Cavity cover and semiconductor epitaxy equipment

Abstract

The invention discloses a cavity cover and semiconductor epitaxy equipment, which are used for the semiconductor epitaxy equipment and comprise a cover body, two sides of the cover body in the thickness direction are a first side and a second side respectively, a plurality of runner spaces which are not communicated with each other are arranged in the cover body, and the plurality of runner spaces are uniformly spaced along the circumferential direction of the cover body; and each runner space is provided with an independent water inlet and an independent water outlet. According to the cavity cover disclosed by the invention, the cooling liquid can flow in the plurality of flow channel spaces at the same time, so that the cavity cover can be cooled by the cooling liquid in the plurality of flow channel spaces at the same time, and the cooling effect is improved. And the plurality of flow channel spaces are uniformly spaced along the circumferential direction of the cover body, so that the flow channel spaces are reasonably arranged, the flow channel space structures are optimized, the cooling uniformity of the cavity cover is improved, and the cooling effect of the cavity cover is further improved.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing equipment, and in particular to a cavity cover and semiconductor epitaxial equipment. Background Art

[0002] Semiconductor epitaxial equipment is usually equipped with a reaction chamber, which is equipped with a chamber cover. The chamber cover seals the reaction chamber from above. The temperature in the reaction chamber may reach 1500℃. The general material of the chamber cover cannot withstand such high temperature. In addition, there are some circuits and sensors on the chamber cover that have higher requirements for temperature control. How to cool the chamber cover has become a very important technical issue. The existing chamber cover structure is unreasonable and the cooling effect is not good. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a cavity cover, which optimizes the flow channel space structure, improves the cooling effect, and also improves the uniformity of cooling.

[0004] The present invention also provides a semiconductor epitaxial device, comprising the above-mentioned cavity cover.

[0005] A cavity cover according to an embodiment of the present invention is used for semiconductor epitaxial equipment and includes: a cover body, wherein the two sides of the cover body in the thickness direction are respectively a first side and a second side, the cover body is provided with a plurality of flow channel spaces which are not connected to each other, the plurality of flow channel spaces are evenly spaced apart along the circumferential direction of the cover body, and each of the flow channel spaces has an independent water inlet and outlet.

[0006] According to the cavity cover of the embodiment of the present invention, the cover body has a plurality of unconnected flow channel spaces, the plurality of flow channel spaces are evenly spaced along the circumferential direction of the cover body, and each flow channel space has an independent water inlet and outlet, so that the coolant can flow in the plurality of flow channel spaces at the same time, so that the cavity cover can be cooled and cooled by the coolant in the plurality of flow channel spaces at the same time, thereby improving the cooling effect. Moreover, since the plurality of flow channel spaces are evenly spaced along the circumferential direction of the cover body, the flow channel spaces are arranged reasonably, and the flow channel space structure is optimized, thereby improving the uniformity of cooling the cavity cover, and further improving the cooling effect of the cavity cover.

[0007] In some embodiments of the present invention, the cavity cover also includes: a first dividing rib, each of the flow channel spaces is provided with the first dividing rib, the first dividing rib extends along the radial direction of the cover body, the first dividing rib divides the flow channel space into two flow channel areas spaced apart along the circumferential direction of the cover body, the two flow channel areas are respectively a first area and a second area, the first dividing rib has a connecting notch connecting the first area and the second area, one of the first area and the second area is arranged opposite to and connected to the water inlet, and the other is arranged opposite to and connected to the water outlet.

[0008] In some embodiments of the present invention, the communication gap is provided at the radial inner end of the first dividing rib, and the water inlet and the water outlet are provided at the radial outer ends of the first region and the second region, respectively.

[0009] In some embodiments of the present invention, a side of the first dividing rib facing the first side has a second step, and the cover body located on the first side has a fixing through hole matched with the second step.

[0010] In some embodiments of the present invention, an air intake hole is provided on the cavity cover, and the air intake hole penetrates the second step and the first dividing rib along the thickness direction of the cover body.

[0011] In some embodiments of the present invention, the air inlet holes are multiple and spaced apart along the length direction of the first dividing rib.

[0012] In some embodiments of the present invention, the first region and the second region are symmetrically arranged about the first dividing rib.

[0013] In some embodiments of the present invention, the cavity cover further includes: a flow channel baffle, a plurality of the flow channel baffles are provided in the first area and the second area, the flow channel baffles extend along the circumferential direction of the cover body, and a plurality of the flow channel baffles in the same area are spaced apart along the radial direction of the cover body; each of the flow channel baffles is connected to one of the two inner walls of the first area or the second area opposite to each other along the circumferential direction of the cover body, and is spaced apart from the other, and along the radial direction of the cover body, the ends of two adjacent flow channel baffles spaced apart from the inner wall of the flow channel space are located at opposite ends.

[0014] In some embodiments of the present invention, along the radial direction of the cover body, the spacing between two adjacent flow baffles is equal; and / or, the multiple flow baffles in the first area and the multiple flow baffles in the second area are symmetrically arranged about the first dividing rib.

[0015] In some embodiments of the present invention, a connecting protrusion is connected between two adjacent flow channel baffles, and the connecting protrusion is connected to a wall surface of the first region or the second region close to the second side and is spaced apart from the wall surface close to the first side.

[0016] In some embodiments of the present invention, a plurality of connecting protrusions are arranged opposite to each other along the radial direction of the cover body.

[0017] A semiconductor epitaxial device according to an embodiment of the present invention includes the above-mentioned chamber cover.

[0018] According to the semiconductor epitaxial device of the embodiment of the present invention, by setting the above-mentioned cavity cover, the cover body has a plurality of flow channel spaces that are not connected to each other, and the plurality of flow channel spaces are evenly spaced along the circumferential direction of the cover body, and each flow channel space has an independent water inlet and outlet, so that the coolant can flow in the plurality of flow channel spaces at the same time, so that the cavity cover can be cooled and cooled by the coolant in the plurality of flow channel spaces at the same time, thereby improving the cooling effect. And because the plurality of flow channel spaces are evenly spaced along the circumferential direction of the cover body, the arrangement of the flow channel spaces is reasonable, and the structure of the flow channel spaces is optimized, thereby improving the uniformity of cooling the cavity cover, and further improving the cooling effect of the cavity cover.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 is a three-dimensional diagram of a cavity cover according to an embodiment of the present invention;

[0022] Figure 2 is an exploded view of the second cover of the cavity cover according to an embodiment of the present invention, wherein an exploded schematic diagram of the second cover and structures such as a central air intake device, a water outlet pipe, a water inlet pipe and a pull ring is shown;

[0023] Figure 3 is a perspective view of a first cover of a cavity cover according to an embodiment of the present invention;

[0024] Figure 4 is a vertical cross-sectional view of a cavity cover according to an embodiment of the present invention;

[0025] Figure 5 is a horizontal cross-sectional view of a cavity cover according to an embodiment of the present invention;

[0026] Figure 6is a partial schematic diagram of a semiconductor epitaxial device according to an embodiment of the present invention.

[0027] Reference numerals:

[0028] 100. Semiconductor epitaxial equipment;

[0029] 10. Cavity cover;

[0030] 1. Cover body; 11. First side; 12. Second side; 13. Flow channel space; 131. First area; 132. Second area; 14. Water inlet; 15. Water outlet; 16. First cover; 161. Flow channel groove; 162. First through hole; 17. Second cover; 171. Fixing through hole; 18. Fixing hole; 19. Mounting opening; 172. Second through hole; 173. Outer area; 174. Inner area;

[0031] 2. first dividing rib; 21. connecting notch; 22. second step; 23. air intake hole; 24. third step; 241. third step surface; 25. first step; 251. first step surface; 26. first step; 27. second step;

[0032] 3. Flow channel baffle;

[0033] 4. Connect the protrusions;

[0034] 5. second dividing rib; 51. first boss; 511. viewing window; 52. second boss;

[0035] 6. Pull ring;

[0036] 20. side wall; 201. reaction chamber;

[0037] 30. Rotating device;

[0038] 40. Master disc;

[0039] 50. Film carrier plate;

[0040] 60. Heating device;

[0041] 200, edge air intake device;

[0042] 300, water inlet pipe;

[0043] 400, water outlet pipe;

[0044] 500, wafer;

[0045] 600. Central air intake. DETAILED DESCRIPTION

[0046] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0047] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0048] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] Reference below Figure 1-Figure 5 A cavity cover 10 according to an embodiment of the present invention is described.

[0050] like Figure 1-Figure 5 As shown, a chamber cover 10 according to an embodiment of the present invention is used in a semiconductor epitaxial device 100 and includes: a cover body 1 .

[0051] Specifically, refer to Figure 1-Figure 5 The two sides of the cover body 1 in the thickness direction are respectively a first side 11 and a second side 12. The cover body 1 has a plurality of flow channel spaces 13 that are not connected to each other. The plurality of flow channel spaces 13 are evenly spaced apart along the circumferential direction of the cover body 1, and each flow channel space 13 has an independent water inlet 14 and a water outlet 15.

[0052] It should be noted that, Figure 6As shown, the semiconductor epitaxial device 100 also includes a reaction chamber, which has a reaction chamber 201, and one end of the reaction chamber is open, the wafer 500 is suitable for being arranged in the reaction chamber 201, and the cover body 1 is arranged at the open mouth to seal the reaction chamber 201, and the second side 12 of the cover body 1 is arranged close to the reaction chamber 201 relative to the first side 11.

[0053] The water inlet 14 and the water outlet 15 are both arranged on the first side 11. The water inlet 14 is suitable for being connected to the water inlet pipe 300, so as to facilitate the coolant to enter the flow channel space 13. The water outlet 15 is suitable for being connected to the water outlet pipe 400, so as to facilitate the coolant in the flow channel space 13 to flow out of the flow channel space 13, thereby realizing the continuous flow of the coolant in the flow channel space 13 and taking away the heat on the cavity cover 10.

[0054] It can be understood that by providing a plurality of flow channel spaces 13, each flow channel space 13 has an independent water inlet 14 and a water outlet 15, so that the coolant can flow in the plurality of flow channel spaces 13 at the same time, so that the cavity cover 10 can be cooled by the coolant in the plurality of flow channel spaces 13 at the same time, thereby improving the cooling effect. In addition, since the plurality of flow channel spaces 13 are evenly spaced along the circumferential direction of the cover body 1, the flow channel spaces 13 are arranged reasonably, thereby improving the uniformity of cooling the cavity cover 10, and further improving the cooling effect of the cavity cover 10.

[0055] For example, Figure 1-Figure 5 In the example shown, there are two flow channel spaces 13 , but the present invention is not limited thereto, and there may be more flow channel spaces 13 , such as 3, 4, 5 or 6.

[0056] Furthermore, if Figure 1-Figure 3 As shown, the cover body 1 is provided with a fixing hole 18, and the pull ring 6 is suitable for being arranged in the fixing hole 18 and connected to the cover body 1, so as to facilitate the opening and closing of the cover body 1, thereby facilitating the placement and removal of the wafer 500, wherein the fixing holes 18 are multiple and spaced apart along the circumferential direction of the cover body 1, and the pull ring 6 is multiple and one-to-one corresponding, for example, Figure 1-Figure 3 In the example shown, there are four fixing holes 18 and four pull rings 6, but the present invention is not limited thereto. The fixing holes 18 and the pull rings 6 may be other numbers, such as 2, 3, 5 or 6.

[0057] Furthermore, if Figure 3-Figure 5As shown, the cover body 1 includes a second cover 17 and a first cover 16 that are arranged opposite to each other, and the first cover 16 has a flow channel 161 on one side facing the first side 11; the second cover 17 is arranged at the notch of the flow channel 161 to block the flow channel 161, and the first cover 16 and the second cover 17 are sealed and connected, and a plurality of flow channel spaces 13 are formed between the first cover 16 and the second cover 17. Therefore, the flow channel space 13 of the present invention is conveniently formed by the split arrangement of the first cover 16 and the second cover 17.

[0058] According to the cavity cover 10 of the embodiment of the present invention, the cover body 1 has a plurality of unconnected flow channel spaces 13, and the plurality of flow channel spaces 13 are evenly spaced along the circumferential direction of the cover body 1, and each flow channel space 13 has an independent water inlet 14 and a water outlet 15, so that the coolant can flow in the plurality of flow channel spaces 13 at the same time, so that the cavity cover 10 can be cooled and cooled by the coolant in the plurality of flow channel spaces 13 at the same time, thereby improving the cooling effect. Moreover, since the plurality of flow channel spaces 13 are evenly spaced along the circumferential direction of the cover body 1, the arrangement of the flow channel spaces 13 is reasonable, and the structure of the flow channel spaces 13 is optimized, thereby improving the uniformity of cooling the cavity cover 10, and further improving the cooling effect of the cavity cover 10.

[0059] In some embodiments of the present invention, Figure 3 Figure 5 As shown, the cavity cover 10 also includes: a first dividing rib 2, a portion of the upper surface of the first cover 16 is recessed inward to form a flow channel 16, the flow channel 16 is generally circular, the bottom of the flow channel 16 is a bottom plate, and the edge of the flow channel 16 forms a peripheral wall of the edge of the flow channel space.

[0060] In some embodiments of the present invention, Figure 3-Figure 5 As shown, each flow channel space is provided with a first dividing rib 2, which is provided in the flow channel groove 16 in the first cover 16, and extends in the radial direction of the first cover 16. The first dividing rib 2 divides the flow channel space into two flow channel areas spaced apart in the circumferential direction of the cover body 1, namely the first area 131 and the second area 132, and the first dividing rib 2 has a connecting notch 21 connecting the first area 131 and the second area 132, one of the first area 131 and the second area 132 is arranged opposite to and connected with the water inlet 14, and the other is arranged opposite to and connected with the water outlet 15. It should be noted that there is at least one flow channel in one flow channel area, and each flow channel can independently inlet and outlet water so as to realize the cooling function independently.

[0061] It can be understood that the provision of the first dividing rib 2 improves the strength of the cavity cover 10 and improves the durability of the cavity cover 10. By providing the connecting notch 21 on the first dividing rib 2, the connecting notch 21 penetrates the first dividing rib 2 along the thickness direction of the first dividing rib 2, so that the first area 131 and the second area 132 can be connected, thereby, the coolant entering from the first area 131 can enter the second area 132 and flow out from the water outlet 15 opposite to the second area 132, or the coolant entering from the second area 132 can enter the first area 131 and flow out from the water outlet 15 opposite to the first area 131, thereby realizing the flow of the coolant in the entire flow channel space 13.

[0062] For example, in the present invention, the first area 131 is arranged opposite to and connected to the water inlet 14, and the second area 132 is arranged opposite to and connected to the water outlet 15, but the present invention is not limited to this. The first area 131 can also be arranged opposite to and connected to the water outlet 15, and the second area 132 can be arranged opposite to and connected to the water inlet 14.

[0063] Furthermore, at least portions of the first dividing rib 2 on both sides along the thickness direction of the cover body 1 are sealed to the inner wall of the flow channel space 13 along the thickness direction of the cover body 1 , thereby preventing the coolant from leaking from the flow channel space 13 .

[0064] In some embodiments of the present invention, Figure 3 As shown in the figure, the communication notch 21 is arranged at the radial inner end of the first dividing rib 2, and the water inlet 14 and the water outlet 15 are respectively arranged at the radial outer ends of the first area 131 and the second area 132. Therefore, the coolant from the water inlet 14 can flow from the radial outer end to the radial inner end along the radial direction (length direction) of the first dividing rib 2, and then flow from the radial inner end to the radial outer end, which increases the flow path of the coolant, makes the cooling more sufficient, and improves the cooling efficiency. At the same time, the coolant can flow through the entire first area 131 and the second area 132 along the radial direction of the cover body 1, so that the positions of the cavity cover 10 corresponding to the first area 131 and the second area 132 can all be cooled, which improves the uniformity of cooling.

[0065] When the first area 131 is arranged opposite to and connected to the water inlet 14, and the second area 132 is arranged opposite to and connected to the water outlet 15, the coolant enters the first area 131 from the water inlet 14, flows toward the radial inner end along the radial direction of the cover body 1, then flows to the second area 132 from the connecting notch 21, flows toward the radial outer end along the radial direction of the cover body 1, and finally flows out from the water outlet 15.

[0066] When the first area 131 is arranged opposite to and connected to the water outlet 15, and the second area 132 is arranged opposite to and connected to the water inlet 14, the coolant enters the second area 132 from the water inlet 14, flows toward the radial inner end along the radial direction of the cover body 1, then flows to the first area 131 from the connecting notch 21, flows toward the radial outer end along the radial direction of the cover body 1, and finally flows out from the water outlet 15.

[0067] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, the inner wall of the communication gap 21 close to the first side 11 is flush with the inner wall of the flow channel space 13 close to the first side 11 , and the inner wall of the communication gap 21 close to the second side 12 protrudes from the inner wall of the flow channel space 13 close to the second side 12 .

[0068] It can be understood that the inner wall of the connecting notch 21 near the first side 11 is flush with the inner wall of the flow channel space 13 near the first side 11, thereby facilitating the passage of the coolant, improving the flow capacity, and improving the cooling efficiency. The inner wall of the connecting notch 21 near the second side 12 protrudes from the inner wall of the flow channel space 13 near the second side 12, so that the inner wall of the connecting notch 21 near the second side 12 can play a buffering role, which can prevent the coolant from flowing too fast. On the one hand, the heat exchange between the coolant and the cavity cover 10 can be sufficient, further improving the cooling efficiency; on the other hand, it can reduce the impact force of the coolant on the inner wall of the flow channel space 13, thereby playing a role in protecting the inner wall of the flow channel space 13.

[0069] In some embodiments of the present invention, Figure 1-Figure 5 As shown, the first dividing rib 2 has a second step 22 on the side facing the first side 11, and the cover body 1 (second cover 17) located on the first side 11 has a fixing through hole 171 that matches the second step 22. It can be understood that the first dividing rib 2 and the cover body 1 located on the second side 12, that is, the first cover 16, are connected and fixed to each other, and through the mutual cooperation of the second step 22 and the fixing through hole 171, the cover body 1 located on the first side 11 can be mutually limited and fixed with the second step 22, so that the cover body 1 located on the first side 11 and the cover body 1 located on the second side 12 can be better fixed and limited, thereby improving the installation stability and reliability of the cover body 1 located on the first side 11.

[0070] In some embodiments of the present invention, Figure 1-Figure 5As shown, the chamber cover 10 is provided with an air intake hole 23, which penetrates the second step 22 and the bottom of the first dividing rib 2 along the thickness direction of the cover body 1. It can be understood that the edge air intake device 200 is suitable for being arranged in the air intake hole 23, so that it is convenient for the edge air intake device 200 to supply air to the reaction chamber 201. At the same time, since the air intake hole 23 is arranged on the second step 22 and the first dividing rib 2, the coolant in the flow channel space 13 is prevented from leaking out through the air intake hole 23, thereby improving the sealing performance of the flow channel space 13.

[0071] In some embodiments of the present invention, Figure 1-Figure 5 As shown, the air inlet holes 23 are arranged in a plurality of intervals along the length direction of the first dividing rib 2. Thus, the plurality of edge air inlet devices 200 can supply air to the reaction chamber 201 through the air inlet holes 23, thereby improving the efficiency of air supply. Figure 1-Figure 4 In the example shown, each first dividing rib 2 has three air inlet holes 23 , but the present invention is not limited thereto, and each first dividing rib 2 may also have other numbers of air inlet holes, such as 2, 4, 5 or 6.

[0072] In some embodiments of the present invention, Figure 3-Figure 5 As shown, the cavity cover 10 further includes: a first dividing rib 2, a side of the first dividing rib 2 facing the first side 11 has a second step 22, and the second cover 17 has a fixing through hole 171 matched with the second step 22. Thus, the second cover 17 is convenient for limiting and fixing, and the installation stability and reliability of the second cover 17 are improved.

[0073] Furthermore, if Figure 1-Figure 4 As shown, the cavity cover 10 further includes: a first dividing rib 5, a second boss 52 is provided on the side of the first dividing rib 5 facing the first side 11, and the second cover 17 has a mounting opening 19 matched with the second boss 52. Thus, the second cover 17 is further facilitated to limit and fix, and the mounting stability and reliability of the second cover 17 are improved.

[0074] Furthermore, if Figure 3-Figure 5As shown, the first dividing rib 2 includes a third step 24, a second step 22, and a first step 25 connected in sequence along the radial direction of the first cover 16. The height of the step surface of the first step 25 is lower than the height of the third step surface 241, and the height of the third step surface 241 is lower than the height of the first step surface 251. When the second cover 17 is covered on the first cover 16, the step surface of the first step 25 is sealed by the bottom surface of the second cover 17, and the second step 22 is inserted into the fixing through hole 171. A gap is left between the third step surface 241 and the bottom surface of the second cover 17 to form a connecting gap 21. The connecting gap 21 enables the flow channel spaces on both sides of the first dividing rib 2 to be connected through the connecting gap 21. By setting three steps of different heights, when the second cover 17 is covered with the first cover 16, the first step 25 abuts against the bottom of the second cover 17, supporting the second cover 17 and sealing the second cover 17. The second step 22 is the highest. The second step 22 is inserted into the fixing through hole 171 to fix the second cover 17 and the first cover 16 to each other, thereby preventing the second cover 17 and the first cover 16 from moving relative to each other in the horizontal direction. The third step 24 is the lowest, and a connecting gap 21 is formed at this time, so that the flow channel spaces on both sides of the first dividing rib 2 can be connected through the connecting gap 21. In this way, these three steps respectively realize the functions of sealing support, limiting and connecting the flow channel spaces. Such multiple functions can be achieved by only relying on the relative position setting and height change of the three steps, so that the cavity cover is compact as a whole, the structure is stable, and the cooling effect is good.

[0075] In some embodiments of the present invention, Figure 3-Figure 5 As shown, the length of the first step 25 is longer than the third step 24, and the length of the first step 25 is shorter than the second step 22. The area of ​​the second cover 17 located above the first step 25 and opposite to the first step 25 is the outer area 173, and the area located above the third step 24 and opposite to the third step 24 is the inner area 174. The length of the outer area 173 is the same as that of the first step 25, and the length of the inner area 174 is the same as that of the third step 24. By setting the outer area 173 longer than the inner area 174, the second cover 17 can obtain a better support effect and reduce the shaking of the second cover 17.

[0076] Further, such as Figure 3-Figure 5 As shown, the second cover 17 is provided with a first through hole 162, and the first cover 16 is provided with a second through hole 172 which can be communicated with the first through hole 162. The first through hole 162 and the second through hole 172 allow the central air intake device 600 to pass through and extend into the reaction chamber 201, and the central air intake device 600 can output reaction gas to all sides.

[0077] Further, such as Figure 3-Figure 5As shown, part of the upper surface of the first cover 16 is recessed inward to form a flow channel 161 . The flow channel 161 is generally circular. The first cover 16 includes a bottom plate located at the bottom of the flow channel 161 . The edge of the first cover 16 forms a peripheral wall of the edge of the flow channel 161 .

[0078] Further, such as Figure 3-Figure 5 As shown, the through hole wall of the second through hole 172 forms two steps along the axial direction of the second through hole 172, namely, the first step 26 and the second step 27. Below the second step 27, the second step 27 is formed by shrinking inward along the outer circumference of the first step 26. The first step 26 forms an annular horizontal plane at the shrinkage point of the second step 27. The height of the horizontal plane is the same as the height of the first step surface 251. In this way, when the second cover 17 is placed on the first cover 16, the lower surface of the second cover 17 abuts against the horizontal plane, and the horizontal plane forms support for the second cover 17. In addition to the support of the first step 25 for the second cover 17, different support areas are added, making the second cover 17 and the first cover 16 more stable. Furthermore, the horizontal plane is annular and is located in the central area of ​​the first cover 16 and the first step surface 251 in the edge area echo each other, so that the first cover 16 is more evenly stressed and the entire cavity cover is more stable.

[0079] In some embodiments of the present invention, Figure 3-Figure 5 As shown, the first dividing ribs 2 include two, and the two first dividing ribs 2 are collinear and symmetrically arranged about the second through hole 172, the third step 24 of each first dividing rib 2 is fixedly connected to the outer peripheral surface of the first step 26, the first step 25 is fixedly connected to the peripheral wall of the first cover 16, and the bottoms of the first step 25, the second step 22, and the third step 24 are all fixedly connected to the bottom plate of the first cover 16. It can be understood that the fixed connection includes but is not limited to welding, riveting, etc.

[0080] In some embodiments of the present invention, Figure 3 and Figure 5 As shown, the first area 131 and the second area 132 are symmetrically arranged about the first dividing rib 2. Thus, the structural arrangement inside the cavity cover 10 is further optimized, so that the structural weight arrangement inside the cavity cover 10 is more uniform, the structural strength is higher, and the service life is longer.

[0081] In some embodiments of the present invention, Figure 3 and Figure 5As shown, the cavity cover 10 also includes: a flow channel baffle 3, a plurality of flow channel baffles 3 are provided in the first area 131 and the second area 132, the flow channel baffle 3 extends along the circumferential direction of the cover body 1, and the plurality of flow channel baffles 3 in the same area are spaced apart along the radial direction of the cover body 1; the height of the flow channel baffle 3 is the same as the height of the first step surface 251 of the first step 25, so that when the second cover 17 is covered on the first cover 16, the second cover 17 also abuts against the flow channel baffle 3, thereby sealing the flow channel space and supporting the second cover 17.

[0082] Each flow channel baffle 3 is connected to one of the two inner walls of the first area 131 or the second area 132 that are opposite to each other in the circumferential direction of the cover body 1, and is spaced apart from the other one. Along the radial direction of the cover body 1, the ends of two adjacent flow channel baffles 3 spaced apart from the inner walls of the flow channel space 13 are located at opposite ends.

[0083] Specifically, when two colinear first dividing ribs 2 are provided at opposite ends of the second through hole 172 in the radial direction, one end of each flow channel baffle 3 is fixedly connected to one of the first dividing ribs 2, and the other end is separated from the other first dividing rib 2, thus forming an S-shaped flow channel direction. It can be understood that, through the above-mentioned setting method, the path through which the coolant flows in the first area 131 and the second area 132 is a winding S-shaped path, which, on the one hand, increases the path for the coolant to flow in the first area 131 and the second area 132, so that the coolant can fully exchange heat with the cavity cover 10, thereby improving the cooling efficiency. On the other hand, the path for the coolant to flow can cover the first area 131 and the second area 132 as much as possible, thereby improving the cooling uniformity and cooling sufficiency, and improving the cooling efficiency.

[0084] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, along the radial direction of the cover body 1, the spacing between two adjacent flow channel baffles 3 is equal; thereby, the distribution of the flow channel baffles 3 in the flow channel space 13 is more uniform, thereby further optimizing the structural setting inside the cavity cover 10, making the structural weight arrangement inside the cavity cover 10 more uniform, the structural strength higher, and the service life longer.

[0085] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, the plurality of flow channel baffles 3 in the first area 131 and the plurality of flow channel baffles 3 in the second area 132 are symmetrically arranged about the first dividing rib 2. Thus, the flow channel baffles 3 are more evenly distributed in the flow channel space 13, thereby further optimizing the structural arrangement inside the chamber cover 10, making the structural weight arrangement inside the chamber cover 10 more even, with higher structural strength and longer service life.

[0086] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, a connecting protrusion 4 is connected between two adjacent flow channel baffles 3, and the connecting protrusion 4 is connected to the wall surface of the first area 131 or the second area 132 close to the second side 12 and is separated from the wall surface close to the first side 11. It can be understood that the connecting protrusion 4 is separated from the wall surface close to the first side 11, thereby ensuring the flow rate of the coolant, so that the coolant can flow smoothly in the flow channel space 13. The setting of the connecting protrusion 4 can prevent the coolant from flowing too fast in the flow channel space 13, and can play the effect of appropriately reducing the flow rate of the coolant. On the one hand, the heat exchange between the coolant and the cavity cover 10 can be sufficient, further improving the cooling efficiency; on the other hand, it can reduce the impact force of the coolant on the inner wall of the flow channel space 13, thereby playing the role of protecting the inner wall of the flow channel space 13.

[0087] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, multiple connection protrusions 4 are relatively arranged along the radial direction of the cover body 1. It can be understood that in the same area, multiple connection protrusions 4 are relatively arranged along the radial direction of the cover body 1, so that the distribution of multiple connection protrusions 4 in the flow channel space 13 is more uniform, thereby further optimizing the structural setting inside the cavity cover 10, making the structural weight arrangement inside the cavity cover 10 more uniform, the structural strength is higher, and the service life is longer.

[0088] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, the cavity cover 10 further includes: a first dividing rib 5 , two adjacent flow channel spaces 13 are spaced apart by the first dividing rib 5 , and the first dividing rib 5 extends along the radial direction of the cover body 1 .

[0089] It can be understood that the number of first dividing ribs 5 and flow channel spaces 13 is equal, and one end of the multiple first dividing ribs 5 along the radial inward direction of the cover body 1 is fixedly connected to the peripheral wall of the second through hole 172. Furthermore, the first dividing ribs 5 are fixedly connected to the outer peripheral surface of the first step 26, and the other end extends in the radial outward direction of the cover body 1. The setting of the first dividing ribs 5 realizes the disconnection between the multiple flow channel spaces 13, so that the coolant can flow in the multiple flow channel spaces 13 at the same time, so that the cavity cover 10 can be cooled down by the coolant in the multiple flow channel spaces 13 at the same time, thereby improving the cooling effect.

[0090] In some embodiments of the present invention, the first dividing rib 5 includes a first boss 51 and a second boss 52 arranged in a stepped manner, wherein the bottom of the first boss 51 is fixedly connected to the bottom plate, the second boss 52 is fixedly arranged above the first boss 51, and the second boss 52 forms an annular step surface.

[0091] In some embodiments of the present invention, the first dividing ribs 5 include two, and the two first dividing ribs 5 are collinear and symmetrically arranged about the second through hole 172, one end of each first dividing rib 5 is fixedly connected to the outer peripheral surface of the first step 26, and the other end is fixedly connected to the peripheral wall of the first cover 16. It can be understood that the fixed connection method includes but is not limited to welding, riveting, etc.

[0092] In some embodiments of the present invention, there are two second dividing ribs 5, and the two second dividing ribs 5 are collinear and symmetrically arranged about the second through hole 172, one end of the first boss 51 of each second dividing rib 5 is fixedly connected to the outer peripheral surface of the first step 26, and the other end of the first boss 51 is fixedly connected to the peripheral wall of the first cover 16, and the bottom of the second dividing ribs 5 is fixedly connected to the bottom plate of the first cover 16. It can be understood that the fixed connection method includes but is not limited to welding, riveting, etc.

[0093] Among them, since the multiple flow channel spaces 13 are evenly spaced along the circumferential direction of the cover body 1, the multiple first dividing ribs 5 are also evenly arranged along the circumferential direction of the cover body 1, so that the multiple first dividing ribs 5 are evenly distributed in the cover body 1, thereby further optimizing the structural setting inside the cavity cover 10, making the structural weight arrangement inside the cavity cover 10 more uniform, the structural strength higher, and the service life longer.

[0094] Furthermore, at least parts of the first dividing rib 5 on both sides along the thickness direction of the cover body 1 are sealed and fitted with the inner wall of the flow channel space 13 along the thickness direction of the cover body 1, thereby preventing leakage of the coolant.

[0095] In some embodiments of the present invention, Figure 1-Figure 4 As shown, the first dividing rib 5 has a second boss 52 on the side facing the first side 11, and the cover body 1 located on the first side 11 has a mounting opening 19 that matches the second boss 52. It can be understood that the first dividing rib 5 and the cover body 1 located on the second side 12 are connected and fixed to each other, and the second boss 52 is inserted into the mounting opening 19. Through the mutual cooperation between the two, the cover body 1 located on the first side 11 can be mutually limited and fixed with the second boss 52, so that the cover body 1 located on the first side 11 and the cover body 1 located on the second side 12 can be better fixed and limited, and the installation stability and reliability of the cover body 1 located on the first side 11 are improved. It can be understood that when the second cover 17 is covered on the first cover 16, the bottom of the second cover 17 is covered on the stepped surface, so that the second boss 52 supports the second cover 17, making the entire cavity cover more stable.

[0096] In some embodiments of the present invention, Figure 1-Figure 4As shown, a viewing window 511 is provided on the second boss 52, and the viewing window 511 penetrates the second boss 52 and the first dividing rib 5 along the thickness direction of the cover body 1, and the viewing window 511 is suitable for installing a temperature sensor. Thus, the temperature sensor can directly detect the temperature in the reaction chamber 201, so that the temperature in the reaction chamber 201 can be controlled within a preset range.

[0097] In addition, since the viewing window 511 is disposed on the second boss 52 , the cooling liquid in the flow channel space 13 is prevented from leaking out through the viewing window 511 , thereby improving the sealing performance of the flow channel space 13 .

[0098] Reference below Figure 1 and Figure 6 A semiconductor epitaxial apparatus 100 according to an embodiment of the present invention is described.

[0099] like Figure 1 and Figure 6 As shown, a semiconductor epitaxial device 100 according to an embodiment of the present invention includes the chamber cover 10 mentioned above.

[0100] Specifically, refer to Figure 1 and Figure 5 , further comprising: a side wall 20, an induction coil, a rotating device 30, a master disc 40 and a wafer carrier 50, wherein the side wall 20 and the chamber cover 10 together enclose a reaction chamber 201. The chamber cover 10 and the side wall 20 may be made of quartz material or other high temperature resistant materials. The side of the master disc 40 facing the chamber cover 10 has a wafer carrier 50 for loading a wafer 500. The master disc 40 is sleeved on the rotating device 30 and is arranged on the side of the rotating device 30 facing the chamber cover 10, and the rotating device 30 can drive the master disc 40 to rotate. A heating device 60 is also provided at the bottom of the master disc 40, and the heating device 60 may be a resistance heating device 60, or an electromagnetic induction heating device 60, etc., and is not limited. The heating device 60 is used to heat the wafer carrier 50, the wafer 500, and the master disc 40. Further, the semiconductor epitaxial device 100 further comprises a base (not shown), which is used to seal the reaction chamber 201 from below and to carry the device in the reaction chamber 201.

[0101] According to the semiconductor epitaxial device 100 of the embodiment of the present invention, by setting the above-mentioned cavity cover 10, the cover body 1 has a plurality of flow channel spaces 13 that are not connected to each other, and the plurality of flow channel spaces 13 are evenly spaced along the circumferential direction of the cover body 1, and each flow channel space 13 has an independent water inlet 14 and a water outlet 15, so that the coolant can flow in the plurality of flow channel spaces 13 at the same time, so that the cavity cover 10 can be cooled and cooled by the coolant in the plurality of flow channel spaces 13 at the same time, thereby improving the cooling effect. And because the plurality of flow channel spaces 13 are evenly spaced along the circumferential direction of the cover body 1, the arrangement of the flow channel spaces 13 is reasonable, and the structure of the flow channel spaces 13 is optimized, thereby improving the uniformity of cooling the cavity cover 10, and further improving the cooling effect of the cavity cover 10.

[0102] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0103] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A cavity cover, characterized in that: For semiconductor epitaxial equipment and comprising: The cover body comprises a first side and a second side on both sides in the thickness direction, and the cover body comprises a plurality of flow channel spaces which are not connected to each other, the plurality of flow channel spaces are evenly spaced apart along the circumferential direction of the cover body, and each of the flow channel spaces has an independent water inlet and outlet.

2. The cavity cover according to claim 1, characterized in that: Also includes: A first dividing rib is provided in each of the flow channel spaces, the first dividing rib extends along the radial direction of the cover body, and the first dividing rib divides the flow channel space into two flow channel areas spaced apart along the circumferential direction of the cover body, the two flow channel areas being a first area and a second area, respectively. One of the first area and the second area is disposed opposite to and communicated with the water inlet, and the other is disposed opposite to and communicated with the water outlet.

3. The cavity cover according to claim 2, characterized in that: The water inlet and the water outlet are respectively arranged at radial outer ends of the first area and the second area.

4. The cavity cover according to claim 2, characterized in that: A side of the first dividing rib facing the first side has a second step, and the cover body located on the first side has a fixing through hole matched with the second step.

5. The cavity cover according to claim 4, characterized in that: The cavity cover is provided with an air intake hole, and the air intake hole penetrates the second step and the first dividing rib along the thickness direction of the cover body.

6. The cavity cover according to claim 5, characterized in that: The air inlet holes are multiple and spaced apart along the length direction of the first dividing rib.

7. The cavity cover according to claim 2, characterized in that: The first region and the second region are symmetrically arranged about the first dividing rib.

8. The cavity cover according to claim 2, characterized in that: Also includes: A flow channel baffle, wherein a plurality of the flow channel baffles are provided in each of the first region and the second region, the flow channel baffles extend along the circumferential direction of the cover body, and the plurality of the flow channel baffles in the same region are spaced apart along the radial direction of the cover body, Each of the flow channel baffles is connected to one of the two inner walls of the first area or the second area that are opposite to each other along the circumferential direction of the cover body, and is spaced apart from the other one. Along the radial direction of the cover body, the ends of two adjacent flow channel baffles spaced apart from the inner wall of the flow channel space are located at opposite ends.

9. The cavity cover according to claim 8, characterized in that: Along the radial direction of the cover body, the distances between two adjacent flow channel baffles are equal; And / or, the plurality of flow channel baffles in the first region and the plurality of flow channel baffles in the second region are symmetrically arranged about the first dividing rib.

10. The cavity cover according to claim 9, characterized in that: A connecting protrusion is connected between two adjacent flow channel baffles, and the connecting protrusion is connected to a wall surface of the first region or the second region close to the second side and is spaced apart from the wall surface close to the first side.

11. The cavity cover according to claim 10, characterized in that: Along the radial direction of the cover body, a plurality of connecting protrusions are arranged opposite to each other.

12. A semiconductor epitaxial device, characterized in that: Comprising a cavity cover according to any one of claims 1-11.

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