Insulation module thermal shock test device for cryogenic storage and transportation and test method thereof

Abstract

The invention discloses an insulation module thermal shock test device for cryogenic storage and transportation and a test method thereof, and belongs to the technical field of insulation modules. Comprising the following steps: placing a test box in a ventilation state at normal temperature and normal pressure, and checking the sealing state of the test box; the method comprises the following steps: preparing at least one type of insulation block sample, checking the appearance of the sample, the states of a test box, hoisting equipment and a low-temperature tank, installing a test plate in the test box when the test box, the hoisting equipment and the low-temperature tank are all in a good state, putting the sample on the test plate in the test box in a hoisting manner through the hoisting equipment, closing a cover plate of the test box, and sealing the test box; thermal shock is conducted on the sample in the test box, the appearance state of the sample is checked in the test process and after the test is completed, when the appearance of the sample is free of cracks, surface protection and a reinforcing layer is free of delamination, the sample meets the standard, and otherwise, the sample does not meet the standard. The stability of the insulation module can be quickly judged through the thermal shock test.

Description

Technical Field

[0001] The invention belongs to the technical field of insulation modules, and in particular relates to a thermal shock test device and a test method for insulation modules used for deep-cold storage and transportation. Background Art

[0002] In the field of energy supply, LNG, as a relatively clean and efficient alternative to fossil energy, has a growing demand for large-scale transit and long-term storage; in the emerging hydrogen energy industry, liquid hydrogen, as a highly potential clean energy carrier in the future, has a huge demand for storage and transportation, whether in high-end application scenarios such as space launches or in civilian fields such as hydrogen fuel cell vehicles that are expected to be popular in the future. The same is true for the chemical industry, where many production processes rely on specific deep-cold liquefied gases as raw materials or reaction media, and their stable and safe storage and transportation is the key to ensuring the continuity of chemical production.

[0003] However, in existing multi-layer composite structures, different material layers are connected by adhesives or simple sealing structures. Under long-term or frequent thermal shocks, interface stratification and debonding are prone to occur. In addition, the thermal expansion coefficients of different materials vary greatly. For example, the thermal expansion coefficient of polyurethane foam is relatively high, while the thermal expansion coefficient of metal or non-metal materials composited with it is low. When encountering thermal shock, the expansion and contraction degree of each layer of material due to temperature change is inconsistent, and a large stress will be generated at the interface. This stress repeatedly acts and may damage the polyurethane material, thereby affecting the thermal insulation performance. Summary of the invention

[0004] Purpose of the invention: To provide a thermal shock test device and a test method for an insulation module used for cryogenic storage and transportation, so as to solve the above-mentioned problems existing in the prior art.

[0005] Technical solution: A test method for thermal shock of insulation modules used in cryogenic storage and transportation, comprising the following steps: Test conditions: Place the test chamber in a ventilated state at normal temperature and pressure, and check the sealing status of the test chamber; Prepare at least one type of insulating block sample, at least three insulating blocks of each type, marked as N1, N2...Nn respectively; Test steps: First, inspect the appearance of the sample, check the test box, lifting equipment and cryogenic tank. When the test box, lifting equipment and cryogenic tank are in good condition, install a test board in the test box, and use the lifting equipment to lift the sample onto the test board in the test box. After the sample is placed in the center of the test box, the cover of the test box is closed, and the sample in the test box is subjected to thermal shock. During and after the test, check the appearance of the sample. When there are no cracks on the surface of the sample, and there is no delamination of the surface protection and reinforcement layer, it meets the standard. Otherwise, it does not meet the standard.

[0006] Preferably, in the test steps, the thermal shock process is as follows: When sample N1 is placed in the test chamber, a low-temperature medium is injected into the test chamber. During the injection of the low-temperature medium, the intelligent PID regulator is used to control the flow rate and temperature of the low-temperature medium injection and the liquid level of the low-temperature medium in the test chamber. After the injection of the low-temperature medium is completed, the sample is soaked in the low-temperature medium for 20-30 minutes. After the soaking is completed, the soaked sample is taken out and placed at room temperature for 2-3 hours, then placed in the test chamber for soaking again and then taken out and placed. After repeated soaking for 5-20 times, the test sample M1 is obtained. The remaining samples are subjected to the above steps one by one, and a thermal shock test is performed to obtain the test sample Mn.

[0007] Preferably, during the immersion of the sample in the low-temperature medium for 20-30 minutes, the low-temperature medium is replenished in the test chamber by controlling the flow rate, temperature or liquid level, so that the low-temperature medium is kept within a predetermined range during the immersion of the sample.

[0008] Preferably, the temperature control process is as follows: The temperature value in the test box is read by a temperature sensor arranged in the test box and transmitted to the intelligent PID regulator. The target temperature value is set on the intelligent PID regulator. When the intelligent PID regulator receives the numerical signal of the temperature sensor, the received numerical signal is converted into a DC4-20mA standard control signal, and the target temperature value signal set by the intelligent PID regulator is used as a 4-20MA signal to control the opening and closing of the medium source valve, so that the temperature in the test box can be automatically PID adjusted and controlled to keep the temperature in the test box within a predetermined range.

[0009] Preferably, the flow control process is as follows: open the medium source valve to inject the low-temperature medium into the test box, and set the target flow on the intelligent PID regulator. By obtaining the value of the flow meter set in the test box, and converting the obtained flow meter value into a DC4-20mA standard control signal, the intelligent PID regulator uses the target flow signal as a 4-20MA signal to control the opening and closing of the medium source valve, thereby automatically PID adjusting and controlling the low-temperature medium flow in the test box, so that the low-temperature medium in the test box is kept within a predetermined range.

[0010] Preferably, the liquid level control process is as follows: The low-temperature medium in the test chamber is controlled by a liquid level gauge installed in the test chamber so that the sample is immersed in the low-temperature medium; The liquid level value in the test box is obtained by a liquid level sensor arranged in the test box and transmitted to the intelligent PID regulator. The upper and lower limits of the target liquid level are set on the intelligent PID regulator. When the intelligent PID regulator receives the numerical signal of the liquid level sensor, it converts the received numerical signal into a DC4-20mA standard control signal, and controls the opening and closing of the medium source valve with the upper and lower limit value signals of the target liquid level set by the intelligent PID regulator as a 4-20MA signal, so that the liquid level in the test box can be automatically PID-regulated and controlled to keep the liquid level in the test box within a predetermined range.

[0011] A test device for thermal shock of an insulation module for cryogenic storage and transportation, comprising a tank body, the tank body is used to hold a medium, the output end of the tank body is connected to a stop valve through a pipeline, the output end of the stop valve is connected to a low-temperature electric flow valve, the output end of the low-temperature electric flow valve is connected to a low-temperature flow meter, the output end of the low-temperature flow meter is connected to a test box through a pipeline, the test box is a hollow structure with an open top, a cover body is rotatably installed at the open end of the test box, a connecting rod is installed on the cover body, a drive assembly is installed on one side of the test box, and the output end of the drive assembly is rotatable Connect the connecting rod, a lock body is installed on the side of the test box opposite to the drive assembly, the lock body is used to lock and limit the cover body, a drain pipe is installed on the side of the test box opposite to the low-temperature flow meter, and the medium in the test box is discharged from the test box through the drain pipe, a liquid level meter and a temperature sensor are installed in the test box, a control terminal is installed on the side of the test box opposite to the drive assembly, the drive assembly, the liquid level meter and the temperature sensor are all connected to the control terminal, and the low-temperature electric flow valve and the low-temperature flow meter are both connected to the control terminal. Preferably, Preferably, it also includes a threaded hole opened on the connecting rod, a screw rod is screwed in the threaded hole, a pressure plate is installed at the end of the screw rod located in the test box, and a turntable is installed at the other end of the screw rod.

[0012] Beneficial effects: The present invention relates to a thermal shock test device and a test method for an insulation module used for cryogenic storage and transportation. By performing a temperature control test on the insulation module, the insulation module is made to have good thermal insulation performance, thereby preventing excessive loss of cold and ensuring that the liquid cargo is always in a suitable low-temperature liquid state; At the same time, the test verifies the failure of the insulation module after multiple loading and unloading and temperature changes during navigation, ensuring that the layers of material will not separate. When encountering thermal shock, the layers of material in the insulation module have inconsistent expansion and contraction degrees due to temperature changes, resulting in greater stress at the interface. When this stress acts repeatedly, it causes damage to the layers of material in the insulation module, thereby ensuring that the material maintains good thermal insulation properties. Through simulated thermal shock tests, the physical form of the insulation module under thermal shock can be quickly obtained to verify the stability of the insulation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of a driving assembly of the present invention; Figure 3 It is a schematic diagram of the test box of the present invention; Figure 4 is a cross-sectional view of the test box of the present invention; Figure 5 for Figure 4 Enlarged view of point A.

[0014] Figures 1 to 5 The figures are marked as follows: 1. tank body; 2. stop valve; 3. low-temperature electric flow valve; 4. low-temperature flow meter; 5. test chamber; 6. cover body; 7. connecting rod; 8. drive assembly; 9. lock body; 10. drain pipe; 11. liquid level meter; 12. temperature sensor; 13. control terminal; 14. screw rod; 15. pressure plate; 16. turntable. DETAILED DESCRIPTION

[0015] like Figures 1 to 5 As shown, the present invention provides a technical solution: a test method for thermal shock of insulation modules used in cryogenic storage and transportation, comprising the following steps: Test conditions: Place the test box 5 at normal temperature and pressure in a ventilated state, and check the sealing state of the test box 5; Prepare at least one type of insulating block sample, at least three insulating blocks of each type, marked as N1, N2...Nn respectively; Test steps: First, the appearance of the sample is tested, and the test box 5, the lifting equipment and the low-temperature tank are checked. When the test box 5, the lifting equipment and the low-temperature tank are in good condition, a test board is installed in the test box 5, and the sample is hoisted by the lifting equipment and placed on the test board in the test box 5. After the sample is placed in the center of the test box 5, the cover of the test box 5 is closed, and the sample in the test box 5 is subjected to thermal shock. The appearance of the sample is checked during and after the test. When there are no cracks on the surface of the sample, and the surface protection and reinforcement layers are not delaminated, it meets the standard. Otherwise, it does not meet the standard. That is, the insulation module verified by the test ensures that the layers of materials will not separate even in the case of material failure. When encountering thermal shock, the expansion and contraction degrees of the layers of materials of the insulation module due to temperature changes are inconsistent, and large stress is generated at the interface. When this stress acts repeatedly, it causes damage to the layers of materials of the insulation module, thereby ensuring that the material maintains good thermal insulation performance.

[0016] In a further embodiment, in the test step, the thermal shock process is as follows: When the sample N1 is placed in the test box 5, a low-temperature medium is injected into the test box 5. During the low-temperature medium injection process, the flow rate and temperature of the low-temperature medium injection are controlled by the intelligent PID regulator, wherein the temperature control process is as follows: The temperature value in the test box 5 is read by the temperature sensor 12 arranged in the test box 5 and transmitted to the intelligent PID regulator. The target temperature value is set on the intelligent PID regulator. When the intelligent PID regulator receives the numerical signal of the temperature sensor 12, the received numerical signal is converted into a DC4-20mA standard control signal, and the target temperature value signal set by the intelligent PID regulator is used as a 4-20MA signal to control the opening and closing of the medium source valve, so that the temperature in the test box 5 can be automatically PID-regulated and controlled to keep the temperature in the test box 5 within a predetermined range; The flow control process is as follows: Open the medium source valve to inject the low-temperature medium into the test box 5, and set the target flow rate on the intelligent PID regulator. By obtaining the value of the flow meter set in the test box 5 and converting the obtained flow meter value into a DC4-20mA standard control signal, the intelligent PID regulator controls the opening and closing of the medium source valve with the target flow signal as a 4-20MA signal, and the low-temperature medium flow in the test box 5 can be automatically PID-regulated and controlled to keep the low-temperature medium in the test box 5 within a predetermined range; While controlling the temperature and flow rate of the cryogenic medium, the liquid level of the cryogenic medium in the test box 5 is controlled. The liquid level control process is as follows: Using the liquid level meter 11 disposed in the test box 5, the low-temperature medium in the test box 5 is controlled so that the sample is immersed in the low-temperature medium; The liquid level value in the test box 5 is obtained by the liquid level sensor arranged in the test box 5 and transmitted to the intelligent PID regulator. The upper limit and lower limit of the target liquid level are set on the intelligent PID regulator. When the intelligent PID regulator receives the numerical signal of the liquid level sensor, it converts the received numerical signal into a DC4-20mA standard control signal, and controls the opening and closing of the medium source valve with the upper limit and lower limit value signals of the target liquid level set by the intelligent PID regulator as 4-20MA signals, so that the liquid level in the test box 5 can be automatically PID-regulated and controlled, so that the liquid level in the test box 5 is kept within a predetermined range; After the injection of the low-temperature medium is completed, the sample is soaked in the low-temperature medium for 20-30 minutes. During the soaking process, the low-temperature medium does not change, and the low-temperature medium and the sample do not react, but a small amount of evaporation will occur in the low-temperature medium. When a large amount of evaporation occurs in the low-temperature medium, the low-temperature medium is replenished in the test box 5 through temperature control, flow control or liquid level control. After the soaking is completed, the soaked sample is taken out and placed at room temperature for 2-3 hours, and then placed in the test box 5 for soaking again and then taken out and placed. After repeated soaking for 5-20 times, the test sample M1 is obtained, that is, the thermal shock test is completed on the test sample M1, and the remaining samples are subjected to the above steps one by one to perform thermal shock tests to obtain the test sample Mn.

[0017] In a further embodiment, during the immersion of the sample in the low-temperature medium for 20-30 minutes, the low-temperature medium is replenished in the test chamber 5 by controlling the flow rate, temperature or liquid level, and the low-temperature medium is controlled to remain within a predetermined range during the immersion of the sample. This can ensure that the sample is in a stable low-temperature environment, prevent excessive cooling or heating, improve experimental efficiency, and protect the integrity of the sample.

[0018] A test device for thermal shock of an insulating module for cryogenic storage and transportation, comprising a tank body 1, wherein the tank body 1 is used to contain a medium, in this embodiment, liquid nitrogen is contained, the output end of the tank body 1 is connected to a stop valve 2 through a pipeline, the output end of the stop valve 2 is connected to a cryogenic electric flow valve 3, the output end of the cryogenic electric flow valve 3 is connected to a cryogenic flow meter 4, the output end of the cryogenic flow meter 4 is connected to a test box 5 through a pipeline, the test box 5 is a hollow structure with an open top, a cover body 6 is rotatably installed at the open part of the test box 5, a connecting rod 7 is installed on the cover body 6, a drive assembly 8 is installed on one side of the test box 5, the output end of the drive assembly 8 is rotatably connected to the connecting rod 7, a lock body 9 is installed on the side of the test box 5 opposite to the drive assembly 8, The lock body 9 is used to lock and limit the cover body 6. A drain pipe 10 is installed on the side of the test box 5 opposite to the low-temperature flow meter 4, and the medium in the test box 5 is discharged from the test box 5 through the drain pipe 10. A liquid level meter 11 and a temperature sensor 12 are installed in the test box 5. A control terminal 13 is installed on the side of the test box 5 opposite to the drive component 8. The drive component 8, the liquid level meter 11 and the temperature sensor 12 are all communicatively connected to the control terminal 13. The low-temperature electric flow valve 3 and the low-temperature flow meter 4 are both communicatively connected to the control terminal 13. The control terminal 13 is used to obtain data signals of the liquid level meter 11 and the temperature sensor 12, and the opening and closing of the low-temperature electric flow valve 3 are adjusted to keep the low-temperature medium in the test box 5 within a predetermined range at all times.

[0019] In a further embodiment, it also includes a threaded hole, which is opened on the connecting rod, and a screw rod 14 is screwed in the threaded hole. A pressure plate 15 is installed at the end of the screw rod 14 located in the test box 5, and a turntable 16 is installed at the other end of the screw rod 14. When the test box 5 performs a thermal shock test on the insulation module, the cover body 6 seals and closes the test box 5, and at the same time applies external force to the turntable 16 to drive the screw rod 14 to rotate, so that the pressure plate 15 squeezes and fixes the insulation module in the test box 5.

[0020] The preferred embodiments of the present invention are described in detail above; however, the present invention is not limited to the specific details in the above embodiments. Within the technical concept of the present invention, various equivalent transformations can be made to the technical solutions of the present invention, and these equivalent transformations all belong to the protection scope of the present invention.

Claims

1. A test method for thermal shock of insulation modules used in cryogenic storage and transportation, characterized in that: The following steps are involved: Test conditions: Place the test box (5) in a ventilated state at normal temperature and pressure, and check the sealing state of the test box (5); Prepare at least one type of insulating block sample, at least three insulating blocks of each type, marked as N1, N2...Nn respectively; Test steps: First, the appearance of the sample is tested, and the conditions of the test box (5), the lifting equipment and the cryogenic tank are checked. When the test box (5), the lifting equipment and the cryogenic tank are all in good condition, a test board is installed in the test box (5), and the sample is hoisted by the lifting equipment and placed on the test board in the test box (5). After the sample is placed in the center of the test box (5), the cover of the test box (5) is closed, and the sample in the test box (5) is subjected to thermal shock. The appearance of the sample is checked during and after the test. When there are no cracks on the surface of the sample and no delamination of the surface protection and reinforcement layer, it meets the standard. Otherwise, it does not meet the standard.

2. A test method for thermal shock of insulation modules used for cryogenic storage and transportation according to claim 1, characterized in that: In the test steps, the thermal shock process is as follows: When the sample N1 is placed in the test box (5), a low-temperature medium is injected into the test box (5). During the injection of the low-temperature medium, the flow rate and temperature of the low-temperature medium injection and the liquid level of the low-temperature medium in the test box (5) are controlled by using an intelligent PID regulator. After the injection of the low-temperature medium is completed, the sample is soaked in the low-temperature medium for 20-30 minutes. After the soaking is completed, the soaked sample is taken out and placed at room temperature for 2-3 hours, and then placed in the test box (5) for soaking again and then taken out and placed. After repeated soaking for 5-20 times, the test sample M1 is obtained. The remaining samples are subjected to the above steps one by one, and a thermal shock test is performed to obtain the test sample Mn.

3. A test method for thermal shock of insulation modules used for cryogenic storage and transportation according to claim 2, characterized in that: During the immersion of the sample in the low-temperature medium for 20-30 minutes, the low-temperature medium is replenished in the test chamber (5) by controlling the flow rate, temperature or liquid level, so that the low-temperature medium is kept within a predetermined range during the immersion of the sample.

4. A test method for thermal shock of insulation modules used for cryogenic storage and transportation according to claim 2, characterized in that: The temperature control process is as follows: The temperature value in the test box (5) is read by a temperature sensor (12) arranged in the test box (5) and transmitted to the intelligent PID regulator. The target temperature value is set on the intelligent PID regulator. When the intelligent PID regulator receives the numerical signal of the temperature sensor (12), the received numerical signal is converted into a DC4-20mA standard control signal, and the target temperature value signal set by the intelligent PID regulator is used to control the opening and closing of the medium source valve in the form of a 4-20mA signal. The temperature in the test box (5) can be automatically PID-regulated and controlled, so that the temperature in the test box (5) is maintained within a predetermined range.

5. The test method for thermal shock of insulation modules used for cryogenic storage and transportation according to claim 2, characterized in that: The flow control process is as follows: open the medium source valve to allow the low-temperature medium to be injected into the test box (5), and set the target flow rate on the intelligent PID regulator. By obtaining the value of the flow meter set in the test box (5), and converting the obtained flow meter value into a DC4-20mA standard control signal, the intelligent PID regulator controls the opening and closing of the medium source valve with the target flow signal as a 4-20mA signal, thereby automatically PID adjusting and controlling the flow rate of the low-temperature medium in the test box (5), so that the low-temperature medium in the test box (5) is kept within a predetermined range.

6. A test method for thermal shock of insulation modules used for cryogenic storage and transportation according to claim 2, characterized in that: The liquid level control process is as follows: Using a liquid level meter (11) disposed in the test box (5), the low-temperature medium in the test box (5) is controlled so that the sample is immersed in the low-temperature medium; The liquid level value in the test box (5) is obtained by a liquid level sensor arranged in the test box (5) and transmitted to the intelligent PID regulator. The upper limit and lower limit of the target liquid level are set on the intelligent PID regulator. When the intelligent PID regulator receives the numerical signal of the liquid level sensor, it converts the received numerical signal into a DC4-20mA standard control signal, and controls the opening and closing of the medium source valve with the upper limit and lower limit value signals of the target liquid level set by the intelligent PID regulator as 4-20mA signals, so that the liquid level in the test box (5) can be automatically PID-regulated and controlled, so that the liquid level in the test box (5) is maintained within a predetermined range.

7. A test device for thermal shock of insulation modules used in cryogenic storage and transportation, characterized in that: The invention comprises a tank body (1), wherein the tank body (1) is used to contain a medium, wherein the output end of the tank body (1) is connected to a stop valve (2) via a pipeline, wherein the output end of the stop valve (2) is connected to a low-temperature electric flow valve (3), wherein the output end of the low-temperature electric flow valve (3) is connected to a low-temperature flow meter (4), wherein the output end of the low-temperature flow meter (4) is connected to a test box (5) via a pipeline, wherein the test box (5) is a hollow structure with an open top, wherein a cover body (6) is rotatably mounted at the open portion of the test box (5), wherein a connecting rod (7) is mounted on the cover body (6), wherein a drive assembly (8) is mounted on one side of the test box (5), wherein the output end of the drive assembly (8) is rotatably connected to the connecting rod (7), wherein the test box (5) and the drive assembly (8) are connected to each other. ) is installed with a lock body (9) on the side opposite to the cover body (6), and the lock body (9) is used to lock and limit the position of the cover body (6); a drain pipe (10) is installed on the side opposite to the test box (5) and the low-temperature flow meter (4), and the medium in the test box (5) is discharged from the test box (5) through the drain pipe (10); a liquid level meter (11) and a temperature sensor (12) are installed in the test box (5); a control terminal (13) is installed on the side opposite to the drive component (8) of the test box (5); the drive component (8), the liquid level meter (11) and the temperature sensor (12) are all connected to the control terminal (13) in communication; the low-temperature electric flow valve (3) and the low-temperature flow meter (4) are all connected to the control terminal (13) in communication.

8. The test device for thermal shock of insulation modules used for cryogenic storage and transportation according to claim 7, characterized in that: It also includes a threaded hole opened on the connecting rod, a screw rod (14) is screwed in the threaded hole, a pressure plate (15) is installed at the end of the screw rod (14) located in the test box (5), and a rotating disk (16) is installed at the other end of the screw rod (14).

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