Microfluidic chip and microfluidic system

Abstract

The invention belongs to the technical field of microfluidics, and particularly relates to a micro-fluidic chip and a micro-fluidic system.The micro-fluidic chip is used for detecting the position of liquid drops and comprises a first substrate; the first base plate comprises a first substrate and a detection area arranged on the first substrate, the detection area comprises a moving area, and the liquid drops can move in the moving area; the non-moving area is arranged on the outer side of the moving area, the non-moving area is provided with a limiting unit, and the limiting unit can limit the liquid drops to move in the moving area. According to the micro-fluidic chip in the scheme, liquid drop deviation can be avoided, liquid drop loss is reduced, and the detection accuracy of the micro-fluidic chip is improved.

Description

Technical Field

[0001] The present application belongs to the field of microfluidics technology, and specifically relates to a microfluidics chip and a microfluidics system. Background Art

[0002] Microfluidic technology is a technology that is mainly characterized by the manipulation of fluids in micrometer-scale space. It can concentrate multiple steps in biological, chemical, and medical analysis processes on a micrometer-level chip and automatically complete the entire analysis process. Due to the strong integration of microfluidic chips, the advantages of fast analysis speed, low loss, low material consumption, and low pollution when processing samples, it has shown great prospects in many fields such as biomedical research, drug synthesis screening, environmental monitoring and protection, health quarantine, forensic identification, and detection of biological reagents.

[0003] Microfluidic chips can automatically prepare and manipulate samples in the form of droplets. They mainly use the dielectric wetting effect to drive the movement of droplets. In the application of the dielectric wetting effect, the dielectric layer is crucial. However, droplets are prone to deviation when moving in microfluidic chips, resulting in droplet loss and inaccurate detection of microfluidic chips. Summary of the invention

[0004] The purpose of the present application is to solve the problem in the prior art that droplets are prone to deviation in a microfluidic chip, resulting in droplet loss and inaccurate detection of the microfluidic chip.

[0005] In a first aspect, the present application provides a microfluidic chip for detecting the position of a droplet, wherein the microfluidic chip comprises a first substrate; the first substrate comprises a first substrate and a detection area provided on the first substrate, wherein the detection area comprises:

[0006] a moving zone in which the droplets can move;

[0007] The non-moving area is arranged outside the moving area. The non-moving area is provided with a limiting unit, and the limiting unit can limit the movement of the droplets in the moving area.

[0008] In an exemplary embodiment of the present application, the first substrate further comprises a plurality of first electrodes arranged in an array in a row direction and a column direction;

[0009] A plurality of the first electrodes are arranged in the moving area. The moving area is extended in the row direction and / or the column direction. The non-moving area is arranged at the diagonal positions of the first electrodes.

[0010] In an exemplary embodiment of the present application, the limiting unit is a raised layer, which is provided on the first substrate and located at the non-moving area, and the film thickness of the moving area is lower than the film thickness in the non-moving area.

[0011] In an exemplary embodiment of the present application, the first substrate further includes:

[0012] A driving layer, provided on the first substrate, and both the moving area and the non-moving area are provided with the driving layer;

[0013] a first insulating layer, provided on the first substrate and covering the driving layer, the first electrode being provided on a side of the first insulating layer away from the first substrate, and a via hole being provided on the first insulating layer in the moving area, the first electrode being electrically connected to the driving layer through the via hole, and the first insulating layer being provided in both the moving area and the non-moving area;

[0014] a second insulating layer, disposed on a side of the first insulating layer away from the first substrate and covering the first electrode, wherein the second insulating layer is disposed on both the moving area and the non-moving area;

[0015] The enhancement layer is arranged on a side of the second insulating layer away from the first substrate, and an orthographic projection of the enhancement layer on the first substrate and an orthographic projection of the first electrode located in the non-moving area on the first substrate have at least an overlapping area.

[0016] In an exemplary embodiment of the present application, the enhancement layer is at least one of an organic layer, a metal layer, and an inorganic layer.

[0017] In an exemplary embodiment of the present application, the driving layer is a first metal layer, the first insulating layer is arranged to cover the first metal layer, and in the moving area: the first electrode is connected to the first metal layer through a via hole on the first insulating layer.

[0018] In an exemplary embodiment of the present application, the driving layer is a first transistor, which includes a first gate, a first source, a first drain and a first active layer, the first source and the first drain are respectively arranged at two ends of the first active layer and are electrically connected to the first active layer, and the first electrode is connected to the first drain.

[0019] In an exemplary embodiment of the present application, the first substrate further comprises a heightened layer, the heightened layer is provided on the first substrate, and the heightened layer is located at the moving area, and the film thickness of the moving area is higher than the film thickness in the non-moving area;

[0020] The limiting unit is a second transistor, the second transistor is electrically connected to a first electrode located in the non-moving area, and the first electrode in the non-moving area can drive the droplet to flow back into the moving area.

[0021] In an exemplary embodiment of the present application, the limiting unit is a blocking member;

[0022] The blocking member is disposed on one of the first substrate and the second substrate, the blocking member abuts against both the first substrate and the second substrate, and an orthographic projection of the blocking member on the first substrate is located in the non-moving area.

[0023] A second aspect of the present application provides a microfluidic system, comprising any of the microfluidic chips described above.

[0024] The microfluidic chip and microfluidic system of the present application have at least the following beneficial effects:

[0025] The microfluidic chip of the present application includes a first substrate, which includes a first substrate and a detection area arranged on the first substrate, and the detection area can detect the position of the droplet to obtain the position of the droplet in real time. The detection area includes a moving area and a non-moving area, and the droplet can move in the moving area. The non-moving area is arranged outside the moving area, and a limiting unit is arranged in the non-moving area. The limiting unit can limit the movement of the droplet in the moving area, prevent the droplet from moving to the non-moving area, reduce the droplet loss, and ensure the detection accuracy of the microfluidic chip.

[0026] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0027] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 A schematic cross-sectional structure diagram of the microfluidic chip provided in Embodiment 1 or Embodiment 9 of the present application is shown.

[0030] Figure 2 A schematic diagram of the arrangement structure of the movable area and the non-movable area of ​​the first substrate provided in Examples 1 to 9 of the present application is shown.

[0031] Figure 3 A schematic cross-sectional structure diagram of an organic layer used in the raised layer provided in the first or ninth embodiment of the present application is shown.

[0032] Figure 4 A schematic cross-sectional structure diagram of the second substrate provided in Embodiments 1 to 9 of the present application is shown.

[0033] Figure 5 A schematic cross-sectional structure diagram of the second metal layer used in the raised layer provided in the second or ninth embodiment of the present application is shown.

[0034] Figure 6 A schematic cross-sectional structure diagram of an inorganic layer used in the enhanced layer provided in the third or ninth embodiment of the present application is shown.

[0035] Figure 7 A schematic diagram of the cross-sectional structure of a stacked layer using an organic layer and a second metal layer is shown in the fifth or ninth embodiment of the present application.

[0036] Figure 8 A schematic diagram of the cross-sectional structure of a stacked layer using an inorganic layer and a second metal layer is shown in the fifth or ninth embodiment of the present application.

[0037] Fig. 9 A schematic diagram of the cross-sectional structure of the stacked layers of organic layers and inorganic layers provided in the fifth or ninth embodiment of the present application is shown.

[0038] Fig.10 A schematic diagram of the cross-sectional structure of the stacked layers of an organic layer, a second metal layer and an inorganic layer provided in the fifth or ninth embodiment of the present application is shown.

[0039] Fig.11 A schematic cross-sectional structure diagram of a liquid droplet provided in Embodiment 6 or Embodiment 9 of the present application being arranged between a first substrate and a second substrate is shown.

[0040] Fig.12 A schematic cross-sectional structure diagram of a first transistor in the driving layer provided in the sixth or ninth embodiment of the present application is shown.

[0041] Fig.13 A schematic cross-sectional structure diagram of the second metal layer used in the enhanced layer provided in the sixth or ninth embodiment of the present application is shown.

[0042] Fig.14 A schematic cross-sectional structure diagram of an inorganic layer used in the enhanced layer provided in Embodiment 6 or Embodiment 9 of the present application is shown.

[0043] Fig.15A schematic diagram of the cross-sectional structure of a stacked layer using an organic layer and a second metal layer is shown in the sixth or ninth embodiment of the present application.

[0044] Fig.16 A schematic diagram of the cross-sectional structure of a stacked layer using an inorganic layer and a second metal layer is shown in the sixth or ninth embodiment of the present application.

[0045] Fig.17 A schematic diagram of the cross-sectional structure of the stacked layers of organic layers and inorganic layers provided in the sixth or ninth embodiment of the present application is shown.

[0046] Fig.18 A schematic diagram of the cross-sectional structure of the stacked layers of an organic layer, a second metal layer and an inorganic layer provided in the sixth or ninth embodiment of the present application is shown.

[0047] Fig.19 A schematic cross-sectional structure diagram of a liquid droplet provided in Embodiment 7 or Embodiment 9 of the present application located between a first substrate and a second substrate is shown.

[0048] Fig. 20 A schematic diagram of the cross-sectional structure in which the film thickness in the mobile area provided in the seventh or ninth embodiment of the present application is higher than the film thickness in the non-mobile area is shown.

[0049] Fig.21 A schematic cross-sectional structure diagram of a blocking member provided at a non-moving area provided in Embodiment 8 or Embodiment 9 of the present application is shown.

[0050] Description of reference numerals:

[0051] 100. Microfluidic chip;

[0052] 110, first substrate; 111, first substrate; 112, mobile area; 112a, first mobile area; 112b, second mobile area; 1121, third metal block; 1122, fourth metal block; 113, non-mobile area; 1131, first metal block; 1132, second metal block; 114, first electrode;

[0053] 115, driving layer; 1150, first metal layer; 1151, first transistor; 11510, first gate; 11511, first active layer; 11512, first source; 11513, first drain; 1152, second transistor; 11520, second gate; 11521, second active layer; 11522, second source; 11523, second drain;

[0054] 116, first insulating layer; 1160, first via hole; 1161, fourth via hole; 117, second insulating layer; 1170, second via hole; 1171, third via hole; 1172, fifth via hole; 118, increased layer; 118a, organic layer; 118b, second metal layer; 118c, inorganic layer; 119, first hydrophobic layer; 1110, third insulating layer; 1120, blocking member;

[0055] 120, second substrate; 121, second underlay; 122, second electrode; 123, second hydrophobic layer; 200, droplet. DETAILED DESCRIPTION

[0056] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0057] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0058] In this application, unless otherwise clearly specified and limited, the terms "assembly", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0059] In addition, described feature, structure or characteristic can be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present application. However, those skilled in the art will appreciate that the technical scheme of the present application can be put into practice without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, known methods, devices, realizations or operations are not shown or described in detail to avoid blurring the various aspects of the application.

[0060] Embodiment 1

[0061] Figure 1A schematic diagram of the cross-sectional structure of a droplet between a first substrate and a second substrate is shown.

[0062] The first embodiment of the present application provides a microfluidic chip 100, which can be used as a carrier for droplet 200 operations. The droplet 200 can perform a series of operations in the microfluidic chip 100, such as moving, separating or mixing. The microfluidic chip 100 can also be used to detect the position of the droplet 200 in real time to accurately and quickly obtain the position of the droplet 200 in the microfluidic chip 100.

[0063] It is understandable that, in the exemplary embodiment, the droplet 200 may be a cell, protein, chromosome, etc. in a solution in a biological tissue, or may be other liquid substances, which are not listed here one by one.

[0064] In some embodiments of the present application, see Figure 1 As shown, the microfluidic chip 100 includes a first substrate 110 and a second substrate 120 arranged oppositely and in parallel. The first substrate 110 and the second substrate 120 are spaced apart by a preset distance to form a receiving cavity. The droplet 200 can be received in the receiving cavity, and the droplet 200 contacts the surfaces of the first substrate 110 and the second substrate 120, respectively.

[0065] It should be noted that the liquid can be injected into the receiving cavity through the liquid droplet 200 inlet of the microfluidic chip 100 .

[0066] In some embodiments of the present application, the first substrate 110 and the second substrate 120 may be relatively fixed by a frame. The frame may be rectangular, circular or other shapes, and may be formed by connecting a plurality of frame strips end to end and arranged at the outer edge of the microfluidic chip 100. The frame strips may be connected by bonding or clamping, or may be an integrated structure.

[0067] It is understandable that in other exemplary embodiments, the first substrate 110 and the second substrate 120 may also be relatively fixed by a frame sealing adhesive.

[0068] In some embodiments of the present application, the height between the first substrate 110 and the second substrate 120 may be greater than the height of the droplet 200 in the thickness direction of the first substrate 110 or the second substrate 120 to ensure that the droplet 200 can move in the receiving cavity to avoid the jamming phenomenon. The thickness direction of the first substrate 110 or the second substrate 120 refers to the direction from the first substrate 110 to the second substrate 120.

[0069] In some embodiments of the present application, the first substrate 110 includes a transparent first substrate 111, and the first substrate 111 is used to provide a platform for forming various functional layers of the first substrate 110. The second substrate 120 includes a transparent second substrate 121, and the second substrate 121 is used to provide a platform for forming various functional layers of the second substrate 120.

[0070] In some embodiments of the present application, the first substrate 111 and the second substrate 121 may be rigid substrates made of glass or quartz, or may be flexible substrates made of materials such as polyimide (PI), which are not listed here one by one.

[0071] In some embodiments of the present application, the first substrate 110 further includes a detection area and a non-detection area disposed on the first substrate 111. The detection area is used to detect the droplet 200, and the non-detection area is disposed around the outer edge of the detection area.

[0072] Figure 2 A schematic diagram of the arrangement structure of the mobile area and the non-mobile area of ​​the present application is shown.

[0073] Among them, see Figure 2 As shown, the detection area includes a moving area 112 and a non-moving area 113 . The moving area 112 can be used for the droplet 200 to move, and the non-moving area 113 is arranged outside the moving area 112 .

[0074] In some embodiments of the present application, the non-moving area 113 is provided with a limiting unit, which can limit the droplet 200 to move in the moving area 112, and will not move toward the non-moving area 113, so as to confine the droplet 200 in the moving area 112, prevent the droplet 200 from deviating, avoid the loss of the droplet 200, and can detect the position of the droplet 200 in real time, thereby ensuring the detection accuracy of the microfluidic chip 100.

[0075] Figure 3 A schematic diagram of the cross-sectional structure of the moving area and the non-moving area is shown. Figure 4 A schematic cross-sectional structure diagram of the second substrate is shown.

[0076] In some embodiments of the present application, the first substrate 110 further includes a first electrode layer disposed on a side of the first substrate 111 facing the second substrate 121. Figure 2 As shown, the first electrode layer includes a plurality of first electrodes 114 arranged in an array in a row direction X and a column direction Y, and adjacent first electrodes 114 are spaced apart and insulated from each other.

[0077] In some embodiments of the present application, see Figure 4As shown, the second substrate 120 also includes a transparent second electrode layer arranged on the side of the second substrate 121 facing the first substrate 111, and the second electrode layer includes a second electrode 122. The second electrode 122 can adopt a full-surface design to reduce the cost of preparing the second electrode 122, thereby reducing the cost of the overall microfluidic chip 100.

[0078] It should be noted that the first electrode 114 may be a transparent electrode or an opaque electrode, which may be specifically designed according to different embodiments.

[0079] In some embodiments of the present application, the first electrode 114 and the second electrode 122 can be made of transparent conductive materials such as indium tin oxide (ITO), zinc tin oxide (ZTO), zinc oxide (ZnO), indium zinc oxide (IZO), gallium indium tin oxide (GIZO), etc., which are not listed here one by one.

[0080] The droplet 200 may be driven to move in the receiving chamber by changing the voltage difference between adjacent first electrodes 114 .

[0081] It should be noted that the principle that the droplet 200 can move in the receiving cavity according to the voltage difference formed between adjacent first electrodes 114 is the electrowetting technology on the medium. The electrowetting technology on the medium refers to the technology of changing the contact angle of the droplet 200 on the surface of the medium by applying a voltage signal, causing the droplet 200 to deform asymmetrically, thereby generating internal force to achieve the control of the droplet 200.

[0082] In some embodiments of the present application, see Figure 2 As shown, a plurality of first electrodes 114 are disposed in the moving area 112 to drive the droplet 200 to move in the moving area 112 so as to detect the position of the droplet 200 in real time.

[0083] In some embodiments of the present application, the droplet 200 can move in the row direction X or the column direction Y, that is, the moving area 112 is extended in the row direction X or the column direction Y.

[0084] It should be noted that, in some other embodiments, the droplet 200 may also move in other directions, such as obliquely.

[0085] In some embodiments of the present application, the detection area includes a plurality of first moving areas 112a arranged at intervals in the row direction X and second moving areas 112b arranged at intervals in the column direction Y. The first moving areas 112a and the second moving areas 112b are arranged to cross each other, and the droplet 200 can move in the first moving area 112a or the second moving area 112b.

[0086] In some embodiments of the present application, see Figure 2As shown, when the first substrate 110 is observed from a top view, the first electrode 114 is in a square structure, and a non-moving area 113 is provided outside the first electrode 114 .

[0087] In some embodiments of the present application, see Figure 2 As shown, a non-movable area 113 is provided at the four diagonals of the first electrode 114. The limiting units in the non-movable area 113 can limit the movement of the droplet 200 toward the non-movable area 113, that is, move in an oblique direction when the droplet 200 moves toward the non-movable area 113, thereby ensuring that the droplet 200 can continue to move in the first moving area 112a and the second moving area 112b, avoiding the loss of the droplet 200, and further ensuring the detection accuracy of the microfluidic chip 100.

[0088] It is understandable that the droplets 200 flow into or out of the microfluidic chip 100 through the droplet 200 inlet and outlet of the microfluidic chip 100, so no limiting unit may be provided at the diagonal of the first electrode 114 at the droplet 200 inlet and outlet to ensure that the droplets 200 can effectively enter or flow out of the first moving area 112a or the second moving area 112b.

[0089] In addition, the limiting units at the diagonals of adjacent first electrodes 114 can be shared to reduce the space occupied by the non-moving area 113 and increase the range of the detection area.

[0090] In some embodiments of this application, please continue to refer to Figure 2 As shown, the non-movable area 113 is arranged at a position where the first moving area 112a and the second moving area 112b do not overlap each other, that is, at the four diagonals of the first electrode 114, so as to ensure that when the droplet 200 moves in the first moving area 112a, the limiting unit in the non-movable area 113 can limit the droplet 200, and at the same time ensure that when the droplet 200 moves in the second moving area 112b, the limiting unit in the non-movable area 113 can also limit the droplet 200, thereby preventing the droplet 200 from moving in an oblique direction, reducing the loss of the droplet 200, and ensuring the detection effect of the microfluidic chip 100.

[0091] That is to say, a non-movable area 113 is arranged at the four diagonals of the first electrode 114, and a limiting unit is set in the non-movable area 113, which can limit the droplets 200 on the first electrode 114 to move toward the four diagonals of the upper left, lower left, upper right and lower right, and limit the droplets 200 to move in the moving area 112, thereby avoiding the loss of the droplets 200 and ensuring the detection effect of the microfluidic chip 100.

[0092] In some embodiments of the present application, see Figure 1 and Figure 3As shown, the first substrate 110 further includes a driving layer 115 , a first insulating layer 116 and a second insulating layer 117 .

[0093] See also Figure 1 or Figure 3 As shown, the driving layer 115 is disposed on a side of the first electrode layer close to the first substrate 111 .

[0094] Please continue to see Figure 3 As shown, the first insulating layer 116 is arranged to cover the driving layer 115, and a first via hole 1160 is provided on the first insulating layer 116 located in the moving area 112. The first electrode 114 is arranged on the side of the first insulating layer 116 away from the first substrate 111, and a part of the first electrode 114 is filled into the first via hole 1160, so that the first electrode 114 is electrically connected to the driving layer 115, so that the first electrode 114 can receive the driving voltage of the driving layer 115 to change the voltage of the first electrode 114, and then change the contact angle on the first electrode 114, so as to control the movement of the droplet 200 in the moving area 112.

[0095] Understandably, please continue to see Figure 3 As shown, adding a first insulating layer 116 between the driving layer 115 and the first electrode 114 can avoid crosstalk between the driving layer 115 and the first electrode 114, ensure that the voltage on the first electrode 114 remains normal, so as to ensure that the contact angle on the first electrode 114 is normal, and further ensure that the droplet 200 moves normally in the moving area 112.

[0096] Please continue to see Figure 3 As shown, the second insulating layer 117 is disposed on a side of the first insulating layer 116 away from the first substrate 111 and covers the first electrode 114 .

[0097] The first insulating layer 116 and the second insulating layer 117 may be made of the same material. For example, the first insulating layer 116 and the second insulating layer 117 may be made of an inorganic insulating material or an organic insulating material, such as a resin.

[0098] In some embodiments of this application, please continue to refer to Figure 3 As shown, the mobile area 112 and the non-mobile area 113 both include a driving layer 115, a first insulating layer 116, a first electrode 114 and a second insulating layer 117, and the driving layer 115 in the mobile area 112 is electrically connected to the first electrode 114 through a first via 1160 on the first insulating layer 116, and the driving layer 115 in the non-mobile area 113 is not electrically connected to the first electrode 114.

[0099] In some embodiments of this application, please continue to refer to Figure 3As shown, the limiting unit is a raised layer 118, which is disposed on the first substrate 111 and located in the non-moving area 113. The raised layer 118 can make the film thickness in the non-moving area 113 higher than the film thickness in the moving area 112. In this way, when the droplet 200 moves to the non-moving area 113, due to the limiting effect of the raised layer 118, the droplet 200 is continuously maintained in the moving area 112, and will not deviate obliquely, thereby avoiding the loss of the droplet 200 and ensuring the detection effect of the microfluidic chip 100.

[0100] In other words, please continue to see Figure 3 As shown, since a raised layer 118 is added in the non-moving area 113, the heights of the four diagonals of the first electrode 114 are higher than the height inside the first electrode 114, which can prevent the droplets 200 from flowing obliquely, confine the droplets 200 in the moving area 112, prevent the droplets 200 from flowing obliquely, and reduce the loss of the droplets 200.

[0101] In some embodiments of this application, please continue to refer to Figure 3 As shown, the enhanced layer 118 in the non-moving area 113 can be arranged on the side of the second insulating layer 117 away from the first substrate 111, and the orthographic projection of the enhanced layer 118 on the first substrate 111 and the orthographic projection of the first electrode 114 located in the non-moving area 113 on the first substrate 111 have at least an overlapping area, so that the film layer height in the non-moving area 113 can be the sum of the driving layer 115, the first insulating layer 116, the first electrode 114, the second insulating layer 117 and the enhanced layer 118, so that the film layer height in the non-moving area 113 is higher than the sum of the heights of the driving layer 115, the first insulating layer 116, the first electrode 114 and the second insulating layer 117 in the moving area 112, so that the droplet 200 is confined in the moving area 112, the droplet 200 is prevented from tilting and moving, and the loss of the droplet 200 is reduced.

[0102] It can be seen that the height of the membrane layer in the non-moving area 113 is higher than that in the moving area 112 by the thickness of the membrane layer of the increased layer 118, which makes the thickness of the membrane layer in the non-moving area 113 higher than that in the moving area 112, so that the droplet 200 can be continuously maintained in the moving area 112 and will not deviate obliquely, thereby avoiding the loss of the droplet 200 and ensuring the detection effect of the microfluidic chip 100.

[0103] It should be noted that in some other embodiments, the raised layer 118 may also be disposed at other film layer positions, for example, the raised layer 118 is disposed at a side of the first electrode 114 close to the first substrate 111. As long as the raised layer 118 can increase the height of the non-moving region 113, it will be sufficient.

[0104] In some embodiments of this application, please continue to refer to Figure 3As shown, the raised layer 118 may be an organic layer 118a. The organic layer 118a is disposed on a side of the second insulating layer 117 away from the first substrate 111, and the orthographic projection of the organic layer 118a on the first substrate 111 is located within the orthographic projection of the first electrode 114 on the first substrate 111, so that the height in the non-moving area 113 is higher than the height in the moving area 112, thereby preventing the droplet 200 from sliding obliquely, reducing the loss of the droplet 200, and ensuring the detection accuracy of the microfluidic chip 100.

[0105] The organic layer 118 a may be made of soluble polytetrafluoroethylene (PFA) or polyimide (PI). Of course, the organic layer 118 a may also be made of other organic materials as long as the height of the non-moving area 113 can be increased.

[0106] It is worth mentioning that in some embodiments of the present application, the microfluidic chip 100 can use a passive driving method to drive the droplets 200 to move in the moving area 112.

[0107] For example, please see Figure 3 As shown, the driving layer 115 is a metal electrode prepared by patterning a first metal layer 1150, and the metal electrode is electrically connected to an external driving voltage. The metal electrode corresponds to the first electrode 114 one by one, and the metal electrode in the moving area 112 is electrically connected to the first electrode 114 through a first via 1160, and a first insulating layer 116 is provided between the metal electrode in the non-moving area 113 and the first electrode 114, and the two are insulated from each other.

[0108] That is, the difference between the moving area 112 and the non-moving area 113 is that an organic layer 118a is provided in the non-moving area 113, which increases the height of the non-moving area 113, effectively confines the droplets 200 in the moving area 112, prevents the droplets 200 from running off, and reduces the loss of the droplets 200.

[0109] It is worth mentioning that the difference in film thickness between the mobile area 112 and the non-mobile area 113 can be prepared by using a halftone mask.

[0110] In some embodiments of this application, please continue to refer to Figure 3 As shown, the first substrate 110 further includes a first hydrophobic layer 119, and the second substrate 120 further includes a second hydrophobic layer 123. The first hydrophobic layer 119 is disposed on a side of the second insulating layer 117 away from the first substrate 111, and covers the organic layer 118a. The second hydrophobic layer 123 is disposed on a side of the second electrode 122 away from the second substrate 121.

[0111] It should be noted that the first hydrophobic layer 119 and the second hydrophobic layer 123 are arranged opposite to each other and spaced apart, and the droplet 200 is located between the first hydrophobic layer 119 and the second hydrophobic layer 123. The first hydrophobic layer 119 and the second hydrophobic layer 123 are used to prevent the droplet 200 from excessively adhering to the first substrate 110 and the second substrate 120, thereby helping the droplet 200 to move in the accommodating cavity.

[0112] In an exemplary embodiment, the first hydrophobic layer 119 and the second hydrophobic layer 123 may be made of the same material, such as Teflon.

[0113] In some embodiments of the present application, the microfluidic chip 100 may be a digital microfluidic chip 100 , so that the droplets 200 may be manipulated more accurately.

[0114] Embodiment 2

[0115] Figure 5 A schematic diagram of the structure in which the second metal layer is used in the increased layer is shown.

[0116] The difference between the second embodiment of the present application and the first embodiment is that the increased layer 118 uses a second metal layer 118b, such as Figure 5 shown.

[0117] In some embodiments of the present application, the second metal layer 118b is arranged on the side of the second insulating layer 117 away from the first substrate 111, and the second metal layer 118b is covered by the first hydrophobic layer 119. The second metal layer 118b can be used to increase the thickness of the film layer in the non-moving area 113 to avoid oblique flow of droplets 200, reduce the loss of droplets 200, and ensure the detection effect of the microfluidic chip 100.

[0118] It should be noted that the second metal layer 118 b can be made of metal such as aluminum (Al), magnesium (Mg), or silver (Ag).

[0119] Embodiment 3

[0120] Figure 6 A schematic diagram of the structure in which the increased layer adopts an inorganic layer is shown.

[0121] The difference between the third embodiment of the present application and the first and second embodiments is that the increase layer 118 uses an inorganic layer 118c, such as Figure 6 shown.

[0122] In some embodiments of the present application, the inorganic layer 118c is arranged on the side of the second insulating layer 117 away from the first substrate 111, and the inorganic layer 118c is covered by the first hydrophobic layer 119. The inorganic layer 118c can be used to increase the thickness of the film layer in the non-moving area 113 to avoid the oblique flow of the droplets 200, reduce the loss of the droplets 200, and ensure the detection effect of the microfluidic chip 100.

[0123] The inorganic layer 118c can be made of materials such as silicon oxide, silicon nitride, and aluminum oxide.

[0124] Embodiment 4

[0125] The difference between the fourth embodiment of the present application and the first to third embodiments is that the increased layer 118 can adopt a multi-layer stacked structure.

[0126] In one example, a plurality of organic layers 118a are stacked in sequence on the second insulating layer 117, and the plurality of organic layers 118a are covered by the first hydrophobic layer 119. The plurality of organic layers 118a stacked in sequence can increase the height in the non-moving area 113 to prevent the droplets 200 from flowing obliquely, reduce the loss of the droplets 200, and ensure the detection effect of the microfluidic chip 100.

[0127] In another example, a plurality of second metal layers 118b are stacked in sequence on the second insulating layer 117, and the first hydrophobic layer 119 covers the plurality of second metal layers 118b. The height of the non-moving area 113 can be increased by stacking the plurality of second metal layers 118b to avoid the oblique flow of the droplets 200, reduce the loss of the droplets 200, and ensure the detection effect of the microfluidic chip 100.

[0128] In another example, a plurality of inorganic layers 118c are sequentially stacked on the second insulating layer 117, and the first hydrophobic layer 119 covers the plurality of inorganic layers 118c. The plurality of inorganic layers 118c stacked on top of each other can increase the height of the non-moving area 113 to prevent the droplets 200 from flowing obliquely, reduce the loss of the droplets 200, and ensure the detection effect of the microfluidic chip 100.

[0129] Embodiment 5

[0130] Figure 7 A schematic diagram of the stacking structure of the organic layer and the second metal layer used in the build-up layer is shown. Figure 8 A schematic diagram of the stacking structure of the inorganic layer and the second metal layer is shown. Fig. 9 A schematic diagram of the stacked structure of an organic layer and an inorganic layer is shown. Fig.10 A schematic diagram of the stacked structure of the raised layer using an organic layer, a second metal layer and an inorganic layer is shown.

[0131] The difference between the fifth embodiment of the present application and the first to fourth embodiments is that the increased layer 118 adopts a composite laminated structure.

[0132] An optional embodiment, see Figure 7 As shown, the increased layer 118 is a superimposed composite film layer of the second metal layer 118b and the organic layer 118a. The film layer sequence of the organic layer 118a and the second metal layer 118b can be designed according to different embodiments. For example: the second metal layer 118b is arranged on the side of the organic layer 118a close to the first substrate 111, that is, the second metal layer 118b is arranged at the bottom of the organic layer 118a, and the second metal layer 118b is arranged on the side of the first electrode 114 away from the first substrate 111. By superimposing the second metal layer 118b and the organic layer 118a, the height of the non-moving area 113 can be increased to avoid the oblique flow of the droplets 200, reduce the loss of the droplets 200, and ensure the detection effect of the microfluidic chip 100.

[0133] Another optional embodiment, see Fig. 9 As shown, the increased layer 118 is a superimposed composite film layer of an organic layer 118a and an inorganic layer 118c. The film layer sequence of the organic layer 118a and the inorganic layer 118c can be designed according to different embodiments. For example: the inorganic layer 118c is arranged on the side of the organic layer 118a close to the first substrate 111, that is, the inorganic layer 118c is arranged at the bottom of the organic layer 118a, and the inorganic layer 118c is arranged on the side of the first electrode 114 away from the first substrate 111. By superimposing the inorganic layer 118c and the organic layer 118a, the height of the non-moving area 113 can be increased to avoid the oblique flow of the droplets 200, reduce the loss of the droplets 200, and ensure the detection effect of the microfluidic chip 100.

[0134] Another optional embodiment, see Figure 8 As shown, the increased layer 118 is a superimposed composite film layer of the second metal layer 118b and the inorganic layer 118c. The film layer sequence of the second metal layer 118b and the inorganic layer 118c can be designed according to different embodiments. For example: the second metal layer 118b is arranged on the side of the inorganic layer 118c close to the first substrate 111, that is, the second metal layer 118b is arranged at the bottom of the inorganic layer 118c, and the second metal layer 118b is arranged on the side of the first electrode 114 away from the first substrate 111. By superimposing the inorganic layer 118c and the second metal layer 118b, the height of the non-moving area 113 can be increased to avoid the oblique flow of the droplets 200, reduce the loss of the droplets 200, and ensure the detection effect of the microfluidic chip 100.

[0135] In another optional embodiment, see Fig.10As shown, the increased layer 118 is a superimposed composite film layer of an organic layer 118a, a second metal layer 118b and an inorganic layer 118c. The film layer sequence of the organic layer 118a, the second metal layer 118b and the inorganic layer 118c can be designed according to different embodiments. For example: the second metal layer 118b is arranged on the side of the inorganic layer 118c close to the first substrate 111, and the organic layer 118a is arranged on the side of the inorganic layer 118c away from the first substrate 111, that is, the inorganic layer 118c is arranged between the second metal layer 118b and the organic layer 118a, and the second metal layer 118b is arranged on the side of the first electrode 114 away from the first substrate 111. By using the superimposed arrangement of the organic layer 118a, the second metal layer 118b and the inorganic layer 118c, the height of the non-moving area 113 can be increased to avoid the oblique flow of the droplet 200, reduce the loss of the droplet 200, and ensure the detection effect of the microfluidic chip 100.

[0136] Embodiment 6

[0137] Fig.11 A schematic cross-sectional structure diagram of a driving layer in a mobile region using a first transistor is shown. Fig.12 A schematic diagram of the structure in which the raised layer adopts an organic layer is shown. Fig.13 A schematic diagram of the structure in which the second metal layer is used in the increased layer is shown. Fig.14 A schematic diagram of the structure in which the increased layer adopts an inorganic layer is shown. Fig.15 A schematic diagram of the stacking structure of the organic layer and the second metal layer used in the increased layer is shown. Fig.16 A schematic diagram of the stacking structure of the inorganic layer and the second metal layer is shown. Fig.17 A schematic diagram of the stacked structure of an organic layer and an inorganic layer is shown. Fig.18 A schematic diagram of the stacked structure of the raised layer using an organic layer, a second metal layer and an inorganic layer is shown.

[0138] The difference between the sixth embodiment of the present application and the first to fifth embodiments is that the driving layer 115 uses a first transistor 1151 , which can control the driving voltage of different first electrodes 114 according to the moving position of the droplet 200 .

[0139] For example, the first transistor 1151 located in the mobile region 112 includes a first gate 11510, a first active layer 11511, a first source 11512 and a first drain 11513, as shown in FIG. Fig.11 and Fig.12 shown.

[0140] like Fig.12As shown, a plurality of first gates 11510 and a plurality of scanning lines are obtained by patterning the first metal layer 1150. The scanning lines are electrically connected to the first gates 11510. The plurality of first gates 11510 are arranged on the side of the first substrate 111 facing the second substrate 120, and the plurality of first gates 11510 are spaced apart from each other. The first gates 11510 correspond one-to-one to the first electrodes 114.

[0141] like Fig.12 As shown, the first insulating layer 116 covers multiple first gate electrodes 11510, and the first active layer 11511, the first source electrode 11512 and the first drain electrode 11513 are all arranged on the side of the first insulating layer 116 away from the first substrate 111. The first insulating layer 116 is used to isolate the first gate electrode 11510 and the first active layer 11511 to avoid crosstalk between the first gate electrode 11510 and the first active layer 11511.

[0142] like Fig.12 As shown, the first source electrode 11512 and the first drain electrode 11513 made of the third metal layer are respectively disposed at two ends of the first active layer 11511 and are electrically connected to the first active layer 11511 to transmit electrical signals.

[0143] like Fig.12 As shown, the second insulating layer 117 is arranged on the side of the first insulating layer 116 away from the first substrate 111, and covers the first active layer 11511, the first source 11512 and the first drain 11513. The second insulating layer 117 is used to protect the first active layer 11511, the first source 11512 and the first drain 11513.

[0144] like Fig.12 As shown, the first electrode 114 is arranged on a side of the second insulating layer 117 away from the first substrate 111, and a second via hole 1170 for exposing the first drain electrode 11513 is opened on the second insulating layer 117. Part of the first electrode 114 is accommodated in the second via hole 1170 and contacts the first drain electrode 11513 exposed by the second via hole 1170, so that the first electrode 114 is electrically connected to the first drain electrode 11513, so that the first drain electrode 11513 provides a driving voltage to the first electrode 114.

[0145] like Fig.12 As shown, a third insulating layer 1110 is provided on a side of the second insulating layer 117 away from the first substrate 111 , and the third insulating layer 1110 covers the first electrode 114 .

[0146] like Fig.12As shown, in the non-movable area 113, the design is also carried out in the same order of the film layers in the movable area 112, that is, the non-movable area 113 includes a first metal block 1131 arranged in the same layer as the first gate 11510, a first insulating layer 116, a first active layer 11511, a second metal block 1132 arranged in the same layer as the first source 11512 and the first drain 11513, a second insulating layer 117, a first electrode 114 and a third insulating layer 1110.

[0147] And in the preparation process, such as Fig.12 As shown, after the first electrode 114 is prepared, a build-up layer 118 is prepared on the non-moving area 113 , and then a third insulating layer 1110 is prepared. The third insulating layer 1110 covers the first electrode 114 and the build-up layer 118 .

[0148] Among them, Figures 12 to 18 As shown, the raised layer 118 can adopt the raised layer 118 in Embodiments 1 to 5 to increase the height of the non-moving area 113 to avoid the oblique flow of the droplets 200, reduce the loss of the droplets 200, and ensure the detection effect of the microfluidic chip 100.

[0149] It can be seen that the height of the membrane layer in the non-moving area 113 is higher than that in the moving area 112 , so as to avoid the oblique flow of the droplets 200 , reduce the loss of the droplets 200 , and ensure the detection effect of the microfluidic chip 100 .

[0150] It can be understood that the first active layer 11511 in the mobile area 112 and the first active layer 11511 in the non-mobile area 113 are in the same layer and are spaced apart.

[0151] In this application, "same-layer arrangement" refers to using the same film-forming process to form a film layer for forming a specific pattern, and then using the same mask to form a layer structure through a single patterning process. That is, one patterning process corresponds to a mask (also called a photomask). Depending on the specific pattern, a single patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses. This simplifies the manufacturing process, saves manufacturing costs, and improves production efficiency.

[0152] In addition, the second metal block 1132 is arranged on the side of the first active layer 11511 in the non-movable area 113 away from the first substrate 111, that is, the film layers in the non-movable area 113 are superimposed on each other to increase the film layer height of the non-movable area 113, so that the film layer height of the non-movable area 113 is higher than the film layer height of the moving area 112.

[0153] Embodiment 7

[0154] Fig.19 A schematic structural diagram is shown in which a liquid droplet is disposed between a first substrate and a second substrate. Fig. 20 A schematic diagram of a structure in which a second transistor is provided in the non-moving region is shown.

[0155] The difference between Example 7 of the present application and Examples 1 to 6 is that the membrane layer height of the mobile area 112 in Example 7 of the present application is higher than the membrane layer height of the non-mobile area 113, and a second transistor 1152 is provided in the non-mobile area 113. A driving voltage different from that of the adjacent first electrode 114 is applied to the first electrode 114 connected to the second transistor 1152, so that the droplet 200 flows back into the mobile area 112 to limit the movement of the droplet 200 in the mobile area 112.

[0156] See also Fig.19 and Fig. 20 As shown, the non-moving area 113 includes: a second gate 11520 , a first insulating layer 116 , a second active layer 11521 , a second source 11522 , a second drain 11523 , a second insulating layer 117 , a first electrode 114 and a third insulating layer 1110 .

[0157] See also Fig. 20 As shown, the second gate 11520 is disposed on the first substrate 111 , and the second gate 11520 corresponds to the non-moving area 113 one by one.

[0158] See also Fig. 20 As shown, the first insulating layer 116 covers the second gate 11520, and the second active layer 11521 is disposed on the side of the first insulating layer 116 away from the first substrate 111. The second source 11522 and the second drain 11523 are respectively overlapped at two ends of the second active layer 11521 in the non-moving area 113.

[0159] See also Fig. 20 As shown, the second insulating layer 117 is arranged on the side of the first insulating layer 116 away from the first substrate 111, and the third via 1171 is arranged on the second insulating layer 117, and the third via 1171 exposes a portion of the second drain 11523, and the first electrode 114 is arranged on the side of the second insulating layer 117 away from the first substrate 111, and the first electrode 114 is connected to the drain through the third via 1171 to transmit a driving voltage to drive the droplets 200 flowing into the non-moving area 113 to return to the moving area 112, so as to prevent the droplets 200 from running off, reduce the loss of the droplets 200, and ensure the detection effect of the microfluidic chip 100.

[0160] See also Fig. 20As shown, the mobile area 112 includes: a third metal block 1121 , a first insulating layer 116 , a second active layer 11521 , a fourth metal block 1122 , a second insulating layer 117 , a first electrode 114 and a third insulating layer 1110 .

[0161] See also Fig. 20 As shown, the third metal block 1121 is disposed in the same layer as the second gate 11520 in the non-moving region 113. The first insulating layer 116 is disposed on the first substrate 111 and covers the first metal block 1131. The first insulating layer 116 is provided with a fourth via hole 1161.

[0162] See also Fig. 20 As shown, the second active layer 11521 is disposed on a side of the first insulating layer 116 away from the first substrate 111 , and the second active layer 11521 in the mobile area 112 and the second active layer 11521 in the non-mobile area 113 are in the same layer and are spaced apart.

[0163] See also Fig. 20 As shown, the fourth metal block 1122 covers the second active layer 11521 , and is arranged in the same layer as the second source 11522 and the second drain 11523 in the non-moving area 113 , and is electrically connected to the third metal block 1121 through a fourth via 1161 .

[0164] See also Fig. 20 As shown, the second insulating layer 117 covers the fourth metal block 1122, and a fifth via hole 1172 is opened on the second insulating layer 117. The first electrode 114 is arranged on the side of the second insulating layer 117 away from the first substrate 111. The first electrode 114 is electrically connected to the fourth metal block 1122 through the fifth via hole 1172, so that the first electrode 114 is electrically connected to the third metal block 1121, so as to receive the driving voltage on the third metal block 1121, change the contact angle on the first electrode 114, and then drive the droplet 200 to move.

[0165] In this application, "same-layer arrangement" refers to using the same film-forming process to form a film layer for forming a specific pattern, and then using the same mask to form a layer structure through a single patterning process. That is, one patterning process corresponds to a mask (also called a photomask). Depending on the specific pattern, a single patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses. This simplifies the manufacturing process, saves manufacturing costs, and improves production efficiency.

[0166] It is understandable that in some embodiments of the present application, see Fig. 20As shown, the raised layer is a composite layer of the second active layer 11521 and the fourth metal block 1122. Since the fourth metal block 1122 in the mobile area 112 covers the second active layer 11521, the superposition height of the second active layer 11521 and the fourth metal block 1122 in the mobile area 112 is higher than the superposition height of the second active layer 11521 and the second source 11522 or the second drain 11523 in the non-mobile area 113, so that the film layer height in the mobile area 112 is higher than the film layer height in the non-mobile area 113.

[0167] In addition, the heightened layer in the mobile area 112 can also adopt the design method of the heightened layer 118 in Examples 1 to 5, that is, the mobile area 112 can be provided with at least one of the inorganic layer 118c, the organic layer 118a, and the metal layer to increase the height of the mobile area 112, so that the height of the mobile area 112 is higher than the height in the non-mobile area 113, so that the droplets 200 that move out of or mistakenly enter the non-mobile area 113 can be controlled to move to the mobile area 112.

[0168] It is worth mentioning that the difference in film thickness between the mobile area 112 and the non-mobile area 113 can be prepared by using a halftone mask.

[0169] Embodiment 8

[0170] Fig.21 A schematic diagram of a structure in which a blocking member is provided on the non-moving area is shown.

[0171] The difference between the eighth embodiment of the present application and the first to seventh embodiments is that: Fig.21 As shown, the limiting unit is a blocking member 1120. The blocking member 1120 is provided on one of the first substrate 110 and the second substrate 120, and the two ends of the blocking member 1120 are respectively abutted against the first substrate 110 and the second substrate 120. The positive projection of the blocking member 1120 on the first substrate 111 is located in the non-moving area 113. The blocking member 1120 is used to confine the droplet 200 in the moving area 112 to prevent the droplet 200 from running off and reduce the loss of the droplet 200.

[0172] It should be noted that the blocking member 1120 may be made of oleophobic or hydrophobic material or other materials that are not compatible with the droplet 200 .

[0173] For example, a blocking member 1120 is provided on the first substrate 110. The upper and lower ends of the blocking member 1120 are respectively in contact with the first substrate 110 and the second substrate 120 to form a blocking wall, which can prevent the droplet 200 from entering the non-moving area 113, avoid the droplet 200 from running off, reduce the loss of the droplet 200, and ensure the detection effect of the microfluidic chip 100.

[0174] In some embodiments of the present application, the blocking member 1120 can be processed separately on the first substrate 110 or the second substrate 120, or can be processed in the box-aligning process of the first substrate 110 and the second substrate 120.

[0175] Embodiment 9

[0176] Embodiment 4 of the present application provides a microfluidic system, which may be a micro-total analysis system (MTAS), which may realize the control of the movement, separation, polymerization, chemical reaction, biological detection, etc. of a small amount of droplets 200. The microfluidic system includes not only the above-mentioned microfluidic chip 100, but also an optical unit.

[0177] Through the above-mentioned microfluidic chip 100, the limiting unit in the non-moving area 113 can be used to limit the movement of the droplet 200 in the moving area 112, thereby preventing the droplet 200 from running off the track, reducing the loss of the droplet 200, and ensuring the detection effect of the microfluidic chip 100.

[0178] In the description of this specification, the description with reference to the terms "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradicting each other.

[0179] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and description of the present application should fall within the scope of the patent of this application.

Claims

1. A microfluidic chip for detecting the position of a droplet, the microfluidic chip comprising a first substrate; characterized in that: The first substrate includes a first substrate and a detection area provided on the first substrate, and the detection area includes: a moving zone in which the droplets can move; The non-moving area is arranged outside the moving area. The non-moving area is provided with a limiting unit, and the limiting unit can limit the movement of the droplets in the moving area.

2. The microfluidic chip according to claim 1, characterized in that: The first substrate further comprises a plurality of first electrodes arranged in an array in the row direction and the column direction; A plurality of the first electrodes are arranged in the moving area. The moving area is extended in the row direction and / or the column direction. The non-moving area is arranged at the diagonal positions of the first electrodes.

3. The microfluidic chip according to claim 2, characterized in that: The limiting unit is a raised layer, which is disposed on the first substrate and located at the non-moving area. The film thickness of the moving area is lower than the film thickness in the non-moving area.

4. The microfluidic chip according to claim 3, characterized in that: The first substrate further comprises: A driving layer, provided on the first substrate, and both the moving area and the non-moving area are provided with the driving layer; a first insulating layer, provided on the first substrate and covering the driving layer, the first electrode being provided on a side of the first insulating layer away from the first substrate, and a via hole being provided on the first insulating layer in the moving area, the first electrode being electrically connected to the driving layer through the via hole, and the first insulating layer being provided in both the moving area and the non-moving area; a second insulating layer, disposed on a side of the first insulating layer away from the first substrate and covering the first electrode, wherein the second insulating layer is disposed on both the moving area and the non-moving area; The enhancement layer is arranged on a side of the second insulating layer away from the first substrate, and an orthographic projection of the enhancement layer on the first substrate and an orthographic projection of the first electrode located in the non-moving area on the first substrate have at least an overlapping area.

5. The microfluidic chip according to claim 3 or 4, characterized in that: The enhancement layer is at least one of an organic layer, a metal layer, and an inorganic layer.

6. The microfluidic chip according to claim 5, characterized in that: The driving layer is a first metal layer, the first insulating layer is arranged to cover the first metal layer, and in the moving area: the first electrode is connected to the first metal layer through a via hole on the first insulating layer.

7. The microfluidic chip according to claim 5, characterized in that: The driving layer is a first transistor, which includes a first gate, a first source, a first drain and a first active layer. The first source and the first drain are respectively arranged at two ends of the first active layer and are electrically connected to the first active layer. The first electrode is connected to the first drain.

8. The microfluidic chip according to claim 2, characterized in that: The first substrate further comprises a raised layer, the raised layer is provided on the first substrate, and the raised layer is located at the moving area, and the film thickness of the moving area is higher than the film thickness in the non-moving area; The limiting unit is a second transistor, the second transistor is electrically connected to a first electrode located in the non-moving area, and the first electrode in the non-moving area can drive the droplet to flow back into the moving area.

9. The microfluidic chip according to claim 2, characterized in that: The limiting unit is a blocking member; The blocking member is disposed on one of the first substrate and the second substrate, the blocking member abuts against both the first substrate and the second substrate, and an orthographic projection of the blocking member on the first substrate is located in the non-moving area.

10. A microfluidic system, characterized in that: A microfluidic chip comprising any one of claims 1 to 9.

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