Sheet feeding machine table and tray structure thereof

Abstract

The invention relates to a sheet feeding machine table and a tray structure thereof, which are characterized in that a magnet is arranged between a soldering-aid tray for containing soldering flux and a base, so that the soldering-aid tray is stably attached to the base, and the soldering-aid tray is kept horizontal. Therefore, the soldering flux can be uniformly distributed on the whole soldering-aid tray, so that when the electronic component is moved to the soldering-aid tray to be adhered with the soldering flux by utilizing the taking and placing structure, the conductive bump of the electronic component can be uniformly and reliably adhered with the soldering flux.

Description

Technical Field

[0001] The present invention relates to a semiconductor wafer loading technology, in particular to a wafer loading machine and a tray structure thereof. Background Art

[0002] Flip chip semiconductor packaging technology is an advanced semiconductor packaging technology that electrically connects electronic components to a substrate through multiple conductive bumps such as solder bumps. Since the flip chip packaging structure does not require bonding wires that take up more space, the overall size can be made thinner and smaller.

[0003] In the existing flip chip packaging process, during the wafer loading (or die placement) process, since the metal surface of the soldering point is prone to form an oxide layer at high temperature, it is usually necessary to first apply flux to the conductive bumps of the electronic components. Flux is a substance that uses chemical methods to clean the metal surface to be soldered to facilitate soldering. The flux can also act as a wetting agent during the soldering process, promoting the soldering process and facilitating the placement of the electronic components on the substrate.

[0004] In the step of applying flux to electronic components, the electronic components are first sucked by the adsorbent, and then moved to adhere to the flux tray containing the flux. Generally speaking, the flux tray is placed on a base. However, if the flux tray is not properly installed on the base when it is placed, or if it is moved to the flux tray during the manufacturing process, the flux tray may be tilted, resulting in the flux not being evenly distributed in the entire flux tray, so that the conductive bumps of the electronic components on the adsorbent cannot all be evenly attached to the flux, or cannot be completely covered with the flux, resulting in the subsequent electronic components being unable to effectively electrically connect to the substrate, resulting in problems such as poor process yield.

[0005] Therefore, how to overcome the above-mentioned problems of the prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the invention

[0006] In view of the various deficiencies of the above-mentioned prior art, the present invention provides a tray structure, including: a base, which has a first side and a second side opposite to each other; and a flux tray, which is arranged on the first side of the base and has a first surface for holding flux and a second surface opposite to the first surface and contacting the base; wherein a magnet is arranged between the base and the flux tray.

[0007] The present invention also provides a wafer loading machine, comprising: a tray structure, which includes a base having a first side and a second side opposite to each other, and a flux tray arranged on the first side of the base, wherein the flux tray has a first surface for holding flux and a second surface opposite to the first surface and contacting the base, and a magnet is arranged between the base and the flux tray; and a pick-and-place structure, which has an adsorbing part for adsorbing electronic components and a mechanical arm for moving the adsorbing part, so as to move the electronic components to the flux tray and adhere the flux.

[0008] In the aforementioned film loading machine and its tray structure, the magnet is disposed on the first side of the base.

[0009] In the aforementioned wafer loading machine and its tray structure, the magnet is disposed on the second surface of the flux tray.

[0010] In the aforementioned wafer loading machine and its tray structure, the magnet is disposed on the first side of the base and the second surface of the soldering tray.

[0011] In the aforementioned wafer loading machine and tray structure, the magnet is located outside the area of ​​the soldering tray containing the soldering flux.

[0012] In the aforementioned wafer loading machine and its tray structure, a concave portion is provided on the first side of the base, and a convex portion opposite to the concave portion is provided on the second surface of the soldering tray.

[0013] In the aforementioned wafer loading machine and its tray structure, a containing portion for containing the soldering flux is provided on the first surface of the soldering tray.

[0014] In the aforementioned wafer loading machine and its tray structure, the fluxing tray is arranged on the base in a tightly fitting manner by utilizing the magnetic force of the magnet.

[0015] As can be seen from the above, in the wafer loading machine and its tray structure of the present invention, a magnet is mainly arranged between the soldering tray containing solder flux and the base, so that the soldering tray is firmly attached to the base by the magnetic force of the magnet, thereby keeping the soldering tray horizontal. In this way, the soldering flux can be evenly distributed on the entire soldering tray. Therefore, when the electronic component is moved to the soldering tray to be coated with solder flux by using the pick-and-place structure, compared with the prior art, the present invention can make the entire conductive bump of the electronic component more evenly and reliably coated with solder flux. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a cross-sectional schematic diagram of the wafer loading machine of the present invention.

[0017] Figure 2 It is a cross-sectional schematic diagram of the tray structure of the present invention.

[0018] Figure 3for Figure 2 Schematic diagram of the base from top view.

[0019] Description of Reference Numerals

[0020] 1. Film loading machine

[0021] 10 Pallet Structure

[0022] 11. Base

[0023] 11a First side

[0024] 11b Second side

[0025] 110 recess

[0026] 12. Flux tray

[0027] 12a First surface

[0028] 12b Second surface

[0029] 120 bulge

[0030] 121 Dress Department

[0031] 20 Pick and place structure

[0032] 21 Adsorption parts

[0033] 22 Robotic Arm

[0034] 30 Electronic components

[0035] 31 Conductive bump

[0036] A Region

[0037] D Horizontal distance

[0038] F Flux

[0039] M Magnet

[0040] T Thickness

[0041] W Width. DETAILED DESCRIPTION

[0042] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0043] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical contents disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "one", "first", and "second" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0044] Figure 1 FIG. 1 is a cross-sectional schematic diagram of the wafer loading machine 1 of the present invention. Figure 1 As shown, the wafer loading machine 1 of this embodiment includes a tray structure 10 and a pick-and-place structure 20. The tray structure 10 contains soldering flux F, and the pick-and-place structure 20 absorbs the electronic component 30 and moves the electronic component 30 onto the tray structure 10 so that the conductive bump 31 of the electronic component 30 is attached to the soldering flux F.

[0045] Figure 2 FIG. 1 is a cross-sectional schematic diagram of the tray structure 10 of the present invention. Figure 2 As shown, in this embodiment, the tray structure 10 includes a base 11 and a soldering tray 12. The base 11 can be a heavy base that is not easy to move. The base 11 can be fixedly set at a specified position in the manufacturing production line, which is conducive to the positioning of the pick-and-place structure 20 on the tray structure 10, and it is not easy to shift or tip over during the manufacturing process. In addition, the base 11 has a first side 11a and a second side 11b opposite to each other, and a first fixing portion for engaging the soldering tray 12, such as a recess 110, can be provided on the first side 11a of the base 11.

[0046] In the present embodiment, the soldering tray 12 has a first surface 12a and a second surface 12b opposite to each other. A containing portion 121 for containing the soldering flux F may be provided on the first surface 12a of the soldering tray 12. The containing portion 121 may be a recessed portion that is recessed inward from the first surface 12a, and the containing portion 121 may define an area A for containing the soldering flux F. Furthermore, in other embodiments, it may also be formed to extend outward from the first surface 12a of the soldering tray 12 to form a containing space for containing the soldering flux F, and is not limited to the above. In addition, the soldering flux F is stable at room temperature and has strong reducing properties at high temperatures, and it can remove the oxide layer on the metal surface, and at the same time has a protective effect and prevents oxidation reactions, thereby promoting welding.

[0047] In addition, a second fixing portion (e.g., a convex portion 120) corresponding to the first fixing portion (e.g., a concave portion 110) is provided on the second surface 12b of the flux tray 12, and the flux tray 12 can be detachably coupled to the first side 11a of the base 11 through the convex portion 120, thereby limiting the horizontal position of the flux tray 12 relative to the base 11. Moreover, the flux tray 12 can be formed into a relatively light structure, which is convenient for the user to move the flux tray 12 removed from the base 11 to contain the flux F or clean the flux tray 12. It should be understood that in other embodiments, the flux tray 12 can also be placed directly on the base 11, or the flux tray 12 and the base 11 can also be coupled in other ways, and are not limited to the above.

[0048] In the present embodiment, a magnet M is provided between the base 11 and the flux tray 12. For example, the magnet M may be provided on the first side 11a of the base 11, and the flux tray 12 may be made of a magnetic material that can be attracted by the magnet M. The flux tray 12 is attracted by the magnetic force of the magnet M on the base 11, so that it can fit tightly with the base 11. In addition, in the present embodiment, the magnet M is provided on the first side 11a of the base 11 in an embedded manner, but the present invention is not limited thereto.

[0049] In addition, in other embodiments, the magnet M may also be disposed on the second surface 12b of the flux tray 12 instead of being disposed on the base 11, and the base 11 may be formed of a magnetic material that can be attracted by the magnet M. Therefore, the flux tray 12 may attract the base 11 through the magnetic force of the magnet M, so that it can fit tightly with the base 11. Also, similarly, the magnet M may be disposed in an embedded manner on the second surface 12b of the flux tray 12, but the present invention is not limited thereto.

[0050] Alternatively, the magnet M may also be disposed on the first side 11a of the base 11 and the second surface 12b of the flux tray 12 at the same time. The magnet M disposed on the first side 11a of the base 11 and the magnet M disposed on the second surface 12b of the flux tray 12 may be located at corresponding positions, so that the magnets M attract each other and further enhance the adsorption force. However, the magnet M disposed on the first side 11a of the base 11 and the magnet M disposed on the second surface 12b of the flux tray 12 may also be staggered from each other, and the base 11 and the flux tray 12 may be composed of magnetic materials that can be attracted by the magnet M. Through the above configuration, the base 11 and the flux tray 12 can be tightly fitted through the magnetic force of the magnet M.

[0051] In the case where the magnet M is not provided as described above, after the user inserts the protrusion 120 of the soldering tray 12 into the recess 110 of the base 11, although the horizontal relative position between the soldering tray 12 and the base 11 can be limited, if the protrusion 120 of the soldering tray 12 is not fully pressed into the recess 110 of the base 11, the vertical relative position of the soldering tray 12 relative to the base 11 may change, causing the soldering tray 12 to tilt. In this embodiment, the magnetic force of the magnet M can ensure that the soldering tray 12 is tightly fitted to the base 11, so that the soldering tray 12 remains horizontal and does not tilt, so that the soldering flux F can be evenly distributed in the entire containing portion 121 of the soldering tray 12.

[0052] Furthermore, Figure 3 for Figure 2 A schematic top view of the base 11. Figure 3 As shown, in order to better adsorb the flux tray 12 and keep the flux tray 12 horizontal, the magnet M can be set at each corner of the base 11. For example, four magnets M are set in this embodiment, which are respectively set at the four corners of the base 11. Therefore, the magnet M on the base 11 can adsorb the entire flux tray 12 more evenly to keep the flux tray 12 horizontal. It should be understood that in other embodiments, more magnets M can be set symmetrically or asymmetrically, or only two magnets M can be set on both sides, as long as the magnetic force of the magnet M is sufficient to make the flux tray 12 fit the base 11. The number and position of the magnets M can be adjusted according to needs, and are not limited to the above.

[0053] In addition, if Figure 2 and Figure 3 As shown, the magnet M is disposed at the periphery of the region A of the soldering tray 12 containing the soldering flux F, and does not overlap with the region A. In this embodiment, the horizontal distance D between the magnet M and the region A can be 3 mm to 6 mm. Therefore, the magnet M will not affect the movement of the electronic component 30.

[0054] In addition, in this embodiment, the width W of the magnet M (i.e., the diameter of the magnet M when the magnet M is circular) can be 4 mm to 8 mm, and the thickness T of the magnet M can be 2 to 5 mm, so that the magnetic adsorption force generated by the four magnets M can be 1 kg to 2 kg. However, the present invention is not limited thereto, as long as the magnetic force of the magnet M is sufficient to make the soldering tray 12 fit the base 11, in other embodiments, the size of the magnet M and the magnetic adsorption force of the magnet M can also be adjusted as needed.

[0055] In addition, if Figure 1As shown, in this embodiment, the pick-and-place structure 20 has a suction member 21 for sucking the electronic component 30 and a mechanical arm 22 for moving the suction member 21. The suction member 21 is, for example, a vacuum suction type suction member, which may have an elastic pad and a suction hole. The suction member 21 contacts the electronic component 30 with the elastic pad and forms a vacuum with the suction hole, thereby sucking the electronic component 30. In addition, the mechanical arm 22 is, for example, a mechanical arm with multiple joints, so as to move the suction member 21 along the vertical direction and the horizontal direction.

[0056] The electronic component 30 is, for example, a semiconductor chip or a packaging module after packaging a semiconductor chip, and has a plurality of conductive bumps 31 such as solder bumps. Through the conductive bumps 31, the electronic component 30 can be combined and electrically connected to a circuit layer such as a substrate in a flip-chip manner in a subsequent process.

[0057] Before the process of placing the electronic component 30 on the substrate is performed, in order to enhance the bonding strength between the conductive bump 31 and the soldering metal surface, the conductive bump 31 of the electronic component 30 needs to be firstly attached with the soldering flux F, so as to facilitate the placement of the electronic component 30 on the substrate. Specifically, the electronic component 30 is adsorbed by the adsorbing member 21 of the pick-and-place structure 20, and the robotic arm 22 of the pick-and-place structure 20 is controlled to move the adsorbing member 21 above the soldering tray 12 of the tray structure 10, and to descend until the conductive bump 31 of the electronic component 30 can contact the soldering flux F contained in the soldering tray 12.

[0058] Since the flux F contained in the flux tray 12 is evenly distributed in the entire area A, and the flux tray 12 is parallel to the electronic component 30 adsorbed by the pick-and-place structure 20, the conductive bumps 31 of the electronic component 30 can be effectively and reliably all uniformly adhered to the flux F, and it is ensured that the conductive bumps 31 of the electronic component 30 are all indeed covered with the flux F.

[0059] In summary, in the wafer loading machine and its tray structure of the present invention, a magnet is mainly arranged between the soldering tray containing solder flux and the base, so that the soldering tray is firmly attached to the base by the magnetic force of the magnet, thereby keeping the soldering tray level. In this way, the soldering flux can be evenly distributed on the entire soldering tray, so when the electronic component is moved to the soldering tray to be coated with the soldering flux by using the pick-and-place structure, the conductive bumps of the electronic component can be more evenly and reliably coated with the soldering flux.

[0060] Furthermore, since the soldering tray is parallel to the electronic components adsorbed by the pick-and-place structure, the electronic components can be more easily attached with soldering flux.

[0061] In addition, when the chip loading machine of the present invention is used to load electronic components, the conductive bumps of the electronic components can all be evenly and reliably attached with soldering flux, so the yield rate of the chip loading process of the electronic components is high.

[0062] In addition, the tray structure has a joint structure formed by the protrusion of the flux tray and the recess of the base, through which the horizontal position of the flux tray can be limited, so the pick-and-place structure can accurately move the electronic components to the area of ​​the flux tray containing flux.

[0063] The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the inventive concept and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. A tray structure, comprising: a base having first and second opposing sides; as well as A soldering tray, which is disposed on a first side of the base and has a first surface for containing soldering flux and a second surface opposite to the first surface and contacting the base; Wherein, a magnet is arranged between the base and the flux tray.

2. The tray structure according to claim 1, wherein: The magnet is disposed on the first side of the base.

3. The tray structure according to claim 1, wherein: The magnet is disposed on the second surface of the flux tray.

4. The tray structure according to claim 1, wherein: The magnet is disposed on the first side of the base and the second surface of the flux tray.

5. The tray structure according to claim 1, wherein: The magnet is located outside the area of ​​the soldering tray containing the soldering flux.

6. The tray structure according to claim 1, wherein: A concave portion is disposed on the first side of the base, and a convex portion opposite to the concave portion is disposed on the second surface of the soldering tray.

7. The tray structure according to claim 1, wherein: A containing portion for containing the soldering flux is provided on the first surface of the soldering tray.

8. The tray structure according to claim 1, wherein: The fluxing tray is arranged on the base in a tightly fitting manner by utilizing the magnetic force of the magnet.

9. A film loading machine, comprising: A tray structure, comprising a base having a first side and a second side opposite to each other, and a soldering tray disposed on the first side of the base, wherein the soldering tray has a first surface for containing soldering flux and a second surface opposite to the first surface and contacting the base, and a magnet is disposed between the base and the soldering tray; and The pick-and-place structure has a suction piece for sucking electronic components and a mechanical arm for moving the suction piece, so as to move the electronic components onto the soldering tray and adhere the soldering flux.

10. The wafer loading machine according to claim 9, wherein: The magnet is disposed on the first side of the base.

11. The wafer loading machine according to claim 9, wherein: The magnet is disposed on the second surface of the flux tray.

12. The wafer loading machine according to claim 9, wherein: The magnet is disposed on the first side of the base and the second surface of the flux tray.

13. The wafer loading machine according to claim 9, wherein: The magnet is located outside the area of ​​the soldering tray containing the soldering flux.

14. The wafer loading machine according to claim 9, wherein: A concave portion is disposed on the first side of the base, and a convex portion opposite to the concave portion is disposed on the second surface of the soldering tray.

15. The wafer loading machine according to claim 9, wherein: A containing portion for containing the soldering flux is provided on the first surface of the soldering tray.

16. The wafer loading machine according to claim 9, wherein: The fluxing tray is arranged on the base in a tightly fitting manner by utilizing the magnetic force of the magnet.

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