CQFP packaging component lead forming process method based on MCCH150 forming machine

Abstract

The invention discloses a CQFP packaging component lead forming process method based on an MCCH150 forming machine, and belongs to the technical field of electrical assembly. By improving the shearing method, one-time shearing of the frames on the two sides is achieved, the impact force of traditional manual shearing on the pins is eliminated, and the pins are prevented from being bent; a supporting tool is designed, so that the problem of interference of transverse and longitudinal leads of the existing tool is solved; by designing the clamping tool, automatic clamping and fixing of the component body are achieved, and the problems of deviation and warping existing in traditional manual pressing are avoided; the chip cleaning tool is designed to achieve the method of adsorbing pin chips through magnetic force, and residual pin chips in a table top, equipment and cracks are effectively cleaned; and through the design of the special transfer tool, the lead interference is eliminated, and the safe transfer of the formed component is realized.

Description

Technical Field

[0001] The invention belongs to the technical field of electrical assembly, and in particular relates to a process method for forming leads of CQFP packaging components based on a MCCH150 forming machine. Background Art

[0002] As an important component of the aerospace fiber optic gyro inertial measurement device, the printed circuit board plays a key role in the signal connectivity and electrical connection of the inertial measurement device. At present, the research and development and design process of printed circuit boards still uses CQFP packaged components as key components for signal conversion and transmission. The quality of their welding directly affects the reliability of the electrical connection of the inertial measurement device. CQFP packaged components must be formed before welding. The process personnel introduced the MCCH150 molding machine, which can realize the molding of the leads of some surface mount packaged components, but there are still the following disadvantages in use:

[0003] First, the operator uses diagonal pliers to cut the frame one by one. During the cutting process, the shear force of the jaws will impact the chip pins and cause them to bend and deform. In addition, uneven cuts will leave residual frames, resulting in the inability to align the edges horizontally during molding, affecting the quality of chip molding.

[0004] Second, the existing support block is suitable for molding chips with a body size of ≥15mm×15mm, but when molding chips with a size of <15mm×15mm, the support surface will interfere with the leads, making it impossible to mold leads of all sizes;

[0005] Third, when pressing the chip body with hands during molding, if the chip is small, the pressing space is small, the chip cannot be fixed well, and there is a risk of damaging the pins.

[0006] Fourth, the traditional anti-static brush cleaning method is time-consuming and laborious, and it is difficult to clean some individual gaps, resulting in residues and the hidden danger of excess materials;

[0007] Fifth, after the components are formed, the leads are bent and deformed, and the original packaging box will interfere with the leads and cannot be used any longer. The leads of components are dense and soft, and they are very easy to deform if not stored properly;

[0008] Sixth, the current coplanarity detection tooling is made of marble and has not undergone anti-static grounding treatment, which can easily introduce static electricity during component testing.

[0009] It can be seen that there is an urgent need to improve the existing assembly process technology to achieve reliable forming of the leads of CQFP packaged components. Summary of the invention

[0010] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a CQFP package component lead forming method based on an MCCH150 forming machine, which achieves breakthroughs and optimizations in ceramic frame reliable shearing technology, chip adaptation and fixing technology, chip body automatic clamping technology, and pin debris efficient cleaning technology, eliminates the hidden dangers of manual operation, breaks through the limitations of forming shoulder width and welding length, and improves lead shearing efficiency and quality.

[0011] The above-mentioned purpose of the present invention is mainly achieved through the following technical solutions:

[0012] A CQFP package component lead forming process based on a MCCH150 forming machine comprises the following steps:

[0013] (1) Measure the lead size of components and the corresponding PCB pad size, and set component molding parameters;

[0014] (2) Place the component on the cutting machine platform, with one corner of the component close to the cutting machine platform, adjust the position of the cutting machine platform so that the edge of the component lead is aligned with the lower edge of the cutting groove, pull down the pressure rod, and cut the ceramic frames on both sides of the component at the same time. Repeat the above operation to complete the cutting of the ceramic frames at adjacent corners in turn;

[0015] (3) Measure the width of the component body, select the supporting tool and the clamping tool. The supporting tool includes a supporting end and a mounting end. The component is placed on the supporting end so that the edge of one side of the component body is level and closely fits the edge of the supporting end. The clamping tool presses the component body to fix the component body.

[0016] (4) placing the support fixture holding the components obtained in the step on the molding machine, pulling down the molding machine pressure rod, and completing the component lead molding;

[0017] (5) Remove the clamping tooling and take out the components;

[0018] (6) Place the finished components on the coplanarity detection tool to detect the coplanarity of the leads, and check that the coplanarity of the leads is ≤0.1mm;

[0019] (7) Place the finished components in a special transfer tooling for transfer to complete the component lead forming.

[0020] The clamping tooling includes an upper cover plate, rear screws and front screws. The upper cover plate is provided with through holes. The rear screws and the front screws connect the clamping tooling and the supporting tooling through the through holes. The method for fixing components with the clamping tooling is as follows: adjust the fixing position of the rear screw nut so that the upper cover plate completely covers the component body, and the front edge of the upper cover plate is aligned with the edge of the supporting end of the supporting tooling; use the front screws and the rear screws to press the upper cover plate against the component body.

[0021] With the rear screw as the axis, the upper cover can be rotated to the outside of the component clamping part to facilitate the removal and replacement of the components.

[0022] The support end is arranged at the edge position of the upper surface of the mounting end, and a plurality of support ends of different specifications can be arranged on the support tooling.

[0023] A positioning pin is arranged at the bottom of the mounting end, and the positioning pin is connected with a positioning hole on the molding machine loading platform to achieve the fixation of the supporting tooling.

[0024] The thickness of the support end of the support tooling is h=the width of the component forming shoulder-0.6±0.1mm, h is 0.1mm~0.6mm, the width of the support end is 5mm~30mm, the width of the support end is ≤the width of the component body, and the height of the support tooling is 11.9-12.1mm.

[0025] The special transfer tool is provided with a plurality of square grooves, the size of which matches the size of the component body and the size of the lead after being formed, and is used for placing the formed components.

[0026] After the lead forming of the components is completed, the remaining debris is cleaned by the debris cleaning tool. The debris cleaning tool is made of magnetic material and can remove debris from corners and gaps through contactless magnetic adsorption.

[0027] The supporting tooling and clamping tooling are made of aluminum alloy, which has anti-static and wear-resistant properties; the coplanarity detection tooling and special transfer tooling are made of stainless steel, which has anti-static properties and is not easy to rust, and the coplanarity is less than 0.05mm.

[0028] After the ceramic frames on both sides of the component are cut in step (2), the component is rotated to a number of required angles and the cutting is completed in sequence.

[0029] A CQFP package component lead forming device based on an MCCH150 forming machine comprises a supporting tool, a clamping tool, a coplanarity detection tool, a debris cleaning tool and a special transfer tool, wherein the supporting tool comprises a supporting end and a mounting end, the clamping tool comprises an upper cover plate, a rear screw and a front screw, the supporting end is arranged at the edge position of the upper surface of the mounting end, a plurality of supporting ends of different specifications can be arranged on the supporting tool, the component is placed on the supporting end, the upper cover plate is used for pressing the component and is fixed by the rear screw and the front screw, the coplanarity detection tool is used for checking the coplanarity of the leads after the component is formed, the debris cleaning tool is made of magnetic material and is used for removing debris from corners and gaps by contactless magnetic adsorption; a plurality of square grooves are arranged on the special transfer tool, the size of the square grooves matches the size of the component body and the size of the leads after forming, and is used for placing the formed components.

[0030] Compared with the prior art, the present invention has at least the following beneficial effects:

[0031] (1) The present invention replaces the traditional manual diagonal pliers cutting process by improving the cutting process, and can achieve one-time cutting of the two side frames, eliminating the impact on the chip and the pins, and avoiding the bending of the pins. At the same time, the improved cutting process is used to achieve thorough and residue-free cutting of the frame, reducing the risk of manual cutting operations and improving product quality.

[0032] (2) The present invention realizes the support and fixation of components of various sizes by designing a special fixing tool. The special fixing tool can be selected according to the width size of the component, eliminating the problem that the existing tool cannot be used for components of various sizes, solving the lead interference problem that the existing tool exists during use, and avoiding the deformation of the component leads.

[0033] (3) The present invention realizes the clamping and automatic fixation of the component body on the molding machine through the design of the supporting tooling and the clamping tooling, avoiding the problems of inaccurate positioning and offset caused by traditional manual fixation.

[0034] (4) The present invention adopts a method of magnetically adsorbing pin debris to produce a handheld magnetic debris cleaning tool, which replaces the anti-static brush and realizes the rapid cleaning of pin debris remaining on the desktop, equipment and in the gaps. It is convenient and fast, improves work efficiency, and eliminates the problems of residual debris and difficult cleaning of debris in gaps caused by traditional brush cleaning.

[0035] (5) The present invention eliminates the problem of electrostatic damage by designing a metal material coplanarity detection tool to replace the traditional marble slab material, thereby realizing non-destructive detection of component leads.

[0036] (6) The present invention realizes the reliable transportation of components after molding by designing a special component transportation tool to replace the traditional anti-static box and tape fixing method, avoids the bending and damage of the leads caused by loose fixation, and can realize the simultaneous transportation of multiple components, thereby improving efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the lead cutting process of the present invention;

[0038] Figure 2 It is a schematic diagram of the supporting tooling of the present invention;

[0039] Figure 3 It is a schematic diagram of the clamping tool of the present invention;

[0040] Figure 4 This is a schematic diagram of the positioning pin of the supporting tooling of the present invention;

[0041] Figure 5 This is a schematic diagram of the installation and clamping of CQFP package components before molding;

[0042] Figure 6 This is a schematic diagram of lead forming for CQFP package components;

[0043] Figure 7 This is a schematic diagram of the coplanarity detection tooling of the present invention;

[0044] Figure 8 A schematic diagram of a debris cleaning tool of the present invention;

[0045] Fig. 9 It is a schematic diagram of the special transfer tooling of the present invention. DETAILED DESCRIPTION

[0046] To make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0047] The process steps of the lead forming of CQFP package components based on MCCH150 forming machine of the present invention are as follows:

[0048] (1) Figure 1 The figure shows the lead cutting process of the present invention. The component 1 is placed on the cutting machine platform 2, and the lead edges on both sides of the component 1 are aligned with the lower edges of the cutting grooves 3 on both sides. The pressure rod is pulled down to achieve simultaneous shearing of the ceramic frames on both sides of one corner of the component 1 body by two cutting knives. The component 1 is rotated to 90°, 180°, and 270° in sequence, and the component 1 body is positioned and supported in sequence, and the ceramic frames of adjacent corners are sheared in sequence;

[0049] (2) Figure 2 The figure shows a schematic diagram of the support fixture 4 of the present invention, wherein the support fixture 4 includes a support end 401 and a mounting end 402. In this figure, the support fixture 4 includes three support ends 401 of different sizes. Measure the width of the component 1 body, select the support fixture 4, and require that the width of the support fixture 4 ≤ the width of the component 1 body, and the thickness of the support end 401 of the support fixture 4 h = the width of the component 1 forming shoulder - 0.6 ± 0.1 mm. Place the selected support fixture 4 flat on the antistatic table, and place the component 1 on the support end 401 of the support fixture 4, so that the edge of one side of the component 1 body is closely fitted with the edge of the support end 401;

[0050] (3) Figure 3The figure shows a schematic diagram of the clamping tool 5 of the present invention. The clamping tool 5 adjusts the nut position of the rear screw 502 of the clamping tool 5 so that the bottom height of the upper cover plate 501 is consistent with the top height of the component 1 body; the upper cover plate 501 completely covers the component 1 body, and the front edge of the upper cover plate 501 is horizontally aligned with the edge of the support end 401 of the support tool 4; the two front fixing screws 503 and the rear screws 502 of the upper cover plate 501 are installed and pre-tightened so that the upper cover plate 501 presses the component 1 body horizontally, so as to achieve the final fixation of the component 1 body;

[0051] (4) Figure 4 The schematic diagram of the positioning pin 403 of the supporting tool 4 of the present invention is shown. The two positioning pins 403 at the bottom of the mounting end 402 of the supporting tool 4 are aligned with the positioning holes on the molding machine stage 9 and placed flat to achieve rapid clamping of the supporting tool 4. Figure 5 As shown;

[0052] (5) Figure 6 As shown, pull down the molding machine pressure rod to complete the lead molding; remove the two front screws 503 of the upper cover plate 501, loosen the fixing nut of the rear screw 502, and use a vacuum suction pen to remove the component 1;

[0053] (6) Figure 7 The coplanarity detection tool 6 is shown, and the formed component 1 is placed on the coplanarity detection tool 6 to detect the coplanarity of the leads;

[0054] (7) Fig. 9 As shown, a vacuum suction pen is used to place the formed components in a special transfer tool 8 for transfer;

[0055] (8) Figure 8 As shown, the debris cleaning tool 7 is used to clean the debris remaining in the cutting knife, desktop, and equipment gap after the lead is cut.

[0056] The supporting fixture 4 and the upper cover plate 501 are made of aluminum alloy, which is wear-resistant and has anti-static properties.

[0057] The coplanarity detection tool 6 is made of stainless steel, which has anti-static properties and is not easy to rust, and the coplanarity is less than 0.05mm.

[0058] The supporting fixture 4 is designed with a supporting end 401 and a mounting end 402 . The supporting end 401 is used for mounting the component 1 body, and the mounting end 402 is used for fixing the supporting fixture 4 on the molding machine stage 9 .

[0059] The thickness h of the support end 401 of the support fixture 4 is equal to the width of the forming shoulder of the component 1 - 0.6 ± 0.1 mm, h is 0.1 mm to 0.6 mm, the width of the support end 401 is 5 mm to 30 mm, the width of the support end 401 is ≤ the width of the component 1 body, and the height of the support fixture 4 is 11.9-12.1 mm. The height of the support fixture 4 is fixed, and after installation, the height consistency of the support surface and the clamping knife of the molding machine can be controlled, with high appearance consistency to avoid misalignment.

[0060] The surface coplanarity of the support fixture 4 is ≤0.1 mm, and the height consistency between the lower surface of the lead of the component 1 and the clamping knife of the molding machine can be controlled through installation, and the appearance consistency is high.

[0061] The clamping fixture upper cover plate 501 is fastened with two front screws 503 and one rear screw 502, and the position relationship of the three is an equilateral triangle, so the fixation is more stable.

[0062] The rear screws 502 of the upper cover plate 501 of the clamping fixture can adjust the position and height of the upper cover plate by adjusting the fixing position of the nuts, so as to meet the clamping requirements of components with different thicknesses.

[0063] The upper cover plate 501 of the clamping fixture can be rotated at the rear side of the support table with the rear screw 502 as the axis without affecting the removal and replacement of the components at the front side.

[0064] The debris cleaning tool 7 can remove debris from corners and gaps through contactless magnetic adsorption.

[0065] The material of the special transfer tool 8 is stainless steel, which is anti-static and not easy to rust.

[0066] The special transfer tool 8 can realize the transfer of 6 components at the same time, thereby improving production efficiency.

[0067] The internal installation dimensions of the special transfer tool 8 are consistent with the body dimensions and lead dimensions of the components after molding, and will not cause interference.

[0068] The contents not described in detail in the specification of the present invention belong to the common knowledge of those skilled in the art.

Claims

1. A CQFP package component lead forming process based on MCCH150 forming machine, characterized in that: The following steps are involved: (1) Measure the lead size of the component (1) and the corresponding printed circuit board pad size, and set the molding parameters of the component (1); (2) Place the component (1) on the cutting machine platform (2), with one corner of the component (1) close to the cutting machine platform (2), adjust the position of the cutting machine platform (2) so that the lead edge of the component (1) is aligned with the lower edge of the cutting groove (3), pull down the pressure rod, and cut the ceramic frames on both sides of the component (1) at the same time, repeat the above operation, and complete the cutting of the ceramic frames at adjacent corners in turn; (3) Measure the width of the component (1) body, select a supporting tool (4) and a clamping tool (5), wherein the supporting tool (4) includes a supporting end (401) and a mounting end (402), place the component (1) on the supporting end (401), make one side edge of the component (1) body parallel to and closely fit the edge of the supporting end (401), and press the component (1) body with the clamping tool (5) to fix the component (1) body; (4) placing the supporting tool (4) holding the component (1) obtained in step (3) on a molding machine, pulling down the molding machine pressure rod, and completing the lead molding of the component (1); (5) Remove the clamping tool (5) and take out the component (1); (6) placing the finished component (1) on a coplanarity detection tool (6) to detect the coplanarity of the leads, and checking that the coplanarity of the leads is ≤0.1 mm; (7) placing the formed component (1) in a special transfer tool (8) for transfer, thereby completing the lead forming of the component (1).

2. According to claim 1, a CQFP package component lead forming process method based on MCCH150 forming machine is characterized in that: The clamping tool (5) comprises an upper cover plate (501), a rear screw (502) and a front screw (503); a through hole is provided on the upper cover plate (501); the rear screw (502) and the front screw (503) are connected to the clamping tool (5) and the supporting tool (4) through the through hole; the method for fixing the component (1) with the clamping tool (5) is as follows: adjusting the fixing position of the nut of the rear screw (502) so that the upper cover plate (501) completely covers the body of the component (1) and the front edge of the upper cover plate (501) is aligned with the edge of the supporting end (401) of the supporting tool (4); and the front screw (503) and the rear screw (502) are used to press the upper cover plate (501) against the body of the component (1).

3. The CQFP package component lead forming process method based on the MCCH150 forming machine according to claim 2, characterized in that: With the rear screw (502) as an axis, the upper cover plate (501) can be rotated to the outside of the clamping component (1) to facilitate the removal and replacement of the component (1).

4. The CQFP package component lead forming process based on the MCCH150 forming machine according to claim 1, characterized in that: The support end (401) is arranged at the edge of the upper surface of the mounting end (402), and a plurality of support ends (401) of different specifications can be arranged on the support tooling (4).

5. The CQFP package component lead forming process based on the MCCH150 forming machine according to claim 1, characterized in that: A positioning pin (403) is provided at the bottom of the installation end (402), and the support tooling (4) is fixed by connecting the positioning pin (403) and a positioning hole on the molding machine loading platform (9).

6. The CQFP package component lead forming process based on the MCCH150 forming machine according to claim 1, characterized in that: The thickness h of the support end (401) of the support tool (4) is equal to the width of the forming shoulder of the component (1) - 0.6±0.1 mm, where h is 0.1 mm to 0.6 mm, the width of the support end (401) is 5 mm to 30 mm, the width of the support end (401) is ≤ the width of the component (1) body, and the height of the support tool (4) is 11.9-12.1 mm.

7. A process for forming the leads of CQFP packaged components (1) based on a MCCH150 forming machine according to claim 1, characterized in that: The special transfer tool (8) is provided with a plurality of square grooves, the size of which matches the size of the body and the size of the lead of the formed component (1), and is used for placing the formed component (1).

8. The process for forming the leads of CQFP packaged components (1) based on the MCCH150 forming machine according to claim 1, characterized in that: After the lead wires of the component (1) are formed, the remaining debris is cleaned by a debris cleaning tool (7). The debris cleaning tool (7) is made of magnetic material and can remove debris from corners and gaps through contactless magnetic adsorption.

9. The CQFP package component lead forming process based on the MCCH150 forming machine according to claim 1, characterized in that: The supporting tooling (4) and the clamping tooling (5) are made of aluminum alloy, which has anti-static and wear-resistant properties; the coplanarity detection tooling (6) and the special transfer tooling (8) are made of stainless steel, which has anti-static properties and is not easy to rust, and the coplanarity is less than 0.05 mm.

10. The CQFP package component lead forming process based on the MCCH150 forming machine according to claim 1, characterized in that: After the ceramic frames on both sides of the component (1) are cut in step (2), the component (1) is rotated to a number of required angles to complete the cutting in sequence.

11. A CQFP package component lead forming device based on MCCH150 forming machine, characterized in that: The invention comprises a supporting tool (4), a clamping tool (5), a coplanarity detection tool (6), a debris cleaning tool (7) and a special transfer tool (8), wherein the supporting tool (4) comprises a supporting end (401) and a mounting end (402), the clamping tool (5) comprises an upper cover plate (501), a rear screw (502) and a front screw (503), the supporting end (401) is arranged at an edge position of an upper surface of the mounting end (402), a plurality of supporting ends (401) of different specifications can be arranged on the supporting tool (4), and the components (1) are placed on the supporting end ( 401), the upper cover plate (501) is used to press the component (1) and fix it by means of rear screws (502) and front screws (503); the coplanarity detection tool (6) is used to check the coplanarity of the leads of the component (1) after molding; the debris cleaning tool (7) is made of magnetic material and is used to remove debris from corners and gaps by means of contactless magnetic adsorption; a plurality of square grooves are provided on the special transfer tool (8), the size of the square grooves matches the size of the body and the lead of the molded component (1), and is used to place the molded component (1).

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