Laser processing device and method

Abstract

The invention discloses a laser processing device, which is used for processing a processed object and comprises a laser beam source, a compensation system and an imaging system. The laser beam source is configured to generate a laser beam, and a non-zero angle is formed between the optical axis of the laser beam and the normal direction of the surface of the machined object. The compensation system includes a phase compensation patch configured to form a beam pattern of the laser beam away from the optical axis, the phase compensation patch being designed based on the non-zero angle. The imaging system is configured to focus the beam pattern as a processing beam at the processing position, and the distance of the phase compensation sheet relative to the laser beam source along the optical axis is determined based on the processing depth of the processing position. A laser processing method is also disclosed. According to the laser processing device and method, the phase difference during oblique laser processing is compensated through the compensation system, so that the problem of distortion of a processing light beam is avoided.

Description

Technical Field

[0001] The invention relates to a laser processing device and a laser processing method. Background Art

[0002] Laser micro-hole processing technology is currently widely used in many industries. In order to meet the needs of lighter, thinner and shorter 3C devices and high-capacity signal transmission such as high-frequency communications and 4K photography, glass perforation (TGV, Through Glass Via) technology is widely used in related technical fields.

[0003] In short, the glass perforation technology is to use a laser beam to drill holes on a glass substrate. Taking the field of optical communication technology as an example, the glass perforation technology of its connector uses bevel laser processing technology to reduce the loss of optical signals. However, this bevel laser processing technology will encounter the problem that the optical axis of the laser beam cannot be incident vertically on the processed object, causing the laser beam to deform and resulting in uneven energy distribution. In addition, current laser processing equipment is often limited by the diffraction characteristics of the laser beam, resulting in the laser processing equipment not having flexible tapered hole processing capabilities, and therefore cannot meet the needs of a single laser drilling process that requires local adjustment to a straight hole or a tapered hole.

[0004] Therefore, a laser device capable of achieving bevel processing is needed. Summary of the invention

[0005] One embodiment of the present invention provides a laser processing device for processing a processing object. The laser processing device includes a laser beam source, a compensation system, and an imaging system. The laser beam source is configured to generate a laser beam, wherein a non-zero angle is sandwiched between the optical axis of the laser beam and the normal direction of the surface of the processing object. The compensation system includes a phase compensator, wherein the phase compensator is configured to form a beam pattern away from the optical axis, and the phase compensator is designed based on the non-zero angle. The imaging system includes a first optical component and a second optical component, wherein the first optical component is configured to perform a first focusing on the beam pattern, and the second optical component is configured to perform a second focusing on the beam pattern that has been focused for the first time, so that the beam pattern becomes a processing beam focused on a processing position. The air spacing between the first optical component and the second optical component on the optical axis is substantially the sum of the first focal length of the first optical component and the second focal length of the second optical component, wherein the distance of the phase compensator relative to the laser beam source along the optical axis is determined based on the processing depth of the processing position.

[0006] In some embodiments, the error range of the air distance and the sum of the first focal length and the second focal length is within 15% of the sum of the first focal length and the second focal length.

[0007] In some embodiments, the non-zero angle is less than 30 degrees.

[0008] In some embodiments, the processing beam includes a central light spot and a plurality of light rings coaxial with the central light spot.

[0009] In some embodiments, the laser beam source includes a laser light source and a conical mirror, wherein the laser light source is configured to generate incident light, and the conical mirror is configured to shape the incident light into a laser beam having a ring shape.

[0010] In some embodiments, the beam pattern is distorted from a laser beam.

[0011] In some embodiments, when the processing position is on the surface of the processing object, the first air distance between the phase compensation plate and the first optical component is substantially equal to the first focal length of the first optical component, and the second air distance between the processing object and the second optical component is substantially equal to the second focal length of the second optical component.

[0012] In some embodiments, the error range between the first air distance and the first focal length is less than 15%, and the error range between the second air distance and the second focal length is less than 15%.

[0013] In some embodiments, the laser processing apparatus further includes an offset component disposed between the first optical component and the second optical component, wherein the offset component is configured to offset the first focused beam pattern relative to the optical axis.

[0014] In some embodiments, the third air distance between the offset component and the first optical component is substantially equal to the first focal length of the first optical component.

[0015] In some embodiments, the offset assembly includes a dual-axis galvanometer and a galvanometer motor connected to the dual-axis galvanometer.

[0016] In some embodiments, the compensation system includes an adjustment component configured to adjust the distance of the phase compensation plate relative to the laser beam source along the optical axis.

[0017] In some embodiments, the adjustment assembly is a single-axis displacement mechanism.

[0018] Another embodiment of the present invention provides a laser processing method for performing oblique processing on a processing object. The laser processing method includes the following steps: using a laser beam source to emit a laser beam, wherein a non-zero angle is formed between the optical axis of the laser beam and the normal direction of the surface of the processing object; using a compensation system to make the laser beam away from the optical axis to form a compensated beam pattern; the compensated beam pattern enters an imaging system and is first focused through a first optical component in the imaging system; the beam pattern that has been first focused is then secondly focused through a second optical component in the imaging system, so that the beam pattern becomes a processing beam focused at a processing depth of the processing object, wherein the air spacing between the first optical component and the second optical component on the optical axis is substantially the sum of the first focal length of the first optical component and the second focal length of the second optical component; and adjusting the distance of the phase compensation plate of the compensation system relative to the laser beam source along the optical axis in response to changes in the processing depth.

[0019] In some embodiments, the laser processing method further includes designing a phase compensation plate based on the non-zero angle.

[0020] In some embodiments, adjusting the position of the phase compensation plate is performed by an adjustment component in the compensation system.

[0021] In some embodiments, the laser processing method further includes setting a preset position of a phase compensator and a processing object, wherein a first air distance between the phase compensator and the first optical component is substantially equivalent to a first focal length of the first optical component, and a second air distance between the processing object and the second optical component is substantially equivalent to a second focal length of the second optical component.

[0022] In some embodiments, the laser processing method further includes using an offset component to offset the first focused beam pattern relative to the optical axis.

[0023] In some embodiments, the third air distance between the offset component and the first optical component is substantially equal to the first focal length of the first optical component.

[0024] In some embodiments, the laser beam is a laser with a phase difference.

[0025] The present invention provides a laser processing device and a laser processing method, which compensates the phase difference during laser oblique processing through a compensation system to avoid the problem of processing beam distortion. Since the displacement of the phase compensation plate of the compensation system and the processing depth of the processing beam are linearly related and have nothing to do with the position of the processing object, it is possible to achieve the effects of simplifying the control structure, reducing the manufacturing process error, improving the processing quality, and improving the manufacturing process speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to make the purpose, features, advantages and embodiments of the present invention more clearly understood, the detailed description of the attached drawings is as follows:

[0027] Figure 1 Schematic diagrams of some embodiments of the laser processing device of the present invention;

[0028] Figure 2 Schematic diagram of some embodiments of the laser processing device of the present invention at another use stage;

[0029] Figure 3A , Figure 3B as well as Figure 3C They are schematic diagrams of different Bessel laser beams;

[0030] Figure 4 Flow charts of some embodiments of the method for designing a laser processing device of the present invention;

[0031] Figure 5A Schematic diagram of laser processing performed by some embodiments of the laser processing device of the present invention;

[0032] Figure 5B A graph showing the relationship between the displacement of the phase compensation plate and time in some embodiments of the laser processing device of the present invention;

[0033] Figure 6 Schematic diagrams of other embodiments of the laser processing device of the present invention;

[0034] Fig. 7A , Figure 7B , Figure 7C They are schematic diagrams of using some embodiments of the laser processing device of the present invention to process oblique tapered holes;

[0035] Fig. 8A Schematic diagram of some embodiments of the laser processing device of the present invention performing oblique tapered hole processing;

[0036] Figure 8B is a graph showing the relationship between the displacement of the phase compensation plate and time in some embodiments of the laser processing device of the present invention;

[0037] Fig. 9 Flowcharts of some embodiments of the laser processing method of the present invention.

[0038] Explanation of symbols

[0039] 100,100':Laser processing device

[0040] 101: Optical axis

[0041] 110: Laser beam source

[0042] 112: Laser light source

[0043] 114: Conical mirror

[0044] 120: Compensation system

[0045] 122: Phase compensation film

[0046] 124: Adjustment components

[0047] 130: Imaging System

[0048] 132: First optical component

[0049] 134: Second optical component

[0050] 140:Offset component

[0051] 142: Dual-axis galvanometer

[0052] 144: Galvanometer motor

[0053] 200: Processing objects

[0054] 201: Normal direction

[0055] 210: Loading platform

[0056] 300A: Ideal Bessel laser beam

[0057] 300B: Uncompensated Bessel Laser Processing Beam

[0058] 300C: Phase-compensated Bessel laser processing beam

[0059] 310: Center spot

[0060] 320: Halo

[0061] M10,M20: Method

[0062] S11,S12,S13,S14,S15,S16,S17,S21,S22,S23,S24,S25,S26: Steps

[0063] L0: incident light

[0064] L1: Laser beam

[0065] L2: Beam pattern

[0066] L3: Processing beam

[0067] θ: Angle

[0068] P, P': Processing position

[0069] AG: Air Gap

[0070] AG1: First air gap

[0071] AG2: Second air gap

[0072] AG3: Third air gap

[0073] AG4: Fourth air gap

[0074] F1: First focal length

[0075] F2: Second focal length

[0076] d1,d2: distance

[0077] ΔZ, ΔZ1, ΔZ2: Processing depth

[0078] ΔS: displacement

[0079] X,Y,Z: axis

[0080] D1, D2: machining inner diameter DETAILED DESCRIPTION

[0081] The following will clearly illustrate the spirit of the present invention with the accompanying drawings and detailed descriptions. Any ordinary technician in the technical field can change and modify the present invention by the technology taught by the present invention after understanding the preferred embodiments of the present invention, without departing from the spirit and scope of the present invention.

[0082] Reference Figure 1 , which is a schematic diagram of some embodiments of the laser processing device of the present invention. The laser processing device 100 is configured to process the processing object 200, for example, to perform oblique processing to form a laser drilled hole on the processing object 200, such as a glass substrate. When the laser processing device 100 performs oblique processing on the processing object 200, an angle θ is sandwiched between the optical axis 101 of the processing light beam L3 emitted by the laser processing device 100 and the normal direction 201 of the surface of the processing object 200, and the angle θ is non-zero. In some embodiments, this non-zero angle θ is less than 30 degrees. When the angle θ of the oblique processing is less than 30 degrees, since the light field amplitude variation of the penetrating light of the processing light beam L3 within this angle range is small, the laser processing device 100 with the compensation system 120 provided by the present invention can achieve better phase compensation effect through the design of the phase compensation plate 122 in the compensation system 120.

[0083] The laser processing device 100 includes a laser beam source 110, a compensation system 120, and an imaging system 130. The laser beam source 110 is used to generate a laser beam L1, wherein the laser beam L1 is a laser with a phase difference. Therefore, if the optical axis 101 of the laser beam L1 (i.e., the optical axis 101 of the processing beam L3) fails to be incident on the surface of the processing object 200 in a normal direction, the processing beam L3 will be deformed due to the non-zero angle θ between the optical axis 101 and the normal direction 201 of the processing object 200.

[0084] The compensation system 120 is used to perform phase compensation on the laser beam L1 according to the angle θ of the oblique processing of the processing object 200 by the laser processing device 100, that is, the angle θ between the optical axis 101 of the laser beam L1 (that is, the optical axis 101 of the processing beam L3) and the normal direction 201 of the surface of the processing object 200, so that the laser beam L1 forms a phase-compensated beam pattern L2.

[0085] Then, the phase-compensated beam pattern L2 is further focused by the imaging system 130 to form a processing beam L3 focused on the processing position P of the processing object 200 for processing. Since the processing beam L3 has been compensated by the compensation system 120 corresponding to the angle θ of the oblique processing, the pattern of the processing beam L3 focused on the processing position P of the processing object 200 is substantially a scaling ratio relationship of the laser beam L1 projected by the laser beam source 110, thereby avoiding the problem of pattern distortion.

[0086] The laser beam source 110 , the compensation system 120 , and the imaging system 130 in the laser processing device 100 are discussed in detail below.

[0087] The laser beam source 110 includes a laser light source 112 and a conical mirror 114. The laser light source 112 is used to generate an incident light L0. After the incident light L0 passes through the conical mirror 114, the conical mirror 114 can shape the incident light L0 into a ring-shaped laser beam L1. The conical mirror 114 can be a refractive or diffractive type. In some embodiments, the shaped laser beam L1 can be a Bessel beam. The processing object 200 is placed at an angle such that a non-zero angle θ is sandwiched between the optical axis 101 of the laser beam L1 and the normal direction 201 of the surface of the processing object 200.

[0088] The compensation system 120 includes a phase compensator 122. The phase compensator 122 is configured to make the laser beam L1 diverge away from the optical axis 101 of the laser beam L1 to form a beam pattern L2. Since the phase compensator 122 is designed based on the angle θ of the oblique processing, the compensated beam pattern L2 will be distorted from the laser beam L1. For example, the laser beam L1 has a symmetrical phase distribution and the compensated beam pattern L2 has an asymmetrical phase distribution, and / or the compensated beam pattern L2 is a deformed pattern of the laser beam L1, etc. The details of the design of the phase compensator 122 based on the angle θ of the oblique processing will be described in detail. Figure 4 A detailed discussion is given in .

[0089] The imaging system 130 includes a first optical component 132 and a second optical component 134. The first optical component 132 is configured to perform a first focusing on the compensated beam pattern L2, and the second optical component 134 is configured to perform a second focusing on the beam pattern L2 that has been focused for the first time, so that the beam pattern L2 becomes a processing beam L3 focused on the processing position P. Because the beam pattern L2 has been phase compensated, and the phase compensation is designed based on the angle θ of the oblique processing. Therefore, the processing beam L3 at the processing position P of the processing object 200 will be substantially a scaling ratio relationship of the laser beam L1 projected by the laser beam source 110, which solves the problem of deformation and distortion of the processing beam L3 during oblique processing.

[0090] In some embodiments, the imaging system 130 is configured to provide a Kepler-type afocal imaging optical path, wherein the air distance AG between the first optical component 132 and the second optical component 134 on the optical axis 101 is substantially the sum of the first focal length F1 of the first optical component 132 and the second focal length F2 of the second optical component 134. The Kepler-type afocal imaging optical path provided by the imaging system 130 has a single magnification M ag =F2 / F1, that is, the magnification M ag is a fixed value, which is only related to the first focal length F1 and the second focal length F2 but has nothing to do with the phase compensation plate 122 and the processing position P. Therefore, the imaging system 130 has the advantages of maintaining the phase of the phase compensation plate 122 constant and the conjugate surface linearization.

[0091] Please also refer to Figure 1 and Figure 2 , Figure 2Schematic diagram of some embodiments of the laser processing device of the present invention in another use stage. Since during laser processing, such as laser drilling, the processing position P of the processing beam L3 in the processing object 200 will gradually change as required, such as gradually going deeper into the processing position P' in the processing object 200, the compensation system 120 further includes an adjustment component 124 connected to the phase compensation plate 122, so as to adjust the distance of the phase compensation plate 122 relative to the laser beam source 110 along the optical axis 101 through the adjustment component 124.

[0092] For example, when the focus position of the processing beam L3 is Figure 1 When the processing depth is zero, the processing depth of the processing beam L3 is equivalent to the surface of the processing object 200, and the processing depth is determined to be zero. When the processing depth is zero, the first air gap AG1 between the phase compensation plate 122 and the first optical component 132 is substantially equivalent to the first focal length F1 of the first optical component 132. In some embodiments, when the processing depth is zero, the error range between the first air gap AG1 between the phase compensation plate 122 and the first optical component 132 and the first focal length F1 of the first optical component 132 is less than 15%. When the processing depth is zero, the second air gap AG2 between the processing object 200 and the second optical component 134 is substantially equivalent to the second focal length F2 of the second optical component 134. In some embodiments, when the processing depth is zero, the error range between the second air gap AG2 between the processing object 200 and the second optical component 134 and the second focal length F2 of the second optical component 134 is less than 15%. The distance of the phase compensation plate 122 relative to the laser beam source 110 along the optical axis 101 is a distance d1.

[0093] When the focus position of the processing beam L3 is Figure 2 When the processing position P' in the processing object 200 is reached, the processing depth of the processing light beam L3 enters the interior of the processing object 200. At this time, the desired processing depth of the processing light beam L3 is set as the processing depth ΔZ. The corresponding phase compensation plate 122 also moves the displacement ΔS in the direction toward the processing object 200 to focus the processing light beam L3 on the processing position P' of the processing depth ΔZ. The distance of the phase compensation plate 122 relative to the laser beam source 110 along the optical axis 101 is the distance d2. The displacement ΔS of the phase compensation plate 122 = ΔZ / M ag 2 , where ΔZ is the processing depth and the magnification M is ag =F2 / F1, F1 is the first focal length of the first optical component 132, and F2 is the second focal length of the second optical component 134.

[0094] And because the magnification M agis a fixed value, therefore, there is also a linear relationship between the processing depth ΔZ of the processing beam L3 and the displacement ΔS of the phase compensation plate 122. In addition, the imaging system 130 has the advantage of conjugate surface linearization. Therefore, the laser processing device 100 only needs to adjust the displacement ΔS of the phase compensation plate 122 along the optical axis 101 relative to the laser beam source 110 based on the desired processing depth ΔZ of the processing beam L3 through the adjustment component 124, so that the processing beam L3 can be smoothly focused on the processing position of the processing depth ΔZ, such as the processing position P'. In some embodiments, the adjustment component 124 can be a single-axis displacement mechanism. Specifically, the adjustment component 124 is configured to allow the phase compensation plate 122 to move along the direction of the optical axis 101.

[0095] In some embodiments, the error range between the air distance AG between the first optical component 132 and the second optical component 134 on the optical axis 101 and the sum of the first focal length F1 of the first optical component 132 and the second focal length F2 of the second optical component 134 is within 15% of the sum of the first focal length F1 and the second focal length F2. If the aforementioned error range is greater than 15% of the sum of the first focal length F1 and the second focal length F2, the magnification of the imaging system 130 of the Kepler-type afocal imaging optical path will not be a fixed value, resulting in a decrease in the degree of linear relationship between the processing depth ΔZ of the processing light beam L3 and the displacement ΔS of the phase compensation plate 122, thereby requiring a more complex nonlinear control system and being detrimental to processing costs and processing efficiency.

[0096] Reference Figure 3A , Figure 3B as well as Figure 3C . Figure 3A is an ideal Bessel laser beam 300A, which includes a central light spot 310 and a plurality of light rings 320 surrounding the central light spot 310 and coaxial with the central light spot 310. The Bessel laser beam 300A may correspond to Figure 1 FIG. 1 is a diagram showing a state of the laser beam L1 emitted by the laser beam source 110. FIG.

[0097] Figure 3B In other embodiments, when the laser processing device does not have a compensation system, oblique processing is performed, so that the uncompensated Bessel laser processing beam 300B is imaged in the processing object. Obviously, the uncompensated Bessel laser processing beam 300B has been distorted.

[0098] Figure 3CAccording to some embodiments of the present invention, when the laser processing device has a compensation system, the phase-compensated Bessel laser processing beam 300C is imaged in the processing object for oblique processing. The phase-compensated Bessel laser processing beam 300C can still observe the central light spot 310 and multiple light rings 320 surrounding the central light spot 310 and coaxial with the central light spot 310. In some embodiments, the diameter of the central light spot 310 is between 1 and 20 μm.

[0099] Please also refer to Figure 1 and Figure 4 ,in Figure 4 Flow charts of some embodiments of the laser processing device design method of the present invention. The laser processing device design method M10 begins with step S11, where the magnification M of the imaging system 130 is calculated. ag The setting of magnification M ag The value is the second focal length F2 of the second optical component 134 / the first focal length F1 of the first optical component 132. Step S11 includes determining the first focal length F1 of the first optical component 132 and the second focal length F2 of the second optical component 134, and then further determining the air gap AG between the first optical component 132 and the second optical component 134, which is the sum of the first focal length F1 of the first optical component 132 and the second focal length F2 of the second optical component 134, and the error is within 15%.

[0100] Next, step S12 is to set the optical path, such as setting the optical path of the Bessel laser beam. Step S12 includes determining the positions of the laser light source 112 and the conical mirror 114, and the position of the conjugate plane of the Bessel laser beam can be deduced. Step S12 is performed without considering the phase compensation plate. In step S12, the refractive index of the processing object 200, such as the glass plate, and the influence of the oblique processing angle are not considered.

[0101] Next, step S13 is to analyze the surface aberration of the processed object 200, such as a glass plate, and in step S14, the coefficients are obtained by using the aberration Zernike polynomial fitting equation, wherein the aberration Zernike polynomial fitting equation is a tool commonly used in analyzing optical aberrations, and is a normalized polynomial that can be used as a basis function for aberration fitting. Any aberration can be represented by the functions of each order (m, n) in the Zernike function and its coefficients, which are divided into odd terms and even terms, wherein the odd terms are The even terms are: Where n and m are non-negative integers and n≥m≥0. R(n,m) has the following form Where ρ is the radial distance, and its value is 0≤ρ≤1.

[0102] It should be noted that the oblique processing angle has been considered when performing the surface aberration analysis of the object 200 in step S13 and using the aberration Zernike polynomial fitting equation in step S14. The aberration distribution φ of the surface of the object 200 can be obtained through steps S13 and S14. aberration (X,Y).

[0103] Next, step S15 is to calculate the phase of the phase compensation plate 122. Since the imaging system 130 is an afocal imaging system with a single magnification M ag , that is, the magnification M ag It has nothing to do with the phase compensation plate 122 and the processing position, and has the advantages of maintaining the phase of the phase compensation plate 122 constant and linearizing the conjugate surface. Therefore, the phase calculation of the corresponding phase compensation plate 122 can be expressed as φ correction (X,Y)=φ aberration (M ag ×X,M ag ×Y), is the linear relationship of the aberration distribution on the surface of the processed object 200.

[0104] Next, step S16 is to configure the phase compensator 122 and the object 200 at a preset position. As mentioned above, the preset position of the phase compensator 122 is set between the laser beam source 110 and the first optical component 132, and the first air gap AG1 between the phase compensator 122 and the first optical component 132 is substantially equal to the first focal length F1 of the first optical component 132. The preset position of the object 200 is a position where the second air gap AG2 between the object 200 and the second optical component 134 is substantially equal to the second focal length F2 of the second optical component 134.

[0105] Finally, step S17 is to perform working distance compensation calculation, wherein the displacement of the phase compensation plate 122 is ΔS=ΔZ / M ag 2 , ΔZ is the processing depth, magnification M ag =F2 / F1, F1 is the first focal length of the first optical component 132, and F2 is the second focal length of the second optical component 134. The displacement ΔS of the phase compensation plate 122 is linearly related to the processing depth of the processing light beam L3.

[0106] In summary, the laser processing device 100 has the advantages of constant magnification and conjugate surface linearization of the afocal optical path design, and the characteristic that the displacement ΔS of the phase compensation plate 122 and the processing depth of the processing beam L3 present a linear relationship. Therefore, the design and operation of the laser processing device 100 can be simplified to a linear relationship and can be quickly compensated in the laser processing process.

[0107] Reference Figure 5A and Figure 5B ,in Figure 5A It is a schematic diagram of laser processing according to some embodiments of the laser processing device of the present invention. Figure 5B 1 is a graph showing the relationship between the displacement ΔS of the phase compensation plate and time in some embodiments of the laser processing device according to the present invention. In some embodiments, the processing object 200 is a glass substrate, the processing object 200 is fixed on the loading platform 210, and the loading platform 210 and the processing object 200 thereon are tilted relative to the laser processing device 100, so that the processing beam L3 performs oblique processing on the processing object 200.

[0108] For example, the oblique processing is glass perforation array processing, more specifically, glass perforation oblique hole array processing. When the laser processing device 100 moves relative to the carrier platform 210, here, the carrier platform 210 is stationary and the laser processing device 100 moves as an example, by controlling the processing depth of the processing beam L3 emitted by the laser processing device 100, an array of oblique holes with a fixed inner diameter can be formed on the processing object 200.

[0109] Specifically, the loading platform 210 is an XY plane loading platform, which has a height gradient in the Z axis direction along the X axis direction. When the laser processing device 100 is used to process the inclined hole array, it is only necessary to move the laser processing device 100 along the X axis or the Y axis, and the processing depth of the processing beam L3 in the Z axis direction is adjusted by adjusting the processing depth of the laser processing device 100. Figure 1 and Figure 2 The displacement amount ΔS of the phase compensation plate 122 along the optical axis 101 changes.

[0110] Specific as Figure 5B As shown, since there is a linear relationship between the displacement ΔS of the phase compensation plate 122 and the processing depth of the processing light beam L3 and it is independent of the position of the processing object 200, there is also a linear relationship between the displacement ΔS of the phase compensation plate 122 and the operation time. Therefore, it is possible to achieve the effects of simplifying the control structure, reducing the manufacturing process error, improving the processing quality, and improving the manufacturing process speed.

[0111] However, in the technical field of laser oblique processing, in addition to the need to process oblique holes with uniform inner diameters, there is also a need to process oblique tapered holes. Therefore, a laser processing device that can be used to process oblique tapered holes is required.

[0112] Reference Figure 6, which are schematic diagrams of other embodiments of the laser processing device of the present invention. In addition to the aforementioned laser beam source 110, compensation system 120, and imaging system 130, the laser processing device 100' further includes an offset component 140, which is disposed between the first optical component 132 and the second optical component 134. The offset component 140 is configured to offset the beam pattern L2 after the first focus relative to the optical axis 101. More specifically, if the direction of the optical axis 101 of the processing beam L3 is the Z-axis direction, the offset component 140 is configured to offset the beam pattern L2 relative to the optical axis 101 on the XY plane.

[0113] In some embodiments, the air distance AG between the first optical component 132 and the second optical component 134 is the sum of the first focal length F1 of the first optical component 132 and the second focal length F2 of the second optical component 134, the third air distance AG3 between the offset component 140 and the first optical component 132 is substantially equal to the first focal length F1 of the first optical component 132, and the fourth air distance AG4 between the offset component 140 and the second optical component 134 is substantially equal to the second focal length F2 of the second optical component 134, so that the optical path of the imaging system 130 still has the characteristics of an afocus optical path.

[0114] In some embodiments, the offset assembly 140 includes a dual-axis galvanometer 142 and a galvanometer motor 144 connected to the dual-axis galvanometer 142. The galvanometer motor 144 is configured to drive the dual-axis galvanometer 142 to perform dual-axis deflection.

[0115] In some embodiments, the laser processing apparatus 100 (see Figure 1 ) and the laser processing device 100' further include a programmable controller (not shown). The programmable controller is connected to the adjustment component 124 of the compensation system 120 and the galvanometer motor 144 (if any) connected to the offset component 140, so that the displacement of the phase compensation plate 122 and the deflection of the dual-axis galvanometer 142 can be set according to the path of laser processing.

[0116] Reference Fig. 7A and Figure 7B , which are schematic diagrams of using some embodiments of the laser processing device of the present invention to perform oblique tapered hole processing. Fig. 7A The processing position is compared with Figure 7B The processing position has a deeper processing depth ΔZ1 and a smaller processing inner diameter D1, that is, Figure 7B The processing position has a shallower processing depth ΔZ2 and a larger processing inner diameter D2. Fig. 7A or Figure 7B During processing, Figure 6The offset assembly 140 shown in the figure makes the processing light beam L3 offset on the XY plane (if the processing depth ΔZ1, ΔZ2 is used as the Z-axis direction), so as to change the processing pattern of the processing light beam L3. Fig. 7A The machining inner diameter D1 shown in Figure 7B The inner diameter D2 shown in the figure is processed. During the processing, as the processing depth ΔZ1 and ΔZ2 change, the inner diameter D2 can be processed as shown in the figure. Figure 6 The compensation system 120 is shown to focus the machining beam L3 at a desired depth.

[0117] By designing the displacement of the compensation system 120 and the offset and offset frequency of the offset component 140, the processing depth and processing pattern of the processing beam L3 can be changed, thereby obtaining the following: Figure 7C The tapered hole shown.

[0118] Reference FIG. 7A to FIG. 7C as well as Fig. 8A and Figure 8B ,in Fig. 8A It is a schematic diagram of performing oblique tapered hole processing according to some embodiments of the laser processing device of the present invention. Figure 8B 1 is a graph showing the relationship between the displacement ΔS of the phase compensator and time in some embodiments of the laser processing device according to the present invention. In some embodiments, the position of the center spot of the processing beam L3, such as the Bessel beam, can be distributed in a circular shape on the XY plane (if the processing depth is taken as the Z-axis direction) by the offset of the offset component 140, and the processing depth of the processing beam L3 in the Z-axis direction is changed by adjusting the displacement ΔS of the phase compensator along the optical axis.

[0119] Specific as Figure 8B As shown, the path of the processing light beam L3 is a circular distribution, and there is a linear relationship between the displacement ΔS of the phase compensation plate and the processing depth of the processing light beam L3. Therefore, there is a simplified harmonic relationship between the displacement ΔS of the phase compensation plate and the operation time, which is beneficial to reduce the error of the three-axis coaxiality and improve the processing position accuracy. Therefore, it is possible to achieve the effects of simplifying the control architecture, reducing the manufacturing process error, improving the processing quality, and improving the manufacturing process speed.

[0120] Reference Fig. 9 , which is a flow chart of some embodiments of the laser processing method according to the present invention. It should be noted that before performing the laser processing method M20, the following should be used: Figure 4 The design method of the laser processing device shown in the figure completes the setting of each component of the laser processing device according to the angle of oblique processing.

[0121] The laser processing method M20 begins with step S21, which is to emit a laser beam, wherein the laser beam is provided by a laser beam source. In some embodiments, the laser beam is a laser beam with a phase difference, such as a Bessel beam with a central spot and a plurality of light rings. The laser processing method M20 is applied to oblique processing, and a non-zero angle is formed between the optical axis of the laser beam and the normal direction of the surface of the processed object.

[0122] Next, step S22 is to use a compensation system to move the laser beam away from the optical axis to form a compensated beam pattern, wherein the phase compensation plate of the compensation system is designed based on the phase compensation plate, and the compensated beam pattern is obtained by using the phase compensation plate to phase compensate the laser beam. In addition, the phase compensation plate is designed according to the angle of the oblique processing.

[0123] Next, in step S23, the compensated beam pattern enters the imaging system and is focused for the first time via the first optical component in the imaging system. Then, in step S24, the beam pattern that has been focused for the first time is focused for the second time via the second optical component in the imaging system, so that the beam pattern becomes a processing beam focused on the processing position of the processing object. The air distance between the first optical component and the second optical component in the imaging system on the optical axis is substantially the sum of the first focal length of the first optical component and the second focal length of the second optical component, and the error is within 15%.

[0124] The laser processing method M20 further includes step S25, in response to the change of the processing depth, adjusting the distance of the phase compensator relative to the laser beam source along the optical axis, wherein the position of the phase compensator is adjusted by an adjustment component in the compensation system. In some embodiments, the processing depth and the displacement of the phase compensator are linearly related, and the adjustment component can be a single-axis displacement mechanism. In some embodiments, the preset position of the phase compensator is a position where the first air spacing between the phase compensator and the first optical component is substantially equal to the first focal length of the first optical component, and the error range therebetween is less than 15%, and the preset position of the processing object is a position where the second air spacing between the processing object and the second optical component is substantially equal to the second focal length of the second optical component, and the error range therebetween is less than 15%.

[0125] In some other embodiments, the laser processing method M20 further selectively includes step S26 to offset the beam pattern relative to the optical axis. More specifically, step S26 to offset the beam pattern relative to the optical axis is performed on the beam pattern after the first focusing, so that the processing beam formed after the second focusing is also offset relative to the optical axis. In some embodiments, step S26 to offset the beam pattern relative to the optical axis is performed using an offset component, and the offset component is set at a position where the third air distance between the offset component and the first optical component is substantially equal to the first focal length of the first optical component.

[0126] Steps S21 to S25 may be repeatedly and continuously performed to form an oblique hole with a fixed inner diameter, and steps S21 to S26 may be repeatedly and continuously performed to form oblique vertebral holes with various inner diameters.

[0127] The compensation system compensates for the phase difference during laser oblique processing to avoid the problem of distortion of the processing beam. Since the displacement of the phase compensation plate of the compensation system is linearly related to the processing depth of the processing beam and has nothing to do with the position of the processing object, it can simplify the control structure, reduce the manufacturing process error, improve the processing quality, and increase the manufacturing process speed.

[0128] Although the present invention is disclosed in conjunction with the above embodiments, they are not intended to limit the present invention. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the definition of the attached claims.

Claims

1. A laser processing device for processing an object, characterized in that: The laser processing device comprises: A laser beam source configured to generate a laser beam, wherein an optical axis of the laser beam forms a non-zero angle with a normal direction of a surface of the object to be processed; Compensation system, including: a phase compensator configured to move the laser beam away from the optical axis to form a beam pattern, the phase compensator being designed based on the non-zero angle; and Imaging system, including: a first optical component configured to perform a first focusing of the beam pattern; as well as A second optical component is configured to perform a second focusing on the beam pattern that has been focused for the first time, so that the beam pattern becomes a processing beam focused on a processing position, wherein the air distance between the first optical component and the second optical component on the optical axis is substantially the sum of the first focal length of the first optical component and the second focal length of the second optical component, wherein the distance of the phase compensator relative to the laser beam source along the optical axis is determined based on the processing depth of the processing position. 2 . The laser processing device as claimed in claim 1 , wherein an error range between the air distance and the sum of the first focal length and the second focal length is within 15% of the sum of the first focal length and the second focal length. The laser processing apparatus as claimed in claim 1 , wherein the non-zero angle is less than 30 degrees. 4 . The laser processing device as claimed in claim 1 , wherein the processing beam comprises a central light spot and a plurality of light rings coaxial with the central light spot. 5 . The laser processing device as claimed in claim 1 , wherein the laser beam source comprises a laser light source and a conical mirror, the laser light source is configured to generate incident light, and the conical mirror is configured to shape the incident light into the laser beam having a ring shape. The laser processing apparatus as claimed in claim 5 , wherein the beam pattern is distorted from the laser beam.

7. The laser processing device as described in claim 1, wherein when the processing position is on the surface of the processing object, the first air distance between the phase compensation plate and the first optical component is substantially equal to the first focal length of the first optical component, and the second air distance between the processing object and the second optical component is substantially equal to the second focal length of the second optical component. 8 . The laser processing device as claimed in claim 7 , wherein an error range between the first air distance and the first focal length is less than 15%, and an error range between the second air distance and the second focal length is less than 15%.

9. The laser processing device as claimed in claim 1, further comprising an offset component disposed between the first optical component and the second optical component, wherein the offset component is configured to offset the beam pattern after the first focusing relative to the optical axis. 10 . The laser processing device as claimed in claim 9 , wherein a third air distance between the offset component and the first optical component is substantially equal to the first focal length of the first optical component. 11 . The laser processing device as claimed in claim 9 , wherein the offset component comprises a dual-axis galvanometer and a galvanometer motor connected to the dual-axis galvanometer. 12 . The laser processing apparatus as claimed in claim 1 , wherein the compensation system comprises an adjustment component configured to adjust the distance of the phase compensation plate relative to the laser beam source along the optical axis.

13. The laser processing device as claimed in claim 12, wherein the adjustment component is a single-axis displacement mechanism.

14. A laser processing method for performing oblique processing on a processing object, characterized in that: The laser processing method comprises the following steps: Using a laser beam source to emit a laser beam, the optical axis of the laser beam forms a non-zero angle with the normal direction of the surface of the processing object; Using a compensation system, the laser beam is moved away from the optical axis to form a compensated beam pattern; The compensated beam pattern enters the imaging system and is focused for the first time via a first optical component in the imaging system; The beam pattern after the first focusing is further focused for a second time by a second optical component in the imaging system, so that the beam pattern becomes a processing beam focused at a processing depth of the processing object, wherein an air distance between the first optical component and the second optical component on the optical axis is substantially a sum of a first focal length of the first optical component and a second focal length of the second optical component; as well as According to the change of the processing depth, the distance between the phase compensation plate of the compensation system and the laser beam source is adjusted along the optical axis. 15 . The laser processing method of claim 14 , further comprising designing the phase compensation plate based on the non-zero angle. 16 . The laser processing method as claimed in claim 14 , wherein adjusting the position of the phase compensation plate is performed by an adjusting component in the compensation system.

17. The laser processing method as described in claim 14 further includes setting a preset position of the phase compensator and the processing object, wherein a first air distance between the phase compensator and the first optical component is substantially equivalent to a first focal length of the first optical component, and a second air distance between the processing object and the second optical component is substantially equivalent to a second focal length of the second optical component. 18 . The laser processing method of claim 14 , further comprising using an offset component to offset the first focused beam pattern relative to the optical axis. 19 . The laser processing method of claim 18 , wherein a third air distance between the offset component and the first optical component is substantially equal to a first focal length of the first optical component.

20. The laser processing method as claimed in claim 14, wherein the laser beam is a laser with a phase difference.

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