Radiator and semiconductor radiator

Abstract

The invention relates to the technical field of air conditioning equipment, which comprises a radiator formed by combining a cavity-shaped heating body and a radiator formed by heat conduction pipes with fins attached in series, and a semiconductor radiator formed by clamping semiconductor chilling plates in a left-right shape or an up-down shape by the radiator, the heat conduction liquid containing the superconductive liquid is filled in the heat conduction pipe and the heating body, the application of the heat pipe technology can increase the height of the radiator so as to increase the heat dissipation and exchange area, the temperature difference formed at the inner side end and the outer side end of the radiator is small, the heat dissipation and cold dissipation capacity of the semiconductor radiator can be improved, and the heat dissipation efficiency is improved. The electromagnetic wire is wound on the heating body and / or the semiconductor chilling plate is clamped on the heating body, a double-heat-source mode of electromagnetic heating and semiconductor heating is achieved, when electromagnetic heating is mainly used, the semiconductor chilling plate is in a stop state, the service life of the semiconductor chilling plate can be remarkably prolonged, and waste of electric power resources is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of air conditioning equipment, and in particular relates to a heat sink and a semiconductor heat sink. Background Art

[0002] Radiator cooling is mainly divided into air cooling, liquid cooling and heat pipe cooling. Among them, heat pipe cooling uses the principle of heat conduction and the rapid heat transfer properties of the refrigerant to transfer heat through the evaporation and condensation of liquid in a fully enclosed vacuum tube. It has extremely high thermal conductivity and can transfer heat over long distances. The heat exchanger composed of heat pipes has the advantages of high heat transfer efficiency, compact structure, and low liquid resistance. Its thermal conductivity far exceeds that of any known metal. At present, most CPU radiators in computers use heat pipe radiators to improve the heat dissipation capacity of the radiator to ensure the normal temperature of the CPU.

[0003] Electromagnetic heating technology mainly utilizes electromagnetic wire to generate an alternating magnetic field after an alternating current passes through it, which acts on a metal heating body with magnetic conductivity, generating countless eddy currents on the metal heating body to generate heat and increase the temperature. Civilian and commercial small and medium-power electromagnetic induction heating products such as induction cookers and steam generators are widely used by people, especially induction cookers, which have the highest penetration rate. Semiconductor refrigerators, also known as electronic refrigerators, use PN junctions made of special semiconductor materials to form thermocouple pairs, produce Peltier effect, and are made into sheets. When direct current passes through them, energy transfer occurs. When current flows from the N-type element to the joint of the P-type element, it absorbs heat to form a cold end. When current flows from the P-type element to the joint of the N-type element, it releases heat to form a hot end. People use its characteristics of generating heat on one side and cooling on the other to apply it to electrical appliances including car-mounted small refrigerators, electrical cabinets, constant temperature cabins, and equipment in the military and medical industries.

[0004] The heat source of the radiator used in a general air conditioner mostly comes from a PTC heater. The PTC heater is essentially a resistive heating method. The heating efficiency is proportional to the current, which has the problem of being relatively power-consuming. In addition, the power of the PTC heater generally decays after long-term use. Poor quality PTC heating sheets may even decay to the point where they cannot be used. The heat source of this type of radiator is mostly single.

[0005] At present, some semiconductor air conditioners have begun to appear on the market, such as Gree Electric's patent (202020599490.2) semiconductor heat exchanger assembly and semiconductor air conditioner and some semiconductor air conditioners. Most of these semiconductor heat exchangers use fin-type heat exchangers, which are mainly composed of multiple spaced heat dissipation fins combined with a heat receiving substrate at one end. The heat receiving substrate is mostly solid. The heat receiving substrates of the two heat exchangers are sandwiched with multiple semiconductor cooling sheets to form a semiconductor heat exchanger. This type of heat exchanger The heat conduction method is that after the substrate is heated, the heat energy is transferred to the inner end of the fin, and then transferred to the outer end of the fin. Its thermal conductivity is greatly affected by the metal material and the height and thickness of the fin. Copper has good thermal conductivity but high cost, while aluminum and aluminum alloy have low cost and poor thermal conductivity. When the fin is too thick, the manufacturing cost is high, and the gap between the fins becomes smaller, affecting the ventilation efficiency. When the fin (or fin stacking) is too high, the temperature difference between the inner and outer ends of the fin increases, and the heat transfer efficiency further deteriorates, affecting the working efficiency of the heat exchanger. Moreover, the heat source of the heat exchangers of these semiconductor air conditioners all comes from the work of the semiconductor refrigeration sheets, and the heat source is single. As the number of semiconductor refrigeration sheets increases, the cost increases and the increase in electricity resources further increases. Long-term use will reduce the service life of the semiconductor refrigeration sheets. Summary of the invention

[0006] The present invention provides a heat sink to solve or improve the problem that the heating method used by the heat sink used in the air conditioner in the prior art is relatively power-consuming, or the heat conduction structure of the semiconductor heat exchanger is not ideal and the heat conduction efficiency is poor, or the heat source of these semiconductor heat exchangers is single, or one of the above problems.

[0007] A heat sink comprises a heating body and a heat sink, wherein the heat sink is composed of a heating body and a heat sink, and the pipe bodies and pipe ports of heat conduction pipes with fins attached in series are respectively connected with the heating body.

[0008] The heating body includes a rectangular or arc-shaped cavity-shaped heating body.

[0009] The side wall of the heating body is provided with through holes and / or through channels and / or is provided with pipe joints, and the through channels are rectangular or circular in shape.

[0010] The heat sink is composed of the heat conducting pipe bodies connected in series and fitted with the fins.

[0011] The heat-conducting pipe includes a heat-conducting U-tube or a heat-conducting straight pipe.

[0012] The pipe openings of the heat-conducting pipe body are respectively connected with the through holes on the heating body.

[0013] The heat-conducting pipe and the heating body are filled with heat-conducting liquid including superconducting liquid.

[0014] The heating body includes at least one heating body.

[0015] The heat conducting pipe includes no less than two heat conducting pipes.

[0016] The fins are multiple and arranged at intervals and are rectangular or arc-shaped.

[0017] The heating body comprises a metal cavity with magnetic conductivity and the heating body is wound with electromagnetic wire.

[0018] A semiconductor heat sink is formed by sandwiching a plurality of semiconductor cooling sheets between at least two of the heat sinks or left-right or up-and-down heating bodies.

[0019] The semiconductor plus the heat sink are respectively a hot end plus the heat sink and a cold end plus the heat sink.

[0020] The hot end with a heat sink and the cold end with a heat sink are switched by controlling the polarity conversion of the positive and negative poles of the semiconductor refrigeration plate through an electromagnetic switch.

[0021] The heat source of the heat sink includes electromagnetic heating.

[0022] The heat source of the semiconductor heat sink includes electromagnetic heating or semiconductor cooling sheet.

[0023] The heat sink is made of a metal material such as iron, copper, aluminum or alloy.

[0024] The beneficial effect of the present invention is that a heat sink is connected in series through a heat-conducting pipe body such as a heat-conducting U-tube or a heat-conducting straight pipe and a heat sink composed of fitted fins and a cavity-shaped heating body, and a heat-conducting liquid including a superconducting liquid is arranged in the heat-conducting pipe and the heating body. The application of heat pipe technology can increase the height of the heat sink to increase the heat exchange area, and the temperature difference formed at the inner end and the outer end of the heat sink is relatively small, which can improve the heat dissipation capacity of the heat sink and the heat dissipation and cooling capacity of the semiconductor heat sink. Compared with the PTC heating method used as the heat source of the heat exchanger on a general air conditioner, which has the problem of being more power-consuming, the present radiator adopts the electromagnetic heating method of the electromagnetic wire wound on the heating body. The electromagnetic wire itself is not electrified, has a high safety factor, is easy to control the temperature, has high heating efficiency, and can work for a long time and has a long service life. After a plurality of semiconductor cooling plates are sandwiched between the two heating bodies of the radiator relative to each other or in an up-and-down or left-and-right shape to form a semiconductor radiator, it has a dual heating function mode of either electromagnetic heating or semiconductor cooling plate heating. In the hot air mode dominated by electromagnetic heating, the semiconductor cooling plate is in a stopped state, which can greatly improve the service life of the semiconductor cooling plate and reduce the waste of electricity resources. The pipe joint included on the heating body can provide either heat energy or cold energy to the external device through an external pipe, or provide either heat energy or cold energy to the radiator through the hot liquid or cold liquid flowing through the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the structure of a dual-heating body with a radiator in some embodiments of the present invention.

[0026] Figure 2 This is a schematic structural diagram of a radiator-added dual-heating body with a pipe joint in some embodiments of the present invention.

[0027] Figure 3 This is a schematic diagram of the structure of a radiator when a U-shaped single heating body is horizontal in some embodiments of the present invention.

[0028] Figure 4 This is a schematic structural diagram of a radiator when a U-shaped single heating body is vertical in some embodiments of the present invention.

[0029] Figure 5 It is a schematic diagram of the structure of a heat sink when the double rectangular heating body is horizontal in some embodiments of the present invention.

[0030] Figure 6 This is a schematic diagram of the structure of a heat sink when the double-arc shaped heating body is vertical in some embodiments of the present invention.

[0031] Figure 7 This is a schematic diagram of the structure of two U-tube-type heat sinks sandwiching a semiconductor refrigeration plate in some embodiments of the present invention.

[0032] Figure 8 It is a schematic diagram of the structure of two straight tubes with pipe joints and a heat sink sandwiching a semiconductor cooling plate in an upper and lower shape in an embodiment of the present invention.

[0033] Fig. 9This is a schematic diagram of the structure of two U-tube-type heat sinks sandwiching a semiconductor refrigeration sheet in some embodiments of the present invention.

[0034] Fig.10 This is a schematic diagram of the structure of two straight tubes with pipe joints and a heat sink sandwiching a semiconductor cooling plate on the left and right in some embodiments of the present invention.

[0035] Fig.11 This is a schematic structural diagram of some embodiments of the present invention in which two U-tube-type radiators are respectively sandwiched between semiconductor refrigeration plates with double heating body-type radiators.

[0036] Fig.12 Schematic diagram of the structure of a heating body with a through channel in some embodiments of the present invention.

[0037] Reference numerals: 1 heat-conducting straight tube 2 heat-conducting U tube 3 heating element A1 4 fin B1 5 heating element A2 6 heating element A3 7 fin B3 8 electromagnetic wire 9 semiconductor cooling sheet 10 heating element A4 11 through hole 12 through channel 101 U tube type plus radiator 102 straight tube type plus radiator 103 straight tube type with pipe joint plus radiator DETAILED DESCRIPTION

[0038] The following is a further detailed description of a heat sink and a semiconductor heat sink of the present invention in conjunction with the accompanying drawings and embodiments and some embodiments.

[0039] Refer to Figures 1 to 6 A heat sink in some of the embodiments shown is a heat sink composed of a heating body and a heat sink, wherein the tube ports of metal heat-conducting tubes connected in series and fitted with metal fins are respectively connected to the metal cavity, the heating body includes a rectangular or arc-shaped cavity-shaped heating body, and has at least one row of multiple equidistant and spaced through holes 11 on one side wall of the cavity-shaped heating body, wherein heating body A1 3 is a rectangular heating body, heating body A2 5 is a rectangular heating body with a pipe joint, heating body A3 6 is an arc-shaped heating body, heating body A4 10 is a heating body with a through channel, the heat sink includes a heat sink composed of or a heat-conducting U-tube 2 tube body connected in series and fitted with fins B1 4, or a heat sink composed of or a heat-conducting straight tube 1 tube body connected in series and fitted with fins B1 4 or fins B3 7, a plurality of fins are arranged in an interval, and gaps for air flow to pass through are formed between the interval-shaped fins to take away the energy of the heat sink.

[0040] Reference Figure 1In some embodiments, the vertical dual-heating body plus radiator heating body includes a rectangular heating body A1 3 with magnetic conductivity, and at least two of the plurality of heat-conducting straight tubes 1 are respectively connected in series and fitted in the through holes 11 on the fins B1 4 having at least one row of multiple through holes 11 equidistantly and spaced apart. The two end ports of at least two of the plurality of heat-conducting straight tubes 1 are respectively fixedly connected with the openings of the multiple through holes 11 in the heating body A1 3 having at least one row of multiple through holes 11 equidistantly and spaced apart on the side wall. In this embodiment, the two heating bodies are arranged in an up-and-down shape, and in some embodiments, the two heating bodies are arranged in a left-and-right shape. Preferably, a heat-conducting liquid including a superconducting liquid is filled in the body of the heat-conducting straight tube 1 and the body of the heating body A1 3 to increase the heat-conducting efficiency of the heat sink. Preferably, an electromagnetic wire 8 is wound around the outer peripheral wall of the heating body A1 3 at one end. In this embodiment, the heat source added to the radiator is provided by electromagnetic heating.

[0041] Reference Figure 2 , in some embodiments, Figure 2 for Figure 1 The improved embodiment of the double heating body type radiator with pipe joints mainly differs in that the heating body A2 5 is a radiator with pipe joints, including an inlet pipe joint and / or an outlet pipe joint, which are respectively arranged diagonally on the vertical side walls of the outer ends of the upper and lower heating bodies of the radiator, and the pipe openings of the pipe joints are arranged outward in opposite directions. In this embodiment, the specific arrangement positions of the inlet pipe joint and the outlet pipe joint are not limited. The heat-conducting straight pipe 1 and the heating body A1 3 provide the radiator with heat energy or cold energy through the liquid including water in the pipeline connected to the pipe joint, or the liquid including water flowing through the radiator takes away the heat energy or cold energy on the working radiator, and provides heat energy or cold energy to the external device or equipment through the pipeline connected to the pipe joint. Preferably, an electromagnetic wire 8 is wound around the outer peripheral wall of the heating body A1 3 having magnetic conductivity. In this embodiment, the heat sink is in a dual heat source mode, and its heat source is provided by either electromagnetic heating or a fluid including water with thermal energy.

[0042] Reference Figure 3 and Figure 4The heating body of the single-heating-body U-tube type plus radiator includes a rectangular heating body A1 3 with magnetic conductivity. The tube openings of the same-side ends of multiple heat-conducting U-tubes 2 are distributed at intervals, and are connected in series and fitted into the through holes of multiple fins B1 4 having at least two rows of multiple through holes that are evenly spaced and distributed at intervals. The tube openings of the multiple heat-conducting U-tubes 2 are respectively fixedly connected to the through holes 11 openings of the heating body A1 3 having at least two rows of multiple through holes 11 that are evenly spaced and distributed at intervals on the side wall in a relative state. Preferably, a heat-conducting liquid including a superconducting liquid is filled into the body of the heat-conducting U-tube 2 and the body of the heating body A1 3 to increase the energy-conducting efficiency of the heat sink. Preferably, an electromagnetic wire 8 is wound around the outer peripheral wall of the heating body A1 3 . In this embodiment, the heat source added to the radiator is provided by electromagnetic heating. Figure 3 and Figure 4 The main difference of adding a radiator is that Figure 3 It is horizontal with radiator. Figure 4 Add a radiator to the vertical shape, so that users can choose the appropriate one according to different scenes and needs. Figure 3 The horizontal shape shown with a heat sink or Figure 4 The vertical shape shown has a radiator.

[0043] Reference Figure 5 In some embodiments, the heating body of the horizontal double-heating body type plus a radiator includes a rectangular heating body A1 3 with magnetic conductivity, which is respectively connected in series and fitted in the through holes on the fins B1 4 having at least one row of multiple through holes equidistantly and spaced apart on the tube bodies of at least two multiple heat-conducting straight tubes 1. The two end ports of at least two multiple heat-conducting straight tubes 1 are respectively fixedly connected to the openings of multiple through holes 11 in the heating body A1 3 having at least one row of multiple through holes 11 equidistantly and spaced apart on the side walls. In this embodiment, the two heating bodies are distributed in a left-right shape. Preferably, a heat-conducting liquid including a superconducting liquid is filled in the body of the heat-conducting straight tube 1 and the body of the heating body A1 3 to increase the heat-conducting efficiency of the heat sink. Preferably, an electromagnetic wire 8 is wound around the outer peripheral wall of the heating body A1 3 at one end or both ends. In this embodiment, an electromagnetic wire 8 is wound around the outer peripheral wall of the heating body A1 3 at both ends.

[0044] Reference Figure 6In some embodiments, the heating body of the double-arc heating body plus radiator includes an arc-shaped heating body A3 6 with magnetic conductivity, which is respectively connected in series and fitted on the through holes on the fins B3 7 with at least one row of multiple through holes that are equidistant and spaced apart on the tube bodies of at least two multiple heat-conducting straight tubes 1. The two end ports of at least two multiple heat-conducting straight tubes 1 are respectively fixedly connected to the openings of multiple through holes 11 in the heating body A3 6 with at least one row of multiple through holes 11 that are equidistant and spaced apart on the side walls, wherein the arc shape, curvature and size of the arc-shaped heating body are respectively matched with the arc shape, curvature and size of the arc-shaped fins. Preferably, a heat-conducting liquid including a superconducting liquid is filled into the body of the heat-conducting straight tube 1 and the body of the heating body A3 6 to increase the heat-conducting efficiency of the heat exchanger. Preferably, the outer peripheral wall of the heating body 8A3 at one end or both ends is wound with an electromagnetic wire 9. In this embodiment, the outer peripheral wall of the heating body A13 at both ends is wound with an electromagnetic wire 8 respectively.

[0045] Reference Figures 1 to 6 In some embodiments, when the electromagnetic wire 8 wound around the outer peripheral wall of the heating body passes through an alternating current generated by an electromagnetic generator electrically connected, an alternating magnetic field is generated to act on the metal heating body with magnetic conductivity to generate eddy current effect and generate heat. The heat energy is transferred to the fins mounted on the heat pipe body through the heat pipe connected to the heating body and the heat-conducting fluid including superconducting fluid in the heat pipe, so that the radiator is heated and the temperature is increased.

[0046] Reference Figures 1 to 6 The heat sink shown is composed of a heating body, a heat conducting tube and fins, and is made of metal materials such as iron, copper, aluminum or alloy.

[0047] The radiator combines the heating body and the heat sink together, and after the electromagnetic wire is wound on the heating body, it has the high thermal conductivity of the heat pipe and the high electrothermal performance of the electromagnetic heating. Within a certain range of the heat pipe height, the height of the radiator can be made relatively large, so that the heat dissipation area formed by the heat sink is also relatively large, and the temperature difference between the inner end heat sink and the outer end heat sink of the radiator due to the heat pipe effect is relatively small, and the heat dissipation efficiency is relatively high. It is used in electrical appliances including heaters and devices and equipment requiring hot air, and can passively dissipate heat, and can actively dissipate heat with the assistance of a fan. Compared with the problem of power attenuation of PTC radiators after long-term use, the electromagnetic heating used is one of the heating methods with the highest electrothermal conversion efficiency on the market. In addition, since the electromagnetic wire itself does not generate heat, there is no risk of electric shock, the service life is long, and the temperature can be easily and accurately controlled, so the maintenance cost is low.

[0048] Reference Figures 7 to 11 In this embodiment and some embodiments, Figures 1 to 6 Any of the heat sinks and semiconductor cooling sheet 9 shown in the figure can be combined into semiconductor heat sinks of different structural types. According to the characteristics of semiconductor cooling sheet 9 that one side heats and the other side cools, the semiconductor heat sink sandwiched with semiconductor cooling sheet 9 forms a cold end heat sink and a hot end heat sink with cold energy and heat energy respectively. The thermal conductivity and heat exchange area of ​​these heat pipe type semiconductor heat sinks are better than the thermal conductivity and heat exchange area of ​​fin type semiconductor heat exchangers, and the cold end heat sink and the hot end heat sink are sandwiched in at least one row in an up-and-down or left-and-right shape. There are multiple semiconductor refrigeration plates 9. At this time, the cold-end radiator and the hot-end radiator have their cold-end cooling surface and hot-end cooling surface arranged in the same vertical direction or in the same horizontal direction, so it is convenient to arrange a blowing device including a wind wheel behind the semiconductor radiator and an air guiding device and an air outlet device including an air guide plate and a fan at the front. The air flow blown by the blowing device takes away the heat energy and cold energy on the radiator respectively, the air outlet device blows the required hot air or cold air to the required space, and the air guiding device guides the unnecessary hot air or cold air out of the required space.

[0049] Reference Figure 7 In some embodiments, the outer bottom surfaces of the heating bodies of two U-tube radiators 101 are arranged opposite to each other, and a plurality of semiconductor cooling sheets 9 including at least one row are sandwiched and mounted between the upper and lower heating bodies of the first radiator 101 and / or the second radiator 101 to form a heating and cooling device, wherein the hot end surfaces and the cold end surfaces of the plurality of semiconductor cooling sheets 9 are respectively arranged in the same direction, and thermal conductive silicone grease is applied on the mounting surface of the semiconductor cooling sheet 9 and the heating body surface to improve the thermal conductivity of the heating body, and the first radiator 101 and / or the second radiator 101 are connected together through a connecting piece. In this embodiment, the specific structure of the heat sink 101 is as shown in

[0042] . Figure 3 The difference lies in the different arrangement of the electromagnetic wire 8 wound on the heating body. The surface of the semiconductor refrigeration plate 9 mounted on the heating body surface of the first radiator 101 at the upper end is the cold end surface. Similarly, the surface of the semiconductor refrigeration plate 9 mounted on the heating body surface of the second radiator 101 at the lower end is the hot end surface. When the semiconductor refrigeration plate 9 is in working state, the first radiator 101 at the upper end has cold energy, and the second radiator 101 at the lower end has heat energy.

[0050] Reference Fig.12Since the semiconductor heat sink in this embodiment is a U-tube single-heating semiconductor heat sink, the heating body needs to be mounted with a semiconductor cooling sheet 9 so that the semiconductor cooling sheet 9 can provide heat and cold energy for the heat sink. When the user needs heat energy, in order to extend the service life of the semiconductor cooling sheet 9 and reduce the waste of power resources, electromagnetic heating is used to provide heat energy for the user. In order to allow the heating body to be wound with an electromagnetic wire 8, the heating body in the heat sink of this embodiment is Fig.12 The heating body A4 10 shown has a through channel 12, so that the electromagnetic wire 8 can be wound around the heating body through the through channel 12, so that the wound electromagnetic wire 8 does not affect the mounting of the semiconductor refrigeration sheet 9, and can realize the electromagnetic heating method of the semiconductor plus heat sink, so that the semiconductor plus heat sink has a dual heat source mode of semiconductor heating or electromagnetic heating. Specifically, multiple rectangular or circular through holes that are opposite to each other and can penetrate each other are arranged at intervals on the vertical side walls on both sides that are perpendicular to the end wall of one side with the through hole 11. These through holes are connected to the internal space of the cavity of the heating body A410. Furthermore, rectangular or circular segmented metal tubes that are compatible with the shape and size of these through holes are respectively adhered and inserted into these opposite through holes, and the joints between the tubes and the through holes are welded and sealed to prevent the leakage of liquid in the cavity and form through channels 12. Preferably, these through channels 12 are respectively located vertically upward at the middle position of two vertically adjacent through holes 11 on the left and right, so as to facilitate the winding of the electromagnetic wire 8 through these through channels 12 between two adjacent heat pipes.

[0051] Reference Figure 8 In this embodiment, two heating bodies with a pipe joint type radiator 103 are arranged relative to each other with their heating body mounting surfaces being opposite to each other, and a plurality of semiconductor cooling sheets 9 including at least one row are sandwiched and mounted between the upper and lower first radiator 103 and / or the second radiator 103 to form a heating and cooling device, wherein the hot end faces and cold end faces of the plurality of semiconductor cooling sheets 9 are respectively arranged in the same direction, and thermal conductive silicone grease is applied on the mounting surfaces of the semiconductor cooling sheets 9 and the heating bodies to improve the thermal conductivity of the heating bodies, and the first radiator 103 and / or the second radiator 103 are connected together by a connector, and the radiators are provided with heat energy or cold energy by a liquid including water in a pipeline connected to the pipe joint. In this embodiment, the specific structure of the heat sink 103 is as shown in

[0041] . Figure 2As described, the liquid inlet pipe joint and the liquid outlet pipe joint on the first radiator 103 and the second radiator 103 are respectively diagonally arranged on the outer side walls at both ends of the heating body and the pipe openings are parallel to the outside. The pipe joint on the inner end of the heating body mounted on the semiconductor refrigeration sheet 9 is the inlet end pipe joint, and the pipe joint on the outer end of the heating body is the outlet end pipe joint. The surface where the heating body of the first radiator 103 at the upper end is mounted on the semiconductor refrigeration sheet 9 is the cold end surface. Similarly, the surface where the heating body of the second radiator 103 at the lower end is mounted on the semiconductor refrigeration sheet 9 is the hot end surface. When the semiconductor refrigeration sheet 9 is in working state, the first radiator 103 at the upper end has cold energy, and the second radiator 103 at the lower end has heat energy. In order to utilize the heat energy and cold energy generated when the semiconductor radiator is working, the pipe joints on the first radiator 103 at the upper end are connected to the pipelines that require cooling, and the liquid including water in the pipelines and the radiator takes away the cold energy on the first radiator 103. Similarly, the pipe joints on the second radiator 103 at the lower end are connected to the pipelines that require heating, and the liquid including water in the pipelines and the radiator takes away the heat energy on the second radiator 103.

[0052] Preferably, an electromagnetic wire 8 can also be wound around the heating body with magnetic conductivity at the outer end of the second radiator 103 at the lower end of the semiconductor radiator in this embodiment to utilize the high electrothermal conversion rate of electromagnetic heating to save electricity resources. Therefore, the semiconductor radiator is a dual heat source mode of either semiconductor refrigeration plate heating or electromagnetic heating. When the semiconductor radiator in this embodiment is in hot air mode, the heating method is mainly electromagnetic heating, and the semiconductor refrigeration plate 9 is in a stopped state to extend the service life of the semiconductor refrigeration plate 9 and save electricity resources. Since the semiconductor radiator has the characteristic that the lower the temperature at the hot end, the lower the temperature at the cold end, when the heat dissipation of the hot end radiator is poor, the temperature of the cold end radiator will increase. In this embodiment, when the semiconductor radiator is in cold air mode, the electromagnetic heating is stopped, and since the fluid flowing through the radiator passes through the external pipeline and the heat exchanger with a fan in the pipeline, it can circulate and carry away the heat energy generated by the semiconductor radiator. The combined flow of air blowing through the fins of the radiator can significantly reduce the temperature of the hot end radiator, so that the radiator at the cold end can obtain a lower temperature, bringing users a better experience when cooling down.

[0053] Reference Fig. 9 In some embodiments, the semiconductor heat sink is composed of two U-tube heat sinks 101 sandwiching a semiconductor cooling sheet 9. The specific structure of the heat sink 101 is referred to

[0042] . Figure 4The specific implementation method refers to

[0049] , the difference is that the semiconductor heat sink sandwiches the semiconductor cooling sheet 9 in different directions, the second heat sink 101 at the left end is a hot end heat sink, the first heat sink 101 at the right end is a cold end heat sink, and the heating body of the second heat sink 101 is Fig.12 The heater A410 type heater with a through channel 12 is shown, and an electromagnetic wire 8 is wound around the heater A410 of the second heat sink 101, so that the semiconductor heat sink in this embodiment has a dual heat source mode of either semiconductor heating or electromagnetic heating.

[0054] Reference Fig.10 In some embodiments, the semiconductor heat sink is composed of two pipe joint type heat sinks 103 sandwiching the semiconductor cooling sheet 9. The specific structure of the heat sink 103 is referred to

[0041] . Figure 2 The difference is that the inlet end pipe joint is vertically arranged on the upper outer wall of the inner end heating body of the radiator 103 mounted with the semiconductor cooling sheet 9, and the outlet end pipe joint is horizontally arranged on the lower outer side surface of the outer end heating body of the radiator 103. At this time, the pipe openings of the inlet end pipe joint and the outlet end pipe joint are oriented vertically, the inlet end pipe joints on the first radiator 103 and the second radiator 103 are arranged in parallel in the same direction, and the outlet end pipe joints are arranged in horizontal directions in the opposite direction. For the specific implementation method, refer to

[0051]

[0052] . The difference is that the radiator 103 is sandwiched between the semiconductor cooling sheet 9 on the left and right sides, the second radiator 103 on the left end is the hot end radiator, and the first radiator 103 on the right end is the cold end radiator. In some embodiments, the semiconductor heat sink is a dual heat source mode of heating or electromagnetic heating of a semiconductor refrigeration sheet. Specifically, an electromagnetic wire 8 is wound on the heating body at the outer end of the first heat sink 103 or the second heat sink 103. In this embodiment, an electromagnetic wire is wound on the heating body of the second heat sink 103, and an electromagnetic heating method of the electromagnetic wire 8 electrically connected to the electromagnetic generator is used to provide a heat source for the second heat sink 103. At this time, the semiconductor refrigeration sheet 9 is in a stopped state to extend the service life of the semiconductor refrigeration sheet 9, and the high electrothermal efficiency of electromagnetic heating is used to provide a heat source for the semiconductor heat sink, thereby reducing the waste of electricity resources. In this embodiment, the heat sink 103 at the left end is the second heat sink 103 at the hot end, and the heat sink 103 at the right end is the first heat sink 103 at the cold end. In some embodiments, electromagnetic wire is wound on the heating body of the first heat sink 103, the heat sink 103 at the left end is the first heat sink 103 at the cold end, and the heat sink 103 at the right end is the second heat sink 103 at the hot end.

[0055] In the above Figures 7 to 10In the embodiments shown, each is a sandwich surface type semiconductor plus heat sink. When the sandwich surface area of ​​the heating body remains unchanged, the number of semiconductor cooling plates that can be sandwiched is constant. In order to increase the heating and cooling capacity of the semiconductor plus heat sink, the number of sandwiched semiconductor cooling plates is increased by increasing the number of sandwich surfaces of the heating body, and the heating and cooling capacity can be doubled, thereby increasing the temperature control coverage volume range of the semiconductor plus heat sink.

[0056] Reference Fig.11 , double sandwich surface type semiconductor radiator, specifically, two U-tube type first radiators 101 are respectively arranged at the two ends of the double heating body type second radiator 102, and no less than two rows of multiple spaced semiconductor cooling plates 9 are respectively arranged between the heating body mounting surface of the first radiator 101 and the opposite heating body mounting surface of the second radiator 102, and thermal conductive silicone grease is applied on the mounting surface, and the first radiator 101 and the second radiator 102 are respectively connected together by connecting parts after the heating body is mounted with the semiconductor cooling plates 9. It should be noted that the surfaces of the semiconductor refrigeration sheets mounted on the heating bodies of the first radiators 101 at both ends are all in the same direction, either hot end surfaces or cold end surfaces. In this embodiment, the inner end mounting surface of the semiconductor refrigeration sheet 9 is the hot end surface, and the outer end mounting surface is the cold end surface. Thus, the second radiator located in the middle has heat energy, and the first radiators located on both sides have cold energy.

[0057] In this embodiment, in order to extend the service life of the semiconductor refrigeration sheet 9 and reduce the waste of electric power resources, the heating body of the second radiator 102 at the left end is an A4 10 type heating body and an electromagnetic wire 8 is wound around the heating body. In some embodiments, the heating body at the right end of the second radiator 102 is also an A4 10 type heating body and an electromagnetic wire 8 is wound around the heating body to obtain more electromagnetic heating heat, reduce the heating time and reduce the heating power, so that the semiconductor radiator has a dual heat source mode of either semiconductor heating or electromagnetic heating. Compared to Figures 7 to 10 The heat sink shown forms a single clamping surface for the semiconductor cooling plate 9. In this embodiment, the heat sink clamps the semiconductor cooling plate 9 to form an interval-shaped double clamping surface, and the number of sandwiched semiconductor cooling plates is doubled. When the semiconductor heat sink is in working state, heat energy is generated on the second heat sink 102 in the middle, and cold energy is generated on the first heat sink 101 at both ends. Due to the doubling of the number of sandwiched semiconductor cooling plates, the semiconductor heat sink can generate more heating and cooling capacity.

[0058] exist Figures 7 to 11When the semiconductor radiator shown is used in air-conditioning equipment, a wind wheel in a blowing device is arranged behind the radiator, and an air guide device and an air outlet device are respectively arranged in front of the radiator. When the terminal ends of multiple semiconductor refrigeration plates 9 in the semiconductor radiator are electrically connected in series or in parallel and a direct current is passed through them, cold energy is generated at the cold end surface of the semiconductor refrigeration plate 9 and heat energy is generated at the hot end surface. These heat energy or cold energy are respectively transferred to the fins through the heating body, the heat pipe and the heat-conducting liquid in the heat pipe, so that the first radiator 101 has heat energy and the second radiator 102 has cold energy, or the first radiator 101 has cold energy and the second radiator 102 has heat energy.

[0059] In this embodiment and some other embodiments, due to the characteristics of the semiconductor cooling sheet 9, one side generates heat energy while the other side also generates cold energy. In practical applications, people often only use the generated heat energy or cold energy, and need to discharge the unnecessary heat energy or cold energy through the air guide device. Figures 7 to 11 When the semiconductor heat sink shown is used in electrical appliances and / or equipment such as air conditioners, it is necessary to set corresponding horizontal or vertical wind guide plates and different numbers of wind guide ports in the shell according to the different setting structures of the heat sink or the semiconductor refrigeration plate 9 sandwiched in an up-and-down or left-and-right shape. The required hot air or cold air is guided to the air outlet through the wind guide plate, and the unnecessary hot air or cold air is guided out of the shell through the air guide port and discharged to the outside through the exhaust duct. Since this application does not involve the requirements of the shell structure, the relevant shell structure is not described in detail. In some embodiments, the air guide plate connected to the reciprocating motor is a movable air guide plate, which is driven to rotate according to the user's selection or instruction to guide the hot air or cold air to the exhaust port. Since the movable air guide plate or the reciprocating motor has the risk of poor rotation or damage, the problem of failing to complete the conversion of the hot air or cold air direction cannot be completed. Therefore, in some embodiments, the air guide plate is fixed, and for the conversion of the hot air or cold air to the exhaust port, the conversion of the positive and negative polarities of the semiconductor refrigeration plate 9 is controlled by setting an electromagnetic switch, and the conversion of the hot air or cold air directed to the outlet is completed, which is convenient for people's needs for hot air or cold air in different environments and simplifies the shell structure.

[0060] It should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, various modifications, equivalent substitutions, improvements, etc. can be made without departing from the principles of the present invention, all of which belong to the scope of protection of the present invention.

Claims

1. A heat sink, characterized in that: include: The heat sink is composed of a heating body and a heat sink, wherein the pipe body and pipe openings of a heat-conducting pipe with fins attached in series are respectively connected to the heating body, and the heating body is sandwiched with a semiconductor cooling sheet and / or wound with an electromagnetic wire.

2. A heat sink according to claim 1, characterized in that: The heating body comprises a rectangular or arc-shaped cavity-shaped heating body, and the side wall of the heating body is provided with through holes and / or through channels and / or is provided with pipe joints, and the through channels are rectangular or circular.

3. A heat sink according to claim 1, characterized in that: The heat sink is composed of the heat conducting pipe bodies connected in series and fitted with the fins.

4. A heat sink according to claim 1, characterized in that: The heat-conducting pipe comprises a heat-conducting U-tube or a heat-conducting straight pipe, and the pipe openings of the heat-conducting pipe body are respectively connected to the through holes on the heating body.

5. A heat sink according to claim 4, characterized in that: The heat-conducting pipe and the heating body are filled with heat-conducting liquid including superconducting liquid.

6. A heat sink according to claim 1, characterized in that: The heating body includes at least one heating body, the heat-conducting pipe includes at least two heat-conducting pipes, and the fins are multiple and arranged at intervals and are in a rectangular shape or an arc shape.

7. A heat sink according to claim 1, characterized in that: The heating body comprises a metal body with magnetic conductivity and is wound with electromagnetic wires. The heat source of the heat sink comes from electromagnetic heating.

8. A heat exchanger according to any one of claims 1 to 7, characterized in that: The heat sink is made of a metal material such as iron, copper, aluminum or alloy.

9. A semiconductor heat sink, comprising a hot end heat sink and a cold end heat sink, and a semiconductor cooling sheet sandwiched between the hot end heat sink and the cold end heat sink, characterized in that: The hot-end radiator and / or the cold-end radiator is a radiator as described in any one of claims 1 to 7, and a plurality of semiconductor cooling sheets are sandwiched between the hot-end radiator and the cold-end radiator or the left-right or up-and-down heating bodies. The hot-end radiator and the cold-end radiator are switched by controlling the polarity conversion of the positive and negative poles of the semiconductor cooling sheets through an electromagnetic switch.

10. The semiconductor device with a heat sink according to claim 9, characterized in that: The heat source of the semiconductor heat sink includes electromagnetic heating or semiconductor cooling sheet.

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