Double-station laser mass transfer equipment

Abstract

The invention relates to double-station laser mass transfer equipment which comprises a working platform unit, a feeding and discharging assembly and a laser processing light path assembly. The upper working platform assembly and the laser processing light path assembly are both installed on the lower working platform assembly, the upper working platform assembly is located in the middle of the lower working platform assembly in the front-back direction, the laser processing light path assembly is located above the upper working platform assembly, and the ground on the side portion of the lower working platform assembly is provided with the feeding and discharging assembly. According to the invention, the problem of low efficiency of mass transfer is solved, the processing process is ensured to be continuously carried out, the equipment does not have the conditions of waiting for feeding and taking, the productivity of a chip factory is improved, and the cost is saved.

Description

Technical Field

[0001] The present invention relates to the technical field related to semiconductor processing, and in particular to a double-station laser mass transfer device. Background Art

[0002] Laser Mass Transfer Equipment is a key technical equipment in the manufacturing of micro-nano electronic devices such as Micro LED and Mini LED. In particular, it plays a key role in the process of efficiently transferring a large number of tiny LED chips from the growth substrate to the target substrate. With the continuous development of display technology, Micro LED has become a hot spot for the next generation of display technology due to its advantages such as high brightness, high contrast, low power consumption and long life. However, in the manufacturing process of Micro LED, how to efficiently and accurately transfer millions or even tens of millions of micron-sized LED chips to the driving circuit substrate has become a key bottleneck restricting its mass production. Laser mass transfer technology came into being in this context, realizing the rapid and large-scale transfer of chips through precise control of lasers.

[0003] Laser mass transfer equipment mainly uses the ablation or thermal expansion effect of the laser beam on a specific material layer to separate the chip from the original substrate and transfer it to the target substrate. The specific process includes multiple steps such as laser stripping, chip picking, transfer and positioning. Among them, laser stripping is to irradiate the specific layer (such as the sacrificial layer) between the chip and the original substrate with a laser beam to cause thermal expansion or ablation, thereby separating the chip; chip picking is to use a transfer head or other mechanical device to pick up the separated chip; transfer and positioning is to accurately place the chip at the specified position on the target substrate, and form a good electrical connection and mechanical fixation with the circuit.

[0004] After massive searches, it was found that the existing Chinese patent announcement number is CN217995984U, which discloses a mass transfer device. In order to solve the inconvenience of loading and unloading and the low efficiency of loading and unloading caused by the existing equipment, the first substrate and the second substrate are placed on a moving mechanism during loading. The moving mechanism can drive the first substrate to move under the adsorption mechanism, the adsorption mechanism adsorbs the first substrate, and the moving mechanism moves the second substrate to under the first substrate. The laser can process the first substrate so that the chip on the first substrate is transferred to the second substrate. After the transfer is completed, the first substrate and the second substrate are removed at the same time to facilitate loading and unloading. Although the method of placing the two substrates on the same moving mechanism during loading solves the problem of loading and unloading at different times, there is still the problem that the processing needs to be suspended during the loading and unloading period.

[0005] After massive searches, it was found that the existing Chinese patent announcement number is CN114743914A, which discloses a laser peeling and mass transfer device based on a composite support platform. With the help of the rapid macro-movement of the upper and lower guide rail platforms and the use of the magnetic support adjustment platform on the lower platform, the substrate and the glass plate can be quickly and accurately fine-tuned. Under the joint action of the two, laser peeling and mass transfer are achieved. Although this method can improve the alignment accuracy of the substrate and the glass plate, it is still not enough to improve the transfer speed of the chip and cannot meet the production capacity requirements of the display panel factory. First, coarse positioning and fine alignment are required to achieve precise positioning; second, after the chip transfer is completed, the structure needs to suspend processing, and the platform needs to move from the processing area to the material collection area to complete the material discharge. After the material collection action, it returns to the processing area to start processing again.

[0006] In order to improve production efficiency, the transfer equipment needs to have fast transfer capabilities to meet the needs of large-scale production. However, the existing mass transfers currently have only one station. After each processing is completed, the moving mechanism needs to leave the processing position and go to the substrate pick-up and placement position to pick up and place the material, and then move to the processing position for processing. During the entire material picking process, the laser does not perform processing, which will affect production efficiency. Therefore, the present invention proposes a dual-station laser mass transfer device to solve the above problems.

[0007] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a dual-station laser mass transfer equipment to make it more valuable for industrial use. Summary of the invention

[0008] In order to solve any of the above technical problems, the purpose of the present invention is to provide a dual-station laser mass transfer device.

[0009] To achieve the above object, the present invention adopts the following technical solutions:

[0010] Dual-station laser mass transfer equipment, including a work platform unit, loading and unloading components, and laser processing optical path components;

[0011] The working platform unit includes an upper working platform assembly and a lower working platform assembly from top to bottom, the upper working platform assembly and the laser processing optical path assembly are both installed on the lower working platform assembly, the upper working platform assembly is located in the middle of the lower working platform assembly along the front-back direction, the laser processing optical path assembly is located above the upper working platform assembly, the lower working platform assembly is installed on the base assembly, the base assembly is located on the ground, and loading and unloading assemblies are arranged on the ground at the side of the lower working platform assembly;

[0012] The upper working platform assembly includes a support seat, a second moving mechanism installed on the support seat drives the first moving mechanism to move in the front-rear direction, and the first moving mechanism drives the first adsorption mechanism to move in the left-right direction;

[0013] The first adsorption mechanism includes a bearing plate, on which a plurality of adsorption rings are mounted;

[0014] The lower working platform assembly comprises a supporting platform, and a first bearing platform assembly and a second bearing platform assembly are respectively installed on the front and rear sides of the supporting platform;

[0015] The first bearing platform assembly includes a third moving mechanism, a fourth moving mechanism, a first lifting mechanism, a first rotating mechanism, and a second adsorption mechanism. The third moving mechanism installed on the supporting platform drives the fourth moving mechanism to move in the front-rear direction, the fourth moving mechanism drives the first lifting mechanism to move in the left-right direction, the first lifting mechanism drives the first rotating mechanism to move in the vertical direction, and the first rotating mechanism drives the second adsorption mechanism to rotate;

[0016] The second adsorption mechanism includes a first substrate adsorption area, and a first material loading adsorption area and a first material unloading adsorption area located on the left and right sides of the first substrate adsorption area;

[0017] The second bearing platform assembly includes a fifth moving mechanism, a sixth moving mechanism, a second lifting mechanism, a second rotating mechanism and a third adsorption mechanism. The fifth moving mechanism installed on the supporting platform drives the sixth moving mechanism to move in the front-rear direction, the sixth moving mechanism drives the second lifting mechanism to move in the left-right direction, the second lifting mechanism drives the second rotating mechanism to move in the vertical direction, and the second rotating mechanism drives the third adsorption mechanism to rotate;

[0018] The third adsorption mechanism includes a second substrate adsorption area, and a second material loading adsorption area and a second material unloading adsorption area located on the left and right sides of the second substrate adsorption area.

[0019] As a further improvement of the present invention, adsorption rings in multiples of 3 are installed on the carrying plate.

[0020] As a further improvement of the present invention, a first adsorption ring, a second adsorption ring and a third adsorption ring are sequentially installed on the carrying plate along the front-to-back direction.

[0021] As a further improvement of the present invention, the loading and unloading assembly includes a first loading and unloading assembly located at the front side of the lower working platform assembly, and a second loading and unloading assembly located at the rear side of the lower working platform assembly.

[0022] As a further improvement of the present invention, the first loading and unloading assembly includes a first manipulator, a first wafer box, a first substrate box and a first box carrier frame. The first wafer box and the first substrate box are respectively installed in the first box carrier frame. The first manipulator is installed on the lower working platform assembly. Two groups of suction claws are provided on the first manipulator, which are respectively adapted to the first wafer box and the first substrate box.

[0023] As a further improvement of the present invention, the second loading and unloading assembly includes a second manipulator, a second wafer box, a second substrate box and a second box carrier frame. The second wafer box and the second substrate box are respectively installed in the second box carrier frame. The second manipulator is installed on the lower working platform assembly. Two groups of suction claws are provided on the second manipulator, which are respectively adapted to the second wafer box and the second substrate box.

[0024] As a further improvement of the present invention, the laser processing optical path assembly includes a laser, a processing optical path and an optical support beam. The optical support beam is installed on the lower working platform assembly along the left and right directions. The laser and the processing optical path compatible with the above-mentioned laser are installed on the optical support beam.

[0025] As a further improvement of the present invention, it also includes a precision alignment component, which includes a first precision alignment platform and a second precision alignment platform. The first precision alignment platform is installed on the lower working platform component on one side of the first bearing platform component, and the second precision alignment platform is installed on the lower working platform component on one side of the second bearing platform component.

[0026] As a further improvement of the present invention, the first precision alignment platform includes a first support beam, a first camera and a first lens. The first support beam is installed on the lower working platform assembly along the left-right direction, and the first camera and a first lens compatible with the above-mentioned first camera are installed on the first support beam; the second precision alignment platform includes a second support beam, a second camera and a second lens. The second support beam is installed on the lower working platform assembly along the left-right direction, and the second camera and a second lens compatible with the above-mentioned second camera are installed on the second support beam.

[0027] As a further improvement of the present invention, the base assembly includes a frame, a plurality of feet are installed at the bottom of the frame, a seismic isolation pad is installed on the frame, and the support platform is installed on the seismic isolation pad.

[0028] By means of the above scheme, the present invention has at least the following advantages:

[0029] The present invention solves the problem of low efficiency in mass transfer, ensures that the processing process continues, and the equipment does not have to wait for material discharge or material collection, thereby increasing the production capacity of the chip factory and saving costs.

[0030] The present invention proposes a new layout of a dual-station platform for laser mass transfer equipment in the field, and has a wide range of applicability;

[0031] The present invention provides a method for transferring mixed-size wafers, which is no longer limited to the barrier that only wafers of the same size can be transferred. Wafers can be transferred and processed to the lower substrate in any combination of 4-inch, 6-inch or 8-inch wafers, solving the existing practical problems of chip factories.

[0032] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 It is a structural schematic diagram of a dual-station laser mass transfer device of the present invention;

[0035] Figure 2 yes Figure 1 A schematic structural diagram of the first adsorption mechanism;

[0036] Figure 3 yes Figure 1 Structural diagram of the middle and lower working platform components;

[0037] Figure 4 yes Figure 1 A schematic structural diagram of the first bearing platform assembly;

[0038] Figure 5 yes Figure 1 A schematic diagram of the structure of the second bearing platform assembly;

[0039] Figure 6 yes Figure 1 A schematic diagram of the structure of the first loading and unloading assembly;

[0040] Figure 7 yes Figure 1 A schematic diagram of the structure of the second loading and unloading assembly;

[0041] Figure 8 yes Figure 1 The structural diagram of the first precision alignment platform in China;

[0042] Fig. 9 yes Figure 1 The structural diagram of the second precision alignment platform;

[0043] Fig.10 yes Figure 1 Schematic diagram of the structure of the middle base assembly.

[0044] The meanings of the various reference numerals in the figures are as follows.

[0045] Upper working platform assembly 100, lower working platform assembly 200, loading and unloading assembly 300, laser processing optical path assembly 400, precise alignment assembly 500, base assembly 600;

[0046] A first adsorption mechanism 110, a first moving mechanism 120, a second moving mechanism 130, and a support base 140;

[0047] A carrying plate 111, a first adsorption ring 112, a second adsorption ring 113, and a third adsorption ring 114;

[0048] A first loading platform assembly 210, a second loading platform assembly 220, and a supporting platform 230;

[0049] A third moving mechanism 211, a fourth moving mechanism 212, a first lifting mechanism 213, a first rotating mechanism 214, and a second adsorption mechanism 215;

[0050] A first substrate adsorption area 2151, a first material loading adsorption area 2152, and a first material unloading adsorption area 2153;

[0051] A fifth moving mechanism 221, a sixth moving mechanism 222, a second lifting mechanism 223, a second rotating mechanism 224, and a third adsorption mechanism 225;

[0052] The second substrate adsorption area 2251; the second material loading adsorption area 2252; the second material unloading adsorption area 2253;

[0053] A first loading and unloading assembly 310 and a second loading and unloading assembly 320;

[0054] A first robot 311, a first wafer material box 312, a first substrate material box 313, and a first material box carrying frame 314;

[0055] A second robot 321, a second wafer material box 322, a second substrate material box 323, and a second material box carrying frame 324;

[0056] Laser 410, processing optical path 420, optical support beam 430;

[0057] A first fine alignment platform 510 and a second fine alignment platform 520;

[0058] A first support beam 511, a first camera 512, and a first lens 513;

[0059] A second supporting beam 521, a second camera 522, and a second lens 523;

[0060] Anchors 610 , frame 620 , and seismic isolation pads 630 . DETAILED DESCRIPTION

[0061] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0062] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0063] like Figures 1 to 10 As shown, a dual-station laser mass transfer device includes a working platform unit, a loading and unloading assembly 300 and a laser processing optical path assembly 400;

[0064] The working platform unit includes an upper working platform assembly 100 and a lower working platform assembly 200 from top to bottom. The upper working platform assembly 100 and the laser processing optical path assembly 400 are both installed on the lower working platform assembly 200. The upper working platform assembly 100 is located in the middle of the lower working platform assembly 200 along the front-back direction. The laser processing optical path assembly 400 is located above the upper working platform assembly 100. The lower working platform assembly 200 is installed on a base assembly 600, and the base assembly 600 is located on the ground. A loading and unloading assembly 300 is provided on the ground on the right side of the lower working platform assembly 200.

[0065] The upper working platform assembly 100 includes a support base 140, and the second moving mechanism 130 installed on the support base 140 drives the first moving mechanism 120 to move in the front-rear direction, and the first moving mechanism 120 drives the first adsorption mechanism 110 to move in the left-right direction;

[0066] The first adsorption mechanism 110 includes a carrier plate 111 on which a plurality of adsorption rings are mounted;

[0067] The lower working platform assembly 200 includes a supporting platform 230, and a first bearing platform assembly 210 and a second bearing platform assembly 220 are respectively installed on the front and rear sides of the supporting platform 230;

[0068] The first carrier assembly 210 includes a third moving mechanism 211, a fourth moving mechanism 212, a first lifting mechanism 213, a first rotating mechanism 214, and a second adsorption mechanism 215. The third moving mechanism 211 installed on the supporting platform 230 drives the fourth moving mechanism 212 to move in the front-to-back direction, the fourth moving mechanism 212 drives the first lifting mechanism 213 to move in the left-to-right direction, the first lifting mechanism 213 drives the first rotating mechanism 214 to move in the vertical direction, and the first rotating mechanism 214 drives the second adsorption mechanism 215 to rotate;

[0069] The second adsorption mechanism 215 includes a first substrate adsorption area 2151, and a first material loading adsorption area 2152 and a first material unloading adsorption area 2153 located on the left and right sides of the first substrate adsorption area 2151;

[0070] The second carrying platform assembly 220 includes a fifth moving mechanism 221, a sixth moving mechanism 222, a second lifting mechanism 223, a second rotating mechanism 224 and a third adsorption mechanism 225. The fifth moving mechanism 221 installed on the supporting platform 230 drives the sixth moving mechanism 222 to move in the front-to-back direction, the sixth moving mechanism 222 drives the second lifting mechanism 223 to move in the left-to-right direction, the second lifting mechanism 223 drives the second rotating mechanism 224 to move in the vertical direction, and the second rotating mechanism 224 drives the third adsorption mechanism 225 to rotate;

[0071] The third adsorption mechanism 225 includes a second substrate adsorption area 2251 , and a second loading material adsorption area 2252 and a second unloading material adsorption area 2253 located on the left and right sides of the second substrate adsorption area 2251 .

[0072] Preferably, a number of adsorption rings that is a multiple of 3 is installed on the carrier plate 111 .

[0073] Preferably, a suction ring 112 , a suction ring 2 113 and a suction ring 3 114 are sequentially installed on the carrier plate 111 along the front-to-back direction.

[0074] Preferably, the loading and unloading assembly 300 includes a first loading and unloading assembly 310 located at the front side of the lower working platform assembly 200 , and a second loading and unloading assembly 320 located at the rear side of the lower working platform assembly 200 .

[0075] Preferably, the first loading and unloading assembly 310 includes a first manipulator 311, a first wafer box 312, a first substrate box 313 and a first box carrier frame 314. The first wafer box 312 and the first substrate box 313 are respectively installed in the first box carrier frame 314, and the first manipulator 311 is installed on the lower working platform assembly 200. Two groups of suction claws are arranged on the first manipulator 311, which are respectively adapted to the first wafer box 312 and the first substrate box 313.

[0076] Preferably, the second loading and unloading assembly 320 includes a second manipulator 321, a second wafer box 322, a second substrate box 323 and a second box carrier frame 324. The second wafer box 322 and the second substrate box 323 are respectively installed in the second box carrier frame 324, and the second manipulator 321 is installed on the lower working platform assembly 200. Two groups of suction claws are arranged on the second manipulator 321, which are respectively adapted to the second wafer box 322 and the second substrate box 323.

[0077] Preferably, the laser processing optical path assembly 400 includes a laser 410, a processing optical path 420 and an optical support beam 430. The optical support beam 430 is installed on the lower working platform assembly 200 along the left-right direction. The laser 410 and the processing optical path 420 adapted to the above-mentioned laser 410 are installed on the optical support beam 430.

[0078] Preferably, it also includes a precision alignment component 500, which includes a first precision alignment platform 510 and a second precision alignment platform 520. The first precision alignment platform 510 is installed on the lower working platform component 200 on one side of the first load-bearing platform component 210, and the second precision alignment platform 520 is installed on the lower working platform component 200 on one side of the second load-bearing platform component 220.

[0079] Preferably, the first precision alignment platform 510 includes a first support beam 511, a first camera 512 and a first lens 513, the first support beam 511 is installed on the lower working platform assembly 200 along the left-right direction, and the first camera 512 and the first lens 513 adapted to the above-mentioned first camera 512 are installed on the first support beam 511; the second precision alignment platform 520 includes a second support beam 521, a second camera 522 and a second lens 523, the second support beam 521 is installed on the lower working platform assembly 200 along the left-right direction, and the second camera 522 and the second lens 523 adapted to the above-mentioned second camera 522 are installed on the second support beam 521.

[0080] Preferably, the base assembly 600 includes a frame 620 , a plurality of feet 610 are installed at the bottom of the frame 620 , a seismic isolation pad 630 is installed on the frame 620 , and the support platform 230 is installed on the seismic isolation pad 630 .

[0081] The first embodiment of the present invention:

[0082] The present invention relates to a chip mass transfer technology, and in particular to a dual-station laser mass transfer device, which includes an upper working platform component 100, a lower working platform component 200, a loading and unloading component 300, a laser processing optical path component 400, a precision alignment component 500, and a base component 600.

[0083] The upper working platform assembly is fixed on the lower working platform assembly, and the laser processing optical path assembly is also fixed on the lower working platform assembly. The laser processing optical path assembly is located above the upper platform working assembly in the height direction. The lower platform assembly is installed on the base assembly, and the loading and unloading assemblies are located on both sides of the lower platform assembly. The precision alignment assembly is fixed on the lower working platform assembly. The base assembly is located on the ground.

[0084] The upper workbench assembly 110 includes a first adsorption mechanism 110, a first moving mechanism 120, a second moving mechanism 130, and a support seat 140. The support seat is made of marble or a steel frame, and the support seat is installed on the support platform of the lower platform assembly. The second moving mechanism is installed on the support seat, and the second moving mechanism provides displacement in the front and rear directions. The second moving mechanism can adopt a mechanism of a linear motor and a linear guide slider or a mechanism of a linear motor and an air-floating guide. The first moving mechanism is installed below the second moving mechanism in an inverted posture. The first moving mechanism can also adopt a mechanism of a linear motor and a linear guide slider or a mechanism of a linear motor and an air-floating guide. It provides displacement in the left and right directions, and the moving paths of the first moving mechanism and the second moving mechanism are orthogonal.

[0085] The first adsorption mechanism is installed under the first moving mechanism in an upside-down posture. The first adsorption mechanism 110 includes a carrier plate 111, an adsorption ring 1 112, an adsorption ring 2 113, and an adsorption ring 3 114. The number of adsorption rings is N (where N is a positive integer, preferably an integer multiple of 3). Because the transferred wafers are usually of three types: R, G, and B. The adsorption ring types include but are not limited to 4 inches, 6 inches, 8 inches, 10 inches, and 12 inches. There are multiple adsorption ring installation positions on the carrier plate. The adsorption rings are installed on the carrier plate and can be quickly replaced. At the same time, the adsorption rings are provided with an adjustment mechanism to adjust the coplanarity between the adsorption rings.

[0086] The lower working platform assembly 200 includes a first bearing platform assembly 210, a second bearing platform assembly 220 and a support platform 230. The support platform is made of marble or steel plate. The support platform is installed on the seismic isolation pad of the base assembly. The first bearing platform assembly 210 includes a third moving mechanism 211, a fourth moving mechanism 212, a first lifting mechanism 213, a first rotating mechanism 214 and a second adsorption mechanism 215. The second bearing platform assembly 220 includes a fifth moving mechanism 221, a sixth moving mechanism 222, a second lifting mechanism 223, a second rotating mechanism 224 and a third adsorption mechanism 225.

[0087] The third moving mechanism provides displacement in the front-to-back direction, and can adopt a mechanism of a linear motor and a linear guide slider or a mechanism of a linear motor and an air-floating guide. The fourth moving mechanism provides displacement in the left-right direction, and can adopt a mechanism of a linear motor and a linear guide slider or a mechanism of a linear motor and an air-floating guide. The first lifting mechanism provides displacement in the up-down direction, and can adopt a lifting platform with a wedge block structure or a ball screw structure. The first rotating mechanism provides rotational movement in the horizontal direction. A DD motor can be used. The second adsorption mechanism 215 includes a first substrate adsorption area 2151, a first loading adsorption area 2152, and a first unloading adsorption area 2153. The first substrate adsorption area can be compatible with 4-12 inch substrates. The first loading adsorption area can adsorb 4-8 inch wafers, and the first unloading adsorption area can adsorb 4-8 inch wafers. The third moving mechanism is installed on the supporting platform. And the third moving mechanism is parallel to the second moving mechanism in the motion path. The fourth moving mechanism is installed on the third moving mechanism, and the motion paths are orthogonal. The first lifting mechanism is installed on the fourth moving mechanism, and the first rotating mechanism is installed on the first lifting mechanism. Optionally, the first lifting mechanism and the first rotating mechanism can be combined into a motion mechanism to provide both up-down and horizontal rotation motions. The second adsorption mechanism is installed above the first rotating mechanism. Optionally, the center of the first substrate adsorption area coincides with the center of the first rotating mechanism, and the first loading adsorption area and the first unloading adsorption area are on the side of the first substrate adsorption area.

[0088] The fifth moving mechanism provides displacement in the front-to-back direction, and can adopt a mechanism of a linear motor plus a linear guide slider or a mechanism of a linear motor plus an air-floating guide. The sixth moving mechanism provides displacement in the left-right direction, and can adopt a mechanism of a linear motor plus a linear guide slider or a mechanism of a linear motor plus an air-floating guide. The second lifting mechanism provides displacement in the up-down direction, and can adopt a lifting platform with a wedge block structure or a ball screw structure. The second rotating mechanism provides rotational movement in the horizontal direction. A DD motor can be used. The third adsorption mechanism 225 includes a second substrate adsorption area 2251, a second loading adsorption area 2252, and a second unloading adsorption area 2253. The second substrate adsorption area can be compatible with 4-12 inch substrates. The second loading adsorption area can adsorb 4-8 inch wafers, and the second unloading adsorption area can adsorb 4-8 inch wafers. The fifth moving mechanism is installed on the supporting platform. And the fifth moving mechanism is parallel to the second moving mechanism in the motion path. The sixth moving mechanism is installed on the fifth moving mechanism, and the motion paths are orthogonal. The second lifting mechanism is installed on the sixth moving mechanism, and the second rotating mechanism is installed on the second lifting mechanism. Optionally, the second lifting mechanism and the second rotating mechanism can be combined into a motion mechanism to provide both up-down and horizontal rotation motions. The third adsorption mechanism is installed above the second rotating mechanism. Optionally, the center of the second substrate adsorption area coincides with the center of the second rotating mechanism, and the second loading adsorption area and the second unloading adsorption area are on the side of the second substrate adsorption area.

[0089] The loading and unloading assembly 300 includes a first loading and unloading assembly 310 and a second loading and unloading assembly 320. The first loading and unloading assembly 310 includes a first robot 311, a first wafer material box 312, a first substrate material box 313, and a first material box supporting frame 314. The second loading and unloading assembly includes a second robot 321, a second wafer material box 322, a second substrate material box 323, and a second material box supporting frame 324.

[0090] The manipulators in the first loading and unloading assembly and the second loading and unloading assembly are fixed to the lower platform assembly. The manipulator is equipped with two sets of suction claws. When one set of suction claws takes the wafers or substrates in the material box, the other set of suction claws can simultaneously take the wafers or substrates transported back by the first loading platform assembly and the second loading platform assembly. The box carrying rack in the first loading and unloading assembly and the box carrying rack in the second loading and unloading assembly are respectively fixed to the rack assembly in the base assembly. The wafer material box and the substrate material box are respectively mounted on the material box carrying rack. The wafer material box can be compatible with wafers of various sizes, and the substrate material box can be compatible with substrates of various sizes. The number of wafer material boxes and substrate material boxes in the first loading and unloading assembly and the second loading and unloading assembly is greater than or equal to 1. It is preferred that 6 wafer boxes (2 red wafers, 2 green wafers, 2 blue wafers) are combined with 2 substrate boxes, which are allocated to the box load-bearing frames in the two loading and unloading components according to the process requirements. According to the different wafer sizes of different batches, there will also be a combination of 5 wafer boxes (2 red wafers, 1 green wafer, 2 blue wafers) and 3 substrate boxes in the transfer process. The combination of wafer boxes and substrate boxes can be adjusted at any time according to the actual process requirements.

[0091] The laser processing optical path assembly 400 includes a laser 410, a processing optical path 420, and an optical support beam 430. The processing optical path is mounted on the optical support beam, and the optical support beam is mounted on a support platform in the lower working assembly. The laser can emit laser light, which passes through the processing optical path and irradiates the chip on the wafer, and the chip is separated from the wafer and transferred to the lower substrate.

[0092] The precision alignment assembly 500 includes a first precision alignment platform 510 and a second precision alignment platform 520. The first precision alignment platform includes a first support beam 511, a first camera 512, and a first lens 513. The second precision alignment platform 520 includes a second support beam 521, a second camera 522, and a second lens 523. The first support beam is fixed on the support platform and is located on the same side as the first loading and unloading assembly. The second support beam is fixed on the support platform and is located on the same side as the second loading and unloading assembly.

[0093] The base assembly 600 includes a foot 610, a frame 620, and a vibration isolation pad 630. The foot is supported on the ground or on a steel pressure plate, and the number is a positive integer greater than or equal to 4. The frame is installed on the foot, and the frame is a steel welded structure or a cast structure. The center of gravity of the frame coincides with the point of action of the combined force of the support force provided by the foot. The vibration isolation pad is a damping material, and the vibration isolation pad is installed on the upper surface of the frame.

[0094] The workflow of the present invention is:

[0095] The first carrier assembly moves to the working area of ​​the first loading and unloading assembly robot, and the second carrier assembly also moves to the working area of ​​the second loading and unloading assembly robot. First, the first robot takes out the wafer from the first wafer material box and puts it into the first loading adsorption area on the first carrier assembly. At the same time, the second robot takes out the wafer from the second wafer material box and puts it into the second loading adsorption area on the second carrier assembly. The first carrier assembly moves to the working area of ​​the first fine alignment platform for fine alignment. At the same time, the second carrier assembly moves to the working area of ​​the second fine alignment platform for fine alignment. Then the first carrier assembly moves to the bottom of the adsorption ring 1 of the upper working platform assembly, so that the center of the wafer coincides with the center of the adsorption ring 1, and the first lifting mechanism rises, so that the wafer contacts and is adsorbed by the adsorption ring 1. The first lifting mechanism descends, and the first carrier assembly moves back to the working area of ​​the first loading and unloading assembly robot. At the same time, the second carrier assembly moves to the bottom of the adsorption ring 3 of the upper working platform assembly, so that the center of the wafer coincides with the center of the adsorption ring 3, and the second lifting mechanism rises, so that the wafer contacts and is adsorbed by the adsorption ring 3. The second lifting mechanism descends, and the second bearing platform assembly moves back into the working area of ​​the second loading and unloading assembly manipulator.

[0096] When the first carrier assembly returns to the working area of ​​the first loading and unloading assembly manipulator, the first manipulator places the wafers of the first wafer material box into the first loading adsorption area and the substrates of the first substrate material box into the first substrate adsorption area in turn. Repeat the above actions, and the first carrier assembly transports the wafer to the second adsorption ring. At this time, the loading of the three adsorption rings is completed. At this time, the upper working platform assembly and the first carrier assembly move synchronously to the working area of ​​the laser processing optical path assembly for transfer processing. When the substrate on the first carrier assembly is full of transferred chips, the first carrier assembly returns to the working area of ​​the first loading and unloading assembly manipulator, and the manipulator takes the substrate and puts a new substrate. At the same time, the second carrier assembly carries the substrate and moves synchronously with the upper working platform assembly to continue the transfer processing. Repeat the above steps until the chips on the wafer on the upper working platform assembly are transferred. The corresponding lower working platform assembly's carrier assembly unloading adsorption area takes the wafer, and the carrier assembly returns to the manipulator working area to take the transferred wafer and put a new wafer. Continue a new round of transfer processing.

[0097] The present invention solves the problem of low efficiency in mass transfer, ensures that the processing process continues, and the equipment does not have to wait for material discharge or material collection, thereby increasing the production capacity of the chip factory and saving costs.

[0098] A new dual-station platform layout for laser mass transfer equipment is proposed in this field, and its applicability is wide;

[0099] A method for transferring mixed-size wafers is provided, which is no longer limited to the barrier that only wafers of the same size can be transferred. Wafers can be transferred and processed to the lower substrate in any combination of 4-inch, 6-inch or 8-inch wafers, solving the existing practical problems of chip factories.

[0100] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0101] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0102] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A dual-station laser mass transfer device, comprising a working platform unit, a loading and unloading assembly (300) and a laser processing optical path assembly (400); characterized in that: The working platform unit comprises, from top to bottom, an upper working platform component (100) and a lower working platform component (200), the upper working platform component (100) and the laser processing optical path component (400) are both mounted on the lower working platform component (200), the upper working platform component (100) is located in the middle of the lower working platform component (200) along the front-back direction, the laser processing optical path component (400) is located above the upper working platform component (100), the lower working platform component (200) is mounted on a base component (600), the base component (600) is located on the ground, and a loading and unloading component (300) is arranged on the ground at the side of the lower working platform component (200); The upper working platform assembly (100) comprises a support seat (140), a second moving mechanism (130) installed on the support seat (140) drives the first moving mechanism (120) to move in the front-rear direction, and the first moving mechanism (120) drives the first adsorption mechanism (110) to move in the left-right direction; The first adsorption mechanism (110) comprises a carrying plate (111), and a plurality of adsorption rings are mounted on the carrying plate (111); The lower working platform assembly (200) comprises a supporting platform (230), and a first bearing platform assembly (210) and a second bearing platform assembly (220) are respectively installed on the front and rear sides of the supporting platform (230); The first carrier platform assembly (210) comprises a third moving mechanism (211), a fourth moving mechanism (212), a first lifting mechanism (213), a first rotating mechanism (214) and a second adsorption mechanism (215); the third moving mechanism (211) installed on the supporting platform (230) drives the fourth moving mechanism (212) to move in the front-rear direction; the fourth moving mechanism (212) drives the first lifting mechanism (213) to move in the left-right direction; the first lifting mechanism (213) drives the first rotating mechanism (214) to move in the vertical direction; and the first rotating mechanism (214) drives the second adsorption mechanism (215) to rotate; The second adsorption mechanism (215) comprises a first substrate adsorption area (2151), and a first loading adsorption area (2152) and a first unloading adsorption area (2153) located on the left and right sides of the first substrate adsorption area (2151); The second carrying platform assembly (220) comprises a fifth moving mechanism (221), a sixth moving mechanism (222), a second lifting mechanism (223), a second rotating mechanism (224) and a third adsorption mechanism (225); the fifth moving mechanism (221) installed on the supporting platform (230) drives the sixth moving mechanism (222) to move in the front-rear direction; the sixth moving mechanism (222) drives the second lifting mechanism (223) to move in the left-right direction; the second lifting mechanism (223) drives the second rotating mechanism (224) to move in the vertical direction; and the second rotating mechanism (224) drives the third adsorption mechanism (225) to rotate; The third adsorption mechanism (225) comprises a second substrate adsorption area (2251), and a second loading adsorption area (2252) and a second unloading adsorption area (2253) located on the left and right sides of the second substrate adsorption area (2251).

2. The dual-station laser mass transfer device according to claim 1, characterized in that: Adsorption rings in multiples of 3 are installed on the carrying plate (111).

3. The dual-station laser mass transfer device according to claim 2, characterized in that: A first adsorption ring (112), a second adsorption ring (113) and a third adsorption ring (114) are sequentially mounted on the carrier plate (111) along the front-to-back direction.

4. The dual-station laser mass transfer device according to claim 1, characterized in that: The loading and unloading assembly (300) comprises a first loading and unloading assembly (310) located at the front side of the lower working platform assembly (200), and a second loading and unloading assembly (320) located at the rear side of the lower working platform assembly (200).

5. The dual-station laser mass transfer device according to claim 4, characterized in that: The first loading and unloading assembly (310) includes a first manipulator (311), a first wafer box (312), a first substrate box (313) and a first box carrier frame (314); the first wafer box (312) and the first substrate box (313) are respectively installed in the first box carrier frame (314); the first manipulator (311) is installed on the lower working platform assembly (200); and two groups of suction claws respectively adapted to the first wafer box (312) and the first substrate box (313) are arranged on the first manipulator (311).

6. The dual-station laser mass transfer device according to claim 4, characterized in that: The second loading and unloading assembly (320) includes a second manipulator (321), a second wafer box (322), a second substrate box (323) and a second box carrier frame (324). The second wafer box (322) and the second substrate box (323) are respectively installed in the second box carrier frame (324). The second manipulator (321) is installed on the lower working platform assembly (200). Two groups of suction claws respectively adapted to the second wafer box (322) and the second substrate box (323) are arranged on the second manipulator (321).

7. The dual-station laser mass transfer device according to claim 1, characterized in that: The laser processing optical path component (400) comprises a laser (410), a processing optical path (420) and an optical support beam (430); the optical support beam (430) is installed on the lower working platform component (200) along the left-right direction; the laser (410) and the processing optical path (420) adapted to the above-mentioned laser (410) are installed on the optical support beam (430).

8. The dual-station laser mass transfer device according to claim 1, characterized in that: It also includes a precision alignment component (500), which includes a first precision alignment platform (510) and a second precision alignment platform (520), wherein the first precision alignment platform (510) is installed on the lower working platform component (200) on one side of the first bearing platform component (210), and the second precision alignment platform (520) is installed on the lower working platform component (200) on one side of the second bearing platform component (220).

9. The dual-station laser mass transfer device according to claim 8, characterized in that: The first precision alignment platform (510) comprises a first support beam (511), a first camera (512) and a first lens (513); the first support beam (511) is installed on the lower working platform assembly (200) along the left-right direction; the first camera (512) and the first lens (513) matched with the first camera (512) are installed on the first support beam (511); the second precision alignment platform (520) comprises a second support beam (521), a second camera (522) and a second lens (523); the second support beam (521) is installed on the lower working platform assembly (200) along the left-right direction; the second camera (522) and the second lens (523) matched with the second camera (522) are installed on the second support beam (521).

10. The dual-station laser mass transfer device according to claim 1, characterized in that: The base assembly (600) comprises a frame (620), a plurality of feet (610) are installed at the bottom of the frame (620), a shock-isolating pad (630) is installed on the frame (620), and the supporting platform (230) is installed on the shock-isolating pad (630).

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