Photosensitive resin composition, photosensitive cover film and electronic component

Abstract

The invention relates to the technical field of printed circuit boards, in particular to a photosensitive resin composition, a photosensitive cover film and an electronic component, the photosensitive resin composition comprises alkali-soluble resin, epoxy resin, a curing agent, a photosensitive monomer, a photoinitiator, a filler and an elastomer; the epoxy resin at least comprises one epoxy resin with the softening point less than 65 DEG C, and the mass sum of the epoxy resin with the softening point less than 65 DEG C and the elastomer accounts for not less than 3% of the total solid content of the photosensitive resin composition; the intrinsic viscosity of the photosensitive resin composition below 45 DEG C is greater than 5 * 10 < 3 > PaS, and the intrinsic viscosity of the photosensitive resin composition above 75 DEG C is lt; and 4 * 10 < 3 > PaS. By adjusting the intrinsic viscosity of the photosensitive resin composition within a reasonable range value, the compliance of the photosensitive cover film prepared from the photosensitive resin composition can be effectively improved.

Description

Technical Field

[0001] The invention relates to the technical field of printed circuit boards, and in particular to a photosensitive resin composition, a photosensitive cover film and an electronic component. Background Art

[0002] With the development of high performance, miniaturization and lightweight of electronic equipment, the high integration of semiconductor components is constantly advancing, and the requirements for high density and high precision of electronic components such as semiconductor elements, semiconductor packages, printed circuit boards, etc. that constitute semiconductor components are also constantly increasing. At the same time, the number of layers of circuit boards is also increasing, from single-layer boards to single-layer double-sided boards, to multi-layer boards, and then to arbitrary-layer boards. The increase in the number of layers not only poses challenges to the manufacturing process, but also puts higher requirements on the materials of the interlayer insulation layer of the circuit board, which is not only reflected in the conventional requirements such as dielectric properties, thermal stability and acid and alkali solvent resistance, but also puts higher requirements on the reliability of the product to ensure the service life of the product. In the interlayer insulation film process, the followability of the interlayer insulation film can directly affect the reliability of the product during the film lamination process. Good followability can make the interlayer insulation film fit well with the substrate, thereby improving the adhesion between the insulation film and the substrate, which can greatly improve the reliability of the product. However, the existing interlayer insulation film has the problem of insufficient followability, which leads to reduced reliability. In addition, the judgment of compliance needs to be completed through the entire process, and the film can only be evaluated after exposure and development. The evaluation cycle is long and the cost is high. How to simplify the compliance prediction and reduce the evaluation cost has become an urgent problem to be solved. Summary of the invention

[0003] The invention provides a photosensitive resin composition, a photosensitive cover film and an electronic component, which are used to solve the problem of insufficient followability of the existing interlayer insulating film.

[0004] According to a first aspect of the present invention, the present invention provides a photosensitive resin composition, comprising an alkali-soluble resin, an epoxy resin, a curing agent, a photosensitive monomer, a photoinitiator, a filler and an elastomer; wherein the epoxy resin comprises at least one epoxy resin having a softening point less than 65°C, and the sum of the weight of the epoxy resin having a softening point less than 65°C and the elastomer accounts for no less than 3% of the total weight of the photosensitive resin composition; the intrinsic viscosity of the photosensitive resin composition below 45°C is greater than 5*10 3 Pa•S, the intrinsic viscosity of the photosensitive resin composition above 75°C is less than 4*10 3 Pa•S.

[0005] In the above scheme, the softening point generally refers to the temperature at which the resin changes from hard to soft and exhibits a certain degree of fluidity during the heating process. The softening point is an important indicator for measuring the thermal stability and fluidity of the resin, and has a direct impact on the use temperature range and processing performance of the resin. The elastomer is a polymer material between rubber and resin, and has the dual properties and broad characteristics of rubber and plastic. It exhibits high elasticity of rubber at room temperature, and can be easily processed and molded like plastic at high temperature. The present invention limits the epoxy resin to contain at least one epoxy resin with a softening point less than 65°C, and the sum of the masses of the epoxy resin with a softening point less than 65°C and the elastomer accounts for not less than 3% of the total weight of the photosensitive resin composition. The purpose of adjusting the intrinsic viscosity of the photosensitive resin composition can be achieved, and the followability of the photosensitive cover film prepared therefrom can be effectively improved. The present invention has been verified by experiments that when the intrinsic viscosity of the photosensitive resin composition is greater than 5*10 below 45°C, the photosensitive resin composition can be effectively improved. 3 Pa•S, intrinsic viscosity above 75℃<4*10 3 When Pa•S is used, the photosensitive cover film prepared thereby can achieve a good bonding effect with the substrate and have good followability, which can greatly improve the adhesion between the photosensitive cover film and the substrate, thereby improving the reliability of the photosensitive cover film in different environments.

[0006] In some specific embodiments, the intrinsic viscosity of the photosensitive resin composition at a temperature below 45° C. is greater than 5*10 3 Pa•S, and <1*10 5 Pa•S; the intrinsic viscosity of the photosensitive resin composition above 75°C is ≥0.4*10 3 Pa•S, and <4*10 3 Pa•S.

[0007] In order to achieve better improvement in the conformability of the photosensitive cover film prepared from the photosensitive resin composition, further, the intrinsic viscosity of the photosensitive resin composition at above 75°C is less than 1.5*10 3 Pa•S.

[0008] In some specific embodiments, the intrinsic viscosity of the photosensitive resin composition at 75°C or above is ≥0.4*10 3 Pa•S, and <1.5*10 3 Pa•S, correspondingly, the intrinsic viscosity of the photosensitive resin composition below 45°C is greater than 5*10 3 Pa•S, and <2*10 4 Pa•S.

[0009] Preferably, the sum of the mass of the epoxy resin having a softening point less than 65°C and the elastomer accounts for no less than 8% of the total weight of the photosensitive resin composition. In some specific embodiments, the sum of the mass of the epoxy resin having a softening point less than 65°C and the elastomer accounts for ≥8% and ≤17% of the total weight of the photosensitive resin composition.

[0010] Furthermore, the photosensitive resin composition comprises, by weight, 20 to 60 parts of an alkali-soluble resin, 20 to 40 parts of an epoxy resin, 8 to 10 parts of a curing agent, 15 to 40 parts of a photosensitive monomer, 1 to 5 parts of a photoinitiator, 50 to 150 parts of a filler, and 2.5 to 15 parts of an elastomer; Preferably, the photosensitive resin composition further comprises 0 to 15 parts by weight of other auxiliary agents, wherein the other auxiliary agents include one or more of a defoaming agent, a leveling agent and a pigment.

[0011] In the above scheme, by limiting the amount of alkali-soluble resin, epoxy resin, curing agent, photosensitive monomer, photoinitiator, filler, elastomer and other additives in the photosensitive resin composition within a reasonable range, the components can achieve better synergistic effect. On the basis of improving the conformability of the photosensitive cover film prepared from the photosensitive resin composition, the photosensitive properties, dielectric properties, thermal stability and acid and alkali resistance of the photosensitive resin composition are further improved, thereby improving the overall performance of the photosensitive resin composition.

[0012] Further, the epoxy resin includes oligomers of bisphenol A, bisphenol F, bisphenol S, bisphenol B, bisphenol TMC or bisphenol AF, naphthalene-type 4-functional epoxy resin, phenol novolac epoxy resin, phenol biphenyl epoxy resin, phenol aralkyl epoxy resin, cresol novolac epoxy resin, biphenyl epoxy resin, dicyclopentadiene epoxy resin with aromatic structure and anthracene epoxy resin. Optionally, the epoxy resin includes DIC HP-4700 series, HP4032H series, HP-7200 series, EXA-7311 series, etc., Nippon Kayaku NC3000 series, etc., Nan Ya Plastic Epoxy Resin NPEL, BPEF, NPES series, etc.

[0013] In the above scheme, by selecting a suitable type of epoxy resin, the epoxy resin and other components can achieve a better synergistic effect, thereby better improving the overall performance of the photosensitive resin composition.

[0014] Further, the elastomer includes one or more of core-shell rubber toughened epoxy resin, thermoplastic elastomer, polyurethane elastomer, liquid rubber and rubber powder. Optionally, the elastomer can be selected from the American Rohm and Haas Paraloid BTA series, Japanese Mitsubishi Metablem C series, Korean LG Chemical LG MB series and Japanese Daicel Epolead PB series.

[0015] In the above scheme, by selecting a suitable type of elastomer, the elastomer and other components can achieve a better synergistic effect, thereby better improving the overall performance of the photosensitive resin composition.

[0016] Furthermore, the filler includes a first filler and a second filler, and the particle size D of the first filler is 50 ≤1.5μm, and D 10 ≥0.6μm, D 90 ≤2.0μm, the particle size D of the second filler 50 ≤0.5μm, and D 10 ≥0.05μm, D 90 ≤0.75μm; the weight ratio of the first filler to the second filler is (1.5-5.5):1.

[0017] Optionally, the weight ratio of the first filler to the second filler can be 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 4.5:1, 5:1 or 5.5:1, etc., and of course it can also be other values ​​within the above range, which is not limited here. In some specific embodiments, the weight ratio of the first filler to the second filler is (3-4):1.

[0018] Furthermore, the filler includes at least one of silicon dioxide, titanium dioxide, zirconium oxide, calcium carbonate, barium sulfate, aluminum oxide, corundum, talcum powder, mica powder, porcelain powder and asbestos powder, preferably at least one of silicon dioxide and titanium dioxide.

[0019] In the above scheme, fillers are commonly used reinforcing materials in resin production, which can effectively improve the mechanical properties of the material such as hardness and strength, and also affect the softening point of the resin. The present invention can further ensure the softening point value of the photosensitive resin composition by selecting fillers with reasonable particle size, type and amount, further achieve the purpose of adjusting the intrinsic viscosity of the photosensitive resin composition, and improve the mechanical properties of the photosensitive resin composition, thereby better improving the overall performance of the photosensitive resin composition.

[0020] Further, the alkali-soluble resin contains a carboxyl group that can be developed with alkali and a vinyl group that can be photopolymerized; preferably, the alkali-soluble resin includes one or more of (meth)acrylic acid-modified bisphenol A epoxy resin, (meth)acrylic acid-modified bisphenol F epoxy resin, (meth)acrylic acid-modified bisphenol AF oligomer epoxy resin, (meth)acrylic acid-modified phenolic epoxy resin and (meth)acrylic acid-modified cresol phenolic epoxy resin; And / or, the acid value of the alkali-soluble resin is 45 to 175 mgKOH / g, preferably 70 to 130 mgKOH / g, and more preferably 90 to 110 mgKOH / g.

[0021] In the above scheme, by selecting a suitable type of alkali-soluble resin, the alkali-soluble resin and other components can achieve better synergistic effects, and the overall performance of the photosensitive resin composition can be better improved. The acid value of the resin has an important influence on its physical properties, chemical properties, processing properties and service life. By limiting the acid value of the alkali-soluble resin to a reasonable range, the viscosity and viscosity of the photosensitive resin composition can be improved. Too low an acid value cannot significantly improve the viscosity and viscosity of the photosensitive resin composition, and too high an acid value may cause the photosensitive resin composition to change color and have too high a viscosity.

[0022] Further, the photosensitive monomer includes one or more (meth)acrylate monomers; optionally, the (meth)acrylate monomer includes methyl (meth)acrylate, ethyl (meth)acrylate, hydroxyethyl (meth)acrylate, glycidyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isobornyl (meth)acrylate, cyclohexyl (methacrylate), 2-cyanoethyl (meth)acrylate, octyl (meth)acrylate, decyl (meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, tripropylene glycol di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, oxadiene di(meth)acrylate, difunctional monomers such as trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, ethoxylated glycerol tri(meth)acrylate, tri(2 -acryloyloxyethyl isocyanurate), etc.; tetrafunctional monomers such as dimethoxypropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, etc.; multifunctional monomers such as dipentaerythritol penta(meth)acrylate, phenoxy dipentaerythritol hexa(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc.

[0023] Furthermore, the curing agent includes one or more of a phenolic resin curing agent, a naphthol curing agent having a phenolic resin structure, a phenolic curing agent containing a triazine skeleton, and a dicyclopentadiene type active ester curing agent containing an aromatic structure; optionally, the curing agent can be DIC's LA series curing agent, Ajinomoto PN-23, etc.

[0024] Furthermore, the photosensitive resin composition also includes a curing agent accelerator, which can accelerate the curing speed of the epoxy resin. The curing agent accelerator includes modified imidazoles or imidazole quaternary ammonium salts and pyridinium quaternary ammonium salts, etc. The curing agent accelerator can also include one or more of nitrogen heterocyclic compounds and their derivatives, quaternary ammonium salts of the nitrogen heterocyclic compounds, urea derivatives, organic guanidine derivatives, phosphorus-containing compounds, transition metal complexes, etc.

[0025] Further, the photoinitiator includes one or more photosensitizers; the photosensitizer includes one or more of oxime ester photosensitizers, phenyl ketone photosensitizers, thioxanthone photosensitizers, phosphine oxide photosensitizers, bisimidazole photosensitizers and benzophenone photosensitizers; preferably, the oxime ester photosensitizer includes one or more of 1-[4-(phenylthio)phenyl]-1,2-octanedione 2-(O-benzoyl oxime) and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]ethanone 1-(O-acetyl oxime); the phenyl ketone photosensitizer includes 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1-propanone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1,2-octanedione 2-(O-benzoyl oxime) [4-(4-morpholinyl)phenyl]-1-butanone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-2-methyl-1-(4-hydroxyethoxy)phenyl-1-propanone, 2-hydroxy-2-methyl-1-(4-methoxy)phenyl-1-propanone and 1-hydroxycyclohexylphenyl ketone; the thioxanthone photosensitizer includes one or both of isopropylthioxanthone and 2,4-diethylthioxanthone; the phosphine oxide photosensitizer includes one or both of (2,4,6-trimethylbenzoyl)diphenylphosphine oxide and phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide; the bisimidazole photosensitizer includes 2 , 2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4',5'-diphenyl-1,1'-diimidazole, 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(methoxyphenyl)imidazole dimer and 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer. One or more of the following; the benzophenone-based photosensitizer includes one or more of tetraethyl Michler's ketone, 3-phenylbenzophenone and 3-methylbenzophenone; more preferably, the photosensitizer is a compound of phenyl ketones, thioxanthones and tetraethyl Michler's ketone.

[0026] According to a second aspect of the present invention, the present invention further provides a photosensitive cover film, comprising a supporting substrate and a photosensitive layer disposed on the supporting substrate, wherein the photosensitive layer is formed from the above-mentioned photosensitive resin composition.

[0027] According to the third aspect of the present invention, the present invention also provides a method for preparing the above-mentioned photosensitive cover film, comprising the following steps: adding a photosensitive resin composition to a solvent to prepare a photosensitive resin composition glue solution with a solid content of 55~75wt%, coating the photosensitive resin composition glue solution on the surface of a supporting substrate, drying to form a photosensitive layer, and obtaining a photosensitive cover film.

[0028] Furthermore, the solvent may be butanone; the supporting substrate may be one of polyethylene terephthalate, polyethylene naphthalate, cellulose acetate, polymethacrylate, methacrylate copolymer, polyvinyl alcohol, polycarbonate, polyamide, polyimide, and cellophane; preferably, the supporting substrate is polyethylene terephthalate with a thickness of 15 to 55 μm.

[0029] According to a fourth aspect of the present invention, the present invention further provides an electronic component, wherein the electronic component uses the above-mentioned photosensitive resin composition or the above-mentioned photosensitive cover film.

[0030] Furthermore, the electronic component may be a semiconductor element, a semiconductor package, a printed circuit board, etc.

[0031] According to the fifth aspect of the present invention, the present invention also provides a method for preparing the above-mentioned electronic components, the preparation method comprising: bonding the photosensitive resin composition or the photosensitive cover film to a substrate by spin coating or lamination, obtaining a corresponding circuit diagram by exposure, development, and post-curing, and forming electronic components by further assembly at a later stage.

[0032] In addition, the photosensitive resin composition or photosensitive cover film of the present invention can also be applied to electronic products by other means.

[0033] Beneficial effects of the present invention: The photosensitive resin composition provided by the present invention can achieve the purpose of adjusting the intrinsic viscosity of the photosensitive resin composition by limiting the epoxy resin to contain at least one epoxy resin with a softening point less than 65°C, and the sum of the mass of the epoxy resin with a softening point less than 65°C and the elastomer accounts for no less than 3% of the total weight of the photosensitive resin composition, and can effectively improve the followability of the photosensitive cover film prepared therefrom. The present invention further limits the intrinsic viscosity of the photosensitive resin composition below 45°C to >5*10 3 Pa•S, intrinsic viscosity above 75℃<4*10 3 Pa•S can make the photosensitive cover film prepared by it achieve a good bonding effect with the substrate, with good followability, which can greatly improve the adhesion between the photosensitive cover film and the substrate, and thus improve the reliability of the photosensitive cover film in different environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1SEM images of the filling capacity of the photosensitive interlayer insulating films of Examples 1, 3, 7, 12 and 14 of the present invention. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] The raw materials used in the following examples and comparative examples are as follows: Alkali-soluble resin: PR6400H (Showa Denko, anhydride-modified o-cresol epoxy acrylate), average acid value is 100 mg KOH / g; Epoxy resin A: XD-1000 (Nippon Kayaku, dicyclopentadiene phenol type epoxy resin), epoxy resin with a softening point of 71-75°C; Epoxy resin B: SQPN-044 (Shengquan, phenol novolac epoxy resin), epoxy resin with a softening point of 36-42°C; Curing agent: PF8011 (Shengquan, phenolic epoxy curing agent); Photosensitive monomer: DHPA (Sartomer, acrylate monomer); Photoinitiator: PI799 (Changzhou Qiangli, 2-methyl-1-(4-methylthiophenyl)-2-morpholinyl-1-propanone, photoinitiator I); PI777 (Changzhou Qiangli, 2,4-diethylthioxanthene-9-one, photoinitiator II); Tetraethyl Michler's ketone (Aladdin, photoinitiator III); Filler: including the first filler and the second filler, the first filler is GW01 (Jinlei Technology, silica filler), D 50 =1 μm, and D 10 =0.6 μm, D 90 =2.0μm, the second filler is NFS-200E (Yishitong, silica filler), D 50 = 0.5 μm, and D 10 = 0.05 μm, D 90 =0.75μm; the weight ratio of the first filler to the second filler is 3.5:1; Elastomer: PB3600 (Japan Daicel, epoxidized polybutadiene); Additives: Defoamer: SH-193 (Dow Chemical); Pigment PG7 (BASF); Solvent: MEK (Aladdin).

[0038] Examples 1 to 15 and Comparative Examples 1 to 4 Examples 1 to 15 and Comparative Examples 1 to 4 respectively provide a photosensitive cover film, comprising a supporting substrate of polyethylene terephthalate and a photosensitive layer disposed on the supporting substrate, wherein the photosensitive layer is formed of a photosensitive resin composition. The preparation method of the photosensitive cover film comprises the following steps: adding the photosensitive resin composition to a solvent to prepare a photosensitive resin composition glue solution having a solid content of 55 to 75 wt %, coating the photosensitive resin composition glue solution on the surface of the supporting substrate, drying to form a photosensitive layer, and obtaining the photosensitive cover film.

[0039] The raw materials for preparing the photosensitive cover film are shown in Tables 1 and 2 below. The amount of each component raw material added in Tables 1 and 2 is calculated in parts by mass. Thus, 19 groups of different photosensitive cover films (Examples 1 to 15 and Comparative Examples 1 to 4) were obtained. The percentage WT of the sum of the mass of the epoxy resin and the elastomer with a softening point of less than 65°C in the total weight of the photosensitive resin composition, the viscosity and the filling capacity are shown in Tables 3 and 4.

[0040] The intrinsic viscosity in Examples 1 to 15 and Comparative Examples 1 to 4 was measured by a rheometer, and the filling capacity was obtained by screening 100 holes using SEM and calculating the ratio of the actual cover hole width to the cover hole slot width.

[0041] Table 1

[0042] Table 2

[0043] Table 3

[0044] Table 4

[0045] It can be seen from the experimental data in Table 3 and Table 4 that the present invention can achieve the purpose of adjusting the intrinsic viscosity of the photosensitive resin composition by limiting the epoxy resin to contain at least one epoxy resin with a softening point less than 65°C, and the sum of the weight of the epoxy resin with a softening point less than 65°C and the elastomer to not less than 3% of the total weight of the photosensitive resin composition, so that the intrinsic viscosity of the photosensitive resin composition below 45°C is greater than 5*10 3 Pa•S, intrinsic viscosity above 75℃<4*10 3 Pa·S, which can effectively improve the followability of the photosensitive cover film prepared therefrom. The intrinsic viscosity of the photosensitive resin composition of Example 1 at above 75°C is 3.35*10 3 Pa•S, the filling capacity of the photosensitive cover film is as follows Figure 1As shown in Figure a, the filling capacity can reach 56.33%; the intrinsic viscosity of the photosensitive resin composition of Example 3 above 75°C is 2.05*10 3 Pa•S, the filling capacity of the photosensitive cover film is as follows Figure 1 As shown in Figure b, the filling capacity can reach 84.15%; the intrinsic viscosity of the photosensitive resin compositions of Example 7, Example 12 and Example 14 above 75°C is 1.43*10 3 Pa•S, 0.84*10 3 Pa•S and 0.52*10 3 Pa•S, the filling capacity of the photosensitive cover film is as follows Figure 1 As shown in Figures c, d and e, the filling capacity can reach 100%. When the intrinsic viscosity of the photosensitive resin composition is greater than 5*10 3 Pa•S, and less than 2*10 4 Pa•S, the intrinsic viscosity above 75℃ is greater than or equal to 0.4*10 3 Pa•S, and less than 1.5*10 3 Pa•S, the filling capacity of the photosensitive cover film can reach 100%, and the followability is even better.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A photosensitive resin composition, characterized in that: The invention comprises an alkali-soluble resin, an epoxy resin, a curing agent, a photosensitive monomer, a photoinitiator, a filler and an elastomer; wherein the epoxy resin comprises at least one epoxy resin having a softening point less than 65°C, and the sum of the weight of the epoxy resin having a softening point less than 65°C and the elastomer accounts for not less than 3% of the total weight of the photosensitive resin composition; the intrinsic viscosity of the photosensitive resin composition below 45°C is greater than 5*10 3 Pa•S, the intrinsic viscosity of the photosensitive resin composition above 75°C is less than 4*10 3 Pa•S.

2. The photosensitive resin composition according to claim 1, characterized in that: The intrinsic viscosity of the photosensitive resin composition above 75°C is less than 1.5*10 3 Pa•S.

3. The photosensitive resin composition according to claim 1, characterized in that: The photosensitive resin composition comprises, by weight, 20 to 60 parts of an alkali-soluble resin, 20 to 40 parts of an epoxy resin, 8 to 10 parts of a curing agent, 15 to 40 parts of a photosensitive monomer, 1 to 5 parts of a photoinitiator, 50 to 150 parts of a filler, and 2.5 to 15 parts of an elastomer; Preferably, the photosensitive resin composition further comprises 0 to 15 parts by weight of other auxiliary agents, wherein the other auxiliary agents include one or more of a defoaming agent, a leveling agent and a pigment.

4. The photosensitive resin composition according to claim 1, characterized in that: The epoxy resin includes one or more of bisphenol A, bisphenol F, bisphenol S, bisphenol B, bisphenol TMC or bisphenol AF oligomers, naphthalene-type tetrafunctional epoxy resins, phenol novolac epoxy resins, phenol biphenyl epoxy resins, phenol aralkyl epoxy resins, cresol novolac epoxy resins, biphenyl epoxy resins, dicyclopentadiene epoxy resins with aromatic structures and anthracene epoxy resins.

5. The photosensitive resin composition according to claim 1, characterized in that: The elastomer includes one or more of core-shell rubber toughened epoxy resin, thermoplastic elastomer, polyurethane elastomer, liquid rubber and rubber powder.

6. The photosensitive resin composition according to claim 1, characterized in that: The filler includes a first filler and a second filler, and the particle size D of the first filler is 50 ≤1.5μm, and D 10 ≥0.6μm, D 90 ≤2.0μm, the particle size D of the second filler 50 ≤0.5μm, and D 10 ≥0.05μm, D 90 ≤0.75μm; the weight ratio of the first filler to the second filler is (1.5-5.5):1; And / or, the filler includes at least one of silicon dioxide, titanium dioxide, zirconium oxide, calcium carbonate, barium sulfate, aluminum oxide, corundum, talc, mica powder, porcelain powder and asbestos powder, preferably at least one of silicon dioxide and titanium dioxide.

7. The photosensitive resin composition according to claim 1, characterized in that: The alkali-soluble resin contains a carboxyl group that can be developed with alkali and a vinyl group that can be photopolymerized; preferably, the alkali-soluble resin includes one or more of (meth)acrylic acid-modified bisphenol A epoxy resin, (meth)acrylic acid-modified bisphenol F epoxy resin, (meth)acrylic acid-modified bisphenol AF oligomer epoxy resin, (meth)acrylic acid-modified phenolic epoxy resin and (meth)acrylic acid-modified cresol novolac epoxy resin; And / or, the acid value of the alkali-soluble resin is 45 to 175 mgKOH / g, preferably 70 to 130 mgKOH / g, and more preferably 90 to 110 mgKOH / g.

8. The photosensitive resin composition according to claim 1, characterized in that: The photosensitive monomer includes one or more (meth)acrylate monomers; And / or, the curing agent includes one or more of a phenolic resin curing agent, a naphthol curing agent having a phenolic resin structure, a phenolic curing agent containing a triazine skeleton, and a dicyclopentadiene type active ester curing agent containing an aromatic structure; And / or, the photoinitiator includes one or more photosensitizers; the photosensitizer includes one or more of oxime ester photosensitizers, phenyl ketone photosensitizers, thioxanthone photosensitizers, phosphine oxide photosensitizers, bisimidazole photosensitizers and benzophenone photosensitizers; preferably, the oxime ester photosensitizer includes one or more of 1-[4-(phenylthio)phenyl]-1,2-octanedione 2-(O-benzoyl oxime) and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]ethanone 1-(O-acetyl oxime); the phenyl ketone photosensitizer includes 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1-propanone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1,2-octanedione 2-(O-benzoyl oxime) ]-1-butanone, 2-dimethylamino-2-(4-methyl)benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-2-methyl-1-(4-hydroxyethoxy)phenyl-1-propanone, 2-hydroxy-2-methyl-1-(4-methoxy)phenyl-1-propanone and 1-hydroxycyclohexylphenyl ketone; the thioxanthone photosensitizer includes one or both of isopropylthioxanthone and 2,4-diethylthioxanthone; the phosphine oxide photosensitizer includes one or both of (2,4,6-trimethylbenzoyl)diphenylphosphine oxide and phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide; the bisimidazole photosensitizer includes 2 , 2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4',5'-diphenyl-1,1'-diimidazole, 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-di(methoxyphenyl)imidazole dimer and 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer. One or more of the benzophenone-based photosensitizer includes one or more of tetraethyl Michler's ketone, 3-phenylbenzophenone and 3-methylbenzophenone; more preferably, the photosensitizer is a compound of phenyl ketones, thioxanthones and tetraethyl Michler's ketone.

9. A photosensitive cover film, characterized in that: The invention comprises a supporting substrate and a photosensitive layer arranged on the supporting substrate, wherein the photosensitive layer is formed by the photosensitive resin composition according to any one of claims 1 to 8.

10. An electronic component, characterized in that: The electronic component uses the photosensitive resin composition according to any one of claims 1 to 7 or the photosensitive cover film according to claim 9.

Images