Transparent super-hydrophobic membrane and preparation method thereof

Abstract

The invention discloses a transparent super-hydrophobic membrane and a preparation method thereof, particularly relates to the technical field of material science, and relates to a transparent super-hydrophobic membrane and a preparation method thereof. The transparent super-hydrophobic membrane is prepared from a micro-nano structure substrate and a super-hydrophobic coating solution. The preparation method specifically comprises the following steps: immersing a micro-nano structure into a super-hydrophobic coating solution to obtain a mixed layer, then lifting the mixed layer, and then carrying out curing treatment on the mixed layer by adopting a UV curing device to prepare the transparent super-hydrophobic membrane, the transparent super-hydrophobic film is prepared by combining a wet etching method with low-surface-energy resin curing, so that the high consistency of a micro-nano structure is ensured, diffuse reflection is effectively reduced, and the transmittance is improved; the transparent super-hydrophobic film is prepared by using a UV curing method, the hydrophobic coating and the substrate are firmly combined and are not easy to fall off, and the hardness is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of materials science, and more specifically, to a transparent super-hydrophobic film and a preparation method thereof. Background Art

[0002] With the development of science and technology, super-hydrophobic surfaces have broad application prospects in the fields of self-cleaning, anti-fog, and waterproofing; therefore, it is of great significance to develop a transparent super-hydrophobic film with simple preparation process, low cost and good durability.

[0003] The superhydrophobic film in the related technology mainly includes a polymer matrix, a plasticizer, a solvent and a cross-linker; the polymer matrix provides the basic structure and properties of the film, such as heat resistance and corrosion resistance; the plasticizer is used to enhance the flexibility and toughness of the polymer and improve the processing performance and mechanical properties of the film; the solvent mixes the polymer and plasticizer and other ingredients evenly to form a solution that can be coated or cast; the cross-linker connects the polymer molecular chains by chemical or physical means to improve the strength and stability of the film.

[0004] However, it still has some disadvantages in actual use, such as low transparency. The super-hydrophobic film in the related art is prepared by spraying, and its micro-nano structure is disordered, which will produce diffuse reflection; low adhesion. The super-hydrophobic film in the related art is prepared by spraying, which leads to serious powder loss and worrying adhesion; poor hydrophobicity. The super-hydrophobic film in the related art is prepared by spraying, and its microscopic roughness structure is disordered, resulting in the contact angle of water droplets on the surface not being large enough, and the rolling angle not being small enough, which cannot meet the requirements of super-hydrophobicity. Summary of the invention

[0005] In order to improve the above problems and reduce the problems of low transparency, low adhesion and poor hydrophobicity of the super-hydrophobic film, the present invention provides a transparent super-hydrophobic film and a preparation method thereof to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A transparent super-hydrophobic film is prepared from a micro-nano structure substrate and a super-hydrophobic coating liquid;

[0008] The micro-nano structure is immersed in a super-hydrophobic coating liquid, then pulled up, and then the coated substrate is cured by a UV curing device;

[0009] The micro-nano structure substrate is obtained by cleaning, coating, soft baking, exposure, development, hardening, demoulding and etching a glass sheet with a thickness of 0.5 cm;

[0010] The super-hydrophobic coating liquid is composed of the following components and their weight ratios: 0-20 parts of fluorosilicone resin, 0-18 parts of fluorocarbon resin, 0-10 parts of silicone resin, 0-80 parts of ethyl acetate, 0-82 parts of acetone, 0-88 parts of toluene and 0.1-1 parts of photoinitiator.

[0011] Preferably, the method for preparing the transparent super-hydrophobic film comprises the following steps:

[0012] A1, first the micro-nano structure substrate is immersed in the super-hydrophobic coating liquid at a depth of 2 / 3 of the substrate height at a perpendicular angle to the super-hydrophobic coating liquid, under the condition of an immersion speed of 1cm / s, and then pulled at a pulling speed of 5-10cm / min until the micro-nano structure substrate surface is evenly coated with the super-hydrophobic coating liquid, and then the micro-nano structure substrate is kept stationary for 30s in the vertical direction, and then, a nitrogen spray gun is used to purge once at a distance of 10cm from the substrate surface under a pressure of 0.1MPa to obtain the substrate after coating;

[0013] A2: Place the coated substrate obtained in A1 in a UV curing device at a light intensity of 50-150 mW / cm 2 , solidified for 3-10 min at a rotation speed of 5 r / min, and then cooled for 2 min to obtain a transparent super-hydrophobic film.

[0014] Preferably, the method for preparing the micro-nanostructure substrate comprises the following steps:

[0015] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a positive photoresist with a thickness of 2 μm at a rotation speed of 2000-3000 r / min for 30-45 seconds, and then soft-bake it in an oven at 80-100° C. for 3-4 minutes to obtain a soft-baked substrate;

[0016] C2, the photoresist on the substrate after soft baking obtained in C1 is exposed to light at an energy of 15-25mJ / cm 2 The substrate is exposed for 8-12 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to expose the substrate surface, and then placed in an oven for hardening at an oven temperature of 120-130° C. for 10-15 minutes to obtain a hardened substrate;

[0017] C3. Treat the substrate with the hard film obtained in C2 in an oxygen plasma environment for 5-10 minutes, then rinse it with ethanol, and then etch it with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40-50° C. for 2-4 minutes to obtain a micro-nano structure substrate.

[0018] Preferably, the method for preparing the super-hydrophobic coating liquid comprises the following steps:

[0019] B1. Dissolve the mixed resin in an organic solvent and place it in a magnetic stirrer at room temperature and stir at a stirring speed of 300 r / min for 30 min, then add a photoinitiator and continue stirring for 15 min under the same conditions to obtain a super-hydrophobic coating liquid.

[0020] Preferably, the hydrofluoric acid-nitric acid mixed etching solution is composed of hydrofluoric acid concentration, nitric acid, and water in a volume ratio of (5-8):(12-15):(70-83).

[0021] Preferably, the mixed resin is any one of fluorosilicone resin, fluorocarbon resin and silicone resin, or a mixture of several of them.

[0022] Preferably, the organic solvent is any one or more of ethyl acetate, acetone and toluene.

[0023] Technical effects and advantages of the present invention:

[0024] 1. The present invention prepares a transparent super-hydrophobic film by wet etching combined with low surface energy resin curing, which ensures the high consistency of the micro-nano structure, effectively reduces diffuse reflection, and improves transmittance;

[0025] 2. The present invention uses a UV curing method to prepare a transparent super-hydrophobic film, the hydrophobic coating is firmly bonded to the substrate, is not easy to fall off, and has improved hardness;

[0026] 3. The present invention combines a wet etching method with low surface energy resin curing to make its micro-nano structure highly consistent, so that its water contact angle is greater than 150° and its rolling angle is less than 10°, and it has excellent self-cleaning performance. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with the embodiments of the present invention. The raw materials used in the examples and embodiments of the present invention are all commercially available common materials unless otherwise specified below.

[0028] Preparation Example 1

[0029] A micro-nano structure substrate is prepared by the following preparation method:

[0030] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a thickness of 2 μm positive photoresist at a speed of 2000 r / min for 45 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0031] The positive photoresist is composed of phenolic resin, naphthoquinone diazide, propylene glycol methyl ether acetate and plasticizer in a weight ratio of 4:2:4:0.1;

[0032] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2 The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to reveal the substrate surface, and then placed in an oven for hardening at an oven temperature of 120°C for 10 minutes to obtain a hardened substrate;

[0033] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0034] The hydrofluoric acid-nitric acid mixed etching solution is composed of hydrofluoric acid, nitric acid and water in a volume ratio of 5:12:83;

[0035] Preparation Example 2

[0036] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0037] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a positive photoresist with a thickness of 2 μm at a speed of 2500 r / min for 40 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0038] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2 The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area and expose the substrate surface, and then placed in an oven at a temperature of 120°C for 10 minutes to harden the film, thereby obtaining a hardened substrate;

[0039] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0040] Preparation Example 3

[0041] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0042] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a positive photoresist with a thickness of 2 μm at a speed of 3000 r / min for 35 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0043] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2 The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to reveal the substrate surface, and then placed in an oven for hardening at an oven temperature of 120°C for 10 minutes to obtain a hardened substrate;

[0044] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0045] Preparation Example 4

[0046] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0047] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a positive photoresist with a thickness of 2 μm at a speed of 3000 r / min for 30 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0048] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to reveal the substrate surface, and then placed in an oven for hardening at an oven temperature of 120°C for 10 minutes to obtain a hardened substrate;

[0049] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0050] Preparation Example 5

[0051] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0052] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for standby use, then spin-coat the substrate material with a positive photoresist with a thickness of 2 μm at a speed of 2000 r / min for 45 seconds, and then soft-bake it in a 90° C. oven for 3.5 minutes to obtain a soft-baked substrate;

[0053] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2 The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to reveal the substrate surface, and then placed in an oven for hardening at an oven temperature of 120°C for 10 minutes to obtain a hardened substrate;

[0054] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0055] Preparation Example 6

[0056] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0057] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for standby use, then spin-coat the substrate material with a positive photoresist with a thickness of 2 μm at a speed of 2000 r / min for 45 seconds, and then soft-bake it in an oven at 80° C. for 3 minutes to obtain a soft-baked substrate;

[0058] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2 The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to reveal the substrate surface, and then placed in an oven for hardening at an oven temperature of 120°C for 10 minutes to obtain a hardened substrate;

[0059] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0060] Preparation Example 7

[0061] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0062] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a thickness of 2 μm positive photoresist at a speed of 2000 r / min for 45 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0063] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 20mJ / cm 2 The substrate was exposed for 10 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to reveal the substrate surface, and then placed in an oven for hardening at an oven temperature of 120°C for 10 minutes to obtain a hardened substrate;

[0064] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0065] Preparation Example 8

[0066] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0067] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a thickness of 2 μm positive photoresist at a speed of 2000 r / min for 45 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0068] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 25mJ / cm 2 The substrate was exposed for 12 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to reveal the substrate surface, and then placed in an oven for hardening at an oven temperature of 120°C for 10 minutes to obtain a hardened substrate;

[0069] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0070] Preparation Example 9

[0071] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0072] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a thickness of 2 μm positive photoresist at a speed of 2000 r / min for 45 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0073] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2 The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to reveal the substrate surface, and then placed in an oven for hardening at an oven temperature of 125°C for 15 minutes to obtain a hardened substrate;

[0074] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0075] Preparation Example 10

[0076] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0077] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a thickness of 2 μm positive photoresist at a speed of 2000 r / min for 45 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0078] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2 The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to reveal the substrate surface, and then placed in an oven for hardening at an oven temperature of 130°C for 15 minutes to obtain a hardened substrate;

[0079] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0080] Preparation Example 11

[0081] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0082] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a thickness of 2 μm positive photoresist at a speed of 2000 r / min for 45 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0083] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to expose the substrate surface, and then placed in an oven for hardening at an oven temperature of 120°C for 15 minutes to obtain a hardened substrate;

[0084] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 7.5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0085] Preparation Example 12

[0086] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0087] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a thickness of 2 μm positive photoresist at a speed of 2000 r / min for 45 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0088] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2 The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to expose the substrate surface, and then placed in an oven for hardening at an oven temperature of 120°C for 15 minutes to obtain a hardened substrate;

[0089] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 10 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40° C. for 2 minutes to obtain a micro-nano structure substrate.

[0090] Preparation Example 13

[0091] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0092] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a thickness of 2 μm positive photoresist at a speed of 2000 r / min for 45 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0093] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2 The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to expose the substrate surface, and then placed in an oven for hardening at an oven temperature of 120°C for 15 minutes to obtain a hardened substrate;

[0094] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 45° C. for 3 minutes to obtain a micro-nano structure substrate.

[0095] Preparation Example 14

[0096] A micro-nano structure substrate, which is different from Preparation Example 1 in that the specific preparation steps are as follows:

[0097] C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a thickness of 2 μm positive photoresist at a speed of 2000 r / min for 45 seconds, and then soft-bake it in an oven at 100° C. for 4 minutes to obtain a soft-baked substrate;

[0098] C2, the photoresist on the substrate after soft baking obtained in C1 was exposed to light at an exposure energy of 15mJ / cm 2 The substrate was exposed for 8 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to expose the substrate surface, and then placed in an oven for hardening at an oven temperature of 120°C for 15 minutes to obtain a hardened substrate;

[0099] C3. Treat the hardened substrate obtained in C2 in an oxygen plasma environment for 5 minutes, then rinse with ethanol, and then etch with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 50° C. for 4 minutes to obtain a micro-nano structure substrate.

[0100] Preparation Example 15

[0101] A micro-nano structure substrate, which is different from Preparation Example 1 in that the hydrofluoric acid-nitric acid mixed etching solution is composed of hydrofluoric acid, nitric acid, and water in a volume ratio of 6.5:13.5:70;

[0102] Preparation Example 16

[0103] A micro-nano structure substrate, which is different from Preparation Example 1 in that the hydrofluoric acid-nitric acid mixed etching solution is composed of hydrofluoric acid, nitric acid, and water in a volume ratio of 8:15:77;

[0104] Preparation Examples 17-21

[0105] A super hydrophobic coating liquid, the preparation components and their corresponding proportions are shown in the following table, and is prepared by the following preparation method:

[0106] B1. Dissolve the mixed resin in an organic solvent and place it in a magnetic stirrer at room temperature and stir at a stirring speed of 300 r / min for 30 min, then add a photoinitiator and continue stirring for 15 min under the same conditions to obtain a super-hydrophobic coating liquid.

[0107] The mixed resin is any one of fluorosilicone resin, fluorocarbon resin and silicone resin or a mixture of several of them;

[0108] The organic solvent is any one or more of ethyl acetate, acetone and toluene;

[0109] The photoinitiator is 2-hydroxy-2-methyl-1-phenyl-1-propanone;

[0110] Table: Components and weight ratios of raw materials in Preparation Examples 17-21 (g)

[0111]

[0112]

[0113] Preparation Example 22

[0114] A transparent super-hydrophobic film, the preparation components and their corresponding proportions are shown in the following table, and is prepared by the following preparation method:

[0115] A1, first the micro-nano structure substrate is immersed in the super-hydrophobic coating liquid at a depth of 2 / 3 of the substrate height at a perpendicular angle to the super-hydrophobic coating liquid, under an immersion speed of 1cm / s, and then pulled at a pulling speed of 5cm / min until the micro-nano structure substrate surface is evenly coated with the super-hydrophobic coating liquid, and then the micro-nano structure substrate is kept stationary for 30s in the vertical direction, and then, a nitrogen spray gun is used to purge once at a distance of 10cm from the substrate surface under a pressure of 0.1MPa to obtain the substrate after coating;

[0116] The micro-nano structure substrate is prepared by Preparation Example 1;

[0117] The super hydrophobic coating liquid is prepared by Preparation Example 17;

[0118] A2: Place the coated substrate obtained in A1 in a UV curing device at a light intensity of 50 mW / cm 2 , and cured for 10 min under a rotation speed of 5 r / min, and then cooled for 2 min to obtain a transparent superhydrophobic film.

[0119] Preparation Example 23

[0120] A transparent super-hydrophobic film, which is different from Preparation Example 22 in that the preparation method is as follows:

[0121] A1, first the micro-nano structure substrate is immersed in the super-hydrophobic coating liquid at a depth of 2 / 3 of the substrate height at a perpendicular angle to the super-hydrophobic coating liquid, under the condition of an immersion speed of 1cm / s, and then pulled at a pulling speed of 7cm / min until the micro-nano structure substrate surface is evenly coated with the super-hydrophobic coating liquid, and then the micro-nano structure substrate is kept stationary for 30s in the vertical direction, and then, a nitrogen spray gun is used to purge once at a distance of 10cm from the substrate surface under a pressure of 0.1MPa to obtain the substrate after coating;

[0122] A2: Place the coated substrate obtained in A1 in a UV curing device at a light intensity of 50 mW / cm 2 , and cured for 10 min under a rotation speed of 5 r / min, and then cooled for 2 min to obtain a transparent superhydrophobic film.

[0123] Preparation Example 24

[0124] A transparent super-hydrophobic film, which is different from Preparation Example 22 in that the preparation method is as follows:

[0125] A1, first the micro-nano structure substrate is immersed in the super-hydrophobic coating liquid at a depth of 2 / 3 of the substrate height at a perpendicular angle to the super-hydrophobic coating liquid, under an immersion speed of 1cm / s, and then pulled at a pulling speed of 10cm / min until the micro-nano structure substrate surface is evenly coated with the super-hydrophobic coating liquid, and then the micro-nano structure substrate is kept stationary for 30s in the vertical direction, and then, a nitrogen spray gun is used to purge once at a distance of 10cm from the substrate surface under a pressure of 0.1MPa to obtain the substrate after coating;

[0126] A2: Place the coated substrate obtained in A1 in a UV curing device at a light intensity of 50 mW / cm 2 , and cured for 10 min under a rotation speed of 5 r / min, and then cooled for 2 min to obtain a transparent superhydrophobic film.

[0127] Preparation Example 25

[0128] A transparent super-hydrophobic film, which is different from Preparation Example 22 in that the preparation method is as follows:

[0129] A1, first the micro-nano structure substrate is immersed in the super-hydrophobic coating liquid at a depth of 2 / 3 of the substrate height at a perpendicular angle to the super-hydrophobic coating liquid, under an immersion speed of 1cm / s, and then pulled at a pulling speed of 5cm / min until the micro-nano structure substrate surface is evenly coated with the super-hydrophobic coating liquid, and then the micro-nano structure substrate is kept stationary for 30s in the vertical direction, and then, a nitrogen spray gun is used to purge once at a distance of 10cm from the substrate surface under a pressure of 0.1MPa to obtain the substrate after coating;

[0130] A2: Place the coated substrate obtained in A1 in a UV curing device at a light intensity of 100 mW / cm 2 , cured for 6 min at a rotation speed of 5 r / min, and then cooled for 2 min to obtain a transparent superhydrophobic film.

[0131] Preparation Example 26

[0132] A transparent super-hydrophobic film, which is different from Preparation Example 22 in that the preparation method is as follows:

[0133] A1, first the micro-nano structure substrate is immersed in the super-hydrophobic coating liquid at a depth of 2 / 3 of the substrate height at a perpendicular angle to the super-hydrophobic coating liquid, under an immersion speed of 1cm / s, and then pulled at a pulling speed of 5cm / min until the micro-nano structure substrate surface is evenly coated with the super-hydrophobic coating liquid, and then the micro-nano structure substrate is kept stationary for 30s in the vertical direction, and then, a nitrogen spray gun is used to purge once at a distance of 10cm from the substrate surface under a pressure of 0.1MPa to obtain the substrate after coating;

[0134] A2: Place the coated substrate obtained in A1 in a UV curing device at a light intensity of 150 mW / cm 2 , solidified for 3 min at a rotation speed of 5 r / min, and then cooled for 2 min to obtain a transparent superhydrophobic film.

[0135] Preparation Example 27-41

[0136] A transparent super-hydrophobic film, which is different from Preparation Example 22 in that the usage of the micro-nanostructure substrate used in its components is different, and the specific corresponding relationship is shown in the following table.

[0137] Table: Comparison of the use of micro-nanostructure substrates in preparation examples 27-41

[0138] Group Micro-nanostructure substrate Preparation Example 27 Prepared from Preparation Example 2 Preparation Example 28 Prepared from Preparation Example 3 Preparation Example 29 Prepared by Preparation Example 4 Preparation Example 30 Prepared from Preparation Example 5 Preparation Example 31 Prepared from Preparation Example 6 Preparation Example 32 Prepared from Preparation Example 7 Preparation Example 33 Prepared from Preparation Example 8 Preparation Example 34 Prepared from Preparation Example 9 Preparation Example 35 Prepared from Preparation Example 10 Preparation Example 36 Prepared from Preparation Example 11 Preparation Example 37 Prepared from Preparation Example 12 Preparation Example 38 Prepared from Preparation Example 13 Preparation Example 39 Prepared from Preparation Example 14 Preparation Example 40 Prepared from Preparation Example 15 Preparation Example 41 Prepared from Preparation Example 16

[0139] Preparation Examples 42-45

[0140] A transparent super-hydrophobic film, which is different from Preparation Example 22 in that the usage of the super-hydrophobic coating liquid used in its components is different, and the specific corresponding relationship is shown in the following table.

[0141] Table: Comparison of the use of super-hydrophobic coating liquid in Preparation Examples 42-45

[0142]

[0143]

[0144] Performance testing

[0145] The transparent super-hydrophobic films prepared in each embodiment were selected for testing, and the test objects were 240 transparent super-hydrophobic films, 10 in each group; the transparency, adhesion, hardness and hydrophobicity thereof were tested, and the specific testing steps were as follows:

[0146] transparency:

[0147] First, the transparent super-hydrophobic film prepared in the embodiment is sampled, and the transmittance of the transparent super-hydrophobic film at a light wavelength of 450nm is measured using an ultraviolet-visible spectrophotometer, and the transparency of the transparent super-hydrophobic film is characterized based on this data; the test results and evaluation criteria are as follows:

[0148] 90%<light transmittance (considered as high transparency);

[0149] Light transmittance < 90% (considered as low transparency).

[0150] Adhesion:

[0151] First, the transparent super-hydrophobic film prepared in the embodiment is sampled, and the adhesion level of the transparent super-hydrophobic film is measured by the Hundred Grid Test Method, and the adhesion of the transparent super-hydrophobic film is characterized based on this data; the test results and evaluation criteria are as follows:

[0152] Adhesion grade: 5B (considered as high adhesion);

[0153] Adhesion grade: 4B 3B (considered as general adhesion);

[0154] Adhesion grade: 2B 1B (considered as poor adhesion).

[0155] Hydrophobicity;

[0156] First, the transparent super-hydrophobic film prepared in the embodiment is sampled, and the water contact angle of the transparent super-hydrophobic film is measured using a contact angle meter, and then the transparent super-hydrophobic film is placed on a sample stage, a 10 μL deionized water droplet is placed on the film surface, and the sample stage is tilted to measure the tilt angle when the droplet starts to roll, that is, the rolling angle, and the adhesion of the transparent super-hydrophobic film is characterized according to this data; the test results and evaluation criteria are as follows:

[0157] 150°<water contact angle (considered as good hydrophobicity);

[0158] The water contact angle is less than 150° (considered as poor hydrophobicity).

[0159] Water rolling angle <10° (considered as good hydrophobicity);

[0160] 10°<water sliding angle (considered as poor hydrophobicity).

[0161] hardness:

[0162] First, the transparent super-hydrophobic film prepared in the embodiment is sampled, and the hardness of the transparent super-hydrophobic film is measured by a pencil hardness test method, and the hardness of the transparent super-hydrophobic film is characterized according to the data; the test results and evaluation criteria are as follows:

[0163] 1H<hardness grade (considered as high hardness);

[0164] Hardness grade <1H (considered as low hardness).

[0165] It should be specifically noted that the above test steps are carried out in accordance with national standards;

[0166] It should be specifically noted that the transparent super-hydrophobic film prepared above is a transparent super-hydrophobic film produced in a normal production method, and the data of the defective transparent super-hydrophobic film produced are discarded.

[0167] Examples 1-5

[0168] A transparent super-hydrophobic film, and the corresponding relationship of the preparation method used are shown in the following table.

[0169] Table: Comparison table of transparent super hydrophobic film usage in Examples 1-5

[0170]

[0171]

[0172] The transparent super-hydrophobic films in the above-mentioned Examples 1-5 were taken, and their transparency, adhesion grade, hardness, water contact angle and water contact angle were tested according to the above-mentioned measurement steps and measurement standards. The average values ​​of the test results were recorded in the following table.

[0173] Table: Transparency, adhesion level, hardness, water contact angle and performance test results of water contact angle of Examples 1-5

[0174]

[0175] As can be seen from the above table, in the preparation process of the transparent super-hydrophobic film in Examples 1-5, the production effect of the transparent super-hydrophobic film is well improved. By coating, developing, exposing, etching and demoulding, a highly consistent micro-nano structure is etched, diffuse reflection is reduced to improve light transmittance, and UV curing is performed by using a mixed resin as a raw material for the super-hydrophobic coating liquid to improve adhesion, hardness and hydrophobicity, thereby achieving the purpose of improving the production effect of the transparent super-hydrophobic film;

[0176] The transparency is 93.7-95.6%, which is considered to be high transparency; the adhesion grade is 5B, which is considered to be high adhesion; the hardness is 1H-2H, which is considered to be high hardness; the water contact angle is 163.2-166.1°, and the water rolling angle is 4.8-6.3°, which is considered to be good hydrophobicity;

[0177] It can be seen that when the production raw materials are constant, the production effect of the transparent super-hydrophobic film can be increased by adjusting the preparation process conditions. Combining the data in the above table, it is not difficult to see that when preparing the transparent super-hydrophobic film, the pulling speed is 7cm / min and the UV light intensity is 100mW / cm 2 When curing for 6 minutes, the production effect of the transparent super-hydrophobic film is the best. The reason is that if the pulling speed is too fast, the coating liquid will not have time to be evenly distributed on the substrate surface, resulting in uneven coating thickness; although a too slow pulling speed is conducive to the uniform distribution of the coating liquid, it will affect the production efficiency. The appropriate pulling speed can allow the coating liquid to better fill the micro-nano structure; too high light intensity may cause the coating surface to cure quickly, and the internal resin will not have time to react, resulting in incomplete curing, and may also cause surface defects such as wrinkling and cracking; if the light intensity is too low, a longer curing time is required to completely cure the resin, as shown in Examples 1-5.

[0178] Embodiment 6-20

[0179] A transparent super-hydrophobic film, and the corresponding relationship of the preparation method used are shown in the following table.

[0180] Table: Comparison table of transparent super-hydrophobic film usage in Examples 6-20

[0181]

[0182]

[0183] The transparent super-hydrophobic films in the above-mentioned Examples 6-20 were selected, and their transparency, adhesion grade, hardness, water contact angle and water contact angle were tested according to the above-mentioned measurement steps and measurement standards. The average values ​​of the test results were recorded in the following table.

[0184] Table: Transparency, adhesion level, hardness, water contact angle and performance test results of water contact angle of Examples 1, 6-20

[0185]

[0186]

[0187] As can be seen from the above table, in the transparent super-hydrophobic film preparation process in Examples 1-5, the transparent super-hydrophobic film production effect is well improved. By coating, developing, exposing, etching, and demoulding, a highly consistent micro-nano structure is etched, diffuse reflection is reduced to increase light transmittance, and UV curing is performed by using a mixed resin as a raw material for a super-hydrophobic coating liquid to improve adhesion, hardness, and hydrophobicity, thereby achieving the purpose of improving the production effect of a transparent super-hydrophobic film;

[0188] The transparency is 94.7-95.7%, which is considered to be high transparency; the adhesion grade is 5B, which is considered to be high adhesion; the hardness is 1H-2H, which is considered to be high hardness; the water contact angle is 165.1-175.1°, and the water rolling angle is 4.7-5.2°, which is considered to be good hydrophobicity;

[0189] It can be seen that when the production raw materials are constant, the production effect of the transparent super-hydrophobic film can be increased by adjusting the conditions for preparing the micro-nano structure substrate. It is not difficult to see from the data in the above table that when preparing the micro-nano structure substrate, the soft baking temperature and time; exposure energy and time; film hardening temperature and time; etching temperature and time are increased, and the coating speed and time are reduced; the degumming treatment time, the transparency of the transparent super-hydrophobic film is improved accordingly. The reason for this is that the high speed causes the solution to splash, affecting the film quality and transparency; the coating time is prolonged, which increases the film thickness and causes defects in the film layer, which reduces the transparency; the soft baking temperature and time are increased, which increases the exposure energy and time; the film hardening temperature and time; the etching temperature and time, and the coating speed and time are reduced; the degumming treatment time is increased. The baking temperature and extended time can make the solvent evaporate slowly, which helps to form a denser and more uniform film layer; the increase in exposure energy and time can make photosensitive materials such as photoresist undergo a more complete cross-linking reaction to form a more stable micro-nano structure; the increase in hardening temperature and time can help to further solidify the film layer, making the structure of the film layer more stable, thereby improving transparency; too long degumming time will cause certain damage to the film layer and affect transparency; the increase in etching temperature and time will deepen the etching degree of the substrate material, and increase the size and roughness of the micro-nano structure, as obtained from Examples 1, 6-18.

[0190] When the production raw materials are constant, the production effect of the transparent super-hydrophobic film can be increased by adjusting the conditions for preparing the micro-nano structure substrate. It is not difficult to see from the data in the above table that when preparing the micro-nano structure substrate, the coating speed and time are increased; the exposure energy and time; the etching temperature and time, the hydrophobicity of the transparent super-hydrophobic film is improved accordingly. The reason for this is that the increase in roughness can increase the contact area between the droplet and the film surface, thereby increasing the contact angle of the droplet on the film surface; increasing the exposure parameters can make the micro-nano structure more regular, increase the roughness, and thus increase the water contact angle; the increase in etching temperature and time will increase the roughness of the substrate surface, thereby increasing the water contact angle, which is obtained from Examples 1, 6-18.

[0191] It can be seen that when the production raw materials are constant, the production effect of the transparent super-hydrophobic film can be increased by adjusting the conditions for preparing the micro-nano structure substrate. It is not difficult to see from the data in the above table that when preparing the micro-nano structure substrate, the hydrofluoric acid-nitric acid mixed etching solution is composed of hydrofluoric acid concentration, nitric acid, and water in a volume ratio of 8:15:77. The hydrophobicity of the transparent super-hydrophobic film is the highest. The reason for this is that the etching ability is strong and the etching rate is fast. Its deeper micro-nano structure can greatly increase the surface roughness, so that the droplets on the film surface are more inclined to exist in a spherical form, which is obtained from Examples 1 and 19-20.

[0192] Examples 21-24

[0193] A transparent super-hydrophobic film, and the corresponding relationship of the preparation method used are shown in the following table.

[0194] Table: Comparison table of transparent super-hydrophobic film usage in Examples 21-24

[0195] Group Transparent super hydrophobic film Embodiment 21 Prepared from Preparation Example 42 Embodiment 22 Prepared from Preparation Example 43 Embodiment 23 Prepared from Preparation Example 44 Embodiment 24 Prepared from Preparation Example 45

[0196] The transparent super-hydrophobic films in the above Examples 21-24 were taken, and their transparency, adhesion level, hardness, water contact angle and water contact angle were tested according to the above measurement steps and measurement standards. The average values ​​of the test results were recorded in the following table.

[0197] Table: Transparency, adhesion level, hardness, water contact angle and performance test results of water contact angle of Examples 1, 21-24

[0198]

[0199] As can be seen from the above table, in the preparation process of the transparent super-hydrophobic film in Examples 21-24, the production effect of the transparent super-hydrophobic film is well improved. By coating, developing, exposing, etching and demoulding, a highly consistent micro-nano structure is etched, diffuse reflection is reduced to improve light transmittance, and UV curing is performed by using a mixed resin as a raw material for the super-hydrophobic coating liquid to improve adhesion, hardness and hydrophobicity, thereby achieving the purpose of improving the production effect of the transparent super-hydrophobic film;

[0200] The transparency is 94.6-96.1%, which is considered to be high transparency; the adhesion grade is 5B, which is considered to be high adhesion; the hardness is 1H-2H, which is considered to be high hardness; the water contact angle is 163.2-166.1°, and the water rolling angle is 4.6-5.8°, which is considered to be good hydrophobicity;

[0201] It can be seen that when the production raw materials are certain, the super-hydrophobic coating liquid conditions can be adjusted to increase the production effect of the transparent super-hydrophobic film. It is not difficult to see from the data in the above table that when the super-hydrophobic coating liquid is prepared, when fluorocarbon resin is used as the resin raw material, the transparency of the prepared transparent super-hydrophobic film is the highest. When fluorosilicone resin and fluorocarbon resin mixed resin are used as the resin raw material, the hydrophobicity of the prepared transparent super-hydrophobic film is the highest, which is obtained by Examples 1-5.

[0202] This specific embodiment is only an explanation of the present invention, not a limitation of the present invention. After reading this specification, those skilled in the art can make non-creative modifications to this embodiment as needed, but as long as it is within the scope of the claims of the present invention, it is protected by the patent law.

Claims

1. A transparent super-hydrophobic film, characterized in that: The invention comprises a micro-nano structure substrate and a super-hydrophobic coating liquid; and the preparation method thereof comprises the following steps: A1, first the micro-nano structure substrate is immersed in the super-hydrophobic coating liquid at a depth of 2 / 3 of the substrate height at a perpendicular angle to the super-hydrophobic coating liquid, under the condition of an immersion speed of 1cm / s, and then pulled at a pulling speed of 5-10cm / min until the micro-nano structure substrate surface is evenly coated with the super-hydrophobic coating liquid, and then the micro-nano structure substrate is kept stationary for 30s in the vertical direction, and then, a nitrogen spray gun is used to purge once at a distance of 10cm from the substrate surface under a pressure of 0.1MPa to obtain the substrate after coating; A2: Place the coated substrate obtained in A1 in a UV curing device at a light intensity of 50-150 mW / cm 2 , solidified for 3-10 min at a rotation speed of 5 r / min, and then cooled for 2 min to obtain a transparent super-hydrophobic film.

2. A transparent super-hydrophobic film according to claim 1, characterized in that: The method for preparing the micro-nanostructure substrate comprises the following steps: C1. Take a glass sheet with a thickness of 0.5 cm as a substrate, then rinse it with deionized water to remove surface impurities, then place it in a 10-fold volume of ethanol solution for ultrasonic cleaning for 15 minutes, then blow it dry with nitrogen for later use, then spin-coat the substrate material with a positive photoresist with a thickness of 2 μm at a rotation speed of 2000-3000 r / min for 30-45 seconds, and then soft-bake it in an oven at 80-100° C. for 3-4 minutes to obtain a soft-baked substrate; C2, the photoresist on the substrate after soft baking obtained in C1 is exposed to light at an energy of 15-25mJ / cm 2 The substrate is exposed for 8-12 seconds under the conditions to form the desired pattern, and then placed in a 0.5% potassium hydroxide solution for development for 30 seconds to dissolve the photoresist in the exposed area to expose the substrate surface, and then placed in an oven to harden the film for 10-15 minutes at an oven temperature of 120-130° C. to obtain a hardened substrate; C3. Treat the substrate with the hard film obtained in C2 in an oxygen plasma environment for 5-10 minutes, then rinse it with ethanol, and then etch it with a hydrofluoric acid-nitric acid mixed etching solution at an etching temperature of 40-50° C. for 2-4 minutes to obtain a micro-nano structure substrate.

3. A transparent super-hydrophobic film according to claim 1, characterized in that: The super-hydrophobic coating liquid is prepared from a mixed resin, an organic solvent and a photoinitiator.

4. A transparent super-hydrophobic film according to claim 1, characterized in that: The preparation method of the super hydrophobic coating liquid comprises the following steps: B1. Dissolve the mixed resin in an organic solvent and place it in a magnetic stirrer at room temperature and stir at a stirring speed of 300 r / min for 30 min, then add a photoinitiator and continue stirring for 15 min under the same conditions to obtain a super-hydrophobic coating liquid.

5. A transparent super-hydrophobic film according to claim 1, characterized in that: The raw material components and weight ratios of the super hydrophobic coating liquid are as follows: mixed resin (10-20) parts, organic solvent (76-88) parts and photoinitiator (0.1-1) parts.

6. A transparent super-hydrophobic film according to claim 3, characterized in that: The mixed resin is composed of fluorosilicone resin, fluorocarbon resin and organic silicon resin in a weight ratio of (0-20): (0-18): (0-10).

7. A transparent super-hydrophobic film according to claim 3, characterized in that: The organic solvent is composed of ethyl acetate, acetone and toluene in a weight ratio of (0-80): (0-82): (0-88).

8. A transparent super-hydrophobic film according to claim 2, characterized in that: The hydrofluoric acid-nitric acid mixed etching solution is composed of hydrofluoric acid concentration, nitric acid and water in a volume ratio of (5-8):(12-15):(70-83).

9. A transparent super-hydrophobic film according to claim 2, characterized in that: The positive photoresist is composed of phenolic resin, naphthoquinone diazide, propylene glycol methyl ether acetate and plasticizer in a weight ratio of 4:2:4:0.

1.

10. A transparent super-hydrophobic film according to claim 3, characterized in that: The photoinitiator is 2-hydroxy-2-methyl-1-phenyl-1-propanone.

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