Metal tube electroplating device and electroplating process

Abstract

The invention provides a metal tube electroplating device, and relates to the technical field of metal tube electroplating, the metal tube electroplating device comprises a box body with an electroplating liquid, the upper end of the box body is provided with a guide rail connected with a positive electrode, the guide rail is provided with a clamp assembly capable of sliding along the guide rail, the clamp assembly clamps a metal tube, and one end of the metal tube is immersed in the electroplating liquid. The metal tube is immersed in the electroplating liquid, so that the outer surface of the immersed part of the metal tube is electrically electroplated with the metal layer. The copper alloy metal layer can be attached to the end of the metal pipe in an electroplating mode, when the end of the metal pipe is subjected to butt welding, copper alloy on the surface of the metal pipe can be molten and dissolved together through high temperature for connection, the welding procedure of the metal pipe can be simplified, and meanwhile the metal pipe can be evenly and stably welded.

Description

Technical Field

[0001] The present invention relates to the technical field of metal tube electroplating, and in particular to a metal tube electroplating device and an electroplating process. Background Art

[0002] The welding of metal pipes is to connect the ends of two metal pipes by welding. The current welding process is to apply solder to the ends of the metal pipes, or to apply paste through equipment. When applying the paste, the paste may enter the inside of the metal pipe, and the paste cannot be evenly applied inside the metal pipe. During welding, the uneven application of the paste causes uneven welding points inside the metal pipe after welding, affecting the quality of the welding process of the metal pipe. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a metal tube electroplating device and an electroplating process to solve the problem of low quality of metal tube welding process.

[0004] Based on the technical problems existing in the background technology, the present invention proposes a metal tube electroplating device and an electroplating process, including a box body with a plating solution, a guide rail connected to a positive electrode is arranged at the upper end of the box body, a clamp assembly that can slide along the guide rail is installed on the guide rail, the clamp assembly clamps a metal tube and immerses one end of the metal tube in the plating solution, a negative electrode is arranged in the box body, and the immersion of the metal tube in the plating solution can make the surface of the immersed part of the metal tube conductively plated.

[0005] Preferably, a driving mechanism is installed above the box body, and the driving mechanism can drive the clamp assembly to slide along the guide rail.

[0006] Preferably, the clamp assembly includes a conductive plate and clamp arms, metal rollers are rotatably mounted on both sides of one end of the conductive plate, the rollers are located above the guide rail and fit into the guide rail, two sets of clamp arms are longitudinally mounted on the same side of the conductive plate, the metal tube is clamped and fixed by the two sets of clamp arms and one end of the metal tube is kept in the electroplating liquid of the box.

[0007] Preferably, the two groups of clamping arms clamp in the transverse direction and the longitudinal direction respectively.

[0008] Preferably, the driving mechanism includes a screw mechanism and a slider that moves threadedly on the screw mechanism, the screw mechanism is installed on the box body and makes the axis of the screw parallel to the guide of the guide rail, the slider is penetrated by a connecting rod, and the connecting rod is connected to the conductive plate.

[0009] Preferably, the screw mechanism is driven by a motor.

[0010] Preferably, the metal layer is a copper alloy layer.

[0011] An electroplating process of a metal tube electroplating device is operated by using the metal tube electroplating device. First, the metal tube is clamped by two sets of clamp arms to keep one end of the metal tube partially immersed in the electroplating solution; power is turned on so that both the guide rail and the electroplating solution are conductive and form a loop through the metal tube; the operation of the screw mechanism drives the entire clamp assembly to move along the guide rail and causes the metal tube to move in the electroplating solution, and the electroplating is completed after power is turned off.

[0012] Compared with the prior art, the metal tube electroplating device and electroplating process proposed by the present invention adopt the above technical solution and achieve the following technical effects:

[0013] The present invention can attach a copper alloy metal layer to the end of the metal pipe by electroplating. When the metal pipe ends are butt-welded, the high temperature can melt the copper alloy on the surface of the metal pipe and dissolve them together for connection, which can simplify the welding process of the metal pipe and maintain uniform and stable welding of the metal pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0015] Figure 2 It is a schematic diagram of the structure of the clamp assembly of the present invention.

[0016] In the figure: 1, box body; 2, guide rail; 3, clamp assembly; 100, metal pipe; 4, driving mechanism; 31, conductive plate; 32, clamp arm; 33, metal roller; 41, screw mechanism; 42, slider; 43, connecting rod. DETAILED DESCRIPTION

[0017] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0018] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0019] Example

[0020] Please refer to Figure 1-Figure 2 The present invention proposes a metal tube 100 electroplating device and an electroplating process, comprising a box body 1 with an electroplating solution, a guide rail 2 connected to a positive electrode is provided at the upper end of the box body 1, a clamp assembly 3 that can slide along the guide rail 2 is installed on the guide rail 2, the clamp assembly 3 clamps the metal tube 100 and immerses one end of the metal tube 100 in the electroplating solution, a negative electrode is provided in the box body 1, and the metal tube 100 is immersed in the electroplating solution so that a conductive electroplated metal layer can be formed on the surface of the immersed part of the metal tube 100; in this scheme, the metal tube 100 is clamped by the clamp assembly 3, and a part of the end of the metal tube 100 is kept immersed in the solution. After the whole device is powered on, a uniform copper alloy layer can be electroplated on the part of the metal tube 100 that enters the solution. After the metal tube 100 is clamped by the clamp assembly 3, the metal tube 100 can be kept suspended in the electrolyte and can be uniformly electroplated with copper alloy.

[0021] In a specific embodiment, refer to Figure 1 , Figure 2 A driving mechanism 4 is installed above the box body 1, and the driving mechanism 4 can drive the clamp assembly 3 to slide along the guide rail 2; in this solution, during the electroplating process of the metal tube 100, the concentration of the plating solution around it may decrease, so the clamp assembly 3 in this application is driven by the driving mechanism 4, so that the clamp assembly 3 can drive the metal tube 100 to always maintain a vertical state and move slowly in the plating solution.

[0022] In a specific embodiment, refer to Figure 1 , Figure 2The clamp assembly 3 includes a conductive plate 31 and a clamp arm 32. Metal rollers 33 are rotatably installed on both sides of one end of the conductive plate 31. The rollers are located above the guide rail 2 and fit with the guide rail 2. Two groups of clamp arms 32 are longitudinally installed on the same side of the conductive plate 31. The metal tube 100 is clamped and fixed by the two groups of clamp arms 32 and one end of the metal tube 100 is kept in the electroplating solution of the box 1. In this solution, the conductive plate 31 and the clamp arm 32 are made of copper, which can better facilitate conductivity. The metal roller 33 can facilitate the sliding of the conductive plate 31 relative to the guide rail 2. The two groups of clamp arms 32 are arranged in sequence longitudinally, which can clamp the upper and lower parts of the metal tube 100 and stabilize the position of the metal tube 100.

[0023] In a specific embodiment, refer to Figure 1 , Figure 2 The two groups of clamping arms 32 clamp in the horizontal and longitudinal directions respectively.

[0024] In a specific embodiment, refer to Figure 1 , Figure 2 The driving mechanism 4 includes a screw mechanism 41 and a slider 42 that moves threadedly on the screw mechanism 41. The screw mechanism 41 is installed on the box body 1 and makes the axis of the screw parallel to the guide of the guide rail 2. The slider 42 is penetrated by a connecting rod 43, and the connecting rod 43 is connected to the conductive plate 31; in this solution, the driving mechanism 4 can drive the screw mechanism 41 to operate, and then the screw mechanism 41 can drive the slider 42 to move. In this application, the slider 42 is made of insulating material, and two groups of guide rails 2 are provided. The number of guide rails 2 can be increased, and they are connected by connecting rods 43, so that the slider 42 can drive multiple clamp assemblies 3 to operate at the same time.

[0025] In a specific embodiment, refer to Figure 1 , Figure 2 The screw mechanism 41 is driven by a motor; the motor in this solution is a servo motor, which can determine the position of the slider 42 more accurately.

[0026] In a specific embodiment, refer to Figure 1 , Figure 2 The metal layer in this solution is a copper alloy layer, and the copper alloy is easier to adhere at high temperatures. At the same time, it can be evenly electroplated on the surface of the metal tube 100 to avoid agglomeration and increase the connection accuracy of the metal tube 100.

[0027] refer to Figure 1-Figure 2 , an electroplating process of a metal tube 100 electroplating device, which is operated by the metal electroplating device. First, the metal tube 100 is clamped by two sets of clamp arms 32 to keep one end of the metal tube 100 partially immersed in the electroplating solution; power is turned on so that the guide rail 2 and the electroplating solution are both conductive and form a loop through the metal tube 100; the operation of the screw mechanism 41 drives the entire clamp assembly 3 to move along the guide rail 2 and causes the metal tube 100 to move in the electroplating solution, and the electroplating is completed after the power is turned off.

[0028] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A metal tube electroplating device, characterized in that: The invention comprises a box (1) having an electroplating liquid, wherein a guide rail (2) connected to a positive electrode is arranged at the upper end of the box (1), a clamp assembly (3) which can slide along the guide rail (2) is installed on the guide rail (2), the clamp assembly (3) clamps a metal tube (100) and allows one end of the metal tube (100) to be immersed in the electroplating liquid, and a negative electrode is arranged in the box (1), and the metal tube (100) is immersed in the electroplating liquid so that a conductive electroplated metal layer is formed on the surface of the immersed portion of the metal tube (100).

2. The metal tube electroplating device according to claim 1, characterized in that: A driving mechanism (4) is installed above the box body (1), and the driving mechanism (4) can drive the clamp assembly (3) to slide along the guide rail (2).

3. The metal tube electroplating device according to claim 1, characterized in that: The clamp assembly (3) comprises a conductive plate (31) and a clamp arm (32); metal rollers (33) are rotatably mounted on both sides of one end of the conductive plate (31); the rollers are located above the guide rail (2) and are in contact with the guide rail (2); two groups of clamp arms (32) are longitudinally mounted on the same side of the conductive plate (31); the metal tube (100) is clamped and fixed by the two groups of clamp arms (32) and one end of the metal tube (100) is kept in the electroplating solution of the box (1).

4. The metal tube electroplating device according to claim 3, characterized in that: The two groups of clamping arms (32) clamp in the transverse direction and the longitudinal direction respectively.

5. The metal tube electroplating device according to claim 2, characterized in that: The driving mechanism (4) comprises a screw mechanism (41) and a slider (42) threadedly movable on the screw mechanism (41); the screw mechanism (41) is mounted on the box body (1) so that the axis of the screw is parallel to the guide of the guide rail (2); a connecting rod (43) passes through the slider (42), and the connecting rod (43) is connected to the conductive plate (31).

6. The metal tube electroplating device according to claim 5, characterized in that: The screw mechanism (41) is driven by a motor.

7. The metal tube electroplating device according to claim 1, characterized in that: The metal layer is a copper alloy layer.

8. An electroplating process for a metal tube electroplating device, characterized in that: The metal tube electroplating device as described in any one of claims 1 to 7 is used for operation. First, the metal tube (100) is clamped by two sets of clamp arms (32) to keep one end of the metal tube (100) partially immersed in the electroplating solution; power is turned on so that the guide rail (2) and the electroplating solution are both conductive and form a loop through the metal tube (100); the entire clamp assembly (3) is driven to move along the guide rail (2) and the metal tube (100) is moved in the electroplating solution through the operation of the screw mechanism (41), and the electroplating is completed after power is turned off.

Images