Part adjusting and positioning device for selective laser repair and scanning repair method

Abstract

The invention discloses a part adjusting and positioning device for selective laser repair and a scanning repair method, and relates to the technical field of selective laser repair. The adjusting and positioning device comprises an XYZ three-axis adjusting and positioning mechanism, an angle adjusting and positioning mechanism, a fixed clamping mechanism, an optical feedback positioning mechanism, a forming substrate connecting mechanism and a computer. The scanning repair method comprises a part adjusting and positioning step and a selective laser repair step. According to the technical scheme, selective laser forming is used for repairing parts, the precision and performance of structure repairing are improved, the requirement for complex structure repairing is met, the three-axis and multi-angle adjusting mechanism is arranged, the optical feedback positioning mechanism is arranged, the powder isolation assembly is arranged, and the powder isolation assembly is arranged on the surface of the part. And high-precision joint of the repaired forming structure and the to-be-repaired area is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of laser selective repair, and in particular to a component adjustment and positioning device for laser selective repair and a scanning repair method. Background Art

[0002] Laser repair technology has increasingly become a hot spot in the research of manufacturing disciplines and technologies and the application of repair industry. At present, laser repair is mainly achieved by laser cladding technology. During the repair process, the laser is used to irradiate the area to be repaired to form a molten pool, and powder or wire is blown into the molten pool to achieve additive repair. Limited by the area and size of the blowing (or conveying) material, the manufacturing and repair accuracy based on laser cladding development are relatively low. In addition, this technology is also mainly suitable for the repair of simple structures, and is powerless for the high-precision repair of more complex structures. The technology of using laser selective forming by layer-by-layer powder laying and layer-by-layer path planning is a technology that has been developed with higher processing accuracy and can meet the additive manufacturing of more complex three-dimensional structural parts. This technology has gradually developed in the 1990s. At present, this technology has been used to realize the direct manufacturing of a variety of metal structural parts, and has been used in aerospace, biomedical implants and other fields, becoming a hot spot in the field of direct manufacturing of high-precision complex metal parts. However, due to the repositioning of the parts to be repaired involved in the laser repair process, there is still no report on the use of laser selective forming technology for structural repair.

[0003] In order to solve the shape and controllability problems in the laser repair process and achieve high-precision and high-performance repair of complex structures, it is urgently necessary to develop new technologies, devices and methods to solve the key restrictive technology of applying laser selective forming technology to component repositioning technology for laser repair. Summary of the invention

[0004] The purpose of the present invention is to provide a component adjustment and positioning device and a scanning repair method for laser selective repair, so as to solve the restriction problem of using laser selective forming technology for high-precision component repair, thereby improving the accuracy, performance and structural complexity of laser repair.

[0005] The technical solution of the present invention is as follows:

[0006] A component adjustment and positioning device for laser selective repair, the device comprising an XYZ three-axis adjustment and positioning mechanism, an angle adjustment and positioning mechanism, a fixed clamping mechanism, an optical feedback positioning mechanism, a forming base connection mechanism and a computer;

[0007] The XYZ three-axis adjustment and positioning mechanism includes a component for adjusting and positioning the X-axis, a component for adjusting and positioning the Y-axis, and a component for adjusting and positioning the Z-axis;

[0008] The angle adjustment and positioning mechanism includes a component for adjusting and positioning the angle in the horizontal plane, and a component for adjusting and positioning the angle in the vertical direction;

[0009] The fixing and clamping mechanism includes a clamp for fixing and clamping the parts to be repaired;

[0010] The optical feedback positioning mechanism includes an optical scanning imaging component, a data acquisition and processing component and a corresponding mechanical connection component;

[0011] The forming base connecting mechanism comprises a component used for connecting with a laser selective melting forming base plate.

[0012] As for the above-mentioned component adjustment and positioning device for laser selective repair, it is further characterized in that the positioning accuracy of the X-axis of the XYZ three-axis adjustment and positioning mechanism is 0.1μm-100μm, and the adjustment range is 10mm-500mm; the positioning accuracy of the Y-axis is 0.1μm-100μm, and the adjustment range is 10mm-500mm; the positioning accuracy of the Z-axis is 0.1μm-100μm, and the adjustment range is 10mm-200mm; and it is electrically or manually controlled.

[0013] As for the above-mentioned component adjustment and positioning device for laser selective repair, it is further characterized in that the angle positioning accuracy of the angle adjustment and positioning mechanism in the horizontal direction is 0.005°-1°, and the angle adjustment range is 2°-360°; the angle positioning accuracy of the angle adjustment and positioning mechanism in the vertical direction is 0.005°-1°, and the angle adjustment range is 2°-360°.

[0014] As for the above-mentioned component adjustment and positioning device for laser selective area repair, it is further characterized in that the optical scanning imaging component is coaxially arranged with the laser optical path for laser selective area forming and repair.

[0015] As for the above-mentioned component adjustment and positioning device for laser selective repair, it is further characterized in that the optical scanning imaging component includes a laser, a scanning galvanometer, a focusing mirror, a spectroscope for realizing reflection signal separation, and an optical signal detector for measuring the reflection signal.

[0016] As for the above-mentioned component adjustment and positioning device for laser selective area repair, it is further characterized in that the optical scanning imaging component is arranged separately from the laser optical path for laser selective area forming and repair.

[0017] As for the above-mentioned component adjustment and positioning device for laser selective repair, it is further characterized in that the optical scanning imaging component includes an optical imaging scanning head, an electric displacement stage for driving the movement of the optical imaging scanning head, and an imaging position acquisition device.

[0018] As for the above-mentioned component adjustment and positioning device for laser selective repair, it is further characterized in that the data acquisition and processing component includes boards and devices for collecting images and position data obtained by the optical scanning imaging component, and processing them to obtain the contour and position of the surface to be repaired.

[0019] The above-mentioned component adjustment and positioning device for laser selective repair further includes a powder isolation component, which can prevent powder from entering the gaps between the XYZ three-axis adjustment and positioning mechanism and the angle adjustment and positioning mechanism.

[0020] As a preferred design, the powder isolation component includes a powder isolation top plate and a powder isolation cover, the powder isolation top plate includes a component for connecting to an angle adjustment and positioning mechanism, a component for connecting to a fixed clamping mechanism, and a component for fitting with an upper cover of a circular hole of the powder isolation cover, the powder isolation cover includes an upper cover of a circular hole of the powder isolation cover fitting with the powder isolation top plate, and a bottom square frame of the powder isolation cover placed on a forming base connecting mechanism.

[0021] In cooperation with the above-mentioned powder isolation component, the fixed clamping mechanism includes a component connected to the powder isolation top plate, and the forming base connection mechanism includes a groove for placing the powder isolation cover.

[0022] The present invention also provides a scanning repair method for laser selective repair, which includes a component adjustment and positioning step and a laser selective repair step. The component adjustment and positioning step uses the component adjustment and positioning device as described above.

[0023] The beneficial effects of the present invention are:

[0024] 1. Through the technical solution of the present invention, laser selective forming is used for the repair of parts, which improves the accuracy and performance of structural repair and meets the needs of complex structural repair;

[0025] 2. The technical solution of the present invention has both a three-axis and multi-angle adjustment mechanism and an optical feedback positioning mechanism, and is provided with a powder isolation component to ensure high-precision bonding between the repair forming structure and the area to be repaired. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In the attached picture:

[0027] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of the powder isolation cover in Example 1;

[0029] Figure 3 Schematic diagram of the structure of the optical feedback positioning mechanism in Example 1;

[0030] Figure 4This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0031] Figure 5 This is a schematic diagram of the structure of the powder isolation cover in Example 2;

[0032] Figure 6 Schematic diagram of the structure of the optical feedback positioning mechanism in Example 2;

[0033] The components represented by the reference numerals in the figure are:

[0034] 1. Forming base connection mechanism; 2. XYZ three-axis adjustment and positioning mechanism; 3. Angle adjustment and positioning mechanism; 4. Powder isolation top plate; 5. Fixed clamping mechanism; 6. Optical feedback positioning mechanism; 7. Computer; 8. Parts to be repaired; 9. Powder isolation cover circular hole upper cover; 10. Powder isolation cover bottom square frame; 11. Laser; 12. Scanning galvanometer; 13. Focusing mirror; 14. Spectrometer; 15. Optical signal detector; 16. Data acquisition and processing component; 17. Surface to be repaired; 18. Optical imaging scanning head; 19. Electric translation stage; 20. Imaging position acquisition device. DETAILED DESCRIPTION

[0035] Example 1

[0036] Figure 1 It is a schematic diagram of Example 1 of the adjustment and positioning device for the component to be repaired for laser selective repair of the present invention. The repair object is an aircraft engine blade as an example. In this embodiment, the optical scanning imaging component is coaxially arranged with the laser optical path for forming repair.

[0037] The adjustment and positioning device for the repaired parts for laser selective repair in this embodiment includes a forming base connecting mechanism 1, an XYZ three-axis adjustment and positioning mechanism 2, an angle adjustment and positioning mechanism 3, a powder isolation top plate 4, a fixed clamping mechanism 5, an optical feedback positioning mechanism 6, and a computer 7.

[0038] The forming substrate connection mechanism 1 is provided with screw holes and fixing screws for fixing with the original printing substrate, and is also provided with grooves for placing the powder isolation cover. Here, the powder isolation top plate 4 and the powder isolation cover are working parts of the powder isolation assembly, which are used to isolate metal powder before laser selective repair, and are described in detail below.

[0039] The forming base connection mechanism 1 is provided with screw holes and fixing screws fixedly connected to the XYZ three-axis adjustment and positioning mechanism 2 to realize the connection between the adjustment and positioning mechanism and the forming base plate. In this embodiment, the XYZ three-axis adjustment and positioning mechanism 2 is a manual three-axis displacement table, and the positioning accuracy of the X, Y, and Z axes is 2μm respectively; the X and Y adjustment ranges are 25mm, and the Z adjustment range is 25mm. The angle adjustment and positioning mechanism 3 fixedly connected to the XYZ three-axis adjustment and positioning mechanism 2 has an angle positioning accuracy of 0.02° in the horizontal direction, and an angle adjustment range of 360°; the angle positioning accuracy in the vertical direction is 0.01°, and the angle adjustment range is 20°. The powder isolation top plate 4 is fixedly connected to the top of the angle adjustment and positioning mechanism 3, and is provided with a silicone component that fits the upper cover of the circular hole of the powder isolation cover. The fixed clamping mechanism 5 is fixedly connected to the powder isolation top plate 4, and can clamp the parts to be repaired 8 with a size of less than 150 mm in the X direction. The surface 17 to be repaired of the parts to be repaired 8 is set upward, and the angle of the surface 17 to be repaired can be roughly adjusted on the fixed clamping mechanism 5 to make the surface 17 to be repaired as horizontal as possible. The pitch table of the angle positioning adjustment mechanism 3 is used to adjust the surface 17 to be repaired to a horizontal level, so that the subsequent optical feedback positioning mechanism 6 can scan the surface 17 to be repaired and perform structural repair. The optical feedback positioning mechanism 6 is suspended above the fixed clamping mechanism 5. The computer 7 is connected to the optical feedback positioning mechanism 6 by a data line to achieve precise control of adjustment and positioning.

[0040] In this embodiment, the powder shield structure is as follows Figure 2 As shown, the powder shielding cover comprises a circular hole upper cover 9 and a bottom square frame 10 of the powder shielding cover, which are used to isolate the XYZ three-axis adjustment and positioning mechanism 2 and the angle adjustment and positioning mechanism 3 from powder during the repair process, reduce the amount of powder used, and avoid the contamination and harm of powder to the XYZ three-axis adjustment and positioning mechanism 2 and the angle adjustment and positioning mechanism 3. The circular hole upper cover 9 of the powder shielding cover and the bottom square frame 10 of the powder shielding cover are fastened and connected by screws, and the height of the powder shielding cover can be adjusted by adjusting the fastening connection position to meet the use requirements.

[0041] In this embodiment, the optical feedback positioning mechanism 6 is coaxially arranged with the laser optical path for forming and repairing. The specific structure is as follows: Figure 3As shown, it includes a laser 11, a scanning galvanometer 12, a focusing mirror 13, a spectroscope 14 for realizing separation of reflected signals, an optical signal detector 15 for measuring reflected signals, and a data acquisition and processing component 16. The indication laser emitted by the laser 11 is converged into a light spot with a focal diameter of 20 μm by the scanning galvanometer 12 and the focusing mirror 13 and irradiated to the upper part of the component 8 to be repaired. The laser reflected by the plane 17 to be repaired on the upper part of 8 is collected by the focusing mirror 13, and is reflected to the optical signal detector 15 for measuring the reflected signal by the scanning galvanometer 12 and the spectroscope 14 for realizing separation of reflected signals. The scanning galvanometer 12 can realize scanning of the plane 17 to be repaired and the surrounding area by the indication laser. Compared with the plane 17 to be repaired, the other upper surfaces of the component 8 to be repaired are not on the laser focal plane converged by the focusing mirror 13. Therefore, when the indication laser is irradiated to the plane 17 to be repaired, the optical signal received by the optical signal detector 15 for measuring the reflected signal is the strongest, and is thus converted into the strongest electrical signal. The data acquisition and processing component 16 processes the acquired electrical signals and laser scanning positions so as to obtain the contour and position of the plane 17 to be repaired.

[0042] In the adjustment process of the adjustment and positioning device for the component to be repaired for laser selective repair of the present embodiment, first, the component to be repaired 8 is locked on the fixed clamping mechanism 5, and the clamping angle is adjusted to make the plane to be repaired 17 of the component to be repaired 8 parallel to the horizontal plane as much as possible. Secondly, the XYZ three-axis adjustment and positioning mechanism 2 and the angle adjustment and positioning mechanism 3 are regulated so that the plane to be repaired 17 of the component to be repaired 8 is at the center of the scanning area of ​​the scanning galvanometer 12 and is parallel to the horizontal plane. The computer 7 is used to control the scanning galvanometer 12 of the optical feedback positioning mechanism 6 so that the laser scans point by point on the plane to be repaired 17 and the surrounding area, and the contour and position of the plane to be repaired 17 are obtained by using the reflected light signal and the laser scanning position fed back by the scanning galvanometer 12, thereby realizing the adjustment and positioning of the component to be repaired for laser selective repair.

[0043] Example 2

[0044] Figure 4 It is a schematic diagram of Example 2 of the device for adjusting and positioning a component to be repaired for laser selective repair of the present invention. In this embodiment, the optical scanning imaging component is separated from the laser optical path for forming repair, and the repair object can be the same as that in Example 1.

[0045] The adjustment and positioning device for the repaired parts for laser selective repair in this embodiment includes a forming base connecting mechanism 1, an XYZ three-axis adjustment and positioning mechanism 2, an angle adjustment and positioning mechanism 3, a powder isolation top plate 4, a fixed clamping mechanism 5, an optical feedback positioning mechanism 6, and a computer 7.

[0046] The forming substrate connection mechanism 1 is provided with screw holes and fixing screws fixedly connected to the original printing substrate; a groove for placing the powder shield is provided; and screw holes and fixing screws fixedly connected to the XYZ three-axis adjustment and positioning mechanism 2 are provided to realize the connection between the adjustment and positioning mechanism and the forming substrate. In this embodiment, the XYZ three-axis adjustment and positioning mechanism 2 is an electric three-axis displacement table, and the positioning accuracy of the X, Y, and Z axes is 1μm respectively; the X and Y adjustment ranges are 50mm, and the Z adjustment range is 20mm. The angle adjustment and positioning mechanism 3 is fixedly connected to the XYZ three-axis adjustment and positioning mechanism 2, and is an electric two-axis angle displacement table. Its horizontal angle positioning accuracy is 0.01°, and the angle adjustment range is 20°; the vertical angle positioning accuracy is 0.01°, and the angle adjustment range is 10°. The powder shield top plate 4 is fixedly connected to the top of the angle adjustment and positioning mechanism 3, and is provided with a silicone component that fits the upper cover of the circular hole of the powder shield. The fixed clamping mechanism 5 is fixedly connected to the powder isolation top plate 4, and can clamp the repaired parts 7 with a size of less than 250 mm in the X direction. The optical feedback positioning mechanism 6 is suspended above the fixed clamping mechanism 5. The computer 7 is connected to the XYZ three-axis adjustment positioning mechanism 2, the angle adjustment positioning mechanism 3 and the optical feedback positioning mechanism 6 by data lines to achieve precise control of adjustment and positioning.

[0047] In this embodiment, the powder shield structure is as follows Figure 5 As shown, it includes a powder shielding cover with round holes 9 and a powder shielding cover bottom frame 10, which are used to isolate the XYZ three-axis adjustment and positioning mechanism 2 and the angle adjustment and positioning mechanism 3 from powder during the repair process, reduce the amount of powder used, and avoid the contamination and hazard of powder to the XYZ three-axis adjustment and positioning mechanism 2 and the angle adjustment and positioning mechanism 3. A round hole is provided at the bottom of the powder shielding cover bottom frame 10 for the cables of the XYZ three-axis adjustment and positioning mechanism 2 and the angle adjustment and positioning mechanism 3 to pass through. The powder shielding cover with round holes 9 and the powder shielding cover bottom frame 10 are fastened and connected by screws, and the height of the powder shield can be adjusted by adjusting the fastening connection position to meet the use requirements.

[0048] In this embodiment, the optical feedback positioning mechanism 6 is separated from the laser optical path for forming and repairing. The specific structure is as follows: Figure 6As shown, it includes an optical imaging scanning head 18, an electric displacement stage 19 for driving the optical imaging scanning head to move, an imaging position acquisition device 20, and a data acquisition and processing component 16. The optical imaging scanning head 18 is a linear imaging scanning head with a scanning amplitude width of 300mm and a resolution of 10μm. The optical imaging scanning head 18 is fixedly connected to the electric displacement stage 19 for driving the optical imaging scanning head to move, and the scanning movement is realized by the electric displacement stage 19 for driving the optical imaging scanning head to move. The maximum stroke of the electric displacement stage 19 for driving the optical imaging scanning head to move is 300mm. The imaging position acquisition device 20 is integrated in the electric displacement stage 19 for driving the optical imaging scanning head to move, and measures the movement position of the electric displacement stage 19 for driving the optical imaging scanning head to move in real time, with a measurement accuracy of 1μm. During the scanning process, the data of the optical imaging scanning head 18 and the imaging position acquisition device 20 are transmitted to the data acquisition and processing component 16 via the data line, and the contour and position of the plane 17 to be repaired can be obtained after being processed by the data acquisition and processing component 16.

[0049] In the adjustment process of the adjustment and positioning device for the repaired component for laser selective repair of this embodiment, first, the repaired component 8 is locked on the fixed clamping mechanism 5, and the clamping angle is adjusted to make the repaired plane 17 of the repaired component 8 parallel to the horizontal plane as much as possible. Secondly, the XYZ three-axis adjustment and positioning mechanism 2 and the angle adjustment and positioning mechanism 3 are controlled by the computer 7, so that the repaired plane 17 of the repaired component 8 is in the center of the laser scanning area of ​​the optical imaging scanning head 18 and is parallel to the horizontal plane. The electric displacement stage 19 used to drive the movement of the optical imaging scanning head of the optical feedback positioning mechanism 6 is controlled by the computer 7 to make the optical imaging scanning head 18 scan and move on the repaired plane 17 and the surrounding area, and the imaging signal and scanning position fed back by the optical imaging scanning head 18 and the imaging position acquisition device 20 are processed by the data acquisition and processing component 16 to obtain the contour and position of the repaired plane 17, thereby realizing the adjustment and positioning of the repaired component for laser selective repair.

[0050] Example 3

[0051] This embodiment provides a scanning repair method for laser selective repair based on Embodiment 1 and Embodiment 2, which method includes a component adjustment and positioning step and a laser selective repair step, wherein the component adjustment and positioning step uses the component adjustment and positioning device of Embodiment 1 or Embodiment 2, and a powder shield is installed before the laser selective repair step.

[0052] The method can be specifically carried out according to the following steps:

[0053] S1, cleaning the surface of the component 8 to be repaired;

[0054] S2, the component 8 to be repaired is fixed;

[0055] Place the component 8 to be repaired on the fixed clamping mechanism 5, with the repaired surface 17 of the component 8 facing upward, roughly adjust the angle of the position to be repaired to be as horizontal as possible, and then clamp it on the fixed clamping mechanism 5;

[0056] S3, adjusting the XYZ three-axis adjustment positioning mechanism 2 and the angle adjustment positioning mechanism 3, adjusting the surface to be repaired 17 to be parallel to the horizontal plane and located directly below the optical scanning imaging assembly;

[0057] S4. Scan the surface 17 to be repaired and its surrounding area (using the scanning method described in Example 1 or Example 2) to obtain the contour and position of the surface 17 to be repaired.

[0058] S5. Measure the height difference between the component on the powder isolation top plate 4 for fitting with the powder isolation cover and the bottom of the groove on the forming base connecting mechanism 1 for placing the powder isolation cover, fasten the powder isolation cover circular hole upper cover 9 and the powder isolation cover bottom square frame 10 with screws, and adjust the height of the powder isolation cover to the measured height difference by adjusting the fastening connection position, and place the powder isolation cover in the groove on the forming base connecting mechanism 1 for placing the powder isolation cover.

[0059] The present invention preferably installs the entire component adjustment and positioning device on the substrate of the laser selective melting equipment before installing and fixing the component 8 to be repaired, and then performs powder laying and melting repair layer by layer according to the laser selective melting procedure.

[0060] Because metal powder needs to be filled into the molding chamber and filled to the surface to be repaired 17 before layer-by-layer powder spreading and melting repair, the XYZ three-axis adjustment and positioning mechanism 2, the angle adjustment and positioning mechanism 3, and the fixed clamping mechanism 5 will be buried by the metal powder. In order to prevent metal powder from entering the gaps between the XYZ three-axis adjustment and positioning mechanism 2 and the angle adjustment and positioning mechanism 3, affecting the operation of the above-mentioned mechanisms, and to prevent excessive occupation of metal powder, a powder shielding cover is installed before filling the molding chamber with powder. During the repair process, metal powder will only fill the space between the inner wall of the molding chamber and the side panels of the powder shielding cover and above the top panel of the powder shielding cover, which can also reduce the occupation of metal powder.

[0061] The subsequent repair process is similar to the laser selective melting molding. The repair surface 17 of the component 8 to be repaired is used as the starting surface, and the additive manufacturing method is used to apply powder and melt layer by layer until the three-dimensional repair is completed. It will not be repeated here.

[0062] In each embodiment of the present invention, the same laser or different lasers can be used for component adjustment and positioning and laser selective repair. When the same laser is used, it is only necessary to adjust the laser parameters according to the two working modes of scanning positioning and before and after melting and forming.

[0063] In summary, by adopting the technical solutions provided in Examples 1 to 3 of the present invention, laser selective forming is used for the repair of parts, which improves the accuracy and performance of structural repair and also meets the needs of repairing complex structures such as aircraft engine blades.

[0064] The above description is only a preferred embodiment of the present invention. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the protection scope of the present invention.

Claims

1. A component adjustment and positioning device for laser selective repair, characterized in that: The device comprises an XYZ three-axis adjustment and positioning mechanism (2), an angle adjustment and positioning mechanism (3), a fixed clamping mechanism (5), an optical feedback positioning mechanism (6), a forming base connection mechanism (1) and a computer (7); The XYZ three-axis adjustment and positioning mechanism (2) comprises a component for adjusting and positioning the X axis, a component for adjusting and positioning the Y axis, and a component for adjusting and positioning the Z axis; The angle adjustment and positioning mechanism (3) comprises a component for adjusting and positioning the angle in the horizontal plane, and a component for adjusting and positioning the angle in the vertical direction; The fixing and clamping mechanism (5) comprises a clamp for fixing and clamping the component to be repaired; The optical feedback positioning mechanism (6) comprises an optical scanning imaging component, a data acquisition and processing component (16) and corresponding mechanical connection components; The forming substrate connection mechanism (1) comprises a component for connecting with a laser selective melting forming substrate.

2. The component adjustment and positioning device for laser selective repair according to claim 1, characterized in that: The XYZ three-axis adjustment and positioning mechanism (2) has an X-axis positioning accuracy of 0.1 μm-100 μm and an adjustment range of 10 mm-500 mm; a Y-axis positioning accuracy of 0.1 μm-100 μm and an adjustment range of 10 mm-500 mm; a Z-axis positioning accuracy of 0.1 μm-100 μm and an adjustment range of 10 mm-200 mm; and is electrically or manually controlled.

3. The component adjustment and positioning device for laser selective repair according to claim 1, characterized in that: The angle adjustment and positioning mechanism (3) has an angle positioning accuracy of 0.005°-1° in the horizontal direction, and an angle adjustment range of 2°-360°; and an angle positioning accuracy of 0.005°-1° in the vertical direction, and an angle adjustment range of 2°-360°.

4. The component adjustment and positioning device for laser selective repair according to claim 1, characterized in that: The optical scanning imaging component is coaxially arranged with the laser optical path for laser selective area forming and repairing.

5. The component adjustment and positioning device for laser selective repair according to claim 4, characterized in that: The optical scanning imaging component comprises a laser (11), a scanning galvanometer (12), a focusing mirror (13), a beam splitter (14) for realizing separation of reflected signals, and an optical signal detector (15) for measuring reflected signals.

6. The component adjustment and positioning device for laser selective repair according to claim 1, characterized in that: The optical scanning imaging component is arranged separately from the laser optical path for laser selective area forming and repairing.

7. The component adjustment and positioning device for laser selective repair according to claim 6, characterized in that: The optical scanning imaging component comprises an optical imaging scanning head (18), an electric displacement stage (19) for driving the optical imaging scanning head (18) to move, and an imaging position acquisition device (20).

8. The component adjustment and positioning device for laser selective repair according to claim 1, characterized in that: The data acquisition and processing component includes boards and devices for acquiring images and position data obtained by the optical scanning imaging component, and processing the images and position data to obtain the contour and position of the surface to be repaired.

9. The component adjustment and positioning device for laser selective repair according to claim 1, characterized in that: A powder isolation assembly is also included.

10. A scanning repair method for laser selective repair, comprising a component adjustment and positioning step and a laser selective repair step, characterized in that: The component adjustment and positioning step uses a component adjustment and positioning device for laser selective repair as described in any one of claims 1-9.

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