Monitoring device and service life testing system suitable for miniature thermoelectric device

Abstract

The invention discloses a monitoring device and a service life test system suitable for a miniature thermoelectric device, and the monitoring device employs a thermocouple fixing plate elastically connected with a positioning guide mechanism to enable each thermocouple element to be in close contact with a corresponding sample piece, thereby reducing the interface thermal resistance. Therefore, real-time and accurate measurement of the cold surface temperatures of a plurality of sample pieces can be realized at the same time, and the condition of inaccurate temperature measurement caused by the fact that part of the sample pieces are not pressed due to existence of a tolerance zone is avoided; the probe provided by the invention has telescopic elasticity, when multi-station design is carried out, the telescopic amount of the probe can overcome the defect that different stations are different in height due to machining precision, and normal power supply and electric signal measurement can still be ensured. Therefore, testing and temperature characterization can be completed in one monitoring device, and the monitoring efficiency is greatly improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor refrigeration chip testing, and in particular relates to a monitoring device and a life test system suitable for micro thermoelectric devices. Background Art

[0002] Semiconductor modules based on the thermoelectric effect can realize the mutual conversion of heat and electricity. On the one hand, they can generate electricity by using temperature difference, and on the other hand, they can pump heat by electricity to achieve precise temperature control of the target. They are widely used in communications, aerospace, biomedicine and other fields. Due to the constraints of the heat conduction process, it is difficult to design redundant thermoelectric devices, but in actual use requirements, their lifespan is often required to be no less than the lifespan of the subsystem module, and they need to work stably for tens of thousands or even hundreds of thousands of hours, which puts extremely high demands on their reliability. Therefore, it is very important to clearly understand the failure rate function of thermoelectric devices under specific process flows.

[0003] In order to evaluate the life of thermoelectric devices through reasonable stress acceleration means and acceleration models, the industry has developed test methods by applying external stress, such as temperature stress or electrical stress. In order to obtain the life information of thermoelectric devices through these methods, it is necessary to ensure that the device maintains good circuit connection under relevant requirements, and monitor the status of the device to obtain the key performance of the device in real time. However, the current life test system is only suitable for thermoelectric devices with larger sizes (above 10mm*10mm), and the life test system only applies a single stress to the device, such as long-term power-on at a single constant temperature, constant temperature difference on both sides, power-on and power-off cycles, and positive and negative power-on cycles. A complete life evaluation requires the use of multiple life test systems. The general life test equipment has a large mechanical size and is difficult to put into an environmental test chamber to change the temperature and humidity conditions. The monitoring of the key performance of the device (such as internal resistance, maximum temperature difference) needs to be transferred to the corresponding test equipment for measurement after the applied stress ends. Therefore, the "stress-release-test" process needs to be repeated many times in each life test cycle of the device, which is cumbersome.

[0004] For micro devices with working surface area reduced to a few square millimeters and electrode area less than 1mm×1mm, it is almost impossible to test them through the life test system of conventional devices. First, the leads for establishing the most basic circuit connection need to be transferred to a microscope for welding, and it is almost impossible to weld four wires on such a small electrode for voltage monitoring, and there is a high probability that the device will fail due to a direct short circuit. Secondly, micro devices are easily affected by the force of the leads and warp up, and a fixed structure needs to be installed to maintain good thermal contact between them and the heat sink. In this way, the practice of directly clamping the thermocouple between the pressure head and the cooling surface increases the thermal resistance of the system on the one hand, and on the other hand, after the size is reduced, the temperature measurement node is almost not in contact with the device surface when the thermocouple is clamped in the thermal interface layer. The temperature of the thermal interface at a certain distance from the surface is not actually measured, which produces a test error that is difficult to evaluate. In addition, the life test requires that multiple micro devices of the same batch be tested at the same time. For micro devices with a thickness not exceeding 2mm, a size error of 0.01mm may cause abnormal thermal contact and failure. Therefore, the commonly used strategy for simultaneous testing is to use multiple single-station test systems for simultaneous testing, which is complicated to operate and has low utilization. Therefore, it is a common problem in the industry to conduct life tests on multiple micro thermoelectric devices at the same time, monitor the current, voltage and temperature status in real time, and perform integrated measurement of the key performance of the devices. There is a lack of suitable life test equipment. Summary of the invention

[0005] The present invention provides a monitoring device suitable for micro-thermoelectric devices, which can realize accurate monitoring of the current, voltage and temperature of multiple micro-thermoelectric devices simultaneously.

[0006] The present invention provides a monitoring device suitable for a micro thermoelectric device, comprising:

[0007] A base, wherein the base is provided with a base groove;

[0008] A heat-conducting and heat-dissipating component is located in the base groove, a thermocouple is arranged in the heat-conducting and heat-dissipating component, and the thermocouple is used to detect the temperature of the heating surface of the sample;

[0009] A sample carrier, comprising a sample fixing plate for loading the sample, the sample fixing plate being located on the heat dissipation assembly, and the sample fixing plate being provided with at least one groove for fixing the sample;

[0010] A probe and thermocouple fixing plate, wherein the probe and thermocouple fixing plate comprises a first positioning plate, a probe fixing plate and a plurality of thermocouple fixing plates;

[0011] The probe fixing plate is fixed on the second positioning plate and is provided with a probe array unit having a telescopic mechanism, each probe array unit is aligned with a corresponding sample, and is used to detect the current and voltage of the sample;

[0012] The thermocouple fixing plate is elastically connected to the probe fixing plate, a thermocouple tube and a thermocouple element are arranged on the thermocouple fixing plate, the thermocouple element is fixed in the thermocouple tube, and the thermocouple element is aligned with the corresponding cold surface of the sample to detect the temperature of the cold surface of the sample;

[0013] The positioning guide mechanism is fixedly connected to the second positioning plate and the sample carrier plate respectively, and is used to press down the probe and thermocouple fixing plate to align and press the probe array unit and the thermocouple element with the corresponding sample.

[0014] Preferably, the thermally conductive and heat dissipating components include a heat dissipation component and a thermally conductive interface material, wherein the thermally conductive interface material is located between the heat dissipation component and the sample carrier and is used to transfer heat from the heating surface of the sample to the heat dissipation component, and the heat dissipation component is used to transfer heat to the outside.

[0015] Further preferably, the heat dissipation component is a water-cooled plate, a fan and heat dissipation fins with a flat plate, a semiconductor refrigeration sheet, or a combination of a semiconductor refrigeration sheet and a water-cooled plate, a semiconductor refrigeration sheet and heat dissipation fins with a flat plate and a fan.

[0016] Further preferably, the heat dissipation component adopts a fan, and the groove of the base is also provided with an air duct.

[0017] Further preferably, the heat dissipation component is a water cooling plate, and the groove of the base is also provided with a water pipe groove.

[0018] Further preferably, the water cooling plate and the heat dissipation fins are made of gold, silver, copper, red copper or aluminum alloy, or the outer surface of the copper / red copper / aluminum alloy block is plated with gold.

[0019] Further preferably, the thermally conductive interface material is a thermally conductive silicone plate, thermally conductive graphite paper or a thermally conductive PVDF-based boron nitride composite material, and the thickness of the thermally conductive interface material needs to ensure that the thermal contact between the bottom surface of the TEC to be tested and the heat sink meets relevant test requirements.

[0020] Preferably, the sample carrier is composed of a plurality of plates, and each plate is provided with at least one groove for fixing the sample.

[0021] The present invention utilizes each board to arbitrarily combine slots of different specifications to meet the testing requirements of samples of different specifications at the same time. The sample carrier also has fixing holes and pin holes or positioning structures that match the base or heat dissipation component. The material of the sample carrier is metal, heat insulation material or anti-static material.

[0022] Preferably, the sample carrier also includes a first positioning plate, which is respectively connected to the sample fixing plate and the positioning guide mechanism, and the positioning guide mechanism includes a positioning guide column and a motor, wherein the first positioning plate is detachably fixedly connected to the sample carrier for fixing the sample carrier, the first positioning plate is fixed to the bottom of the positioning guide column, the second positioning plate passes through the positioning guide column and is located above the first positioning plate, a probe and a thermocouple fixing plate are detachably fixed above the second positioning plate, and the motor is connected to the second positioning plate for controlling the movement of the second positioning plate in the Z direction.

[0023] The present invention detachably fixes the probe and the thermocouple fixing plate above the second positioning plate, so that the probe and the thermocouple fixing plate can be replaced accordingly based on the change of the sample carrier plate.

[0024] The present invention utilizes a first positioning plate and a positioning guide column to constrain a sample carrier in the Z direction, and combines the grooves in the sample carrier to constrain the sample in the X and Y directions, thereby realizing the constraint on the position of the sample. At the same time, a second positioning plate is utilized to fix the probe and the thermocouple fixing plate, so as to constrain the X and Y directions of the probe array unit and the thermocouple element. At the same time, the positioning guide column is used to constrain the Z direction of the probe array unit and the thermocouple element, thereby constraining the position of the probe array unit and the thermocouple element. Therefore, by regulating the positioning guide mechanism provided by the present invention, the probe array unit and the thermocouple element can be aligned with the corresponding sample.

[0025] Preferably, when the thermocouple element is a thermocouple wire, the thermocouple wire is fixed inside a thermocouple conduit, and the temperature of the cold surface of the sample is measured through the thermocouple wire;

[0026] Alternatively, when the thermocouple element is a thermocouple film, the thermocouple film is fixed to the end of the thermocouple tube, and the multi-point temperature measurement of the cold surface of the sample is performed through the thermocouple film.

[0027] Compared with thermocouple wires, the present invention can arrange thermocouple thin films more easily on the horizontal plane to achieve the measurement of the specified sample cold surface temperature and multi-point array measurement. For example, the upper surface temperature of a 2mm×2mm sample to be measured can only be measured at one temperature point by placing one wire through thermocouple wires. Thermocouple thin films can be arranged at micron-level resolution, that is, arranging 5 temperature measurement points in a 2mm×2mm area is also achievable.

[0028] Preferably, the probe array unit comprises four probes, two of which are aligned with the positive electrodes of the corresponding sample, and the other two probes are aligned with the negative electrodes of the corresponding sample.

[0029] The present invention uses probes to power micro devices, without the need for wire bonding, and uses a four-probe method to measure voltage, resulting in more accurate test results. The traditional method of wire bonding only has positive and negative leads, so the same method of testing will introduce the resistance of these leads and cause errors. In addition, the probe technology designed by the present invention can be arranged in an array and exist as a modular unit, and batch processing can be performed at the same time, which is also an improvement over the existing technology.

[0030] The present invention also provides a micro device testing system, comprising:

[0031] The sample delivery module is used to load the sample onto the carrier plate, transfer the sample carrier plate to the waiting area for inspection, and send the sample to the inspected area after the inspection is completed;

[0032] The monitoring device of the micro thermoelectric device is used to receive the sample and align and press the probe array unit and the thermocouple element with the corresponding sample based on the instruction, and obtain the current, voltage and temperature signals of the sample during the test process;

[0033] A safety protection module is used to monitor the circuit connectivity, current overload and abnormal temperature of the sample based on a preset safety protection program;

[0034] A program control module, for controlling the monitoring device of the micro thermoelectric device to conduct a DC or AC test on the sample based on a preset test program, so as to realize the set test based on the set power-on system, and to process the obtained current, voltage and temperature signals, archive them and automatically generate a report;

[0035] The sensing and information acquisition module is used to transmit current, voltage and temperature signals to the program control module.

[0036] Traditional technical means need to package each TEC into a module separately, and then assemble the modules in batches for testing. In this way, the module can only be removed and the TEC can be taken out after the life test system has worked for a period of time, and then transferred to the test system for characterization testing. After the test, it is assembled again, and this process is repeated. Compared with traditional solutions, the micro-device testing system provided by the present invention can monitor the status of components in real time. Traditional technology needs to interrupt the test at a fixed time point and take out the sample to the test platform for characterization testing. The monitoring device of the micro-thermoelectric device provided by the present invention integrates testing and characterization, thereby greatly improving the test efficiency. This patent can realize the automatic setting of parameters such as DC / AC power-on mode, power-on time, static time, current direction, on-off time, number of cycles, and downward pressure. It can automatically complete the life test pause, static, test, report generation and storage at a preset time point, and complete the life test with one click.

[0037] The micro device testing system provided by the present invention is connected with the automated production line, bids farewell to the traditional manual sampling, assembly, monitoring, testing and reporting mode, and realizes an intelligent system of automatic sampling, testing and feedback of results with the automated production line.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] During the downward pressing process of the positioning guide mechanism, the present invention utilizes a thermocouple fixing plate elastically connected to the positioning guide mechanism to bring each thermocouple element into close contact with the corresponding sample, thereby reducing the interface thermal resistance. This enables real-time and accurate measurement of the cold surface temperatures of multiple samples at the same time, realizes multi-point temperature measurement, and avoids the situation where some samples are not pressed tightly due to the existence of the tolerance zone, resulting in inaccurate temperature measurement.

[0040] The probe provided by the present invention has telescopic elasticity. When a multi-station design is performed, the telescopic amount of the probe can overcome the height differences between different stations caused by processing precision, while still ensuring normal power supply and electrical signal measurement. The present invention integrates current, voltage and temperature testing into one device for the first time, so that both testing and temperature characterization can be completed in one monitoring device, greatly improving monitoring efficiency.

[0041] Compared with existing monitoring devices that are large in size, inconvenient to move, and basically tested in room temperature environments, the monitoring device provided by the present invention is smaller in size, so it can be used in conjunction with an environmental test chamber to conduct experiments in environments with other temperatures and humidity. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 A schematic diagram of a monitoring device applicable to a micro thermoelectric device provided in a specific embodiment of the present invention;

[0043] Figure 2 A front view of a monitoring device for a micro thermoelectric device provided in a specific embodiment of the present invention;

[0044] Figure 3 A schematic diagram of a probe and a thermocouple fixing plate provided in a specific embodiment of the present invention;

[0045] Figure 4 A schematic diagram of a micro-device testing system provided in accordance with a specific embodiment of the present invention.

[0046] Specific embodiment

[0047] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0048] In order to integrate the current and voltage test and the temperature test of the micro thermoelectric device for accurate testing, a specific embodiment of the present invention provides a monitoring device suitable for the micro thermoelectric device, such as Figure 1and Figure 2 As shown, it includes a base 011, a heat-conducting and heat-dissipating component 012, a sample carrier 013, a probe and thermocouple fixing plate and a positioning guide mechanism. The heat-conducting and heat-dissipating component 012 provided by the present invention is located in the base groove of the base 011, and its height is higher than the base groove. The sample carrier 013 is located on the heat-conducting and heat-dissipating component 012, and the temperature of the heating surface of the sample loaded on the sample carrier 013 is derived through the heat-conducting and heat-dissipating component 012. The probe and thermocouple fixing plate are located on the upper part of the sample carrier 013. A probe fixing plate and a thermocouple fixing plate 014 and a second positioning plate 015 are provided on the probe and thermocouple fixing plate. The probe fixing plate is fixed on the second positioning plate 015, and the thermocouple fixing plate is elastically connected to the second positioning plate 015. The probe fixing plate is provided with a probe having a telescopic mechanism. The probe array unit and the thermocouple fixing plate are provided with thermocouple elements, the probe array unit and the thermocouple elements are aligned with the corresponding samples, and the probe and the thermocouple fixing plate are pressed down by the positioning guide mechanism, so that the sample carrier plate 013 and the probe and the thermocouple fixing plate are pressed tightly, so that the probe array unit is accurately connected to the positive and negative electrodes of the corresponding sample, and the thermocouple elements are pressed tightly on the cold surface of the corresponding sample, so as to realize the simultaneous and real-time measurement of the current, voltage and cold surface temperature of the corresponding sample, and because the thermocouple fixing plate is elastically connected to the second positioning plate 015, and the probes in the probe array unit have a telescopic mechanism, the current, voltage and temperature signals of the samples can still be measured more accurately in batches even if the heights of different workstations are different due to the precision, and the probe includes a power-on probe and a measuring probe.

[0049] The base 011 provided in the specific embodiment of the present invention is provided with a base groove, which is used to fix the heat dissipation component. The height of the base groove is lower than the height of the heat dissipation component. The base 011 is also provided with a pillar, which ensures that the sample carrier 013 and the thermal interface material can be tightly attached to the surface of the heat dissipation component. In a specific embodiment, the specific embodiment of the present invention accurately positions the heat dissipation component in the base groove through a positioning structure or a positioning pin, and ensures that the relative positions of the sample carrier 013, the heat dissipation component and the base 011 do not change by more than 0.005mm before and after the thermal interface material is better.

[0050] A thermocouple is arranged inside the heat-conducting and heat-dissipating component provided in a specific embodiment of the present invention, and the temperature of the heating surface of the detection sample can be measured by the thermocouple. The heat-conducting and heat-dissipating component includes a heat-dissipating component and a thermally conductive interface material. The thermally conductive interface material is located between the heat-dissipating component and the sample carrier, and is used to transfer the heat of the heating surface of the sample to the heat-dissipating component. The heat-dissipating component is used to transfer the heat to the outside.

[0051] The heat dissipation component provided in the specific embodiment of the present invention is a water-cooled plate, a fan and a heat dissipation fin with a flat plate, a semiconductor refrigeration sheet, or a combination of a semiconductor refrigeration sheet and a water-cooled plate, a semiconductor refrigeration sheet and a heat dissipation fin with a flat plate and a fan.

[0052] The heat dissipation component provided in the specific embodiment of the present invention adopts a fan, and the groove of the base is also provided with an air duct.

[0053] The heat dissipation component provided in a specific embodiment of the present invention is a water cooling plate, and the groove of the base is also provided with a water pipe groove.

[0054] The water cooling plate and the heat dissipation fins provided in the specific embodiment of the present invention are made of gold, silver, copper, red copper or aluminum alloy, or the outer surface of the copper / red copper / aluminum alloy block is plated with gold.

[0055] The thermal interface material provided in the specific embodiment of the present invention is a thermally conductive silicone plate, thermally conductive graphite paper or a thermally conductive PVDF-based boron nitride composite material. The thickness of the thermally conductive interface material needs to ensure that the thermal contact between the bottom surface of the TEC to be tested and the heat sink meets the relevant test requirements.

[0056] In a specific embodiment, the heat-conducting and heat-dissipating components include a water-cooled heat sink and a silicone thermal interface material. The thermal interface material itself is slightly sticky and adheres tightly to the surface of the water-cooled heat sink. The silicone thermal interface material is pressed and fixed in place by screwing the sample carrier 013 and the base 011 together.

[0057] The sample carrier 013 provided in a specific embodiment of the present invention includes a sample fixing plate and a first positioning plate. The first positioning plate is detachably fixed to the sample fixing plate and is used to fix the sample carrier. Since it is detachably fixed, it is convenient to replace the sample carrier. The sample fixing plate is located on the heat dissipation assembly, and at least one groove for fixing the sample is provided on the sample fixing plate.

[0058] In a specific embodiment, the sample fixing plate can be a whole plate spliced ​​together from multiple plates, so that slots of different specifications can be arbitrarily combined to meet the testing requirements of samples of different specifications at the same time. It also has fixing holes and pin holes or positioning structures that cooperate with the base or heat dissipation assembly. The material can be metal, heat insulation material or anti-static material.

[0059] The probe and thermocouple fixing plate provided in a specific embodiment of the present invention comprises a first positioning plate, a probe fixing plate and a plurality of thermocouple fixing plates, wherein: Figure 3As shown, the probe fixing plate 0141 is fixed on the second positioning plate 0142, and a probe array unit 01411 with a telescopic mechanism is provided, each probe array unit is aligned with the corresponding sample, and is used to input current to the sample and detect the voltage of the sample, the thermocouple fixing plate 0142 is elastically connected to the probe fixing plate 0141, and a thermocouple tube 01421 and a thermocouple element 01422 are provided on the thermocouple fixing plate 0142, and the thermocouple element 01422 is fixed in the thermocouple tube 01421, and the thermocouple element 01422 is aligned with the corresponding cold surface of the sample, and is used to detect the temperature of the cold surface of the sample.

[0060] The specific embodiment of the present invention aligns the array distribution of the probe array unit arranged on the probe fixing plate and the array distribution of the thermocouple elements arranged on the thermocouple fixing plate with the sample distributed in the array on the sample carrier, so as to realize the measurement of current, voltage and temperature of the sample distributed in the array at the same time. It can be understood that the alignment of the probe, thermocouple elements and the sample provided by the specific embodiment of the present invention can be a (probe / thermocouple / carrier)*n alignment structure or a (probe*n / thermocouple*n / carrier*n) alignment structure. Therefore, no matter how many workstations there are, the alignment structure unit provided by the specific embodiment of the present invention is included in the embodiment of the present invention. At the same time, it allows the assembly of unit groups of different specifications (probe / thermocouple / carrier), where the specifications are their internal structures, and the external structure is a unified interface, supporting the simultaneous measurement of multiple specifications.

[0061] The probe fixing plate provided by the specific embodiment of the present invention can be composed of multiple plates of different specifications spliced ​​together to achieve a one-to-one correspondence with the sample carrier. The probe array unit provided by the specific embodiment of the present invention includes four probes to ensure that the positive and negative electrodes of each sample are contacted by two probes to achieve circuit conduction and four-probe measurement. In a specific embodiment, the four probes fall on the positive and negative electrodes of the sample to be tested in pairs, wherein one probe of the positive electrode is connected to the positive pole of the power supply 018, and the other is connected to the voltage acquisition card, one probe of the negative electrode is connected to the current acquisition card, and the other probe is connected to the voltage acquisition card. The other side of the current acquisition card is connected to the relay control circuit, and then connected to the negative pole of the power supply 018 to form a loop. The relay circuit is controlled by the host computer software and is responsible for the on-off and current regulation of each station circuit. The thermocouple is also connected to the temperature acquisition card, and all acquisition card signals are transmitted to the host computer through the USB / RS-485 converter.

[0062] Each probe provided in the specific embodiment of the present invention has a telescopic mechanism, which can ensure that when there is a height difference between samples in multiple stations, they can accurately contact the electrodes of each sample after being pressed down. In a specific embodiment, the probe is equipped with a spring to ensure that all probes can normally contact the sample electrodes when the Z-direction height difference of all probes does not exceed 0.3mm.

[0063] The thermocouple fixing plate provided in the specific embodiment of the present invention is elastically connected to the second fixing plate by fastening screws and a spring structure, the thermocouple tube is located on the thermocouple fixing plate, and the thermocouple element is fixed on one end of the thermocouple tube so that the thermocouple element is aligned with the corresponding sample.

[0064] When the thermocouple element provided in the specific embodiment of the present invention is a thermocouple wire, the thermocouple wire passes through the thermocouple conduit, shrinks annularly until the conduit diameter is smaller than the hot junction of the thermocouple wire, and then passes the thermocouple wire through the positioning column to tighten it, ensuring that the thermocouple junction is strictly constrained at the guide tube mouth. When pressed down, the thermocouple fixing plate is pressed against the surface of the sample to be tested by the spring force, and at the same time, pressure is applied to the sample to maintain good thermal contact with the heat dissipation component. It is also possible to fix the relative position of the thermocouple junction and the thermocouple conduit in advance, fill the conduit with glue such as epoxy resin, and bond the thermocouple junction to the thermocouple conduit under low vacuum conditions.

[0065] In a specific embodiment, the thermocouple tube provided in this embodiment is a rigid metal syringe, the thermoelectric junction is located at one end of the rigid metal syringe, and the minimum node size is Φ50μm. The thermocouple syringe will be pressed down as the test upper pressure plate 015 is pressed down, and finally pressed on the test surface of the device under test. The spring force presses the device under test and the interface thermal conductive material tightly, and forms good thermal contact with the heat sink.

[0066] When the thermocouple element provided in the specific embodiment of the present invention is a thermocouple wire, the thermocouple wire is fixed inside the thermocouple tube by filling fixing glue into the inside of the thermocouple tube, and the temperature of the cold surface of the sample is measured by the thermocouple wire. Since the thermocouple wire is low in cost, it can be used in batches, but only low-precision detection can be achieved.

[0067] When the thermocouple element provided in the specific embodiment of the present invention is a thermocouple film, at least one thermocouple film can be fixed to the end of the thermocouple tube. It can be understood that the end of the thermocouple tube is a sealing structure, and the thermocouple film is fixed on the end surface of the seal so that the thermocouple film contacts the cold surface of the sample. Compared with thermocouple wires, the specific embodiment of the present invention uses thermocouple films that can be arranged more easily on the horizontal plane to achieve multi-point and more accurate measurement of the cold surface temperature of the sample.

[0068] The positioning and guiding mechanism provided in a specific embodiment of the present invention includes a positioning and guiding column 016 and a motor 017, wherein the first positioning plate is fixed at the bottom of the positioning and guiding column 016, the second positioning plate 015 passes through the positioning and guiding column 016 and is located above the first positioning plate, and a probe fixing plate is detachably fixed above the second positioning plate 015. The motor 017 is connected to the second positioning plate 015 and is used to control the movement of the second positioning plate 015 in the Z direction. The motor 017 is a linear motor.

[0069] The specific embodiment of the present invention also provides a micro device testing system, including a sample delivery module, a micro thermoelectric device monitoring device 01, a safety protection module, a program control module and a sensor and information acquisition module 042. The specific operation process is as follows: Figure 4 shown.

[0070] The sample delivery module provided in the specific embodiment of the present invention includes a transfer module 041, a sample bin 042 to be tested, a sample storage bin, a drive transmission mechanism, a positioning mechanism, an image recognition module, a sample delivery transmission mechanism and a tested sample bin 043.

[0071] Since the test requires the hot surface of the test sample to maintain good thermal contact with the heat sink, the test sample is placed on the thermal interface material on the test carrier. This carrier cannot be used under certain production processes, so it is necessary to determine whether the production carrier is consistent with the test carrier. If they are inconsistent, the sample is loaded into the transfer module 041. The transfer module 41 is required to transfer the test sample on the generated carrier to the test carrier, and the CCD camera is used to position it and the vacuum nozzle is used to transfer it. The transferred sample is stored in the sample warehouse 042, and the test bench is allocated according to its size and the life test system. The test carrier is sent to the designated test bench by the conveying mechanism. On the test bench, the positioning mechanism can install and fix the sample carrier on the base to complete the actual position correction, ensuring that the test carrier and the probe board are perfectly matched. At the same time, the image recognition module identifies the sample number of each position of the test sample 00, and transmits the identity information of the test sample to the host computer software, which collects and records the information.

[0072] The driving test module completes the pressing down of the upper pressure plate, and realizes the circuit conduction of the sample to be tested through the circuit conduction and current and voltage monitoring module.

[0073] The safety protection module provided in the specific embodiment of the present invention controls the power supply 018 protection and adjustment circuit based on the safety protection program 052, so as to monitor whether the circuit is connected, whether the current is overloaded, and whether the cold surface temperature is over-temperature abnormal.

[0074] The program control module provided in the specific embodiment of the present invention controls the power supply 018 to perform the DC / AC test according to the test program 051, and controls the water cooler 032, which is connected to the water cooling plate of the heat dissipation component 012. The main purpose is to control the surface temperature of the heat dissipation component by adjusting the output temperature and water flow of the water cooler. The constant temperature control is generally completed by the PID control program. The initial performance of the test piece at each station, such as AC internal resistance, maximum temperature difference, maximum working current and maximum working voltage, is recorded by the current, voltage and temperature signals transmitted to the host computer software. Then, the set test is carried out according to the power-on system designed by the test program. The set test includes life test, fixed-point test, constant high temperature test or constant temperature and humidity test, etc. The fixed point is controlled by the test program to control the test module to conduct circuit switching, and the test data is recorded in real time by the test program. After the test is completed, the data collection and processing program 053 archives the original data and automatically generates a report. At the same time, the sample delivery mechanism sends the inspected sample to the inspected warehouse.

[0075] The sensing and information acquisition module provided in the specific embodiment of the present invention is used to transmit the current, voltage and temperature signals to the data collection processing program 053 of the program control module for processing.

[0076] The sensing and information acquisition module provided in the specific embodiment of the present invention includes a current acquisition module, a voltage acquisition module and a temperature acquisition module. The current acquisition module is a multi-channel acquisition card. In a single acquisition circuit, the "+" connection point of the current acquisition card is connected to the positive pole of the power supply, the "-" connection point of the current acquisition card is connected to the positive electrode probe of the probe board, and the negative electrode probe of the probe board is connected to the safety protection. The "+" connection point of the voltage acquisition card is connected to the positive electrode test probe of the probe board, and the "-" connection point is connected to the negative electrode test probe 0154 of the probe board. The positive and negative poles of the thermocouple wire are connected to the "+" and "-" connection points of the temperature acquisition module, and the data of each acquisition module is transmitted to the host computer through the converter.

[0077] Example 1

[0078] This embodiment introduces the life test of multiple micro devices with electrode size of 1mm×1mm being powered on for a long time at the same time.

[0079] 1. Customize the sample carrier and probe fixing plate to match the device under test. The length and width of the sample carrier slot are 0.003-0.005mm larger than the length and width of the device under test to ensure that the electrodes of the device under test are accurately constrained. Each measuring electrode on the probe fixing plate has two gold-plated spring needles. The diameter of the measuring needle end is 0.3mm, and the diameter of the conductive needle end is 0.5mm. The relative position relationship between the probe and the device under test is within the tolerance of

[0080] 0.003mm shaft-hole fit constraint.

[0081] 2. The heat conduction and heat dissipation component 012 is composed of a copper water-cooled plate, a conventional TEC and a silicone thermal conductive material. The sample carrier 013 is connected to the base 011 and clamps the heat conduction and heat dissipation component. T-type thermocouple sensors are evenly distributed in the silicone layer to monitor and feedback the temperature of the constant temperature end. The output of the water cooler and the conventional TEC is controlled by the host computer software to maintain accurate temperature control of the constant temperature end.

[0082] 3. Place the devices to be tested into the sample slot of the sample carrier in turn, press down the probe pressure plate through the quick pressing structure and lock the buckle, check the on-off status of the circuit of each station through the host computer software, and set the long-term power-on life test program to (1.2A / 100h+0A / 1h+key performance test)×5 after ensuring that the circuit connection is correct. After clicking start, the host computer program controls the power supply to output a rated current of 1.2A to each station, and collects the real-time current, voltage and temperature values ​​of each station through the sensor and information acquisition module and feeds them back to the host computer software, forming a table for storage and drawing a time-key performance curve for easy visual observation. When the power-on time reaches the set time, it will be still. After the stillness ends, start the test program. The program-controlled power supply outputs 60s, 0.2A DC and 60s, 5000Hz, 0.28A AC according to the host computer program settings, and calculates the AC internal resistance of the samples at each station.

[0083] ACR, dimensionless quality factor Z and response time constant t.

[0084] 4. After the test is completed, the failure rate function is obtained according to the preset failure rules, the key performance decay curve is output and the reliability analysis report is output.

[0085] Example 2

[0086] This embodiment introduces the life test of multiple micro devices with electrode size of 1mm×1mm in a room temperature environment by simultaneously performing positive and negative power cycles.

[0087] 1. Customize the sample carrier and probe fixing plate to match the device under test. The length and width of the sample carrier slot are 0.003-0.005mm larger than the length and width of the device under test to ensure that the electrodes of the device under test are accurately constrained. Each measuring electrode on the probe fixing plate has two gold-plated spring needles. The diameter of the measuring needle end is 0.3mm, and the diameter of the conductive needle end is 0.5mm. The relative position relationship between the probe and the device under test is within the tolerance of

[0088] 0.003mm shaft-hole fit constraint.

[0089] 2. The heat conduction and heat dissipation component 012 is composed of a copper water-cooling plate, a conventional TEC and a silicone thermal conductive material. The sample carrier 013 is connected to the base 011 and clamps the heat conduction and heat dissipation component. T-type thermocouple sensors are evenly distributed in the embedded holes of the copper water-cooling plate to monitor and feedback the temperature of the constant temperature end. The output of the water cooler and the conventional TEC is controlled by the host computer software to maintain accurate temperature control of the constant temperature end.

[0090] 3. Place the devices to be tested into the sample slot of the sample carrier in turn, press down the probe pressure plate through the quick pressing structure and lock the buckle, check the on-off status of the circuit of each station through the upper computer software, and set the positive and negative power-on cycle life test program to (on 1.2A / 4.5min+off 0A / 1.5min)×1000+0A / 2h key performance test)×5 after ensuring the circuit connection is correct. After clicking start, the upper computer program controls the power supply to output 1.2A pulse current to each station, and collects the real-time current, voltage and temperature values ​​of each station through the sensor and information acquisition module and feeds them back to the upper computer software, forming a table for storage and drawing a time-key performance curve for easy visual observation. When the number of cycles reaches the set value, it stops. When it is still, the environment around the sample is first changed to room temperature test environment and maintained for more than one hour. After the stillness ends, the test program is started. The programmable power supply outputs 60s, 0.2A DC and 60s 5000Hz, 0.28A AC according to the upper computer program settings, and calculates the AC internal resistance ACR, dimensionless quality factor Z and response time constant t of the sample at each station.

[0091] 4. After the test is completed, the failure rate function is obtained according to the preset failure rules, the key performance decay curve is output and the reliability analysis report is output.

[0092] Example 3

[0093] This embodiment introduces the life test of multiple micro devices with electrode size of 1mm×1mm in a high temperature and high humidity environment of 85℃ / 85% by simultaneously performing positive and negative power cycles.

[0094] 1. Customize the sample carrier and probe fixing plate to match the device under test. The length and width of the sample carrier slot are 0.003-0.005mm larger than the length and width of the device under test to ensure that the electrodes of the device under test are accurately constrained. Each measuring electrode on the probe fixing plate has two gold-plated spring needles. The diameter of the measuring needle end is 0.3mm, and the diameter of the conductive needle end is 0.5mm. The relative position relationship between the probe and the device under test is within the tolerance of

[0095] 0.003mm shaft-hole fit constraint.

[0096] 2. The heat-conducting and heat-dissipating component 012 is composed of a copper water-cooling plate (with protective paint sprayed on the surface of the sample carrier), conventional TEC and silicone thermal conductive material. The sample carrier 013 is connected to the base 011 and clamps the heat-conducting and heat-dissipating components. The contact surface is sealed with inorganic glue to prevent the copper plate from being corroded. The base, quick-pressing structure, fixing plate and guide structure are made of stainless steel with anti-corrosion coating sprayed on the surface. Under high temperature environment, the thermal expansion dimensions of the probe and the sample carrier alignment structure are the same. A 5mm thick insulating and zero-swelling resin-based fiber-reinforced composite material layer is added to the contact surface between the heat-conducting and heat-dissipating component 012 and the base 011. T-type thermocouple sensors are evenly distributed in the embedded holes of the copper water-cooling plate to monitor and feedback the temperature of the constant temperature end. The output of the water cooler and conventional TEC is controlled by the host computer software to maintain accurate temperature control of the constant temperature end.

[0097] 3. Place the device to be tested into the sample slot of the sample carrier in turn, press down the probe pressure plate through the quick pressure structure and lock the buckle, check the circuit connection of each station through the host computer software, and set the forward and reverse power cycle life test program to (forward 1.2A / 6s+reverse 1.2A / 3s)×1000+0A / 2h key performance test)×5 after ensuring that the circuit connection is correct. After clicking start, the host computer program controls the power supply to output a 1.2A pulse current to each station, reverses the current direction through the programmable relay, and collects the real-time current, voltage and temperature values ​​of each station through the sensor and information acquisition module and feeds them back to the host computer software, forming a table for storage and drawing a time-key performance curve for easy visual observation. When the number of cycles reaches the set value, it will stop. When it is still, first change the surrounding environment of the sample to the room temperature test environment and maintain it for more than one hour. After the stillness ends, start the test program. The programmable power supply outputs 60s, 0.2A DC and 60s according to the host computer program settings.

[0098] 5000Hz, 0.28A AC, and calculate the AC internal resistance ACR, dimensionless quality factor Z and response time constant t of the sample at each workstation.

[0099] 4. After the test is completed, the failure rate function is obtained according to the preset failure rules, the key performance decay curve is output and the reliability analysis report is output.

Claims

1. A monitoring device suitable for a micro thermoelectric device, characterized in that: include: A base, wherein the base is provided with a base groove; A heat-conducting and heat-dissipating component is located in the base groove, a thermocouple is arranged in the heat-conducting and heat-dissipating component, and the thermocouple is used to detect the temperature of the heating surface of the sample; A sample carrier, comprising a sample fixing plate for loading the sample, the sample fixing plate being located on the heat dissipation assembly, and the sample fixing plate being provided with at least one groove for fixing the sample; A probe and thermocouple fixing plate, the probe and thermocouple fixing plate comprising a first positioning plate, a probe fixing plate and a thermocouple fixing plate; the probe fixing plate is fixed on the second positioning plate, and is provided with a probe array unit having a telescopic mechanism, each probe array unit is aligned with a corresponding sample, and is used to detect the current and voltage of the sample; the thermocouple fixing plate is elastically connected to the probe fixing plate, a thermocouple guide tube and a thermocouple element are provided on the thermocouple fixing plate, the thermocouple element is fixed in the thermocouple guide tube, and the thermocouple element is aligned with the corresponding cold surface of the sample, and is used to detect the temperature of the cold surface of the sample; The positioning guide mechanism is fixedly connected to the second positioning plate and the sample carrier plate respectively, and is used to press down the probe and thermocouple fixing plate to align and press the probe array unit and the thermocouple element with the corresponding sample.

2. The monitoring device for micro thermoelectric devices according to claim 1, characterized in that: The heat-conducting and heat-dissipating components include a heat-dissipating assembly and a heat-conducting interface material. The heat-conducting interface material is located between the heat-dissipating assembly and the sample carrier and is used to transfer the heat from the heating surface of the sample to the heat-dissipating assembly. The heat-dissipating assembly is used to transfer the heat to the outside.

3. The monitoring device for micro thermoelectric devices according to claim 2, characterized in that: The heat dissipation component is a water-cooled plate, a fan and a heat dissipation fin with a flat plate, a semiconductor refrigeration sheet, or a combination of a semiconductor refrigeration sheet and a water-cooled plate, a semiconductor refrigeration sheet and a heat dissipation fin with a flat plate and a fan.

4. The monitoring device for micro thermoelectric devices according to claim 2, characterized in that: The thermally conductive interface material is a thermally conductive silicone plate, a thermally conductive graphite paper or a thermally conductive PVDF-based boron nitride composite material.

5. The monitoring device for micro thermoelectric devices according to claim 1, characterized in that: The sample carrier is composed of a plurality of plates, and each plate is provided with at least one groove for fixing the sample.

6. The monitoring device for micro thermoelectric devices according to claim 1, characterized in that: The sample carrier plate further comprises a first positioning plate, and the first positioning plate is respectively connected to the sample fixing plate and the positioning guide mechanism; The positioning and guiding mechanism includes a positioning and guiding column and a motor, wherein the first positioning plate is detachably and fixedly connected to the sample carrier and is used to fix the sample carrier, the first positioning plate is fixed to the bottom of the positioning and guiding column, the second positioning plate passes through the positioning and guiding column and is located above the first positioning plate, a probe and a thermocouple fixing plate are detachably fixed above the second positioning plate, and the motor is connected to the second positioning plate and is used to control the movement of the second positioning plate in the Z direction.

7. The monitoring device for micro thermoelectric devices according to claim 1, characterized in that: When the thermocouple element is a thermocouple wire, the thermocouple wire is fixed inside the thermocouple conduit, and the temperature of the cold surface of the sample is measured through the thermocouple wire; Alternatively, when the thermocouple element is a thermocouple film, the thermocouple film is fixed to the end of the thermocouple tube, and the multi-point temperature measurement of the cold surface of the sample is performed through the thermocouple film.

8. The monitoring device for micro thermoelectric devices according to claim 1, characterized in that: The probe array unit includes four probes, two of which are aligned with the positive electrodes of the corresponding sample, and the other two probes are aligned with the negative electrodes of the corresponding sample.

9. A micro device life test system, characterized in that: include: The sample delivery module is used to load the sample onto the carrier plate, transfer the sample carrier plate to the waiting area for inspection, and send the sample to the inspected area after the inspection is completed; The monitoring device for a micro thermoelectric device according to any one of claims 1 to 8, which is used to receive a sample and align and press the probe array unit and the thermocouple element with the corresponding sample based on instructions, and obtain the current, voltage and temperature signals of the sample during the test; A safety protection module is used to monitor the circuit connectivity, current overload and abnormal temperature of the sample based on a preset safety protection program; A program control module, for controlling the monitoring device of the micro thermoelectric device to conduct a DC or AC test on the sample based on a preset test program, so as to realize the set test based on the set power-on system, and to process the obtained current, voltage and temperature signals, archive them and automatically generate a report; The sensing and information acquisition module is used to transmit current, voltage and temperature signals to the program control module.

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