High-power silicon controlled rectifier dimming passive heat dissipation LED Par64 lamp

Abstract

The invention discloses a high-power silicon controlled rectifier dimming passive heat dissipation LED Par64 lamp which comprises a lamp panel radiator, a power supply sleeve is installed on the inner side of the upper portion of the lamp panel radiator, a power supply board is installed on the inner side of the power supply sleeve, and a power supply upper cover is installed on the top of the power supply sleeve. A lamp panel electrically connected with the power panel is installed at the bottom of the lamp panel radiator, a plurality of first cooling fins are evenly distributed on the outer side of the lamp panel radiator, a plurality of second cooling fins are arranged on the outer side of the power sleeve, and a plurality of third cooling fins are arranged on the top of the power upper cover. The power panel is provided with a plurality of MOS tubes in contact with the bottom of the power upper cover, and a connector electrically connected with the power panel is installed on the top of the power upper cover. The LED lamp is large in heat dissipation area, high in heat dissipation speed, stable in work, good in waterproofness, stable in illumination, beneficial to long-term use, high in working efficiency and long in service life, and has a special heat dissipation function for a power supply.

Description

Technical Field

[0001] The invention relates to the technical field of lamps, and in particular to a high-power silicon-controlled dimming passive heat dissipation LED Par64 lamp. Background Art

[0002] PAR lamps generally include PAR30, PAR36, PAR46, PAR56, PAR64, etc., with different sizes. They are also called downlights. They emit light beams and are generally used to illuminate the stage, change colors dynamically, etc. They are common lamps on the stage. Because of their high power consumption and the feeling of being baked, traditional aluminum cold reflective halogen spotlights are gradually being replaced by LED PAR lamps. As the requirements for stage lighting become higher and higher, the power requirements for PAR lamps are also increasing, and the heat dissipation requirements for PAR lamps are also increasing. Traditional PAR lamps generally dissipate heat for the light board, but not for the power supply. The heat dissipation area is far from enough, which will cause the PAR lamp to work unstably, affect work efficiency, and even cause the PAR lamp to heat up severely and produce defects, which is not conducive to the long-term use of PAR lamps. Therefore, in order to avoid the shortcomings of the prior art, it is necessary to improve the prior art. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings and deficiencies in the prior art and to provide a high-power thyristor dimming passive heat dissipation LED Par64 lamp with a large heat dissipation area and stable operation.

[0004] The present invention is achieved through the following technical solutions:

[0005] A high-power thyristor dimming passive heat dissipation LED Par64 lamp, including a lamp board radiator, a power supply sleeve is installed on the inner side of the upper part of the lamp board radiator, a power supply board is installed on the inner side of the power supply sleeve, a power supply upper cover is installed on the top of the power supply sleeve, a lamp board electrically connected to the power supply board is installed on the bottom of the lamp board radiator, a plurality of first heat sinks are evenly distributed on the outer side of the lamp board radiator, a plurality of second heat sinks are provided on the outer side of the power supply sleeve, a plurality of third heat sinks are provided on the top of the power supply upper cover, the power supply board is provided with a plurality of MOS tubes in contact with the bottom of the power supply upper cover, and a connector electrically connected to the power supply board is installed on the top of the power supply upper cover.

[0006] Furthermore, a silicone pad for connecting the top of the lamp board radiator is provided at the bottom of the outer side of the power supply upper cover.

[0007] Furthermore, a partition plate is installed at the bottom of the power sleeve.

[0008] Furthermore, a lens plate is installed at the bottom of the lamp board heat sink, a plurality of LED lamp beads are arranged at the bottom of the lamp board, the lens plate is provided with a lens covering the LED lamp beads, and the lens plate is provided with air holes which are connected up and down.

[0009] Furthermore, a waterproof rubber ring is provided at the connection between the lens plate and the light board radiator.

[0010] Furthermore, the first heat sink is arranged in an arc shape, the first heat sink is distributed in a circular array, and a plurality of first convex strips are arranged on the surface of the first heat sink.

[0011] Furthermore, the third heat sink is arranged in an arc shape, the third heat sink is distributed in a circular array, and a plurality of third convex strips are arranged on the surface of the third heat sink.

[0012] Furthermore, a mounting plate is provided at the bottom of the lamp board radiator, a heat dissipation gap is formed between the mounting plate and the bottom of the power supply sleeve, a heat dissipation channel is formed between the first heat sinks, and the heat dissipation gap is connected to the heat dissipation channel.

[0013] Furthermore, a power supply sleeve mounting hole for installing the power supply sleeve is provided on the inner side of the lamp board heat sink, and a connector mounting groove for installing the connector is provided on the top of the power supply upper cover.

[0014] Furthermore, a ring is provided at the bottom of the outer side of the power supply upper cover for connecting the top of the lamp board radiator.

[0015] Compared with the prior art, the present invention installs a power supply sleeve on the inner side of the upper part of the lamp board radiator, and a power supply upper cover is installed on the top of the power supply sleeve. A plurality of first heat sinks are evenly distributed on the outer side of the lamp board radiator, a plurality of second heat sinks are arranged on the outer side of the power supply sleeve, a plurality of third heat sinks are arranged on the top of the power supply upper cover, and the power board is provided with a plurality of MOS tubes in contact with the bottom of the power supply upper cover. The second heat sinks export the heat of the power board to prevent heat accumulation, the first heat sinks dissipate the heat of the lamp board and the heat exported by the second heat sinks, the power supply upper cover exports the heat of the MOS tube with large heat generation of the power board, and the third heat sink dissipates the heat of the MOS tube, so that the heat dissipation area of ​​the PAR lamp is large, the heat dissipation is specifically for the power supply, the heat dissipation speed is fast, the operation is stable, the phenomenon of adverse effects caused by severe heating is eliminated, the long-term use of the PAR lamp is beneficial, the working efficiency of the PAR lamp is improved, and the service life of the PAR lamp is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the structure of a high-power thyristor dimming passive heat dissipation LED Par64 lamp of the present invention;

[0018] Figure 2 This is a structural exploded view of the high-power thyristor dimming passive heat dissipation LED Par64 lamp of the present invention;

[0019] Figure 3 It is a structural schematic diagram of the light panel heat sink of the present invention;

[0020] Figure 4 It is a schematic diagram of the structure of the power supply upper cover of the present invention.

[0021] In the figure: 1-lamp board radiator; 2-power supply sleeve; 3-power supply board; 4-power supply cover; 5-lamp board; 6-first heat sink; 7-second heat sink; 8-third heat sink; 9-MOS tube; 10-connector; 12-partition plate; 13-lens plate; 14-lens; 15-mounting plate; 16-heat dissipation channel; 18-power supply sleeve mounting hole; 19-connector mounting groove; 21-vent hole; 22-waterproof rubber ring; 23-first convex strip; 24-third convex strip; 28-silicone pad. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] like Figures 1 to 4The high-power thyristor dimming passive heat dissipation LED Par64 lamp of the present invention includes a lamp board radiator 1, a power supply sleeve 2 is installed on the inner side of the upper part of the lamp board radiator 1, a power supply board 3 is installed on the inner side of the power supply sleeve 2, a power supply upper cover 4 is installed on the top of the power supply sleeve 2, a lamp board 5 electrically connected to the power supply board 3 is installed on the bottom of the lamp board radiator 1, a plurality of first heat sinks 6 are evenly distributed on the outer side of the lamp board radiator 1, a plurality of second heat sinks 7 are arranged on the outer side of the power supply sleeve 2, a plurality of third heat sinks 8 are arranged on the top of the power supply upper cover 4, the power supply board 3 is provided with a plurality of MOS tubes 9 in contact with the bottom of the power supply upper cover 4, and a connector 10 electrically connected to the power supply board 3 is installed on the top of the power supply upper cover 4. A power supply sleeve 2 is installed on the inner side of the upper part of the lamp board radiator 1, and a power supply upper cover 4 is installed on the top of the power supply sleeve 2. A plurality of first heat sinks 6 are evenly distributed on the outer side of the lamp board radiator 1, a plurality of second heat sinks 7 are arranged on the outer side of the power supply sleeve 2, and a plurality of third heat sinks 8 are arranged on the top of the power supply upper cover 4. The power board 3 is provided with a plurality of MOS tubes 9 in contact with the bottom of the power supply upper cover 4. The second heat sink 8 guides the heat of the power board 3 to prevent heat accumulation. The first heat sink 6 dissipates the heat of the lamp board 5 and the heat guided by the second heat sink 8. The power supply upper cover 4 guides the heat of the MOS tube 9 with large heat generation of the power board 3. The third heat sink 8 dissipates the heat of the MOS tube 9, so that the heat dissipation area of ​​the PAR lamp is large, the heat dissipation is specifically aimed at the power supply, the heat dissipation speed is fast, the operation is stable, and the phenomenon of adverse effects caused by severe heating is eliminated, which is conducive to the long-term use of the PAR lamp, improves the working efficiency of the PAR lamp, and improves the service life of the PAR lamp.

[0024] A silicone pad 28 is provided at the bottom of the outer side of the power cover 4 for connecting to the top of the lamp board radiator 1. The silicone pad 28 separates the power cover 4 from the lamp board radiator 1 to provide heat insulation so that each can dissipate heat separately without interfering with or accumulating heat.

[0025] A partition plate 12 is installed at the bottom of the power supply sleeve 2 to facilitate the installation of the power supply board 3 and to play a role in heat insulation to prevent heat from interfering with each other or accumulating.

[0026] A lens plate 13 is installed at the bottom of the lamp board radiator 1, and a plurality of LED lamp beads are arranged at the bottom of the lamp board 5. The lens plate 13 is provided with a lens 14 which is covered on the LED lamp beads, so that the PAR lamp emits light more evenly. The lens plate 13 is provided with an air hole 21 which is connected up and down, so that the heat accumulated in the lens 14 during operation can be discharged from the air hole 21, and the heat is dissipated by convection from bottom to top, and the heat is properly discharged, so as to avoid the phenomenon of yellowing or even deformation of the lens due to overheating, improve the luminous efficiency and luminous quality, and facilitate the long-term use of the PAR lamp.

[0027] A waterproof rubber ring 22 is provided at the connection between the lens plate 13 and the lamp board radiator 1 to improve the sealing and waterproof performance of the lens plate 13 during installation.

[0028] The first heat sink 6 is arranged in an arc shape and is distributed in a circular array. A plurality of first convex strips 23 are arranged on the surface of the first heat sink 6 to increase the heat dissipation area of ​​the first heat sink 6 and improve the heat dissipation effect.

[0029] The third heat sink 8 is arranged in an arc shape, and the third heat sink 8 is arranged in a circular array. A plurality of third convex strips 24 are arranged on the surface of the third heat sink 8 to increase the heat dissipation area of ​​the third heat sink 8 and improve the heat dissipation effect.

[0030] A mounting plate 15 is provided at the bottom of the lamp board radiator 1, and a heat dissipation gap is formed between the mounting plate 15 and the bottom of the power supply sleeve 2, leaving enough space between each other so that air can flow better for better heat dissipation. A heat dissipation channel 16 is formed between the first heat sinks 6, and the heat dissipation gap is connected to the heat dissipation channel 16, so that the airflow can flow inside and outside, thereby improving the heat dissipation effect.

[0031] A power sleeve mounting hole 18 for mounting the power sleeve 2 is provided on the inner side of the lamp panel heat sink 1, so as to facilitate the positioning and mounting of the power sleeve 2 and make the mounting of the power sleeve 2 more stable.

[0032] A connector installation groove 19 for installing the connector 10 is provided on the top of the power supply upper cover 4, so as to facilitate the positioning and installation of the connector 10 and make the installation of the connector 10 more stable.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-power thyristor dimming passive heat dissipation LED Par64 lamp, characterized by: It includes a lamp board radiator, a power supply sleeve is installed on the inner side of the upper part of the lamp board radiator, a power supply board is installed on the inner side of the power supply sleeve, a power supply upper cover is installed on the top of the power supply sleeve, a lamp board electrically connected to the power supply board is installed on the bottom of the lamp board radiator, a plurality of first heat sinks are evenly distributed on the outer side of the lamp board radiator, a plurality of second heat sinks are arranged on the outer side of the power supply sleeve, a plurality of third heat sinks are arranged on the top of the power supply upper cover, the power supply board is provided with a plurality of MOS tubes in contact with the bottom of the power supply upper cover, and a connector electrically connected to the power supply board is installed on the top of the power supply upper cover.

2. The high-power thyristor dimming passive heat dissipation LED Par64 lamp according to claim 1, characterized in that: A silicone pad for connecting the top of the lamp board radiator is provided at the bottom of the outer side of the power supply upper cover.

3. The high-power thyristor dimming passive heat dissipation LED Par64 lamp according to claim 1, characterized in that: A partition plate is installed at the bottom of the power sleeve.

4. The high-power thyristor dimming passive heat dissipation LED Par64 lamp according to claim 1, characterized in that: A lens plate is installed at the bottom of the lamp board radiator, a plurality of LED lamp beads are arranged at the bottom of the lamp board, the lens plate is provided with a lens covering the LED lamp beads, and the lens plate is provided with air holes which are connected up and down.

5. The high-power thyristor dimming passive heat dissipation LED Par64 lamp according to claim 4, characterized in that: A waterproof rubber ring is provided at the connection between the lens plate and the light board radiator.

6. The high-power thyristor dimming passive heat dissipation LED Par64 lamp according to claim 1, characterized in that: The first heat sink is arranged in an arc shape, the first heat sink is distributed in a circular array, and a plurality of first convex strips are arranged on the surface of the first heat sink.

7. The high-power thyristor dimming passive heat dissipation LED Par64 lamp according to claim 1, characterized in that: The third heat sink is arranged in an arc shape, the third heat sink is distributed in a circular array, and a plurality of third convex strips are arranged on the surface of the third heat sink.

8. The high-power thyristor dimming passive heat dissipation LED Par64 lamp according to claim 1, characterized in that: A mounting plate is provided at the bottom of the lamp board radiator, a heat dissipation gap is formed between the mounting plate and the bottom of the power supply sleeve, a heat dissipation channel is formed between the first heat sinks, and the heat dissipation gap is connected to the heat dissipation channel.

9. The high-power thyristor dimming passive heat dissipation LED Par64 lamp according to claim 1, characterized in that: A power supply sleeve mounting hole for mounting the power supply sleeve is provided on the inner side of the lamp board heat sink.

10. The high-power thyristor dimming passive heat dissipation LED Par64 lamp according to claim 1, characterized in that: A connector mounting groove for mounting the connector is disposed on the top of the power supply upper cover.

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