Packaging structure, optical module and optical system

Abstract

The invention provides a packaging structure, an optical module and an optical system. The packaging structure comprises a photon chip, an optical fiber array and a substrate. Wherein the photon chip is internally provided with a spot size converter, and the spot size converter is composed of a cantilever beam waveguide and a first groove; the optical fiber array comprises optical fibers, a bottom plate and a cover plate, the bottom plate comprises a second groove, the second groove is used for accommodating the optical fibers, and the cover plate is buckled with the bottom plate; wherein the photon chip is arranged on the upper surface of the substrate, the bottom plate or the cover plate is arranged on the upper surface of the substrate, and the cantilever beam waveguide is in coupling connection with the optical fiber. In the packaging structure, the photon chip and the optical fiber array are arranged on the upper surface of the substrate together, and an additional supporting piece is avoided, so that the mechanical stability of the packaging structure can be ensured, the change of stress near the cantilever beam waveguide caused by temperature change, displacement, external force application and the like in the packaging structure is reduced, and low-stress packaging is realized.

Description

Technical Field

[0001] The present application relates to the field of optical communications, and in particular to a packaging structure, an optical module and an optical system. Background Art

[0002] With the rapid development of big data and cloud computing, the network traffic of data centers has shown a rapid growth trend, which has posed more severe challenges to data center networks and optical interconnection technologies. The core of silicon photonics technology is to use silicon as the basic material for optical devices and to build optical components such as optical waveguides, modulators, optical switches, etc. on photonic chips with the help of advanced manufacturing processes. These devices can realize functions such as the generation, transmission, regulation and detection of optical signals.

[0003] The packaging of photonic integrated circuit (PIC) and fiber array (FA) is one of the important technical difficulties in silicon photonics technology. Since the mode field diameter of the waveguide in the photonic chip is small and does not match the mode field diameter of the standard optical fiber, direct coupling of the waveguide with the optical fiber will result in large coupling loss. As a packaging form, a spot size converter (SSC) can be set at the edge of the photonic chip, or it can also be understood as one end of the photonic chip, so that the waveguide mode spot matches the optical fiber mode spot. The mode spot converter can be in the form of a cantilever beam, and the bottom of the cantilever beam type mode spot converter is etched to form a first groove, and the waveguide is suspended relative to the first groove to form a cantilever beam waveguide. However, the cantilever beam structure is sensitive to stress. For example, changes in ambient temperature, application of external forces, movement of the packaging structure, etc. may cause stress to act on the cantilever beam waveguide, which will cause the optical transmission characteristics of the cantilever beam waveguide to change, and the high stress will cause damage to the mechanical structure of the waveguide. Therefore, how to achieve low-stress packaging of the end-face coupling structure is an urgent problem to be solved. Summary of the invention

[0004] The present application provides a packaging structure, an optical module and an optical system, which realize low-stress packaging of an end-face coupling structure by arranging a photonic chip and an optical fiber array on the upper surface of the same substrate.

[0005] In the first aspect, a packaging structure is provided, including a photon chip, an optical fiber array and a substrate, wherein: a pattern spot converter is arranged in the photon chip, the pattern spot converter is composed of a cantilever beam waveguide and a first groove, wherein there is a gap between the cantilever beam waveguide and the first groove; the optical fiber array includes an optical fiber, a bottom plate and a cover plate, the bottom plate includes a second groove, the second groove is used to accommodate the optical fiber, and the cover plate is buckled with the bottom plate; wherein the photon chip is arranged on the upper surface of the substrate, and the bottom plate or the cover plate is arranged on the upper surface of the substrate, and the cantilever beam waveguide is coupled and connected with the optical fiber. In this packaging structure, by arranging the photon chip and the optical fiber array together on the upper surface of the substrate and avoiding the use of additional supporting members, such as pads, the mechanical stability of the packaging structure can be ensured, and the stress changes near the cantilever beam waveguide caused by temperature changes, displacements, external force application, etc. in the packaging structure can be reduced, so as to achieve low-stress packaging.

[0006] In combination with the first aspect, in certain implementations of the first aspect, the coupling connection between the cantilever beam waveguide and the optical fiber includes: the end of the cantilever beam waveguide is butted against the end of the optical fiber. Thus, in a packaging solution where the cantilever beam waveguide is directly coupled to the optical fiber, by arranging the photonic chip and the optical fiber array on the upper surface of the same substrate, the problem of excessive local stress in the coupling area of ​​the cantilever beam waveguide and the optical fiber due to temperature changes, displacements, external force application, etc. is avoided, thereby reducing packaging losses.

[0007] In combination with the first aspect, in certain implementations of the first aspect, the projections of the optical fiber and the photonic chip on the substrate do not overlap, thereby preventing the optical fiber from over-extending to the photonic chip, causing mechanical damage such as breakage of the optical fiber, and reducing stress between the cantilever beam waveguide and the optical fiber, thereby reducing packaging loss.

[0008] In combination with the first aspect, in certain implementations of the first aspect, the projections of the bottom plate and the photonic chip on the substrate are spaced apart, and the optical fiber extends beyond the bottom plate at one end adjacent to the photonic chip. By moving the bottom plate backward, the stress between the cantilever beam waveguide and the optical fiber can be reduced, thereby reducing packaging loss.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the projections of the cover plate and the photonic chip on the substrate are spaced apart, and the optical fiber extends beyond the cover plate at one end adjacent to the photonic chip. By moving the cover plate backward, optical fiber identification and glue dispensing can be facilitated during the preparation of the optical fiber array, thereby optimizing the preparation process. The stress between the cantilever beam waveguide and the optical fiber can also be reduced, thereby reducing packaging losses.

[0010] In combination with the first aspect, in certain implementations of the first aspect, the projections of the bottom plate and the photonic chip on the substrate have a spacing, and the projections of the cover plate and the photonic chip on the substrate have a spacing, and the optical fiber extends beyond the bottom plate and the cover plate at one end adjacent to the photonic chip. By moving the bottom plate and the cover plate backward, it is possible to facilitate optical fiber identification and glue dispensing during the preparation of the optical fiber array, thereby optimizing the preparation process. It is also possible to reduce stress between the cantilever beam waveguide and the optical fiber, thereby reducing packaging losses.

[0011] In combination with the first aspect, in some implementations of the first aspect, wherein: the material of the substrate is fused quartz, Invar, Kovar, silicon carbide, silicon, aluminum oxide, aluminum nitride or tungsten copper alloy; and / or the thermal expansion rate of the substrate is 0.3-10ppm / °C. This ensures that the packaging structure can ensure low stress of the packaging structure in a "three-temperature" environment, and ensures the mechanical stability of the packaging structure. In some implementations, the material of the substrate is aluminum oxide, aluminum nitride or tungsten copper alloy; and / or the thermal expansion rate of the substrate is 4-8ppm / °C. This further matches the expansion rate of the material used for the substrate with the material used for the optical fiber array and the photonic chip, ensuring that the packaging structure can ensure low stress of the packaging structure in a "three-temperature" environment, and ensures the mechanical stability of the packaging structure.

[0012] In combination with the first aspect, in certain implementations of the first aspect, a first bonding portion is provided at the coupling of the cantilever beam waveguide and the optical fiber, wherein: the first bonding portion is made of silicone; and / or the modulus of the first bonding portion is less than 1Mpa; and / or the refractive index of the first bonding portion is 1.35-1.45; and / or the thermal expansion coefficient of the first bonding portion is less than 100ppm / °C. Thus, the optical signal is limited to be transmitted between the cantilever beam waveguide and the optical fiber, and a "soft connection" between the cantilever beam waveguide and the optical fiber is achieved, local stress is reduced, and local stress of the cantilever beam waveguide or the optical fiber due to temperature changes, displacements, external force application, etc. in the packaging structure is avoided, and the low stress of the packaging structure can be ensured in the "three-temperature" environment.

[0013] In combination with the first aspect, in some implementations of the first aspect, a second bonding portion is provided in the first groove, the second bonding portion contacts the cantilever beam waveguide, or the second bonding portion covers the cantilever beam waveguide, wherein: the second bonding portion is made of silicone; and / or the modulus of the second bonding portion is less than 1Mpa; and / or the refractive index of the second bonding portion is 1.35-1.45; and / or the thermal expansion coefficient of the second bonding portion is less than 100ppm / °C. Thus, the cantilever beam waveguide is protected, local stress is reduced, and mechanical damage to the cantilever beam waveguide caused by temperature change, displacement, external force, etc. is avoided, and the optical signal is limited to be transmitted in the cantilever beam waveguide, and it is ensured that the second bonding portion generates a large thermal expansion in the "three-temperature" environment to avoid mechanical damage to the cantilever beam waveguide.

[0014] In combination with the first aspect, in certain implementations of the first aspect, an adhesive layer is provided between the optical fiber array and / or the photonic chip and the substrate, wherein: the adhesive layer is made of epoxy resin or acrylic acid; and / or the shrinkage rate of the adhesive layer is less than 0.3%. This prevents the optical fiber array and / or the photonic chip from shifting and reduces packaging losses. The adhesive layer 160 may be made of epoxy resin or acrylic acid, thereby preventing the optical fiber array and / or the photonic chip from shifting and reducing packaging losses.

[0015] In combination with the first aspect, in some implementations of the first aspect, a glue guide groove is provided on the substrate, and the glue guide groove is located between the photonic chip and the optical fiber array. The glue guide groove is used to guide the flow of glue when dripping glue on the first bonding part and the second bonding part during the packaging stage, so as to avoid contact between the glue on the first bonding part and the second bonding part and the glue on the bonding layer, which may cause contamination.

[0016] In combination with the first aspect, in some implementations of the first aspect, the pattern spot converter includes N cantilever beam waveguides, the optical fiber array includes N optical fibers, the N cantilever beam waveguides correspond to the N optical fibers one by one, the cantilever beam waveguides in the N cantilever beam waveguides are coupled to the corresponding optical fibers, and N is a positive integer. In some implementations, N is a positive integer greater than or equal to 2, and in the case where the packaging structure is a multi-channel packaging structure, by arranging the photonic chip and the optical fiber array on the same substrate, the stability of the packaging structure is increased, and high stress can be avoided in the coupling part of the N optical fibers and the N cantilever beam waveguides, thereby reducing the restriction on the optical fibers in the optical fiber array.

[0017] In combination with the first aspect, in some implementations of the first aspect, wherein: the packaging structure includes M optical fiber arrays, the photonic chip includes M spot mode converters, the M optical fiber arrays correspond to the M spot mode converters one by one, the optical fiber arrays in the M optical fiber arrays are coupled to the corresponding spot mode converters, and M is a positive integer. In some implementations, M is a positive integer greater than or equal to 2. The packaging structure can be a co-packaging structure, thereby shortening the transmission distance of the optical signal, reducing packaging loss, and reducing system cost and energy loss.

[0018] In a second aspect, a packaging structure and an optical component including the first aspect and any possible implementation of the first aspect are provided. The optical component is optically connected to the packaging structure, and the optical component is used to receive and / or send optical signals.

[0019] In a third aspect, an optical system is provided, comprising an optoelectronic device and the second aspect and any possible optical module, wherein the optoelectronic device is connected to the optical module, and the optoelectronic device is any one of an optical switch, an optical fiber router, and an optical fiber network card. The optoelectronic device may include multiple ports, each of the multiple ports corresponds to an optical transmission channel, and the ports of the multiple ports are connected to the optical module, thereby realizing multi-channel, high-speed data transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of a packaging structure provided in an embodiment of the present application.

[0021] Figure 2 A pattern spot converter is provided in an embodiment of the present application.

[0022] Figure 3 It is a schematic diagram of another packaging structure provided in an embodiment of the present application.

[0023] Figure 4 It is a schematic diagram of another packaging structure provided in an embodiment of the present application.

[0024] Figure 5 It is a schematic diagram of another packaging structure provided in an embodiment of the present application.

[0025] Figure 6 It is a schematic diagram of an optical module provided in an embodiment of the present application.

[0026] Figure 7 It is a schematic diagram of an optical system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0027] The technical solution in this application will be described below in conjunction with the accompanying drawings.

[0028] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0029] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0030] In the description of the embodiments of the present application, the terms "upper", "lower", "vertical", "horizontal", etc. indicate orientations or positional relationships that are defined relative to the orientations or positions of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative descriptions and clarifications, rather than indicating or implying that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. They may change accordingly according to changes in the orientations of the components placed in the drawings, and therefore cannot be understood as limitations on the present application.

[0031] The terms "including" and "having" and any variations thereof in the embodiments of the present application shown below are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units that are not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0032] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions, and embodiments or designs described as "exemplary" or "for example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. The use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way for easy understanding.

[0033] With the rapid development of big data and cloud computing, the network traffic of data centers has shown a rapid growth trend, which has posed more severe challenges to data center networks and optical interconnection technologies. In traditional data center networks, there are some limitations in the use of electronic interconnection technology, such as high power consumption, limited bandwidth, and high latency. In order to meet the requirements of high bandwidth, low latency, and energy saving, silicon photonics technology has attracted much attention. The core of silicon photonics technology is to use silicon as the basic material for optical devices, and to use advanced manufacturing processes to build optical components such as optical waveguides, modulators, and optical switches on photonic chips. These devices can realize functions such as the generation, transmission, regulation, and detection of optical signals. Compared with traditional optical devices, silicon photonics technology has the advantages of low manufacturing cost, high integration, and strong compatibility.

[0034] The packaging of photonic chips (photonics integrated circuit, PIC) and fiber arrays (fiber array, FA) is one of the important technical difficulties in silicon photonics technology. Since the mode field diameter of the waveguide in the photonic chip is small and does not match the mode field diameter of the standard optical fiber, direct coupling of the waveguide with the optical fiber will result in large coupling losses. At present, the packaging structure of photonic chips and optical fibers can be divided into end-face coupling packaging structure and grating coupling packaging structure. Among them, the end-face coupling packaging structure can refer to a packaging structure formed by directly or indirectly optically connecting the end face of the photonic chip and the end face of the optical fiber. The grating coupling packaging structure can refer to a packaging structure formed by optically connecting the photonic chip and the optical fiber through a grating. Although the grating coupling packaging structure has the advantages of large tolerance and easy adjustment, the grating itself will cause loss of optical signals. The end-face coupling packaging structure has the advantages of low packaging loss and small size, and has become the main form of coupling packaging structure.

[0035] As a packaging form of an end-face coupling structure, a spot size converter (SSC) can be set at the edge of the photonic chip, or it can also be understood as one end of the photonic chip, so that the waveguide spot and the optical fiber spot match. The spot converter can be in the form of a cantilever beam. The bottom of the cantilever beam spot converter is etched to form a first groove. The waveguide is suspended relative to the first groove to form a cantilever beam waveguide. The air in the first groove is used to limit the transmitted optical signal to be transmitted in the cantilever beam waveguide, thereby achieving mode field matching and reducing packaging losses. However, the cantilever beam structure is sensitive to stress. For example, changes in ambient temperature, the application of external forces, the movement of the packaging structure, etc. may cause stress to act on the cantilever beam waveguide, which will cause the optical transmission characteristics of the cantilever beam waveguide to change, and the high stress will cause damage to the mechanical structure of the waveguide. Therefore, how to achieve low-stress packaging of the end-face coupling structure is an urgent problem to be solved.

[0036] In view of this, the embodiments of the present application provide a packaging structure, an optical module and an optical system, which realize low-stress packaging of an end-face coupling structure by arranging a photonic chip and an optical fiber array on the upper surface of the same substrate.

[0037] Figure 1 It is a schematic diagram of a packaging structure provided in an embodiment of the present application. Figure 1 (a), (b) and (c) show side views of the packaging structure. Figure 1 (d) shows a top view of the packaging structure. Figure 1 As shown, the packaging structure may include a photonic chip 110 , an optical fiber array 120 , and a substrate 130 .

[0038] A spot converter is provided in the photonic chip 110. The spot converter is composed of a cantilever beam waveguide 113 and a first groove 112. The optical fiber array 120 includes an optical fiber 121. The photonic chip 110 is provided on the upper surface of the substrate 130, and the optical fiber array 120 is provided on the upper surface of the substrate 130, and the cantilever beam waveguide 113 is coupled and connected with the optical fiber 121.

[0039] The cantilever beam waveguide 113 may specifically refer to the suspended portion of the waveguide 111 relative to the first groove 112. Alternatively, the cantilever beam waveguide 113 and the waveguide 111 may also be separate optical components, and optical elements such as a coupler and a beam splitter are provided between the cantilever beam waveguide 113 and the waveguide 111, which is not limited in the present application. There is a gap between the cantilever beam waveguide 113 and the first groove 112, or it can also be understood that there is a gap between the cantilever beam waveguide 113 and the first groove 112, or there is no contact between the cantilever beam waveguide 113 and the first groove 112. In addition, the first groove may also be referred to as an undercut.

[0040] The optical fiber array 120 may include a bottom plate 122 and a cover plate 123. The bottom plate 122 may be provided with a second groove, which may be a V-groove for accommodating the optical fiber. The bottom plate 122 and the cover plate 123 may be fastened together, and the fastening method may be glue bonding or other methods. The optical fiber array 120 may be provided on the upper surface of the substrate 130 as follows: Figure 1 As shown in (a), the cover plate 123 is disposed on the upper surface of the substrate 130, or as shown in Figure 1 As shown in (b), the cover plate 123 is disposed on the upper surface of the substrate 130. Alternatively, the optical fiber array 120 may also be assembled in other ways, which is not limited in the present application.

[0041] The coupling connection between the cantilever beam waveguide 113 and the optical fiber 121 may specifically refer to a direct optical connection or an indirect optical connection between the cantilever beam waveguide 113 and the optical fiber 121. The indirect optical connection may refer to an adapter, a lens, a polymer waveguide, etc. being provided between the cantilever beam waveguide 113 and the optical fiber 121. Figure 1 In the case shown in , the coupling connection between the cantilever waveguide 113 and the optical fiber 121 specifically refers to the butt connection between the end of the cantilever waveguide 113 and the end of the optical fiber 121, or it can also be understood that the end face of the cantilever waveguide 113 is butted against the end face of the optical fiber 121, or the cantilever waveguide 113 is aligned or aligned with the optical fiber 121. Therefore, in the packaging solution of direct coupling between the cantilever waveguide and the optical fiber, by arranging the photonic chip and the optical fiber array on the upper surface of the same substrate, the problem of excessive local stress in the coupling area of ​​the cantilever waveguide and the optical fiber is avoided due to temperature changes, displacements, external force application, etc., and the packaging loss is reduced.

[0042] The photonic chip 110 may be mainly made of silicon material, and the cantilever beam waveguide part provided in the photonic chip 110 may be glass, that is, silicon dioxide material. The cover plate 123 and the bottom plate 122 in the optical fiber array 120 may be made of glass. The mode spot converter expands the mode spot of the cantilever beam waveguide 113 to 9 μm, which is the same as that of the optical fiber 121.

[0043] In such Figure 1 In the packaging structure shown, by arranging the photonic chip and the optical fiber array together on the upper surface of the substrate and avoiding the use of additional support members, such as gaskets, the mechanical stability of the packaging structure can be ensured, and the stress changes near the cantilever beam waveguide caused by temperature changes, displacements, external forces, etc. in the packaging structure can be reduced, thereby achieving low-stress packaging.

[0044] In some implementations, the thermal expansion rate of the substrate 130 can be 0.3-10ppm / °C, so as to ensure that the expansion rate of the material used for the substrate matches that of the material used for the optical fiber array and the photonic chip, so as to ensure that the packaging structure can ensure low stress of the packaging structure under the "three temperatures" environment, where the "three temperatures" specifically refer to low temperature of -40°C, room temperature of 25°C and high temperature of 85°C. Among them, the material of the substrate 130 can be fused quartz, Invar alloy, Kovar alloy, silicon carbide, or silicon. In some implementations, the material of the substrate 130 can be aluminum oxide, aluminum nitride or tungsten copper alloy, and the thermal expansion rate of the substrate 130 can be 4-8ppm / °C, so as to ensure that the expansion rate of the material used for the substrate matches that of the material used for the optical fiber array and the photonic chip, so as to ensure that the packaging structure can ensure low stress of the packaging structure under the "three temperatures" environment, and ensure the mechanical stability of the packaging structure.

[0045] In some implementations, such as Figure 1As shown in (c), a first bonding portion 140 is provided at the coupling point between the cantilever beam waveguide and the optical fiber. The refractive index of the first bonding portion 140 is 1.35-1.45, thereby limiting the transmission of the optical signal between the cantilever beam waveguide and the optical fiber, further reducing the packaging loss. The modulus of the first bonding portion 140 can be less than 1Mpa, thereby achieving a "soft connection" between the cantilever beam waveguide and the optical fiber, reducing local stress, and avoiding packaging losses of the cantilever beam waveguide or optical fiber caused by temperature changes, displacements, external forces, etc. in the packaging structure. The thermal expansion coefficient of the first bonding portion 140 can be less than 100ppm / ℃, thereby ensuring that the packaging structure can maintain low stress in the "three-temperature" environment. The first bonding portion 140 may be made of silicone material, thereby limiting the transmission of the optical signal between the cantilever beam waveguide and the optical fiber, and achieving a "soft connection" between the cantilever beam waveguide and the optical fiber, reducing local stress, avoiding an increase in local stress of the cantilever beam waveguide or optical fiber caused by temperature changes, displacement, external force application, etc. in the packaging structure, and ensuring that the packaging structure can maintain low stress in a "three-temperature" environment.

[0046] In some implementations, such as Figure 1 As shown in (c), a second adhesive portion 150 is provided in the first groove, and the second adhesive portion 150 is in contact with the cantilever beam waveguide, or the second adhesive portion 150 covers the cantilever beam waveguide. Among them, the modulus of the second adhesive portion 150 can be less than 1Mpa, so as to protect the cantilever beam waveguide, reduce local stress, and avoid mechanical damage to the cantilever beam waveguide caused by temperature changes, displacement, external force, etc. The refractive index of the second adhesive portion 150 can be 1.35-1.45, so that it will limit the optical signal to be transmitted in the cantilever beam waveguide together with the air in the first groove. The thermal expansion coefficient of the second adhesive portion 150 can be less than 100ppm / ℃, so as to ensure that the second adhesive portion produces a large thermal expansion in the "three-temperature" environment, and avoid mechanical damage to the cantilever beam waveguide. The second bonding part 150 can be made of silicone material, so as to protect the cantilever beam waveguide, reduce local stress, avoid mechanical damage to the cantilever beam waveguide caused by temperature change, displacement, external force, etc., and limit the transmission of the optical signal in the cantilever beam waveguide, and ensure that the second bonding part generates a large thermal expansion under the "three-temperature" environment to avoid mechanical damage to the cantilever beam waveguide. The thickness of the second bonding part below the cantilever beam waveguide can be the same as the thickness of the second bonding part above the cantilever beam waveguide, so as to further ensure the stress balance at the cantilever beam waveguide.

[0047] In some implementations, such as Figure 1As shown in (c), an adhesive layer 160 is provided between the optical fiber array and the substrate, and / or an adhesive layer 160 is provided between the photonic chip and the substrate. The shrinkage rate of the adhesive layer 160 may be less than 0.3%, thereby preventing the optical fiber array and / or the photonic chip from shifting and reducing packaging loss. The adhesive layer 160 may be made of epoxy resin or acrylic acid, thereby preventing the optical fiber array and / or the photonic chip from shifting and reducing packaging loss.

[0048] In some implementations, such as Figure 1 As shown in (a), (b), (c), and (d), the projections of the optical fiber 121 and the photonic chip 110 on the substrate 130 do not overlap, thereby preventing the optical fiber from excessively extending to the photonic chip, which would cause mechanical damage such as breakage of the optical fiber, and reducing the stress between the cantilever beam waveguide and the optical fiber, thereby reducing packaging losses.

[0049] like Figure 1 The specific process of the pattern spot converter shown in is determined according to actual conditions. Figure 2 It is a pattern spot converter provided by an embodiment of the present application. The pattern spot converter is composed of a cantilever beam waveguide 210, a first groove 220 and a bracket 230. Among them, the bracket 230 is used to support the cantilever beam waveguide 210 so that the cantilever beam waveguide 210 and the first groove 220 are not in contact, or it can also be understood that the cantilever beam waveguide 210 is suspended relative to the first groove 220, so as to constrain the optical signal emitted from the optical fiber 121 to be transmitted in the cantilever beam waveguide 210.

[0050] In some implementations, the pattern spot converter includes N cantilever beam waveguides. In this case, the lateral dimension of the first groove 220 can be extended accordingly, and the bracket 230 is used to support the N cantilever beam waveguides. The optical fiber array includes N optical fibers in one-to-one correspondence with the N cantilever beam waveguides of the pattern spot converter. The cantilever beam waveguides in the N cantilever beam waveguides are coupled with the corresponding optical fibers, and N is a positive integer. In some implementations, N is a positive integer greater than or equal to 2. In the case where the packaging structure is a multi-channel packaging structure, by arranging the photonic chip and the optical fiber array on the same substrate, the stability of the packaging structure is increased, and high stress can be avoided in the coupling part of the N optical fibers and the N cantilever beam waveguides, thereby reducing the restriction on the optical fibers in the optical fiber array. Using the packaging structure of the present application, an optical fiber with an outer diameter of 127μm and an inner diameter of 125μm can be used as a transmission medium for optical signals to achieve a high-density lateral pitch arrangement scheme without using a conventional 250μm size optical fiber.

[0051] Figure 3 It is a schematic diagram of another packaging structure provided in an embodiment of the present application. Figure 3The packaging structure includes a photonic chip 310, an optical fiber array 320, a substrate 330, a mode spot converter provided in the photonic chip, a first groove and a cantilever beam waveguide included in the mode spot converter, and an optical fiber, a bottom plate 322 and a cover plate 323 included in the optical fiber array 320, and Figure 1 The same is true in , so I will not repeat it here.

[0052] like Figure 3 As shown, in the packaging structure, a glue guide groove 370 may be further provided on the substrate 330, and the glue guide groove 370 is located between the photonic chip 310 and the optical fiber array 320. The glue guide groove 370 is used to guide the flow when glue is dripped on the first bonding part 340 and the second bonding part 350 during the packaging stage, so as to avoid contact between the glue of the first bonding part 340 and the second bonding part 350 and the glue of the bonding layer 360, which may cause contamination.

[0053] Figure 4 It is a schematic diagram of another packaging structure provided in an embodiment of the present application. Figure 4 The packaging structure includes a photonic chip 410, an optical fiber array 420, a substrate 430, a mode spot converter provided in the photonic chip, a first groove and a cantilever beam waveguide included in the mode spot converter, and an optical fiber, a bottom plate 422 and a cover plate 423 included in the optical fiber array 420, and Figure 1 The same is true in , so I will not repeat it here.

[0054] In some implementations, such as Figure 4 As shown in (a), the projections of the cover plate 423 and the photonic chip 410 on the substrate 430 are spaced apart, and the optical fiber 421 extends beyond the cover plate 423 at one end adjacent to the photonic chip 410. By moving the cover plate 423 backward, it is possible to facilitate optical fiber identification and glue dispensing during the preparation of the optical fiber array, thereby optimizing the preparation process. It can also reduce the stress between the photonic chip and the optical fiber, and reduce packaging losses. In addition, when a first bonding portion 440, a second bonding portion 450, and an adhesive layer 460 are provided in the packaging structure, the bonding surface between the cover plate 423 and the photonic chip 410 in the first bonding portion 440 can be eliminated to prevent the glue from flowing out and contacting the glue in the adhesive layer 460 to cause contamination.

[0055] In some implementations, such as Figure 4As shown in (b), the projections of the bottom plate 422 and the photonic chip 410 on the substrate 430 are spaced apart, and the optical fiber 421 extends beyond the bottom plate 422 at one end adjacent to the photonic chip 410. By moving the bottom plate 422 backward, the stress between the cantilever beam waveguide and the optical fiber can be reduced, and the packaging loss can be reduced. In addition, when the first bonding portion 440, the second bonding portion 450, and the bonding layer 460 are provided in the packaging structure, the bonding surface between the cover plate 423 and the photonic chip 410 in the first bonding portion 440 can be eliminated to prevent the glue from flowing out and contacting with the glue in the bonding layer 460 to cause contamination.

[0056] In some implementations, such as Figure 4 As shown in (c), the projections of the bottom plate 422 and the photonic chip 410 on the substrate 430 have a spacing, and the projections of the cover plate 423 and the photonic chip 410 on the substrate 430 have a spacing, and the optical fiber 421 extends beyond the bottom plate 422 and the cover plate 423 at one end adjacent to the photonic chip 410. By moving the bottom plate 422 and the cover plate 423 backward, it is possible to facilitate optical fiber identification and glue dispensing in the preparation stage of the optical fiber array, thereby optimizing the preparation process. It can also reduce the stress between the cantilever beam waveguide and the optical fiber and reduce the packaging loss. In addition, when the first bonding portion 440, the second bonding portion 450, and the bonding layer 460 are provided in the packaging structure, the bonding surface between the cover plate 423 and the photonic chip 410 in the first bonding portion 440 can be eliminated to prevent the glue from flowing out and contacting the glue in the bonding layer 460 to cause contamination.

[0057] Figure 5 Schematic diagram of another packaging structure provided by an embodiment of the present application. Figure 5 As shown, the packaging structure includes M optical fiber arrays 520, the photonic chip 510 includes M spot converters, the M optical fiber arrays 520 correspond to the M spot converters one by one, the optical fiber arrays in the M optical fiber arrays are coupled with the corresponding spot converters, and M is a positive integer. In some implementations, M is a positive integer greater than or equal to 2, and the packaging structure can be a co-package structure (coupled package optics, CPO), thereby shortening the transmission distance of the optical signal, reducing packaging loss, and reducing system cost and energy loss.

[0058] It should be understood that Figure 5 Only the case where M is equal to 4 is shown, and the specific form of the packaging structure should not be limited. It should be understood that Figure 5 Only the case where the M optical fiber arrays 510 and the photonic chip 510 are simultaneously arranged on the upper surface of the substrate 530 is shown. In addition, the optical fiber arrays in the M optical fiber arrays 520 may also be partially arranged on the upper surface of the substrate 530, and the present application does not limit this.

[0059] In some implementations, the optical fiber array in the M optical fiber arrays includes one optical fiber, and the spot mode converter in the M spot mode converters includes a cantilever beam waveguide. In this case, the optical fiber array and the spot mode converter are specifically used for single-channel optical signal transmission.

[0060] In some implementations, the optical fiber array in the M optical fiber arrays includes N optical fibers, and the pattern spot converter in the M pattern spot converters includes N cantilever beam waveguides, where N is a positive integer greater than or equal to 2. The number of optical fibers included in each of the M optical fiber arrays may be the same or different, and correspondingly, the number of cantilever beam waveguides included in each of the M pattern spot converters may be the same or different. In this case, the optical fiber array and the pattern spot converter are specifically used for multi-channel optical signal transmission.

[0061] Figure 6 Schematic diagram of an optical module provided in an embodiment of the present application. Figure 6 As shown, the optical module may include an optical component 610 and a packaging structure 620. The optical component 610 is optically connected to the packaging structure 620. The optical component 610 is used to receive and / or send optical signals. The specific configuration of the packaging structure 620 is as follows: Figures 1 to 5 As shown. When the optical component 610 is used to send an optical signal, the optical component 610 may include a light source, a modulator, a filter, etc. When the optical component 610 is used to receive an optical signal, the optical component 610 may include a processor, a detector, etc. In some implementations, the optical component 610 includes a light source of multiple wavelengths, and the corresponding packaging structure 620 is used to send and / or receive optical signals of multiple wavelengths.

[0062] The components included in the optical component can be arranged in the photonic chip in the packaging structure, or the components included in the optical component and the photonic chip and optical fiber array in the packaging structure are discrete components, and the specific optical module form is determined according to the actual situation. The optical connection between the optical component 610 and the packaging structure 620 can refer to a direct optical connection or an indirect optical connection, and the indirect optical connection can refer to the provision of optical elements such as couplers and beam splitters between the components in the optical component 610 and the photonic chip or optical fiber array in the packaging structure 620.

[0063] In some implementations, the optical module also includes a printed circuit board (PCB), and the PCB is electrically connected to the photonic chip in the packaging structure 620. The specific electrical connection method can be through wires, wire welding, wire bonding, etc. The PCB can be used to process the optical signal sent and / or received by the photonic chip. For example, the PCB is used to send electrical signals, and the photonic chip is used to convert the electrical signal into an optical signal for transmission. Alternatively, the photonic chip is used to receive an optical signal, and the PCB is used to convert the optical signal into an electrical signal and process it.

[0064] Figure 7 Schematic diagram of an optical system provided in an embodiment of the present application. Figure 7 As shown, the optical system may include optoelectronic devices and Figure 6 The optical module shown. The optoelectronic device can be any one of an optical switch, an optical fiber router, and an optical fiber network card, and the optoelectronic device is connected to the optical module.

[0065] The optoelectronic device may include multiple ports, each of which corresponds to an optical transmission channel, and the ports of the multiple ports are connected to optical modules, thereby realizing multi-channel, high-speed data transmission. The optical switch can be used to realize data exchange between multiple optical transmission channels. The optical fiber router can be used to convert optical signals into data signals and realize the forwarding and routing of data signals. The optical fiber network card can be used in an Ethernet network to realize the connection between a computer and an optical fiber.

[0066] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A packaging structure, characterized in that: It includes a photonic chip, an optical fiber array and a substrate, wherein: The photonic chip is provided with a pattern spot converter, which is composed of a cantilever beam waveguide and a first groove, wherein there is a gap between the cantilever beam waveguide and the first groove; The optical fiber array comprises optical fibers, a bottom plate and a cover plate, the bottom plate comprises a second groove, the second groove is used to accommodate the optical fibers, and the cover plate is buckled with the bottom plate; The photonic chip is arranged on the upper surface of the substrate, and the bottom plate or the cover plate is arranged on the upper surface of the substrate, and the cantilever beam waveguide is coupled and connected with the optical fiber.

2. The packaging structure according to claim 1, characterized in that: The coupling connection between the cantilever beam waveguide and the optical fiber includes: a terminal end of the cantilever beam waveguide is butted with a terminal end of the optical fiber.

3. The packaging structure according to claim 1 or 2, characterized in that: Projections of the optical fiber and the photonic chip on the substrate do not overlap.

4. The packaging structure according to any one of claims 1 to 3, characterized in that: in: The bottom plate and the projection of the photonic chip on the substrate have a distance therebetween, and the optical fiber extends out of the bottom plate at one end adjacent to the photonic chip; or The projections of the cover plate and the photonic chip on the substrate are spaced apart, and the optical fiber extends out of the cover plate at one end adjacent to the photonic chip; or The bottom plate and the projection of the photonic chip on the substrate have a spacing, and the cover plate and the projection of the photonic chip on the substrate have a spacing, and the optical fiber extends beyond the bottom plate and the cover plate at one end adjacent to the photonic chip.

5. The packaging structure according to any one of claims 1 to 4, characterized in that: in: The material of the substrate is fused quartz, Invar alloy, Kovar alloy, silicon carbide, silicon, aluminum oxide, aluminum nitride or tungsten copper alloy; and / or The thermal expansion coefficient of the substrate is 0.3-10 ppm / °C.

6. The packaging structure according to any one of claims 1 to 5, characterized in that: A first bonding portion is provided at the coupling point between the cantilever beam waveguide and the optical fiber, wherein: The first bonding portion is made of silicone; and / or The modulus of the first bonding portion is less than 1 MPa; and / or The refractive index of the first bonding portion is 1.35-1.45; and / or The thermal expansion coefficient of the first bonding portion is less than 100 ppm / °C.

7. The packaging structure according to any one of claims 1 to 6, characterized in that: A second bonding portion is disposed in the first groove, the second bonding portion is in contact with the cantilever beam waveguide, or the second bonding portion covers the cantilever beam waveguide, wherein: The second bonding portion is made of silicone; and / or The modulus of the second bonding portion is less than 1 MPa; and / or The refractive index of the second bonding portion is 1.35-1.45; and / or The thermal expansion coefficient of the second bonding portion is less than 100 ppm / °C.

8. The packaging structure according to any one of claims 1 to 7, characterized in that: An adhesive layer is provided between the optical fiber array and / or the photonic chip and the substrate, wherein: The adhesive layer is made of epoxy resin or acrylic acid; and / or The shrinkage rate of the adhesive layer is less than 0.3%.

9. The packaging structure according to any one of claims 1 to 8, characterized in that: The substrate is provided with a glue guiding groove, and the glue guiding groove is located between the photonic chip and the optical fiber array.

10. The packaging structure according to any one of claims 1 to 9, characterized in that: The pattern spot converter includes N cantilever beam waveguides, the optical fiber array includes N optical fibers, the N cantilever beam waveguides correspond to the N optical fibers one by one, the cantilever beam waveguides in the N cantilever beam waveguides are coupled with the corresponding optical fibers, and N is a positive integer.

11. The packaging structure according to any one of claims 1 to 10, characterized in that: in: The packaging structure includes M optical fiber arrays, the photonic chip includes M spot mode converters, the M optical fiber arrays correspond to the M spot mode converters one by one, the optical fiber arrays in the M optical fiber arrays are coupled with the corresponding spot mode converters, and M is a positive integer.

12. An optical module, characterized in that: It comprises a packaging structure as claimed in any one of claims 1 to 11 and an optical component, wherein the optical component is optically connected to the packaging structure, and the optical component is used to receive and / or send an optical signal.

13. An optical system, characterized in that: It comprises an optoelectronic device and the optical module as claimed in claim 12, wherein the optoelectronic device is connected to the optical module, and the optoelectronic device is any one of an optical switch, an optical fiber router, and an optical fiber network card.

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