding to the image sensor 11 of the analog interface and the image sensor 11 of the SerDes interface includes a signal conversion submodule 2214 and a first isolation submodule 2212; the signal conversion submodule 2214 is respectively connected to the second plug interface 21 and the first isolation submodule 2212, and the first isolation submodule 2212 is also connected to the image processing component 23; the signal conversion submodule 2214 is used to convert the received second signal into a DVP signal, and send the DVP signal to the first isolation submodule 2212; the first isolation submodule 2212 is used to electrically isolate the DVP signal, and send the DVP signal after electrical isolation to the image processing component 23.

[0066] In some embodiments, the image signal sent by the image sensor 11 whose interface is an analog interface is a second signal, and the image signal sent by the image sensor 11 whose interface is a SerDes interface is also a second signal, and thus, the electrical isolation module 221 corresponding to the image sensor 11 whose interface is an analog interface and the image sensor 11 whose interface is a SerDes interface can be the same, that is, the electrical isolation module 221 corresponding to the image sensor 11 whose interface is an analog interface and the image sensor 11 whose interface is a SerDes interface is used to electrically isolate the second signal.

[0067] Due to the limitation of the electrical isolation device, the second signal needs to be converted before the corresponding electrical isolation operation can be performed. Therefore, the electrical isolation module 221 corresponding to the image sensor 11 with the analog interface and the image sensor 11 with the SerDes interface may include a signal conversion submodule 2214. Since the signal conversion submodule 2214 is connected to the second plug interface 21, when the image sensor 11 with the analog interface or the endoscope 1 with the image sensor 11 with the SerDes interface is connected to the processing unit 2, the signal conversion submodule 2214 can receive the second signal and convert the second signal into a DVP signal, so as to perform an electrical isolation operation on the DVP signal in the subsequent process, that is, perform an electrical isolation operation on the second signal.

[0068] Continuing with the above description, after the signal conversion submodule 2214 converts the second signal into a DVP signal that meets the requirements of the electrical isolation device, it is also necessary to electrically isolate the DVP signal, and then electrically isolate the second signal, so the electrical isolation module 221 corresponding to the image sensor 11 of the analog interface and the image sensor 11 of the SerDes interface can also include a first isolation submodule 2212. Moreover, the signal conversion submodule 2214 is also connected to the first isolation submodule 2212, so the first isolation submodule 2212 can receive the DVP signal and perform corresponding electrical isolation operations on the DVP signal.

[0069] Moreover, the first isolation module 2212 is also connected to the image processing component 23, so the image processing component 23 can receive the DVP signal after electrical isolation and optimize it.

[0070] It should be noted that the above description is based on the electrical isolation module 221 corresponding to the image sensor 11 with an analog interface and the image sensor 11 with a SerDes interface, including a signal conversion submodule 2214 and a first isolation submodule 2212. Alternatively, in an application, the electrical isolation module 221 corresponding to the image sensor 11 with an analog interface and the image sensor 11 with a SerDes interface may also include other components, which is not limited to the embodiments of the present application.

[0071] In the case where the interface of the image sensor 11 is an LVDS interface, the image signal is a third signal, such as Figure 4 As shown, the electrical isolation module 221 corresponding to the image sensor 11 of the LVDS interface includes a second isolation sub-module 2213; the second isolation sub-module 2213 is respectively connected to the second plug-in interface 21 and the image processing component 23; the second isolation sub-module 2213 is used to electrically isolate the third signal, and send the third signal after electrical isolation to the image processing component 23.

[0072] In some embodiments, the image signal sent by the image sensor 11 with an LVDS interface is a third signal, so the electrical isolation component 22 also includes an electrical isolation module 221 corresponding to the image sensor 11 with an LVDS interface, and the electrical isolation module 221 is used to perform electrical isolation operations on the third signal.

[0073] Since the third signal can be directly electrically isolated, the electrical isolation module 221 of the image sensor 11 with the LVDS interface only needs to include the second isolation submodule 2213. The second isolation submodule 2213 is connected to the second plug interface 21. Therefore, when the endoscope 1 using the image sensor 11 with the LVDS interface is connected to the processing unit 2, the second isolation submodule 2213 can receive the third signal and perform corresponding electrical isolation operations on the third signal. The second isolation submodule 2213 is also connected to the image processing component 23. Therefore, the image processing component 23 can receive the third signal after electrical isolation and optimize it.

[0074] It should be noted that the above description is based on the electrical isolation module 221 corresponding to the image sensor 11 of the LVDS interface including the second isolation sub-module 2213, or, in application, the electrical isolation module 221 corresponding to the image sensor 11 of the LVDS interface may also include other components, and the embodiment of the present application does not limit this.

[0075] In some embodiments, Figure 5 As shown, the electrical isolation module 221 corresponding to the MIPI image sensor 11 and the electrical isolation modules 221 corresponding to the image sensor 11 of the analog interface and the image sensor 11 of the SerDes interface reuse the same first isolation sub-module 2212; the electrical isolation module 221 corresponding to the MIPI image sensor 11 and the electrical isolation module 221 corresponding to the image sensor 11 of the LVDS interface reuse the same second isolation sub-module 2213.

[0076] In order to reduce the volume of the endoscope system and save the cost of electrical isolation, the first isolation submodule 2212 in the electrical isolation module 221 corresponding to the MIPI image sensor 11 and the first isolation submodule 2212 in the electrical isolation module 221 corresponding to the image sensor 11 with an analog interface and the image sensor 11 with a SerDes interface are the same isolation submodule. It can be seen that the first isolation submodule 2212 can perform electrical isolation operations on both low-power signals and DVP signals, that is, when the processing unit 2 is connected to the endoscope 1 using the MIPI image sensor 11, the first isolation submodule 2212 can perform corresponding electrical isolation operations on the first signal; when the processing unit 2 is connected to the endoscope 1 using the analog interface image sensor 11 or the endoscope 1 using the SerDes interface image sensor 11, the first isolation submodule 2212 can also perform corresponding electrical isolation operations on the second signal.

[0077] The second isolation submodule 2213 in the electrical isolation module 221 corresponding to the MIPI image sensor 11 and the second isolation submodule 2213 in the electrical isolation module 221 corresponding to the LVDS interface image sensor 11 are the same isolation submodule. It can be seen that the second isolation submodule 2213 can perform electrical isolation operations on both high-speed signals and third signals. That is, when the processing unit 2 is connected to the endoscope 1 using the MIPI image sensor 11, the second isolation submodule 2213 can perform corresponding electrical isolation operations on the first signal; when the processing unit 2 is connected to the endoscope 1 using the LVDS interface image sensor 11, the second isolation submodule 2213 can perform corresponding electrical isolation operations on the third signal.

[0078] In some embodiments, Figure 6 As shown, the signal separation submodule 2211 includes at least one transistor Q1, the first isolation submodule 2212 includes a digital isolator QS1, the second isolation submodule includes an LVDS isolator QS2, and the signal conversion submodule 2214 includes a decoding chip C1.

[0079] The first signal is separated into a low-power signal and a high-speed signal by the transistor Q1, so that low-cost electrical isolation of the first signal can be achieved.

[0080] The digital isolator QS1 is a chip that has high resistance isolation characteristics when transmitting digital or analog signals in the endoscope system to achieve isolation between the endoscope system and the user, thereby improving safety and reducing ground loop noise.

[0081] An LVDS isolator is an electronic device used to isolate LVDS signals, i.e. low voltage differential signals. It transmits data on two wires through a differential signal pair and has the advantages of low power consumption, low electromagnetic interference and high transmission rate.

[0082] The decoding chip C1 is an integrated circuit used to convert digital signals into visible, audible or perceptible signals to achieve decoding and playback of multimedia data.

[0083] It should be noted that the above is explained by the signal separation submodule 2211 including at least one transistor Q1, or, in application, the signal separation submodule may also include a MIPI to LVDS bridge chip; the above is explained by the first isolation submodule 2212 including a digital isolator QS1, the second isolation submodule including an LVDS isolator QS2, and the signal conversion submodule 2214 including a decoding chip C1, or, in application, the above three may include other components. The present application embodiment does not limit this.

[0084] In some embodiments, the first plug interface 12 is a microHDMI male interface, and the second plug interface 21 is a microHDMI female interface. Since the micro HDMI interface can process video signals up to 1080p, when the user uses the endoscope system, it can provide the user with high-quality high-definition resolution, and since the microHDMI interface is smaller in size, it can reduce the occupied area of ​​the endoscope system heavy interface.

[0085] In some embodiments, Figure 7 As shown, the power generation component 13 includes multiple voltage regulators 131 (three voltage regulators 131 are exemplified in the figure); the multiple voltage regulators 131 are connected to the power supply pin 211 of the second plug interface 21 through the first plug interface 12, and the multiple voltage regulators 131 are also connected to the image sensor 11 respectively, for adjusting the voltage output by the power supply pin 211 to generate the voltage required by the image sensor 11.

[0086] Since each of the multiple voltage regulators 131 can be connected to the power supply pin 211 through the first plug interface 12, when the endoscope 1 is connected to the processing unit 2, the multiple voltage regulators 131 can receive the voltage from the power supply pin 211 and adjust the voltage to different voltages, thereby meeting the power demand of the image sensor 11. Moreover, the multiple voltage regulators 131 are also connected to the image sensor 11 respectively, so that after the multiple voltage regulators 131 adjust the voltage from the power supply pin 211, the adjusted voltage can be output to the image sensor 11. For example, please refer to Figure 7 ,from Figure 7 It can be seen that the power generation component 13 includes three voltage regulators 131, and the above three voltage regulators 131 can adjust the voltage from the power supply pin 211 to 2.8V, 1.8V and 1.2V, and are all connected to the image sensor 11. Therefore, the image sensor 11 can obtain voltages of 2.8V, 1.8V and 1.2V to meet its own power needs.

[0087] It should be noted that the voltage regulator 131 may be an LDO (low dropout regulator) or other voltage regulators, which is not limited in the embodiment of the present application.

[0088] In some embodiments, Figure 8 As shown, the second plug interface 21 also includes a function pin 212, an illumination power supply pin 213, a first data transmission pin 214 and a second data transmission pin 215; the function pin 212 can establish a connection with the image sensor 11 of MIPI, the image sensor 11 of the LVDS interface, the image sensor 11 of the analog interface or the image sensor 11 of the SerDes interface, so that the endoscope 1 can realize related functions; the illumination power supply pin 213 can establish a connection with the image sensor 11 of MIPI, the image sensor 11 of the LVDS interface, the image sensor 11 of the analog interface or the image sensor 11 of the SerDes interface, so as to power the illumination module 14 included in the endoscope 1; the first data transmission pin 214 and the second data transmission pin 215 can both establish a connection with the image sensor 11 of MIPI or the image sensor 11 of the LVDS interface to realize the data transmission of the above-mentioned image sensor 11; the first data transmission pin 214 or the second data transmission pin 215 can be connected to the image sensor 11 of the SerDes interface to realize the data transmission of the image sensor 11 of the SerDes interface.

[0089] That is to say, when the endoscope 1 is connected to the processing unit 2 , the endoscope 1 can realize various functions through the function pin 212 , and the lighting module 14 in the endoscope 1 can also be powered through the lighting power supply pin 213 .

[0090] Since the first signal sent by the MIPI image sensor 11 and the third signal sent by the LVDS interface image sensor 11 are differential signals, and two sets of transmission pins are required to transmit the first signal and the third signal, when the processing unit 2 is connected to the endoscope 1 using the MIPI image sensor 11, the first data transmission pin 214 and the second data transmission pin 215 can both establish a connection with the MIPI image sensor 11 through the second plug interface 21, thereby realizing the transmission of the first signal. Similarly, when the processing unit 2 is connected to the endoscope 1 using the LVDS interface image sensor 11, the first data transmission pin 214 and the second data transmission pin 215 can also establish a connection with the LVDS interface image sensor 11 through the second plug interface 21, thereby realizing the transmission of the third signal.

[0091] Since the second signal sent by the image sensor 11 of the SerDes interface is also a differential signal, but only one set of transmission pins is needed to transmit the second signal, therefore, when the processing unit 2 is connected to the endoscope 1 using the image sensor 11 of the SerDes interface, only one of the first data transmission pin 214 and the second data transmission pin 215 needs to establish a connection with the image sensor 11 of the SerDes interface through the second plug interface 21 to achieve the transmission of the second signal.

[0092] In some embodiments, the endoscope 1 also includes a pressure sensor and a charge pump, wherein the charge pump is connected to the power supply pin 211 and the pressure sensor respectively, and the charge pump is used to adjust the voltage from the power supply pin 211 to the required voltage of the pressure sensor so that the pressure sensor can detect the pressure when the endoscope 1 is in use.

[0093] In addition, in some embodiments, the endoscope also includes a filtering circuit, which can filter out interference with the image signal.

[0094] The image sensors included in the endoscope in the endoscope system in the embodiment of the present application have different interface types, that is, the endoscope system is compatible with image sensors of different interface types, and the application scenarios are more extensive; moreover, the endoscope also includes a power generation component, and the second plug interface of the processing unit also includes a power supply pin, and the power generation component is respectively connected to the image sensor and the power supply pin, and can adjust the voltage from the power supply pin to the power supply voltage required by the image sensor to meet the power demand of the image sensor. In this way, only one power supply pin is needed to provide the corresponding power supply voltage for the endoscope, which can save resources; in addition, the electrical isolation component in the processing unit also includes multiple electrical isolation modules corresponding to image sensors of different interface types, and each electrical isolation module can be used to perform electrical isolation operations on image signals sent by image sensors of the corresponding interface type, that is, the electrical isolation of image signals sent by image sensors of different interface types is separate, thereby performing more targeted electrical isolation on the image signals.

[0095] In addition, the first plug interface may also include a first encryption circuit, in which the identification and image parameters of the endoscope 1 are stored, and the second plug interface also includes a second encryption circuit that can be bound to the first encryption circuit, so that the image parameters corresponding to the image signal can be obtained at the second plug interface, so that the image processing component optimizes the image signal according to the image parameters corresponding to the endoscope in the subsequent process; and because the first encryption circuit is bound to the second encryption circuit, the illegal replacement of accessories in the endoscope system can be avoided, and the safety management of the endoscope system can be achieved. The interface of the image sensor can be one or more of MIPI, LVDS interface, analog interface, and SerDes interface, and when the interface of the image sensor is MIPI, the corresponding electrical isolation module includes a signal separation submodule, which can include a transistor, and can realize the separation of low-power signals and high-speed signals in the first signal, and electrically isolate them respectively, not only without converting the signal, but also realizing low-cost and safe electrical isolation.

[0096] Next, the image optimization method provided in the embodiment of the present application is introduced in detail.

[0097] Fig. 9 : is a flow chart of an image optimization method provided in an embodiment of the present application, the method is applied to an endoscope system, the endoscope system includes one or more endoscopes, the endoscope includes an image sensor; the image optimization method includes:

[0098] Step 901: In response to a user's photographing operation, an image signal is acquired.

[0099] In some embodiments, when the endoscope is used by a user, the endoscope system can acquire corresponding image signals in response to the user's photographing operation.

[0100] Step 902: Determine a target electrical isolation operation based on the type of the image signal, and electrically isolate the image signal according to the target electrical isolation operation. The target electrical isolation mode is one of multiple electrical isolation operations. The type of the image signal is related to the interface type of the image sensor.

[0101] In some embodiments, since the interface types of the image sensors included in the endoscope are different, the types of image signals obtained may also be different, and the electrical isolation operations corresponding to image sensors with different interface types are also different, that is, the electrical isolation operations corresponding to different types of image signals are different. Therefore, after acquiring the image signal, it is also necessary to determine how to electrically isolate the image signal based on the type of the image signal, that is, determine the target electrical isolation operation from multiple electrical isolation operations. Then, the image signal is electrically isolated according to the target electrical isolation operation.

[0102] Step 903: Optimizing the image signal after electrical isolation based on the image parameters corresponding to the endoscope, so as to optimize the image collected by the endoscope.

[0103] In some embodiments, the endoscope system also includes an encryption circuit, which stores the identification of the endoscope and image parameters. Therefore, the endoscope system can directly obtain the image parameters corresponding to the endoscope, and optimize the image signal after electrical isolation based on the image parameters, thereby optimizing the image captured by the endoscope.

[0104] The embodiment of the present application acquires an image signal. Since the type of the image signal is related to the interface type of the image sensor, and different types of image signals correspond to different electrical isolation operations, it is necessary to determine the target electrical isolation operation based on the type of the image signal. It can be seen that different types of image signals correspond to different electrical isolation operations, which can achieve more targeted electrical isolation and improve the safety of the endoscope system when it is used.

[0105] Those skilled in the art will appreciate that all or part of the functions of the various methods in the above-mentioned embodiments can be implemented by hardware or by computer programs. When all or part of the functions in the above-mentioned embodiments are implemented by computer programs, the program can be stored in a computer-readable storage medium, and the storage medium can include: read-only memory, random access memory, disk, optical disk, hard disk, etc., and the program is executed by a computer to implement the above-mentioned functions. For example, the program is stored in the memory of the device, and when the program in the memory is executed by the processor, all or part of the above-mentioned functions can be implemented. In addition, when all or part of the functions in the above-mentioned embodiments are implemented by computer programs, the program can also be stored in a storage medium such as a server, another computer, disk, optical disk, flash disk or mobile hard disk, and can be downloaded or copied and saved in the memory of the local device, or the system of the local device is updated, and when the program in the memory is executed by the processor, all or part of the functions in the above-mentioned embodiments can be implemented.

[0106] The above specific examples are used to illustrate the present invention, which is only used to help understand the present invention and is not intended to limit the present invention. For those skilled in the art, according to the concept of the present invention, some simple deductions, modifications or substitutions can be made.

Claims

1. An endoscope system, characterized in that: comprising one or more endoscopes and a processing unit; The endoscope comprises an image sensor, a first plug interface, a power generation component and a lighting module, and one or more of the image sensors included in the endoscope have different interface types; the endoscope is used to collect images and obtain image signals through the image sensor; one end of the first plug interface is connected to the image sensor, and the other end of the first plug interface is used to connect to the processing unit; the power generation component is connected to the image sensor, and is used to generate the power supply voltage required by the image sensor; the lighting module is used to illuminate when collecting images; The processing unit comprises a second plug interface that matches the first plug interface, an electrical isolation component and an image processing component; The second plug interface has multiple pins, and the second plug interface and the first plug interface are pluggable connections, and the multiple pins of the second plug interface can be reused by the image sensors of different interface types; the power supply pin of the second plug interface is connected to the power generation component through the first plug interface, so that the power generation component adjusts the voltage provided by the power supply pin, and the second plug interface is also connected to the electrical isolation component, so that the electrical isolation component receives the image signal sent by the image sensor; the electrical isolation component is also connected to the image processing component, and the electrical isolation component includes multiple electrical isolation modules corresponding to image sensors of different interface types, and each of the electrical isolation modules is used to perform electrical isolation operations on the image signal of the image sensor of the corresponding interface type; the image processing component is used to optimize the image signal after electrical isolation based on the image parameters corresponding to the endoscope after receiving the image signal after electrical isolation, so as to optimize the image captured by the endoscope.

2. The endoscope system according to claim 1, wherein: The interface of the image sensor is one or more of MIPI, LVDS interface, analog interface, and SerDes interface; When the interface of the image sensor is MIPI, the image signal is a first signal, and the electrical isolation module corresponding to the image sensor of MIPI includes a signal separation submodule, a first isolation submodule and a second isolation submodule; the signal separation submodule is respectively connected to the second plug interface, the first isolation submodule and the second isolation submodule, and the first isolation submodule and the second isolation submodule are also connected to the image processing component; the signal separation submodule is used to separate a low-power signal and a high-speed signal from the received first signal, and send the low-power signal to the first isolation submodule, and send the high-speed signal to the second isolation submodule; the first isolation submodule is used to electrically isolate the low-power signal, and send the low-power signal after electrical isolation to the image processing component; the second isolation submodule is used to electrically isolate the high-speed signal, and send the high-speed signal after electrical isolation to the image processing component; and / or, When the interface of the image sensor is the analog interface or the SerDes interface, the image signal is the second signal, and the electrical isolation module corresponding to the image sensor of the analog interface and the image sensor of the SerDes interface includes a signal conversion submodule and a first isolation submodule; the signal conversion submodule is connected to the second plug interface and the first isolation submodule respectively, and the first isolation submodule is also connected to the image processing component; the signal conversion submodule is used to convert the received second signal into a DVP signal, and send the DVP signal to the first isolation submodule; The first isolation submodule is used to electrically isolate the DVP signal and send the DVP signal after electrical isolation to the image processing component; and / or, When the interface of the image sensor is the LVDS interface, the image signal is a third signal, and the electrical isolation module corresponding to the image sensor of the LVDS interface includes a second isolation sub-module; the second isolation sub-module is respectively connected to the second plug interface and the image processing component; the second isolation sub-module is used to electrically isolate the third signal, and send the third signal after electrical isolation to the image processing component.

3. The endoscope system according to claim 2, characterized in that: The electrical isolation module corresponding to the image sensor of MIPI and the electrical isolation modules corresponding to the image sensor of the analog interface and the image sensor of the SerDes interface reuse the same first isolation sub-module; the electrical isolation module corresponding to the image sensor of MIPI and the electrical isolation module corresponding to the image sensor of the LVDS interface reuse the same second isolation sub-module.

4. The endoscope system according to claim 2, wherein: The signal separation submodule includes at least one transistor, the first isolation submodule includes a digital isolator, the second isolation submodule includes an LVDS isolator, and the signal conversion submodule includes a decoding chip.

5. The endoscope system according to claim 1, wherein: The first plug interface is a microHDMI male interface, and the second plug interface is a microHDMI female interface.

6. The endoscope system according to claims 1 to 5, characterized in that: The power generation component includes a plurality of voltage regulators; The plurality of voltage regulators are connected to the power supply pins of the second plug interface through the first plug interface, and the plurality of voltage regulators are also respectively connected to the image sensors for adjusting the voltage output by the power supply pins to generate the voltage required by the image sensor.

7. The endoscope system according to claims 1 to 5, characterized in that: The second plug interface further includes a function pin, a lighting power supply pin, a first data transmission pin and a second data transmission pin; The function pin can establish a connection with the image sensor of MIPI, the image sensor of LVDS interface, the image sensor of analog interface or the image sensor of SerDes interface, so that the endoscope realizes relevant functions; The lighting power supply pin can establish a connection with the image sensor of MIPI, the image sensor of LVDS interface, the image sensor of analog interface or the image sensor of SerDes interface to power the lighting module included in the endoscope; The first data transmission pin and the second data transmission pin can both establish a connection with the MIPI image sensor or the LVDS interface image sensor to achieve data transmission of the above-mentioned image sensor; The first data transmission pin or the second data transmission pin can be connected to the image sensor of the SerDes interface to implement data transmission of the image sensor of the SerDes interface.

8. An image optimization method, characterized in that: Applied to an endoscope system, the endoscope system includes one or more endoscopes, the endoscope includes an image sensor, and the image optimization method includes: In response to a user's photographing operation, acquiring an image signal; Determining a target electrical isolation operation based on the type of the image signal, and electrically isolating the image signal according to the target electrical isolation operation, wherein the target electrical isolation mode is one of a plurality of electrical isolation operations, and the type of the image signal is related to an interface type of the image sensor; The image signal after electrical isolation is optimized based on the image parameters corresponding to the endoscope, so as to optimize the image collected by the endoscope.

9. A computer-readable storage medium, characterized in that: The medium stores a computer program, which can be executed by a processor to implement the method according to claim 8.

10. A computer program product comprising a computer program and / or instructions, characterized in that: When the computer program and / or the instructions are executed by a processor, the method according to claim 8 is implemented.

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