Probe card, probe head, probe head manufacturing method, and electronic test device test by the probe card

Abstract

The invention provides a probe card, a probe head, a manufacturing method of the probe head and an electronic device tested by the probe card. The probe card comprises a circuit board, a space converter and a probe head. The probe head includes a probe pair, an insulating spacer, and a guide plate. Each of the two probes in the probe pair comprises a probe head part, a probe tail part and a probe body part which is located between the probe head part and the probe tail part and extends according to a longitudinal development axis. The respective probe body portions of the two probes can deflect and deform in an arcuate manner on the longitudinal development axis when the probes are loaded. The guide plate comprises a guide hole, two probes of the probe pair penetrate through the guide hole, and the diameter of the guide hole is larger than that of a grounding guide hole adjacent to the guide hole. The insulating spacer is coupled between the two probes, thereby maintaining a relative position between the two probes.

Description

Technical Field

[0001] The present invention relates to a probe card, a probe head, and a method for manufacturing the probe head. More specifically, the present invention relates to a probe card capable of reducing reflection loss between the probe card and an object to be tested (electronic device under test), a probe head, a method for manufacturing the probe head, and an electronic device under test tested by the probe card. Background Art

[0002] A probe card is a tool for testing the electrical properties of a semiconductor wafer or a packaged device, which generally includes at least a probe head, a space transformer, and a circuit board. The probe head may include a plurality of probes and a plurality of guide plates for fixing the plurality of probes, typically an upper guide plate and a lower guide plate. Each probe is disposed in a guide hole of the upper guide plate and the lower guide plate, and each guide hole prevents the probes therein from contacting each other due to excessive movement when contacting an electronic device under test (DUT) integrated in the semiconductor wafer, thereby allowing each probe to stably test the electrical performance of the electronic device under test.

[0003] Figure 1 FIG. 1 is a schematic diagram showing a guide plate 1 in a conventional probe head when viewed from above. Figure 1 The guide plate 1 may include a guide hole 101 and a guide hole 102, which may be used to accommodate a probe 111 and a probe 112 respectively. The probe 111 and the probe 112 may be a pair of differential probes, that is, the two probes may be used to transmit a pair of differential signals to the electronic device under test. The probe 111 and the probe 112 are respectively supported by the guide hole 101 and the guide hole 102 in the right direction of the figure.

[0004] In recent years, the demand for high-frequency / high-speed testing of electronic devices under test has been increasing day by day. As the data transmission rate in the test increases (for example, from 50 to 60 billion bits per second (Gbps) to more than 100 Gbps), the impedance matching (impedance matching) between the probe head as a whole and the electronic device under test has an increasingly significant impact on high-speed signal transmission. When the impedance of the test path (i.e., the signal transmission path) is not matched, the impact of return loss will become significant. Therefore, how to effectively improve the impedance matching between the probe head as a whole and the electronic device under test to reduce the impact of return loss on the test is a highly concerned issue in the technical field to which the present invention belongs. Summary of the invention

[0005] In order to at least solve the above technical problems, reducing the equivalent dielectric constant between a set of differential pair probes is a method that can theoretically improve the impedance matching between the probe head as a whole and the electronic device under test. Among the many methods of reducing the equivalent dielectric constant between two probes, the most direct and effective one is to reduce the spacing between the set of differential pair probes, but this approach is often limited by the spacing of the contact pads of the electronic device under test and cannot be changed at will. However, after further review, the inventor of this case found that the equivalent dielectric constant between a set of differential pair probes is greatly affected by the substance between the two probes. Therefore, if the equivalent dielectric constant is to be reduced, it is necessary to change the medium structure or content between the two probes. The inventor of this case first tried to dig a pair of guide holes on the guide plate for accommodating differential pair probes through each other to form a through enlarged guide hole, so that the medium between the two probes is only air. However, if the two guide holes are dug through in order to improve the electrical performance, the two probes will move excessively in the enlarged guide hole after digging through when they are subjected to force during the test, and even contact each other.

[0006] Figure 2 Dig through Figure 1 Schematic diagram of forming an enlarged guide hole by connecting two guide holes in the Figure 2 , originally in Figure 1 The guide holes 101 and 102 are formed by being bored toward each other. Figure 2 An enlarged guide hole 21 is formed in the probe card. Since the probes 111 and 112 are originally supported by the guide holes 101 and 102 on the right side of the figure, during the test, the probe 111 will inevitably move toward the probe 112 in the guide hole 21 after being dug through and contact the probe 112, which may cause a short circuit between the two probes, burnout of the probe needles, or even the burning of the entire probe card (circuit board). In view of this, how to reduce the equivalent dielectric constant between a pair of probes as much as possible during high-frequency testing while maintaining the relative position between the two probes to avoid contact with each other is a technical problem that needs to be solved in the technical field to which the present invention belongs.

[0007] In order to at least solve the above technical problems, the present invention provides a probe head. The probe head may include a probe pair, a first insulating spacer, and a first guide plate. The two probes in the probe pair each include a needle head, a needle tail, and a needle body portion extending between the needle head and the needle tail according to a longitudinal development axis, and the needle body portion of each of the two probes can be deflected and deformed in an arc shape on the longitudinal development axis when a load is applied to the corresponding probe. The first guide plate may include a first enlarged guide hole, wherein the two probes of the probe pair both pass through the first enlarged guide hole, wherein the aperture of the first enlarged guide hole is larger than the aperture of a grounding guide hole adjacent to the first enlarged guide hole on the first guide plate. The first insulating spacer may be arranged between the probe pair to maintain the relative position between the probe pair.

[0008] In order to at least solve the above technical problems, the present invention further provides a probe card. The probe card may include a circuit board, a space transformer and a probe head as described above. The space transformer may be arranged on the circuit board. The probe head may be arranged on the other side of the space transformer relative to the circuit board, and a needle tail of each probe in a probe pair in the probe head may be configured to be electrically connected to the space transformer.

[0009] In order to at least solve the above technical problems, the present invention further provides a method for manufacturing a probe head, which may include the following steps:

[0010] Placing the probes in parallel in pairs among the plurality of probes to form a plurality of probe pairs, wherein each probe pair is used to transmit a set of differential signals;

[0011] Among the plurality of probes, the probes are placed in pairs in parallel to form a plurality of probe pairs;

[0012] For each probe pair, align the two needle heads and the two needle tails of the two probes respectively;

[0013] For each probe pair, an insulating spacer is formed between the two probes of the same probe pair so that the insulating spacer is coupled to the two probes;

[0014] The plurality of needle tails and the plurality of needle heads of the plurality of probe pairs are respectively passed through an upper guide plate and a lower guide plate, thereby arranging the plurality of probe pairs between the upper guide plate and the lower guide plate, wherein:

[0015] At least one of the upper guide plate and the lower guide plate includes a plurality of enlarged guide holes, each of which accommodates a portion of the two probes included in one of the plurality of probe pairs and at least a portion of the insulating spacer between the two probes, and a hole diameter of each enlarged guide hole is larger than a hole diameter of a grounding guide hole adjacent to the same enlarged guide hole; and

[0016] At least one of the upper guide plate and the lower guide plate further includes a plurality of unenlarged guide holes, and each unenlarged guide hole accommodates a portion of one of the plurality of probes, so that the needle head or needle tail of each probe pair that is not coupled therebetween by the insulating spacer can pass through it alone.

[0017] In order to at least solve the above technical problems, the present invention further provides an electronic device under test, which uses a probe card to which the above probe head belongs to perform a high-frequency test procedure. The high-frequency test procedure uses a high-frequency signal to perform the test, and the high-frequency test procedure is a loopback test procedure.

[0018] In summary, the probe system and the probe card and probe head provided by the present invention maintain the probe spacing (both the center spacing and the inner edge spacing) of each group of differential pair probes through the insulating spacers therein, so that the two guide holes originally corresponding to the differential pair probes on the guide plate can be dug toward each other to form an enlarged guide hole, so that the equivalent dielectric constant between the two probes at the guide plate can be as close to the equivalent dielectric constant of the air as possible, while still ensuring that the two probes will not contact each other during the test process. This effectively improves the problem of the inability to maintain the probe spacing derived from the method of digging through two guide holes to reduce the equivalent dielectric constant between the probes in the technical field to which the present invention belongs, and has the benefits of "improving the impedance matching between the probe head (or even the probe card to which it belongs) as a whole and the electronic device under test" and "increasing the position stability of the probe during testing". If the above-mentioned mechanism provided by the present invention is applied to more groups of differential signal probe pairs, higher improvement results can be obtained.

[0019] The above content provides a basic description of the present invention, including the technical problems solved by the present invention, the technical means adopted and the technical effects achieved, and the following will further illustrate various embodiments of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The structure of a guide plate in the prior art is illustrated in a top view.

[0021] Figure 2 The structure of a guide plate according to one or more embodiments of the present invention is illustrated in a top view.

[0022] Figure 3 A wafer testing system including a probe, a probe card, and a probe head according to one or more embodiments of the present invention is illustrated.

[0023] Figure 4 , Figure 5 , Figure 6 The structure of the guide plate and the insulating spacer according to one or more embodiments of the present invention is illustrated in a top view.

[0024] Figure 7 The cross-sectional structure of a probe device and a probe base according to one or more embodiments of the present invention is illustrated in a side view.

[0025] Figure 8 A probe structure according to one or more embodiments of the present invention is illustrated.

[0026] Fig. 9 A flow chart illustrating a method for manufacturing a probe head according to one or more embodiments of the present invention is shown.

[0027] Figures 2 to 9The contents shown are only examples for describing the embodiments of the present invention, and are not intended to limit the protection scope of the present invention. DETAILED DESCRIPTION

[0028] The following embodiments are not intended to limit the invention to a specific environment, application, structure, process, or context. In the attached drawings, elements that are not directly related to the invention will be omitted. In the attached drawings, the size of the elements and the size ratio between the elements are only used as illustrative examples and are not intended to limit the invention. Unless otherwise specified, the same element symbols may refer to the same elements below.

[0029] The terminology described herein is only for the purpose of easily describing the content of the embodiment, and is not intended to be used to limit the invention to be protected. Unless otherwise clearly stated, the term "one" before the element should be regarded as "a kind of", and covers one and plural aspects. "Including", "including", "having" and other terms are used to specifically describe the existence of the features, integers, steps, operations, elements, components and / or groups stated thereafter, but do not exclude the existence or addition of one or more other additional features, integers, steps, operations, elements, components and / or groups, etc. The term "and / or" is used to represent any one or all combinations of one or more related enumerated items. When the terms "first", "second", "third" and the like are used to describe the elements, the purpose is not to limit these described elements, but only to distinguish the described elements. Therefore, for example, without departing from the spirit or scope of the invention to be protected, the first element may also be named as the second element.

[0030] Reference Figure 3 , which shows a probe system 3. The probe system 3 may include at least a probe card 31 and a chuck 32. The probe card 31 may be used to electrically connect and / or mechanically contact an electronic device under test 33, and to test the electrical performance of the electronic device under test 33. The electronic device under test 33 may be a semiconductor wafer. The chuck 32 may be used to carry the electronic device under test 33 for detection by the probe card 31. The electronic device under test 33 may include one or more contact pads (e.g. Figure 3 The probe tip is configured to contact the one or more contact pads ( 34 ) during testing of the electronic device under test 33 . Figure 3 , where the probe tip has not yet contacted the one or more contact pads).

[0031] The probe card 31 may include a circuit board 311, a space transformer 312, and a probe head 313. The space transformer 312 may be disposed on the circuit board 311, and the probe head 313 may be disposed on the space transformer 312. The probe head 313 may basically include a plurality of probes, an upper guide plate unit 314, and a lower guide plate unit 315, and one end of each probe may be electrically connected to the circuit board 311 through the space transformer 312, and the other end may contact a contact pad (e.g., a metal pad or a conductor bump) on the electronic device under test 33 during testing. It should be noted that the space transformer 312 is disposed on the circuit board 311, which is described only based on the conventional size relationship between the space transformer 312 and the circuit board 311, and does not limit the space transformer 312 to be necessarily located above the circuit board 311 in a physical sense.

[0032] The test equipment 35 can perform various test procedures and / or communicate test information to the electronic device under test 33 through the probe card 31. The test equipment 35 can be, for example, a test head of a tester. In some embodiments, the test procedure can include a loopback test procedure, which utilizes the electronic device under test 33 to first generate a required high-frequency test signal, and the high-frequency test signal is then transmitted back to the electronic device under test 33 for testing after passing through the probe card 31, thereby determining whether the electronic device under test 33 is operating normally.

[0033] The circuit board 311 may include a wafer side and a test side. The wafer side and the test side of the circuit board 311 are arranged opposite to each other, and the test side can be used to connect to a test device. Figure 3 In the illustrated embodiment, the wafer side may be the lower side of the circuit board 311, which may face the space transformer 312 and / or may face the electronic device under test 33, and the test side may be the upper side of the circuit board 311, which may face away from the electronic device under test 33 and / or may face the test equipment 35. The circuit board 311 may be a general printed circuit board, and may have a top surface, a bottom surface, and a variety of signal lines located therein, and contacts (contact pads) electrically connected to the signal lines are formed on the top surface and the bottom surface. The pogo pins of the test equipment 35 may contact the contacts on the top surface of the circuit board 311. The test signals of the test equipment 35 may be transmitted to the bottom surface of the circuit board 311 via the aforementioned signal lines.

[0034] The space transformer 312 may also include a wafer side and a test side. The space transformer 312 may be formed by a multi-layer circuit board. The test side of the space transformer 312 may be connected to the wafer side of the circuit board 311. Figure 3 In the illustrated embodiment, the wafer side of the space transformer 312 may be the lower side of the space transformer 312, which may face the probe head 313 and / or the electronic device under test 33, and the test side of the space transformer 312 may be the upper side of the space transformer 312, which may face away from the electronic device under test 33 and may face the circuit board 311 and / or the test equipment 35. In the present embodiment, the space transformer 312 may include a multilayer organic (MLO) substrate or a multilayer ceramic (MLC) substrate, and the material thereof may be adjusted according to actual needs, and the present invention does not limit it. The space transformer 312 has a plurality of signal circuits inside, and has contacts on the top and bottom surfaces electrically connected to the internal signal circuits, and the center spacing between the top surface contacts may be greater than the center spacing between the bottom surface contacts. The space transformer 312 is mechanically and electrically connected to the wafer side of the circuit board 311, that is, the bottom surface of the circuit board 311, and is located below the circuit board 311, so that the contacts on the top surface of the space transformer 312 can be electrically connected to the contacts on the bottom surface of the circuit board 311, so that the signal circuit inside the space transformer 312 is electrically connected to the signal circuit of the circuit board 311. However, in some embodiments, the space transformer 312 and the circuit board 311 can also be indirectly mechanically and / or electrically connected through another carrier (e.g., a spacer board) between them so that the space transformer 312 is configured on the wafer side of the circuit board 311.

[0035] The probe head 313 may be disposed on the wafer side of the space transformer 312 in a mechanical and / or electrical connection manner. Figure 3 As shown, the probe head 313 may include an upper guide plate unit 314, a lower guide plate unit 315, and a plurality of probes (eg Figure 3 316). Each probe can be used to physically contact the electronic device under test 33. In some embodiments, the length of each probe may be no greater than 6 mm, and preferably no greater than 3 mm.

[0036] The upper guide plate unit 314 may include at least one upper guide plate, and the at least one upper guide plate may be provided with a plurality of upper guide holes. The lower guide plate unit 315 may include at least one lower guide plate, and the at least one lower guide plate may be provided with a plurality of lower guide holes. The upper guide plate unit 314 and the lower guide plate unit 315 may be arranged along a longitudinal development axis (e.g., substantially along the longitudinal development axis). Figure 3The upper guide plate unit 314 is arranged relatively to each other up and down in the direction of the coordinate axis Z of the local reference system (hereinafter referred to as the "Z axis"). Each probe can pass through one of the multiple upper guide holes and one of the multiple lower guide holes. When the upper guide plate unit 314 is composed of multiple upper guide plates, there may be a gap between each upper guide plate in the direction corresponding to the longitudinal development axis. Similarly, when the lower guide plate unit 315 is composed of multiple lower guide plates, there may also be a gap between each lower guide plate in the direction corresponding to the longitudinal development axis (not shown in the figure), and the gap may be smaller than the gap between the upper guide plate unit 314 and the lower guide plate unit 315 in the direction corresponding to the longitudinal development axis.

[0037] The probes are usually made of special metals with good electrical and mechanical properties. By pressing the test head onto the electronic device under test 33, a good connection between each probe and the contact pad of the electronic device under test 33 can be ensured. During the pressurized contact, the probes can slide in the guide holes on the upper and lower guide plates, and the probes can bend in the air gap 120 between the two types of guide plate units.

[0038] According to some embodiments of the present invention, each probe included in the probe head 313 may be a probe known in the art as a "buckling beam", i.e., the probe body may have a constant cross-section (e.g., rectangular or trapezoidal, preferably square or rectangular) over its entire length, wherein the probe body may be deformed and adapted to bend at a substantially central position, thereby further deforming during the testing of the electronic device under test 33. However, in some other embodiments, each probe does not necessarily have a constant cross-section over its entire length.

[0039] The probe applicable to the present invention may include at least a straight probe or a pre-bent probe. More specifically, the straight probe may be, for example, a forming wire (FW) probe or a MEMS wire (MW) probe. The pre-bent probe may be, for example, a cobra probe or a MEMS probe with a pre-bent body.

[0040] like Figure 3 As shown, each probe may include a needle head (e.g., needle head 317 included in probe 316), a needle tail (e.g., needle tail 318 included in probe 316), and a needle body (e.g., needle body 319 included in probe 316) located between the needle head and the needle tail and extending along a longitudinal development axis. The needle head may end at a contact tip and may be configured to be adjacent to a contact pad of an electronic device under test 33 integrated in a semiconductor wafer, for example Figure 3The needle head 117 shown in the figure is configured to be adjacent to the contact pad 34 of the electronic device under test 33. The respective needle body portion of each probe of the probe head 313 can be deflected and deformed in an arc shape on the longitudinal development axis when the respective probe is loaded (for example, each probe tip contacts the corresponding contact pad and is subjected to force during the test of the electronic device under test 33).

[0041] In some embodiments, the width of each probe tip may be greater than the width of each probe tail. The tip of each probe may include an electroplating layer so that the tip width of each of the two probes is greater than the tip width (i.e., the tip is thickened by electroplating). The thickness of the electroplating layer of the tip may be, for example, between 5 microns and 20 microns, and preferably between 8 microns and 12 microns. Since the tip needs to contact the guide hole of the lower guide plate unit 315 and the contact pad of the electronic device under test 33, the material of the electroplating layer may be a wear-resistant metal. The thickening of the tip may be thickening the contact area during the production process (e.g., thickening the entire contact tip as a whole, or thickening only the part in the direction of the center line of the probe), but the thickening of the contact area may not be limited to electroplating. For example, for a micro-electromechanical probe (MEMS Wire), the thickness of the contact area may be increased by a micro-electromechanical process. When the contact area of ​​each probe is thickened, the area of ​​the contact pad of the electronic device under test 33 is also increased, thereby providing a more stable contact method. In particular, when the manufacturer reduces the center distance between each probe pair in order to reduce the reflection loss between the probe head 313 and the electronic device under test 33, the thickened contact area will still be able to normally contact the corresponding contact pad. The thickness increase of the thickened contact area can be between 1 and 5 microns, and preferably between 1 and 2 microns. Taking the thickening (i.e., increasing the diameter) of the contact area of ​​a snake probe (Cobra) by electroplating as an example, when the thickness of the needle head of the probe is 50 microns, a thickness of 1 to 2 microns can be formed in the corresponding contact area, and the thickness of the thickened contact area is 52 to 54 microns.

[0042] In some embodiments, in addition to widening / thickening the needle head, the needle body portion 319 of each probe of the probe head 313 may also include a flat structure, and the width of the flat structure may be greater than the width of the needle head of the probe to which it belongs. In other words, the flattened needle body may be wider / thicker than the widened / thickened needle head. The flat structure means that the probe may have a processing procedure for flattening the needle body during the production process. In some embodiments, the width of the needle body portion of each probe may be between 25 microns and 100 microns, and preferably between 55 microns and 65 microns.

[0043] Continue to refer to Figure 3The needle tail portion 318 of each probe can pass through the guide hole on the upper guide plate unit 314 to be electrically connected to the space transformer 312. The needle tail portion 318 can end at a contact tail end and can be configured to be adjacent to a contact pad (not shown) of the space transformer 312. The needle body portion 319 can extend substantially along the longitudinal development axis between the needle head portion 317 and the needle tail portion 318.

[0044] The needle head 317 of each probe can be used to electrically contact the electronic device under test 33. More specifically, the needle head 317 of each probe can be configured to perform electrical communication and / or contact communication with the corresponding contact pad 34 of the electronic device under test 33. In some examples, the communication means that the probe is configured to transmit the test signal of the probe card 31 to the electronic device under test 33 and / or receive the signal from the electronic device under test 33.

[0045] Many embodiments of the present invention relate to different implementations of the probe head 313. However, it should be noted that, although the probe structures in the various embodiments of the present invention may be slightly different, the plurality of probes included in the probe head in each embodiment may include at least one probe pair as a whole. In some embodiments, each probe pair can be used to transmit a set of differential signals, so such a probe pair can also be called a differential pair. In a preferred embodiment of the present invention, the differential pair can use two single-ended signal lines (e.g., P line and N line) to connect TX+ and RX+, and TX- and RX-, respectively, to transmit signals simultaneously, and these two signals have the same signal voltage amplitude but opposite signal phases.

[0046] At least one insulating spacer may be disposed between two probes in each probe pair on the probe head 313, for example Figure 3 , the insulating spacer 36 (i.e., disposed in the enlarged guide hole of the lower guide plate unit 315 and coupled between the two needle heads), the insulating spacer 37 (i.e., disposed (coupled) between the two needle bodies), and the insulating spacer 38 (i.e., disposed in the enlarged guide hole of the upper guide plate unit 314 and coupled between the two needle tails) illustrated in the figure. The insulating spacer can be used to maintain the spacing between the two probes. As its name describes, the insulating spacer can have an insulating material, such as but not limited to reinforced plastic, plastic steel and the like. In some embodiments, the material of the insulating spacer can be a porous filling material. In some embodiments, the material of the insulating spacer can have a relative dielectric constant not greater than 6. In some embodiments, the material of the insulating spacer can even have a relative dielectric constant not greater than 4. In some embodiments, the relative dielectric constant of the material of the insulating spacer can be not greater than the relative dielectric constant of the material of each upper guide plate in the upper guide plate unit 314 and the material of each lower guide plate in the lower guide plate unit 315. In some embodiments, the width of the insulating spacer (corresponding to Figure 3 The direction of the coordinate axis X (hereinafter referred to as “X axis”) of the local reference system in the embodiment of the present invention may be smaller than the fine pitch between the centers of the two contact points on the electronic device under test 33 corresponding to the two coupled probes.

[0047] In some embodiments, the insulating spacer may have a thickness corresponding to the longitudinal development axis, and the thickness may be less than or equal to the depth of the enlarged guide hole corresponding to the longitudinal development axis, that is, the insulating spacer may not protrude from the enlarged guide hole in the direction of the longitudinal development axis, such as the insulating spacer 36 and the insulating spacer 38 mentioned above.

[0048] In some embodiments, each probe pair as a differential pair may be provided with at least one corresponding ground probe on the probe head 313, and the probe spacing between the two probes of each differential pair (e.g., the center spacing between the needle body or the center spacing between the needle head) may be smaller than the spacing between each of the two probes and the at least one ground probe (e.g., the center spacing between the needle body or the center spacing between the needle head). That is, the two probes of the differential pair may be the probes closest to each other on the probe head 313.

[0049] Next refer to Figure 4 , which takes a part of the guide plate 4 as an example, and shows the possible implementation of the probe pair and the insulating spacer at the upper guide plate unit 314 and / or the lower guide plate unit 315 from a top view. In other words, Figure 4 The implementation of the guide plate 4 shown in the figure can directly represent possible implementations of the upper guide plate unit 314 and the lower guide plate unit 315 .

[0050] like Figure 4 As shown, the guide plate 4 may include a guide hole 41, which may be formed by punching through the original guide hole 42 and guide hole 43 ( Figure 4 The guide hole 42 and the guide hole 43 can be used to accommodate the probe 44 and the probe 45 as a differential pair. Figure 4 In the illustrated scenario, the probes 44 and 45 are arranged to bear against the guide holes 42 and 43 respectively during testing. Figure 4 , that is, the negative direction of the coordinate axis Y (hereinafter referred to as “Y axis”) of the local reference system, and the buckling direction of the probe body of the probe 44 and the probe 45 during the test may be Figure 4 In other words, the directions in which the probes 44 and 45 are supported by the guide holes 42 and 43 and the bending directions of the two probes may be substantially perpendicular to the direction of the line between the two probes.

[0051] In some embodiments, the diameter of the guide hole (referred to herein as the enlarged guide hole) that is enlarged by punching through the original guide hole may be larger than the diameters of the other non-enlarged guide holes adjacent to the guide hole on the guide plate to which it belongs. Examples of the other non-enlarged guide holes may be, for example but not limited to, a grounding guide hole for accommodating a grounding probe (also known as a "G needle"), or an original guide hole for accommodating one of the other differential pair probes. For example, Figure 4 The diameter of the guide hole 41 which is the enlarged guide hole is larger than the grounding guide hole 47 on the guide plate 4 corresponding to the probes 44 and 45 .

[0052] After the area between the two guide holes is punched through to form the guide hole 41, although the probe 44 and the probe 45 may not slide immediately toward each other (because the bearing direction is perpendicular to the connection direction of the two probes), they may still be deformed and moved due to force during testing. Therefore, the original inherent relative distance between the probe 44 and the probe 45 still needs to be maintained by other means to avoid unnecessary movement during testing, or even the two probes touching each other. Therefore, an insulating spacer 46 may be provided between the probe 44 and the probe 45, which is coupled with the probe 44 and the probe 45 to maintain the relative position of the probe 44 and the probe 45, that is, to maintain the center pitch of the probes. Thereby, the probe 44 and the probe 45 can maintain their original inherent bearing direction and relative distance. In some embodiments, the center pitch of the probe 44 and the probe 45 can be between 80 microns and 220 microns, and preferably between 100 microns and 130 microns.

[0053] The insulating spacer 46 may be disposed between the respective needle heads of the probe 44 and the probe 45, or between the respective needle tails of the probe 44 and the probe 45. When the insulating spacer 46 is disposed between the respective needle heads of the probe 44 and the probe 45, the guide hole 41 may accommodate a portion of the respective needle heads of the probe 44 and the probe 45 and at least a portion of the insulating spacer 46, that is, the insulating spacer 46 may be partially or completely contained in the guide hole 41 on the guide plate 4 in the direction of the longitudinal development axis (Z axis).

[0054] The shaft portions of the probes 44 and 45 may have a transverse cross-section, for example Figure 4 The transverse cross-section of the needle body of the probe 44 and the probe 45 is shown, which is cut on the probe by a plane perpendicular to the longitudinal development axis (for example, a plane parallel to the guide plate 4). It should be noted that Figure 4Although the transverse cross-section of the needle body of the two probes and the guide plate 4 are shown at the same time, this is only for the convenience of describing the transverse cross-section of the needle body, and does not mean that the two probes are actually supported by the needle body against the guide plate 4. The two probes are supported by their needle head or needle tail, depending on whether the guide plate 4 is actually implemented as an upper guide plate unit 314 or a lower guide plate unit 315.

[0055] like Figure 4 As shown, the needle body of probe 44 and probe 45 may have a rectangular transverse cross-section, and thus the transverse cross-section may have a long side and a short side. In certain embodiments, insulating spacer 46 may be substantially located in the direction of the center line connecting the needle heads of probe 44 and probe 45, and coupled to probe 44 and probe 45 respectively on the side where the short side of the needle heads of the two probes is located. Since probes 44 and 45 use the side where the long side of the transverse cross-section of the needle body is located as a bending surface, and the bending direction is substantially perpendicular to the direction of the connection between the two probes, the two probes are less likely to touch each other due to deformation due to force during testing. Accordingly, compared to the probe arrangement in which the two probes are opposite to each other with the long sides of the transverse cross-section of the needle body, the probe arrangement in which the two probes are opposite to each other with the short sides of the transverse cross-section of the needle body (i.e., the two probes are arranged in a manner such that the two probes are opposite to each other) is more convenient. Figure 4 ) allows the two probes to further reduce the distance between the two probes (for example, the inner edge distance of the needle body of the two probes, or even the center distance may be further reduced), thereby improving the overall electrical performance of the differential pair to which the two probes belong (when the two probes belong to the same differential pair). Because the distance between the two probes may be further reduced, the importance of maintaining the distance between the two probes through the insulating spacer 46 in the art also increases accordingly.

[0056] Reference Figure 5 , which takes a part of the guide plate 5 as an example, and shows the possible implementation of the probe pair and the insulating spacer at the upper guide plate unit 314 and / or the lower guide plate unit 315 from a top view. In other words, Figure 5 The implementation of the guide plate 5 shown in FIG. 3 can directly represent the possible implementations of the upper guide plate unit 314 and the lower guide plate unit 315. Figure 5 As shown, the guide plate 5 may include a guide hole 51, which may be formed by punching through the original guide hole 52 and guide hole 53 ( Figure 5 The outline of which is shown in dotted lines).

[0057] Similar to the guide holes 42 and 43, the guide holes 52 and 53 can be used to accommodate probes 54 and 55 as differential pairs, respectively. Figure 5 In the illustrated scenario, probes 54 and 55 are arranged to bear against guide holes 52 and 53 respectively during testing. Figure 5 to the right, that is, the positive direction of the X axis, and Figure 5In other words, the directions in which the probes 54 and 55 are supported by the guide holes 52 and 53 and the bending directions thereof may be substantially parallel to the direction of the line connecting the probes 54 and 55 .

[0058] Since the bearing direction of the probe 54 and the probe 55 is Figure 5 In the right side of the figure, after the area between the guide hole 52 and the guide hole 53 is punched to form the guide hole 51, the probe 54 will slide toward the position where the probe 55 is located, so an insulating spacer 56 may be provided between the probes 54 and 55 to maintain the relative position of the probes 54 and 55, that is, to maintain the probe spacing. In some embodiments, the center spacing between the probes 54 and 55 may be between 80 microns and 220 microns, and preferably between 100 microns and 130 microns.

[0059] The difference between the insulating spacer 56 and the insulating spacer 46 is that the insulating spacer 56 not only provides support between the probe 54 and the probe 55 in the direction of the center line of the two probes (i.e., the X-axis direction), but it even surrounds and covers the partial outer edges of the two probes, thereby providing a more stable and comprehensive stabilization effect. The local outer edges may refer to the local outer edges of the needle head, needle body, and needle tail, depending on the position where the insulating spacer actually intersects with the two probes. For example, the insulating spacer 56 may intersect with the probe 54 and the probe 55 at the height of the guide plate 5 (for example: relative to the longitudinal development axis / Z axis), and the insulating spacer 56 may be surrounding and covering the probe 54 and the probe 55 on all sides in the guide hole 51. In some embodiments, the insulating spacer 56 may even completely fill the guide hole 51 in the X-axis direction and the Y-axis direction (not shown). In addition, in some embodiments, if the insulating spacer 56 is completely located in the guide hole 51 in the direction of the longitudinal development axis / Z axis, the insulating spacer 56

[0060] The guide hole 51 may even be completely filled in the directions of the three axes X, Y, and Y (not shown).

[0061] In some embodiments, the entire enlarged via may be further filled with a material and used as an insulating spacer between the two probes, and the material may have a relative dielectric constant of no greater than 6. In some embodiments, the material may even have a relative dielectric constant of no greater than 4.

[0062] Next refer to Figure 6 , which takes a part of the guide plate 6 as an example, and shows the possible implementation of the probe pair and the insulating spacer at the upper guide plate unit 314 and / or the lower guide plate unit 315 from a top view. In other words, Figure 6 The implementation of the guide plate 6 shown in FIG. 3 can directly represent the possible implementations of the upper guide plate unit 314 and the lower guide plate unit 315. Figure 6As shown, the guide plate 6 may include a guide hole 61, which may be formed by punching through the original guide hole 62 and guide hole 63 ( Figure 6 The guide hole 62 and the guide hole 63 can be used to accommodate the probe 64 and the probe 65 which can be used as a differential pair, and the probe 64 and the probe 65 are arranged to bear against the guide hole 62 and the guide hole 63 respectively during the test. Figure 6 The probe 64 and the probe 65 are respectively located at the needle tail of the upper guide plate unit 314 and / or the probe 64 and the probe 65 are respectively located at the needle head of the lower guide plate unit 315. Figure 6 61. After the area between the two guide holes is punched to form the guide hole 61, the probes 64 and 65 will not slide toward each other immediately like the probes 54 and 55. However, since each probe will deform and move due to the force during the test, the original relative distance between the probes 64 and 65 must still be maintained by other means to avoid unnecessary movement or even contact between the two probes during the test. Accordingly, an insulating spacer 66 can be provided between the probes 64 and 65 to maintain the relative position of the probes 64 and 65, that is, to maintain the distance between the probes.

[0063] In addition, the insulating spacer 66 may be surrounded and covered by the reinforcement member 67 at the guide hole 61 (e.g., at a position substantially at the same Z-axis height as the guide hole 61). In some embodiments, the center distance between the probes 64 and 65 may be between 80 microns and 220 microns, and preferably between 100 microns and 130 microns.

[0064] The insulating spacer 66 may also be surrounded and covered by the reinforcement member 67 at the guide hole 61 (e.g., at a position substantially at the same Z-axis height as the guide hole 61). In some embodiments, the center-to-center distance between the probes 64 and 65 may be between 80 microns and 220 microns, and preferably between 100 microns and 130 microns.

[0065] The reinforcing member 67 can be used to enhance the anti-deformation capability of the insulating spacer 66. In some embodiments, the reinforcing member 67 can also surround and cover the two probes at the guide hole 61 like the insulating spacer 56 described above, so as to provide a more stable and all-round stabilization effect for the probes 64, 65 and the insulating spacer 66. In this way, the probes 64 and 65 can maintain their original inherent bearing direction and relative distance at the guide hole 61.

[0066] In some embodiments, the material of the reinforcement 67 may be an insulating material, such as but not limited to plastic, carbon fiber, or other non-metallic materials. However, in some other embodiments, the material of the reinforcement 67 may also be a metal material, and in these embodiments, the inner edge of the reinforcement 67 and the contact parts with the probe 64, the probe 65 and the insulating spacer 66 may be treated with insulation (e.g., coated with insulating paint, insulating coating, etc.) to avoid affecting the electrical performance of the probe.

[0067] It should be stated that Figure 4 , Figure 5 , Figure 6 Although the original guide holes before enlargement are shown as circles, in some embodiments, the cross-section of each guide hole may have a substantially circular shape, an elliptical shape, a substantially rectangular shape, or a combination of the foregoing shapes.

[0068] Figure 7 The side view illustrates the arrangement of the insulating spacer of the pre-bent probe and the enlarged guide hole in the probe head 313. Figure 7 , the probes 701 and 702 as a differential pair and another set of probes 703 and 704 as a differential pair all pass through the upper guide plate unit 314 and the lower guide plate unit 315, and the needle head of each probe contacts a contact pad of the electronic device under test 33. The upper guide plate unit 314 may have guide holes 705 and 706, and the lower guide plate unit 315 may have guide holes 707, 708, and 709. Figure 7 The guide holes 705, 706 and 707 in the figure can be enlarged guide holes that are expanded from two original general guide holes to a single guide hole, just like the guide holes 41, 51 and 61 mentioned above. For ease of explanation, the following will refer to this type of guide hole as "enlarged guide hole" and refer to the unenlarged guide hole as "general guide hole".

[0069] It should be stated that Figure 7 Although each probe is presented in the form of a pre-bent probe, this is not a direct limitation on the type of probe applicable to the present invention. Figure 7 Each probe in can also be replaced by a straight probe.

[0070] The insulating spacer 710 may be disposed at the guide hole 705 and coupled to the needle tail 711 of the probe 701 and the needle tail 712 of the probe 702. Similarly, the insulating spacer 713 may be disposed at the guide hole 706 and coupled to the needle tail 714 of the probe 703 and the needle tail 715 of the probe 704. Another insulating spacer 716 may be disposed at the guide hole 707 and coupled to the needle head 717 of the probe 703 and the needle head 718 of the probe 704. Each insulating spacer may be coupled to the corresponding needle tail or needle head by, for example, adhesive, inlay, etc.

[0071] It should be stated that Figure 7 A single diagram simultaneously shows a plurality of different possible arrangements of the upper guide plate unit 314, the lower guide plate unit 315 and the insulating spacer, which does not limit the actual implementation result of the probe head 313 to completely comply with Figure 7 The configuration shown is not intended to be a one-size-fits-all configuration, but rather a variety of configurations may be mixed and matched as may be feasible for successful implementation.

[0072] In some embodiments, only one of the upper guide plate unit 314 and the lower guide plate unit 315 may include an enlarged guide hole, and the other one that does not include an enlarged guide hole may include two general guide holes (i.e., non-enlarged guide holes) for the two probes of the probe pair to pass through respectively. Figure 7 The results are presented in the left half of .

[0073] In some embodiments, the upper guide plate unit 314 and the lower guide plate unit may both include enlarged guide holes, and both probes of the probe pair pass through the enlarged guide holes on the upper guide plate unit 314 and the lower guide plate unit. Figure 7 The result is shown in the right half of . However, in some embodiments, the insulating spacer may be provided in only one of the enlarged guide holes, for example, the insulating spacer 716 may be provided only in the guide hole 707, but not in the guide hole 706. When the guide holes for accommodating a pair of probes in the upper guide plate unit 314 and the lower guide plate unit 315 are both enlarged guide holes, but the enlarged guide holes on only one side of the guide plate are provided with insulating spacers, it is preferred to provide the insulating spacer at the enlarged guide hole of the lower guide plate unit 315 closer to the electronic device under test 33.

[0074] In certain embodiments, the insulating spacer is disposed along the longitudinal development axis (ie, Figure 7 The Z axis shown in FIG) can be completely located in the enlarged guide hole. A specific example of this situation is Figure 7 The insulating spacer 710 and the insulating spacer 713 are respectively disposed in the corresponding guide hole 705 and the guide hole 706. In contrast, in some embodiments, only a portion of the insulating spacer may be located in the enlarged guide hole along the longitudinal development axis. A specific example of this is Figure 7The insulating spacer 716 is arranged in the corresponding guide hole 707. Other examples may be: a portion of the insulating spacer 710 and / or the insulating spacer 713 is located below the lower surface of the upper guide plate unit 314, a portion of the insulating spacer 716 is located below the lower surface of the lower guide plate unit 314 and / or a portion of the insulating spacer 716 is located above the upper surface of the lower guide plate unit 314.

[0075] 4, a portion of the insulating spacer 716 is located below the lower surface of the lower guide plate unit 314, and / or a portion of the insulating spacer 716 is located above the upper surface of the lower guide plate unit 314.

[0076] In certain embodiments, Figure 7 The insulating spacer 713 and the insulating spacer 716 in the figure can even be replaced by a single insulating spacer, whose upper edge is located in the guide hole 706 and whose lower edge is located in the guide hole 707, and is simultaneously coupled to the needle tail 714, needle tail 715, needle head 717, and needle head 718 of the probe 703 and the probe 704. This situation can be regarded as a state in which the insulating spacer 713 and the insulating spacer 716 are connected up and down, but this state is not simultaneously presented in Figure 7 middle.

[0077] In some embodiments, the center lines of the needle bodies of the two probes of each probe pair as a differential pair on the probe head 313 may be aligned without deviating from the center lines of their respective needle heads. However, in some other embodiments, the center lines of the needle bodies of the two probes of the differential pair may not be aligned with the center lines of the contact areas of the needle heads, so that the center lines of the needle bodies of each probe may be spaced apart from the center lines of the contact areas of the needle heads (i.e., the needle tips), i.e., the spacing between the center lines of the needle bodies of the probes (also referred to as the center spacing) may be different from the spacing between the center lines of the contact areas of the needle heads (also referred to as the center spacing). Since the center spacing between the contact areas of the two probes will in principle correspond to the spacing between the contact pads on the electronic device under test 33, and considering that the center spacing between the contact pads (or the spacing between the two contact positions during other tests) may not be a specification that can be determined by the probe manufacturer, this structure allows the two probes in the probe pair to further shorten the center spacing between the two needle bodies when the center spacing between the two contact areas is fixed, thereby improving the electrical performance of the probe pair as a differential pair. For more specific examples, please refer to Figure 8 , which takes the probe pair 8 as a differential pair on the probe head 313 as an example, and shows a double-needle arrangement of each probe pair on the probe head 313. Figure 8As shown, the inner edge spacing D1 of the needle body of the two probes in the probe pair 8 (for example, the spacing between the probes 44 and 45 can be between 80 microns and 220 microns, and preferably between 100 microns and 130 microns as previously mentioned) can be smaller than the inner edge spacing D2 of the needle heads of the contact areas of the two probes, or even smaller than the contact area center spacing D3 of the two contact points (for example, contact pads) on the electronic device under test 33 contacted by the two probes. The contact area center spacing D3 can be the same as the center spacing of the needle heads of the probe pair 8, so as to facilitate accurate contact between the two.

[0078] Taking the probe pair 8 as a differential pair on the probe head 313 as an example, a double-needle arrangement of each probe pair on the probe head 313 is shown. Figure 8 As shown, the inner edge spacing D1 of the needle body of the two probes in the probe pair 8 (for example, the spacing between the probes 44 and 45 can be between 80 microns and 220 microns, and preferably between 100 microns and 130 microns as previously mentioned) can be smaller than the inner edge spacing D2 of the needle heads of the contact areas of the two probes, or even smaller than the contact area center spacing D3 of the two contact points (for example, contact pads) on the electronic device under test 33 contacted by the two probes. The contact area center spacing D3 can be the same as the center spacing of the needle heads of the probe pair 8, so as to facilitate accurate contact between the two.

[0079] The contact area center distance D3 of two contact points (eg, contact pads) on the device under test 33 may be the same as the center distance between the needle heads of the probe pair 8 to facilitate accurate contact between the two.

[0080] In certain embodiments, for example, a pre-bent probe such as a cobra probe, the width formed by the two needle body portions of the two probes in each probe pair and the gap between the two needle body portions may be greater than the width of the enlarged guide hole on the lower guide plate unit, so that the two probes can be pressed as a whole against an upper surface of the lower guide plate unit in the direction corresponding to the longitudinal development axis without continuing to slide downward.

[0081] like Fig. 9 As shown, many embodiments of the present invention also relate to a probe head manufacturing method 9. The probe head manufacturing method 9 may include the following steps:

[0082] Among the plurality of probes, the probes are placed in pairs in parallel to form a plurality of probe pairs (labeled as 901);

[0083] For each probe pair, align the two needle heads and the two needle tails of the two probes respectively (marked as 902);

[0084] For each probe pair, an insulating spacer is formed between the two probes of the same probe pair, so that the insulating spacer is coupled to the two probes (labeled as 903); and

[0085] The plurality of needle tails and the plurality of needle heads of the plurality of probe pairs are respectively passed through an upper guide plate and a lower guide plate, thereby disposing the plurality of probe pairs between the upper guide plate and the lower guide plate, wherein: at least one of the upper guide plate and the lower guide plate comprises a plurality of enlarged guide holes, each of which accommodates a portion of the two probes included in one of the plurality of probe pairs and at least a portion of the insulating spacer between the two probes, and an aperture of each enlarged guide hole is larger than an aperture of each of at least one grounding guide holes adjacent to the same enlarged guide hole; and at least one of the upper guide plate and the lower guide plate further comprises a plurality of non-enlarged guide holes, each of which accommodates a portion of one of the plurality of probes, so that the needle head or needle tail of each probe pair that is not coupled therebetween by the insulating spacer can pass therethrough alone (labeled as 904).

[0086] In certain embodiments, regarding the probe head manufacturing method 9, the probes included in the plurality of probe pairs are all pre-bent probes, and the probe head manufacturing method 9 may also include the following steps: first, covering the lower guide plate to allow each of the plurality of needle heads of the plurality of probe pairs to pass through one of the plurality of enlarged guide holes or one of the plurality of non-enlarged guide holes corresponding to the lower guide plate, and then covering the upper guide plate to allow each of the plurality of needle tails of the plurality of probe pairs to pass through one of the plurality of enlarged guide holes or one of the plurality of non-enlarged guide holes corresponding to the upper guide plate, thereby arranging the plurality of probe pairs between the upper guide plate and the lower guide plate.

[0087] In certain embodiments, regarding the probe head manufacturing method 9, the probes included in the plurality of probe pairs are all straight probes, and the probe head manufacturing method 9 may also include the following steps: covering the upper guide plate and the lower guide plate at the same time to allow each of the plurality of needle heads of the plurality of probe pairs to pass through one of the plurality of enlarged guide holes or one of the plurality of non-enlarged guide holes corresponding to the lower guide plate, and allowing each of the plurality of needle tails of the plurality of probe pairs to pass through one of the plurality of enlarged guide holes or one of the plurality of non-enlarged guide holes corresponding to the upper guide plate, thereby arranging the plurality of probe pairs between the upper guide plate and the lower guide plate.

[0088] Each embodiment of the probe head manufacturing method 9 basically corresponds to a certain embodiment of the probe head 313. Therefore, based on the above description of the probe head 313, a person skilled in the art in the technical field of the present invention can fully understand and implement all corresponding embodiments of the probe head manufacturing method 9, even if each embodiment of the probe head manufacturing method 9 is not described in detail above.

[0089] In summary, the insulating spacer provided by the present invention for each probe pair in the probe card ensures the spacing between the two probes, so that the original general guide hole in the upper guide plate and / or the lower guide plate can be expanded into an enlarged guide hole, which effectively reduces the equivalent dielectric constant between the two probes due to the contribution of the enlarged guide hole, thereby improving the electrical performance of signal transmission when the probe pair is used as a differential pair. Accordingly, the probe card and the probe head therein provided by the present invention can indeed meet the electrical requirements of high-speed (high-frequency) testing (its signal integrity can be improved).

[0090] The above embodiments are only used to illustrate some embodiments of the present invention and to explain the technical features of the present invention, and are not used to limit the protection scope and range of the present invention. Any changes or equivalent arrangements that can be easily completed by ordinary technicians in the technical field of the present invention belong to the scope claimed by the present invention, and the scope of protection of the present invention shall be subject to the claims.

Claims

1. A probe head, characterized in that: Include: A probe pair, wherein each of the two probes in the probe pair comprises a needle head, a needle tail, and a needle body extending between the needle head and the needle tail along a longitudinal development axis, and the needle body of each of the two probes can deflect and deform in an arc shape along the longitudinal development axis when a load is applied to the corresponding probe; A first guide plate comprising a first enlarged guide hole, wherein both probes of the probe pair pass through the first enlarged guide hole, wherein the aperture of the first enlarged guide hole is larger than the aperture of a grounding guide hole adjacent to the first enlarged guide hole on the first guide plate; and The first insulating spacer is disposed between the two probes and coupled to the two probes, thereby maintaining the relative positions between the two probes.

2. The probe head according to claim 1, characterized in that: At least a portion of the first insulating spacer is disposed in the first enlarged via.

3. The probe head according to claim 1, further comprising a second guide plate, characterized in that: The second guide plate is spaced a distance from the first guide plate on the longitudinal development axis; and The second guide plate includes two unenlarged guide holes, and the two probes in the probe pair pass through the two unenlarged guide holes respectively.

4. The probe head according to claim 1, further comprising a second guide plate and a second insulating spacer, wherein: The second guide plate is spaced a distance from the first guide plate on the longitudinal development axis; The second guide plate includes a second enlarged guide hole, and the two probes in the probe pair both pass through the first enlarged guide hole and the second enlarged guide hole; The first guide plate is an upper guide plate, and at least a portion of the needle tail of each of the two probes is disposed in the first enlarged guide hole; The second guide plate is a lower guide plate, and at least a portion of the needle head of each of the two probes is disposed in the second enlarged guide hole; and The second insulating spacer is disposed between the two probes and coupled with the two probes, and at least a portion of the second insulating spacer is disposed in the second enlarged via.

5. The probe head according to claim 1, characterized in that: The first insulating spacer is disposed between the two needle heads of the two probes or between the two needle tails of the two probes; The needle body of each of the two probes has a long side and a short side in a transverse cross section thereof; and The first insulating spacer and the two probes are respectively coupled to the side where the needle head of each of the two probes corresponds to the short side, or coupled to the side where the needle tail of each of the two probes corresponds to the short side.

6. The probe head according to claim 4, characterized in that: The width formed by the two needle bodies of the two probes and the gap between the two needle bodies outside the second enlarged guide hole is greater than the width of the second enlarged guide hole on the second guide plate, so that the two probes are pressed against the upper surface of the second guide plate in the direction corresponding to the longitudinal development axis.

7. The probe head according to claim 1, characterized in that: The first enlarged guide hole has a depth on the first guide plate corresponding to the longitudinal development axis; and The first insulating spacer has a thickness corresponding to the longitudinal development axis, and the thickness of the first insulating spacer is less than or equal to the depth of the first enlarged guide hole.

8. The probe head according to claim 1, characterized in that: The width of the first insulating spacer between the two probes is smaller than the center distance between the first enlarged guide hole and other adjacent guide holes.

9. The probe head according to claim 1, characterized in that: The first insulating spacer has a plurality of holes; The relative dielectric constant of the material of the first insulating spacer is not greater than the relative dielectric constant of the material of the first guide plate; and The cross section of the first enlarged guide hole has a circular shape, an elliptical shape, a rectangular shape, or a combination thereof.

10. The probe head according to claim 1, characterized in that: The probe device further includes at least one ground probe, and the distance between the two probes is smaller than the distance between each of the two probes and the at least one ground probe.

11. The probe head according to claim 1, characterized in that: The width of each of the two probes' needle heads is greater than the width of their needle tails.

12. The probe head according to claim 1, characterized in that: The two probes correspond to two contact points on the electronic device under test respectively, and the distance between the needle heads of the two probes is smaller than the center distance between the two contact points.

13. The probe head according to claim 11, characterized in that: The needle head of each of the two probes comprises an electroplating layer, so that the width of the needle head of each of the two probes is greater than the width of the needle tail; and The needle body of each of the two probes comprises a flat structure, and the width of the flat structure is greater than the width of the needle head of the probe to which it belongs.

14. The probe head according to claim 1, characterized in that: The first enlarged guide hole is filled with a first material, and the first material has a relative dielectric constant not greater than 6; and The first material has a relative dielectric constant not greater than 4.

15. The probe head according to claim 1, characterized in that: The first insulating spacer surrounds and covers a portion of each of the two probes of the probe pair.

16. The probe head according to claim 1, characterized in that: The probe device further comprises a fixing member, which covers the first insulating spacer and is used for enhancing the anti-deformation capability of the first insulating spacer.

17. The probe head according to claim 1, characterized in that: The supporting direction of the probe pair against the first guide plate is substantially perpendicular to the connecting direction between the two probes of the probe pair.

18. A probe card, characterized in that: Include: Circuit boards; a space transformer disposed on the circuit board; and The probe head according to any one of claims 1 to 17 is arranged on the other side of the space transformer relative to the circuit board, and the needle tail of each probe in the probe pair in the probe head is configured to be electrically connected to the space transformer.

19. An electronic device under test, characterized in that: The electronic device under test uses the probe card according to claim 18 to perform a high-frequency test procedure, wherein the high-frequency test procedure uses a high-frequency signal to perform the test, and the high-frequency test procedure is a loopback test procedure.

20. A method for manufacturing a probe head, characterized in that: It includes the following steps: Among the multiple probes, the probes are placed in parallel in pairs to form multiple probe pairs; For each probe pair, align the two needle heads and the two needle tails of the two probes respectively; For each probe pair, an insulating spacer is formed between the two probes of the same probe pair so that the insulating spacer is coupled to the two probes; The plurality of needle tails and the plurality of needle heads of the plurality of probe pairs are respectively passed through the upper guide plate and the lower guide plate, thereby arranging the plurality of probe pairs between the upper guide plate and the lower guide plate, wherein: At least one of the upper guide plate and the lower guide plate includes a plurality of enlarged guide holes, each of which accommodates a portion of the two probes included in one of the plurality of probe pairs and at least a portion of the insulating spacer between the two probes, and a diameter of each enlarged guide hole is larger than a diameter of a grounding guide hole adjacent to the same enlarged guide hole; and At least one of the upper guide plate and the lower guide plate further comprises a plurality of unenlarged guide holes, each of which contains a portion of one of the plurality of probes, so that the needle head or needle tail of each probe pair that is not coupled therebetween by the insulating spacer can pass through the hole alone.

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